Circuit board pin cutting equipment

By designing circuit board foot cutting equipment with rotating components, cutting components and grinding parts, the problems of complex operation and inefficiency of existing equipment are solved, and efficient and accurate circuit board pin cutting and grinding are achieved.

CN119681148APending Publication Date: 2025-03-25WEIQIN ELECTRONICS CO LTD
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Patent Information

Application Number
CN202411846171.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-13
Publication Date
2025-03-25

AI Technical Summary

Technical Problem

The existing circuit board foot cutting equipment is complex in the cutting process and has low cutting efficiency. After cutting, it requires repeated adjustment of position and grinding, resulting in low processing efficiency.

Method used

A circuit board foot cutting device including a rotating assembly, a cutting assembly and a grinding part is designed. By rotating assembly, the cutting assembly and the grinding part are driven to rotate, and the circuit board pins are cut and polished, and air purging is provided by the air supply assembly to improve the grinding effect.

Benefits of technology

It improves the accuracy and stability of circuit board pin cutting, simplifies the operation process, improves the efficiency of cutting and grinding, and reduces the splashing and collection difficulty of waste.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention belongs to the technical field of circuit board processing, and discloses circuit board foot cutting equipment which comprises an assembly frame, a movable table is slidably mounted in the assembly frame, a lifting type movable part is slidably mounted in the movable table, and a rotating assembly is fixedly arranged at the top of the lifting type movable part. The outer surface of the rotating assembly is sleeved with a cutting assembly. According to the device, the rotating assembly is used for driving the cutting assembly installed on the outer side in a meshed mode to rotate, the two sets of rotating rollers are used for supporting the cutting assembly to rotate by a certain length, and in the transverse moving process, linear pins within the length range of the bottom of a circuit board are cut off instantly; the circuit board pin cutting device has the advantages of being high in cutting precision, small in cutting vibration and good in cutting stability compared with stamping cutting and large-angle swinging cutting, and the cutting effect of the circuit board pin is greatly improved.
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Description

Technical Field

[0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a circuit board pin cutting device. Background Art

[0002] Circuit board pin cutting equipment is a kind of equipment used in the electronics manufacturing industry. It is mainly used to cut the pins of circuit boards. Pin cutting refers to cutting off the pins or excess parts of components on the circuit board. By cutting off the protruding excess linear pins, the flatness and appearance of the circuit board can be ensured, while improving its performance.

[0003] During use, the circuit board pin cutting equipment in the prior art is limited by the distribution of the pins at the bottom of the circuit board, and usually adopts hydraulic punching or bottom rotary cutting. However, in actual operation, a larger range of punching has a greater impact on the circuit board itself. When the punching range is small, the punching position needs to be repeatedly adjusted, and rotary cutting also needs to repeatedly adjust the cutting position. The overall pin cutting is difficult, the operation is complicated, and the pin cutting efficiency is low.

[0004] In addition, after the circuit board pin cutting equipment in the prior art completes the pin cutting, there are often sharp protrusions on the bottom of the pins, which need to be polished. The current polishing process is carried out after the cutting is completely completed, and the polishing position still needs to be repeatedly adjusted during polishing. The overall circuit board processing efficiency is low and the use effect is poor. Summary of the invention

[0005] The object of the present invention is to provide a circuit board pin cutting device to solve the problems raised in the above background technology.

[0006] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a circuit board pin cutting device, comprising an assembly frame, a movable table is slidably installed inside the assembly frame, a lifting movable part is slidably installed inside the movable table, a rotating component is fixedly provided on the top of the lifting movable part, a cutting component is sleeved on the outer surface of the rotating component, a grinding part is fixedly provided on the inner wall of the cutting component, a distribution baffle located above the rotating component is sleeved inside the cutting component, a gas supply component is fixedly provided on the side of the lifting movable part, the gas supply component outputs gas upward through the distribution baffle, the grinding part is located on the top of the distribution baffle and is intermittently connected with the distribution baffle, and a clamping component is fixedly provided on the top of the assembly frame.

[0007] The cutting assembly includes a belt, a cutting knife and a sponge pad.

[0008] The grinding part includes a mounting frame, a sleeve plate, a grinding sponge block and two springs. The grinding part and the sponge pad are alternately distributed. The inner wall of the belt is provided with a tooth block one, and the tooth block one is engaged with a rotating component. The rotating component controls the rotation of the cutting component and the grinding part.

