Liquid ejecting head and liquid ejecting apparatus

Abstract

An object is to provide a liquid ejecting head which can be easily mounted on a liquid ejecting apparatus. The liquid ejecting head includes: a storage unit configured to store a liquid; an element substrate having an ejection port surface in which an ejection port for ejecting the liquid stored in the storage unit is formed; and a circuit substrate electrically relaying the liquid ejecting apparatus and the element substrate. In a posture in which the liquid ejecting head is mounted on the liquid ejecting apparatus, the circuit substrate is positioned above the element substrate in the vertical direction, a connector for electrically connecting with an electrical connection member included in the liquid ejecting apparatus is provided on the circuit substrate, and a conductive member is provided on the circuit substrate. The connector is only disposed on a top surface facing in an opposite direction to the ejection port surface.

Description

Technical Field

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection apparatus. Background Art

[0002] A liquid ejection head that can be attached to and detached from a liquid ejection device is known. In the attaching / detaching work of the liquid ejection head, there is a case where a predetermined wiring is connected to a predetermined electrical connection portion provided on a circuit substrate arranged inside the liquid ejection head.

[0003] Japanese Patent Application Laid-Open No. 2021-41658 discloses a liquid ejection head (liquid ejection head) whose circuit substrate is laminated on the top surface of the head housing above the nozzle plate. The circuit substrate is provided with a connector (electrical connection portion) that can connect a wiring member for transmitting a predetermined electrical signal.

[0004] According to the configuration of Japanese Patent Application Laid-Open No. 2021-41658, the circuit substrate is arranged in a laid-down state, and therefore, connection of the wiring member with the connector arranged on the circuit substrate is achieved while lowering the height of the liquid ejection head.

[0005] However, with the circuit substrate disclosed in Japanese Patent Application Laid-Open No. 2021-41658, multiple connectors are arranged not only on the top surface of the circuit substrate but also on the bottom surface, and therefore, it is difficult to connect all multiple wiring members to all connectors provided on the circuit substrate. Summary of the invention

[0006] An object of the present invention is to provide a liquid ejecting head which can be easily mounted on a liquid ejecting apparatus.

[0007] According to the present invention, a liquid injection head includes: a storage unit configured to store liquid; an element substrate having an injection port surface, in which an injection port for injecting liquid stored in the storage unit is formed; and a circuit substrate electrically relaying a liquid injection device and the element substrate, wherein in a posture in which the liquid injection head is mounted on the liquid injection device, the circuit substrate is located above the element substrate in a vertical direction, an end portion of the circuit substrate in a longitudinal direction is provided with a connector for electrically connecting to an electrical connection member included in the liquid injection device, and on the circuit substrate, the connector is provided only on the top surface facing in a direction opposite to the injection port surface.

[0008] Further features of the present disclosure will become apparent from the following description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is an exploded perspective view showing one example of a liquid ejecting head in one embodiment;

[0010] Figure 2 is a schematic diagram showing an example of a connection portion between a circuit substrate and an element substrate in one embodiment;

[0011] Figure 3A is a schematic diagram showing a liquid ejection head in a first comparative example;

[0012] Figure 3B is a schematic diagram showing a liquid ejection head in a second comparative example;

[0013] Figure 4A is a schematic cross-sectional view of a liquid ejection head in one embodiment;

[0014] Figure 4B is a schematic cross-sectional view of a liquid ejection head in one embodiment;

[0015] Figure 5 is a schematic top view of a circuit substrate in one embodiment;

[0016] Figure 6 is a schematic perspective view of a portion of a liquid ejecting head in one embodiment;

[0017] Fig. 7A yes Figure 6 VIIA-VIIA cross-section diagram;

[0018] Figure 7B yes Figure 6 VIIB-VIIBA cross-sectional view of FIG.

[0019] Figure 8 is a schematic top view of a circuit substrate in one embodiment. DETAILED DESCRIPTION

[0020] [First embodiment]

[0021] Figure 1 is an exploded perspective view of one example of a liquid ejection head 100 that can be applied to the present embodiment.

[0022] The coordinate axes in the accompanying drawings are explained. Here, the posture of the liquid ejection head 100 in a state where it is installed on a liquid ejection device that is not schematically shown is explained. In the drawings mentioned in this specification, the X direction and the Y direction represent two directions perpendicular to each other on a horizontal plane. The Z direction represents the vertical direction. Respectively, the +Y direction represents the backward direction of the liquid ejection head 100, the -Y direction represents the forward direction, the -X direction represents the left direction, the +X direction represents the right direction, the +Z direction represents the upward direction, and the -Z direction represents the downward direction. The +Y direction also represents the downstream side in the conveying direction of the printing medium, and the -Y direction also represents the upstream side in the conveying direction of the printing medium. The X direction is appropriately referred to as the scanning direction. In the following explanation, unless otherwise described, the upward, downward, leftward and rightward directions represent the directions of the posture used by the liquid ejection head 100 in a normal state.

