Clamp for wafer aging test
By designing modular wafer aging test fixtures, including probe plate assembly, chuck assembly and heating suction cup assembly, the problems of complex structure, inconvenient operation, low reliability and large volume in the prior art are solved, efficient and reliable large-scale testing is achieved, and space occupation is reduced.
Patent Information
- Application Number
- CN202510022272.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2025-03-25
AI Technical Summary
The existing wafer aging test fixtures have complex structures, inconvenient operation, low testing efficiency, and low reliability, which can easily cause damage to wafer devices, large size and take up more space.
A modular fixture is designed, including a fixture probe plate assembly, a fixture chuck assembly and a heating suction cup assembly. The fixture probe plate assembly realizes the aging test signal transmission of wafers through the plate pallet, the plate adapter plate, the probe fixing plate and the bolt assembly. The fixture chuck assembly forms a sealing structure through the chuck base, inflatable joint and inner line adapter plate to provide protection and heat insulation. The heating suction cup assembly achieves uniform heating by heating the suction cup, heating sheet and thermally conductive material.
The structural modular design of the fixture is realized, which is easy to operate, improves testing efficiency, and is suitable for large-scale testing; the reliability of the device is improved, and the protection of wafer devices is ensured; the volume of the device is reduced and the space is occupied.
Smart Images
Figure CN119689220A_ABST