Wafer detection device and detection method

Abstract

The invention discloses a wafer detection device and method, and belongs to the field of wafer detection, and the device comprises a rotating table which is suitable for bearing and adsorbing a wafer and driving the wafer to rotate; the positioning mechanism is suitable for detecting the offset of the wafer in the wafer rotating process; the adjusting mechanism is suitable for jacking the wafer away from the rotating table and driving the jacked wafer to finely adjust the wafer along a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction in response to the offset detected by the positioning mechanism; the first detection mechanism is used for detecting the edge of the wafer; the first supporting mechanism is located below the wafer and corresponds to part of the wafer in the detection area of the first detection mechanism, and the first supporting mechanism is suitable for being upwards close to and supporting the edge of the wafer; the wafer is suitable for being driven by the rotating table to rotate so that all parts of the periphery of the wafer can flow through the detection area of the first detection mechanism. By adopting the structure, the wafer can be accurately and efficiently detected.

Description

Technical Field

[0001] The present invention relates to the field of wafer detection technology, and in particular to a wafer detection device and a detection method. Background Art

[0002] During the wafer production process, the edge morphology needs to be detected. For example, Chinese invention patent CN202410048950.5 discloses a wafer edge detection device, including a rotating mechanism, a clamping mechanism and a supporting mechanism. The clamping mechanism is transmission-connected to the rotating mechanism, and the supporting mechanism is located below the clamping mechanism. During detection, the wafer is placed on the clamping mechanism, the clamping mechanism clamps the outer edge of the wafer, and the rotating mechanism drives the clamping mechanism to rotate so that the detection structure detects most of the outer edge of the wafer that is not blocked by the clamping mechanism; then the clamping mechanism releases the wafer, the supporting mechanism rises and supports the wafer, the turntable rotates a certain angle, and the supporting mechanism puts the wafer back to the clamping mechanism, so that the clamping mechanism clamps the outer edge of the wafer that has been detected; then the rotating mechanism continues to drive the clamping mechanism to rotate, and the detection structure can detect the remaining outer edge of the wafer.

[0003] When adopting the above structure, the clamping mechanism needs to clamp and release during the wafer placement process, which has low efficiency and is easy to damage the wafer during the clamping process. At the same time, the clamping mechanism will also block the outer edge of the wafer. After most of the wafer edges are inspected during the detection process, the supporting mechanism needs to cooperate with the rotating mechanism to adjust the clamping position of the wafer in order to detect the edges of the remaining wafers, which further reduces the detection efficiency. In addition, the entire detection process is not coherent, which is not conducive to analysis and processing after detection.

[0004] Therefore, it is necessary to improve the prior art to overcome the above defects in the prior art. Summary of the invention

[0005] The object of the present invention is to provide a wafer detection device and a detection method to significantly improve the detection efficiency of wafers.

[0006] The object of the present invention is to achieve the following technical solution: a wafer detection device, comprising: A rotating table, suitable for carrying and adsorbing wafers and driving the wafers to rotate; A positioning mechanism, adapted to detect the offset of the wafer during its rotation; An adjustment mechanism, adapted to lift the wafer off the rotating table, and in response to the offset detected by the positioning mechanism, drive the lifted wafer to fine-tune the wafer along a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction; A first detection mechanism, used to detect the edge of the wafer; The first support mechanism is located below the wafer and corresponds to a part of the wafer within the detection area of the first detection mechanism. The first support mechanism is adapted to move upwardly close to and support the edge of the wafer. Wherein, the wafer is adapted to rotate driven by the rotating table so that each part of its periphery flows through the detection area of the first detection mechanism.

[0007] Further, the adjustment mechanism includes: A lifting module; A fine adjustment module carried on the lifting module and adapted to move up and down in the vertical direction driven by the lifting module; A lifting frame carried on the fine adjustment module and adapted to move in a first horizontal direction and a second horizontal direction driven by the fine adjustment module; Wherein, the lifting frame is located below the wafer and is used to support the wafer.

[0008] Further, the wafer detection device includes a mounting table. The rotating table is arranged on the tabletop of the mounting table. A receiving space is formed inside the mounting table. The lifting module and the fine adjustment module are arranged in the receiving space. A part of the lifting frame is located inside the receiving space to be in transmission connection with the fine adjustment module, and a part is located outside the receiving space and surrounds the rotating table on all sides.

[0009] Further, the lifting frame includes: A bottom plate received in the receiving space and carried on the fine adjustment module; A top frame located above the bottom plate and surrounding the outer periphery of the rotating table; Connectors connected between the bottom plate and the top frame, and a plurality of them are arranged at intervals along the periphery of the bottom plate and / or the top frame; Wherein, a first support member protruding relative to the top surface of the top frame is provided on the top frame, and a plurality of the first support members are evenly distributed along the circumferential direction of the top frame to contact the bottom surface of the wafer.

[0010] Further, the positioning mechanism is located on one side of the rotating table in the first horizontal direction and includes: A first bracket; A detection sensor arranged on the first bracket and with a detection direction parallel to the vertical direction. Two of the detection sensors are arranged at intervals in the vertical direction, and the detection ends of the two detection sensors are arranged oppositely; Wherein, a detection area is formed between the two detection sensors. During the process of the rotating table driving the wafer to rotate, the edge of the wafer is adapted to flow through the detection area of the detection sensor.

