Method and device for detecting abnormal heating of working device in laser

Abstract

The invention provides a method and device for detecting abnormal heating of working devices in a laser, and relates to the technical field of semiconductor lasers, and the method comprises the steps: S10, collecting the temperature of each working device on the laser, and judging whether the temperature is an abnormal temperature or not, the position of the working device with the abnormal temperature is locked; and S20, according to the position of the working device with the abnormal temperature locked, collecting the serial number of the working device with the abnormal temperature on the laser.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor lasers, and in particular to a method and a device for detecting abnormal heating of a working device in a laser. Background Art

[0002] High-power lasers are composed of multiple high-power semiconductor chips and their optical passive devices. Since the module uses high-power output, the internal chips and optical passive devices need to withstand the heat brought by the high-power output. The chips and other working devices are easily damaged, which can easily cause performance abnormalities and reliability problems, such as insufficient power and abnormal heating. Therefore, it is particularly important to check the performance of the module in the early stage. Therefore, it is necessary to study a method and device for detecting abnormal heating of working devices in lasers, so as to check abnormal chips in the early stage of the laser process for timely processing and avoid performance abnormalities and reliability problems. Summary of the invention

[0003] The object of the present invention is to provide a method and device for detecting abnormal heating of a working device in a laser, so as to alleviate the technical problem of high failure rate in existing laser production.

[0004] In a first aspect, the present invention provides a method for detecting abnormal heating of a working device in a laser, comprising: Step S10. Collect the temperature of each working device on the laser and determine whether the temperature is abnormal, and lock the position of the working device with abnormal temperature; Step S20. According to the position of the locked working component with abnormal temperature, collect the serial number of the working component with abnormal temperature on the laser.

[0005] Furthermore, the method for detecting abnormal heating of a working device in a laser further includes the following steps performed before step S10: Step S1. Collecting an image of a laser; Make the working components on the laser be located within the temperature collection area and the serial number collection area.

[0006] Furthermore, in step S10, the temperature of each working component on the laser is collected by a thermal imaging detection mechanism to determine whether the temperature is abnormal, and the position of the working component with abnormal temperature is locked; In the step S20, the serial number of the working device with abnormal temperature on the laser is collected by the serial number image detection mechanism; In the step S1, the image of the laser is collected by positioning the image detection mechanism; the working device on the laser is located in the temperature collection area of ​​the thermal imaging detection mechanism and the serial number collection area of ​​the serial number image detection mechanism.

[0007] Furthermore, the step S1 includes the steps of: the positioning image detection mechanism identifies and locates the positioning mark on the laser, and numbers each working device on the laser; The step S10 includes the steps of: the thermal imaging detection mechanism identifies the positioning mark on the laser and positions it so that the image of the laser collected by the positioning image detection mechanism in step S1 coincides with the image of the laser collected by the thermal imaging detection mechanism in step S10; collecting the serial number of the working device with abnormal temperature; The step S20 specifically includes: according to the serial number of the abnormal working device, adjusting the focal length of the serial number image detection mechanism to magnify the image of the area where the serial number of the abnormal working device is located to obtain the serial number of the working device with abnormal temperature.

[0008] Further, the step S1 includes the steps of: the positioning image detection mechanism identifies the positioning mark on the laser and positions it, numbers each working device on the laser, and sets the number of one of the working devices as a preset number; Adjust the focal length of the serial number image detection mechanism so that the serial number collection area is focused on the area where the preset number is located; The step S10 includes the steps of: the thermal imaging detection mechanism identifying the positioning mark on the laser and positioning it so that the image of the laser collected by the positioning image detection mechanism in step S1 coincides with the image of the laser collected by the thermal imaging detection mechanism in step S10; The step S20 specifically includes the steps of: moving the laser to move the working device with abnormal temperature to the position of the area where the preset number is located; and collecting the serial number of the working device with abnormal temperature on the laser through the serial number image detection mechanism.

