Automatic discharging type sheet type butterfly valve plate stamping equipment

Abstract

The invention relates to the technical field of stamping equipment, in particular to automatic discharging type sheet type butterfly valve plate stamping equipment which comprises a workbench and a base, the workbench is fixedly connected to the base, a driving assembly is arranged on the base and comprises a press machine and a die, the press machine is fixedly connected to the workbench, and the die is fixedly connected to the press machine. A heating assembly is arranged on the workbench and comprises a support, conducting strips, a fixing cylinder, a lifting seat, a rubber air bag, a first power source, a fixing rod, a first conducting block and a first conducting rod, the support is fixedly connected to the workbench, the two conducting strips are fixedly connected to the support, the fixing cylinder is fixedly connected to the base, and the lifting seat is slidably connected to the fixing cylinder; a cooling assembly is arranged on the base; raw materials can be heated and softened before stamping, so that the raw materials can be better attached to the die in the stamping process, and the produced valve plate can better meet the production requirements at fine features.

Description

Technical Field

[0001] The invention relates to the technical field of stamping equipment, in particular to an automatic unloading type thin-film butterfly valve plate stamping equipment. Background Art

[0002] Butterfly valve discs are usually in the form of thin sheets, so in mass production, they can be produced by stamping. Compared with butterfly valve discs produced by cutting and other methods, butterfly valve discs produced by stamping have smoother edges, so they can have better sealing when used.

[0003] However, depending on the type of butterfly valve, some butterfly valve discs have subtle features in shape, that is, the shape of the butterfly valve disc is irregular, so that the valve disc encounters less resistance when in use. When the butterfly valve disc has these subtle features in shape, the butterfly valve disc produced by conventional stamping methods is prone to dimensional errors at these subtle features, resulting in poor sealing when the valve disc is put into use. Therefore, a new stamping equipment is needed to solve this problem. Summary of the invention

[0004] In order to solve the above technical problems, the present invention proposes an automatic unloading thin-film butterfly valve plate stamping equipment, which can heat and soften the raw material before stamping, so that the raw material can fit the mold better during the stamping process, so that the produced valve plate can better meet the production requirements in terms of subtle features.

[0005] The technical solution to achieve the purpose of the present invention is: an automatic unloading type thin-film butterfly valve valve sheet stamping equipment, including a workbench and a base, the workbench is fixedly connected to the base, a driving assembly is arranged on the base, the driving assembly includes a press and a mold, the press is fixedly connected to the workbench, the mold is fixedly connected to the press, a heating assembly is arranged on the workbench, the heating assembly includes a bracket, a conductive sheet, a fixed cylinder, a lifting seat, a rubber airbag, a first power supply, a fixed rod, a first conductive block and a first conductive rod, the bracket is fixedly connected to the workbench, and the two The conductive sheet is fixedly connected to the bracket, the fixed tube is fixedly connected to the base, the lifting seat is slidably connected to the fixed tube, the rubber airbag is fixedly connected between the inner wall of the fixed tube and the inner wall of the lifting seat, the first power supply is fixedly connected to the inside of the lifting seat, the fixed rod is fixedly connected to the lifting seat, the two first conductive blocks are fixedly connected to the fixed rod, the two first conductive blocks are respectively electrically connected to the positive and negative poles of the first power supply, the two first conductive rods are fixedly connected to the bracket, the two first conductive rods are respectively fixedly connected to the two conductive sheets, and a cooling component is provided on the base.

[0006] Preferably, the driving assembly further comprises a slide, a clamp and a spring, the slide is slidably connected to the workbench, the two clamps are slidably connected to the slide, the springs are provided in two groups and each group of springs is fixedly connected between the corresponding clamp and the slide.

[0007] Preferably, the driving assembly also includes a motor, a rotating rod and a slider, the motor is fixedly connected to the workbench, the slider is slidably connected to the slide, one end of the rotating rod is fixedly connected to the output shaft of the motor, and the other end of the rotating rod is rotatably connected to the slider.

[0008] Preferably, the heating component further comprises a first through hole and a second through hole, the first through hole is opened on the bracket, the second through hole is opened on the workbench, the lifting seat is located inside the second through hole, and the first through hole is located below the mold.

[0009] Preferably, the cooling component includes a semiconductor refrigerator and a second conductive block, the semiconductor refrigerator is arranged inside the lifting seat, two second conductive blocks are fixedly connected to the fixed rod, and the two second conductive blocks are electrically connected to the positive and negative poles of the semiconductor refrigerator respectively.