[0011] Further, the first detection mechanism is located on one side of the rotating table in the second horizontal direction, and it includes: Two second brackets, which are arranged at intervals along the first horizontal direction, and the first support mechanism is located between the two second brackets; A first detection camera, which is arranged on one of the second brackets, and the shooting direction is parallel to the first horizontal direction; A first light source, which is arranged on the other second bracket, and the irradiation direction is parallel to the first horizontal direction, and the irradiation end of the first light source and the shooting end of the first detection camera are arranged oppositely; Wherein, a detection area is formed between the first detection camera and the first light source, and during the process that the rotating table drives the wafer to rotate, the edge of the wafer is adapted to flow through the detection area between the first detection camera and the first light source.

[0012] Further, the first support mechanism includes: A third bracket; A support driving member, which is arranged on the third bracket; A support assembly, which is in transmission connection with the support driving member and is located below the wafer; Wherein, the support assembly is adapted to move upward under the drive of the support driving member, and the support surface for supporting the wafer is flush with the support surface of the rotating table.

[0013] Further, the wafer detection device includes a second detection mechanism, the second detection mechanism is located on the other side of the rotating table in the first horizontal direction, and the second detection mechanism includes: A fourth bracket; A second detection camera, which is arranged on the fourth bracket, and the shooting direction is parallel to the vertical direction. There are two second detection cameras arranged at intervals along the vertical direction, and the shooting ends of the two second detection cameras are arranged oppositely; A second light source, which is arranged on the fourth bracket, is located between the two second detection cameras, and is adapted to irradiate the bottom surface of the wafer. The second light source is an annular light source, and the shooting ends of the two second detection cameras correspond to the hollow area of the second light source; A third light source, which is arranged on the fourth bracket and is adapted to irradiate the circumferential side of the wafer; Wherein, a detection area is formed between the two second detection cameras, the third light source is staggered from the detection area of the second detection camera, and during the process that the rotating table drives the wafer to rotate, the notch on the edge of the wafer is adapted to flow through the detection area of the second detection camera.

[0014] Further, the wafer inspection device includes a second support mechanism located below the wafer. The second support mechanism corresponds to a part of the wafer within the detection area of the second detection mechanism, and the second support mechanism is adapted to move upward to approach and support the edge of the wafer.

[0015] In addition, the present invention also provides a wafer inspection method, including the following steps: S100. Transport the wafer to the rotating table. The rotating table drives the wafer to rotate one week, and the positioning mechanism obtains the centroid deviation of the wafer. S200. The adjustment mechanism adjusts the position of the wafer according to the centroid deviation obtained by the positioning mechanism, so that the actual centroid of the wafer coincides with the preset standard centroid. S300. The rotating table drives the wafer to rotate one week again. The positioning mechanism reinspects the position of the wafer. If the actual centroid of the wafer coincides with the preset standard centroid, the rotating table drives the wafer to rotate one week for inspection. If the actual centroid of the wafer does not coincide with the preset standard centroid, repeat the steps of S200. S400. During the process of the rotating table driving the wafer to rotate for inspection, it stops after rotating a preset angle each time, and then the first support mechanism rises to support the edge of the wafer, and the first detection mechanism detects the edge of the supported wafer until the wafer rotates one week, completing the detection of multiple measurement points on the wafer edge.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present invention directly carries and adsorbs the wafer through the rotating table, without the need to set an additional clamping structure, and it is not easy to damage the wafer during the picking and placing process, making the picking and placing process more convenient and efficient. At the same time, the edge of the wafer will not be blocked, improving the subsequent detection efficiency and the coherence during the edge detection process; by setting the positioning mechanism and the adjustment mechanism, the positioning mechanism can detect the position of the wafer placed on the rotating table, and the adjustment mechanism can finely adjust the wafer according to the actual deviation of the wafer, so that the wafer is accurately coaxial with the rotating table, enabling reliable detection of the edge of the wafer during the subsequent detection process; in order to ensure reliable edge detection of wafers of different sizes, the size of the rotating table is made smaller so that the sizes of different wafers are all larger than the size of the rotating table to avoid blocking the edge of the wafer. However, adopting the above structure will cause the edge of some larger-sized wafers to warp downward, affecting the detection accuracy. By setting the first support mechanism, it can support the edge of the part of the wafer in the detection area to prevent this part from warping downward and improve the detection accuracy. Description of the Drawings

[0017] Figure 1 is a schematic structural diagram of the wafer inspection device of the present invention.

[0018] Figure 2It is a schematic structural diagram of the wafer detection device of the present invention when a wafer is installed.

[0019] Figure 3 It is an installation schematic diagram of the rotating table, adjustment mechanism and mounting table in the present invention.

[0020] Figure 4 It is a schematic structural diagram of the adjustment mechanism in the present invention.

[0021] Figure 5 It is a schematic structural diagram of the positioning mechanism in the present invention.

[0022] Figure 6 It is a schematic structural diagram of the first detection mechanism and the first support mechanism in the present invention.