[0009] Further, the step S1 includes the steps of: positioning the image of the laser collected by the image detection mechanism so that all working components on the laser are located within the temperature collection area of ​​the thermal imaging detection mechanism; Adjusting the focal length of the serial number image detection mechanism so that the serial number acquisition area of ​​the serial number image detection mechanism is focused within the temperature acquisition area, and fixing the serial number acquisition area; wherein the serial number acquisition area is sufficient to completely acquire an image of the serial number of a working device; The step S10 specifically includes the steps of: moving the laser, passing the working components on the laser through the serial number collection area one by one, and collecting the temperature of the working components on the laser by a thermal imaging detection mechanism; The step S20 specifically includes the following steps: when the temperature of the working device in the serial number collection area is abnormal, the serial number of the working device with abnormal temperature in the serial number collection area is collected by a serial number image detection mechanism.

[0010] In a second aspect, the present invention provides a device for detecting abnormal heating of a working device in a laser, the detection device comprising: a thermal imaging detection mechanism and a serial number image detection mechanism, The thermal imaging detection mechanism collects the temperature of each working component on the laser and determines whether the temperature is abnormal, and locks the position of the working component with abnormal temperature; The serial number image detection mechanism collects the serial numbers of working components with abnormal temperatures on the laser.

[0011] Furthermore, the device for detecting abnormal heating of a working device in a laser further comprises a positioning image detection mechanism and a movable bracket, wherein the positioning image detection mechanism, the thermal imaging detection mechanism and the serial number image detection mechanism are all mounted on the same movable bracket so that the three have the same motion state; The positioning image detection mechanism is used to collect images of the laser, and the movable bracket is used to move the laser to be detected to the temperature collection area of ​​the thermal imaging detection mechanism and the serial number collection area of ​​the serial number image detection mechanism.

[0012] Further, the mobile bracket includes a first driving mechanism and a second driving mechanism, wherein the driving end of the first driving mechanism is connected to a connecting frame, and the first driving mechanism is used to drive the connecting frame to move vertically; the driving end of the second driving mechanism is connected to the first driving mechanism, so that the second driving mechanism drives the first driving mechanism and the connecting frame to move horizontally together; The positioning image detection mechanism, the thermal imaging detection mechanism and the serial number image detection mechanism are all installed on the connecting frame.

[0013] Furthermore, the device for detecting abnormal heating of a working component in a laser also includes a movable base, and the movable base is used to install the laser to drive the laser to move in a horizontal direction.

[0014] The present invention has at least the following advantages or beneficial effects: The method for detecting abnormal heating of working components in a laser provided by the present invention comprises: step S10. collecting the temperature of each working component on the laser and determining whether the temperature is abnormal, and locking the position of the working component with abnormal temperature; step S20. collecting the serial number of the working component with abnormal temperature on the laser according to the position of the locked working component with abnormal temperature.

[0015] The detection method provided by the present invention collects the temperature of the working components inside the laser and determines whether the temperature is abnormal, thereby identifying the working components with abnormal temperature; then obtains the serial number of the working components with abnormal temperature, performs focused analysis on the working components with abnormal temperature, and checks the abnormal working components of the system in the early stage of preparation and handles them in time to avoid performance and reliability problems, so as to avoid the overall failure of the laser due to its failure when used by the client, thereby ensuring that the overall state of the laser works in the best state and improving the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 A schematic diagram of a device for detecting abnormal heating of a working device in a laser provided in Embodiment 4 of the present invention (the detailed structure of the laser is not shown); Figure 2 The image of the laser collected in step S1 of the method for detecting abnormal heating of a working device in a laser provided in embodiment 1 of the present invention; Figure 3 The thermal image of the laser collected in step S10 of the method for detecting abnormal heating of a working device in a laser provided in embodiment 1 of the present invention; Figure 4 A schematic diagram of an abnormal working device collected in step S20 in the method for detecting abnormal heating of a working device in a laser provided in Example 1 of the present invention; Figure 5 The image collected by the positioning image detection mechanism in step S1 of the method for detecting abnormal heating of a working device in a laser provided in embodiment 2 of the present invention; Figure 6 The image collected by the thermal imaging detection mechanism in step S10 of the method for detecting abnormal heating of a working device in a laser provided in embodiment 2 of the present invention; Figure 7 The image collected by the thermal imaging detection mechanism in step S20 of the method for detecting abnormal heating of a working device in a laser provided in Embodiment 2 of the present invention; Figure 8 A schematic diagram of step S1 in the method for detecting abnormal heating of a working device in a laser provided in Embodiment 3 of the present invention; Fig. 9 This is a schematic diagram of step S10 in the method for detecting abnormal heating of a working device in a laser provided in Example 3 of the present invention.

