Equipment control method based on integrated manufacturing system and integrated manufacturing system

Abstract

The invention discloses an equipment control method based on an integrated manufacturing system and the integrated manufacturing system, and relates to the technical field of control, the integrated manufacturing system comprises a manufacturing execution system and an equipment automation system, and a database of differentiated chip taking rules is established through the manufacturing execution system; the database comprises a plurality of differentiated film taking rules of the multi-chamber machine, and each differentiated film taking rule of the multi-chamber machine comprises a plurality of different film taking rules; the rule labels corresponding to the multi-chamber machines in the production line are configured through the equipment automation system, and the rule labels of the multi-chamber machines with the same number of chambers are different. According to the method and the device, differentiated sheet taking of the processing machine tables in the production line can be realized flexibly, so that the efficiency of positioning and analyzing the machine tables with the abnormal process when the product goes wrong is improved, the time consumed for positioning the abnormity is shortened as far as possible, the abnormity is eliminated more quickly, and the influence of the machine tables with the abnormal process on the subsequent production line production is reduced.

Description

Technical Field

[0001] The present application relates to the field of control technology, and in particular to an equipment control method based on an integrated manufacturing system and an integrated manufacturing system. Background Art

[0002] The manufacturing of chips requires hundreds of processing steps, and each process will affect the final performance of the chip. When manufacturing chips, a batch of wafers (LOT) is usually used as a processing unit and sent to the machine on the production line for processing. A batch of wafers includes multiple wafers. Monitoring and locating process abnormalities in a batch of wafers (LOT) after being sent to the production line is of great significance for optimizing chip processing technology and improving yield.

[0003] However, current chip manufacturing usually relies on the software of the machines in the production line to set the chip picking rules. The chip picking rules are usually fixed and single and cannot be flexibly set. The regular chip picking rules make it more difficult to monitor and locate machines with process abnormalities. It takes a lot of time to query the abnormalities through verification experiments, which will have an adverse impact on the production progress of the production line. Summary of the invention

[0004] The embodiments of the present application provide a solution that is not limited by the software and hardware of the machine itself, and can achieve flexible and differentiated film picking for processing machines in the production line, thereby improving the efficiency of locating and analyzing machines with process abnormalities when product problems occur, shortening the time spent on locating abnormalities as much as possible, eliminating abnormalities more quickly, and reducing the impact of machines with process abnormalities on subsequent production lines.

[0005] The embodiments of the present application provide the following technical solutions:

[0006] According to one embodiment of the present application, a device control method based on an integrated manufacturing system is provided, wherein the integrated manufacturing system includes a manufacturing execution system and an equipment automation system, and the method includes: establishing a database of differentiated film picking rules through the manufacturing execution system, wherein the database includes differentiated film picking rules for a variety of multi-chamber machines, and each differentiated film picking rule for the multi-chamber machine includes a plurality of different film picking rules; configuring rule labels corresponding to the multi-chamber machines in the production line through the equipment automation system, wherein the rule labels are different between multi-chamber machines with the same number of chambers, and each rule label corresponds to a film picking rule in the database.

[0007] In some embodiments of the present application, after configuring the rule labels corresponding to the multi-chamber machines in the production line through the equipment automation system, the method further includes: receiving, through the manufacturing execution system, feedback from the equipment automation system on the correspondence between the multi-chamber machines and the rule labels, so as to allocate film taking rules when producing on the production line according to the correspondence.

[0008] In some embodiments of the present application, after receiving the correspondence between the multi-chamber machine and the rule label fed back by the equipment automation system through the manufacturing execution system, the method further includes: determining the machine to be picked up during production on the production line through the manufacturing execution system; acquiring the film picking rules corresponding to the machine to be picked up from the database according to the correspondence, and obtaining target film picking rules; sending the target film picking rules to the equipment automation system through the manufacturing execution system; and controlling the machine to be picked up through the equipment automation system to perform film picking processing from the wafer batch according to the target film picking rules.