[0023] Figure 7 It is an installation schematic diagram of the baffle and the adjustment block in the present invention.

[0024] Figure 8 It is an exploded structural schematic diagram of the baffle and the adjustment block in the present invention.

[0025] Figure 9 It is a cross-sectional schematic diagram of the first support mechanism in the present invention.

[0026] Figure 10 It is a schematic structural diagram of the second detection mechanism and the second support mechanism in the present invention.

[0027] Explanation of reference numerals: 100, Rotating table; 110, Wafer; 111, Notch; 200, Adjusting mechanism; 210, Lifting module; 211, Lifting driving part; 212, Sliding seat; 213, Slide rail assembly; 220, Fine-tuning module; 230, Lifting frame; 231, Bottom plate; 232, Top frame; 233, Connecting part; 234, First support part; 300, Positioning mechanism; 310, First bracket; 320, Detection sensor; 400, First detection mechanism; 410, Second bracket; 411, Displacement slide; 412, Mounting seat; 413, Baffle plate; 4131, Avoidance hole; 4132, Connecting hole; 414, Adjusting block; 4141, Adjusting waist-shaped hole; 420, First detection camera; 430, First light source; 500, First support mechanism; 510, Third bracket; 520, Support driving part; 530, Support assembly; 531, Support seat; 5311, Mounting hole; 5312, First section; 5313, Second section; 532, Second support part; 5321, Rod body; 5322, Convex part; 533, Spring; 534, Micrometer; 600, Mounting table; 610, Receiving space; 620, Substrate; 630, Table board; 631, Avoidance area; 640, Column; 700, Second detection mechanism; 710, Fourth bracket; 720, Second detection camera; 730, Second light source; 740, Third light source; 750, Adjusting cylinder; 800, Second support mechanism. Detailed implementation manners

[0028] To make the above objectives, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application in conjunction with the accompanying drawings. It can be understood that the specific embodiments described herein are only used to explain the present application, rather than limiting the present application. Additionally, it should be noted that for the convenience of description, only the parts related to the present application are shown in the drawings, rather than all the structures. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0029] The terms "including" and "having" in the present application and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include steps or units not listed, or may optionally further include other steps or units inherent to these processes, methods, products, or devices.

[0030] References herein to "embodiments" mean that the particular features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0031] Please refer to Figure 1 and Figure 2 As shown, a wafer inspection device corresponding to a preferred embodiment of the present invention includes: a rotating table 100, adapted to carry and adsorb a wafer 110 and drive the wafer 110 to rotate; a positioning mechanism 300, adapted to detect the offset of the wafer 110 during the rotation of the wafer 110; an adjustment mechanism 200, adapted to lift the wafer 110 away from the rotating table 100 and, in response to the offset detected by the positioning mechanism 300, drive the lifted wafer 110 to finely adjust the wafer 110 along a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction; a first detection mechanism 400, for detecting the edge of the wafer 110; a first support mechanism 500, located below the wafer 110 and corresponding to a part of the wafer 110 within the detection area of the first detection mechanism 400, the first support mechanism 500 being adapted to move upward to approach and support the edge of the wafer 110; wherein, the wafer 110 is adapted to rotate under the drive of the rotating table 100 so that each part of its periphery flows through the detection area of the first detection mechanism 400.

[0032] In the present invention, the rotating table 100 directly carries and adsorbs the wafer 110, eliminating the need for an additional clamping structure. During the picking and placing process, the wafer 110 is not easily damaged, and the picking and placing process is more convenient and efficient. At the same time, the edge of the wafer 110 is not blocked, improving the subsequent detection efficiency and the coherence during the edge detection process; by providing the positioning mechanism 300 and the adjustment mechanism 200, the positioning mechanism 300 can detect the position of the wafer 110 placed on the rotating table 100, and the adjustment mechanism 200 can finely adjust the wafer 110 according to the actual deviation of the wafer 110 to make the wafer 110 precisely coaxial with the rotating table 100, enabling reliable detection of the edge of the wafer 110 during the subsequent detection process; in order to ensure reliable edge detection for wafers 110 of different sizes, the size of the rotating table 100 is made smaller so that the sizes of different wafers 110 are all larger than the size of the rotating table 100 to avoid blocking the edge of the wafer 110. However, adopting the above structure may cause the edge of some larger-sized wafers 110 to warp downward, affecting the detection accuracy. By providing the first support mechanism 500, it can support the edge of the part of the wafer 110 within the detection area to prevent this part from warping downward and improve the detection accuracy.

[0033] Furthermore, the rotating table 100 is a conventional vacuum adsorption rotating table. The table top of the rotating table 100 is circular and is provided with a plurality of adsorption holes to adsorb the bottom surface of the wafer 110 , which will not be elaborated in detail in the present invention.

[0034] Further, refer to Figure 3 and Figure 4 As shown, the adjustment mechanism 200 includes a lifting module 210, a fine-tuning module 220 and a lifting frame 230. The fine-tuning module 220 is carried by the lifting module 210 and is suitable for lifting and lowering in a vertical direction under the drive of the lifting module 210. The lifting frame 230 is carried by the fine-tuning module 220 and is suitable for moving in a first horizontal direction and a second horizontal direction under the drive of the fine-tuning module 220. The lifting frame 230 is located below the wafer 110 and is suitable for lifting to support the wafer 110.