[0023] In this embodiment, the description is made based on the assumption that the "liquid" is ink. However, the liquid that can be used in this embodiment is not limited to ink. That is, as the liquid, various printing liquids can also be used, including treatment liquids for the purpose of improving the fixing performance of ink in the printing medium, reducing gloss unevenness, or improving scratch resistance, etc.

[0024] In this embodiment, the description is made based on the assumption that the "print medium" is a sheet material used in a general liquid ejection device. However, the "print medium" is not limited as long as it is a medium capable of receiving liquid. As another example of the "print medium", there are cloth, plastic film, metal plate, glass, ceramic, resin, wood, leather or the like.

[0025] "Printing" not only refers to forming important information such as characters and graphics. "Printing" also refers to forming meaningless information such as images or patterns. In addition, "printing" has nothing to do with whether visualization is performed so that humans can visually perceive. That is, "printing" also refers to forming a structure for printing a medium or changing the medium.

[0026] Can Figure 1 The liquid ejection head 100 shown is freely attached to and detached from a liquid ejection device (e.g., an inkjet printer) that can perform printing on a print medium (e.g., a sheet) by ejecting liquid in a so-called serial method. For example, the liquid ejection head 100 is mounted on a carriage (not schematically shown) that can reciprocate in a scanning direction (±X direction). The liquid ejection head 100 can perform printing on a print medium (not schematically shown) while reciprocating in the scanning direction (±X direction) in a state mounted on the carriage.

[0027] The liquid ejection device includes a conveying unit (not schematically shown) configured to convey the print medium along a conveying direction. In the present embodiment, the conveying direction is determined as a direction perpendicular to the scanning direction (-Y direction). The liquid ejection device performs printing by moving the liquid ejection head 100 in the scanning direction while driving the conveying unit to intermittently move the print medium in the conveying direction and ejecting liquid.

[0028] The liquid ejection device includes: a control unit (e.g., a CPU not shown schematically) configured to control the entire device; a ROM (not shown schematically) in which programs and various parameters executed by the control unit are stored; and a RAM (not shown schematically) which can be used as a temporary storage unit. For example, printing on a print medium can be performed by the CPU reading a program stored in the ROM, loading the program onto the RAM, and executing the program. In the present embodiment, the ink in the liquid ejection head 100 can also be circulated by the CPU reading a program stored in the ROM, loading the program onto the RAM, and executing the program.

[0029] like Figure 1 As shown, the liquid ejection head 100 includes four independent units 101 capable of ejecting liquid individually. The liquid ejection head 100 includes: a base member 102 capable of supporting all the independent units 101; a circuit substrate 103 arranged on the base member 102; and a cover 104 capable of covering the circuit substrate 103. In the present embodiment, the cover 104 can be attached to and detached from the base member 102. However, the cover 104 may be fixed so that the cover 104 cannot be easily detached from the base member 102.

[0030] Each of the four independent units 101 includes: a sub-tank 105, which serves as a storage unit capable of temporarily storing liquid to be used for printing; a channel unit 106 in which a channel is formed; and an element substrate 107, which is a semiconductor device capable of ejecting liquid. The circuit substrate 103 and each of the four element substrates 107 are connected through a flexible substrate 108. That is, in this embodiment, four flexible substrates 108 are used.

[0031] In the present embodiment, an example of supplying liquid to the sub-tank 105 from the outside (e.g., a main tank not schematically shown) is shown, but a box pre-stored with a predetermined amount of liquid may be installed inside the liquid ejection head 100. As described above, liquid may also be supplied to the channel unit 106 by attaching and detaching a box that is a type that is used until it is used up and then discarded. Inside the channel unit 106, two channels are formed that fluidly connect the sub-tank 105 and the element substrate 107.

[0032] The element substrate 107 has: a plurality of energy generating elements (e.g., heaters) that generate energy for ejecting liquid; and an ejection port surface on which an ejection port array including a plurality of ejection ports is formed along a predetermined direction, and liquid is ejected through the plurality of ejection ports. The ejection port array is formed along the conveying direction (Y direction) of the print medium. Each of the plurality of energy generating elements is arranged at a position corresponding to each of the plurality of ejection ports. Driven by the energy generating elements, droplets are ejected from the ejection ports. An electrical signal (ejection signal) for driving the energy generating element is generated by the above-mentioned control unit. The ejection signal is transmitted from the main body of the liquid ejection device to the circuit substrate 103 via the electrical connection member 109.

[0033] In this embodiment, a flexible cable is used as the electrical connection member 109. The ejection signal received by the circuit substrate 103 is transmitted to the element substrate 107 via the flexible substrate 108. The element substrate 107 is provided with a terminal capable of receiving the ejection signal. When the ejection signal is received, the element substrate 107 drives the energy generating element. In this embodiment, the liquid is ejected as described above.