[0018] Icons: 1-positioning image detection mechanism; 2-thermal imaging detection mechanism; 3-serial number image detection mechanism; 4-movable bracket; 5-laser; 6-working device; 7-positioning mark; 8-preset number area; 9-temperature collection area; 10-serial number collection area. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0022] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0023] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0024] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] Example 1 like Figure 1 As shown, in order to solve the problem that the abnormal working device 6 (the working device 6 in this embodiment is a chip) in the laser 5 generates higher heat, this method is designed to collect the temperature of the working device 6 inside the laser 5 through a thermal image, identify the abnormal temperature working device 6; focus on analyzing the abnormal temperature working device 6, and check the abnormal parts of the system in the early stage of the process and deal with them in time.

[0026] The method for detecting abnormal heating of a working device in a laser provided by the present invention is performed by a detection device, wherein the detection device includes: a thermal imaging detection mechanism 2 and a serial number image detection mechanism 3. The thermal imaging detection mechanism 2 collects the temperature of each working device 6 on the laser 5. Preferably, the temperature can be displayed. The user can pre-set that when the temperature is higher than a first preset value, it is judged as an abnormal temperature. The first preset value is different for different products. When the thermal imaging detection mechanism 2 finds a working device 6 with an abnormal temperature, it quickly locks the position of the working device 6 with the abnormal temperature and displays the abnormal temperature.

[0027] The serial number image detection mechanism 3 collects the serial number of the working device 6 with abnormal temperature on the laser 5, identifies the serial number and retrieves the COS stage test result of the working device 6 with abnormal temperature to compare whether it is abnormal, and accelerates the analysis of the abnormality. Specifically, according to the serial number of the working device 6, the data recorded by this working device 6 in the test aging stage is retrieved, and through relevant reliability data (such as optical power, working current, working voltage, polarization, etc.), it is judged whether the working device 6 has an abnormality.

[0028] The detection method provided by the present invention collects the temperature of the working component 6 inside the laser 5 through the thermal imaging detection mechanism 2, identifies the working component 6 with abnormal temperature; then obtains the serial number of the working component 6 with abnormal temperature, performs key analysis on the working component 6 with abnormal temperature, checks the system abnormal components in the early stage of preparation and handles them in time, thereby improving the yield rate.

[0029] like Figure 1As shown, the detection device also includes: a positioning image detection mechanism 1, and the positioning image detection mechanism 1, the thermal imaging detection mechanism 2 and the serial number image detection mechanism 3 can all be installed on the same mobile bracket 4. The three detection mechanisms are fixed to the mobile bracket 4 and can move simultaneously, but can fine-tune the focal length separately. First, the image acquisition center is positioned by the positioning image detection mechanism 1 to ensure that all the working devices 6 on the laser 5 can be completely collected, and the shooting focal length is determined. After the focus is determined, the height of the mobile bracket 4 is kept basically unchanged (in the z-axis direction), that is, the focus is unchanged. Thereafter, the thermal imaging detection mechanism 2 is turned on to collect heat, and the working devices 6 with abnormal temperatures can be observed. Next, the serial number of the abnormal temperature point is determined by the serial number image detection mechanism 3. The mobile bracket 4 can move in two-dimensional or three-dimensional directions. In this embodiment, the mobile bracket 4 can move horizontally (in the x-axis direction) and vertically (in the z-axis direction).

[0030] The method for detecting abnormal heating of a working device in a laser also includes the following steps performed before step S10: step S1. capturing an image of the laser 5 by positioning the image detection mechanism 1, and adjusting the position of the movable bracket 4 so that the laser 5 to be detected is located in the temperature collection area of ​​the thermal imaging detection mechanism 2 and the serial number collection area 10 of the serial number image detection mechanism 3.

