AOI detection machine and detection method

Abstract

The invention relates to an AOI detection machine and a detection method. The AOI detection machine comprises a rack, a conveying device, a first detection device and a second detection device. The first detection device is configured to be used for acquiring appearance information of a wafer and first position information of the wafer on a substrate, performing first detection judgment according to the appearance information and the first position information, marking the wafer if the wafer is unqualified, and performing a next detection process if the wafer is qualified; and the second detection device is configured to be used for acquiring the position characteristic information of the wire on the optical device, performing second detection and judgment according to the position characteristic information, judging that the optical device is a qualified product if the optical device is qualified, and marking the optical device if the optical device is not qualified. Due to the arrangement of the first detection assembly and the second detection assembly, the appearance defect of the surface of the wafer and the position angle of the wafer are detected firstly, then the three-dimensional shape information of the wire is obtained through the second detection assembly, and the three-dimensional shape information is compared with the preset position characteristic range, so that the consistency of optical device products is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to an AOI inspection machine and an inspection method. Background Art

[0002] Semiconductor AOI automatic optical inspection equipment is most widely used in the electronics manufacturing industry. AOI can screen out defective NG products and give timely alarms to improve the defect rate of products leaving the factory. The principle of AOI detection is to use camera technology to output the reflected light intensity of the object to be detected in a quantitative grayscale value, and compare it with the grayscale value of the standard image to analyze and determine the defects and classify them. To make a vivid analogy with manual inspection, the ordinary LED or special light source used by AOI is equivalent to the natural light during manual inspection, the optical sensor and optical lens used by AOI are equivalent to the human eye, and the image processing and analysis system of AOI is equivalent to the human brain, that is, the two links of "seeing" and "judgment". Therefore, the working logic of AOI detection can be simply divided into four stages: image acquisition stage (optical scanning and data collection), data processing stage (data classification and conversion), image analysis stage (feature extraction and template comparison) and defect reporting stage (defect size type classification, etc.). In order to support and realize the above four functions of AOI detection, the hardware system of AOI equipment also includes four parts: working platform, imaging system, image processing system and electrical system. It is an automation equipment that integrates multiple disciplines such as machinery, automation, optics and software.

[0003] In the prior art, AOI inspection equipment usually only inspects semiconductor products once, and usually can only detect defects in the planar dimensions of semiconductor products. Semiconductor products usually include PCB boards, wafers and wires. The wafers are arranged on the PCB boards, and the PCB boards and wafers are electrically connected through wires. When the wires are connected between the wafers and the PCB boards, they will bend, resulting in different degrees of bending and heights of the wires, leading to poor consistency of semiconductor products. In the application of some high-end equipment or precision instruments, if the height of the wires is too high, other components may be blocked and their use may be hindered. In addition, if multiple wires of semiconductor products cross or overlap, it will cause a short circuit in the circuit, resulting in serious consequences that the semiconductor product or even the entire device cannot be used. Summary of the invention

[0004] The first object of the present invention is to provide an AOI inspection machine, which aims to solve the technical problem that the existing AOI inspection equipment can only perform defect inspection on a semiconductor product in a plane dimension once, and the inspection dimension is too few, resulting in poor consistency of semiconductor products.

[0005] In order to solve the above technical problems, an AOI inspection machine is provided, which is applied to an optical device. The optical device includes a substrate, a wafer and a wire. The wafer is arranged on the substrate. The substrate and the wafer are electrically connected through the wire. The AOI inspection machine includes: A frame, including a first detection position and a second detection position; A conveying device, used for moving the optical device on the fixture to the first detection position and the second detection position in sequence; A first detection device, comprising a first mounting frame, a first detection assembly and a first light source assembly, wherein the first light source assembly is slidably mounted on the first mounting frame to adjust the position height of the first light source assembly, and the first light source assembly is arranged between the first detection assembly and the conveying device, and the first detection assembly is connected to the first mounting frame; A second detection device, comprising a second mounting frame, a second detection assembly and a second light source assembly, wherein the second light source assembly is slidably mounted on the second mounting frame to adjust the position height of the second light source assembly, and the second light source assembly is arranged between the second detection assembly and the conveying device, and the second detection assembly is connected to the second mounting frame; Among them, the first detection device is configured to obtain the appearance information of the wafer and the first position information of the wafer on the substrate, and perform a first detection and judgment based on the appearance information and the first position information. If it is unqualified, it is marked; if it is qualified, the next detection process is carried out; the second detection device is configured to obtain the position feature information of the wire on the optical device, and perform a second detection and judgment based on the position feature information. If it is qualified, the optical device is determined to be a qualified product; if it is unqualified, it is marked.

