Dispensing process method suitable for dispensing medium-viscosity glue to dense cavity and removing bubbles

In the medium viscosity glue dispensing process, the glue is first pre-dispensed and the glue fills the gap from bottom to top, exhausts air, and then performs secondary dispensing and curing, the problem of removing bubbles of medium viscosity glue dispensing is solved, achieving high quality of product appearance and improving the bonding effect.

CN119687079APending Publication Date: 2025-03-25HANGZHOU CMR POLYMAGNET CO LTD
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Patent Information

Application Number
CN202411856081.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-17
Publication Date
2025-03-25

AI Technical Summary

Technical Problem

The prior art is difficult to remove bubbles into the dense cavity when using medium viscosity glue, resulting in bubble formation after curing, affecting the appearance and use feeling of the product.

Method used

A dispensing process is adopted. First, an appropriate amount of glue is placed into the cavity of the part to assemble the core parts, and the core and parts are closely fitted through magnetic adsorption or mechanical force. The glue is left to fill the gap from bottom to top, extrude air, and dispense and cure again to form a sealing effect.

Benefits of technology

Through this process, the formation of gap bubbles can be effectively avoided, the appearance quality of the product can be improved, the glue surface is smooth and bubble-free, and the adhesion is good, so as to avoid air leakage caused by peeling.

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Abstract

The invention discloses a dispensing process method suitable for dispensing medium-viscosity glue into a dense cavity to remove bubbles. The dispensing process method comprises the following steps that firstly, glue is pre-dispensed in a part; then the core body is loaded into a part, glue at the bottom is extruded, a gap between the core body and the part is filled with the glue from bottom to top, and air in the gap is exhausted; then top dispensing is conducted, top glue is self-leveled and connected with bottom glue at the edge, and the phenomenon that air trapping is formed due to the fact that the top glue is directly filled downwards along peripheral gaps and extrudes air, and air bubbles exist on the top glue face due to the fact that the glue viscosity is high and trapped air cannot be directly discharged is avoided; and standing the dispensed product for several minutes, enabling the product to enter a UV furnace for preliminary curing after the glue flow is leveled, and further curing at room temperature. The magnetic component product dispensed by the dispensing and curing process is good in air tightness, smooth in dispensing surface, free of pits and bubbles, free of cracks between glue and the surface of the product, good in bonding force and good in product appearance, and the phenomenon of air leakage caused by stripping of the glue and the surface of the product in a working environment is avoided.
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