[0009] Preferably, a pushing mechanism is provided inside the assembly frame, and the movable end of the pushing mechanism is fixedly connected to the movable table. A clamping plate is provided on the top of the movable table, and a slide plate is fixedly provided on the side of the movable table. The slide plate is slidably connected to the inner wall of the assembly frame, and a screw mechanism is fixedly provided inside the movable table. A limit plate is fixedly provided on the inner wall of the movable table, and an adapting notch is provided on the side of the limit plate.

[0010] Preferably, the screw mechanism includes a control motor and a screw, the control motor drives the screw to rotate, the screw is threadedly sleeved with the lifting movable part, and the bottom of the lifting movable part is slidably sleeved with the slide plate.

[0011] Preferably, the lifting movable part includes a movable block, an electric push rod, a sleeve rod and a spring 1. The bottom surface of the movable block is adapted to be matched with the slide plate, the electric push rod is fixed to the top of the movable block, the sleeve is fixedly connected to the top of the movable block, the spring 1 is fixedly connected to the top of the movable block and sleeved in the sleeve, and the sleeve rod is movably sleeved in the sleeve and fixedly connected to the spring 1.

[0012] Preferably, the rotating assembly includes a rotating roller, a fixed shaft, a carrier plate and a motor 1, the fixed shaft is fixedly sleeved inside the rotating roller, the fixed shaft is sleeved inside the carrier plate through a bearing, the bottom surface of the carrier plate is fixedly connected to the movable end of the electric push rod, the bottom surface of the carrier plate is fixedly connected to the sleeve rod, the motor 1 is fixedly installed on the bottom of the carrier plate and drives a group of fixed shafts to rotate, the outer surface of the rotating roller is provided with a gear block 2, the gear block 2 and the gear 1 are meshed with each other, and the rotating roller drives the belt sleeved on the outside to rotate.

[0013] Preferably, the cutting knife is fixed on the outer surface of the belt at equal intervals, and the bottom surface of the cutting knife is kept level with the top surface of the belt, the mounting frame is fixedly connected to the inner side surface of the belt, the sleeve plate is movably sleeved in the mounting frame, the grinding sponge block is fixedly connected to the top of the sleeve plate, the spring 2 is fixedly connected to the mounting frame and fixedly connected to the sleeve plate, the bottom of the mounting frame is provided with air holes, and the top of the grinding sponge block is provided with an abrasive layer.

[0014] Preferably, the distribution baffle comprises a baffle, a through hole and a distribution cavity, the through hole is opened on the top of the baffle, the distribution cavity is opened inside the baffle, and the through hole is located on the moving path of the air hole.

[0015] Preferably, the air supply assembly includes an air pump, a connecting pipe and an air pipe, the air pump is fixed on the movable block through a support plate, the connecting pipe is fixedly connected to the bottom of the baffle and communicated with the distribution chamber, the bottom end of the connecting pipe is fixedly socketed with the carrier plate, one end of the air pipe is connected to the connecting pipe, and the other end is connected to the air outlet end of the air pump.

[0016] Preferably, the clamping assembly includes a lifting part, an intermediate plate, a vacuum pump and a clamping part, a support frame is fixedly provided on the top of the assembly frame, the lifting part is fixed in the support frame, the intermediate plate is fixedly connected to the bottom of the lifting part, the vacuum pump is fixedly installed on the top of the intermediate plate, the clamping part is movably connected on both sides of the intermediate plate, and the vacuum pump sucks the air in the intermediate plate and controls the approach and distance of the clamping parts on both sides.

[0017] The beneficial effects of the present invention are as follows:

[0018] 1. The present invention utilizes a rotating component to drive the outer meshing mounted cutting component to rotate, utilizes two sets of rotating rollers to support the cutting component to rotate at a certain length, and in the process of lateral movement, instantly cuts off the linear pins within the length range of the bottom of the circuit board, thereby completely cutting off the pins of the circuit board after the lateral movement, avoiding repeated movement to adjust the cutting position, and improving the cutting efficiency. Compared with stamping cutting and large-angle swing cutting, the present invention has the advantages of high cutting accuracy, small cutting vibration, and good cutting stability, which greatly improves the cutting effect of the circuit board pins.

[0019] 2. The present invention utilizes the rotation effect of the belt to drive the cutting knife to rotate and cut within a certain length range, while driving the inner assembled grinding part to rotate, and utilizes the grinding sponge block in the grinding part to quickly friction grind the cut pin end face after rotation cutting, thereby reducing the sharp part of the end face and avoiding the safety risk of the sharp pin end face, and the actual grinding follows the cutting action and is achieved synchronously, and also utilizes the rotation path within a certain length range to grind a large area of ​​the pins at the bottom of the circuit board without repeatedly adjusting the position and angle, and affected by the structure of the belt, the actual grinding part is divided into front and back parts during the rotation process, and realizes front and back grinding twice in a single lateral movement for the same pin section, further improving the grinding quality and efficiency, ensuring that the rapid grinding process can be completed in the state of rapid lateral movement, and the comprehensive processing efficiency is high.