[0006] Furthermore, the first detection device further includes a first adjustment component, the first detection component is mounted on the first mounting frame through the first adjustment component, and the first adjustment component is used to adjust the position of the first detection device; The second detection device further includes a second adjustment component, through which the second detection component is mounted on the second mounting frame, and the second adjustment component is used to adjust the position of the second detection device.

[0007] Further, the first light source assembly includes a first slide bar, a first bearing plate and a first light source component, the first slide bar and the first light source component are respectively fixedly mounted on the first bearing plate, the first mounting frame includes a first sliding groove and a first fixing component, the first slide bar cooperates with the first sliding groove, and the first fixing component acts on the first slide bar to make the first slide bar in an active or fixed state; The second light source assembly includes a second sliding rod, a second supporting plate and a second light source component. The second sliding rod and the second light source component are respectively fixedly mounted on the second supporting plate. The second mounting frame includes a second sliding groove and a second fixing component. The second sliding rod cooperates with the second sliding groove. The second fixing component acts on the second sliding rod to make the second sliding rod in an active or fixed state.

[0008] Furthermore, the first light source component includes a first light-emitting surface and a first through hole, the first through hole is arranged directly above the first detection position, and the first light-emitting surface is used to form light emitted along the Z-axis direction; the second light source component includes a second light-emitting surface and a second through hole, the second through hole is arranged directly above the second detection position, and the second light-emitting surface is used to form an irradiation space within the circumferential range of the second detection.

[0009] Furthermore, the conveying device includes a conveying track, a mobile gripper, a first in-place sensor and a second in-place sensor, the mobile gripper is connected to the conveying track to drive the optical device to move, the first in-place sensor is set at the first detection position, and the second in-place sensor is set at the second detection position.

[0010] Furthermore, the AOI inspection machine also includes a loading module and a unloading module arranged at opposite ends of the conveying device, the loading module includes a main frame, a bracket, and an X-axis moving assembly, a Y-axis moving assembly and a Z-axis moving assembly all installed on the main frame, the bracket is connected to the Z-axis moving assembly, the bracket is used to carry the jig in the material box, and the unloading module is configured to have the same structure as the loading module.

[0011] Further, the main frame includes a loading position and a first cavity and a second cavity which are independently arranged respectively, the Z-axis moving component is arranged in the first cavity, the Y-axis moving component is arranged in the second cavity, and the height position of the X-axis moving component is arranged flush with the loading position; The Y-axis moving assembly includes a Y-axis motor, a belt, a driving wheel, a driven wheel and a moving member, wherein the driving wheel is connected to the Y-axis motor, the driving wheel and the driven wheel are coupled and connected via the belt, the moving member is connected to the belt, and the moving member is formed with a plurality of placement positions for placing the material box; The Z-axis moving assembly includes a Z-axis motor, a ball screw, a guide rod and a first slider. The Z-axis motor and the guide rod are fixedly mounted on the main frame, the first slider is slidably mounted on the ball screw and the guide rod, and the bracket is connected to the first slider.

[0012] Furthermore, the Y-axis moving assembly also includes a guide rail and a second slider, the second slider is slidably installed on the guide rail, the moving part includes a moving plate and a plurality of column groups fixedly installed on the moving plate, and the plurality of column groups are arranged at intervals on the moving plate, and the placement position is formed between adjacent column groups, and the moving plate is fixedly connected to the second slider.

[0013] A second object of the present invention is to provide a detection method, using the above-mentioned AOI detection machine, the method comprising: Preset appearance defect characteristics, position deviation range and position feature range; Moving the optical device to the first detection position by the conveying device; Acquiring appearance information of the wafer and first position information of the wafer on the substrate; Comparing the first position information with the position deviation range, and comparing the appearance information with the appearance defect characteristics, if the first position information is within the position deviation range, and the appearance information does not conform to the appearance defect characteristics, moving the optical device to the second inspection position for the next inspection process, and if the first position information exceeds the position deviation range, and / or the appearance information conforms to the appearance defect characteristics, marking it; Acquiring position characteristic information of a wire located on the optical device; The position characteristic information is compared with the position characteristic range. If the position characteristic information conforms to the position characteristic range, the optical device is determined to be qualified. If the position characteristic information does not conform to the position characteristic range, the optical device is marked.

[0014] Furthermore, the position characteristic information includes height information, length information and bending angle information of the wire, and the position characteristic range includes a height position range, a length position range and a bending angle range, wherein the height information is compared with the height position range, the length information is compared with the length position range, and the bending angle information is compared with the bending angle range, and if any one of the height information, the length information and the bending angle information does not conform to the position characteristic range, the optical device is judged to be unqualified.

