Spheronization processing eccentricity detection device and method, and spheronization processing equipment

Abstract

The present disclosure provides a spheroidization processing eccentricity detection device and method and a spheroidization processing equipment. The device comprises a crystal bar clamping unit, a support unit arranged on the crystal bar clamping unit, a moving unit connected with the support unit and movable along the axial direction of the crystal bar, a distance measuring unit arranged on the moving unit and having a measuring end facing the crystal bar, capable of measuring the distance from the measuring end to an obstacle in a first direction, the first direction being a direction perpendicular to the axial direction of the crystal bar, and a control unit for moving the distance measuring unit to a first target position, controlling the distance measuring unit to measure the distance from the measuring end to the surface of the crystal bar during the rotation of the crystal bar, and obtaining the eccentricity information of the crystal bar according to the distance data, the eccentricity information including at least one of the maximum eccentricity and the maximum eccentric position. The spheroidization processing eccentricity detection device and method and the spheroidization processing equipment can reduce the eccentricity correction time.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, and in particular to a device and method for detecting eccentricity of a rounding process, and a rounding process equipment. BACKGROUND

[0002] With the increasing demand for epitaxial wafers, the quality of the crystal bar used as the substrate is also required to be higher. The single crystal silicon bar produced by crystal pulling will be rounded, truncated and cut before wafer processing. The rounding process is to process the crystal bar with different diameters into a crystal bar with the same diameter.

[0003] After the crystal bar is rounded, the true circularity of the entire crystal bar must meet the requirements. The rounding process of the crystal bar is usually completed by a rounding machine, which is provided with a crystal bar head chuck and a crystal bar tail chuck. In order to meet the true circularity requirements of the crystal bar after processing, the coaxiality of the center of the crystal bar and the head chuck and tail chuck of the crystal bar must meet the standard when the crystal bar is loaded. If the coaxiality of the center of the crystal bar and the head chuck and tail chuck of the crystal bar is eccentric, the crystal bar after rounding will be elliptical. Therefore, the eccentricity of the crystal bar needs to be measured before the rounding process.

[0004] In the prior art, a diameter measuring device is used to measure the eccentricity of the crystal bar. After the crystal bar is loaded, the head chuck and the tail chuck are used to clamp and rotate the crystal bar, and the rotation center is fixed. Two positions are measured at the head and tail positions of the crystal bar, respectively, to obtain four diameter values. Assuming that the maximum diameter value among the four diameter values is D1 and the minimum diameter value is D2, the eccentricity is (D1-D2) / 2. The eccentricity is calculated according to the above formula, and the maximum eccentricity is taken as the eccentricity value of the crystal bar.

[0005] However, the above-mentioned eccentricity measurement method can only determine the eccentricity value of the crystal bar, but cannot accurately determine the maximum eccentricity value and the maximum eccentricity position, which leads to the need to find the maximum eccentricity position and the eccentricity again when correcting the eccentricity, and further leads to a long eccentricity correction time, low work efficiency and low equipment utilization rate. SUMMARY

[0006] To solve at least one of the above technical problems in the prior art, the present application provides a device and method for detecting eccentricity of a rounding process, and a rounding process equipment.

[0007] The technical solutions provided by the embodiments of the present application are as follows:

[0008] In a first aspect, the embodiments of the present application provide a device for detecting eccentricity of a rounding process, comprising:

[0009] A crystal bar clamping unit, comprising a head clamping member for clamping a head of a crystal bar and a tail clamping member for clamping a tail of the crystal bar, the crystal bar clamping unit being configured to clamp and rotate the crystal bar;

[0010] A support unit arranged on the head clamping member and / or the tail clamping member;

[0011] A moving unit connected with the support unit and movable relative to the crystal bar along an axial direction of the crystal bar; and

[0012] A distance measuring unit arranged on the moving unit, a measuring end of the distance measuring unit facing the crystal bar, the distance measuring unit being configured to measure a distance from the measuring end to an obstacle in a first direction, the first direction being perpendicular to the axial direction of the crystal bar;

[0013] A control unit connected with the crystal bar clamping unit, the moving unit and the distance measuring unit respectively, the control unit being configured to:

[0014] control the moving unit to move the distance measuring unit to a first target position corresponding to a position of the axial direction of the crystal bar, control the head clamping member and the tail clamping member to clamp and rotate the crystal bar, and obtain eccentric information of the crystal bar according to distance data measured by the distance measuring unit during the rotation of the crystal bar, the eccentric information including at least one of a maximum eccentricity and a maximum eccentric position.