[0034] Each of the four independent units 101 is assembled to the liquid ejection head 100 by being fixed to the base member 102. The periphery of the sub-tank 105 is covered by a cover 104. The cover 104 is mounted downward from above in the vertical direction and is fixed to the base member 102.

[0035] In the present embodiment, four independent units 101 are used, but the number of independent units 101 is not limited to four.

[0036] Figure 2 1 is a schematic diagram showing an example of a connection state between the circuit substrate 103 and the element substrate 107 of the present embodiment.

[0037] like Figure 2 As shown, in a state where the front and back surfaces are horizontal, the circuit substrate 103 is arranged above the channel unit 106 in the vertical direction. Due to this, the circuit substrate 103 has a top surface facing upward (+Z direction) and a bottom surface facing downward (-Z direction) in the vertical direction. In the circuit substrate 103, a first opening 201 is formed.

[0038] The flexible substrate 108 is arranged in such a manner as to pass through the first opening 201. On the top surface of the circuit substrate 103, the end portion ( Figure 2 The flexible substrate 108 passes through the first opening 201 from the top surface of the circuit substrate 103 and extends along the side surface of the channel unit 106 (at Figure 2 , the face facing the -X direction) extends.

[0039] The element substrate 107 is attached to the bottom surface of the channel unit 106 (at Figure 2 The flexible substrate 108 extends along the side of the channel unit 106 and is bent about 90 degrees to extend along the bottom surface. When viewed from above, the element substrate 107 is in the shape of a rectangle having long sides and short sides. Figure 2 In the embodiment of the present invention, an electrical contact portion is provided to connect the end portion of the flexible substrate 108. The electrical contact portion is provided along the longitudinal direction of the flexible substrate 108 at the end portion in the lateral direction of the flexible substrate 108.

[0040] In detail, the electrical contact portion is composed of a plurality of terminals arranged along the longitudinal direction of the flexible substrate 108 at the end portion in the lateral direction of the flexible substrate 108. Inside the flexible substrate 108, a plurality of wirings 203 (e.g., copper foil) are included. After the element substrate 107 and the flexible substrate 108 are electrically connected, the electrical contact portion is sealed by a sealing member 202. On the flexible substrate 108, each individual wiring 203 is linearly arranged along the extending direction of the flexible substrate 108.

[0041] According to such an arrangement, it is no longer necessary to ensure a relatively wide area for arranging the wiring 203 on the bottom surface portion of the liquid ejection head 100. That is, the size of the bottom surface portion of the liquid ejection head 100 and the entire liquid ejection head can be reduced. As described above, in the bottom surface portion of the liquid ejection head 100, in consideration of the size reduction and production cost of the liquid ejection head 100, the wiring 203 is linearly arranged along the extension direction of the flexible substrate 108 without changing the direction in which the wiring 203 extends. Hereinafter, the effect of the size reduction of the liquid ejection head 100 of the present embodiment is explained by using an imaginary comparative example.

[0042] Figure 3A is a schematic diagram showing a liquid ejection head 310 in a first comparative example.

[0043] like Figure 3A As shown, the liquid ejection head 310 includes a circuit substrate 303, a flexible substrate 318, an element substrate 317, a channel unit 316, and a sealing member 312. The flexible substrate 318 includes wiring 313. The circuit substrate 303 corresponds to the circuit substrate 103 (see Figure 1 and Figure 2 ). The flexible substrate 318 corresponds to the flexible substrate 108 (see Figure 1 and Figure 2 ). The wiring 313 corresponds to the wiring 203 (see Figure 2 ). The element substrate 317 corresponds to the element substrate 107 (see Figure 1 and Figure 2 ). Channel unit 316 corresponds to channel unit 106 (see Figure 1 and Figure 2 ). The sealing member 312 corresponds to the sealing member 202 (see Figure 2 ).

[0044] In this comparative example, the end portion of the flexible substrate 318 is connected to the end portion of the circuit substrate 303. Then, the flexible substrate 318 is bent from the back surface (surface facing the -Y direction) of the channel unit 316 along the bottom surface (surface facing the -Z direction).

[0045] In addition, the element substrate 317 has an electrical connection portion as provided in the present embodiment. On the bottom surface portion of the liquid ejection head 310, the wiring 313 is in a state of extending along the depth direction (Y direction) of the channel unit 316 and changing its orientation along the width direction (X direction) of the channel unit 316. That is, on the flexible substrate 318 of the present comparative example, each individual wiring 313 is not arranged along the extension direction of the flexible substrate 318, and therefore, an additional area in which the wiring 313 changes its orientation becomes necessary compared to the flexible substrate 108 of the present embodiment. Therefore, the width 31 of the bottom surface of the channel unit 316 on which the element substrate 317 is provided becomes larger than the width W2 of the channel unit 106 (see Figure 2 ), and therefore, the size of the liquid ejection head 310 is likely to become large.