[0015] Implementing the embodiments of the present invention will have the following beneficial effects: In one embodiment, the AOI inspection machine of the present application, due to the setting of the first inspection component and the second inspection component, first checks the appearance defects on the surface of the wafer and the position angle of the wafer on the substrate through the first inspection component. At this time, the top surface of the wafer is mainly inspected. After confirming that the wafer is not damaged and the position of the wafer is correct, the three-dimensional shape information of the wire is obtained through the second inspection component, specifically including the height information, length information and bending angle information of the wire, and compared with the preset position feature range. The position of the wire meets strict technical requirements, avoiding circuit failure or performance degradation caused by wire position deviation, which is conducive to improving the consistency of optical device products; In another embodiment, the first detection device and the second detection device are both equipped with adjustment components, which allow the position of the detection component to be accurately adjusted to focus. In addition, the first light source component is slidably mounted on the first mounting frame, and the second light source component is slidably mounted on the second mounting frame. The height position of the first light source component and the second light source component can be adjusted, which is convenient for the user to adjust the light source component according to actual conditions to achieve the best lighting environment, so that the first detection component and the second detection component can obtain clearer pictures, which is conducive to further improving the accuracy of the detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a structural schematic diagram of the AOI inspection machine according to an embodiment of the present invention; Figure 2 A top view of the AOI inspection machine according to an embodiment of the present invention; Figure 3 A schematic diagram of the structure of a first detection device according to an embodiment of the present invention from one viewing angle; Figure 4 A schematic structural diagram of the first detection device according to an embodiment of the present invention from another perspective; Figure 5 A schematic diagram of the structure of a second detection device according to an embodiment of the present invention from one viewing angle; Figure 6 A schematic structural diagram of the second detection device according to an embodiment of the present invention from another perspective; Figure 7 It is a schematic diagram of the structure of the conveying device according to an embodiment of the present invention; Figure 8It is a structural schematic diagram of the feeding module according to an embodiment of the present invention; Fig. 9 This is a schematic diagram of the structure of the loading module according to an embodiment of the present invention after removing part of the main frame; Fig.10 It is a structural schematic diagram of the combination of the Y-axis moving assembly and the Z-axis moving assembly according to an embodiment of the present invention; Fig.11 It is a front view of the combination of the Y-axis moving assembly and the Z-axis moving assembly according to an embodiment of the present invention; Fig.12 A schematic diagram of the structure of an optical device according to an embodiment of the present invention; Fig.13 for Fig.12 A local enlarged schematic diagram of the middle A; Fig.14 A top view of the optical device according to an embodiment of the present invention; Fig.15 This is a structural schematic diagram of a jig according to an embodiment of the present invention being placed in a material box; Fig.16 It is a structural schematic diagram of placing the optical device according to an embodiment of the present invention on a fixture; Fig.17 The present invention provides a method for detecting the quality of optical components using the AOI inspection machine described in an embodiment of the present invention.

[0018] Wherein: 100, AOI inspection machine; 110, frame; 111, first inspection position; 112, second inspection position; 120, conveying device; 121, conveying track; 122, mobile gripper; 123, first in-position sensor; 124, second in-position sensor; 130, first inspection device; 131, first mounting frame; 1311, first sliding groove; 132, first inspection assembly; 133, first light source assembly; 1331, first slide bar; 1332, first carrier plate; 1333, first light source member; 1333A, first light-emitting surface; 1333B, first through hole; 134, first adjustment assembly; 140, second inspection device; 141, second mounting frame; 1411, second sliding groove; 142, second inspection assembly; 143, second light source assembly; 1431, second slide bar ; 1432, second carrier plate; 1433, second light source; 1433A, second light emitting surface; 1433B, second through hole; 144, second adjustment assembly; 150, loading module; 151, main frame; 1511, first cavity; 1512, second cavity; 152, bracket; 153, X-axis moving assembly; 154, Y-axis moving assembly; 1541, Y-axis motor; 1542, belt; 1543, driving wheel; 1544, driven wheel; 1545, moving member; 1545A, moving plate; 1545B, column group; 1545C, placement position; 1546, guide rail; 1547, second slider; 155, Z-axis moving assembly; 1551, Z-axis motor; 1552, ball screw; 1553, guide rod; 1554, first slider; 160, unloading module; 200, optical device; 210, substrate; 220, wafer; 230, wire; 300, material box; 310, material discharge trough; 400. Fixture; 410. Placement slot. DETAILED DESCRIPTION

