Burn-in board, test system and test method

Abstract

The invention provides a burn-in board, a test system and a test method. The burn-in board comprises an expansion output module, a plurality of first switch modules and a plurality of terminating resistors, the to-be-tested device is provided with a plurality of pins, the pins, the first switch modules and the terminating resistors are in one-to-one correspondence, the first switch modules and the corresponding terminating resistors are connected in series between the first power supply and the corresponding pins, the first switch modules are further connected with the expansion output module, and the expansion output module is in communication connection with the main control board through the communication bus. The expansion output module is arranged in the burn-in board, so that when a switching test is carried out on the device to be tested, the main control board does not need to directly control each first switch module, and each first switch module can be controlled by communicating with the expansion output module; the main control board only needs to provide one communication interface to be in communication connection with the expansion output module in the burn-in board, so that different tests can be switched, the number of pins of the main control board is reduced, and the structural complexity and cost are reduced.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of chip testing technology, and in particular to an aging board, a testing system and a testing method. Background Art

[0002] Aging board is a device specially used for long-term stability and reliability testing of devices, and is widely used in the fields of semiconductors and electronic components.

[0003] Traditional burn-in boards are mainly limited to aging tests on devices under test, and do not support current parameter tests. Since a large number of relays are used in the current burn-in boards to establish the connection between the pins of the device under test and the termination resistors, in order to meet the needs of current parameter testing, the main control board needs to control a large number of relays to disconnect the connection between the pins of the device under test and the termination resistors. This practice requires the main control board to allocate more pins to control these relays, resulting in a complex structure and increased costs. Summary of the invention

[0004] The embodiment of the present invention provides an aging board, a test system and a test method. By arranging an extended output module in the aging board, the number of pins connecting the main control board and the aging board is reduced, the structure is simplified and the cost is reduced.

[0005] In a first aspect, an embodiment of the present invention provides an aging board for performing an aging test on a device under test, the aging board comprising an extended output module, a plurality of first switch modules and a plurality of termination resistors; the device under test has a plurality of pins, the pins, the first switch module and the termination resistors correspond one to one, the first switch module and the corresponding termination resistor are connected in series between a first power supply and the corresponding pin, the first switch module is also connected to the extended output module, and the extended output module is connected to a main control board through a communication bus; the extended output module is configured to receive a first control signal of the main control board through the communication bus, and output a plurality of first control sub-signals to the plurality of first switch modules based on the first control signal, and receive a second control signal of the main control board through the communication bus, and output a plurality of second control sub-signals to the plurality of first switch modules based on the second control signal; the first switch module is configured to be turned on based on the first control sub-signal so that the first power supply, the first switch module, the termination resistor and the pin form a loop, and to be turned off based on the second control sub-signal to disconnect the loop.

[0006] In some embodiments, the extended output module includes an IO extension chip; the IO extension chip is connected to each of the first switch modules, and the IO extension chip is also communicatively connected to the main control board via the communication bus.

[0007] In some embodiments, the extended output module further includes a first switch unit; the first switch unit is connected to the IO extension chip and the first switch module respectively.

[0008] In some embodiments, the first switch module includes a first photorelay; a first end of the first photorelay is connected to the extended output module, a second end of the first photorelay is grounded, a third end of the first photorelay is connected to the first power supply, and a fourth end of the first photorelay is connected to the corresponding termination resistor, and the termination resistor is connected to the corresponding pin.

[0009] In some embodiments, the aging board also includes a second switch module; the second switch module is respectively connected to the extended output module, the pin, the second power supply, and the main control board; the extended output module is also configured to output a third control sub-signal to the second switch module based on the first control signal, and to output a fourth control sub-signal to the second switch module based on the second control signal; the second switch module is configured to establish a connection between the pin and the second power supply and disconnect the pin from the main control board based on the third control sub-signal, and to establish a connection between the pin and the main control board and disconnect the pin from the second power supply based on the fourth control sub-signal.

[0010] In some embodiments, the second switch module includes a second photorelay and a third photorelay; the first end of the second photorelay is connected to the third power supply, the second end of the second photorelay and the first end of the third photorelay are both connected to the extended output module, the second end of the third photorelay is grounded, the third end of the second photorelay is connected to the second power supply, the fourth end of the second photorelay and the third end of the third photorelay are connected to the pin, and the fourth end of the third photorelay is connected to the main control board.

[0011] In a second aspect, an embodiment of the present invention provides a test system, which includes a device under test, a main control board, and an aging board as described in any embodiment of the first aspect; the pins of the device under test are respectively connected to the aging board and the main control board, and the extended output module in the aging board is communicatively connected to the main control board via a communication bus.

[0012] In some embodiments, the main control board includes a control module, a DC test module, a read-write test module and a switching switch module; the control module is respectively connected to the DC test module, the read-write test module and the switching switch module, the control module is communicatively connected to the extended output module via the communication bus, and the switching switch module is also respectively connected to the DC test module, the read-write test module and the pins of the device under test; the control module is configured to control the working state of the switching switch module to establish a connection between the pin and the DC test module so that the device under test performs a DC test, or to establish a connection between the pin and the read-write test module so that the device under test performs a read-write test.