[0009] In some embodiments of the present application, obtaining the film picking rules corresponding to the machine to be picked up from the database according to the corresponding relationship to obtain the target film picking rules includes: querying whether there is a rule tag corresponding to the machine to be picked up in the corresponding relationship; if so, obtaining the film picking rules corresponding to the rule tag corresponding to the machine to be picked up from the database; and obtaining the target film picking rules according to the film picking rules corresponding to the rule tag corresponding to the machine to be picked up.

[0010] In some embodiments of the present application, the target film picking rule is obtained according to the film picking rule corresponding to the rule label corresponding to the machine to be picked up, including: judging whether the film picking rule corresponding to the rule label corresponding to the machine to be picked up matches the number of available chambers of the machine to be picked up; if they match, determining the film picking rule corresponding to the rule label corresponding to the machine to be picked up as the target film picking rule.

[0011] In some embodiments of the present application, after determining whether the film picking rule corresponding to the rule label corresponding to the machine to be picked up matches the number of available chambers of the machine to be picked up, the method further includes: if there is no match, obtaining a supplementary film picking rule from a public library through the manufacturing execution system that matches the number of available chambers of the machine to be picked up and is different from the film picking rule configured for the multi-chamber machine in the production line; and determining the supplementary film picking rule as the target film picking rule.

[0012] In some embodiments of the present application, after querying whether there is a rule label corresponding to the machine to be picked up in the corresponding relationship, the method also includes: if it does not exist and the machine to be picked up has multiple chambers, obtaining from the public library through the manufacturing execution system a candidate film picking rule that matches the number of available chambers of the machine to be picked up and is different from the film picking rules configured for the multi-chamber machine in the production line; and sending the candidate film picking rule to the equipment automation system through the manufacturing execution system.

[0013] In some embodiments of the present application, the database of differentiated wafer picking rules is established through the manufacturing execution system, including: obtaining the number of wafers included in the wafer batch to be processed and the number of chambers of the multi-chamber machine in the production line through the manufacturing execution system; and establishing a database of differentiated wafer picking rules based on the number of wafers and the number of chambers of the multi-chamber machine in the production line.

[0014] According to one embodiment of the present application, an integrated manufacturing system includes: a manufacturing execution system for establishing a database of differentiated film picking rules, wherein the database includes differentiated film picking rules for a variety of multi-chamber machines, and each differentiated film picking rule for the multi-chamber machine includes a plurality of different film picking rules; an equipment automation system for configuring rule labels corresponding to the multi-chamber machines in the production line, wherein the rule labels are different between multi-chamber machines with the same number of chambers, and each rule label corresponds to a film picking rule in the database.

[0015] In some embodiments of the present application, the manufacturing execution system is further used to: receive the correspondence between the multi-chamber machine and the rule label fed back by the equipment automation system, so as to allocate film extraction rules during production on the production line according to the correspondence.

[0016] In some embodiments of the present application, the manufacturing execution system is also used to: determine the machine to be picked up during production on the production line; obtain the wafer picking rules corresponding to the machine to be picked up from the database according to the corresponding relationship, and obtain the target wafer picking rules; send the target wafer picking rules to the equipment automation system; accordingly, the equipment automation system is also used to: control the machine to be picked up to perform wafer picking processing from the wafer batch according to the target wafer picking rules.

[0017] In some embodiments of the present application, the manufacturing execution system is also used to: query whether there is a rule label corresponding to the machine to be picked up in the corresponding relationship; if so, obtain the film picking rule corresponding to the rule label corresponding to the machine to be picked up from the database to obtain the target film picking rule.

[0018] According to another embodiment of the present application, a storage medium stores a computer program thereon, and when the computer program is executed by a processor of a computer, the computer executes the method described in the embodiment of the present application.

[0019] According to another embodiment of the present application, an electronic device may include: a memory storing a computer program; and a processor reading the computer program stored in the memory to execute the method described in the embodiment of the present application.

[0020] According to another embodiment of the present application, a computer program product or a computer program includes a computer instruction stored in a computer-readable storage medium. A processor of a computer device reads the computer instruction from the computer-readable storage medium, and the processor executes the computer instruction, so that the computer device executes the method provided in various optional implementations described in the embodiments of the present application.