[0020] 3. The present invention utilizes the air supply effect of the air supply assembly to blow the pressurized air upward through the distribution baffle during the actual rotary grinding process, and cooperates with the rotating grinding part to achieve intermittent air flow, and after the flow, pushes the grinding sponge block in the grinding part to move further upward, thereby increasing the contact area with the pin cross section and improving the grinding effect. When the grinding part and the distribution baffle are not connected, the purged gas is directly released upward and acts on the pin cross section after cutting, intermittently blowing, cooling and dust removal are performed on the cut and polished pins, thereby achieving efficient grinding while having a self-cleaning effect.

[0021] 4. The present invention utilizes two sets of rotating rollers to support the belts to adapt to the bottom length of the circuit board to perform pin cutting under rotation. When the pins are actually cut, the inner rotating grinding part is used to achieve rear blocking, so that the cut pieces fall out in the forward direction of the cutting component and fall onto the movable table at the bottom for collection, avoiding the waste from scattering and being difficult to collect in the existing cutting situation, further reducing the difficulty of waste collection, and achieving good use effect.

[0022] 5. The present invention realizes upward clamping and positioning of the circuit board by adopting a straight-up and straight-down clamping method of the clamping component. The movable table that can be telescopically moved at the bottom of the skimming can quickly realize the grasping and positioning of the circuit board. The actual grasping and positioning operation is simple, and the movement complexity is low. The movable table drives the position adjustment of the cutting component and the polishing part to adapt to the cutting action of the circuit board, which greatly reduces the difficulty of positioning the circuit board and improves the positioning efficiency and the cutting speed. The actual circuit board cutting speed is fast, the efficiency is high, and the use effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the present invention;

[0024] Figure 2 It is a cross-sectional schematic diagram of the present invention;

[0025] Figure 3 It is a schematic diagram of the installation of the movable platform and the lifting installation movable part of the present invention;

[0026] Figure 4 It is an exploded schematic diagram of the lifting movable part and the lead screw mechanism of the present invention;

[0027] Figure 5 It is a cross-sectional schematic diagram of the lifting movable part and the rotating assembly of the present invention;

[0028] Figure 6 It is a schematic diagram of the rotating assembly, the distribution baffle and the air supply assembly of the present invention;

[0029] Figure 7 is a schematic diagram of a cutting assembly and a grinding portion of the present invention;

[0030] Figure 8 A cross-sectional schematic diagram of a distribution baffle of the present invention;

[0031] Fig. 9 is a cross-sectional schematic diagram of the grinding portion of the present invention;

[0032] Fig.10 It is a cross-sectional schematic diagram of the clamping assembly of the present invention.

[0033] In the figure: 1. assembly frame; 2. movable table; 3. screw mechanism; 4. lifting movable part; 41. movable block; 42. electric push rod; 43. sleeve rod; 44. sleeve; 45. spring one; 5. rotating component; 51. rotating roller; 52. fixed shaft; 53. carrier plate; 54. motor one; 6. cutting component; 61. belt; 62. cutting knife; 63. sponge pad; 7. distribution baffle; 71. baffle; 72. through hole; 73. distribution chamber; 8. air supply component; 81. air pump; 82. connecting pipe; 83. air pipe; 9. grinding part; 91. mounting frame; 92. sleeve plate; 93. grinding sponge block; 94. spring two; 10. clamping component; 101. lifting part; 102. middle plate; 103. vacuum pump; 104. clamping part; 11. limit plate. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] like Figures 1 to 10 As shown, an embodiment of the present invention provides a circuit board pin cutting device, including an assembly frame 1, a movable table 2 is slidably installed inside the assembly frame 1, a lifting movable part 4 is slidably installed inside the movable table 2, a rotating component 5 is fixedly provided on the top of the lifting movable part 4, a cutting component 6 is sleeved on the outer surface of the rotating component 5, a grinding part 9 is fixedly provided on the inner wall of the cutting component 6, a distribution baffle 7 located above the rotating component 5 is sleeved inside the cutting component 6, a gas supply component 8 is fixedly provided on the side of the lifting movable part 4, the gas supply component 8 outputs gas upward through the distribution baffle 7, the grinding part 9 is located on the top of the distribution baffle 7 and is intermittently connected with the distribution baffle 7, and a clamping component 10 is fixedly provided on the top of the assembly frame 1.