[0013] In some embodiments, the DC test module includes a parameter measurement unit, an AD acquisition unit and a second switch unit; the parameter measurement unit is connected to the control module, and the second switch unit is also connected to the AD acquisition unit, the control module and the switching switch module.

[0014] In some embodiments, the control module includes a first controller and a second controller; the first controller is respectively connected to the second controller, the extended output module and the read-write test module, and the second controller is respectively connected to the DC test module and the switching switch module.

[0015] In a third aspect, an embodiment of the present invention provides a testing method, which is applied to a testing system as described in any one of the embodiments of the second aspect, and the testing method includes: the control module sends a first control signal to the extended output module; the extended output module responds to the first control signal and outputs multiple first control sub-signals to multiple first switch modules respectively; the first switch module responds to the first control sub-signal to establish a connection between the pin and the first power supply, so that the aging board performs an aging test on the device under test or the main control board performs a read and write test on the device under test; the control module sends a second control signal to the extended output module; the extended output module responds to the second control signal and outputs multiple second control sub-signals to multiple first switch modules respectively; the first switch module responds to the second control sub-signal to disconnect the pin from the first power supply, so that the main control board performs a DC test on the device under test.

[0016] In some embodiments, the aging board also includes a second switch module, and the testing method also includes: when performing a read and write test on the device under test, the extended output module also responds to the first control sub-signal and outputs a third control sub-signal to the second switch module; the second switch module responds to the third control sub-signal to disconnect the pin from the main control board and establish a connection between the pin and the second power supply; when performing a DC test on the device under test, the extended output module also responds to the second control sub-signal and outputs a fourth control sub-signal to the second switch module; the second switch module responds to the fourth control sub-signal to establish a connection between the pin and the main control board and disconnect the pin from the second power supply.

[0017] In some embodiments, the main control board also includes a switching switch module, and the testing method also includes: when performing a read-write test or an aging test on the device under test, the control module sends a third control signal to the switching switch module, and the switching switch module responds to the third control signal to establish a connection between the pin and the read-write test module and disconnect the connection between the pin and the DC test module; when performing a DC test on the device under test, the control module sends a fourth control signal to the switching switch module, and the switching switch module responds to the fourth control signal to disconnect the connection between the pin and the read-write test module and establish a connection between the pin and the DC test module.

[0018] The beneficial effects of the embodiments of the present invention are as follows: the embodiments of the present invention provide an aging board, a test system and a test method, the aging board includes an extended output module, a plurality of first switch modules and a plurality of termination resistors; the device to be tested has a plurality of pins, the pins, the first switch modules and the termination resistors correspond one to one, the first switch module and the corresponding termination resistor are connected in series between the first power supply and the corresponding pins, the first switch module is also connected to the extended output module, and the extended output module is connected to the main control board via a communication bus. By arranging the extended output module in the aging board, when switching the device to be tested, the main control board does not need to directly control each first switch module, but can control each first switch module by communicating with the extended output module. The main control board only needs to provide a communication interface to communicate with the extended output module in the aging board to switch different tests, saving the number of pins of the main control board and reducing the complexity and cost of the structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0020] Figure 1 A structural block diagram of a test system provided by an embodiment of the present invention;

[0021] Figure 2 A partial structural block diagram of an aging board provided by an embodiment of the present invention;

[0022] Figure 3 A partial structural block diagram of another aging board provided by an embodiment of the present invention;

[0023] Figure 4 A partial structural block diagram of another aging board provided by an embodiment of the present invention;

[0024] Figure 5 A partial structural block diagram of another aging board provided by an embodiment of the present invention;

[0025] Figure 6 A structural block diagram of another test system provided by an embodiment of the present invention;

[0026] Figure 7 A structural block diagram of a main control board provided by an embodiment of the present invention;

[0027] Figure 8 A flowchart of a testing method provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0028] In order to facilitate the understanding of the present invention, the present invention is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element, or there can be one or more centered elements therebetween. When an element is described as "electrically connected" to another element, it can be directly connected to another element, or there can be one or more centered elements therebetween. The orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "bottom" and the like used in this specification is based on the orientation or positional relationship shown in the accompanying drawings, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0029] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this specification includes any and all combinations of one or more related listed items. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0030] The current double data rate (DDR) memory particle aging is tested using a repair tester during aging, which does not support DC testing of the parameter measurement unit (PMU); and the FT tester that can perform DC testing cannot be used for aging testing. This results in the need to use different testers when performing aging testing and DC testing on the device under test, resulting in increased development and testing costs. In addition, the main control board can be used to control a large number of relays in the aging board to disconnect the connection between the pins of the device under test and the termination resistor to support current parameter testing, but this method will cause the number of pins on the main control board to increase dramatically, resulting in a complex structure and increased costs. Among them, DC testing includes open circuit and short circuit testing, leakage current testing, and IDD testing. IDD testing refers to the test of the total current flowing into the device under test.