[0046] Figure 3B 3 is a schematic diagram showing a liquid ejection head 320 in a second comparative example. Figure 3A )'s construction is the same as that of the previous one, and the differences are mainly explained.

[0047] like Figure 3B As shown, the liquid ejection head 320 includes a circuit substrate 333, a flexible substrate 328, an element substrate 327, a channel unit 326, and a sealing member 322. The flexible substrate 328 includes a wiring 323. The circuit substrate 333 corresponds to the circuit substrate 103 (see Figure 1 and Figure 2 ). The flexible substrate 328 corresponds to the flexible substrate 108 (see Figure 1 and Figure 2 ). The wiring 323 corresponds to the wiring 203 (see Figure 2 ). The element substrate 327 corresponds to the element substrate 107 (see Figure 1 and Figure 2 ). Channel unit 326 corresponds to channel unit 106 (see Figure 1 and Figure 2 ). The sealing member 322 corresponds to the sealing member 202 (see Figure 2 ).

[0048] In the present comparative example, the electrical connection portion of the element substrate 327 is arranged in the lateral direction (X direction) at both end portions in the longitudinal direction of the element substrate 327. As a result, the wiring 323 connected to the electrical connection portion arranged on the front side (the side in the -Y direction) of the center of the element substrate 327 is arranged linearly.

[0049] However, the wiring 323 connected to the electrical connection portion provided on the rear side (the side in the +Y direction) of the center of the element substrate 327 extends toward the depth direction (Y direction) of the channel unit 326. Then, the wiring 323 changes its orientation in the lateral direction (X direction), and then changes its orientation again toward the depth direction (Y direction). That is, on the flexible substrate 328 of the present comparative example, each individual wiring 323 is not arranged along the extension direction of the flexible substrate 328, and therefore, an additional area in which the wiring 313 changes its orientation becomes necessary compared to the flexible substrate 108 of the present embodiment. Therefore, the width W32 of the bottom surface of the channel unit 326 on which the element substrate 327 is provided becomes larger than the width W2 of the channel unit 106 (see Figure 2 ), and therefore, the size of the liquid ejection head 320 is likely to become large.

[0050] Figure 4A and Figure 4B 2 are schematic cross-sectional views of the liquid ejecting head 100 in this embodiment. Figure 4A and Figure 4B In FIG. 1 , the liquid ejection head 100 is shown in a state of being mounted on a liquid ejection device. Figure 4A In the embodiment, the liquid ejection head 100 is cut along a cutting line passing through the Y-axis and the Z-axis. Figure 4B In the embodiment, the liquid ejection head 100 is cut by a cutting line passing through the X-axis and the Z-axis.

[0051] like Figure 4A As shown, in the top surface portion of the cover 104, a second opening 401 is formed. The sub-tank 105 is provided with a supply port 402 through which liquid is supplied from the main tank (not schematically shown). The supply port 402 is provided inside the second opening 401. The circuit substrate 103 is provided with a third opening 403.

[0052] The base member 102 is provided with a fourth opening 404 and a sixth opening 414, and a portion of the channel unit 106 passes through the fourth opening (see Figure 4B). The channel unit 106 is provided with a supply channel 406 connected to the sub-tank 105. The supply channel 406 is formed to pass through the third opening 403 and the fourth opening 404. On the top surface of the circuit substrate 103, an electrical connection portion 407 (specifically, a plurality of terminals) is provided, to which the end portion of the flexible substrate 108 is connected. The flexible substrate 108 and the element substrate 107 are connected via the wire 408. The wire 408 is sealed by the sealing member 202.

[0053] In a state where the liquid ejection head 100 is mounted on a liquid ejection device, the top surface of the circuit substrate 103 is arranged parallel to the bottom surface of the element substrate 107 in which ejection ports capable of ejecting liquid are formed.

[0054] The flexible substrate 108 is arranged to pass through the first opening 201 provided in the circuit substrate 103 from the electrical connection portion 407 provided on the top surface of the circuit substrate 103, and through the fifth opening 405 provided in the base member 102. The flexible substrate 108 is arranged along the side and bottom surfaces of the channel unit 106, and is connected to the wire 408. The terminal of the flexible substrate 108 and the terminal provided for the element substrate 107 are connected by wire bonding using the wire 408.

[0055] In the case of performing printing by the liquid ejection head 100, the liquid for printing is supplied from the main tank (not schematically shown) to the sub-tank 105 via the supply port 402. In the sub-tank 105, the liquid is temporarily stored. In a state where the sub-tank 105 is contained in the liquid ejection head 100, the sub-tank 105 is arranged above the circuit substrate 103 in the vertical direction. The liquid stored in the sub-tank 105 is supplied to the element substrate 107 via the supply channel 406.