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0022] Please refer to Figure 1-Figure 16 The embodiment of the present invention provides an AOI inspection machine 100, which is applied to an optical device 200. The optical device 200 includes a substrate 210, a wafer 220 and a wire 230. The wafer 220 is arranged on the substrate 210. The substrate 210 and the wafer 220 are electrically connected through the wire 230. The AOI inspection machine 100 includes a frame 110, a conveying device 120, a first inspection device 130 and a second inspection device 140. The frame 110 includes a first inspection position 111 and a second inspection position 112. The conveying device 120 is used to move the optical device 200 on the fixture 400 to the first inspection position 111 and the second inspection position 112 in sequence. The first detection device 130 includes a first mounting frame 131, a first detection assembly 132 and a first light source assembly 133. The first light source assembly 133 is slidably mounted on the first mounting frame 131 to adjust the position height of the first light source assembly 133, and the first light source assembly 133 is disposed between the first detection assembly 132 and the conveying device 120, and the first detection assembly 132 is connected to the first mounting frame 131. The second detection device 140 includes a second mounting frame 141, a second detection assembly 142 and a second light source assembly 143. The second light source assembly 143 is slidably mounted on the second mounting frame 141 to adjust the position height of the second light source assembly 143, and the second light source assembly 143 is disposed between the second detection assembly 142 and the conveying device 120, and the second detection assembly 142 is connected to the second mounting frame 141. The first detection device 130 is configured to obtain the appearance information of the wafer 220 and the first position information of the wafer 220 on the substrate 210, and perform a first detection and judgment based on the appearance information and the first position information. If it is unqualified, it is marked, and if it is qualified, the next detection process is carried out; the second detection device 140 is configured to obtain the position feature information of the wire 230 located on the optical device 200, and perform a second detection and judgment based on the position feature information. If it is qualified, the optical device 200 is determined to be a qualified product, and if it is unqualified, it is marked. For example, the marking of the unqualified optical device 200 mentioned above refers to <map>The label is used for client image mapping, that is, when unqualified optical devices 200 are detected, the AOI inspection machine 100 of the present application will not remove them, but will pack them together. When the user uses it, he can check the position and number of unqualified optical devices 200 in the whole box of optical devices 200.

[0023] In addition, it should be noted that, in the present embodiment, the AOI inspection machine 100 is provided with two inspection positions, namely, a first inspection position 111 and a second inspection position 112, and a corresponding inspection device is provided at each inspection position to inspect the optical device 200. Of course, in specific applications, the number of inspection positions is not limited thereto, and corresponding inspections can be configured according to their needs and functions. For example, as an alternative, the number of inspection positions can be set to one, three, or four, and when multiple inspection positions are provided, the multiple inspection positions can be arranged in a linear distribution in a straight line, or in a circular rotational distribution.

[0024] Please refer to Figure 1 and Figure 2 In this embodiment, the AOI inspection machine 100 of the present application, due to the provision of the first inspection component 132 and the second inspection component 142, firstly checks the appearance defects on the surface of the wafer 220 and the position angle of the wafer 220 on the substrate 210 through the first inspection component 132. At this time, the top surface of the wafer 220 is mainly inspected. After confirming that the wafer 220 is not damaged and the position of the wafer 220 is correct, the three-dimensional shape information of the wire 230 is obtained through the second inspection component 142, specifically including the height information, length information and bending angle information of the wire 230, and compared with the preset position feature range. Make the position of the wire 230 meet the strict technical requirements, and avoid circuit failure or performance degradation caused by the position deviation of the wire 230; Please refer to Figure 4 and Figure 6 In a possible implementation, the first detection device 130 further includes a first adjustment component 134, the first detection component 132 is mounted on the first mounting frame 131 through the first adjustment component 134, and the first adjustment component 134 is used to adjust the position of the first detection device 130. The second detection device 140 further includes a second adjustment component 144, the second detection component 142 is mounted on the second mounting frame 141 through the second adjustment component 144, and the second adjustment component 144 is used to adjust the position of the second detection device 140. In another embodiment, the first detection device 130 and the second detection device 140 are both equipped with adjustment components, which allow the position of the detection member to be accurately adjusted to focus. The first adjustment component 134 and the second adjustment component 144 are both two-axis moving mechanisms, which can adjust the position of the detection component in the X-axis direction and the Z-axis direction respectively, and the first adjustment component 134 and the second adjustment component 144 are both manually adjusted. In addition, the first light source component 133 is slidably mounted on the first mounting frame 131, and the second light source component 143 is slidably mounted on the second mounting frame 141. The height positions of the first light source assembly 133 and the second light source assembly 143 can be adjusted, so that the user can adjust the light source components according to actual conditions to achieve the best lighting environment, so that the first detection assembly 132 and the second detection assembly 142 can obtain clearer pictures, which is conducive to further improving the accuracy of the detection results.