[0031] In order to solve the above technical problems, the embodiments of the present invention provide an aging board, a test system and a test method. An extended output module is arranged in the aging board, and the extended output module is communicatively connected with the main control board. The main control board is used to control the extended output module to output multiple control signals to multiple first switch modules to control the loop between each pin and the termination resistor, thereby reducing the number of pins of the main control board, reducing the structural complexity and cost.

[0032] In a first aspect, an embodiment of the present invention provides a burn-in board, referring to Figure 1 The aging board 100 is used to perform an aging test on a device under test 200 . The aging board 100 includes an extended output module 10 , a plurality of first switch modules 20 and a plurality of termination resistors 30 .

[0033] The device under test 200 has a plurality of pins 210, and the pins 210, the first switch module 20 and the termination resistor 30 correspond one to one. The first switch module 20 and the corresponding termination resistor 30 are connected in series between the first power source V1 and the corresponding pin 210. The first switch module 20 is also connected to the extended output module 10, and the extended output module 10 is connected to the main control board 300 through a communication bus. The extended output module 10 is configured to receive a first control signal of the main control board 300 through the communication bus, and output a plurality of first control sub-signals to the plurality of first switch modules 20 based on the first control signal, and receive a second control signal of the main control board 300 through the communication bus, and output a plurality of second control sub-signals to the plurality of first switch modules 20 based on the second control signal. The first switch module 20 is configured to be turned on based on the first control sub-signal so that the first power source V1, the first switch module 20, the termination resistor 30 and the pin 210 form a loop, and to be turned off based on the second control sub-signal so as to disconnect the loop.

[0034] The device under test 200 may be a DDR memory or other test chip, such as DDR4, which has a plurality of pins 210 for easy connection with external devices. The device under test has various packaging forms, including single or not limited to 78-ball grid array, 82-ball grid array and 496-ball grid array. By performing an aging test on the device under test 200, the state of the chip after long-term use, such as performance changes, can be detected.

[0035] The extended output module 10 refers to a device with multiple output terminals, which can be communicated with the main control board 300 and output multiple control sub-signals to multiple first switch modules 20 in response to the control signal of the main control board 200 to control the conduction state of the multiple first switch modules 20.

[0036] The first switch module 20 is a switch device on the aging board 100 for controlling the connection between the pin 210 of the device under test 200 and the termination resistor 30. Each pin 210 of the device under test 200 corresponds to a first switch module 20 and a termination resistor 30, and the first switch module 20 can be turned on or off according to the control sub-signal provided by the extended output module 10, thereby controlling the circuit connection state between the pin 210 of the device under test 200 and the termination resistor 30.

[0037] The terminating resistor 30 is a resistor on the aging board 100 that is connected in series with the pin 210 of the device under test 200. During the aging test, the terminating resistor 30 can simulate the load in the actual circuit to evaluate the performance of the device under test 200 under specific load conditions. At the same time, the terminating resistor 30 can also be used to limit the current to protect the device under test 200 from damage by excessive current.

[0038] The first power source V1 may be an external DC power source, which may be provided by the main control board 300 or other devices.

[0039] The main control board 300 is the core control unit of the aging test system, which is responsible for generating control signals and sending them to the extended output module 10 through the communication bus. The software or hardware logic on the main control board 300 can dynamically adjust the content of the control signal according to the test requirements, execute the test process and collect the test results.

[0040] In the aging board 100, the main control board 300 can send different control signals to the extended output module 10 through the communication bus. The extended output module 10 can output multiple control sub-signals to multiple first switch modules 20 based on the control signal to control the first switch module 20 to be in an on state or an off state, thereby establishing or disconnecting a loop. In this way, when the loop is established, an aging test or a read-write test can be performed on the device under test 200. When the loop is disconnected, a DC test can be performed on the device under test 200, such as a leakage current test, an open circuit test, and a short circuit test.

[0041] It can be seen that in the present invention, by setting an extended output module 10 in the aging board 100, when performing a switching test on the device under test 200, there is no need for the main control board 200 to directly control each first switch module 20. Instead, each first switch module 20 can be controlled by communicating with the extended output module 10. The main control board 300 only needs to provide a communication interface to communicate with the extended output module 10 in the aging board 100 to achieve switching of different tests, thereby saving the number of pins of the main control board 300 and reducing the structural complexity and cost.

[0042] In some of these embodiments, see Figure 2 The extended output module 10 includes an IO extension chip 11; the IO extension chip 11 is connected to each first switch module 20, and the IO extension chip 11 is also connected to the main control board 300 through a communication bus.

[0043] The IO expansion chip 11 is a chip specifically used to increase or expand the input and output ports of the system. Specifically, the IO expansion chip 11 can be a TCA9539QPWRQ1 chip, and the communication bus can be an I 2C communication bus, that is, the IO expansion chip 11 communicates with the main control board 300 using the I 2C communication protocol, and the number of IO expansion chips 11 can be set according to actual needs.

[0044] In this embodiment, by setting the IO expansion chip 11 to provide additional IO ports, the main control board 300 only needs to provide a communication interface for communicating with the IO expansion chip 11 to control multiple first switch modules 20, so as to control whether the loop between multiple pins 210 of the device under test 200, the termination resistor 30 and the first power supply V1 is turned on, thereby switching different tests on the device under test 200, and the aging board 100 can support a test environment of up to 110°C and can stably operate in an environment of 98°C.