[0056] When an ejection signal for ejecting liquid is transmitted to the energy generating element provided on the element substrate 107 via the flexible substrate 108 and the wire 408 , the liquid is ejected from the ejection port.

[0057] like Figure 4B As shown in FIG. 1 , a first connector 410 is provided on the top surface of the circuit substrate 103, which is capable of connecting the electrical connection member 109 for transmitting an electrical signal (e.g., an ejection signal) transmitted from the main body of the liquid ejection device to the circuit substrate 103. In the present embodiment, the first connector 410 is provided only on the top surface of the circuit substrate 103 facing the direction (+Z direction) opposite to the direction (-Z direction) facing the ejection port surface of the element substrate 107.

[0058] In addition, in the present embodiment, the liquid ejection head 100 is configured to circulate liquid inside it so as to obtain stable ejection performance even when the viscosity of the liquid becomes high. Inside the sub-tank 105, a pump (not schematically shown) for sucking and circulating the liquid is provided. An original signal for driving the pump is generated by a pump control unit (e.g., the above-mentioned CPU, not schematically shown). The original signal is input from the main body of the liquid ejection device to the first connector 410 provided on the top surface of the circuit substrate 103 via the electrical connection member 109.

[0059] On the circuit substrate 103, the original signal is transmitted to the second connector 412 provided on the top surface of the circuit substrate 103 via the circuit provided on the circuit substrate 103. In a state where the wire harness 411 is connected to the second connector 412, the original signal is transmitted to the pump provided inside the sub-tank 105 via the wire harness 411. The wire harness 411 can be attached to and detached from the second connector 412.

[0060] As described above, the liquid ejection head 100 can be attached to and detached from the liquid ejection device. At a point in time before the liquid ejection head 100 is mounted on the liquid ejection device, each of the electrical connection member 109 and the wiring harness 411 is in a state of not being connected to each of the first connector 410 and the second connector 412. In a case where the liquid ejection head 100 is mounted on the liquid ejection device, the electrical connection member 109 is connected to the first connector 410. Specifically, the end portion of the electrical connection member 109 is inserted into the insertion portion of the first connector 410. In a case where the liquid ejection head 100 is removed from the liquid ejection device, the end portion of the electrical connection member 109 is pulled out from the insertion portion of the first connector 410.

[0061] In addition, when the liquid ejection head 100 is mounted on the liquid ejection device, the wire harness 411 is connected to the second connector 412. Specifically, the end portion of the wire harness 411 is inserted into the insertion portion of the second connector 412. When the liquid ejection head 100 is removed from the liquid ejection device, the end portion of the wire harness 411 is pulled out from the insertion portion of the second connector 412.

[0062] In the channel unit 106, a collecting channel 413 is formed for collecting liquid from the element substrate to the sub-tank 105 in the case of liquid circulation. The collecting channel 413 is formed to pass through a sixth opening 414 provided in the base member 102 and a seventh opening 415 provided in the circuit substrate 103. The sub-tank 105 and the channel unit 106 are connected to each other via the supply channel 406 and the collecting channel 413.

[0063] According to such a configuration, in the case where a drive signal for driving the pump is input to the first connector 410 via the electrical connection member 109, the drive signal is transmitted to the second connector 412 via the circuit provided on the circuit substrate 103. Then, the drive signal is transmitted to the pump via the harness 411. In the case where the pump is driven by the drive signal, the liquid is supplied from the pump to the element substrate 107 via the supply channel 406, and is collected from the element substrate 107 to the pump via the collection channel 413.

[0064] In the present embodiment, the first connector 410 is located in a relatively narrow space inside the liquid ejection head 100. Therefore, the user must perform the attaching / detaching work of the electrical connecting member 109 for the first connector 410 in the narrow space. Due to this, convenience of the attaching / detaching work is required.

[0065] Therefore, in the present embodiment, the first connector 410 is used, and in a state where the liquid ejection head 100 is mounted on the liquid ejection device, the first connector linearly extends in a vertically upward direction from the top surface of the circuit substrate 103. Then, the electrical connection member 109 is linearly connected to the linear type first connector 410 in a vertically downward direction from above. According to such a configuration, the electrical connection member 109 can be connected to the first connector 410 without any complicated work.

[0066] Furthermore, in the present embodiment, the work of connecting the harness 411 to the second connector 412 is performed after assembling the sub-tank 105. Therefore, after assembling the sub-tank 105, the second connector 412 is located in a relatively narrow space inside the liquid ejection head 100. Therefore, the user must perform the attachment / detachment work of the harness 411 for the second connector 412 in this narrow space. Therefore, the convenience of this attachment / detachment work is also required.