[0021] In an embodiment of the present application, an integrated manufacturing system includes a manufacturing execution system and an equipment automation system. A database of differentiated film picking rules is established through the manufacturing execution system, wherein the database includes differentiated film picking rules for a variety of multi-chamber machines, and each differentiated film picking rule of the multi-chamber machine includes a plurality of different film picking rules. Rule labels corresponding to the multi-chamber machines in the production line are configured through the equipment automation system, wherein the rule labels are different between multi-chamber machines with the same number of chambers, and each rule label corresponds to a film picking rule in the database.

[0022] In this way, through the combination of the manufacturing execution system and the equipment automation system, differentiated film picking rules can be flexibly set for the processing machines in the production line. According to the differentiated film picking rules, the machines with process abnormalities can be further efficiently and accurately located. Without being restricted by the machine's own hardware and software, it is possible to flexibly and differentiatedly pick films for the processing machines in the production line, thereby improving the efficiency of locating and analyzing machines with process abnormalities when product problems occur, shortening the time spent on locating abnormalities as much as possible, eliminating abnormalities more quickly, and reducing the impact of machines with process abnormalities on subsequent production lines. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 An architectural diagram based on an integrated manufacturing system according to an embodiment of the present application is shown.

[0025] Figure 2 A flow chart of a device control method based on an integrated manufacturing system according to an embodiment of the present application is shown.

[0026] Figure 3 A differentiated film-taking rule table according to an embodiment of the present application is shown.

[0027] Figure 4 A differentiated film-taking rule table according to another embodiment of the present application is shown.

[0028] Figure 5 A schematic diagram of a production line according to an embodiment of the present application is shown.

[0029] Figure 6 A slice fetching rule allocation table according to a solution using the prior art is shown.

[0030] Figure 7 A slice taking rule allocation table according to another embodiment of the present application is shown. DETAILED DESCRIPTION

[0031] The present disclosure is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the embodiments provided herein are only used to explain the present disclosure and are not intended to limit the present disclosure. In addition, the embodiments provided below are partial embodiments for implementing the present disclosure, rather than providing all embodiments for implementing the present disclosure. In the absence of conflict, the technical solutions recorded in the embodiments of the present disclosure can be implemented in any combination.

[0032] It should be noted that, in the embodiments of the present disclosure, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a method or apparatus including a series of elements includes not only the elements explicitly recorded, but also includes other elements not explicitly listed, or also includes elements inherent to the implementation of the method or apparatus. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other related elements in the method or apparatus including the element (such as a step in the method or a unit in the apparatus, for example, a unit may be a part of a circuit, a part of a processor, a part of a program or software, etc.).

[0033] For example, the equipment control method based on the integrated manufacturing system provided in the embodiment of the present disclosure includes a series of steps, but the equipment control method based on the integrated manufacturing system provided in the embodiment of the present disclosure is not limited to the recorded steps. Similarly, the equipment control device based on the integrated manufacturing system provided in the embodiment of the present disclosure includes a series of units, but the device provided in the embodiment of the present disclosure is not limited to including the units explicitly recorded, and may also include units required to obtain relevant information or perform processing based on the information.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure.

[0035] It is understandable that in the specific implementation of this application, relevant data is involved. When the embodiments in this application are applied to specific products or technologies, user permission or consent is required, and the collection, use and processing of relevant data need to comply with relevant laws, regulations and standards of relevant countries and regions.

[0036] Figure 1 The schematic diagram shows an architecture diagram of an integrated manufacturing system according to an embodiment of the present application. The integrated manufacturing system includes a manufacturing execution system (MES) 110 and an equipment automation program (EAP) 120 .

[0037] Manufacturing execution systems can be used to: monitor the production process on the production line in real time, manage manufacturing data, optimize production plans, and improve equipment utilization and production efficiency. Manufacturing execution systems can exchange data with various machines and systems on the production line to collect, analyze and monitor production data in real time, helping production managers make timely decisions, optimize production processes, and improve production efficiency and product quality.