[0035] In the present embodiment, the jacking module 210 includes a jacking drive 211 and a sliding seat 212. The jacking drive 211 can be an electric cylinder or a pneumatic cylinder. In the present embodiment, an electric cylinder is preferably used to improve the reliability of the load-bearing. The sliding seat 212 is connected to the output end of the jacking drive 211 so as to be lifted and lowered in the vertical direction under the drive of the jacking drive 211. Preferably, a slide rail assembly 213 is provided between the sliding seat 212 and the jacking drive 211, and the slide rail assembly 213 is arranged along the vertical direction to smoothly and reliably guide the lifting and lowering of the sliding seat 212. The fine-tuning module 220 is an electric slide, which is fixed on the sliding seat 212. The electric slide is a well-known structure, and the present invention will not be repeated here. The lifting frame 230 is connected to the output end of the fine-tuning module 220 and is located below the wafer 110. It is suitable for lifting and supporting the wafer 110 under the drive of the lifting module 210, and is suitable for moving along the first horizontal direction and the second horizontal direction under the drive of the fine-tuning module 220 to achieve fine-tuning of the wafer 110.

[0036] Furthermore, the wafer inspection device includes a mounting table 600, a rotating table 100 is arranged on the table top of the mounting table 600, a receiving space 610 is formed in the mounting table 600, a lifting module 210 and a fine-tuning module 220 are arranged in the receiving space 610, a lifting frame 230 is partially located in the receiving space 610 to be transmission-connected with the fine-tuning module 220, and is partially located outside the receiving space 610 and is arranged around the rotating table 100.

[0037] Specifically, the mounting platform 600 includes a base plate 620, a table plate 630 and a column 640. The table plate 630 is arranged in parallel above the base plate 620. The rotating platform 100 is fixed to the table surface of the table plate 630. The column 640 is connected between the base plate 620 and the table plate 630. There are multiple columns 640, which are arranged at intervals along the periphery of the base plate 620 and / or the table plate 630. A plurality of columns 640 surround a receiving space 610.

[0038] The lifting frame 230 includes a bottom plate 231, a top frame 232, and a connecting member 233. The bottom plate 231 is received in the receiving space 610 and carried on the fine adjustment module 220. The top frame 232 is a through structure in the vertical direction. It is located outside the receiving space 610 and surrounds the outer periphery of the rotating table 100. The connecting member 233 extends partially through the receiving space 610 to the outside to connect between the bottom plate 231 and the top frame 232, and a plurality of connecting members 233 are arranged at intervals along the periphery of the bottom plate 231 and / or the top frame 232.

[0039] In this embodiment, the connecting member 233 has a columnar structure and is arranged in the vertical direction. The table plate 630 is formed with an avoidance area 631 penetrating in the vertical direction. The connecting member 233 is received in the avoidance area 631 to connect the bottom plate 231 and the top frame 232 through the avoidance area 631. In the avoidance area 631, the connecting member 233 can move in the first horizontal direction and the second horizontal direction to avoid hindering the fine adjustment of the wafer 110. A plurality of connecting members 233 are respectively arranged on both sides of the bottom plate 231 and / or the top frame 232 in the first horizontal direction, and preferably two connecting members 233 are provided on each side. Correspondingly, the number of avoidance areas 631 is two, and they are respectively arranged on both sides of the table plate 630 in the first horizontal direction. Each avoidance area 631 on each side receives two connecting members 233.

[0040] However, when the top frame 232 is directly used to lift the wafer 110, the contact area between the top frame 232 and the wafer 110 is relatively large. To ensure the reliability during the lifting process, a high flatness requirement is imposed on the top frame 232. As a preferred embodiment, the top frame 232 is provided with a plurality of first support members 234 protruding from the top surface of the top frame 232. The first support members 234 are evenly distributed along the axis of the top frame 232 to contact the bottom surface of the wafer 110, ensuring reliable contact and lifting of the wafer 110. The first support member 234 is preferably a vacuum suction nozzle, which can adsorb the wafer 110 to prevent the wafer 110 from shifting relative to the lifting frame 230 during the lifting and fine adjustment processes.

[0041] Further, referring to Figure 1 、 Figure 2 and Figure 5As shown, the positioning mechanism 300 is located on one side of the rotating table 100 in the first horizontal direction, and it includes a first bracket 310 and a detection sensor 320 arranged on the first bracket 310. The detection sensor 320 can be a laser sensor, and its detection direction is parallel to the vertical direction. Two detection sensors 320 are arranged at intervals along the vertical direction. One of the detection sensors 320 is located above the wafer 110, and the other detection sensor 320 is located below the wafer 110. The detection ends of the two detection sensors 320 are arranged opposite to each other. A detection area is formed between the two detection sensors 320. During the rotation of the rotating table 100 driving the wafer 110, the edge of the wafer 110 is adapted to flow through the detection area of the detection sensor 320 to detect the eccentricity of the wafer 110. Since the size of the wafer 110 is larger than the tabletop size of the rotating table 100, the wafer 110 may be warped downward. By setting the two detection sensors 320 to cooperate with each other, the error caused by the deformation of the wafer 110 in the vertical direction can be compensated and / or eliminated, making the obtained deviation information more accurate.