[0031] Specifically, the image of the complete laser 5 can be obtained by positioning the image detection mechanism 1, so that the laser 5 is located at the center of the image acquisition area of ​​the positioning image detection mechanism 1, that is, the positioning image detection mechanism 1, the thermal imaging detection mechanism 2 and the serial number image detection mechanism 3 can all acquire a complete top view of the laser 5, which facilitates the positioning of the thermal imaging detection mechanism 2 and the serial number image detection mechanism 3 so that the focal length adjustment range of the corresponding detection mechanism can be reduced, thereby facilitating rapid acquisition and identification work.

[0032] In this embodiment, the step S1 includes the steps of: identifying the positioning mark 7 on the laser 5 by the positioning image detection mechanism 1, and positioning the laser 5 according to the positioning mark 7, and then numbering the working components 6 thereon. Among them, the positioning mark 7 can be a specific structure on the laser 5, such as a screw hole, a positioning column and other structures. In this embodiment, 4 screw holes are used as positioning marks 7. According to the position of the working components 6 (chips) on the laser 5, all the working components 6 are numbered. For example, there are 26 working components 6 that generate heat on the laser 5. Starting from the first working component 6 in the upper left corner of the image, these 26 working components 6 can be assigned morphological registration in sequence (to prepare for the subsequent serial number image detection mechanism 3 to focus the image, to avoid the serial number not being in the image after focusing) and numbered, such as number 1, number 2...number 26, such as Figure 2As shown. In step S10, the laser 5 is positioned using the same positioning mark 7, so that the image collected in step S1 corresponds to the thermal imaging image collected in step S10. Because the number corresponds to the working device 6 one by one, when the working device 6 with abnormal temperature appears, the number of the abnormal working device 6 can be directly obtained without obtaining the coordinates of each working device 6 by establishing coordinates. Then, according to the number of the abnormal working device 6, the focal length of the serial number image detection mechanism 3 is adjusted to enlarge the image of the area where the number of the abnormal working device 6 is located to obtain the complete serial number of the working device 6 with abnormal temperature, as shown in FIG. Figure 3 and Figure 4 In this embodiment, the images collected by the positioning image detection mechanism 1, the thermal imaging detection mechanism 2 and the serial number image detection mechanism 3 are processed uniformly, so that the serial number of the abnormal working component 6 can be found quickly and accurately.

[0033] Example 2 In this embodiment, the step S1 includes the steps of identifying the positioning mark 7 on the laser 5 by the positioning image detection mechanism 1, positioning the laser 5 according to the positioning mark 7, and then numbering the working components 6 thereon. This step is the same as that in Embodiment 1 and will not be repeated herein.

[0034] After numbering each working device 6, adjust the focal length of the serial number image detection mechanism 3 so that it is focused on the area 8 where the preset number is located and fix the serial number collection area 10 of the serial number image detection mechanism 3 to the area 8 where the preset number is located. For example, the serial number collection area 10 of the serial number image detection mechanism 3 is locked at the position of the working device 6 numbered No. 1 in the upper left corner by focusing, and then the serial number collection area 10 of the serial number image detection mechanism 3 no longer changes, such as Figure 5 shown.

[0035] Similar to Example 1, in step S10, the laser 5 is positioned in the same positioning manner so that the image of the laser captured by the positioning image detection mechanism 1 in step S1 coincides with the image of the laser 5 captured by the thermal imaging detection mechanism 2 in step S10, thereby making the image captured in step S1 correspond to the thermal imaging image captured in step S10.

[0036] like Figure 6 As shown, after the abnormal temperature working device 6 is locked, the laser 5 is moved to move the locked abnormal temperature working device 6 to the position of the area 8 where the preset number is located, such as Figure 7As shown, the serial number of the abnormal temperature working device 6 on the laser 5 is collected by the serial number image detection mechanism 3. During the detection of the serial number, the shooting position of the serial number image detection mechanism 3 remains unchanged, but the entire laser 5 is translated to move the abnormal working device 6 into the collection area of ​​the serial number image detection mechanism 3.