[0038] Equipment automation systems can be used to: monitor and automatically control machines on production lines in real time. Through communication and data collection with the machines, the equipment automation system can monitor the operating status and performance of the equipment in real time, and automatically adjust the working mode and parameter settings of the machines according to the preset process parameters and production plans.

[0039] Figure 2The flowchart of the device control method based on the integrated manufacturing system according to one embodiment of the present application is schematically shown. The execution subject of the device control method based on the integrated manufacturing system can be a terminal and / or server with control processing capabilities, such as a computer, a host computer, etc., and a server such as a cloud server or a physical server.

[0040] like Figure 2 As shown, the equipment control method based on the integrated manufacturing system may include steps S210 to S220.

[0041] Step S210, establishing a database of differentiated film picking rules through the manufacturing execution system, wherein the database includes differentiated film picking rules for multiple multi-chamber machines, and each differentiated film picking rule for the multi-chamber machine includes multiple different film picking rules;

[0042] Step S220, configuring rule labels corresponding to multi-chamber machines in the production line through the equipment automation system, wherein the rule labels of multi-chamber machines with the same number of chambers are different, and each rule label corresponds to a film extraction rule in the database.

[0043] A multi-chamber machine is a machine with multiple wafer processing chambers, and various multi-chamber machines include, for example, a 2-chamber machine, a 3-chamber machine, etc. A database of differentiated wafer picking rules is established through the manufacturing execution system, and the database includes differentiated wafer picking rules for various multi-chamber machines, for example, differentiated wafer picking rules corresponding to a 2-chamber machine and differentiated wafer picking rules corresponding to a 3-chamber machine.

[0044] The differentiated wafer picking rules for each multi-chamber machine further include multiple different wafer picking rules. For example, the differentiated wafer picking rules corresponding to a 2-chamber machine may include n different wafer picking rules, and the differentiated wafer picking rules corresponding to a 3-chamber machine may include n different wafer picking rules. Among them, the wafer picking rules are the rules for placing wafers into the processing chamber, that is, the rules for which wafers from a batch of wafers to place into different processing chambers.

[0045] For example, Figure 3 As shown, a multi-chamber machine is a 2-chamber machine, which includes 2 processing chambers ChamberA and ChamberB. The differentiated wafer picking rules of the 2-chamber machine may include multiple different wafer picking rules such as 2-①, 2-②, and 2-③; wherein, the 2-① wafer picking rule is to put wafers No. 1 to 5 in a batch of wafers into ChamberA, and wafers No. 6 to 10 into ChamberB; and the 2-② wafer picking rule is to put wafers No. 1, 3, 5, 7, and 9 in a batch of wafers into ChamberA, and wafers No. 2, 4, 6, 8, and 10 into ChamberB.

[0046] For example, Figure 4 As shown, a multi-chamber machine is a 3-chamber machine, which includes 3 processing chambers ChamberA, ChamberB, and ChamberC. The differentiated wafer picking rules of the 3-chamber machine may include multiple different wafer picking rules such as 3-①, 3-②, and 3-③; wherein, the 3-① wafer picking rule is to put wafers No. 1 to 4 in a batch of wafers into ChamberA, wafers No. 5 to 7 into ChamberB, and wafers No. 8 to 10 into ChamberC; and the 3-② wafer picking rule is to put wafers No. 1, 4, 7, and 10 in a batch of wafers into ChamberA, wafers No. 2, 5, and 8 into ChamberB, and wafers No. 3, 6, and 9 into ChamberC.

[0047] The actual production line may include one or more single-chamber machines (i.e., a processing machine with only one processing chamber) and one or more multi-chamber machines. The equipment automation system can configure corresponding rule tags for some or all of the multi-chamber machines in the production line. The rule tag is the identifier of the film extraction rule, for example, Figure 3 The rule labels such as 2-①, 2-②, 2-③, etc.

[0048] The rule labels of multi-chamber machines with the same number of chambers in the production line are different, and each rule label corresponds to a slice picking rule in the database. For example, the production line includes three three-chamber machines, namely three-chamber machine 1, three-chamber machine 2 and three-chamber machine 3. The rule label of three-chamber machine 1 can be configured as 3-1, the rule label of three-chamber machine 2 can be configured as 3-2, and the rule label of three-chamber machine 3 can be configured as 3-3. Therefore, the rule labels of the three-chamber machines in the production line are different.