[0010] Preferably, the cooling component also includes a second power supply and a second conductive rod, the second power supply is fixedly connected to the base, two second conductive rods are fixedly connected to the second power supply, and the two second conductive rods are electrically connected to the positive and negative poles of the second power supply, respectively.

[0011] Preferably, the cooling assembly further comprises a telescopic rod and a third through hole, the telescopic rod is fixedly connected to the inner wall of the fixed cylinder, and the third through hole is provided on the lifting seat.

[0012] Preferably, the two first conductive blocks and the two second conductive blocks are respectively located at the top and the bottom of the fixing rod, and the two first conductive rods and the two second conductive rods are respectively located above and below the fixing rod.

[0013] Compared with the prior art, the present invention has the following significant advantages: First, in the present invention, the raw metal plate for stamping can be placed on a workbench, and the metal plate can be placed between two clamping plates. The two clamping plates have elastic expansion and contraction functions under the action of springs, so even if the size of the metal plate is not fixed, it can be placed between the two clamping plates, and the metal plate can be clamped by the elastic force of the spring; Second, in the present invention, after the metal plate is clamped, the motor can be started to push the metal plate fixed inside the slide forward together. When the metal plate is moved to the bottom of the mold, the metal plate will contact the two conductive sheets. At this time, a complete circuit will be formed between the two conductive sheets, the metal plate and the first power supply, so current will flow into the metal plate. At this time, the metal plate will generate heat due to its own internal resistance. As the temperature of the metal plate continues to rise, the hardness of the metal plate will decrease. At this time, the press can be started to move the mold downward. During the downward movement of the mold, the metal plate will be stamped. During this process, a part of the metal plate will be filled into the mold, and because the metal plate has been heated and softened, the metal can be better filled into the mold. Compared with the ordinary stamping process, the shape of the metal in the mold can better fit the required shape, especially in subtle features, it is not easy to produce errors; Thirdly, in the present invention, during the process of the mold pressing downward, it will press against the lifting seat below, and then the lifting seat will be pressed downward together. When the lifting seat moves downward, the rubber airbag will be compressed and folded, and the telescopic rod will be squeezed and shortened. At the same time, the two first conductive rods will be separated from the two first conductive blocks. At this time, the first power supply no longer generates current, so the metal plate is no longer heated, until the lifting seat is lowered to a certain height, at which time the two second conductive blocks will contact the two second conductive rods. At this time, the circuit between the second power supply and the semiconductor refrigerator is connected, and the semiconductor refrigerator is started. The semiconductor refrigerator can quickly cool down and generate low temperature in a very short time, so that the lifting seat and the mold are cooled down. Therefore, the metal valve sheet in the mold will also quickly cool down and be shaped. Since the metal valve sheet in the mold cools down quickly, it will automatically be demolded from the mold; Fourthly, when the valve sheet in the mold is demolded, the press can be started to raise and reset the mold, and the demolded valve sheet will remain on the top of the lifting seat. During the resetting of the mold, since the lifting seat is no longer squeezed, the rubber airbag and the telescopic rod will be reset due to their own elasticity. However, a compression spring is provided in the telescopic rod, so the reset speed is faster than the reset speed of the rubber airbag. Therefore, the top of the telescopic rod will protrude from the third through hole, thereby pushing open the valve sheet on the lifting seat and completing the unloading of the valve sheet. After that, the rubber airbag will slowly reset and push the lifting seat upward, so that the lifting seat will slowly reset, so that the top of the telescopic rod will be back inside the lifting seat. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be further explained below in conjunction with the accompanying drawings and embodiments: Figure 1 The three-dimensional structure of the present invention is shown in FIG. Figure 1 ; Figure 2 The three-dimensional structure of the present invention is shown in FIG. Figure 2 ; Figure 3It is an exploded view of the connection structure between the slide and the clamping plate in the present invention; Figure 4 is a cross-sectional view of the internal structure of the present invention; Figure 5 The present invention Figure 2 An enlarged view of the structure of part A is shown; Figure 6 The present invention Figure 4 An enlarged view of the structure of part B is shown.

