Three-dimensional uniform-temperature plate welding jig

Abstract

The invention provides a three-dimensional uniform-temperature plate welding jig which comprises a base, and at least one supporting arm and a plate body are arranged on the base. The plate body is arranged on the supporting arm, and a plurality of solder grooves are concavely formed in the plate body; a through hole is formed in the bottom of each welding flux groove, and a heat supply pipe penetrates through the through hole. By means of the jig, the three-dimensional uniform-temperature plate to be welded is welded in an inverted mode, so that the welding flux is prevented from being melted and entering the uniform-temperature plate body cavity under the action of gravity to cause corrosion and pollute working fluid and a capillary structure in the cavity, and the quality and the heat dissipation effect are further prevented from being affected.

Description

Technical Field

[0001] The invention relates to a temperature-averaging plate welding jig, and in particular to a three-dimensional temperature-averaging plate welding jig. Background Art

[0002] As technology advances, the computing performance of electronic devices has increased significantly, and a large amount of heat is also generated. In order to ensure that electronic devices are not damaged by high temperatures, a heat dissipation device must be installed. The heat dissipation device currently used includes a three-dimensional vapor chamber, which is a heat dissipation device that combines a heat pipe 92 and a vapor chamber body 91.

[0003] During the manufacturing process, in order to combine the heat pipe 92 with the temperature balancing plate 91, the solder 93 is melted at the joint for welding. Figure 1 As shown, during welding, the temperature balancing plate 91 is placed at the bottom, and the heat pipe 92 is vertically connected (for example, inserted) to the upward-facing welding hole of the temperature balancing plate 91, and then the ring-shaped solder 93 is inserted into the upright heat pipe 92. In this way, the solder 93 will fall into the joint between the heat pipe 92 and the temperature balancing plate 91, so as to heat the welding, so that the heat pipe 92 and the temperature balancing plate 91 can be combined by melting the solder 93.

[0004] However, although the solder 93 at the joint of the heat pipe 92 and the temperature-averaging plate 91 can be melted and then welded together by this forward welding method, other problems arise, because the solder will not only wet between the surfaces of the heat pipe 92 and the temperature-averaging plate 91, but also flow into the internal cavity of the temperature-averaging plate 91 from the gap at the joint of the heat pipe 92 and the temperature-averaging plate 91 due to capillary action and gravity, causing the internal cavity of the temperature-averaging plate 91 to be contaminated, resulting in the quality and heat dissipation effect of the three-dimensional temperature-averaging plate being affected.

[0005] In view of this, how to effectively combine the heat pipe 92 and the temperature equalizing plate body 91 when welding the heat pipe 92 and the temperature equalizing plate body 91 with solder 93 during the manufacturing process of the three-dimensional temperature equalizing plate, and how to prevent the internal cavity of the temperature equalizing plate body 91 from being corroded by the solder due to the melting of the solder, thereby contaminating the working fluid and capillary structure in the cavity and further affecting the quality and heat dissipation effect, is indeed the direction that the inventor of this case and related manufacturers engaged in this industry are eager to study and improve. Summary of the invention

[0006] The purpose of the present invention is to provide a three-dimensional temperature equalizing plate welding fixture for welding a plurality of heat pipes and a temperature equalizing plate body in an inverted manner, which can effectively improve the risk of corrosion contamination of the internal cavity of the temperature equalizing plate body due to melting of solder in traditional forward (vertical) welding processing.

[0007] The present invention provides a three-dimensional temperature-averaging plate welding fixture, comprising a base, the base being provided with at least one support arm, and a plate body. The plate body is provided on the support arm, and the plate body is provided with a plurality of solder grooves. A through hole is provided at the bottom of each solder groove for a heat pipe to pass through.

[0008] According to an embodiment of the present invention, the base is provided with a partition groove, the partition groove includes at least one embedding area and a tube groove area, one end of the support arm is engaged with the embedding area, and the tube groove area is used to accommodate the plurality of inserted heat pipes.

[0009] According to an embodiment of the present invention, the embedding area includes a first embedding area and a second embedding area, and the first embedding area and the second embedding area are respectively arranged on both sides of the tube groove area.

[0010] According to an embodiment of the present invention, the support arm includes a first support arm and a second support arm, and one end of the first support arm and one end of the second support arm are respectively disposed in the first fitting area and the second fitting area.