[0042] In addition, some wafers 110 also need to measure their diameters during the detection process. The detection sensor 320 can also measure the diameter of the wafer 110, that is, the positioning mechanism 300 can simultaneously have the functions of wafer 110 deviation detection and diameter measurement, without the need to set up additional measurement structures, simplifying the structure and reducing costs.

[0043] Furthermore, referring to Figure 1 、 Figure 2 and Figure 6 As shown, the first detection mechanism 400 is located on one side of the rotating table 100 in the second horizontal direction, and it includes a second bracket 410, a first detection camera 420 and a first light source 430. The number of the second brackets 410 is two, and they are arranged at intervals along the first horizontal direction. The first support mechanism 500 is located between the two second brackets 410. The first detection camera 420 is arranged on one of the second brackets 410, and its shooting direction is parallel to the first horizontal direction. The first light source 430 is arranged on the other second bracket 410, and its irradiation direction is parallel to the first horizontal direction. The irradiation end of the first light source 430 and the shooting end of the first detection camera 420 are arranged opposite to each other. A detection area is formed between the first detection camera 420 and the first light source 430. During the rotation of the rotating table 100 driving the wafer 110, the edge of the wafer 110 is adapted to flow through the detection area between the first detection camera 420 and the first light source 430 to detect the chamfer or the edge appearance of the wafer 110 edge, etc.

[0044] Preferably, displacement sliders 411 are provided on both of the two second brackets 410. Mounting seats 412 are provided on the displacement sliders 411. The first inspection camera 420 and the first light source 430 are respectively arranged on different mounting seats 412. The displacement slider 411 is a manually adjustable structure, which can adjust the first inspection camera 420 and the first light source 430 to correspond to a preset position on the edge of the wafer 110 to ensure the inspection accuracy.

[0045] Preferably, a shielding plate 413 is provided on the mounting seat 412 corresponding to the first light source 430. The shielding plate 413 is adapted to shield the irradiation end of the first light source 430. Refer to Figure 7 and Figure 8 As shown, the shielding plate 413 is provided with an avoidance hole 4131 concentric with the first light source 430. The avoidance hole 4131 can limit the irradiation range of the first light source 430 to accurately match the edge of the wafer 110, that is, the light hits exactly on the edge area to be detected, reducing interference and enabling the first inspection camera 420 to clearly capture the edge contour. In the irradiation direction of the first light source 430, the inner peripheral dimension of the avoidance hole 4131 gradually decreases, so that the light emitted from the avoidance hole 4131 can be more convergent, further improving the irradiation effect. The avoidance hole 4131 is preferably a square hole. Two of the cross-sectional edges of the avoidance hole 4131 are parallel to the vertical direction, and the other two edges are parallel to the second horizontal direction. With the above structure, the light emitted by the first light source 430 is square, and the edge of the square light is a straight edge, which can generate a sharp boundary and a very high-contrast bright-dark dividing line, greatly simplifying the edge positioning process of the image, improving the positioning accuracy, making it extremely sensitive to minute defects in the edge morphology, and at the same time maintaining the lighting uniformity.

[0046] In addition, an adjustment block 414 is provided on the shielding plate 413. The adjustment block 414 is located on the side of the shielding plate 413 away from the first light source 430. The adjustment block 414 can move relative to the shielding plate 413 to gradually open or close the side of the avoidance hole 4131 away from the first light source 430, and then the opening of the avoidance hole 4131 can be flexibly adjusted according to actual needs to meet different lighting requirements. In this embodiment, there are two adjustment blocks 414, which are arranged relative to each other in the vertical direction. The adjustment blocks 414 can slide in the vertical direction. The two adjustment blocks 414 are suitable for moving toward each other to gradually close the avoidance hole 4131, or moving away from each other to gradually open the avoidance hole 4131. One of the adjustment block 414 and the baffle plate 413 is provided with a connection hole 4132, and the other is provided with an adjustment waist hole 4141. The length direction of the adjustment waist hole 4141 is parallel to the vertical direction. Bolts, screws and other threaded parts are provided between the connection hole 4132 and the adjustment waist hole 4141 to achieve the fixation of the adjustment block 414 and the baffle plate 413. Preferably, in the second horizontal direction, the two sides of the adjustment block 414 protrude relative to the inner walls of the two sides of the avoidance hole 4131, and the opposite sides of the two adjustment blocks 414 are parallel to the second horizontal direction, so that during the adjustment process of the adjustment block 414, the defined different opening areas are also square areas, and the size in the second horizontal direction remains unchanged, and only the size in the vertical direction changes, so as to avoid readjusting the positions of the first light source 430 and the first detection camera 420 after the adjustment of the adjustment block 414.