[0037] When the number of working devices 6 with abnormal temperature is greater than or equal to two, the working devices 6 with abnormal temperature are moved to the area 8 with preset numbers in sequence from near to far from the area 8 with preset numbers, thereby reducing the total movement distance of the laser 5 and shortening the detection time.

[0038] Example 3 like Figure 8 and Fig. 9 As shown, in this embodiment, unlike Embodiments 1 and 2, it is simpler and faster, and there is no need to register the morphology of the working device 6, nor to obtain the coordinate information of the working device 6; the serial number of the abnormal working device 6 can be quickly and accurately obtained only by moving the position of the laser 5 in the temperature collection area of ​​the thermal imaging detection mechanism 2.

[0039] Specific: such as Figure 8 As shown, before acquiring the thermal imaging image, the size of the thermal imaging image of all the working devices 6 to be detected is first adapted to the temperature acquisition area 9 of the thermal imaging detection mechanism 2, for example, the height is adapted ( Figure 8 Left side figure): The uppermost working device 6 is located at the uppermost left corner of the temperature collection area 9, and the serial number collection area 10 of the serial number image detection mechanism 3 is also focused and locked at the position of the uppermost left corner. (Of course, the focus locking position can also be other positions, such as other corners, or a certain edge position of the temperature collection area 9, as long as the thermal imaging image of a certain working device 6 can be moved out or moved in at the edge position by moving the position of the laser 5). When an abnormal working device 6 appears, the thermal imaging images of other working devices 6 can be moved to the locked position one by one by moving the position of the laser 5. Fig. 9As shown, by moving the position of the laser 5, the thermal imaging image of each working device 6 can pass through the serial number collection area 10 one by one and be moved out of the temperature collection area 9. Preferably, it is only necessary to detect the temperature of the working device 6 at the serial number collection area 10 at a fixed point; when the thermal imaging image of the working device 6 is normal, it is directly moved out of the temperature collection area 9, and then the position of the laser 5 is moved so that the thermal imaging image of the next working device 6 is moved into the serial number collection area 10. Therefore, during the detection process, there is no need to register the morphology of the working device 6, nor to obtain the coordinate information of the working device 6. Only by moving the position of the laser 5 in the temperature collection area of ​​the thermal imaging detection mechanism 2 can the serial number of the abnormal working device 6 be quickly and accurately obtained, and the detection speed is faster and more convenient.

[0040] Example 4 The present invention provides a device for detecting abnormal heating of working components in a laser, and the detection device includes: a thermal imaging detection mechanism 2 and a serial number image detection mechanism 3, wherein the thermal imaging detection mechanism 2 collects the temperature of each working component 6 on the laser 5 and determines whether the temperature is abnormal, and locks the position of the working component 6 with abnormal temperature; the serial number image detection mechanism 3 collects the serial number of the working component 6 with abnormal temperature on the laser 5. The detection method provided by the present invention collects the temperature of the working component 6 inside the laser 5 by the thermal imaging detection mechanism 2, identifies the working component 6 with abnormal heat; then obtains the serial number of the working component 6 with abnormal temperature, performs key analysis on the working component 6 with abnormal temperature, checks the abnormal components of the system in the early stage of preparation and handles them in time, and improves the yield rate.

[0041] The device for detecting abnormal heating of working components in the laser also includes the positioning image detection mechanism 1 and a movable bracket 4. The positioning image detection mechanism 1, the thermal imaging detection mechanism 2 and the serial number image detection mechanism 3 are all installed on the same movable bracket 4 so that the three have the same motion state.

[0042] The detection device also includes: a positioning image detection mechanism 1, and the positioning image detection mechanism 1, the thermal imaging detection mechanism 2 and the serial number image detection mechanism 3 can all be installed on the same mobile bracket 4. The three detection mechanisms are fixed to the mobile bracket 4 and can move simultaneously, but can fine-tune the focal length separately. First, the image acquisition center is positioned by the positioning image detection mechanism 1 to ensure that the laser 5 is fully collected and the shooting focal length is determined. After the focus is determined, the height of the mobile bracket 4 is kept basically unchanged, that is, the focus is unchanged. Thereafter, the thermal imaging detection mechanism 2 is turned on to collect heat, and abnormal temperature points can be observed. Next, the serial number of the abnormal temperature point is determined by the serial number image detection mechanism 3. The mobile bracket 4 can move in two or three dimensions. In this embodiment, the mobile bracket 4 can move horizontally (x-axis direction) and vertically (z-axis direction).

