Spiral groove machining system and method, electronic equipment and computer readable storage medium

Abstract

The invention provides a spiral groove machining system and method, electronic equipment and a computer readable storage medium, and belongs to the technical field of laser manufacturing, the system comprises a control module, a laser module and a rotating shaft, the laser module comprises an X-axis direction galvanometer driving plate, a Y-axis direction galvanometer driving plate and a galvanometer, the control module is connected with the X-axis direction galvanometer driving plate and the Y-axis direction galvanometer driving plate, and the Y-axis direction galvanometer driving plate is connected with the rotating shaft; the control module is used for controlling the X-axis direction galvanometer driving plate and the Y-axis direction galvanometer driving plate to work when it is monitored that etching of one filling line is completed. The laser module is used for driving an X pendulum shaft of a galvanometer to move along an X axis by an X-axis direction galvanometer driving plate and driving a rotating shaft to rotate by a preset angle by a Y-axis direction galvanometer driving plate according to the control of the control module until an etching point is located at a starting point of a next filling line; the rotating shaft is used for rotating based on driving of the Y-axis galvanometer driving plate. A spiral groove with any pattern can be etched at a high response speed.

Description

Technical Field

[0001] The present disclosure relates to the field of laser manufacturing technology, and in particular to a spiral groove processing system, method, electronic device and computer-readable storage medium. Background Art

[0002] Liquid metal bearings are bearings that use liquid metal as the lubricating and supporting medium between friction pairs. Compared with traditional ball bearings, liquid metal bearings have the advantages of low wear, low noise, low vibration, high heat capacity, strong stability, clear imaging and long service life. Liquid metal bearings have more advantages and development prospects and are used in high-speed trains, wind turbines, ships and heavy machinery.

[0003] Before working, liquid metal bearings need to heat the metal (such as low-melting-point metals or alloys such as lead, bismuth, tin, etc.) to above its melting point to keep it in liquid state. When the rotating parts start to rotate, the liquid metal is pushed to the outer edge of the bearing due to the centrifugal force. Between the inner surface of the bearing and the rotating parts, the liquid metal is guided through the flow channel to form a thin and continuous liquid film, forming liquid static pressure, which is supported on the fixed cavity respectively.

[0004] The flow channels of liquid metal bearings are usually spiral grooves of different shapes. However, in the related art, each style of spiral groove is customized, which has poor universality and high cost. Summary of the invention

[0005] The present disclosure provides a spiral groove processing system, method, electronic device and computer-readable storage medium; the spiral grooves of arbitrary patterns can be etched at a high response speed.

[0006] The technical solution of the present disclosure is achieved as follows: In a first aspect, the present disclosure provides a spiral groove processing system, which includes: a control module, a laser module, and a rotating shaft. The laser module includes: an X-axis galvanometer drive board, a Y-axis galvanometer drive board and a galvanometer. The control module is connected to the X-axis galvanometer drive board and the Y-axis galvanometer drive board, and the Y-axis galvanometer drive board is connected to the rotating shaft; the control module is configured to control the X-axis galvanometer drive board and the Y-axis galvanometer drive board to work when it is detected that the etching of a filling line is completed; the laser module is configured to, according to the control of the control module, drive the X-axis galvanometer drive board to drive the X-swing axis of the galvanometer to move along the X-axis, and the Y-axis galvanometer drive board to drive the rotating shaft to rotate a preset angle until the etching point is located at the starting point of the next filling line; the rotating shaft is configured to rotate based on the drive of the Y-axis galvanometer drive board.

[0007] In some embodiments, the control module is further configured to determine the preset angle according to the perimeter of the part to be etched and the interval between the filling lines in the input two-dimensional drawing of the part to be etched.

[0008] In some embodiments, the spiral groove processing system further includes: a protective shell for isolating the component to be etched.

[0009] In some embodiments, the protective shell is provided with a light-passing slit for allowing the laser to enter the cavity.

[0010] In some embodiments, the spiral groove processing system further includes: an inert gas generator connected to the protective shell; the inert gas generator is configured to inject inert gas into the protective shell.