[0015] Description of reference numerals: 1. Workbench; 2. Base; 3. Drive assembly; 31. Press; 32. Mold; 33. Slide; 34. Clamp; 35. Spring; 36. Motor; 37. Rotating rod; 38. Slider; 4. Heating assembly; 41. Bracket; 42. First through hole; 43. Conductive sheet; 44. Fixed cylinder; 45. Lifting seat; 46. Rubber airbag; 47. First power supply; 48. Fixed rod; 49. First conductive block; 410. First conductive rod; 411. Second through hole; 5. Cooling assembly; 51. Semiconductor refrigerator; 52. Second conductive block; 53. Second power supply; 54. Second conductive rod; 55. Telescopic rod; 56. Third through hole. DETAILED DESCRIPTION

[0016] The present invention is described in detail below, and the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] The present invention provides an automatic unloading type thin-film butterfly valve plate stamping device through improvement. The technical solution of the present invention is: like Figure 1-Figure 6As shown, an automatic unloading type thin-film butterfly valve plate stamping equipment includes a workbench 1 and a base 2, the workbench 1 is fixedly connected to the base 2, a driving assembly 3 is arranged on the base 2, the driving assembly 3 includes a press 31 and a mold 32, the press 31 is fixedly connected to the workbench 1, the mold 32 is fixedly connected to the press 31, a heating assembly 4 is arranged on the workbench 1, the heating assembly 4 includes a bracket 41, a conductive sheet 43, a fixed cylinder 44, a lifting seat 45, a rubber airbag 46, a first power supply 47, a fixed rod 48, a first conductive block 49 and a first conductive rod 410, the bracket 41 is fixedly connected to the workbench 1, two conductive sheets 43 are fixedly connected to the bracket 41, the fixed cylinder 44 is fixedly connected to the base 2, the lifting seat 45 is slidably connected to the fixed cylinder 44, and the rubber airbag 46 is fixedly connected to the base 2. The capsule 46 is fixedly connected between the inner wall of the fixed cylinder 44 and the inner wall of the lifting seat 45, the first power supply 47 is fixedly connected to the inside of the lifting seat 45, the fixed rod 48 is fixedly connected to the lifting seat 45, the two first conductive blocks 49 are fixedly connected to the fixed rod 48, and the two first conductive blocks 49 are respectively electrically connected to the positive and negative poles of the first power supply 47, the two first conductive rods 410 are fixedly connected to the bracket 41, and the two first conductive rods 410 are respectively fixedly connected to the two conductive sheets 43, and a cooling component 5 is provided on the base 2. The rubber airbag 46 has the same effect as the spring 35. It can be compressed and can restore its shape through its own elasticity, but its elasticity is weaker than the spring 35. Therefore, after being squeezed, its reset speed is slower. Therefore, after the lifting seat 45 descends, it will reset at a slow speed.

[0018] Furthermore, the drive assembly 3 also includes a slide 33, a clamp 34 and a spring 35. The slide 33 is slidably connected to the workbench 1, and the two clamps 34 are slidably connected to the slide 33. There are two groups of springs 35 and each group of springs 35 is fixedly connected between the corresponding clamp 34 and the slide 33. When the metal plate is placed between the two clamps 34, the two clamps 34 have elastic expansion and contraction functions under the action of the springs 35. Therefore, even if the size of the metal plate is not fixed, it can be placed between the two clamps 34 and the metal plate can be clamped by the elastic force of the springs 35.

[0019] Furthermore, the driving assembly 3 also includes a motor 36, a rotating rod 37 and a slider 38. The motor 36 is fixedly connected to the workbench 1, and the slider 38 is slidably connected to the slide 33. One end of the rotating rod 37 is fixedly connected to the output shaft of the motor 36, and the other end of the rotating rod 37 is rotatably connected to the slider 38. The rotating rod 37 is driven by the motor 36 to rotate, so that the slide 33 can be controlled to translate on the workbench 1, and the raw metal plate is placed between the two clamps 34, so the raw metal plate can be driven to move by the movement of the slide 33.

[0020] Furthermore, the heating assembly 4 also includes a first through hole 42 and a second through hole 411 . The first through hole 42 is opened on the bracket 41 , and the second through hole 411 is opened on the workbench 1 . The lifting seat 45 is located inside the second through hole 411 , and the first through hole 42 is located below the mold 32 .

[0021] Furthermore, the cooling component 5 includes a semiconductor refrigerator 51 and a second conductive block 52. The semiconductor refrigerator 51 is arranged inside the lifting seat 45. The two second conductive blocks 52 are fixedly connected to the fixing rod 48. The two second conductive blocks 52 are electrically connected to the positive and negative poles of the semiconductor refrigerator 51 respectively. The semiconductor refrigerator 51 can generate low temperature in a very short time and conduct the low temperature to the entire lifting seat 45. When the mold 32 moves downward and is stamped, the mold 32 and the lifting seat 45 will come into contact. Therefore, when the lifting seat 45 is cooled by the semiconductor refrigerator 51, the low temperature will also be quickly conducted to the mold 32, so that the valve sheet in the mold 32 can be demolded.

[0022] Furthermore, the cooling component 5 also includes a second power supply 53 and a second conductive rod 54. The second power supply 53 is fixedly connected to the base 2. The two second conductive rods 54 are fixedly connected to the second power supply 53. The two second conductive rods 54 are electrically connected to the positive and negative poles of the second power supply 53 respectively. The second power supply 53 is used to power the semiconductor refrigerator 51.