[0036] The cutting assembly 6 includes a belt 61, a cutting knife 62 and a sponge pad 63.

[0037] The grinding part 9 includes a mounting frame 91, a sleeve plate 92, a grinding sponge block 93 and a second spring 94. The grinding part 9 and the sponge pad 63 are alternately distributed. The inner wall of the belt 61 is provided with a tooth block 1, which is engaged with the rotating component 5. The rotating component 5 controls the rotation of the cutting component 6 and the grinding part 9.

[0038] Embodiment: When in use, the device is installed above the conveyor belt. As the external conveying mechanism conveys the circuit board to be processed to the bottom of the device, the clamping assembly 10 is started, so that the lifting part 101 drives the middle plate 102 and the clamping part 104 to descend. When it descends above the circuit board, the bottom of the clamping part 104 moves to both sides of the circuit board, and the vacuum pump 103 is started. The negative pressure suction effect makes the clamping parts 104 on both sides approach each other, clamping and fixing the circuit board, and then the lifting part 101 moves upward, driving the clamped circuit board to move up, and making the circuit board contact with the top limit plate 11, and the circuit board is completed. The push mechanism in the assembly frame 1 pushes the movable table 2 to move horizontally, so that the movable table 2 moves to the bottom of the circuit board, and then the starting screw mechanism 3 in the assembly frame 1 is started to drive the lifting movable part 4 to move horizontally, and the rotating component 5 is started. The motor 54 in the rotating component 5 drives the rotating roller 51 to rotate, driving the outer meshing cutting component 6 to rotate, and the belt 61 drives the cutting knife 62 to follow the rotation. The rotating cutting knife 62 moves along the horizontal line and cuts off the linear protruding pins along the bottom of the circuit board. In the process of rotation, the belt 61 synchronously drives the grinding part 9 to rotate, and the grinding part The grinding sponge block 93 in 9 rotates and grinds the cut pin section; during the process, the cut pin fragments are shielded by the rotating grinding part 9, so that the fragments fall on the bottom of the movable table 2; as the cutting and grinding are carried out synchronously, the air supply component 8 is started, and the pressurized air is input into the distribution baffle 7 through the air pipe 83 and the connecting pipe 82, and the pressurized air is swept upward through the distribution cavity 73 and the through hole 72. When the grinding part 9 rotates to the top of the through hole 72, the pressurized air is input into the grinding part 9, and the sleeve plate 92 and the grinding sponge block 93 are pushed upward, and the grinding sponge block 93 is pushed to The top of the polishing sponge block 93 is further in contact with the bottom of the pin, and the top of the polishing sponge block 93 is further in contact with the pin cross-section to complete the full polishing. When the polishing portion 9 is staggered with the through hole 72, the through hole 72 directly blows air upward, and the blowing air acts on the bottom of the polished circuit board to complete the purging and cooling. After the pin cutting is completed, the lifting movable portion 4 is retracted, and the cutting component 6 and the polishing portion 9 are driven to return and move for reverse polishing. After the reset polishing is completed, the pushing mechanism is started and the movable table 2 is reset. The clamping component 10 drives the processed circuit board to descend to the conveying mechanism to complete the pin cutting and polishing process.

[0039] Firstly, the rotating component 5 is used to drive the outer meshing cutting component 6 to rotate, and two sets of rotating rollers 51 are used to support the cutting component 6 to rotate at a certain length. During the lateral movement, the linear pins within the length range of the bottom of the circuit board are instantly cut off, so that the circuit board pins are completely cut off after the lateral movement, avoiding repeated movement and adjustment of the cutting position, and improving the cutting efficiency. Compared with stamping cutting and large-angle swing cutting, it has the advantages of high cutting accuracy, small cutting vibration, and good cutting stability, which greatly improves the cutting effect of the circuit board pins.

[0040] In addition, by utilizing the rotation effect of the belt 61, the cutting knife 62 is driven to rotate and cut within a certain length range, while the inner assembled grinding part 9 is driven to rotate. The grinding sponge block 93 in the grinding part 9 is used to quickly friction grind the cut pin end face after rotation cutting, thereby reducing the sharp part of the end face and avoiding the safety risk of the sharp pin end face. The actual grinding closely follows the cutting action and is achieved synchronously. The rotation path within a certain length range is also used to grind a large area of ​​the pins at the bottom of the circuit board without repeatedly adjusting the position and angle. Influenced by the structure of the belt 61, the actual grinding part 9 is divided into front and back parts during the rotation process, and the front and back grinding are realized twice in a single lateral movement for the same pin section, thereby further improving the grinding quality and efficiency, ensuring that the rapid grinding process can be completed even in the state of rapid lateral movement, and the comprehensive processing efficiency is high.