[0043] The device for detecting abnormal heating of working components in the laser also includes a movable base (not shown), which is used to install the laser 5 to drive the laser 5 to move in the horizontal direction, so that the working component 6 thereon is moved to the serial number collection area 10 of the serial number image detection mechanism 3. In this embodiment, the movable base can move in the x-axis direction and the y-axis direction, so that the working component 6 locked with abnormal temperature can be moved to the position of the area 8 where the preset number is located. During the detection process of the serial number, the shooting position of the serial number image detection mechanism 3 remains unchanged, but the entire laser 5 is translated to move the abnormal working component 6 to the serial number collection area 10 of the serial number image detection mechanism 3.

[0044] Furthermore, the mobile bracket 4 includes a first driving mechanism and a second driving mechanism, wherein the driving end of the first driving mechanism is connected to a connecting frame, and the first driving mechanism is used to drive the connecting frame to move vertically (in the z-axis direction); the driving end of the second driving mechanism is connected to the first driving mechanism, so that the second driving mechanism drives the first driving mechanism and the connecting frame to move horizontally (in the x-axis direction). The positioning image detection mechanism 1, the thermal imaging detection mechanism 2 and the serial number image detection mechanism 3 are all installed on the connecting frame. The first driving mechanism and the second driving mechanism can both be conventional linear drive modules, such as screw motor modules.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for detecting abnormal heating of a working device in a laser, characterized in that: include: Step S10. collecting the temperature of each working device (6) on the laser (5) and determining whether the temperature is abnormal, and locking the position of the working device (6) with abnormal temperature; Step S20. According to the position of the abnormally-temperature working component (6) that is locked, the serial number of the abnormally-temperature working component (6) on the laser (5) is collected.

2. The method for detecting abnormal heating of a working device in a laser according to claim 1, characterized in that: The method for detecting abnormal heating of a working device in a laser further includes the following steps performed before step S10: Step S1. collecting an image of the laser (5); The working device (6) on the laser (5) is located in the temperature collection area (9) and the serial number collection area (10).

3. The method for detecting abnormal heating of a working device in a laser according to claim 2, characterized in that: In the step S10, the temperature of each working device (6) on the laser (5) is collected by the thermal imaging detection mechanism (2) to determine whether the temperature is abnormal, and the position of the working device (6) with abnormal temperature is locked; In the step S20, the serial number of the working device (6) with abnormal temperature on the laser (5) is collected by the serial number image detection mechanism (3); In the step S1, an image of the laser (5) is collected by positioning the image detection mechanism (1); and the working device (6) on the laser (5) is located in the temperature collection area (9) of the thermal imaging detection mechanism (2) and the serial number collection area (10) of the serial number image detection mechanism (3).

4. The method for detecting abnormal heating of a working device in a laser according to claim 3, characterized in that: The step S1 comprises the steps of: the positioning image detection mechanism (1) identifies and locates the positioning mark (7) on the laser (5), and numbers each working device (6) on the laser (5); The step S10 comprises the steps of: the thermal imaging detection mechanism (2) identifying the positioning mark (7) on the laser (5) and positioning it so that the image of the laser collected by the positioning image detection mechanism (1) in step S1 coincides with the image of the laser (5) collected by the thermal imaging detection mechanism (2) in step S10; The number of the working device (6) that collects the abnormal temperature; The step S20 specifically comprises: according to the serial number of the abnormal working device (6), adjusting the focal length of the serial number image detection mechanism (3) to magnify the image of the area where the serial number of the abnormal working device (6) is located to obtain the serial number of the working device (6) with abnormal temperature.