[0047] Further, refer to Figure 1 , Figure 2 , Figure 6 and Figure 9 As shown, the first support mechanism 500 includes a third bracket 510, a support driver 520 and a support assembly 530. The support driver 520 is arranged on the third bracket 510. The support assembly 530 is connected to the support driver 520 by transmission and is located below the wafer 110. The support assembly 530 is suitable for moving upward under the drive of the support driver 520, and its support surface for supporting the wafer 110 is flush with the support surface of the rotating table 100, so as to correct the edge of the wafer 110, so that the edge and the middle of the wafer 110 are on the same horizontal plane, ensuring that the first detection camera 420 and the first light source 430 are facing the cross section of the wafer 110 perpendicular to the first horizontal direction, which is convenient for accurate analysis after imaging. The support driver 520 preferably adopts an electric cylinder arranged in the vertical direction to ensure the lifting accuracy of the support assembly 530.

[0048] The support assembly 530 includes a support base 531 and a second support member 532. The support base 531 is connected to the output end of the support driving member 520. The support base 531 is recessed inward from its top to form a mounting hole 5311. The second support member 532 is inserted through the mounting hole 5311 and protrudes relative to the top of the support base 531 at the top. The second support member 532 is used to contact and support the top surface of the wafer 110. In this embodiment, preferably, there are two second support members 532, which are arranged side by side along the first horizontal direction. The two second support members 532 cooperate to support the edge of the wafer 110, and the correction effect is better.

[0049] Preferably, in this embodiment, the second support member 532 has a rod-shaped structure, which includes a rod body 5321 and a convex portion 5322 coaxially arranged at the bottom end of the rod body 5321. The outer diameter of the convex portion 5322 is larger than the outer diameter of the rod body 5321. The mounting hole 5311 is formed by penetrating along the vertical direction, and it includes a first section 5312 and a second section 5313 connected to the first section 5312. The first section 5312 is adapted to the rod body 5321, and the second section 5313 is adapted to the convex portion 5322. The rod body 5321 is received in the first section 5312, and the bottom end extends into the second section 5313. The convex portion 5322 is received in the second section 5313. The second support member 532 can move vertically. A spring 533 is sleeved outside the rod body 5321. One end of the spring 533 abuts against the convex portion 5322, and the other end abuts against the step surface between the first section 5312 and the second section 5313. A micrometer 534 is provided at the bottom of the support base 531. The telescopic end of the micrometer 534 extends into the second section 5313 from the end of the second section 5313 away from the first section 5312 and abuts against the convex portion 5322. By rotating the micrometer 534, it can push the convex portion 5322, so that the rod body 5321 gradually extends out of the first section 5312 and compresses the spring 533. When the micrometer 534 is rotated in the opposite direction, the rod body 5321 gradually extends into the first section 5312 under the elastic return of the spring 533.

[0050] By adopting the above structure, the extension amount of the rod body 5321 can be adjusted. When the support driving member 520 rises to a preset position and the top end of the second support member 532 is not flush with the tabletop of the rotating table 100, the two can be made flush by adjusting the rod body 5321. The operation is simple and there is no need to additionally adjust the support driving member 520.

[0051] Further, when detecting the wafer 110, in addition to detecting the edge of the wafer 110, there is also a need to detect the notch 111 on the edge of the wafer 110, such as whether the size, contour, etc. of the notch 111 meet the requirements.

[0052] As a preferred embodiment, referring to Figure 1 、 Figure 2 andFigure 10 As shown, the wafer inspection device includes a second inspection mechanism 700 located on the other side of the rotating table 100 in the first horizontal direction. The second inspection mechanism 700 includes a fourth support 710, a second inspection camera 720, a second light source 730, and a third light source 740. The second inspection camera 720 is disposed on the fourth support 710, and the shooting direction is parallel to the vertical direction. Two second inspection cameras 720 are arranged at intervals along the vertical direction. One of the second inspection cameras 720 is located above the wafer 110, and the other second inspection camera 720 is located below the wafer 110. The shooting ends of the two second inspection cameras 720 are arranged oppositely, and a detection area is formed between the two second inspection cameras 720. During the rotation of the rotating table 100 driving the wafer 110, the notch 111 on the edge of the wafer 110 is adapted to flow through the detection area of the second inspection camera 720.

[0053] The second light source 730 is disposed on the fourth support 710, which is located between the two second inspection cameras 720, and is adapted to irradiate the bottom surface of the wafer 110 along the vertical direction. The second light source 730 is an annular light source. The shooting ends of the two second inspection cameras 720 correspond to the hollow area of the second light source 730. The second inspection camera 720 can pass through the hollow area of the second light source 730 to shoot the notch 111.

[0054] The third light source 740 is disposed on the fourth support 710, which is staggered from the detection area of the second inspection camera 720 to avoid obstructing the shooting of the second inspection camera 720. The third light source 740 is disposed opposite to the peripheral side of the wafer 110 and is adapted to irradiate the peripheral side of the wafer 110 along the first horizontal direction. Through the mutual cooperation of the second light source 730 and the third light source 740, the notch 111 can be irradiated in all directions to ensure that the second inspection camera 720 clearly shoots the image of the notch 111. Preferably, an adjustment cylinder 750 is provided between the third light source 740 and the fourth support 710. The adjustment cylinder 750 is adapted to drive the third light source 740 to approach or move away from the peripheral side of the wafer 110 along the first horizontal direction to adapt to wafers 110 of different sizes.