[0015] Illustratively, the moving unit comprises:

[0016] a driving cylinder; and

[0017] a telescopic rod, an axial direction of the telescopic rod being parallel to the axial direction of the crystal bar; wherein

[0018] an axial first end of the telescopic rod is in driving connection with the driving cylinder, an axial second end of the telescopic rod being axially telescopic relative to the axial second end under the driving of the driving cylinder, the distance measuring unit being mounted to the axial second end.

[0019] Illustratively, the distance measuring unit comprises a distance sensor.

[0020] Illustratively, the support unit is configured to drive the moving unit and the distance measuring unit to be movable relative to the crystal bar along the first direction.

[0021] Illustratively, the control unit is configured to:

[0022] control the moving unit to move the distance measuring unit to a second target position, the second target position being a preset position of the distance measuring unit outside the axial direction of the crystal bar;

[0023] controlling the ranging unit to obtain a reference distance L0 when the ranging unit is located at the second target position, the reference distance L0 being a distance from the ranging unit to the head clamp or the tail clamp in the first direction;

[0024] controlling the moving unit to move the ranging unit to the first target position;

[0025] controlling the head clamp and the tail clamp to clamp and rotate the crystal bar by one revolution when the ranging unit is located at the first target position, and controlling the ranging unit to measure a distance at every predetermined rotation angle during the rotation of the crystal bar to obtain N distance data Li;

[0026] obtaining eccentric information of the crystal bar according to the N distance data Li.

[0027] Exemplarily, the control unit is configured to:

[0028] calculating a difference between each distance data Li and the reference distance L0 to obtain N distance difference values ΔLi;

[0029] comparing the N distance difference values ΔLi to obtain a maximum distance difference value ΔLimax and a minimum distance difference value ΔLimin;

[0030] obtaining an eccentricity ΔL according to the maximum distance difference value ΔLimax and the minimum distance difference value ΔLimin;

[0031] determining a rotation angle of the crystal bar corresponding to the maximum distance difference value ΔLimax according to a corresponding relationship between the distance data Li and the rotation angle to determine a maximum eccentric position of the crystal bar.

[0032] In a second aspect, the present disclosure provides a method for detecting eccentricity in a rounding process, applied to the device for detecting eccentricity in a rounding process as described above, and the method comprises:

[0033] controlling the moving unit to move the ranging unit to a first target position corresponding to an axial position of the crystal bar;

[0034] controlling the head clamp and the tail clamp to clamp and rotate the crystal bar;

[0035] during the rotation of the crystal bar,

[0036] obtaining eccentric information of the crystal bar according to distance data measured by the ranging unit, wherein the eccentric information comprises at least one of a maximum eccentricity and a maximum eccentric position.

[0037] Exemplarily, the method specifically comprises:

[0038] controlling the moving unit to move the ranging unit to a second target position, the second target position being a preset position outside the axial direction of the crystal bar;

[0039] controlling the ranging unit to obtain a reference distance L0 when the ranging unit is at the second target position, the reference distance L0 being a distance from the ranging unit to the head clamp or the tail clamp in the first direction;

[0040] controlling the moving unit to move the ranging unit to the first target position;

[0041] controlling the head clamp and the tail clamp to clamp and rotate the crystal bar by one revolution, and controlling the ranging unit to measure the distance at a predetermined rotation angle interval during the rotation of the crystal bar to obtain N distance data Li when the ranging unit is at the first target position;

[0042] obtaining the eccentricity information of the crystal bar according to the N distance data Li.

[0043] For example, the obtaining the eccentricity information of the crystal bar according to the N distance data Li comprises:

[0044] calculating the difference between each distance data Li and the reference distance L0 respectively to obtain N distance difference values ΔLi;

[0045] comparing the N distance difference values ΔLi to obtain a maximum distance difference value ΔLimax and a minimum distance difference value ΔLimin;

[0046] obtaining an eccentricity value ΔL according to the maximum distance difference value ΔLimax and the minimum distance difference value ΔLimin;

[0047] determining the rotation angle of the crystal bar corresponding to the maximum distance difference value ΔLimax according to the corresponding relationship between the distance data Li and the rotation angle to determine the maximum eccentric position of the crystal bar.

[0048] In a third aspect, the embodiments of the present disclosure further provide a rounding processing device, which comprises the rounding processing eccentricity detection device as described above.