[0041] In addition, by utilizing the air supply effect of the air supply assembly 8, during the actual rotary grinding process, the pressurized air is blown out upward through the distribution baffle 7, and intermittently introduced in conjunction with the rotating grinding part 9, and after introduction, the grinding sponge block 93 in the grinding part 9 is pushed to move further upward, thereby increasing the contact area with the pin cross section and improving the grinding effect. When the grinding part 9 is not connected to the distribution baffle 7, the purged gas is directly released upward and acts on the pin cross section after removal, thereby intermittently blowing, cooling and removing dust from the cut and polished pins, thereby achieving efficient grinding while having a self-cleaning effect.

[0042] On the other hand, by utilizing two sets of rotating rollers 51 to support the belt 61 to adapt to the bottom length of the circuit board, the pins are cut while rotating forward. When the pins are actually cut, the inner rotating grinding part 9 is used to achieve rear side blocking, so that the cut pieces fall out in the forward direction of the cutting component 6 and fall into the movable table 2 at the bottom for collection, thereby avoiding the waste from scattering and being difficult to collect in the existing cutting situation, further reducing the difficulty of waste collection, and achieving good use effect.

[0043] On the other hand, by adopting the straight-up and straight-down clamping method of the clamping component 10, the upward clamping and positioning of the circuit board is realized, and the movable table 2 that moves laterally at the bottom of the painting can quickly realize the grasping and positioning of the circuit board. The actual grasping and positioning operation is simple, and the movement complexity is low. The movable table 2 drives the position adjustment of the cutting component 6 and the polishing part 9 to adapt to the cutting action of the circuit board, which greatly reduces the difficulty of positioning the circuit board and improves the positioning efficiency and the cutting speed. The actual circuit board cutting speed is fast, the efficiency is high, and the use effect is good.

[0044] Among them, a pushing mechanism is provided inside the assembly frame 1, and the movable end of the pushing mechanism is fixedly connected to the movable table 2. A clamping plate is provided on the top of the movable table 2, and a slide is fixedly provided on the side of the movable table 2. The slide is slidably connected to the inner wall of the assembly frame 1, and a screw mechanism 3 is fixed inside the movable table 2. A limit plate 11 is fixed on the inner wall of the movable table 2, and an adapting notch is provided on the side of the limit plate 11.

[0045] The movable table 2 is pushed to move horizontally along the inside of the assembly frame 1 by utilizing a pushing mechanism, the movable table 2 is moved away when the circuit board is grabbed, and the movable table 2 is moved to the bottom of the positioned circuit board when cutting and polishing. The pushing mechanism is specifically hydraulically pushed, and the movable table 2 uses a slide plate to maintain sliding stability in the assembly frame 1.

[0046] The lead screw mechanism 3 includes a control motor and a lead screw. The control motor drives the lead screw to rotate. The lead screw is threadedly sleeved with the lifting movable part 4. The bottom of the lifting movable part 4 is slidably sleeved with the slide plate.

[0047] The screw mechanism 3 and the clamping plate cooperate with the movable block 41 of the lifting movable part 4 to realize the lateral movement control of the lifting movable part 4. The clamping plate and the movable block 41 cooperate with each other to limit the movement and ensure the maintenance of the lateral movement control.

[0048] Among them, the lifting movable part 4 includes a movable block 41, an electric push rod 42, a sleeve rod 43 and a spring 45. The bottom surface of the movable block 41 is adapted to fit the slide plate, the electric push rod 42 is fixed to the top of the movable block 41, the sleeve 44 is fixedly connected to the top of the movable block 41, the spring 45 is fixedly connected to the top of the movable block 41 and sleeved in the sleeve 44, and the sleeve rod 43 is movably sleeved in the sleeve 44 and fixedly connected to the spring 45.

[0049] The lifting movable part 4 controls the up and down movement of the rotating component 5 and supports the rotating component 5. Under the up and down movement control, the height of the cutting component 6 and the grinding part 9 can be adjusted, thereby adjusting the cutting position and the grinding position. The sleeve rod 43 and the sleeve tube 44 are connected to maintain relative stability.