5. The method for detecting abnormal heating of a working device in a laser according to claim 3, characterized in that: The step S1 comprises the steps of: the positioning image detection mechanism (1) identifies the positioning mark (7) on the laser (5) and positions it, numbers each working device (6) on the laser (5), and sets the number of one of the working devices (6) to a preset number; Adjusting the focal length of the serial number image detection mechanism (3) so that the serial number acquisition area (10) is focused on the area (8) where the preset number is located; The step S10 comprises the steps of: the thermal imaging detection mechanism (2) identifying the positioning mark (7) on the laser (5) and positioning it so that the image of the laser collected by the positioning image detection mechanism (1) in step S1 coincides with the image of the laser (5) collected by the thermal imaging detection mechanism (2) in step S10; The step S20 specifically comprises the steps of: moving the laser (5) to move the working device (6) with abnormal temperature to be locked to the position of the area (8) where the preset number is located; and collecting the serial number of the working device (6) with abnormal temperature on the laser (5) by means of the serial number image detection mechanism (3).

6. The method for detecting abnormal heating of a working device in a laser according to claim 3, characterized in that: The step S1 comprises the steps of: capturing an image of the laser (5) by positioning the image detection mechanism (1) so that all working components (6) on the laser (5) are located within a temperature collection area (9) of the thermal imaging detection mechanism (2); Adjusting the focal length of the serial number image detection mechanism (3) so that the serial number acquisition area (10) of the serial number image detection mechanism (3) is focused within the temperature acquisition area (9), and fixing the serial number acquisition area (10); wherein the serial number acquisition area (10) is sufficient to completely acquire an image of the serial number of a working device (6); The step S10 specifically comprises the steps of: moving the laser (5), passing the working components (6) on the laser (5) through the serial number collection area (10) one by one, and collecting the temperature of the working components (6) on the laser (5) by means of the thermal imaging detection mechanism (2); The step S20 specifically comprises the steps of: when the temperature of the working device (6) in the serial number collection area (10) is abnormal, collecting the serial number of the working device (6) with abnormal temperature in the serial number collection area (10) by means of the serial number image detection mechanism (3).

7. A device for detecting abnormal heating of a working device in a laser, characterized in that: The detection device comprises: a thermal imaging detection mechanism (2) and a serial number image detection mechanism (3), The thermal imaging detection mechanism (2) collects the temperature of each working device (6) on the laser (5) and determines whether the temperature is abnormal, and locks the position of the working device (6) with abnormal temperature; The serial number image detection mechanism (3) collects the serial number of the working device (6) with abnormal temperature on the laser (5).

8. The device for detecting abnormal heating of a working device in a laser according to claim 7, characterized in that: The device for detecting abnormal heating of a working device in a laser further comprises a positioning image detection mechanism (1) and a movable bracket (4); the positioning image detection mechanism (1), the thermal imaging detection mechanism (2) and the serial number image detection mechanism (3) are all mounted on the same movable bracket (4) so ​​that the three have the same motion state; The positioning image detection mechanism (1) is used to collect an image of a laser (5), and the movable bracket (4) is used to move the laser (5) to be detected to a temperature collection area of ​​the thermal imaging detection mechanism (2) and a serial number collection area (10) of the serial number image detection mechanism (3).

9. The device for detecting abnormal heating of a working component in a laser according to claim 8, characterized in that: The mobile bracket (4) comprises a first driving mechanism and a second driving mechanism, wherein the driving end of the first driving mechanism is connected to a connecting frame, and the first driving mechanism is used to drive the connecting frame to move vertically; the driving end of the second driving mechanism is connected to the first driving mechanism, so that the second driving mechanism drives the first driving mechanism and the connecting frame to move horizontally together; The positioning image detection mechanism (1), the thermal imaging detection mechanism (2) and the serial number image detection mechanism (3) are all mounted on the connecting frame.

10. The device for detecting abnormal heating of a working device in a laser according to claim 8, characterized in that: The device for detecting abnormal heating of a working device in a laser further comprises a movable base, wherein the movable base is used to mount the laser (5) so as to drive the laser (5) to move in a horizontal direction.

Images