[0011] In some embodiments, the spiral groove processing system further includes: a dust removal module disposed close to the light-transmitting slit; the dust removal module is configured to absorb and purify dust generated during the laser processing process.

[0012] In some embodiments, the spiral groove processing system also includes: a visual camera connected to the control module; the visual camera is configured to obtain image information of the part to be etched; the control module is also configured to determine the etching position based on the image information and the two-dimensional drawing of the part to be etched.

[0013] In a second aspect, the present disclosure provides a spiral groove processing method, which includes: when monitoring that the etching of a filling line is completed, controlling the X-axis direction galvanometer drive plate to move along the X-axis, and controlling the Y-axis direction galvanometer drive plate to drive the rotating shaft to rotate a preset angle until the etching point is located at the starting point of the next filling line.

[0014] In some embodiments, the spiral groove processing method further includes: determining a preset angle according to the circumference of the part to be etched and the interval between the filling lines in the input two-dimensional drawing of the part to be etched.

[0015] In a third aspect, the present disclosure provides an electronic device comprising a processor, a memory, and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction, when executed by the processor, implements the steps of the spiral groove machining method as described in the second aspect.

[0016] In a fourth aspect, the present disclosure provides a computer-readable storage medium storing a program or instruction, which, when executed by a processor, implements the steps of the spiral groove machining method as described in the second aspect.

[0017] In a fifth aspect, the present disclosure provides a computer program product, wherein the computer program product includes a computer program or instructions. When the computer program product runs on a processor, the processor executes the computer program or instructions to implement the steps of the spiral groove processing method as described in the second aspect.

[0018] In a sixth aspect, the present disclosure provides a chip, comprising a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run a program or instruction to implement the spiral groove processing method as described in the second aspect.

[0019] The present invention provides a spiral groove processing system, which includes: a control module, a laser module, and a rotating shaft. The laser module includes: an X-axis galvanometer driving plate, a Y-axis galvanometer driving plate and a galvanometer. The control module is connected to the X-axis galvanometer driving plate and the Y-axis galvanometer driving plate, and the Y-axis galvanometer driving plate is connected to the rotating shaft. The control module is configured to control the X-axis galvanometer driving plate and the Y-axis galvanometer driving plate to work when it is detected that the etching of a filling line is completed. The laser module is configured to drive the X-axis galvanometer driving plate and the Y-axis galvanometer driving plate to move along the X-axis according to the control of the control module, and the Y-axis galvanometer driving plate drives the rotating shaft to rotate a preset angle until the etching point is located at the starting point of the next filling line. The rotating shaft is configured to rotate based on the drive of the Y-axis galvanometer driving plate. By connecting the Y-axis galvanometer drive plate with the rotary axis, it is possible to etch spiral grooves of any shape on the part to be etched, while utilizing the high response characteristics of the laser module to improve processing efficiency. In addition, compared with contact processing, the use of a laser module can avoid contact stress and tool loss, and laser processing directly ionizes the material without thermal effects and remelting layers, thereby obtaining higher quality spiral grooves. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is one of the structural schematic diagrams of a spiral groove processing system provided by the present disclosure; Figure 2 A two-dimensional schematic diagram of the development of the herringbone spiral groove provided by the present disclosure; Figure 3 A schematic diagram of the structure of the laser module provided by the present disclosure; Figure 4 The second structural schematic diagram of a spiral groove processing system provided by the present invention; Figure 5 The third structural schematic diagram of a spiral groove processing system provided by the present invention; Figure 6 A schematic diagram of the structure of the protective shell provided by the present invention; Figure 7 The fourth structural schematic diagram of a spiral groove processing system provided by the present invention; Figure 8 A schematic diagram of the process of the spiral groove machining method provided by the present invention; Fig. 9 A schematic diagram of the hardware structure of an electronic device provided by the present invention. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the present disclosure to clearly describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present disclosure are within the scope of protection of the present disclosure.

[0022] Liquid metal bearings have high matching accuracy for each component, so the quality requirements for the machined surface are extremely high. However, the traditional liquid metal bearing spiral groove is machined by contact processing, which will produce contact stress on the material, causing micro deformation of the material, affecting the matching of the etched parts with other components. Therefore, the traditional contact processing method not only cannot obtain high-quality bearings, but also consumes a lot of tools.