[0049] The advantageous effects brought by the embodiments of the present disclosure are as follows:

[0050] The eccentricity detection device and method for rounding processing and the rounding processing equipment provided by the embodiments of the present disclosure are characterized in that: a moving unit is installed on a crystal bar clamping unit clamping the head and tail of a crystal bar through a support unit, and a distance measuring unit is installed on the moving unit, the distance measuring unit can be moved to a first target position corresponding to a predetermined position on the axial direction of the crystal bar through the moving unit, and the head clamping piece and the tail clamping piece are used to clamp and rotate the crystal bar, the distance from the measuring end to the surface of the crystal bar can be measured through the distance measuring unit during the rotation of the crystal bar, and the eccentricity information of the crystal bar can be obtained according to the distance data measured by the distance measuring unit, wherein the eccentricity information includes at least one of the maximum eccentricity and the maximum eccentric position. In this way, the distance from the measuring unit to the circumferential surface of the crystal bar can be obtained through the eccentricity detection device for rounding processing during the circumferential movement of the crystal bar, a series of distance data at different rotation angles at the same or different axial position points of the crystal bar can be obtained, the maximum eccentricity and the maximum eccentric position can be obtained at the same time according to the series of distance data, the eccentricity of the crystal bar can be corrected more quickly, the eccentricity correction time is reduced, the true circularity of the crystal bar after rounding processing is ensured, and the work efficiency and the effective operation rate of the equipment are improved. BRIEF DESCRIPTION OF DRAWINGS

[0051] Figure 1 FIG. 1 shows a structure schematic diagram of the eccentricity detection device for rounding processing in the embodiments of the present disclosure when measuring a reference distance;

[0052] Figure 2 FIG. 2 shows a structure schematic diagram of the eccentricity detection device for rounding processing in the embodiments of the present disclosure when measuring distance data;

[0053] Figure 3 FIG. 3 shows a structure schematic diagram of the eccentricity detection device for rounding processing in the embodiments of the present disclosure; Figure 1 FIG. 4 shows a cross-sectional view of the eccentricity detection device for rounding processing in the embodiments of the present disclosure in A-A direction. DETAILED DESCRIPTION

[0054] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of, rather than all of, the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without any creative effort belong to the scope of protection of the present disclosure.

[0055] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the ordinary meaning as understood by a person having ordinary skill in the art to which the present disclosure pertains. The terms "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used to distinguish different components. Similarly, the terms "one", "a", or "the" do not denote a quantity restriction, but mean that at least one exists. The terms "include", "comprise", and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms "connect" or "connected" or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "upper", "lower", "left", "right", and the like are used only to represent relative positional relationships, and when the absolute positions of the described objects are changed, the relative positional relationships can also be changed accordingly.

[0056] The features "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the strict "parallel", "perpendicular", "same" and the "approximately parallel", "approximately perpendicular", "approximately same" with a certain tolerance, which, considering the measurement and the tolerance related to the measurement of a specific value (for example, the limitation of the measurement system), represents the acceptable deviation range for the specific value determined by a person having ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0057] In addition, in this document, unless otherwise defined, the terms "substantially", "essentially", "approximately", and "about" are used to describe and account for small variations. When used with an event or circumstance, these terms can encompass the event or circumstance exactly occurring, or the event or circumstance approximately occurring. For example, when used with a numerical value, these terms can include a range of variation of the numerical value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can mean that two surfaces are arranged along the same plane within the micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm along the same plane.

[0058] The spheroidization processing eccentricity detection device provided by the embodiments of the present disclosure can include a crystal bar clamping unit 100, a support unit 200, a moving unit 300, a distance measuring unit 400, and a control unit (not shown in the figure).

[0059] The head and tail of the crystal bar 10 can be clamped by the crystal bar clamping unit 100 during the rounding process. As shown in Figure 1 and Figure 2 The crystal bar clamping unit 100 can include a head clamping part 110 and a tail clamping part 120. The crystal bar clamping unit 100 in the rounding process eccentricity detection device in the embodiment of the present disclosure can be a crystal bar clamping unit in the rounding process equipment. The head clamping part 110 is used to clamp the head of the crystal bar 10, and the tail clamping part 120 can be used to clamp the tail of the crystal bar 10. For example, the head clamping part 110 can include a head chuck connecting rod 111 and a head chuck 112, and the tail clamping part 120 can include a tail chuck connecting rod 121 and a tail chuck 122, etc. The crystal bar clamping unit 100 can be configured to clamp and rotate the crystal bar 10.