[0049] In this manner of the embodiments of the present application, through the combination of the manufacturing execution system and the equipment automation system, differentiated film picking rules can be flexibly set for the processing machines in the production line. According to the differentiated film picking rules, the machines with process abnormalities can be further efficiently and accurately located. Without being restricted by the machine's own hardware and software, it is possible to flexibly and differentiatedly pick films for the processing machines in the production line, thereby improving the efficiency of locating and analyzing machines with process abnormalities when product problems occur, shortening the time spent on locating abnormalities as much as possible, eliminating abnormalities more quickly, and reducing the impact of machines with process abnormalities on subsequent production lines.

[0050] For example, Figure 5As shown, an example production line 300 includes 66 process stations, each of which is equipped with a processing machine, wherein the process stations "0320-0350" are equipped with a 2-chamber machine 310, a single-chamber machine 320, a 2-chamber machine 330, and a 2-chamber machine 340 in sequence. According to the regular film-taking rule setting method in the prior art (that is, the setting method when the method of the embodiment of the present application is not configured), the film-taking rule set in each chamber of each machine is as follows: Figure 6 As shown; and the differentiated film taking rules set by the embodiment of the present application are as follows Figure 7 shown.

[0051] If the process abnormality is detected in the process site range of "0320-0350" through relevant means, Figure 6 The setting method of the film picking rule shown in FIG. 1 (i.e., the setting method when the method of the embodiment of the present application is not configured) is difficult to further locate which machine has a process abnormality. Figure 7 The film picking rule setting method of the embodiment of the present application shown can locate the process abnormality of the 2-chamber machine 330 according to the film picking rule, so that relevant personnel can be instructed to adjust and repair the 2-chamber machine 330.

[0052] Described below Figure 1 When the equipment control based on the integrated manufacturing system is performed under the embodiment, further optional specific embodiments are provided under each step performed.

[0053] In one embodiment, after configuring the rule labels corresponding to the multi-chamber machines in the production line through the equipment automation system, the method further includes:

[0054] The manufacturing execution system receives the corresponding relationship between the multi-chamber machine and the rule label fed back by the equipment automation system, so as to allocate the sheet picking rule during the production of the production line according to the corresponding relationship.

[0055] The equipment automation system can feed back the correspondence between the configured multi-chamber machines and the rule labels to the manufacturing execution system, and then, when the production line is in production, the manufacturing execution system can obtain and assign the film-taking rules of the multi-chamber machines from the database according to the correspondence. Thus, different film-taking rules with differences can be flexibly specified for multi-chamber machines with the same number of chambers in the production line.

[0056] Furthermore, in one embodiment, after receiving the correspondence between the multi-chamber machine and the rule label fed back by the equipment automation system through the manufacturing execution system, the method may also include: determining the machine to be picked up during production on the production line through the manufacturing execution system; acquiring the film picking rules corresponding to the machine to be picked up from the database according to the correspondence, and obtaining target film picking rules; sending the target film picking rules to the equipment automation system through the manufacturing execution system; and controlling the machine to be picked up to perform film picking processing from the wafer batch according to the target film picking rules through the equipment automation system.

[0057] When the production line is in production, after the wafer batch arrives at a processing machine in the assembly line (i.e., the machine to be picked up), the manufacturing execution system can monitor the machine to be picked up, and then obtain the wafer picking rules corresponding to the machine to be picked up from the database based on the corresponding relationship to obtain the target wafer picking rules.

[0058] The manufacturing execution system sends the target wafer picking rules corresponding to the machine to be picked up to the equipment automation system. The equipment automation system can further control the machine to be picked up to perform wafer picking processing from the wafer batch according to the target wafer picking rules, thereby jointly controlling the machines in the production line to perform differentiated wafer picking processing through the manufacturing execution system and the equipment automation system without having to rely on the machine's own system.