[0045] In some of these embodiments, see Figure 3 The extended output module 10 further includes a first switch unit 12; the first switch unit 12 is connected to the IO extension chip 11 and the first switch module 20 respectively.

[0046] For the convenience of management, the first switch modules 20 can be grouped and controlled. For example, the first switch modules 20 corresponding to the same type of pins 210 are grouped together. In this embodiment, in order to save the output pins 210 of the IO expansion chip 11, the conduction states of the first switch modules 20 of different groups can be controlled by the conduction states of multiple first switch units 12. In this way, the IO expansion chip 11 can control the conduction states of the first switch units 12 to control the conduction states of multiple groups of first switch modules 20. Specifically, the control end of the first switch unit 12 is connected to the IO expansion chip 11, one end of the first switch unit 12 is connected to the fourth power supply V4, such as a 3.3V power supply, and the other end of the first switch unit 12 is respectively connected to multiple first switch modules 20 of the same group. The first switch unit 12 may include a PMOS tube or a PNP transistor. In this way, the IO expansion chip 11 can control the conduction or disconnection of the first switch unit 12 to control the connection state between the first switch module 20 and the fourth power supply V4, so that the first switch module 20 is in the conduction or disconnection state.

[0047] In this embodiment, by using the first switch unit 12, group control of multiple first switch modules 20 can be achieved, so that multiple first switch modules 20 that originally require multiple IO expansion chip 11 output pins 210 to be controlled separately can be controlled synchronously through the control of one or a few first switch units 12, thereby greatly saving the output pin resources of the IO expansion chip 11.

[0048] In some of these embodiments, see Figure 4 The first switch module 20 includes a first photorelay U1; a first end of the first photorelay U1 is connected to the extended output module 10, a second end of the first photorelay U1 is grounded GND, a third end of the first photorelay U1 is connected to the first power supply V1, a fourth end of the first photorelay U1 is connected to the corresponding termination resistor 30, and the termination resistor 30 is connected to the corresponding pin 210.

[0049] The first photorelay U1 can adopt TLP3450 chip, the first control sub-signal can be a high-level signal, and the second control sub-signal can be a low-level signal. After the first photorelay U1 receives the high-level signal output by the extended output module 10, the light-emitting diode between the first end and the second end will emit light to make the connection between the third end and the fourth end conductive, that is, the loop between the first power supply V1 and the termination resistor 30 and the pin 210 is conductive. After the first photorelay U1 receives the low-level signal output by the extended output module 10, the light-emitting diode between the first end and the second end will not emit light, and the connection between the third end and the fourth end will be disconnected, that is, the loop between the first power supply V1 and the termination resistor 30 and the pin 210 is disconnected.

[0050] In this embodiment, by setting the first optical relay U1 as the first switch module 20, the control signal is transmitted through the optical signal, which has higher isolation performance than the traditional relay with direct electrical connection.

[0051] In some embodiments, see Figure 4 In order to protect the light-emitting diode in the first photorelay U1, a current-limiting resistor Rp1 may be connected between the second end of the first photorelay U1 and the ground GND, and / or, in order to improve the stability of the power supply, a first capacitor C1 may be provided to be connected to the first power supply V1 and the ground GND respectively, and the first power supply V1 may be filtered by the first capacitor C1 to improve the circuit stability.

[0052] In some of these embodiments, see Figure 5 , the aging board 100 also includes a second switch module 40. The second switch module 40 is respectively connected to the extended output module 10, the pin 210, the second power supply V2, and the main control board 300. The extended output module 10 is also configured to output a third control sub-signal to the second switch module 40 based on the first control signal, and to output a fourth control sub-signal to the second switch module 40 based on the second control signal. The second switch module 40 is configured to establish a connection between the pin 210 and the second power supply V2 and disconnect the connection between the pin 210 and the main control board 300 based on the third control sub-signal, and to establish a connection between the pin 210 and the main control board 300 and disconnect the connection between the pin 210 and the second power supply V2 based on the fourth control sub-signal.

[0053] The voltage value of the second power supply V2 may be 0 V, or a voltage higher than 0 V. For example, for a pin 210 in the device under test 200 that needs to be pulled up when performing a read / write test, the voltage value of the second power supply V2 connected to the corresponding second switch module 40 may be a voltage higher than 0 V, and for a pin 210 in the device under test 200 that needs to be pulled down when performing a read / write test, the voltage value of the second power supply V2 connected to the corresponding second switch module 40 may be 0 V, that is, grounded.