[0023] Therefore, in the spiral groove etching system provided by the present disclosure, laser is used to etch the spiral groove of the liquid metal bearing core. The mechanism is that during the laser radiation process, the material receives a large amount of photon energy, reaching the energy threshold of chemical bond breaking or lattice structure destruction, and then material removal occurs. The thermal effect of the cold polishing process is very small, the processing quality of the material surface is good, there is no "crater" and burr, and the roughness of the etched area is good. In addition, laser belongs to optical non-contact cold processing, which replaces the tool processing method and can also avoid the contact stress and tool loss caused by machining.

[0024] Furthermore, in order to improve the processing quality, the present invention uses an ultrashort pulse laser generated by a femtosecond laser to process a spiral groove in the component to be etched. The ultrashort pulse laser has an extremely high peak power and can directly ionize the material without thermal effects and remelting layers, thereby obtaining a higher quality spiral groove.

[0025] Based on the above description, the present disclosure provides a spiral groove processing system for etching a spiral groove using a laser. Figure 1 A spiral groove processing system is shown in the present disclosure. Figure 1 As shown, the spiral groove processing system includes: a control module 10, a laser module 20, and a rotating shaft 30. The laser module 20 includes: an X-axis direction galvanometer drive plate 201, a Y-axis direction galvanometer drive plate 202 and a galvanometer 203. The control module 10 is connected to the X-axis direction galvanometer drive plate 201 and the Y-axis direction galvanometer drive plate 202, and the Y-axis direction galvanometer drive plate 202 is connected to the rotating shaft 30.

[0026] The control module 10 is configured to control the X-axis galvanometer drive board 201 and the Y-axis galvanometer drive board to work when it is detected that the etching of a filling line is completed; the laser module 20 is configured to drive the X-swing axis of the galvanometer 203 to move along the X-axis according to the control of the control module 10, and the Y-axis galvanometer drive board 202 drives the rotating shaft 30 to rotate a preset angle until the etching point is located at the starting point of the next filling line; the rotating shaft 30 is configured to rotate based on the drive of the Y-axis galvanometer drive board 202.

[0027] The X axis is parallel to the axis of the rotary shaft 30 , and the X axis is perpendicular to the Y axis.

[0028] A fill line refers to a line used to fill the internal area of ​​a specified graphic. A graphic of a spiral groove to be etched is planned on the component to be etched, and multiple fill lines are planned inside the graphic. Each fill line indicates an etching path, and the laser beam of the laser module 20 etches along each fill line. After etching of one fill line is completed, the laser beam needs to move to the starting point of the next fill line (the laser module 20 does not emit light during this movement) according to the planned etching path, and then etching is performed until all the planned spiral grooves are finally formed on the component to be etched.

[0029] like Figure 2 As shown, it is a two-dimensional unfolded view of the part to be etched. The herringbone pattern with filled line segments in the figure is the spiral groove 401 to be etched, and the discontinuous line segments in the figure are filled lines. A filled line includes discontinuous line segments from left to right along the X-axis direction.

[0030] like Figure 3 As shown, it is an optical schematic diagram of the laser module 20, and the laser module 20 also includes: a laser generator 204, a beam expander 205, a reflector 206 and a field lens 207. The laser generator 204 is used to generate laser light, and the laser generator 204 can be a femtosecond laser. A femtosecond laser is a laser that can produce a femtosecond pulse duration, has ultra-high peak power and energy density, can directly ionize the material, and has no remelting layer, so the thermal effect during the etching process is small. The beam expander 205 is used to adjust the laser beam diameter and divergence angle. The reflector 206 is used to change the transmission direction of the laser beam. The galvanometer 203 is used to control the scanning trajectory of the laser beam. The field lens 207 is used to converge the laser beam to obtain a focused spot with high energy density.