[0055] Furthermore, the wafer inspection device further includes a second support mechanism 800 located below the wafer 110. The second support mechanism 800 corresponds to a part of the wafer 110 within the detection area of the second inspection mechanism 700. The second support mechanism 800 is adapted to move upward to approach and support the edge of the wafer 110 to improve the accuracy of the detection by the second inspection camera 720. The second light source 730 is located between the second support mechanism 800 and the third light source 740. In this embodiment, the second support mechanism 800 is directly disposed on the fourth support 710. The structure of the second support mechanism 800 is similar to that of the first support mechanism 500, and will not be described in detail in the present invention.

[0056] In addition, the present invention further provides a detection method, including the following steps: S100. Transfer the wafer 110 to the rotating table 100. The rotating table 100 drives the wafer 110 to rotate one week, and the positioning mechanism 300 obtains the center deviation amount of the wafer 110.

[0057] S200. The adjustment mechanism 200 adjusts the position of the wafer 110 according to the center deviation amount obtained by the positioning mechanism 300, so that the actual center of the wafer 110 coincides with the preset standard center.

[0058] In this step, first, the rotating table 100 releases the adsorption of the wafer 110. Then, the lifting module 210 lifts the lifting frame 230 to make the wafer 110 separate from the rotating table 100. Then, the fine adjustment module 220 adjusts the wafer 110 along the first horizontal direction and the second horizontal direction according to the actual deviation to make the center of the wafer 110 coincide with that of the rotating table 100. Then, the lifting module 210 drives the lifting frame 230 to descend, and the wafer 110 is re-adsorbed on the rotating table 100.

[0059] S300. The rotating table 100 drives the wafer 110 to rotate one week again. The positioning mechanism 300 reinspects the position of the wafer 110. If the actual center of the wafer 110 coincides with the preset standard center, the rotating table 100 drives the wafer 110 to rotate one week for detection. If the actual center of the wafer 110 does not coincide with the preset standard center, repeat the steps of S200.

[0060] S400. During the rotation detection process of the rotating table 100 driving the wafer 110, it stops after rotating a preset angle each time. Then, the first support mechanism 500 rises to support the edge of the wafer 110, and the first detection mechanism 400 detects the edge of the supported wafer 110 until the wafer 110 rotates one week to complete the detection of multiple measurement points on the edge of the wafer 110.

[0061] In this step, specifically, the rotating table 100 stops once every 45° rotation, and performs edge detection during the stop interval. After the detection is completed, the rotating table 100 continues to rotate 45° for re-detection until the wafer 110 rotates one week to complete the detection and take away the wafer 110. It should be noted that in other embodiments, it can also rotate once every 30°, 60°, etc. The present invention does not limit this here.

[0062] Further, when the second detection mechanism 700 and the second support mechanism 800 are provided, during the multiple stop intervals of the rotating table 100, there is a situation where the edge notch 111 of the wafer 110 corresponds to the second detection mechanism 700. When the notch 111 corresponds to the second detection mechanism 700, the second support mechanism 800 rises to support the edge of the wafer 110, and then the second detection mechanism 700 detects the notch 111.

[0063] The above are only the embodiments of the present application, and do not thus limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall similarly be included within the patent protection scope of the present application.

Claims

1. A wafer inspection device, characterized in that, Comprising: A rotating table (100), adapted to carry and adsorb a wafer (110) and drive the wafer (110) to rotate; A positioning mechanism (300), adapted to detect the offset of the wafer (110) during the rotation of the wafer (110); An adjustment mechanism (200), adapted to lift the wafer (110) away from the rotating table (100) and, in response to the offset detected by the positioning mechanism (300), drive the lifted wafer (110) to finely adjust the wafer (110) in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction; A first detection mechanism (400) for detecting the edge of the wafer (110); A first support mechanism (500), located below the wafer (110) and corresponding to a part of the wafer (110) within the detection area of the first detection mechanism (400), the first support mechanism (500) being adapted to move upward close to and support the edge of the wafer (110); Wherein, the wafer (110) is adapted to rotate under the drive of the rotating table (100) so that each part of its periphery flows through the detection area of the first detection mechanism (400).

2. The wafer inspection device according to claim 1, wherein The adjustment mechanism (200) includes: A lifting module (210); A fine adjustment module (220), carried on the lifting module (210) and adapted to move up and down in the vertical direction under the drive of the lifting module (210); A lifting frame (230), carried on the fine adjustment module (220) and adapted to move in the first horizontal direction and the second horizontal direction under the drive of the fine adjustment module (220); Wherein, the lifting frame (230) is located below the wafer (110) and is used to support the wafer (110).

3. The wafer inspection device according to claim 2, wherein, The wafer detection device includes a mounting table (600), the rotating table (100) is arranged on the tabletop of the mounting table (600), a receiving space (610) is formed in the mounting table (600), the lifting module (210) and the fine adjustment module (220) are arranged in the receiving space (610), and a part of the lifting frame (230) is located in the receiving space (610) to be in transmission connection with the fine adjustment module (220), and a part is located outside the receiving space (610) and surrounds the rotating table (100) on all sides.