[0025] Please refer to Figure 4 and Figure 5 In a possible embodiment, the first light source assembly 133 includes a first sliding rod 1331, a first supporting plate 1332 and a first light source component 1333. The first sliding rod 1331 and the first light source component 1333 are respectively fixedly mounted on the first supporting plate 1332. The first mounting frame 131 includes a first sliding groove 1311 and a first fixing component (not shown in the figure). The first sliding rod 1331 cooperates with the first sliding groove 1311, and the first fixing component acts on the first sliding rod 1331 to make the first sliding rod 1331 in an active or fixed state.

[0026] Please refer to Figure 6 and Figure 7 The second light source assembly 143 includes a second slide bar 1431, a second carrier plate 1432 and a second light source component 1433. The second slide bar 1431 and the second light source component 1433 are respectively fixedly mounted on the second carrier plate 1432. The second mounting frame 141 includes a second sliding groove 1411 and a second fixing component (not shown in the figure). The second slide bar 1431 cooperates with the second sliding groove 1411. The second fixing component acts on the second slide bar 1431 to make the second slide bar 1431 active or fixed. Exemplarily, the height positions of the first light source component 1333 and the second light source component 1433 are manually adjusted.

[0027] Please refer to Figure 4 and Figure 6 In a possible implementation, the first light source 1333 includes a first light-emitting surface 1333A and a first through hole 1333B, the first through hole 1333B is arranged directly above the first detection position 111, and the first light-emitting surface 1333A is used to form a light emission along the Z-axis direction; the second light source 1433 includes a second light-emitting surface 1433A and a second through hole 1433B, the second through hole 1433B is arranged directly above the second detection position 112, and the second light-emitting surface 1433A is used to form an irradiation space within the circumferential range of the second detection. Exemplarily, since the first detection device 130 can only detect the information of the wafer 220 on a two-dimensional plane, the first light source 1333 only needs to concentrate on irradiating the upper surface of the wafer 220, and the second detection device 140 needs to detect the three-dimensional position information of the wire 230. Therefore, the irradiation space formed by the second light source 1433 should be able to illuminate the surroundings of the wafer 220 and the wire 230, so that the second detection device 140 can obtain the position information on the three-dimensional guide. In addition, it should be noted that the first through hole 1333B is used to avoid the first detection component 132, and the first detection component 132 obtains image information of the wafer 220 through the first through hole 1333B, and the second through hole 1433B is used to avoid the second detection component 142, and the second detection component 142 obtains image information of the wafer 220 through the second through hole 1433B.

[0028] Please refer to Figure 1 and Figure 7 In a possible implementation, the conveying device 120 includes a conveying track 121, a mobile gripper 122, a first in-position sensor 123, and a second in-position sensor 124. The mobile gripper 122 is connected to the conveying track 121 to drive the optical device 200 to move. The first in-position sensor 123 is set at the first detection position 111, and the second in-position sensor 124 is set at the second detection position 112. Exemplarily, the in-position sensor can ensure that the optical device 200 is accurately positioned at the first detection position 111 and the second detection position 112 during the conveying process. In addition, by automatically sensing whether the optical device 200 is in place, the waiting time and manual intervention time can be reduced, thereby improving the working efficiency of the entire AOI inspection machine 100.

[0029] Please refer to Figure 8 , Fig. 9 , Fig.10 and Fig.11 In a possible implementation, the AOI inspection machine 100 further includes a loading module 150 and a unloading module 160 disposed at opposite ends of the conveying device 120, the loading module 150 includes a main frame 151, a bracket 152, and an X-axis moving assembly 153, a Y-axis moving assembly 154, and a Z-axis moving assembly 155 all mounted on the main frame 151, the bracket 152 is connected to the Z-axis moving assembly 155, the bracket 152 is used to carry the fixture 400 in the material box 300, and the unloading module 160 is configured to have the same structure as the loading module 150. Exemplarily, in this embodiment, the material box 300 has a plurality of material placing grooves 310 for placing the fixture 400, the plurality of material placing grooves 310 are arranged in a single row, the fixture 400 is in a strip shape, and a plurality of placement grooves 410 are arranged in a single row, and the placement grooves 410 are arranged in a single row, and the placement grooves 410 are used to place the substrate 210 or the optical device 200. In a possible embodiment, the main frame 151 includes a loading position and a first cavity 1511 and a second cavity 1512 that are independently arranged, the Z-axis moving assembly 155 is arranged in the first cavity 1511, the Y-axis moving assembly 154 is arranged in the second cavity 1512, and the height position of the X-axis moving assembly 153 is arranged to be flush with the loading position.