[0031] The X-swing axis and Y-swing axis in the galvanometer 203 refer to the two main motion axes of the galvanometer 203, which are respectively responsible for controlling the deflection of the laser beam in the X-axis and Y-axis directions. The X-swing axis is driven by the X-axis direction galvanometer driving board 201, so as to control the deflection angle of the reflector 206 on the X-axis. By changing the deflection angle of the reflector 206 on the X-swing axis, the movement and positioning of the laser beam in the X-axis direction can be controlled. The control module 10 controls the X-axis direction galvanometer driving board 201 to drive the X-swing axis of the galvanometer 203 to move according to the fill line. In a fill line, the control module 10 also controls the laser module 20 to emit light or not according to the fill line, such as Figure 2 As shown, in a filling line (i.e., a discontinuous line segment from left to right), the laser module 20 emits light in the filling line segment portion, and the laser module 20 in the white herringbone pattern without the filling area, i.e., the portion that does not need to be etched, does not emit light.

[0032] The Y-swing axis is driven by the Y-axis galvanometer driving plate 202, thereby controlling the deflection angle of the reflector 206 on the Y-axis. By changing the deflection angle of the reflector 206 on the Y-swing axis, the movement and positioning of the laser beam in the Y-axis direction can be controlled.

[0033] However, in the present disclosure, what needs to be etched is a spiral groove, and controlling the movement of the laser beam in the Y-axis direction by changing the deflection angle of the reflector 206 on the Y-swing axis cannot achieve etching of the to-be-etched component. Therefore, in the present disclosure, in the process of etching the spiral groove by the laser beam, the Y-axis direction galvanometer drive plate 202 is not used to drive the Y-swing axis, and the deflection angle of the reflector 206 on the Y-swing axis is fixed, that is, the Y-swing axis is in a fixed position. However, the laser module 20 also has a high-response drive control characteristic, that is, the X-axis direction galvanometer drive plate 201 and the Y-axis direction galvanometer drive plate 202 respond very quickly to the control of the control module 10.

[0034] Therefore, in the embodiment of the present disclosure, in order to etch a spiral groove pattern and be able to respond to the control signal at high speed, the Y-axis galvanometer drive plate 202 is connected to the rotating shaft 30, and the Y-axis galvanometer drive plate 202 no longer drives the Y swing axis of the galvanometer 203. The Y swing axis of the galvanometer 203 remains fixed in position during the etching process, but drives the rotating shaft 30 to rotate.

[0035] The rotary shaft 30 adopts a high-precision rotary shaft, and the end runout (referring to axial runout, the vertical movement when rotating on a vertical plane, affecting the position of the component to be etched in the vertical direction) and radial runout (referring to radial runout, the horizontal movement when rotating on a horizontal plane, affecting the position of the component to be etched in the horizontal direction) are small (less than 5um), so as to keep the top generatrix of the component to be etched in the same focal plane, and ensure that the focused light spot is always on the highest generatrix of the component to be etched, so that the depth of the spiral groove etched on the component to be etched is consistent. In addition, after many tests and measurements, it is determined that the positioning accuracy of the rotary shaft 30 is 8", and the repeat positioning accuracy is 4", wherein the positioning accuracy indicates the difference between the actual position of the rotary shaft 30 and the expected position of the control module 10, and the repeat positioning accuracy indicates the average of multiple positioning accuracies. The positioning accuracy and repeat positioning accuracy are also high, thereby further ensuring the processing quality.

[0036] In some embodiments, the spiral groove processing system also includes a fixture for fastening the part to be etched on the etching station of the rotating shaft 30. The fixture can be a high-elastic chuck that can further reduce the end jump and radial jump of the part to be etched while fixing the part to be etched.

[0037] In some embodiments, the control module 10 is further configured to determine the preset angle according to the perimeter of the part to be etched and the interval between the filling lines in the input two-dimensional drawing of the part to be etched.

[0038] Specifically, in the unfolded two-dimensional drawing of the part to be etched, the circumference is determined to be 3.14D, D is the diameter of the part to be etched, and the interval between the two filling lines is m, then the preset angle is: 360m / 3.14D.