[0054] The second switch module 40 can be a switching switch or any other suitable switch device, which can change the connection state between the pin 210 and the second power supply V2, and change the connection state between the pin 210 and the main control board 300 under different signal indications. Specifically, the first control signal includes a first A control signal and a first B control signal. When it is necessary to perform an aging test on the device under test 200, the main control board 300 sends the first A control signal to the extended output module 10, and the extended output module 10 outputs the first control sub-signal to the first switch module 20 based on the first A control signal, and the first switch module 20 is turned on; when it is necessary to perform a read and write test on the device under test 200, the main control board 300 sends the first B control signal to the extended output module 10, and the extended output module 10 outputs the first control sub-signal to the first switch module 20 based on the first B control signal and outputs the third control sub-signal to the second switch module 40, and the first switch module 20 is turned on, and the first B control signal is turned on. The second switch module 40 will establish a connection between the pin 210 and the second power supply V2 based on the third control sub-signal and disconnect the pin 210 from the main control board 300, so that the pin 210 is pulled up or down; when it is necessary to perform a DC test on the device under test 200, the main control board 300 sends a second control signal to the extended output module 10, and the extended output module 10 will output a second control sub-signal to the first switch module 20 based on the second control signal and output a fourth control sub-signal to the second switch module 40, the first switch module 20 is disconnected, and the second switch module 40 establishes a connection between the pin 210 and the main control board 300 and disconnects the connection between the pin 210 and the second power supply V2.

[0055] In this embodiment, by setting a second switch module 40, the main control board 300 can control the second switch module 40 to be in a conducting state through the extended output module 10, so that the pin 210 is connected to the second power supply V2 in the read-write test state to achieve a pull-up level or a pull-down level. In this way, there is no need to set a circuit for pulling up or pulling down the level of the pin 210 in the main control board 300, thereby reducing the structure in the main control board 300; or the main control board 300 can control the second switch module 40 through the extended output module 10 to establish a connection between the pin 210 and the main control board 300, so as to perform a DC test on the pin 210.

[0056] In some of these embodiments, see Figure 5 The second switch module 40 includes a second photorelay U2 and a third photorelay U3; the first end of the second photorelay U2 is connected to the third power supply V3, the second end of the second photorelay U2 and the first end of the third photorelay U3 are both connected to the extended output module 10, the second end of the third photorelay U3 is grounded GND, the third end of the second photorelay U2 is connected to the second power supply V2, the fourth end of the second photorelay U2 and the third end of the third photorelay U3 are connected to the pin 210, and the fourth end of the third photorelay U3 is connected to the main control board 300.

[0057] The second photorelay U2 and the third photorelay U3 can use TLP3450 chip, the third control sub-signal is a low-level signal, and the fourth control sub-signal is a high-level signal. When the extended output module 10 outputs a low-level signal to the second photorelay U2 and the third photorelay U3, the light-emitting diode between the first end and the second end of the second photorelay U2 is turned on, so that the connection between the third end and the fourth end of the second photorelay U2 is turned on, and the light-emitting diode between the first end and the second end of the third photorelay U3 is not turned on, so that the connection between the third end and the fourth end of the third photorelay U3 is turned on, so that the connection between the pin 210 and the second power supply V2 is turned on; when the extended output module 10 outputs a high-level signal to the second photorelay U2 and the third photorelay U3, the light-emitting diode between the first end and the second end of the second photorelay U2 is not turned on, and the light-emitting diode between the first end and the second end of the third photorelay U3 is turned on, so that the connection between the pin 210 and the main control board 300 is turned on.

[0058] In this embodiment, the second optical relay U2 and the third optical relay U3 are provided as the second switch module 40 to achieve transmission of control signals through optical signals, which has higher isolation performance than conventional relays that are directly electrically connected.

[0059] In a second aspect, an embodiment of the present invention provides a test system, referring to Figure 1 The test system includes a device under test 200, a main control board 300, and a burn-in board 100 as described in any embodiment of the first aspect. The pins 210 of the device under test 200 are connected to the burn-in board 100 and the main control board 300 respectively, and the extended output module 10 in the burn-in board 100 is communicatively connected to the main control board 300 via a communication bus.

[0060] In this embodiment, the aging board 100 has the same structure and function as the aging board 100 described in any one of the first aspects, which will not be described in detail herein.

[0061] In this test system, the extended output module 10 in the aging board 100 communicates with the main control board 300, so that the main control board 300 can control multiple first switch modules 20 through the extended output module 10 to switch different tests, thereby reducing the number of pins of the main control board 300 and reducing the structural complexity and cost.

[0062] In some of these embodiments, see Figure 6 The main control board 300 includes a control module 310, a DC test module 320, a read-write test module 330 and a switch module 340. The control module 310 is connected to the DC test module 320, the read-write test module 330 and the switch module 340 respectively. The control module 310 is connected to the extended output module 10 through a communication bus. The switch module 340 is also connected to the DC test module 320, the read-write test module 330 and the pin 210 of the device under test 200 respectively. The control module 310 is configured to control the working state of the switch module 340 to establish a connection between the pin 210 and the DC test module 320 so that the device under test 200 performs a DC test, or to establish a connection between the pin 210 and the read-write test module 330 so that the device under test 200 performs a read-write test.

[0063] The DC test module 320 is a module that can perform DC parameter tests on each pin 210 of the device under test 200. For example, the DC test module 320 can provide a DC power supply to the pin 210 of the device under test 200 and measure the current value passing through the pin 210 to evaluate the working performance and electrical characteristics of the device under test 200 under different voltage or current conditions, such as leakage current.