[0030] Please refer to Figure 8 , Fig. 9 , Fig.10 and Fig.11 The Y-axis moving component 154 includes a Y-axis motor 1541, a belt 1542, a driving wheel 1543, a driven wheel 1544 and a moving member 1545. The driving wheel 1543 is connected to the Y-axis motor 1541. The driving wheel 1543 and the driven wheel 1544 are coupled and connected by the belt 1542. The moving member 1545 is connected to the belt 1542. The moving member 1545 is formed with a plurality of placement positions 1545C for placing the material boxes 300.

[0031] Please refer to Figure 8 , Fig. 9 , Fig.10 and Fig.11 The Z-axis moving assembly 155 includes a Z-axis motor 1551, a ball screw 1552, a guide rod 1553 and a first slider 1554. The Z-axis motor 1551 and the guide rod 1553 are fixedly installed on the main frame 151, the first slider 1554 is slidably installed on the ball screw 1552 and the guide rod 1553, and the bracket 152 is connected to the first slider 1554.

[0032] Please refer to Figure 8 , Fig. 9 , Fig.10 and Fig.11 In a possible embodiment, the Y-axis moving assembly 154 also includes a guide rail 1546 and a second slider 1547, the second slider 1547 is slidably mounted on the guide rail 1546, the moving member 1545 includes a moving plate 1545A and a plurality of column groups 1545B fixedly mounted on the moving plate 1545A, and the plurality of column groups 1545B are arranged at intervals on the moving plate 1545A, and a placement position 1545C is formed between adjacent column groups 1545B, and the moving plate 1545A is fixedly connected to the second slider 1547. Exemplarily, a plurality of placement positions 1545C are formed, and one placement position 1545C can place one material box 300. One column group 1545B includes two columns respectively arranged at both ends of the moving plate 1545A. The Y-axis moving assembly 154 is provided with the guide rail 1546 and the second slider 1547, which is conducive to improving the stability and accuracy of the moving member 1545 during the movement process and improving the control accuracy. The loading process includes: the Y-axis motor 1541 is used to drive the material box 300 to move along the Y-axis direction, so that the material box 300 is placed on the bracket 152. Thereafter, the Z-axis motor 1551 drives the bracket 152 to rise along the Z-axis direction to reach the loading position, and then the X-axis moving assembly 153 moves along the X-axis direction to push the fixture 400 in the material box 300 onto the track of the conveying device 120. In this embodiment, the unloading module 160 has the same structure as the loading module 150. When unloading, the moving gripper 122 of the conveying device 120 is used to push the fixture 400 into the material box 300, and then the Z-axis motor 1551 drives the bracket 152 to descend along the Z-axis direction, and then the Y-axis motor 1541 is used to drive the material box 300 to move along the Y-axis direction to move the material box 300 out to complete the unloading.

[0033] Please refer to Fig.17 The second object of the present invention is to provide a detection method, using the above-mentioned AOI detection machine 100, the method comprising: Preset appearance defect characteristics, position deviation range and position feature range; Move the optical device 200 to the first detection position 111 by the conveying device 120; The appearance information of the wafer 220 and the first position information of the wafer 220 on the substrate 210 are obtained; illustratively, the first position information includes the position distance and position angle of the wafer 220 on the substrate 210. The appearance information includes the appearance state of the upper surface of the wafer 220, and checks whether it has damage, cracks, stains, etc.

[0034] Compare the first position information with the position deviation range, and compare the appearance information with the appearance defect characteristics. If the first position information is within the position deviation range and the appearance information does not meet the appearance defect characteristics, move the optical device 200 to the second inspection position 112 for the next inspection process. If the first position information exceeds the position deviation range and / or the appearance information meets the appearance defect characteristics, mark it. Acquire position characteristic information of the wire 230 located on the optical device 200; The position characteristic information is compared with the position characteristic range. If the position characteristic information is consistent with the position characteristic range, the optical device 200 is determined to be qualified. If the position characteristic information is inconsistent with the position characteristic range, it is marked.