[0060] The support unit 200 is arranged on the head clamping part 110 and / or the tail clamping part 120. For example, as shown in Figure 1 and Figure 2 The support unit 200 can be fixed on the head chuck connecting rod 111 and / or the tail chuck connecting rod 121. The moving unit 300 is connected with the support unit 200 and can move along the axial direction of the crystal bar 10 relative to the crystal bar 10.

[0061] The distance measuring unit 400 is arranged on the moving unit 300 and can move along the axial direction of the crystal bar 10 under the driving of the moving unit 300. The measuring end of the distance measuring unit 400 faces the crystal bar 10, and the distance measuring unit 400 is used to measure the distance from the measuring end to the obstacle in the first direction Y, wherein the first direction Y is the direction perpendicular to the axial direction of the crystal bar 10.

[0062] The control unit is connected with the crystal bar clamping unit 100, the moving unit 300 and the distance measuring unit 400 respectively, and the control unit is used to:

[0063] Control the moving unit 300 to move the distance measuring unit 400 to a first target position corresponding to the target axial position of the crystal bar 10; control the head clamping part 110 and the tail clamping part 120 to clamp and rotate the crystal bar 10; control the distance measuring unit 400 to measure the distance from the measuring end to the surface of the crystal bar 10 during the rotation of the crystal bar 10; and obtain the eccentricity information of the crystal bar 10 according to the distance data measured by the distance measuring unit 400, wherein the eccentricity information includes at least one of the maximum eccentricity and the maximum eccentric position.

[0064] For example, the support unit 200 can have an extension length in a first direction Y, which is a direction perpendicular to the axial direction of the crystal bar 10. The moving unit 300 can be mounted on the support unit 200, and the moving unit 300 is kept at a distance from the crystal bar 10 in the first direction Y, so that the distance measuring unit 400 can be kept at a distance from the surface of the crystal bar 10, facilitating distance measurement.

[0065] In the above scheme, by mounting the moving unit 300 on the support unit 200 on the crystal bar clamping unit 100 clamping the head and tail of the crystal bar 10, and mounting the distance measuring unit 400 on the moving unit 300, the distance measuring unit 400 can be moved to a first target position corresponding to a predetermined position in the axial direction of the crystal bar 10 by the moving unit 300, and the head clamping piece 110 and the tail clamping piece 120 can clamp and rotate the crystal bar 10. During the rotation of the crystal bar 10, the distance measuring unit 400 can measure the distance from the measuring end to the surface of the crystal bar 10. According to the distance data measured by the distance measuring unit 400, the eccentricity information of the crystal bar 10 can be obtained, wherein the eccentricity information includes at least one of the maximum eccentricity and the maximum eccentric position.

[0066] In this way, the rolling machining eccentricity detection device can obtain a series of distance data at different rotation angles of the same or different axial position points of the crystal bar 10 by measuring the distance from the measuring unit to the surface of the crystal bar 10 during the rotation of the crystal bar 10. According to the series of distance data, the maximum eccentricity and the maximum eccentric position can be obtained at the same time, so that the eccentricity of the crystal bar 10 can be corrected faster, the eccentricity correction time can be reduced, the true roundness of the crystal bar 10 after rolling machining can be ensured, and the work efficiency and the effective utilization rate of the equipment can be improved.

[0067] In some example embodiments, as shown in Figure 1 and Figure 2 The moving unit 300 includes a driving cylinder 310 and a telescopic rod 320, the axial direction of the telescopic rod 320 is parallel to the axial direction of the crystal bar 10, the first end of the axial direction of the telescopic rod 320 is in transmission connection with the driving cylinder 310, the second end of the axial direction is connected to the driving cylinder 310, and the second end of the axial direction can be axially telescopic under the driving of the driving cylinder 310, and the distance measuring unit 400 is mounted to the second end of the axial direction.

[0068] By using the above scheme, the telescopic rod 320 can be telescopic along the axial direction of the crystal bar 10 by driving the driving cylinder 310, which is simple in structure and easy to operate.

[0069] However, it can be understood that the specific structure of the moving unit 300 is not limited to this in other embodiments not shown, for example, the moving unit 300 can also be realized by using other movable components such as lead screws, sliders and guide rails.

[0070] In some exemplary embodiments, the distance measuring unit 400 comprises a distance sensor.

[0071] The distance sensor is a component for measuring the distance between an object and the sensor. The distance sensor can be divided into various types, such as ultrasonic sensor, laser sensor, infrared sensor, electromagnetic wave sensor, optical sensor, capacitive sensor, etc.