[0050] Among them, the rotating component 5 includes a rotating roller 51, a fixed shaft 52, a carrier plate 53 and a motor 54. The fixed shaft 52 is fixedly sleeved inside the rotating roller 51. The fixed shaft 52 is sleeved inside the carrier plate 53 through a bearing. The bottom surface of the carrier plate 53 is fixedly connected to the movable end of the electric push rod 42. The bottom surface of the carrier plate 53 is fixedly connected to the sleeve rod 43. The motor 54 is fixedly installed at the bottom of the carrier plate 53 and drives a group of fixed shafts 52 to rotate. The outer surface of the rotating roller 51 is provided with a gear block 2, and the gear block 2 is meshed with the gear 1. The rotating roller 51 drives the belt 61 sleeved on the outside to rotate.

[0051] The rotating component 5 provides rotational power and controls the rotation of the cutting component 6. The tooth block 2 (not shown in the figure) on the outer side of the rotating roller 51 and the tooth block 1 (not shown in the figure) on the inner side of the belt 61 adopt a conventional meshing method to achieve stable rotation control.

[0052] Among them, the cutting knife 62 is fixed on the outer surface of the belt 61 at equal intervals, and the bottom surface of the cutting knife 62 is kept level with the top surface of the belt 61, the mounting frame 91 is fixedly connected to the inner side surface of the belt 61, the sleeve 92 is movably sleeved in the mounting frame 91, the grinding sponge block 93 is fixedly connected to the top of the sleeve 92, the spring 94 is fixedly connected in the mounting frame 91 and fixedly connected to the sleeve 92, the bottom of the mounting frame 91 is provided with air holes, and the top of the grinding sponge block 93 is provided with an abrasive layer.

[0053] The cutting assembly 6 realizes the cutting action, the grinding part 9 realizes the grinding process, and the grinding sponge block 93 relies on the top abrasive layer to realize the grinding process. The sponge itself has good flexibility and can fully cover and grind the pin section during the up and down movement to increase the grinding range. The grinding part 9 realizes upward pushing when the interior is inflated through the cooperation of the internal sleeve plate 92 and the spring 2 94, thereby further increasing the contact area with the pin section.

[0054] The distribution baffle 7 includes a baffle 71, a through hole 72 and a distribution cavity 73. The through hole 72 is opened on the top of the baffle 71, and the distribution cavity 73 is opened inside the baffle 71. The through hole 72 is located on the moving path of the air hole.

[0055] The pressure air is guided by the distribution baffle 7, and each group of grinding parts 9 is synchronously intermittently ventilated in coordination with the through holes 72 to achieve auxiliary control, and the top circuit board is purged during direct release.

[0056] Among them, the air supply component 8 includes an air pump 81, a connecting pipe 82 and an air pipe 83. The air pump 81 is fixed on the movable block 41 through a support plate. The connecting pipe 82 is fixedly connected to the bottom of the baffle 71 and communicated with the distribution chamber 73. The bottom end of the connecting pipe 82 is fixedly socketed with the carrier plate 53. One end of the air pipe 83 is connected to the connecting pipe 82, and the other end is connected to the air outlet end of the air pump 81.

[0057] The air supply assembly 8 provides pressurized air, which on the one hand controls the small amount of upward movement of the grinding part 9, and on the other hand provides direct blowing, cleaning and cooling. The connecting pipe 82 is a rigid pipe, which cooperates with the fixed socket of the carrier plate 53 to maintain the stability of the distribution baffle 7.

[0058] Among them, the clamping assembly 10 includes a lifting part 101, an intermediate plate 102, a vacuum pump 103 and a clamping part 104. A support frame is fixedly provided on the top of the assembly frame 1, the lifting part 101 is fixed in the support frame, the intermediate plate 102 is fixedly connected to the bottom of the lifting part 101, the vacuum pump 103 is fixedly installed on the top of the intermediate plate 102, and the clamping part 104 is movably connected on both sides of the intermediate plate 102. The vacuum pump 103 sucks the air in the intermediate plate 102 and controls the approach and distance of the clamping parts 104 on both sides.

[0059] The clamping assembly 10 realizes the clamping action of the circuit board. The air inside the middle plate 102 is sucked by the vacuum pump 103, so that the clamping parts 104 that are movably sleeved on both sides are brought close to each other under the action of negative pressure, thereby cooperating with the clamping parts 104 located on both sides of the circuit board to achieve clamping and fixing. The clamping parts 104 have built-in spring parts, which are convenient for resetting after removing the negative pressure, and quickly realize the clamping of the circuit board and the change of the upper and lower positions of the circuit board. The limit plate 11 limits the upward position and cooperates with the cutting assembly 6 moving from the bottom to conveniently control the cutting position range. It relies on the upward pulling force and the pressure cooperation of the limit plate 11, as well as the clamping action, to maintain a stable positioning effect and achieve a stable cutting operation. The notch on the limit plate 11 is adapted to the arrangement of the clamping part 104 to avoid interference.