[0011] According to an embodiment of the present invention, the plate body is provided with a plurality of docking holes which can be used to engage with the other end of the support arm.

[0012] According to an embodiment of the present invention, each solder groove is a circular groove for accommodating a ring-shaped solder.

[0013] According to an embodiment of the present invention, the annular solder is phosphor copper solder.

[0014] By using the three-dimensional temperature equalizer welding fixture of the present invention, the three-dimensional temperature equalizer to be welded is inverted to prevent the melted solder from entering the cavity of the temperature equalizer body under gravity to cause corrosion, pollute the working fluid and capillary structure in the cavity, and thus affect the quality and heat dissipation effect.

[0015] The above description of the content of the present invention and the following description of the embodiments are intended to demonstrate and explain the principles of the present invention and to provide further explanation of the claims of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a front schematic diagram of the three-dimensional temperature equalizing plate welding structure in the prior art.

[0017] Figure 2 It is a three-dimensional schematic diagram of a three-dimensional temperature homogenizing plate welding fixture according to the present invention.

[0018] Figure 3 It is a schematic diagram of a three-dimensional exploded view of a three-dimensional temperature homogenizing plate welding fixture according to the present invention.

[0019] Figure 4 It is a schematic diagram of a three-dimensional exploded view of a three-dimensional temperature homogenizing plate welding fixture according to the present invention.

[0020] Figure 5 It is a front schematic diagram of a three-dimensional temperature homogenizing plate welding fixture according to the present invention.

[0021] Figure 6 It is a front cross-sectional schematic diagram of a three-dimensional temperature homogenizing plate welding fixture according to the present invention.

[0022] Figure 7 It is a front schematic diagram of a three-dimensional temperature homogenizing plate welding fixture according to the present invention.

[0023] Figure 8 It is a front cross-sectional schematic diagram of a three-dimensional temperature homogenizing plate welding fixture according to the present invention.

[0024] Fig. 9 Schematic diagram of a three-dimensional temperature homogenizing plate according to the present invention.

[0025] Explanation of the accompanying drawings: A three-dimensional temperature-averaging plate welding fixture; 1 base; 12 partition grooves; 121 fitting area; 121a first fitting area; 121b second fitting area; 122 tube groove area; 2 support arms; 21 first support arm; 22 second support arm; 23 convex portion; 3 plate body; 30 through hole; 311 solder groove; 311a bottom; 33 docking hole; 331 first docking hole; 332 second docking hole; 333 third docking hole; 334 fourth docking hole; B three-dimensional temperature-averaging plate; B1 temperature-averaging plate body; B10 chamber; B11 surface to be welded; B110 through hole; B12 contact portion; B2 heat pipe; B20 closed pipe; B21 open end; B22 closed end; B3 ring solder. DETAILED DESCRIPTION

[0026] Please refer to the attached figure. Figure 2 A three-dimensional schematic diagram of a three-dimensional temperature homogenizing plate welding fixture according to the present invention; Figure 3 and Figure 4 It is a three-dimensional exploded schematic diagram of a three-dimensional temperature homogenizing plate welding fixture according to the present invention; Figure 5 and Figure 7 It is a front schematic diagram of a three-dimensional temperature homogenizing plate welding jig according to the present invention; Figure 6 and Figure 8 is a front cross-sectional schematic diagram of a three-dimensional temperature homogenizing plate welding jig according to the present invention; and Fig. 9 Schematic diagram of a three-dimensional temperature homogenizing plate according to the present invention.

[0027] like Figure 2 and Figure 3 As shown, the present invention provides a three-dimensional temperature-averaging plate welding fixture A, which includes at least a base 1, on which at least one support arm 2 and a plate body 3 are provided. The support arm 2 is provided above the base 1, and the plate body 3 is provided above the support arm 2.

[0028] The plate body 3 is provided with a plurality of solder grooves 311, and a through hole 30 is provided at the bottom 311a of each solder groove 311 for a heat pipe B2 to pass through. The heat pipe B2 has a closed end B22 and an open end B21. Figures 4 to 6 As shown, the closed ends B22 of the heat pipes B2 to be welded are inserted into the plurality of through holes 30 through the solder groove 311, and then the temperature equalizing plate B1 is placed and positioned on the plate 3, so that the plurality of heat pipes B2 are fixed at the bottom and the temperature equalizing plate B1 is fixed at the top in an inverted state.