[0072] Among them, the laser sensor calculates the distance by emitting a laser beam and measuring the time of the laser reflection. The straight-line propagation characteristics of the laser beam make it have high precision in long-distance measurement. The infrared sensor determines the distance by emitting infrared light and measuring the intensity or time of the reflected light. The ultrasonic sensor emits high-frequency sound waves (ultrasonic waves), and when the sound waves encounter an obstacle, they will reflect back. The sensor receives the reflected wave and calculates the distance from the obstacle according to the time of sound wave propagation. The electromagnetic wave sensor uses electromagnetic waves (such as microwaves) for distance measurement. The sensor emits electromagnetic waves, and the waves reflect when they encounter an object. The sensor receives the reflected wave and calculates the distance. The optical sensor determines the distance by measuring the intensity change or phase difference of light. The optical sensor can use laser, LED and other light sources. The capacitive sensor determines the distance of an object by measuring the change of capacitance. The capacitance will change due to the proximity of the object.

[0073] For example, in some embodiments, the distance sensor in the embodiments of the present disclosure can be selected from any suitable sensor such as a laser sensor or an infrared sensor.

[0074] In some exemplary embodiments, as shown in Figure 1 and Figure 2 The support unit 200 is configured to drive the moving unit 300 and the distance measuring unit 400 to move along the first direction Y relative to the crystal bar 10. In this way, for different diameters of the crystal bar 10, the distance measuring unit 400 can be lifted along the first direction Y by the support unit 200 to obtain better distance measuring effect. For example, the support unit 200 can be constructed as a telescopic support.

[0075] In addition, in some exemplary embodiments, the control unit is specifically used for:

[0076] controlling the moving unit 300 to move the distance measuring unit 400 to a second target position, the second target position being a preset position where the distance measuring unit 400 is located outside the axial direction of the crystal bar 10.

[0077] When the distance measuring unit 400 is located at the second target position, the distance measuring unit 400 is controlled to obtain a reference distance L0, where the reference distance L0 is the distance from the distance measuring unit 400 to the head clamping member 110 or the tail clamping member 120 in the first direction Y;

[0078] controlling the moving unit 300 to move the ranging unit 400 to the first target position;

[0079] When the distance measuring unit 400 is located at the first target position, the head clamping member 110 and the tail clamping member 120 are controlled to clamp and rotate the crystal ingot 10 once, and the distance measuring unit 400 is controlled to measure the distance once every predetermined rotation angle during the rotation of the crystal ingot 10 to obtain N distance data Li;

[0080] According to the N distance data Li, the eccentricity information of the crystal ingot 10 is obtained.

[0081] In the above solution, the working process of the spherical processing eccentricity detection device provided by the embodiment of the present disclosure can be as follows:

[0082] First, the distance measuring unit 400 is moved to the second target position, which is a preset position of the distance measuring unit 400 located axially outside the crystal rod 10. For example, the second target position can be as follows: Figure 1 As shown, it is located above the head chuck link 111 or the tail chuck link 121. In this way, the distance measuring unit 400 can measure the distance between itself and the head chuck link 111 or the tail chuck link 121, and use this distance as the reference distance L0;

[0083] Then, the crystal ingot 10 is rotated to a predetermined initial angle, for example, the predetermined initial angle may be the 0° crystal orientation of the crystal ingot 10. The 0° crystal orientation may refer to an orientation relative to a certain reference direction (e.g., the (100) direction, the (110) direction, etc.). For example, in some cases, 0° may represent a direction parallel to the (100) crystal orientation;

[0084] Then, the crystal ingot 10 can be clamped and rotated by the crystal ingot clamping unit 100, so that the crystal ingot 10 rotates one circle. During the rotation of the crystal ingot 10, a distance measurement is performed every interval of the predetermined rotation angle α. Thus, during the rotation of the crystal ingot 10, N distance data Li can be obtained, where N = 360° / α. The smaller the value of the predetermined rotation angle α, the more distance values ​​can be measured and the more accurate the measurement accuracy. For example, the predetermined rotation angle α can be equal to 5°, 10°, 15°, 20°, etc.

[0085] Then, according to the N distance data Li, the eccentricity information of the crystal bar 10 can be obtained.

[0086] Specifically, in some exemplary embodiments, the obtaining of the eccentricity information of the crystal bar 10 according to the N distance data Li specifically comprises:

[0087] The difference between each distance data Li and the reference distance L0 is calculated respectively to obtain N distance difference values ΔLi.

[0088] The N distance difference values ΔLi are compared to obtain a maximum distance difference value ΔLimax and a minimum distance difference value ΔLimin.