[0059] It can be understood that when a single-chamber machine in a production line is used as a wafer-waiting machine, all wafers in a wafer batch can be directly sent into its processing chamber for processing.

[0060] In one embodiment, obtaining the film picking rules corresponding to the machine to be picked up from the database according to the corresponding relationship to obtain the target film picking rules includes: querying whether there is a rule tag corresponding to the machine to be picked up in the corresponding relationship; if so, obtaining the film picking rules corresponding to the rule tag corresponding to the machine to be picked up from the database; and obtaining the target film picking rules according to the film picking rules corresponding to the rule tag corresponding to the machine to be picked up.

[0061] The manufacturing execution system can query from all the corresponding relationships whether there is a rule tag corresponding to the machine to be picked up. If so, it means that the equipment automation system has configured the corresponding rule tag for the machine to be picked up. The manufacturing execution system can further obtain the film picking rules corresponding to the rule tag corresponding to the machine to be picked up from the database, and then, the target film picking rules can be obtained according to the film picking rules corresponding to the rule tag corresponding to the machine to be picked up.

[0062] Further, in one embodiment, obtaining the target film taking rule according to the film taking rule corresponding to the rule label corresponding to the film taking machine to be taken may include:

[0063] Determine whether the film picking rule corresponding to the rule label corresponding to the machine to be picked up matches the number of available chambers of the machine to be picked up; if they match, determine the film picking rule corresponding to the rule label corresponding to the machine to be picked up as the target film picking rule.

[0064] The actual number of available chambers of the wafer-picking machine is the number of chambers that can be used by the wafer-picking machine when performing processing. For example, a wafer-picking machine actually has 5 chambers, but the number of chambers that can be used when performing processing is 3, then the number of available chambers of the wafer-picking machine is 3.

[0065] After obtaining the film fetching rules corresponding to the rule labels corresponding to the machine to be fetched, it is determined whether the obtained film fetching rules match the actual number of available chambers of the machine to be fetched. If they match, the film fetching rules corresponding to the rule labels corresponding to the machine to be fetched are determined as the target film fetching rules. For example, if the film fetching rules corresponding to the rule labels corresponding to the machine to be fetched are the film fetching rules for a machine with 3 chambers, and the actual number of available chambers of the machine to be fetched is also 3, the film fetching rules corresponding to the rule labels corresponding to the machine to be fetched can be determined as the target film fetching rules.

[0066] In this way, matching checks can avoid situations where the target wafer picking rules are actually incompatible with the machine to be picked up due to errors in the early rule configuration or temporary changes in the available chambers of the machine, thereby further ensuring the compatibility of the target wafer picking rules with the machine to be picked up and improving wafer processing reliability.

[0067] After determining whether the film picking rule corresponding to the rule label corresponding to the machine to be picked up matches the number of available chambers of the machine to be picked up, the method further includes: if there is no match, obtaining a supplementary film picking rule from a public library through the manufacturing execution system that matches the number of available chambers of the machine to be picked up and is different from the film picking rule configured for the multi-chamber machine in the production line; and determining the supplementary film picking rule as the target film picking rule.

[0068] After obtaining the film picking rules corresponding to the rule labels corresponding to the machine to be picked up, if it is determined that the obtained film picking rules do not match the actual number of available chambers of the machine to be picked up, a supplementary film picking rule that matches the number of available chambers of the machine to be picked up and is different from the film picking rules configured for the multi-chamber machines in the production line is obtained from the public library, and the supplementary film picking rule is determined as the target film picking rule.

[0069] For example, if the film taking rule corresponding to the rule label corresponding to the machine to be taken is the film taking rule of a 3-chamber machine, and the actual number of available chambers of the machine to be taken is 2 (for example, the 2-chamber machine is mistakenly configured with the film taking rule of 3 chambers, or the machine has 3 chambers but one chamber is out of service for some reason, the actual number of available chambers of the machine to be taken is 2), then the obtained film taking rule does not match the actual number of available chambers of the machine to be taken. Furthermore, a supplementary film taking rule with a matching chamber number of 2 and different from the film taking rule configured for the multi-chamber machine in the production line can be obtained from the public library, and the supplementary film taking rule is determined as the target film taking rule.