[0023] Furthermore, the cooling component 5 also includes a telescopic rod 55 and a third through hole 56. The telescopic rod 55 is fixedly connected to the inner wall of the fixed tube 44. The third through hole 56 is opened on the lifting seat 45. There is a compression spring inside the telescopic rod 55. It can be shortened when squeezed, and it will restore its original length when not squeezed.

[0024] Furthermore, the two first conductive blocks 49 and the two second conductive blocks 52 are respectively located at the top and bottom of the fixed rod 48, and the two first conductive rods 410 and the two second conductive rods 54 are respectively located above and below the fixed rod 48. When the lifting seat 45 is in the initial position, the first conductive block 49 and the first conductive rod 410 can be in contact with each other. At this time, the first power supply 47 and the conductive sheet 43 are energized, and then the metal plate is energized so that the metal plate is heated and softened. When the lifting seat 45 moves downward to a certain distance, the second conductive block 52 and the second conductive rod 54 are in contact with each other, and the second power supply 53 supplies power to the semiconductor refrigerator 51.

[0025] The specific working method is: first place the raw metal plate for stamping on the workbench 1, and put the metal plate between two clamps 34. The two clamps 34 have elastic expansion and contraction functions under the action of springs 35. Therefore, even if the size of the metal plate is not fixed, it can be put between the two clamps 34 and the metal plate can be clamped by the elastic force of the springs 35.

[0026] After the metal plate is clamped, the motor 36 can be started, and the output shaft of the motor 36 will drive the rotating rod 37 to rotate. When the rotating rod 37 rotates, it will push the slider 38, so that the slider 38 drives the slide 33 to translate on the workbench 1, thereby pushing the metal plate fixed inside the slide 33 forward. When the metal plate is moved to the bottom of the mold 32, the metal plate will contact the two conductive sheets 43. At this time, a complete circuit will be formed between the two conductive sheets 43, the metal plate and the first power supply 47, so current will flow into the metal plate. At this time, the metal plate will The internal resistance generates heat. As the temperature of the metal plate continues to rise, the hardness of the metal plate will decrease. At this time, the press 31 can be started to move the mold 32 downward. During the downward movement of the mold 32, the metal plate will be stamped. During this process, a part of the metal plate will be filled into the mold 32, and because the metal plate has been heated and softened, the metal can be better filled into the mold 32. Compared with the ordinary stamping process, the shape of the metal in the mold 32 can better fit the required shape, especially in subtle features, it is not easy to produce errors.

[0027] During the downward stamping process of the mold 32, it will press against the lifting seat 45 below, and then press the lifting seat 45 downward together. When the lifting seat 45 moves downward, the rubber airbag 46 will be compressed and folded, and the telescopic rod 55 will be squeezed and shortened. At the same time, the two first conductive rods 410 will be separated from the two first conductive blocks 49. At this time, the first power supply 47 no longer generates current, so the metal plate is no longer heated until the lifting seat 45 is lowered to a certain height. At this time, the two second conductive blocks 52 will contact the two second conductive rods 54. At this time, the circuit between the second power supply 53 and the semiconductor refrigerator 51 is connected, and the semiconductor refrigerator 51 is started. The semiconductor refrigerator 51 can quickly cool down and generate low temperature in a very short time, so that the lifting seat 45 and the mold 32 are cooled down, so the metal valve sheet in the mold 32 will also quickly cool down and take shape. , and since the metal valve sheet in the mold 32 cools down quickly, it will automatically complete demoulding from the mold 32. At this time, the press machine 31 can be started to make the mold 32 rise and reset, and the demoulding valve sheet will remain on the top of the lifting seat 45. During the resetting process of the mold 32, since the lifting seat 45 is no longer squeezed, the rubber airbag 46 and the telescopic rod 55 will be reset due to their own elasticity. However, a compression spring is provided in the telescopic rod 55, so the reset speed is faster than the reset speed of the rubber airbag 46. Therefore, the top of the telescopic rod 55 will protrude from the third through hole 56, thereby pushing the valve sheet on the lifting seat 45 open and completing the unloading of the valve sheet. After that, the rubber airbag 46 slowly resets and pushes the lifting seat 45 upward, so that the lifting seat 45 slowly resets, so that the top of the telescopic rod 55 is again inside the lifting seat 45.

[0028] Afterwards, by controlling the motor 36 and the press 31, the above process can be continuously repeated to produce valve sheets in batches.