[0067] Therefore, in the present embodiment, the second connector 412 is used, and in a state where the liquid ejection head 100 is mounted on the liquid ejection device, the second connector extends linearly in a vertically upward direction from the top surface of the circuit substrate 103. Then, the wire harness 411 is linearly connected to the second connector 412 in a vertically downward direction from above. According to such a configuration, the wire harness 411 can be connected to the second connector 412 without any complicated work.

[0068] Furthermore, in the present embodiment, the first connector 410 and the second connector 412 are arranged at each of the two end portions of the circuit substrate 103, and a space for extending the electrical connection member 109 and the wiring harness 411 is ensured above in the vertical direction. Therefore, by connecting the electrical connection member 109 and the wiring harness 411 in the vertical direction, both the convenience of the attachment / detachment work and the size reduction of the liquid ejection head can be achieved at the same time.

[0069] like Figure 4B As shown, it is preferred that the first connector 410 and the second connector 412 are provided at the end portion in the conveying direction (Y direction) on the top surface of the circuit substrate 103. That is, on the top surface of the circuit substrate 103, the first connector 410 and the second connector 412 are preferably provided at the end portion in the direction (Y direction) intersecting the direction (X direction) in which the liquid ejection head 100 scans in the plane. The reason is that, compared with the case where the operator approaches the first connector 410 and the second connector 412 from the scanning direction, the possibility of the operator (i.e., the user) interfering with the carriage is reduced in the case where the operator approaches the first connector 410 and the second connector 412 from the conveying direction.

[0070] Figure 5 FIG. 1 is a top view of a circuit substrate 103 that can be applied to the present embodiment.

[0071] like Figure 5 As shown, on the top surface of the circuit substrate 103, an electrical connection portion and an electrical component mounting portion are provided. In the present embodiment, as the electrical connection portion, an electrical connection portion 407, a first connector 410, and a second connector 412 are provided. As the electrical component mounting portion, a storage device 501 and a pump drive circuit 502 are provided, the storage device being configured to record information related to the liquid ejection head 100, and the pump drive circuit being configured to generate a drive signal by converting an original signal for driving the pump into a drive signal. As described above, in the present embodiment, all electrical connection portions and all electrical component mounting portions are concentrated on the top surface of the circuit substrate 103.

[0072] In addition, in the circuit substrate 103, a third opening 403 through which a supply channel 406 (see FIG. 4 ) passes and a seventh opening 415 through which a collection channel 413 (see FIG. 4 ) passes are formed. Preferably, an electrical connection portion 407 configured to connect the flexible substrate 108 and the circuit substrate 103 is sealed by a sealing member (not schematically shown). According to such a configuration, electrical safety can be maintained.

[0073] As described above, according to the liquid ejecting head of the present embodiment, the liquid ejecting head can be easily mounted on the liquid ejecting apparatus.

[0074] Furthermore, it is possible to achieve size reduction and suppress cost increase as compared with a liquid ejection head in which an electrical connection portion and an electrical part mounting portion are provided on the top and bottom surfaces of a circuit substrate.

[0075] Furthermore, the electrical connection portion and the electrical parts mounting portion are concentrated on the top surface of the circuit substrate 103, and therefore, it is also possible to suppress an increase in cost during production and reduce the time required for work.

[0076] Furthermore, in the event of liquid leakage from the channel, it is necessary to prevent the liquid from reaching the electrical component mounting portion, but the range that the user must approach can be limited to the top surface by concentrating the electrical component mounting portion on the top surface of the circuit substrate 103. That is, in the event of liquid leakage, it is easier to take countermeasures against leakage than in a liquid ejecting head in which the electrical connection portion and the electrical component mounting portion are provided on the top and bottom surfaces of the circuit substrate.

[0077] [Second embodiment]

[0078] The purpose of this embodiment is to provide a technology that can easily install a liquid ejection head on a liquid ejection device even when the liquid ejection head becomes longer. In the following, the explanation of the configuration that is the same or corresponding to the first embodiment is omitted by using the same symbols and names, and the parts that are different from the first embodiment are mainly explained.

[0079] Figure 6 : is a schematic perspective view showing a part of a second liquid ejection head 600 which can be applied to the present embodiment.

[0080] like Figure 6 As shown in FIG. 1 , two element substrates 107 are arranged in a staggered pattern along the direction (Y direction) in which the ejection port array extends on the bottom surface of the one channel unit 106. The two element substrates 107 are arranged to be point-symmetrical with respect to a center point 601 located at the center of the bottom surface of the channel unit 106. In this embodiment, because the two element substrates 107 are used, two flexible substrates 108 are used.

[0081] One of the two flexible substrates 108 is provided for each of the two element substrates 107. An end portion of each of the two flexible substrates 108 is connected to an electrical contact portion of the element substrate 107 as in the first embodiment.

[0082] Fig. 7A is along Figure 6 Cross-sectional view of VIIA-VIIA.