[0029] In order to smoothly pass the closed ends B22 of the plurality of heat pipes B2 through the plate body 3, the aperture of the through hole 30 is set to match the diameter of the plurality of heat pipes B2. At the same time, the temperature-averaging plate body B1 is placed on the plate body 3 with the surface B11 to be welded facing downward. For example, the surface B11 to be welded of the temperature-averaging plate body B1 is provided with a plurality of through holes B110 connected to the chamber B10 inside it. At this time, the plurality of solder grooves 311 and the through holes 30 of the plate body 3 are both set at positions corresponding to the plurality of through holes B110.

[0030] Therefore, if Figures 4 to 8 As shown, before the welding is completed, the open end B21 of the plurality of heat pipes B2 is inserted into the plurality of through holes B110 of the open end B21, and the closed end B22 thereof is vertically downwardly penetrated into the plurality of through holes 30 until the surface B11 to be welded of the temperature balancing plate body B1 contacts and is supported by the plate body 3. In this way, with the support of the three-dimensional temperature balancing plate welding fixture A, the temporary joints of the plurality of heat pipes B2 and the surface B11 to be welded of the temperature balancing plate body B1 (i.e., the contact parts of the through holes B110 and the open end B21) are inverted, and are naturally corresponding to and abutting against the plurality of solder grooves 311 under the guidance of gravity.

[0031] In other embodiments, the plurality of heat pipes B2 may also be expanded at the open end B21 to form a lip (not shown), so there is no need to temporarily insert the plurality of through holes B110 of the temperature equalizing plate B1. Instead, the closed ends B22 of the plurality of heat pipes B2 may be respectively passed vertically downward through the plurality of through holes 30 under the force of gravity until the lip enters the bottom 311a of the plurality of solder grooves 311. The lip is then unable to pass through the plurality of through holes 30 due to its larger outer diameter, and the plurality of heat pipes B2 are respectively fixed by the plurality of through holes 30. The present invention is not limited to this.

[0032] In addition, before the plurality of heat pipes B2 and the temperature balancing plate B1 are set, the solder can be set in the plurality of solder grooves 311. The present invention is fixed by the three-dimensional temperature balancing plate welding fixture A, and the temporary joint between the open end B21 of the plurality of heat pipes B2 and the through hole B110 just abuts against the plate 3. Therefore, as long as the solder is set in the plurality of solder grooves 311 of the plate 3, the solder can correspond to and be close to the temporary joint of the plurality of heat pipes B2 on the surface to be welded B11 of the temperature balancing plate B1.

[0033] More specifically, if Figures 5 to 8 As shown, the outer diameter of the plurality of solder grooves 311 is larger than the aperture of the plurality of through holes 30, and the plurality of solder grooves 311 are recessed from the plate body 3 to form a basin-shaped bottom 311a; at this time, each solder groove 311 can be a circular groove, and the plurality of solders can be an annular solder B3, whose inner circumference is coaxial with the plurality of through holes 30 to cooperate with the plurality of heat pipes B2 to penetrate the plurality of through holes 30.

[0034] Therefore, the plurality of annular solders B3 are coaxially positioned and inserted into the outer periphery of the plurality of heat pipes B2 and against the to-be-welded surface B11 of the temperature balancing plate B1, which can ensure that the melted solder contacts both the plurality of heat pipes B2 and the temperature balancing plate B1 at the same time, so that the melted annular solder B3 wets the areas adjacent to the temporary connection of the two at the same time, and because of the surface tension of the melted state, the plurality of annular solders B3 gather toward the middle of the two in the melted state. Therefore, even if the temperature balancing plate B1 is on top and the plurality of heat pipes B2 are on the bottom, in the case of gravity acting downward, it does not affect the full welding connection.

[0035] Furthermore, due to the circular and annular configuration, even if the plurality of heat pipes B2 push or touch the plurality of annular solders B3 when penetrating into the plurality of through holes 30, the plurality of annular solders B3 can return to the plurality of solder grooves 311 by themselves partially due to the balance and correction of the arc contact surface by the action of gravity.