[0039] It should be noted that, in a component to be etched, the same pattern with the same interval can be etched, different patterns with the same interval can be etched, the same pattern with different intervals can be etched, and different patterns with different intervals can be etched. In addition, the position range of the component to be etched can be a circle of the component to be etched, or a partial area of ​​the component to be etched. The corresponding preset angle is adapted in the control module 10 according to the pattern actually required to be etched.

[0040] In some embodiments, the spiral groove processing system also includes: a visual camera and a distance measuring module connected to the control module 10; the visual camera is configured to obtain the etching area of ​​the component to be etched; the distance measuring module is configured to determine the etching distance of the focused light spot emitted by the laser module 20; the control module 10 is also configured to control the laser module 20 to etch within the etching area, and to control the distance between the laser module 20 and the component to be etched to be the etching distance.

[0041] Before etching, the relative position calibration of the galvanometer 203 machining center, the visual camera field of view center and the distance measurement module center needs to be completed to ensure accurate positioning during the machining process. According to the machining position in the two-dimensional drawing, a paraxial high-precision visual camera is used to determine the etching area; for example, a 30mm bearing needs to be centered to process the spiral groove, and the center position on the bearing is determined by the visual camera. Since the relative position calibration of the galvanometer 203 machining center and the visual camera field of view center is carried out, the control module 10 can determine the machining position corresponding to the galvanometer 203 machining center according to the etching area determined by the visual camera. A high-precision distance measuring module is used to measure the position of the laser focus spot (the minimum spot where the laser beam converges) and the etching distance of the galvanometer 203. Accurate determination of the focus spot position is crucial to ensuring the depth and width of laser processing. Slight changes in the focus spot position may affect the processing effect. Since the relative positions of the processing center of the galvanometer 203 and the center of the distance measuring module are calibrated, the galvanometer 203 can process the parts to be etched according to the etching distance during the processing. In this way, the accuracy and reliability of the laser processing process can be ensured.

[0042] In the embodiments of the present disclosure, the Y-axis galvanometer drive plate is connected to the rotating shaft to achieve high-speed response. At the same time, any spiral groove pattern (such as herringbone patterns, figure-eight patterns, etc.) can be etched on the part to be etched. In addition, compared with contact processing, the use of a laser module can avoid contact stress and tool loss, and laser processing directly ionizes the material without thermal effects and remelting layers, thereby obtaining higher quality spiral grooves.

[0043] In some embodiments, Figure 4 As shown, the spiral groove processing system further includes: a protective shell 50 for isolating the component 40 to be etched.

[0044] The protective shell 50 is made of a transparent material, so that the laser beam can irradiate the component 40 to be etched, while preventing dust and powder from polluting the environment during the processing.

[0045] In some embodiments, a light-through slit for allowing the laser to enter the cavity is provided on the protective shell 50. The light-through slit is located directly below the laser beam and ensures that the laser beam can irradiate the part to be etched 40 without obstruction. The shape of the slit can be U-shaped or strip-shaped, and the specific shape is not limited in this disclosure.

[0046] Since the transparent protective shell 50 must be able to ensure that the laser beam can ionize the part to be etched 40 and has no effect on the transparent protective shell 50, the required material cost is relatively high, and there will be light loss when the laser beam passes through the protective shell 50 and then irradiates the material to be etched, resulting in reduced energy of the laser beam, and the etching quality and etching efficiency will also decrease. By setting a light-through slit, the laser beam directly irradiates the part to be etched 40 through the light-through slit, which not only ensures that there is no energy loss, but also reduces the material requirements for the protective shell 50.

[0047] In some embodiments, Figure 5 As shown, the spiral groove processing system further includes: an inert gas generator 60 connected to the protective shell 50 ; the inert gas generator 60 is configured to inject inert gas into the protective shell 50 .

[0048] Adding inert gas during the processing of the component 40 to be etched can avoid metal oxidation during the processing. The added inert gas can be: argon, helium, nitrogen, hydrogen, etc.

[0049] In addition, by introducing inert gas into the protective shell 50 to form a slight positive pressure in the protective shell 50, floating dust and powder in the processing process can be discharged through the light-transmitting slits to avoid the floating and sinking of powder in the processing process due to gravity and the redeposition of powder on the part to be etched 40 to seriously affect the processing quality.