[0083] like Fig. 7A As shown, one of the two flexible substrates 108 is connected to one of the two electrical connection portions 407 provided on the top surface of the circuit substrate 103 ( Fig. 7A , the electrical connection portion 407 at the left end portion). The flexible substrate 108 passes through Fig. 7AThe flexible substrate 108 passes through the first opening 201 and the fifth opening 405 on the left side of the channel unit 106 and is pulled out under the circuit substrate 103. Then, the flexible substrate 108 extends along the left side surface (the surface facing the -X direction) of the channel unit 106, is bent by about 90° so as to extend along the bottom surface, and is connected to one of the two element substrates 107 arranged on the bottom surface of the channel unit 106 via the wire 408.

[0084] Figure 7B is along Figure 6 Cross-sectional view of VIIB-VIIB.

[0085] As described above, the two element substrates 107 are arranged to be point symmetrical with respect to the center point 601 (see Figure 6 Therefore, the two electrical connection parts 407 are also arranged to be point symmetrical with respect to the center point 601 (see Figure 6 ). Therefore, each of the two flexible substrates 108 is pulled out from each of the two electrical connection portions 407 in directions opposite to each other.

[0086] like Figure 7B As shown, the other of the two flexible substrates 108 is connected to the other of the two electrical connection portions 407 disposed on the top surface of the circuit substrate 103 ( Figure 7B , the electrical connection portion 407 at the right end portion). The flexible substrate 108 passes through Figure 7B The flexible substrate 108 is formed by passing through the first opening 201 and the fifth opening 405 on the right side of the channel unit 106 and is pulled out under the circuit substrate 103. Then, the flexible substrate 108 extends along the right side surface (the surface facing the +X direction) of the channel unit 106, is bent by about 90° so as to extend along the bottom surface, and is connected to the other of the two element substrates 107 arranged on the bottom surface of the channel unit 106 via the wire 408.

[0087] Figure 8 FIG. 1 is a top view of a circuit substrate 103 that can be applied to the present embodiment.

[0088] like Figure 8 As shown, on the top surface of the circuit substrate 103 of the present embodiment, on the two element substrates 107 (see Figure 6 ) are provided at positions corresponding to the positions of each element substrate in the two flexible substrates 108. Figure 6 ) passes through each of the two first openings 201 and is connected to each of the two electrical connection portions 407 provided on the top surface of the circuit substrate 103.

[0089] As in the first embodiment, also in this embodiment, the electrical connection portion and the electrical parts mounting portion are concentrated on the top surface of the circuit substrate 103. That is, the first connector 410, the second connector 412, the storage device 501, and the pump drive circuit 502 are provided only on the top surface of the circuit substrate 103. The first connector 410, the second connector 412, the storage device 501, and the pump drive circuit 502 are not provided on the lower surface of the circuit substrate 103. With such a configuration, the same effects as those in the first embodiment can also be obtained.

[0090] As explained above, in this embodiment, the independent unit 101 is extended by arranging two element substrates 107 in a staggered pattern. As described above, by including a plurality of common configurations for the one independent unit 101, a second liquid ejection head 600 that is relatively inexpensive and has relatively high functionality can be provided.

[0091] In the present embodiment, the circuit substrate 103 is arranged so that the top surface of the circuit substrate 103 is parallel to the ejection port surface, and the electrical contact portion and the electrical parts mounting portion are provided only on the top surface of the circuit substrate 103. Therefore, a second liquid ejection head 600 that is compact and can be easily attached and detached can be provided.

[0092] In the present embodiment, four channel units 106 in which two element substrates 107 are arranged in a staggered pattern are used, but the number of channel units 106 is not limited to four. In addition, the number of element substrates 107 arranged in a staggered pattern is not limited to two for the one channel unit 106. That is, any number of channel units 106 and element substrates 107 may be used.

[0093] [Other embodiments]

[0094] In the first and second embodiments, the individual unit 101 is configured to be able to eject a single color of ink. However, assuming that the liquids are not mixed within the one individual unit 101, a plurality of types of liquids may be ejected from the one individual unit 101.

[0095] Furthermore, four or more independent units 101 may be arranged in the X direction (scanning direction) and the Y direction (transportation direction). That is, the four or more independent units 101 do not have to be arranged in a line.

[0096] According to the liquid ejection head of the present disclosure, the liquid ejection head can be easily mounted on the liquid ejection apparatus.

[0097] Although the present disclosure has been described with reference to exemplary embodiments, it is to be understood that the present disclosure is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. A liquid ejection head, comprising: a storage unit configured to store a liquid; an element substrate having an ejection port surface in which ejection ports for ejecting the liquid stored in the storage unit are formed; as well as A circuit substrate which electrically relays the liquid ejection device and the element substrate, wherein In the posture where the liquid ejecting head is mounted on the liquid ejecting device, the circuit substrate is located above the element substrate in the vertical direction, The end portion of the circuit substrate in the longitudinal direction is provided with a connector for electrically connecting to an electrical connection member included in the liquid ejection device, and On the circuit substrate, the connector is provided only on the top surface facing in a direction opposite to the ejection port surface.