[0064] The read / write test module 330 is a module that can perform read / write tests on each pin 210 of the device under test 200. For example, the read / write test module 330 sends data to the pin 210 to perform a write operation, or receives data from the pin 210 to perform a read operation, thereby verifying the data processing capability, data transmission rate, and communication protocol of the device under test 200.

[0065] The switching module 340 is a module that can establish connections between different ends when receiving different control signals, so that the connection status between each pin 210 and the DC test module 320 and the read-write test module 330 can be changed.

[0066] Under different tests, the main control board 300 can selectively connect the DC test module 320 or the read-write test module 330 to the pins of the device under test by controlling the switching module 340, so as to facilitate different tests. For example, when performing an aging test, the main control board 300 controls the switching module 340 to be turned off, so that the pin 210 of the device under test 200 is neither connected to the DC test module 320 nor to the read-write test module 330; when performing a DC test, the main control board 300 controls the switching module 340 to connect the pin 210 of the device under test 200 to the DC test module 320; when performing a read-write test, the main control board 300 controls the switching module 340 to connect the pin 210 of the device under test 200 to the read-write test module 330. In this flexible way, different tests can be performed on the pins without changing the hardware.

[0067] In some of these embodiments, see Figure 7 The DC test module 320 includes a parameter measurement unit 321, an AD acquisition unit 322 and a second switch unit 323. The parameter measurement unit 321 is connected to the control module 310, and the second switch unit 322 is also connected to the AD acquisition unit 322, the control module 310 and the switch module 340.

[0068] The parameter measurement unit (PMU) 321 is a device specifically used to measure circuit parameters. In the DC test module 320, the parameter measurement unit 321 is responsible for leakage current testing, open circuit testing, and short circuit testing.

[0069] The AD acquisition unit 322 and the parameter measurement unit 321 are connected to the second switch unit 323 at the same time. The AD acquisition unit 322 can more accurately measure and determine whether the signal output by the parameter measurement unit 321 is correct, so as to ensure the reliability of the test.

[0070] The second switch unit 323 is an electronic component for switching signals between multiple circuit paths, and may include switch devices such as analog switches and relays. In the DC test module 320, the second switch unit 323 selectively connects or disconnects the connection between the pin 210 and the parameter measurement unit 321 according to the instruction of the control module 310.

[0071] In this embodiment, by providing the parameter measurement unit 321 and the second switch unit 323 , a DC test can be performed on the pin 210 .

[0072] In some of these embodiments, see Figure 7The control module 310 includes a first controller 311 and a second controller 312. The first controller 311 is connected to the second controller 312, the extended output module 10 and the read-write test module 330 respectively, and the second controller 312 is connected to the DC test module 320 and the switch module 340 respectively.

[0073] Specifically, the first controller 311 can be a central processing unit (CPU), the second controller 312 can be a field programmable gate array (FPGA), the first controller 311 and the second controller 312 can be communicatively connected via an SPI communication bus, the first controller 311 and the read-write test module 330 can be communicatively connected via an SPI communication bus, the first controller 311 and the extended output module 10 can be communicatively connected via an I2C communication bus, the second controller 321 and the parameter measurement unit 321 can be communicatively connected via an SPI communication bus, and the second controller 321 is also respectively connected to the second switch unit 323 and the switching switch module 340.

[0074] In this embodiment, by setting two controllers as the control module 310, different tasks can be assigned to the two controllers for processing, thereby improving data processing efficiency.

[0075] In a third aspect, an embodiment of the present invention provides a testing method, which is applied to a testing system as in any one of the second aspects, referring to Figure 8 , the test method includes:

[0076] Step S10 : the control module 310 sends a first control signal to the expansion output module 10 .

[0077] Specifically, Figure 6 and Figure 7 Taking the embodiment shown as an example, in this step, the first control signal includes a first A control signal and a first B control signal. When performing an aging test, the first controller 311 sends the first A control signal to the extended output module 10 through the I2C communication bus. When performing a read-write test, the first controller 311 sends the first B control signal to the extended output module 10 through the I2C communication bus.

[0078] Step S20 : ​​the expansion output module 10 outputs a plurality of first control sub-signals to the first switch module 20 in response to the first control signal.

[0079] After receiving the first A control signal or the first B control signal, the extended output module 10 outputs a plurality of first control sub-signals to the plurality of first switch modules 20 .

[0080] Step S30: the first switch module 20 establishes a connection between the pin 210 and the first power source V1 in response to the first control sub-signal, so that the aging board 100 performs an aging test on the device under test 200 or the main control board 300 performs a read-write test on the device under test 200;

[0081] Next, the first switch module 20 is turned on after receiving the first control signal, so that the loop among the pin 210, the terminating resistor 30, the first switch module 20 and the first power supply V1 is turned on, so that the DUT 200 can be subjected to an aging test or a read / write test.

[0082] Step S40 : the control module 310 sends a second control signal to the expansion output module 10 .

[0083] When performing a DC test, the first controller 311 sends a second control signal to the expansion output module 10 via the I 2C communication bus.