[0035] Please refer to Fig.13 , Fig.14 and Fig.17 In a possible implementation, the position feature information includes the height information, length information and bending angle information of the wire 230, and the position feature range includes the height position range, the length position range and the bending angle range, wherein the height information is compared with the height position range, the length information is compared with the length position range, the bending angle information is compared with the bending angle range, and if one of the height information, the length information and the bending angle information does not meet the position feature range, the optical device 200 is judged to be unqualified. Exemplarily, the wafer 220 is disposed on the substrate 210, and one end of the wire 230 has a solder joint with the wafer 220, and the other end has a solder joint with the substrate 210. Because the wire 230 cannot contact the epitaxial of the wafer 220 to avoid a short circuit, the wire 230 is in a bent state between the two solder joints, that is, the length of the wire 230 should be greater than the straight-line distance between the two solder joints. During assembly and manufacturing, the length of the guide should be controlled within a certain length range. Specifically, the height D of the wafer 220 is defined, and the height H of the wire 230 is a value within the range of [1 / 2D, D]. For example, the height H of the wire 230 can be equal to 1 / 2D, or 2 / 3D, or 3 / 4D, or 4 / 5D. The distance between two adjacent wafers 220 is defined as L, and the height H of the wire 230 should satisfy H<1 / 2L to avoid cross contact between adjacent wires 230. It should be noted that H<1 / 2L and 1 / 2D≥H≥D should be satisfied at the same time. The bending angle of the wire 230 is defined as α, and the value range of the bending angle α of the wire 230 is within the range of [75°, 135°]. The significance of limiting the bending angle of the wire 230 is to avoid the wire 230 from contacting the epitaxial wafer 220 and causing a short circuit. The length of the wire 230 is defined as S, and the value range of the length S of the wire 230 is [2.5D, 5D]. On the one hand, the purpose of limiting the length, bending angle, and height of the wire 230 is to improve the consistency of the product. The positions of the two solder joints are fixed, and then the length of the wire 230 is fixed, which is more conducive to the consistency of the bending angle and height of the wire 230 when it is connected.

[0036] In addition, it should be noted that when applied to a specific TO optical device 200, the specific standard values ​​of the length S, height H, and bending angle α of the wire 230 can be set according to actual conditions, and the height position range, length position range, and bending angle range can all be set according to their standard values. For example, the length S of the wire 230 is set to 4D, the bending angle α is set to 100°, and the height H is set to 3 / 4D, then 4D is the length standard value of the length S, 100° is the angle standard value of the bending angle α, and 3 / 4D is the height standard value of the height H. The height position range is the allowable deviation range of the height standard value, the length position range is the allowable deviation range of the length standard value, and the angle standard value is the allowable deviation range of the bending angle range. The length S of the wire 230 is obtained by extracting a three-dimensional stereoscopic image of the wire 230 by the second detection component 142, that is, the length information of the wire 230 obtained by the second detection device 140 is equal to or close to the actual length of the wire 230. Its specific values ​​can be set according to actual conditions, and no further details are given here.

[0037] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.< / map>

Claims

1. An AOI inspection machine, applied to an optical device, wherein the optical device comprises a substrate, a wafer and a wire, wherein the wafer is arranged on the substrate, and the substrate and the wafer are electrically connected through the wire, wherein: The AOI inspection machine comprises: A frame, including a first detection position and a second detection position; A conveying device, used for moving the optical device on the fixture to the first detection position and the second detection position in sequence; A first detection device, comprising a first mounting frame, a first detection assembly and a first light source assembly, wherein the first light source assembly is slidably mounted on the first mounting frame to adjust the position height of the first light source assembly, and the first light source assembly is arranged between the first detection assembly and the conveying device, and the first detection assembly is connected to the first mounting frame; A second detection device, comprising a second mounting frame, a second detection assembly and a second light source assembly, wherein the second light source assembly is slidably mounted on the second mounting frame to adjust the position height of the second light source assembly, and the second light source assembly is arranged between the second detection assembly and the conveying device, and the second detection assembly is connected to the second mounting frame; Among them, the first detection device is configured to obtain the appearance information of the wafer and the first position information of the wafer on the substrate, and perform a first detection and judgment based on the appearance information and the first position information. If it is unqualified, it is marked; if it is qualified, the next detection process is carried out; the second detection device is configured to obtain the position feature information of the wire on the optical device, and perform a second detection and judgment based on the position feature information. If it is qualified, the optical device is determined to be a qualified product; if it is unqualified, it is marked.

2. The AOI inspection machine according to claim 1, characterized in that: The first detection device further includes a first adjustment component, the first detection component is mounted on the first mounting frame through the first adjustment component, and the first adjustment component is used to adjust the position of the first detection device; The second detection device further includes a second adjustment component, through which the second detection component is mounted on the second mounting frame, and the second adjustment component is used to adjust the position of the second detection device.