2. The liquid ejecting head according to claim 1, wherein In the posture where the liquid ejection head is mounted on the liquid ejection device, the circuit substrate and the element substrate are arranged horizontally, and The connector receives vertical downward insertion of the electrical connection member.

3. The liquid ejecting head according to claim 1 or 2, further comprising: a channel unit configured to fluidically connect the storage unit and the element substrate; as well as A flexible substrate electrically connects the element substrate and the circuit substrate, wherein The liquid ejecting head ejects liquid while moving in a scanning direction, and The flexible substrate is arranged in a state of being bent along a side surface facing a scanning direction of the channel unit and a bottom surface on which the element substrate is disposed.

4. The liquid ejecting head according to claim 3, wherein In the circuit substrate, a first opening is provided for the flexible substrate to pass through, and The flexible substrate is arranged to pass through the first opening.

5. The liquid ejecting head according to claim 3, wherein The channel unit is arranged to pass through a second opening provided in the circuit substrate.

6. The liquid ejection head according to claim 1, wherein The connector receives vertically downward insertion of the electrical connection member corresponding to the connector in a state in which the liquid ejection head is mounted on the liquid ejection device.

7. The liquid ejection head according to claim 1, further comprising: A sealing unit is configured to seal an electrical connection portion in the liquid ejection head.

8. The liquid ejection head according to claim 3, wherein On the top surface, the connector is provided at an end portion in a direction intersecting the scanning direction.

9. The liquid ejection head according to claim 3, further comprising: A pump capable of sucking a liquid, wherein The channel unit includes a first channel for supplying liquid from the storage unit to the element substrate and a second channel for collecting liquid from the element substrate to the storage unit, and When the pump is driven, liquid circulates between the pump and the element substrate.

10. The liquid ejection head according to claim 1, further comprising: a channel unit configured to fluidically connect the storage unit and the element substrate, wherein The channel unit includes a first channel for supplying liquid from the storage unit to the element substrate and a second channel for collecting liquid from the element substrate to the storage unit, and The storage unit includes a liquid storage chamber and a pump for circulating the liquid between the storage chamber and the element substrate.

11. The liquid ejection head according to claim 10, wherein The circuit substrate has a circuit for converting an original signal for driving the pump into a driving signal, and The connector includes a connector for receiving the original signal and a connector for transmitting the driving signal.

12. The liquid ejection head according to claim 11, wherein A connector for transmitting the driving signal is provided so as to be able to receive vertically downward insertion of a wiring harness transmitting the driving signal.

13. The liquid ejection head according to claim 11, wherein On the top surface, a connector for transmitting the drive signal is provided at an end portion in a direction intersecting the scanning direction in a plane.

14. The liquid ejection head according to claim 10, wherein A connector for receiving the original signal is provided at one end in the longitudinal direction of the circuit substrate, and A connector for transmitting the drive signal is provided at the other end of the circuit substrate in the longitudinal direction.

15. The liquid ejection head according to claim 10, further comprising: a pump control unit capable of generating a drive signal for driving the pump, wherein The pump control unit is provided only on the top surface.

16. The liquid ejecting head according to claim 3, comprising: a plurality of said storage units; a plurality of the element substrates; and A plurality of channel units are configured to connect each of the plurality of storage units and each of the plurality of element substrates, wherein The one circuit substrate is provided with each of the plurality of the memory cells, each of the plurality of the element substrates, and each of the plurality of the channel units.

17. The liquid ejection head according to claim 16, wherein The element substrate corresponding to each of the plurality of the memory cells is provided.

18. The liquid ejection head according to claim 16, wherein Each of the plurality of element substrates is arranged in a staggered pattern along a direction intersecting the scanning direction.

19. A liquid ejection device, comprising: Liquid injection head; as well as a conveying unit capable of conveying the printing medium along a conveying direction, The liquid ejection head has: a storage unit configured to store liquid; an element substrate having an ejection port surface in which ejection ports for ejecting the liquid stored in the storage unit are formed; and a circuit substrate which electrically relays the liquid ejection device and the element substrate, wherein the circuit substrate is located above the element substrate in the vertical direction in a posture in which the liquid ejection head is mounted on the liquid ejection device, The end portion of the circuit substrate in the longitudinal direction is provided with a connector for electrically connecting to an electrical connection member included in the liquid ejection device, and On the circuit substrate, the connector is provided only on the top surface facing in a direction opposite to the ejection port surface.

20. The liquid ejection device according to claim 19, further comprising: A moving unit is configured to move the liquid ejecting head along a scanning direction.

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