[0089] According to the maximum distance difference value ΔLimax and the minimum distance difference value ΔLimin, the eccentricity ΔL is obtained, ΔL=(ΔLimax-ΔLimin) / 2, and according to the corresponding relationship between the distance data Li and the rotation angle, the rotation angle of the crystal bar 10 corresponding to the maximum distance difference value ΔLimax is determined to determine the maximum eccentric position of the crystal bar 10.

[0090] In the above scheme, by rotating the crystal bar 10 one circle, N distance data Li is obtained, recorded as L1, L2, L3……Li, where i is less than or equal to N, the N distance data Li is calculated with the reference distance L0 to obtain N distance difference values ΔLi, recorded as ΔL1, ΔL2, ΔL3……ΔLi, from the N distance difference values ΔLi, the maximum distance difference value ΔLimax and the minimum distance difference value ΔLimin can be determined, and based on the corresponding relationship between the distance data Li and the rotation angle of the crystal bar 10, the rotation angle corresponding to the maximum distance difference value ΔLimax and the minimum distance difference value ΔLimin can be determined. Please refer to Figures 1 to 3 Since the reference distance L0 is greater than the distance data Li, the position corresponding to the maximum distance difference value ΔLimax can be determined as the maximum eccentric position.

[0091] It should be noted that in the above scheme, the distance from the distance measuring unit 400 to the surface of the crystal bar 10 reflects the diameter change of the crystal bar 10, which has simple structure and high measurement accuracy.

[0092] It should be noted that, in the above scheme, the ranging unit 400 is first moved to the second target position corresponding to the head chuck link 111 or the tail chuck link 121, and the distance from the ranging unit 400 to the head chuck link 111 or the tail chuck link 121 is measured as the reference distance. In this way, the reference distance can be obtained, and compared with the method of directly lifting the ranging unit 400 to a target height to determine the reference distance, the height error caused by lifting the ranging unit 400 can be avoided, so that the measurement accuracy in the embodiment is more accurate.

[0093] In addition, in some embodiments, the ranging unit 400 can be moved to a first target position to measure the diameter of the surface of the crystal bar 10 at an axial position point in the axial direction of the crystal bar 10. However, it should be understood that, in other embodiments, in order to improve accuracy, the ranging unit 400 can also be moved to at least two different axial position points, and the crystal bar 10 is rotated one circle at each axial position point to measure the distance, so as to detect the eccentricity of the diameter at different axial position points, and further improve the roundness of the crystal bar 10.

[0094] In addition, it should be noted that, as shown in Figure 1 and Figure 2 The support unit 200, the moving unit 300 and the ranging unit 400 are all installed on the head clamping piece 110, so that the eccentricity information of the crystal bar body (Body) close to the head position can be measured. In other embodiments, the support unit 200, the moving unit 300 and the ranging unit 400 can also be installed on the tail clamping piece 120, and the eccentricity information of the crystal bar body (Body) close to the tail position can be measured. The measurement principle and process are the same as those of the eccentricity information of the crystal bar body (Body) close to the head position, and will not be described here.

[0095] In addition, the disclosure embodiment also provides a rounding processing eccentricity detection method, which is applied to the rounding processing eccentricity detection device provided by the disclosure embodiment, and the method comprises the following steps:

[0096] The moving unit 300 is controlled to move the ranging unit 400 to a first target position corresponding to a target axial position of the crystal bar 10;

[0097] The head clamping piece 110 and the tail clamping piece 120 are controlled to clamp and rotate the crystal bar 10;

[0098] During the rotation of the crystal bar 10, the ranging unit 400 is controlled to measure the distance from the measurement end to the surface of the crystal bar 10;

[0099] According to the distance data measured by the distance measuring unit 400, eccentricity information of the crystal bar 10 is obtained, wherein the eccentricity information includes at least one of a maximum eccentricity and a maximum eccentric position.

[0100] In some exemplary embodiments, the method specifically further includes:

[0101] Step S01, controlling the moving unit 300 to move the distance measuring unit 400 to a second target position, wherein the second target position is a preset position of the distance measuring unit 400 located outside the axial direction of the crystal bar 10;

[0102] Step S02, when the distance measuring unit 400 is located at the second target position, controlling the distance measuring unit 400 to obtain a reference distance L0, wherein the reference distance L0 is a distance from the distance measuring unit 400 to the head clamping member 110 or the tail clamping member 120 in the first direction Y;

[0103] Step S03, controlling the moving unit 300 to move the distance measuring unit 400 to the first target position;

[0104] Step S04, when the distance measuring unit 400 is located at the first target position, controlling the head clamping member 110 and the tail clamping member 120 to clamp and rotate the crystal bar 10 by one revolution, and controlling the distance measuring unit 400 to measure the distance every predetermined rotation angle during the rotation of the crystal bar 10 to obtain N distance data Li;

[0105] Step S05, obtaining eccentricity information of the crystal bar 10 according to the N distance data Li.