[0029] The technical means disclosed in the solution of the present invention are not limited to the technical means disclosed in the above technical means, but also include technical solutions composed of equivalent replacement of the above technical features. Matters not covered in the present invention belong to the common knowledge of those skilled in the art.

Claims

1. An automatic unloading type thin-film butterfly valve plate stamping device, comprising a workbench (1) and a base (2), wherein the workbench (1) is fixedly connected to the base (2), and is characterized in that: A driving assembly (3) is arranged on the base (2), the driving assembly (3) comprising a press (31) and a mold (32), the press (31) being fixedly connected to the workbench (1), the mold (32) being fixedly connected to the press (31), a heating assembly (4) being arranged on the workbench (1), the heating assembly (4) comprising a bracket (41), a conductive sheet (43), a fixed cylinder (44), a lifting seat (45), a rubber airbag (46), a first power source (47), a fixed rod (48), a first conductive block (49) and a first conductive rod (410), the bracket (41) being fixedly connected to the workbench (1), the two conductive sheets (43) being fixedly connected to the bracket (41), the fixed cylinder (44) being fixedly connected to the bracket (41), and the The lifting seat (45) is connected to the base (2), the lifting seat (45) is slidably connected to the fixed cylinder (44), the rubber airbag (46) is fixedly connected between the inner wall of the fixed cylinder (44) and the inner wall of the lifting seat (45), the first power source (47) is fixedly connected to the inside of the lifting seat (45), the fixed rod (48) is fixedly connected to the lifting seat (45), the two first conductive blocks (49) are fixedly connected to the fixed rod (48), the two first conductive blocks (49) are respectively electrically connected to the positive and negative electrodes of the first power source (47), the two first conductive rods (410) are fixedly connected to the bracket (41), and the two first conductive rods (410) are respectively fixedly connected to the two conductive sheets (43), and a cooling component (5) is provided on the base (2).

2. The automatic unloading type thin-film butterfly valve plate stamping equipment according to claim 1 is characterized by: The driving assembly (3) further comprises a slide (33), a clamping plate (34) and a spring (35); the slide (33) is slidably connected to the workbench (1); the two clamping plates (34) are slidably connected to the slide (33); and the spring (35) is provided in two groups, and each group of springs (35) is fixedly connected between a corresponding clamping plate (34) and the slide (33).

3. The automatic unloading type thin-film butterfly valve plate stamping equipment according to claim 2 is characterized by: The driving assembly (3) further comprises a motor (36), a rotating rod (37) and a sliding block (38); the motor (36) is fixedly connected to the workbench (1); the sliding block (38) is slidably connected to the slide frame (33); one end of the rotating rod (37) is fixedly connected to the output shaft of the motor (36); and the other end of the rotating rod (37) is rotatably connected to the sliding block (38).

4. The automatic unloading type thin-film butterfly valve plate stamping equipment according to claim 1 is characterized by: The heating component (4) further comprises a first through hole (42) and a second through hole (411), wherein the first through hole (42) is formed on the support (41), and the second through hole (411) is formed on the workbench (1); the lifting seat (45) is located inside the second through hole (411), and the first through hole (42) is located below the mold (32).

5. The automatic unloading type thin-film butterfly valve plate stamping equipment according to claim 1 is characterized by: The cooling component (5) comprises a semiconductor refrigerator (51) and a second conductive block (52); the semiconductor refrigerator (51) is arranged inside the lifting seat (45); two second conductive blocks (52) are fixedly connected to the fixing rod (48); and the two second conductive blocks (52) are respectively electrically connected to the positive and negative electrodes of the semiconductor refrigerator (51).

6. The automatic unloading type thin-film butterfly valve plate stamping equipment according to claim 5 is characterized by: The cooling component (5) further comprises a second power source (53) and a second conductive rod (54); the second power source (53) is fixedly connected to the base (2); two second conductive rods (54) are fixedly connected to the second power source (53); and the two second conductive rods (54) are electrically connected to the positive and negative electrodes of the second power source (53), respectively.

7. The automatic unloading type thin-film butterfly valve plate stamping equipment according to claim 6 is characterized by: The cooling assembly (5) further comprises a telescopic rod (55) and a third through hole (56); the telescopic rod (55) is fixedly connected to the inner wall of the fixed cylinder (44); and the third through hole (56) is formed on the lifting seat (45).

8. The automatic unloading type thin-film butterfly valve plate stamping equipment according to claim 6 is characterized by: The two first conductive blocks (49) and the two second conductive blocks (52) are respectively located at the top and bottom of the fixed rod (48), and the two first conductive rods (410) and the two second conductive rods (54) are respectively located above and below the fixed rod (48).

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