3. The AOI inspection machine according to claim 2, characterized in that: The first light source assembly includes a first slide bar, a first bearing plate and a first light source component, the first slide bar and the first light source component are respectively fixedly mounted on the first bearing plate, the first mounting frame includes a first sliding slot and a first fixing component, the first slide bar cooperates with the first sliding slot, and the first fixing component acts on the first slide bar to make the first slide bar in an active or fixed state; The second light source assembly includes a second sliding rod, a second supporting plate and a second light source component. The second sliding rod and the second light source component are respectively fixedly mounted on the second supporting plate. The second mounting frame includes a second sliding groove and a second fixing component. The second sliding rod cooperates with the second sliding groove. The second fixing component acts on the second sliding rod to make the second sliding rod in an active or fixed state.

4. The AOI inspection machine according to claim 3, characterized in that: The first light source component includes a first light-emitting surface and a first through hole, the first through hole is arranged directly above the first detection position, and the first light-emitting surface is used to form light emitted along the Z-axis direction; the second light source component includes a second light-emitting surface and a second through hole, the second through hole is arranged directly above the second detection position, and the second light-emitting surface is used to form an irradiation space within the circumferential range of the second detection.

5. The AOI inspection machine according to claim 1, characterized in that: The conveying device includes a conveying track, a mobile gripper, a first in-place sensor and a second in-place sensor. The mobile gripper is connected to the conveying track to drive the optical device to move. The first in-place sensor is set at the first detection position, and the second in-place sensor is set at the second detection position.

6. The AOI inspection machine according to claim 5, characterized in that: The AOI inspection machine also includes a loading module and a unloading module arranged at opposite ends of the conveying device, the loading module includes a main frame, a bracket, and an X-axis moving component, a Y-axis moving component and a Z-axis moving component all installed on the main frame, the bracket is connected to the Z-axis moving component, the bracket is used to carry the jig in the material box, and the unloading module is configured to have the same structure as the loading module.

7. The AOI inspection machine according to claim 6, characterized in that: The main frame includes a loading position and a first cavity and a second cavity which are independently arranged respectively, the Z-axis moving assembly is arranged in the first cavity, the Y-axis moving assembly is arranged in the second cavity, and the height position of the X-axis moving assembly is arranged flush with the loading position; The Y-axis moving assembly includes a Y-axis motor, a belt, a driving wheel, a driven wheel and a moving member, wherein the driving wheel is connected to the Y-axis motor, the driving wheel and the driven wheel are coupled and connected via the belt, the moving member is connected to the belt, and the moving member is formed with a plurality of placement positions for placing the material box; The Z-axis moving assembly includes a Z-axis motor, a ball screw, a guide rod and a first slider. The Z-axis motor and the guide rod are fixedly mounted on the main frame, the first slider is slidably mounted on the ball screw and the guide rod, and the bracket is connected to the first slider.

8. The AOI inspection machine according to claim 7, characterized in that: The Y-axis moving assembly also includes a guide rail and a second slider, the second slider is slidably installed on the guide rail, the moving member includes a moving plate and a plurality of column groups fixedly installed on the moving plate, and the plurality of column groups are arranged on the moving plate at intervals, and the placement positions are formed between adjacent column groups, and the moving plate is fixedly connected to the second slider.

9. A detection method, characterized in that: Using the AOI inspection machine according to any one of claims 1 to 8, the method comprises: Preset appearance defect characteristics, position deviation range and position feature range; Moving the optical device to the first detection position by the conveying device; Acquiring appearance information of the wafer and first position information of the wafer on the substrate; Comparing the first position information with the position deviation range, and comparing the appearance information with the appearance defect characteristics, if the first position information is within the position deviation range, and the appearance information does not conform to the appearance defect characteristics, moving the optical device to the second inspection position for the next inspection process, and if the first position information exceeds the position deviation range, and / or the appearance information conforms to the appearance defect characteristics, marking it; Acquiring position characteristic information of a wire located on the optical device; The position characteristic information is compared with the position characteristic range. If the position characteristic information conforms to the position characteristic range, the optical device is determined to be qualified. If the position characteristic information does not conform to the position characteristic range, the optical device is marked.

10. The detection method according to claim 9, characterized in that: The position feature information includes the height information, length information and bending angle information of the wire, and the position feature range includes a height position range, a length position range and a bending angle range, wherein the height information is compared with the height position range, the length information is compared with the length position range, and the bending angle information is compared with the bending angle range, and if any one of the height information, the length information and the bending angle information does not conform to the position feature range, the optical device is judged to be unqualified.

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