[0036] In some embodiments, a non-separable solder may be used between the plurality of heat pipes B2 and the temperature-averaging plate body B1. For example, the solder may be pre-formed at a predetermined position of the plurality of heat pipes B2 or the temperature-averaging plate body B1, so that it is only necessary to fix the plurality of heat pipes B2 and the temperature-averaging plate body B1 to the three-dimensional temperature-averaging plate welding fixture A, and then heat it to melt it at the plurality of solder grooves 311, but the invention is not limited thereto.

[0037] By this, Figure 7 and Figure 8As shown, the three-dimensional temperature-averaging plate welding fixture A of the present invention fixes the inverted relative relationship between the plurality of heat pipes B2, the plurality of annular solders B3, and the temperature-averaging plate body B1 to complete the preparation for the next welding operation. At this time, it is only necessary to heat the three-dimensional temperature-averaging plate welding fixture A of the present invention and the plurality of heat pipes B2, the plurality of annular solders B3, and the temperature-averaging plate body B1 fixed therein together (for example, send them into a reflow furnace), melt the plurality of annular solders B3 therein, and then the plurality of heat pipes B2 can be welded and joined with the temperature-averaging plate body B1, and the finished product can be taken out after the production of the three-dimensional temperature-averaging plate B is completed.

[0038] By means of the fixed setting of the three-dimensional temperature-averaging plate welding fixture A of the present invention, the temperature-averaging plate body B1, the plurality of annular solders B3, and the plurality of heat pipes B2 are inverted in sequence. Therefore, the plurality of annular solders B3 melted by heating will be guided to wet the gap through the capillary action of the gap between the plurality of through holes B110 contacting the temperature-averaging plate body B1 and the open ends B21 of the plurality of heat pipes B2 to complete the welding. Moreover, because the gravity acts downward in the direction away from the temperature-averaging plate body B1 at this time, it is possible to prevent the melted plurality of annular solders B3 from entering the chamber B10 of the temperature-averaging plate body B1 through the plurality of through holes B110 due to the influence of gravity, causing corrosion, contaminating the working fluid and capillary structure in the chamber B10, and thus affecting the quality and heat dissipation effect.

[0039] In some embodiments, the plurality of heat pipes B2 and the temperature balancing plate B1 may be made of copper, and in this case, the plurality of annular solders B3 may be phosphor copper solder. Figures 7 to 9 As shown, after cooling, the three-dimensional temperature equalizing plate B is completed by welding, in which the plurality of heat pipes B2 have been bonded to the temperature equalizing plate body B1 by the melted annular solder B3, so that the open ends B21 of the plurality of heat pipes B2 and the plurality of through holes B110 are sealed to each other, and the closed pipes B20 in the plurality of heat pipes B2 and the chambers B10 in the temperature equalizing plate body B1 are sealed and connected to each other, and are fully isolated from the outside except for necessary needs (for example, degassing and filling with coolant).

[0040] Furthermore, in response to different needs, the design of the three-dimensional temperature plate B may be changed. The diameter, location, and length of the plurality of heat pipes B2 and the area and shape of the temperature plate body B1 may be different. The present invention may be configured accordingly without limitation. Fig. 9 As shown, at the position where the heat source (such as a processor) is expected to be attached on the side opposite to the surface to be welded B11, a contact portion B12 in the shape of a platform can also be protruded; at this time, the area corresponding to the surface to be welded B11 can be provided with the plurality of through holes B110 with a larger aperture, so as to cooperate with the plurality of heat pipes B2 with a larger diameter in the part close to the heat source, so as to improve the heat dissipation efficiency around the heat source.

[0041] like Figure 3 and Figure 4 As shown, the plurality of through holes 30 of the plate body 3 are arranged to have different hole sizes in accordance with the plurality of heat pipes B2, and the plurality of through holes 30 and the annular solder B3 are arranged in accordance with the positions of the plurality of heat pipes B2. Figure 6 and Figure 7 As shown, in order to maximize the length of the multiple heat pipes B2 that can be set, a partition groove 12 can also be provided on the upper side of the base 1. The partition groove 12 includes at least one embedding area 121 and a tube groove area 122. One end of the support arm 2 is engaged with the embedding area 121. The tube groove area 122 provides sufficient accommodation space for the closed end B22 (opposite to the open end B21) of the multiple heat pipes B2 after they are inserted.

[0042] In some embodiments, the base 1 and the plate body 3 are respectively in the shape of a rounded rectangle to avoid collision and reduce the risk of damaging other components or damaging the three-dimensional temperature homogenizing plate welding fixture A itself due to concentrated force.