[0060] The working principle and use process of the present invention are as follows: when in use, the device is installed above the conveyor belt, and the circuit board to be processed is conveyed to the bottom of the device as the external conveying mechanism, and the clamping assembly 10 is started, so that the lifting part 101 drives the middle plate 102 and the clamping part 104 to descend. When it descends to the top of the circuit board, the bottom of the clamping part 104 moves to the two sides of the circuit board, and the vacuum pump 103 is started. The negative pressure suction effect makes the clamping parts 104 on both sides approach each other, and the circuit board is clamped and fixed. Then the lifting part 101 moves upward, drives the clamped circuit board to move up, and makes the circuit board and the top limit. The plate 11 contacts and the positioning is completed. The pushing mechanism in the assembly frame 1 pushes the movable table 2 to move horizontally, so that the movable table 2 moves to the bottom of the circuit board. Then the starting screw mechanism 3 in the assembly frame 1 is started to drive the lifting movable part 4 to move horizontally, and the rotating component 5 is started. The motor 54 in the rotating component 5 drives the rotating roller 51 to rotate, driving the outer meshing cutting component 6 to rotate, and the belt 61 drives the cutting knife 62 to follow the rotation. The rotating cutting knife 62 moves along the horizontal line and cuts off the linear protruding pins along the bottom of the circuit board. In the rotation process, the belt 61 synchronously drives the grinding part 9 to rotate. The grinding sponge block 93 in the grinding part 9 rotates and grinds the cut pin section; during the process, the cut pin fragments are shielded by the rotating grinding part 9, so that the fragments fall on the bottom of the movable table 2; as the cutting and grinding are carried out synchronously, the air supply component 8 is started, and the pressurized air is input into the distribution baffle 7 through the air pipe 83 and the connecting pipe 82, and the pressurized air is swept upward through the distribution cavity 73 and the through hole 72. When the grinding part 9 rotates to the top of the through hole 72, the pressurized air is input into the grinding part 9, and the sleeve plate 92 and the grinding sponge block 93 are pushed upward, and the grinding sponge block 9 is pushed 3 is further contacted with the bottom of the pin upward, and the top of the polishing sponge block 93 is further sunk into contact with the pin section to complete the full polishing. When the polishing portion 9 is staggered with the through hole 72, the through hole 72 directly blows air upward, and the blowing air acts on the bottom of the polished circuit board to complete the purging and cooling. After the pin cutting is completed, the lifting movable portion 4 is retracted, and the cutting component 6 and the polishing portion 9 are driven to move back and reversely polish. After the reset polishing is completed, the pushing mechanism is started and the movable table 2 is reset. The clamping component 10 drives the processed circuit board to descend to the conveying mechanism to complete the pin cutting and polishing process.

[0061] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board cutting device, comprising an assembly frame (1), characterized in that: A movable platform (2) is slidably mounted inside the assembly frame (1), a lifting movable part (4) is slidably mounted inside the movable platform (2), a rotating assembly (5) is fixedly mounted on the top of the lifting movable part (4), a cutting assembly (6) is sleeved on the outer surface of the rotating assembly (5), a grinding part (9) is fixedly mounted on the inner wall of the cutting assembly (6), a distribution baffle (7) located above the rotating assembly (5) is sleeved inside the cutting assembly (6), an air supply assembly (8) is fixedly mounted on the side of the lifting movable part (4), the air supply assembly (8) outputs air upward through the distribution baffle (7), the grinding part (9) is located on the top of the distribution baffle (7) and is intermittently connected to the distribution baffle (7), and a clamping assembly (10) is fixedly mounted on the top of the assembly frame (1). The cutting assembly (6) comprises a belt (61), a cutting knife (62) and a sponge pad (63). The grinding part (9) comprises a mounting frame (91), a sleeve plate (92), a grinding sponge block (93) and a second spring (94); the grinding part (9) and the sponge pad (63) are alternately arranged; the inner wall of the belt (61) is provided with a tooth block 1, the tooth block 1 is meshed with a rotating assembly (5), and the rotating assembly (5) controls the cutting assembly (6) and the grinding part (9) to rotate.