4. The wafer inspection device according to claim 3, wherein The lifting frame (230) includes: A bottom plate (231), received in the receiving space (610) and carried on the fine adjustment module (220); A top frame (232), located outside the receiving space (610) and surrounding the outer periphery of the rotating table (100); Connectors (233), connected between the bottom plate (231) and the top frame (232), and a plurality of them are arranged at intervals along the periphery of the bottom plate (231) and / or the top frame (232); Wherein, a first support member (234) protruding relative to the top surface of the top frame (232) is provided on the top frame (232), and a plurality of the first support members (234) are evenly distributed along the circumferential direction of the top frame (232) to contact the bottom surface of the wafer (110).

5. The wafer inspection device according to claim 1, characterized in that, The positioning mechanism (300) is located on one side of the rotating table (100) in the first horizontal direction and includes: The first bracket (310); The detection sensors (320) are arranged on the first bracket (310), and the detection directions are parallel to the vertical direction. Two detection sensors (320) are arranged at intervals along the vertical direction, and the detection ends of the two detection sensors (320) are arranged oppositely; Wherein, a detection area is formed between the two detection sensors (320). During the rotation of the rotating table (100) driving the wafer (110), the edge of the wafer (110) is adapted to flow through the detection area of the detection sensors (320).

6. The wafer inspection device according to claim 1, characterized in that, The first detection mechanism (400) is located on one side of the rotating table (100) in the second horizontal direction and includes: The second brackets (410), the number of which is two, are arranged at intervals along the first horizontal direction, and the first support mechanism (500) is located between the two second brackets (410); The first detection camera (420) is arranged on one of the second brackets (410), and the shooting direction is parallel to the first horizontal direction; The first light source (430) is arranged on the other second bracket (410), and the irradiation direction is parallel to the first horizontal direction. The irradiation end of the first light source (430) and the shooting end of the first detection camera (420) are arranged oppositely; Wherein, a detection area is formed between the first detection camera (420) and the first light source (430). During the rotation of the rotating table (100) driving the wafer (110), the edge of the wafer (110) is adapted to flow through the detection area between the first detection camera (420) and the first light source (430).

7. The wafer inspection device according to claim 1, wherein, The first support mechanism (500) includes: The third bracket (510); The support driving member (520) is arranged on the third bracket (510); The support assembly (530) is in transmission connection with the support driving member (520) and is located below the wafer (110); Wherein, the support assembly (530) is adapted to move upward under the drive of the support driving member (520) so that the support surface for supporting the wafer (110) is flush with the support surface of the rotating table (100).

8. The wafer inspection device according to claim 1, wherein, The wafer detection device includes a second detection mechanism (700). The second detection mechanism (700) is located on the other side of the rotating table (100) in the first horizontal direction. The second detection mechanism (700) includes: The fourth bracket (710); The second detection cameras (720) are arranged on the fourth bracket (710), and the shooting directions are parallel to the vertical direction. Two second detection cameras (720) are arranged at intervals along the vertical direction, and the shooting ends of the two second detection cameras (720) are arranged oppositely; A second light source (730) is disposed on the fourth support (710), located between the two second detection cameras (720), and adapted to irradiate the bottom surface of the wafer (110). The second light source (730) is an annular light source, and the shooting ends of the two second detection cameras (720) correspond to the hollow area of the second light source (730); A third light source (740) is disposed on the fourth support (710) and adapted to irradiate the circumferential side of the wafer (110); Wherein, a detection area is formed between the two second detection cameras (720), the third light source (740) is staggered from the detection area of the second detection camera (720), and during the rotation of the wafer (110) driven by the turntable (100), the notch (111) at the edge of the wafer (110) is adapted to flow through the detection area of the second detection camera (720).

9. The wafer inspection apparatus according to claim 8, wherein, The wafer detection device includes a second support mechanism (800) located below the wafer (110). The second support mechanism (800) corresponds to a part of the wafer (110) within the detection area of the second detection mechanism (700), and the second support mechanism (800) is adapted to move upward to approach and support the edge of the wafer (110).

10. A wafer detection method, characterized in that, Including the following steps: S100. Transport the wafer (110) to the turntable (100), the turntable (100) drives the wafer (110) to rotate one week, and the positioning mechanism (300) obtains the center deviation of the wafer (110); S200. The adjustment mechanism (200) adjusts the position of the wafer (110) according to the center deviation obtained by the positioning mechanism (300) so that the actual center of the wafer (110) coincides with the preset standard center; S300. The turntable (100) drives the wafer (110) to rotate one week again, and the positioning mechanism (300) reinspects the position of the wafer (110). If the actual center of the wafer (110) coincides with the preset standard center, the turntable (100) drives the wafer (110) to rotate one week for detection. If the actual center of the wafer (110) does not coincide with the preset standard center, repeat the steps of S200; S400. During the rotation detection of the wafer (110) driven by the turntable (100), it stops after rotating a preset angle each time, and then the first support mechanism (500) rises to support the edge of the wafer (110), and the first detection mechanism (400) detects the edge of the supported wafer (110) until the wafer (110) rotates one week to complete the detection of multiple measurement points on the edge of the wafer (110).

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