[0050] A U-shaped groove or a strip groove is opened on the top, and the size of the U-shaped groove or the strip groove is 120mm×10mm. It will not block the light and can also effectively discharge the processing dust from here to ensure the quality of the core surface and the processing area.

[0051] For example, Figure 6 As shown in the structural diagram of the protective shell 50, the bottom of the protective shell 50 is connected to the bottom plate bolts through a T-slot structural member to ensure coaxiality, facilitate quick disassembly, and not interfere with the rotation of the rotating shaft 30; its left end is flexibly in contact with the fixture through a soft sponge to achieve end side sealing without affecting the rotation of the fixture; the other side is connected to the inert gas generator 60 through a conduit to continuously introduce argon gas during the processing to avoid oxidation of the part to be etched 40 during the processing; the size of the through slit opened on the top is 120mm×10mm to ensure that there is no light loss in the laser beam. In addition, the inert gas injected ensures a slight positive pressure, and can also effectively discharge processing dust from the through slit to ensure the quality of the surface of the part to be etched 40 and the processing area.

[0052] In some embodiments, Figure 7As shown, the spiral groove processing system also includes: a dust removal module 70 arranged close to the light-passing slit; the dust removal module 70 is configured to absorb and purify dust generated during the laser processing. Since the dust during the processing will be discharged through the light-passing slit, the dust during the processing is absorbed and purified by the dust removal module 70 to avoid environmental pollution and affect the health of workers.

[0053] Based on the same concept as the spiral groove processing system provided above, the present disclosure also provides a spiral groove processing method, which can be the above-mentioned control module 10, or can be an electronic device including the control module 10 that can implement the control module 10. The specific method can be determined according to actual usage requirements, and the embodiments of the present disclosure are not limited.

[0054] like Figure 8 As shown, the present disclosure provides a spiral groove processing method, which may include the following steps S801 to S802.

[0055] In step S801, when it is detected that the etching of one filling line is completed, the X-axis direction galvanometer driving plate is controlled to move along the X-axis.

[0056] In step S802, the Y-axis direction galvanometer drive plate is controlled to drive the rotary axis to rotate by a preset angle until the etching point is located at the starting point of the next filling line.

[0057] In some embodiments, the spiral groove processing method further includes: determining a preset angle according to the circumference of the part to be etched and the interval between the filling lines in the input two-dimensional drawing of the part to be etched.

[0058] It should be noted that the above-mentioned spiral groove processing method can realize the spiral groove processing system provided by the above-mentioned system embodiment, and can achieve the same technical effect. In order to avoid repetition, it will not be repeated here.

[0059] like Fig. 9 , which is a schematic diagram of the structure of an electronic device provided by the present disclosure, the electronic device may include: at least one processor 910, a memory 920, and a communication interface 930.

[0060] The memory 920 is used to store programs. Specifically, the programs may include program codes, and the program codes include computer operation instructions.

[0061] The memory 920 may include a high-speed random access memory (RAM), and may also include a non-volatile memory (non-volatile memory), such as at least one disk memory.

[0062] The processor 910 is used to execute the computer-executable instructions stored in the memory 920 to implement the spiral groove machining method described in the above method embodiment. The processor 910 may be a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present disclosure.

[0063] The electronic device may also include a communication interface 930, so that it can communicate and interact with external devices through the communication interface 930. In a specific implementation, if the communication interface 930, the memory 920 and the processor 910 are implemented independently, the communication interface 930, the memory 920 and the processor 910 can be connected to each other through a bus and complete the communication between each other. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc., but it does not mean that there is only one bus or one type of bus.

[0064] The present disclosure also provides a computer-readable storage medium storing at least one instruction, wherein the at least one instruction is used to be executed by a processor to implement the spiral groove machining method described in the above embodiments.

[0065] The present disclosure also provides a computer program product, which includes computer instructions stored in a computer-readable storage medium; a processor of an electronic device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the electronic device executes to implement the spiral groove processing method described in the above-mentioned embodiments.