[0043] In some embodiments, two support arms 2 are provided between the base 1 and the plate body 3, which are a first support arm 21 and a second support arm 22. Correspondingly, the interlocking area 121 also includes a first interlocking area 121a and a second interlocking area 121b, and the first interlocking area 121a and the second interlocking area 121b are respectively provided on both sides of the tube groove area 122. One end of the first support arm 21 and the second support arm 22 are respectively provided in the first interlocking area 121a and the second interlocking area 121b. In this way, the weight of the temperature equalizing plate B1 borne by the plate body 3 can be evenly distributed and transferred to the base 1 from both sides. In addition, the first support arm 21 and the second support arm 22 of different lengths can be replaced in accordance with the length of the plurality of heat pipes B2.

[0044] In addition, the plate body 3 is provided with a plurality of docking holes 33, and the other end of the plurality of support arms 2 is provided with a plurality of protrusions 23 corresponding to the plurality of docking holes 33 to engage with the plurality of docking holes 33. The plurality of docking holes 33 include a first docking hole 331, a second docking hole 332, a third docking hole 333 and a fourth docking hole 334, and the first docking hole 331, the second docking hole 332, the third docking hole 333 and the fourth docking hole 334 are respectively located at the four corners of the plate body 3. In this way, not only the force on the plate body 3 is evenly dispersed, but also different plate bodies 3 can be replaced according to the size, shape, and even the position and diameter of the plurality of heat pipes B2 of the temperature balancing plate body B1.

[0045] In summary, the present invention uses the jig to perform welding in an inverted manner, which can effectively avoid the traditional forward (vertical) welding, which causes the molten solder to flow into the internal chamber B10 of the temperature equalizing plate B1 due to gravity, causing corrosion, polluting the working fluid and capillary structure in the chamber B10, and affecting the overall quality and heat dissipation effect. The present invention has been described in detail above, and the above is only a preferred embodiment of the present invention, and it should not be used to limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the claims of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A three-dimensional temperature balancing plate welding fixture, used for fixing a plurality of heat pipes to be welded and a temperature balancing plate body, characterized in that: The three-dimensional temperature plate welding fixture includes: a base having at least one supporting arm disposed thereon; and A plate body is arranged on the supporting arm. The plate body is concavely provided with a plurality of solder grooves. A through hole is arranged at the bottom of each solder groove for each heat pipe to penetrate.

2. The three-dimensional temperature-homing plate welding fixture according to claim 1, characterized in that: The base is provided with a partition groove, which includes at least one embedding area and a tube groove area. One end of the support arm is engaged with the embedding area. The tube groove area is used to provide a holding space for the plurality of heat pipes.

3. The three-dimensional temperature-homing plate welding fixture according to claim 2, characterized in that: The embedding area includes a first embedding area and a second embedding area, and the first embedding area and the second embedding area are respectively arranged on two sides of the tube groove area.

4. The three-dimensional temperature-homing plate welding fixture according to claim 3, characterized in that: The support arm comprises a first support arm and a second support arm, and one end of the first support arm and one end of the second support arm are respectively arranged in the first fitting area and the second fitting area.

5. The three-dimensional temperature-homing plate welding fixture according to claim 2, characterized in that: The plate body is provided with a plurality of docking holes, and the other end of the support arm is provided with a plurality of convex parts corresponding to the plurality of docking holes so as to be engaged with the plurality of docking holes.

6. The three-dimensional temperature-homing plate welding fixture according to claim 1, characterized in that: The base is in the shape of a rounded rectangle.

7. The three-dimensional temperature-homing plate welding fixture according to claim 1, characterized in that: The plate body is in the shape of a rounded rectangle.

8. The three-dimensional temperature-homing plate welding fixture according to claim 5, characterized in that: The plurality of docking holes include a first docking hole, a second docking hole, a third docking hole and a fourth docking hole. The first docking hole, the second docking hole, the third docking hole and the fourth docking hole are respectively located at four corners of the plate body.

9. The three-dimensional temperature-homing plate welding fixture according to claim 1, characterized in that: Each solder groove is a circular groove for accommodating a ring-shaped solder.

10. The three-dimensional temperature-homing plate welding fixture according to claim 9, characterized in that: The ring solder is phosphor copper solder.

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