[0084] Step S50 : the extended output module 10 outputs a plurality of second control sub-signals to the plurality of first switch modules 20 in response to the second control signal.

[0085] After receiving the second control signal, the extended output modules 10 each output a plurality of second control sub-signals to the plurality of first switch modules 20 .

[0086] Step S60 : the first switch module 20 disconnects the pin 210 from the first power source V1 in response to the second control sub-signal, so that the main control board 300 performs a DC test on the device under test 200 .

[0087] Next, the first switch module 20 is turned off after receiving the first control signal, so that the loop between the pin 210, the terminating resistor 30, the first switch module 20 and the first power supply V1 is disconnected, so that the DC test can be performed on the device under test 200.

[0088] It can be seen that in this embodiment, the main control board 300 only needs to communicate with the extended output module 10 to control the working state of each first switch module 20, thereby switching different tests.

[0089] In some embodiments, the aging board 100 further includes a second switch module 40, and the testing method further includes the following steps:

[0090] Step S71: When performing a read and write test on the device under test 200, the extended output module 10 also responds to the first control sub-signal and outputs a third control sub-signal to the second switch module 40. Step S72: The second switch module 40 responds to the third control sub-signal to disconnect the pin 210 from the main control board 300 and establish a connection between the pin 210 and the second power supply V2.

[0091] Specifically, when performing a read and write test, when the extended output module 10 receives the first B control signal, the extended output module 10 also outputs a third control sub-signal to the second switch module 40, so that the connection between the pin 210 and the second power supply V2 is established to pull up or down the level of the pin 210.

[0092] Step S73: When performing a DC test on the device under test 200, the extended output module 10 also responds to the second control sub-signal and outputs a fourth control sub-signal to the second switch module 40. Step S74: The second switch module 40 responds to the fourth control sub-signal to establish a connection between the pin 210 and the main control board 300 and disconnect the pin 210 from the second power supply V2.

[0093] Specifically, when performing a DC test, the extended output module 10 also controls the second switch module 40 to disconnect the connection between the pin 210 and the second power supply V2, and establishes a connection between the pin 210 and the main control board 300, so that the main control board 300 can subsequently perform a DC test on the pin 210.

[0094] In this embodiment, the main control board 300 can control the second switch module 40 to be in the on state through the extended output module 10, so that the pin 210 is connected to the second power supply V2 in the read-write test state to achieve a pull-up level or a pull-down level. In this way, there is no need to set a circuit for pulling up or pulling down the level of the pin 210 in the main control board 300, thereby reducing the structure in the main control board 300; in addition, the main control board 300 can establish a connection between the main control board 300 and the pin 210 by controlling the second switch module 40 to perform a DC test on the pin 210.

[0095] In some embodiments, the main control board 300 includes a switching switch module 340, and the testing method further includes the following steps: Step S81: When performing a read-write test or an aging test on the device under test 200, the control module 310 sends a third control signal to the switching switch module 340, and the switching switch module 340 responds to the third control signal to establish a connection between the pin 210 and the read-write test module 330 and disconnect the connection between the pin 210 and the DC test module 320. Step S82: When performing a DC test on the device under test 200, the control module 310 sends a fourth control signal to the switching switch module 340, and the switching switch module 340 responds to the fourth control signal to disconnect the connection between the pin 210 and the read-write test module 330 and establish a connection between the pin 210 and the DC test module 320.

[0096] Specifically, when performing a read / write test or an aging test on the device under test 200, the second controller 312 sends a third control signal to the switching module 340, and the switching module 340 can establish a connection between the pin 210 and the read / write test module 330 based on the third control signal, so that the second controller 312 can control the read / write test module 330 to work and implement a read / write test, or run some test programs when performing an aging test on the device under test 200. When performing a DC test on the device under test 200, the second controller 312 sends a fourth control signal to the switching module 340, and the switching module 340 can establish a connection between the pin 210 and the DC test module 320 based on the fourth control signal, such as establishing a connection between the pin 210 and the second switch unit 323, so that the second controller 312 can control the parameter measurement unit 321 and the second switch unit 323 to work and implement a DC test.

[0097] The specific control process of the read / write test and the DC test can refer to the prior art and is not limited here. In this embodiment, by controlling the working state of the switching module 340, the module connected to the pin 210 is changed, so that different tests can be performed.

[0098] It should be noted that the device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may also be combined, the steps may be implemented in any order, and there are many other changes in different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they may still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An aging board, characterized in that: Used for performing aging test on the device under test, the aging board comprises an extended output module, a plurality of first switch modules and a plurality of termination resistors; The device under test has a plurality of pins, and the pins, the first switch module and the termination resistor correspond to each other one by one. The first switch module and the corresponding termination resistor are connected in series between the first power supply and the corresponding pin. The first switch module is also connected to the extended output module, and the extended output module is connected to the main control board through a communication bus. The extended output module is configured to receive a first control signal from the main control board through the communication bus, and output a plurality of first control sub-signals to the plurality of first switch modules based on the first control signal, and receive a second control signal from the main control board through the communication bus, and output a plurality of second control sub-signals to the plurality of first switch modules based on the second control signal; The first switch module is configured to be turned on based on the first control sub-signal to form a loop among the first power supply, the first switch module, the termination resistor and the pin, and to be turned off based on the second control sub-signal to disconnect the loop.