[0066] The disclosed embodiment further provides a chip, which includes a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run programs or instructions to implement the various processes of the above-mentioned spiral groove processing method embodiment, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0067] It should be understood that the chip mentioned in the embodiments of the present disclosure may also be referred to as a system-level chip, a system chip, a chip system, or a system-on-chip chip, etc.

[0068] In the several embodiments provided in the present disclosure, it should be understood that the disclosed systems, devices, servers and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0069] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0070] In addition, each functional unit in each embodiment of the present disclosure may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0071] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present disclosure is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present disclosure. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), RAM, disk or optical disk, etc. Various media that can store program codes.

[0072] Those skilled in the art should be aware that in one or more of the above examples, the functions described in the present disclosure can be implemented using hardware, software, firmware, or any combination thereof. When implemented using software, these functions can be stored in a computer-readable medium or transmitted as one or more instructions or codes on a computer-readable medium. Computer-readable media include computer storage media and communication media, wherein communication media include any media that facilitates the transmission of computer programs from one place to another. Storage media can be any available media that can be accessed by a general or special-purpose computer.

[0073] It should be noted that the technical solutions described in the present disclosure can be combined arbitrarily without conflict.

[0074] The above description is only a specific implementation mode of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure.

Claims

1. A spiral groove processing system, characterized in that: The system comprises: a control module, a laser module, and a rotary shaft, wherein the laser module comprises: an X-axis galvanometer drive board, a Y-axis galvanometer drive board, and a galvanometer, wherein the control module is connected to the X-axis galvanometer drive board and the Y-axis galvanometer drive board, and the Y-axis galvanometer drive board is connected to the rotary shaft; The control module is configured to control the X-axis galvanometer drive board and the Y-axis galvanometer drive board to work when it is detected that the etching of a filling line is completed; The laser module is configured to, according to the control of the control module, drive the X-axis galvanometer driving plate to drive the X-swing axis of the galvanometer to move along the X-axis, and drive the Y-axis galvanometer driving plate to drive the rotary axis to rotate by a preset angle until the etching point is located at the starting point of the next filling line; The rotary shaft is configured to rotate based on the driving of the Y-axis galvanometer driving plate.

2. The spiral groove machining system according to claim 1, characterized in that: The control module is further configured to: The preset angle is determined according to the perimeter of the part to be etched and the interval between the filling lines in the input two-dimensional drawing of the part to be etched.

3. The spiral groove machining system according to claim 1, characterized in that: The spiral groove processing system also includes: a protective shell for isolating the parts to be etched.

4. The spiral groove machining system according to claim 3, characterized in that: The protective shell is provided with a light-passing slit for allowing the laser to enter the cavity.

5. The spiral groove machining system according to claim 4, characterized in that: The spiral groove processing system further includes: an inert gas generator connected to the protective shell; The inert gas generator is configured to inject inert gas into the protective shell.

6. The spiral groove machining system according to claim 4, characterized in that: The spiral groove processing system further includes: a dust removal module disposed close to the light-through slit; The dust removal module is configured to absorb and purify dust generated during laser processing.

7. The spiral groove machining system according to any one of claims 1 to 6, characterized in that: The spiral groove processing system further includes: a visual camera and a distance measurement module connected to the control module; The visual camera is configured to determine the etching area of ​​the part to be etched according to the two-dimensional drawing; The distance measuring module is configured to determine the etching distance of the focused light spot emitted by the laser module; The control module is further configured to control the laser module to perform etching in the etching area, and to control the distance between the laser module and the component to be etched to be the etching distance.

8. A spiral groove processing method, characterized in that: The spiral groove processing method comprises: When it is detected that the etching of one filling line is completed, the X-axis galvanometer driving plate is controlled to move along the X-axis, and the Y-axis galvanometer driving plate is controlled to drive the rotary axis to rotate a preset angle until the etching point is located at the starting point of the next filling line.

9. An electronic device, characterized in that: It includes a processor, a memory, and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction, when executed by the processor, implements the steps of the spiral groove machining method as claimed in claim 8.

10. A computer-readable storage medium, characterized in that: The readable storage medium stores a program or instruction, and when the program or instruction is executed by the processor, the steps of the spiral groove machining method according to claim 8 are implemented.

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