[0106] In some exemplary embodiments, the step S05 specifically includes:

[0107] Step S051, calculating the difference between each distance data Li and the reference distance L0 respectively to obtain N distance difference values ΔLi;

[0108] Step S052, comparing the N distance difference values ΔLi to obtain a maximum distance difference value ΔLimax and a minimum distance difference value ΔLimin;

[0109] Step S053, obtaining an eccentricity ΔL according to the maximum distance difference value ΔLimax and the minimum distance difference value ΔLimin, wherein ΔL=(ΔLimax-ΔLimin) / 2, and determining the rotation angle of the crystal bar 10 corresponding to the maximum distance difference value ΔLimax according to the corresponding relationship between the distance data Li and the rotation angle to determine the maximum eccentric position of the crystal bar 10.

[0110] Since the principle of solving problems of the spheroidization processing detection method is similar to the principle of solving problems of the spheroidization processing detection device, the embodiments of the spheroidization processing detection method provided by the present disclosure can refer to the embodiments of the spheroidization processing detection device provided by the present disclosure, and details are not repeated here.

[0111] In addition, the present disclosure also provides a spheroidization processing device including the spheroidization processing eccentricity detection device provided by the present disclosure. Other essential components of the display device (such as a spheroidization operation assembly) should be understood by those skilled in the art, and details are not repeated here and should not be considered as a limitation of the present disclosure. Since the principle of solving problems of the spheroidization processing device is similar to the principle of solving problems of the spheroidization processing detection device, the embodiments of the spheroidization processing device provided by the present disclosure can refer to the embodiments of the spheroidization processing detection device provided by the present disclosure, and details are not repeated here.

[0112] In addition, the present disclosure also provides a device including a memory and a processor, the memory stores a computer program, and the processor implements the steps of the above method when executing the computer program. The above device can implement the above methods when the processor executes the computer program, and therefore can automatically complete the wafer spheroidization processing eccentricity detection.

[0113] In one embodiment, the present disclosure also provides a computer readable storage medium having a computer program stored thereon, and the computer program is executed by a processor to implement the steps in the above method embodiments.

[0114] The above computer readable storage medium, since the computer program stored in the memory is executed by the processor to implement the steps in the above method embodiments, and therefore can automatically complete the wafer position calibration without opening the device chamber for operation, avoiding chamber or wafer contamination.

[0115] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when the computer program is executed, the processes of the above-mentioned embodiments of the methods can be included. Any reference to memory, storage, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration but not limitation, the RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0116] The following points need to be explained:

[0117] (1) The drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, and other structures can refer to the general design.

[0118] (2) In order to be clear, the thickness of the layer or region is enlarged or reduced in the drawings used to describe the embodiments of the present disclosure, that is, these drawings are not drawn according to the actual proportion. It can be understood that when an element such as a layer, film, region or substrate is referred to as being located "on" or "under" another element, the element can be "directly" located on or under another element or there can be an intermediate element.

[0119] (3) In the case of no conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0120] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A device for detecting eccentricity during rounding, characterized in that: include: a crystal ingot clamping unit, comprising a head clamping piece for clamping a head of the crystal ingot and a tail clamping piece for clamping a tail of the crystal ingot, wherein the crystal ingot clamping unit is configured to clamp and rotate the crystal ingot; a bracket unit, disposed on the head clamping member and / or the tail clamping member; a moving unit connected to the support unit and movable relative to the crystal ingot along the axial direction of the crystal ingot; and a distance measuring unit, disposed on the moving unit, with a measuring end of the distance measuring unit facing the crystal ingot, and configured to measure a distance from the measuring end to an obstacle in a first direction, wherein the first direction is a direction perpendicular to the axial direction of the crystal ingot; A control unit is connected to the crystal ingot clamping unit, the moving unit, and the distance measuring unit, respectively, and is used to: The moving unit is controlled to move the distance measuring unit to a first target position corresponding to the axial position of the crystal ingot; the head clamping member and the tail clamping member are controlled to clamp and rotate the crystal ingot; during the rotation of the crystal ingot, eccentricity information of the crystal ingot is obtained according to the distance data measured by the distance measuring unit, wherein the eccentricity information includes at least one of a maximum eccentricity amount and a maximum eccentricity position.