2. A circuit board cutting device according to claim 1, characterized in that: A pushing mechanism is provided inside the assembly frame (1), a movable end of the pushing mechanism is fixedly connected to the movable platform (2), a clamping plate is provided on the top of the movable platform (2), a sliding plate is fixedly provided on the side of the movable platform (2), the sliding plate is slidably sleeved with the inner wall of the assembly frame (1), a screw mechanism (3) is fixedly provided inside the movable platform (2), a limiting plate (11) is fixedly provided on the inner wall of the movable platform (2), and an adapting notch is provided on the side of the limiting plate (11).

3. A circuit board cutting device according to claim 2, characterized in that: The screw mechanism (3) comprises a control motor and a screw, the control motor drives the screw to rotate, the screw is threadedly sleeved with the lifting movable part (4), and the bottom of the lifting movable part (4) is slidably sleeved with the slide plate.

4. A circuit board cutting device according to claim 3, characterized in that: The lifting movable part (4) comprises a movable block (41), an electric push rod (42), a sleeve rod (43) and a spring one (45); the bottom surface of the movable block (41) is adapted to be matched with the slide plate; the electric push rod (42) is fixed to the top of the movable block (41); the sleeve (44) is fixedly connected to the top of the movable block (41); the spring one (45) is fixedly connected to the top of the movable block (41) and sleeved in the sleeve (44); the sleeve rod (43) is movably sleeved in the sleeve (44) and fixedly connected to the spring one (45).

5. A circuit board cutting device according to claim 4, characterized in that: The rotating assembly (5) comprises a rotating roller (51), a fixed shaft (52), a carrier plate (53) and a motor 1 (54); the fixed shaft (52) is fixedly sleeved inside the rotating roller (51); the fixed shaft (52) is sleeved inside the carrier plate (53) through a bearing; the bottom surface of the carrier plate (53) is fixedly connected to the movable end of the electric push rod (42); the bottom surface of the carrier plate (53) is fixedly connected to the sleeve rod (43); the motor 1 (54) is fixedly installed at the bottom of the carrier plate (53) and drives a group of fixed shafts (52) to rotate; the outer surface of the rotating roller (51) is provided with a tooth block 2, the tooth block 2 and the gear 1 are meshed with each other; the rotating roller (51) drives the belt (61) sleeved on the outer side to rotate.

6. A circuit board cutting device according to claim 5, characterized in that: The cutting blades (62) are fixed on the outer surface of the belt (61) at equal intervals, and the bottom surface of the cutting blades (62) is kept level with the top surface of the belt (61); the mounting frame (91) is fixedly connected to the inner side surface of the belt (61); the sleeve (92) is movably sleeved in the mounting frame (91); the grinding sponge block (93) is fixedly connected to the top of the sleeve (92); the spring 2 (94) is fixedly connected in the mounting frame (91) and is fixedly connected to the sleeve (92); the bottom of the mounting frame (91) is provided with air holes, and the top of the grinding sponge block (93) is provided with an abrasive layer.

7. A circuit board cutting device according to claim 6, characterized in that: The distribution baffle (7) comprises a baffle (71), a through hole (72) and a distribution cavity (73); the through hole (72) is opened at the top of the baffle (71); the distribution cavity (73) is opened inside the baffle (71); and the through hole (72) is located on the moving path of the air hole.

8. A circuit board cutting device according to claim 7, characterized in that: The air supply assembly (8) comprises an air pump (81), a connecting pipe (82) and an air pipe (83); the air pump (81) is fixed on the movable block (41) via a support plate; the connecting pipe (82) is fixedly connected to the bottom of the baffle (71) and communicates with the distribution chamber (73); the bottom end of the connecting pipe (82) is fixedly sleeved with the carrier plate (53); one end of the air pipe (83) is communicated with the connecting pipe (82), and the other end is connected to the air outlet end of the air pump (81).

9. A circuit board cutting device according to claim 8, characterized in that: The clamping assembly (10) comprises a lifting part (101), an intermediate plate (102), a vacuum pump (103) and a clamping part (104); a support frame is fixedly provided on the top of the assembly frame (1); the lifting part (101) is fixed in the support frame; the intermediate plate (102) is fixedly connected to the bottom of the lifting part (101); the vacuum pump (103) is fixedly installed on the top of the intermediate plate (102); the clamping part (104) is movably sleeved on both sides of the intermediate plate (102); the vacuum pump (103) sucks air in the intermediate plate (102) and controls the approach and separation of the clamping parts (104) on both sides.