2. The aging board according to claim 1, characterized in that: The extended output module includes an IO extension chip; The IO expansion chip is connected to each of the first switch modules, and the IO expansion chip is also communicatively connected to the main control board via the communication bus.

3. The aging board according to claim 2, characterized in that: The extended output module also includes a first switch unit; The first switch unit is connected to the IO expansion chip and the first switch module respectively.

4. The aging board according to claim 1, characterized in that: The first switch module includes a first photorelay; The first end of the first photorelay is connected to the extended output module, the second end of the first photorelay is grounded, the third end of the first photorelay is connected to the first power supply, the fourth end of the first photorelay is connected to the corresponding termination resistor, and the termination resistor is connected to the corresponding pin.

5. The aging board according to any one of claims 1 to 4, characterized in that: The aging board also includes a second switch module; The second switch module is respectively connected to the extended output module, the pin, the second power supply, and the main control board; The extended output module is further configured to output a third control sub-signal to the second switch module based on the first control signal, and to output a fourth control sub-signal to the second switch module based on the second control signal; The second switch module is configured to establish a connection between the pin and the second power supply and disconnect the connection between the pin and the main control board based on the third control sub-signal, and to establish a connection between the pin and the main control board and disconnect the connection between the pin and the second power supply based on the fourth control sub-signal.

6. The aging board according to claim 5, characterized in that: The second switch module includes a second photorelay and a third photorelay; The first end of the second photorelay is connected to the third power supply, the second end of the second photorelay and the first end of the third photorelay are both connected to the extended output module, the second end of the third photorelay is grounded, the third end of the second photorelay is connected to the second power supply, the fourth end of the second photorelay and the third end of the third photorelay are connected to the pin, and the fourth end of the third photorelay is connected to the main control board.

7. A testing system, characterized in that: It comprises a device under test, a main control board, and an aging board as claimed in any one of claims 1 to 6; The pins of the device under test are respectively connected to the aging board and the main control board, and the extended output module in the aging board is communicatively connected to the main control board via a communication bus.

8. The test system according to claim 7, characterized in that: The main control board includes a control module, a DC test module, a read-write test module and a switch module; The control module is connected to the DC test module, the read-write test module and the switch module respectively, the control module is connected to the extended output module through the communication bus, and the switch module is also connected to the DC test module, the read-write test module and the pins of the device under test respectively; The control module is configured to control the working state of the switching module to establish a connection between the pin and the DC test module so that the device under test performs a DC test, or to establish a connection between the pin and the read-write test module so that the device under test performs a read-write test.

9. The test system according to claim 8, characterized in that: The DC test module includes a parameter measurement unit, an AD acquisition unit and a second switch unit; The parameter measurement unit is connected to the control module, and the second switch unit is also connected to the AD acquisition unit, the control module and the switching module.

10. The test system according to claim 9, characterized in that: The control module includes a first controller and a second controller; The first controller is connected to the second controller, the extended output module and the read-write test module respectively, and the second controller is connected to the DC test module and the switching switch module respectively.

11. A testing method, characterized in that: Applied to the test system according to any one of claims 7 to 10, the test method comprises: The control module sends a first control signal to the extended output module; The extended output module outputs a plurality of first control sub-signals to a plurality of first switch modules respectively in response to the first control signal; The first switch module establishes a connection between the pin and the first power supply in response to the first control sub-signal, so that the aging board performs an aging test on the device under test or the main control board performs a read-write test on the device under test; The control module sends a second control signal to the extended output module; The extended output module outputs a plurality of second control sub-signals to a plurality of the first switch modules respectively in response to the second control signal; The first switch module disconnects the pin from the first power source in response to the second control sub-signal, so that the main control board performs a DC test on the device under test.

12. The testing method according to claim 11, characterized in that: The aging board also includes a second switch module, and the testing method also includes: When performing a read and write test on the device under test, the extended output module also outputs a third control sub-signal to the second switch module in response to the first control sub-signal; The second switch module disconnects the connection between the pin and the main control board and establishes the connection between the pin and the second power supply in response to the third control sub-signal; When performing a DC test on the device under test, the extended output module further outputs a fourth control sub-signal to the second switch module in response to the second control sub-signal; The second switch module establishes a connection between the pin and the main control board and disconnects a connection between the pin and the second power source in response to the fourth control sub-signal.

13. The testing method according to claim 11, characterized in that: The main control board also includes a switching switch module, and the testing method also includes: When performing a read / write test or an aging test on the device under test, the control module sends a third control signal to the switching module, and the switching module establishes a connection between the pin and the read / write test module and disconnects the connection between the pin and the DC test module in response to the third control signal; When performing a DC test on the device under test, the control module sends a fourth control signal to the switching module, and the switching module disconnects the connection between the pin and the read-write test module and establishes a connection between the pin and the DC test module in response to the fourth control signal.

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