2. The eccentricity detection device for rounding according to claim 1, characterized in that: The mobile unit comprises: driving cylinders; and A telescopic rod, wherein the axial direction of the telescopic rod is arranged parallel to the axial direction of the crystal rod; wherein, The first axial end of the telescopic rod is transmission-connected to the driving cylinder, the second axial end is connected to the driving cylinder and can be axially telescopic relative to the second axial end under the drive of the driving cylinder, and the distance measuring unit is installed on the second axial end.

3. The eccentricity detection device for rounding according to claim 1, characterized in that: The distance measuring unit includes a distance sensor.

4. The eccentricity detection device for rounding according to claim 1, characterized in that: The support unit is configured to drive the moving unit and the distance measuring unit to move relative to the crystal ingot along the first direction.

5. The eccentricity detection device for rounding according to claim 1, characterized in that: The control unit is used to: Controlling the moving unit to move the distance measuring unit to a second target position, where the second target position is a preset position where the distance measuring unit is located axially outside the crystal ingot; When the distance measuring unit is located at the second target position, controlling the distance measuring unit to obtain a reference distance L0, where the reference distance L0 is the distance from the distance measuring unit to the head clamping member or the tail clamping member in the first direction; controlling the moving unit to move the ranging unit to the first target position; When the distance measuring unit is located at the first target position, the head clamping member and the tail clamping member are controlled to clamp and rotate the crystal ingot one circle, and the distance measuring unit is controlled to measure the distance once every predetermined rotation angle during the rotation of the crystal ingot to obtain N distance data Li; According to the N distance data Li, the eccentricity information of the crystal ingot is obtained.

6. The eccentricity detection device for rounding according to claim 5, characterized in that: The control unit is used to: Calculate the difference between each distance data Li and the reference distance L0 to obtain N distance difference values ​​△Li; Compare N distance differences △Li to obtain the maximum distance difference △Limax and the minimum distance difference △Limin; According to the maximum distance difference △Limax and the minimum distance difference △Limin, the eccentricity △L is obtained; According to the corresponding relationship between the distance data Li and the rotation angle, the rotation angle of the crystal ingot corresponding to the maximum distance difference △Limax is determined to determine the maximum eccentricity position of the crystal ingot.

7. A method for detecting eccentricity in rounding, characterized in that: Applicable to the spherical processing eccentricity detection device according to any one of claims 1 to 6, the method comprising: controlling the moving unit to move the distance measuring unit to a first target position corresponding to the axial position of the crystal ingot; Controlling the head clamping member and the tail clamping member to clamp and rotate the crystal rod; During the rotation of the crystal ingot, eccentricity information of the crystal ingot is obtained according to the distance data measured by the distance measuring unit, wherein the eccentricity information includes at least one of a maximum eccentricity amount and a maximum eccentricity position.

8. The method for detecting eccentricity in rounding according to claim 7, characterized in that: The method comprises: Controlling the moving unit to move the distance measuring unit to a second target position, where the second target position is a preset position where the distance measuring unit is located axially outside the crystal ingot; When the distance measuring unit is located at the second target position, controlling the distance measuring unit to obtain a reference distance L0, where the reference distance L0 is the distance from the distance measuring unit to the head clamping member or the tail clamping member in the first direction; controlling the moving unit to move the ranging unit to the first target position; When the distance measuring unit is located at the first target position, the head clamping member and the tail clamping member are controlled to clamp and rotate the crystal ingot one circle, and the distance measuring unit is controlled to measure the distance once every predetermined rotation angle during the rotation of the crystal ingot to obtain N distance data Li; According to the N distance data Li, the eccentricity information of the crystal ingot is obtained.

9. The method for detecting eccentricity in rounding according to claim 8, characterized in that: The obtaining of the eccentricity information of the crystal ingot according to the N distance data Li includes: Calculate the difference between each distance data Li and the reference distance L0 to obtain N distance difference values ​​△Li; Compare N distance differences △Li to obtain the maximum distance difference △Limax and the minimum distance difference △Limin; According to the maximum distance difference △Limax and the minimum distance difference △Limin, the eccentricity △L is obtained; According to the corresponding relationship between the distance data Li and the rotation angle, the rotation angle of the crystal ingot corresponding to the maximum distance difference △Limax is determined to determine the maximum eccentricity position of the crystal ingot.

10. A rounding processing equipment, characterized in that, It comprises the eccentricity detection device for rounding processing as described in any one of claims 1 to 6.

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