[0070] In this way, when the target film picking rules are actually incompatible with the machine to be picked up due to errors in the previous rule configuration or temporary changes in the available chambers of the machine through matching checks, the supplementary film picking rules can be reliably reallocated as the target film picking rules, thereby ensuring the compatibility of the target film picking rules with the machine to be picked up and improving the reliability of wafer processing.

[0071] Furthermore, after querying whether there is a rule label corresponding to the machine to be picked up in the corresponding relationship, the method may also include: if it does not exist and the machine to be picked up has multiple chambers, obtaining from the public library through the manufacturing execution system a candidate film picking rule that matches the number of available chambers of the machine to be picked up and is different from the film picking rules configured for the multi-chamber machine in the production line; and sending the candidate film picking rule to the equipment automation system through the manufacturing execution system.

[0072] If the manufacturing execution system fails to find the rule label corresponding to the machine to be picked up from all the corresponding relationships, it means that the equipment automation system has not configured the corresponding rule label for the machine to be picked up. At this time, the manufacturing execution system can obtain candidate picking rules from the public library that match the number of available chambers of the machine to be picked up and are different from the picking rules configured for the multi-chamber machines in the production line, so that differentiated candidate picking rules can be obtained from the public library even if differentiated picking rules are not configured.

[0073] The manufacturing execution system sends the candidate film picking rules to the equipment automation system, which can then control the machine to be picked up to perform film picking processing according to the candidate film picking rules, ensuring the normal operation of the production line while achieving differentiated film picking.

[0074] In one embodiment, the database of differentiated wafer picking rules is established through the manufacturing execution system, including: obtaining the number of wafers included in the wafer batch to be processed and the number of chambers of the multi-chamber machine in the production line through the manufacturing execution system; and establishing the database of differentiated wafer picking rules according to the number of wafers and the number of chambers of the multi-chamber machine in the production line.

[0075] When the manufacturing execution system establishes a database of differentiated film picking rules, it can obtain the number of wafers included in the wafer batch to be processed and the number of chambers of the multi-chamber machines in the production line. Thus, the manufacturing execution system can establish a database of differentiated film picking rules based on the number of wafers included in the wafer batch and the number of chambers of the multi-chamber machines in the production line. A database that can effectively allocate differentiated film picking rules to multi-chamber machines in the production line can be established with minimized workload.

[0076] Furthermore, the integrated manufacturing system in the embodiment of the present application is as follows: Figure 1 As shown, the integrated manufacturing system includes a manufacturing execution system (MES) 110 and an equipment automation program (EAP) 120. The meanings of the terms are the same as those in the above-mentioned equipment control method, and the specific implementation details can refer to the description in the method embodiment.

[0077] The manufacturing execution system 110 can be used to: establish a database of differentiated film picking rules, wherein the database includes differentiated film picking rules for a variety of multi-chamber machines, and each differentiated film picking rule for the multi-chamber machine includes a plurality of different film picking rules; the equipment automation system 120 can be used to: configure rule labels corresponding to the multi-chamber machines in the production line, wherein the rule labels are different between multi-chamber machines with the same number of chambers, and each rule label corresponds to a film picking rule in the database.

[0078] Furthermore, in one embodiment, the manufacturing execution system can be used to: establish a database of differentiated film picking rules, wherein the database includes differentiated film picking rules for a variety of multi-chamber machines, and each differentiated film picking rule for the multi-chamber machine includes a plurality of different film picking rules; the equipment automation system can be used to: configure rule labels corresponding to the multi-chamber machines in the production line, wherein the rule labels are different between multi-chamber machines with the same number of chambers, and each rule label corresponds to a film picking rule in the database.

[0079] Furthermore, in one embodiment, the manufacturing execution system can also be used to: receive the correspondence between the multi-chamber machine and the rule label fed back by the equipment automation system, so as to allocate the sheet picking rules when producing on the production line according to the correspondence.

[0080] Furthermore, in one embodiment, the manufacturing execution system can also be used to: determine the machine to be picked up during production on the production line; obtain the wafer picking rules corresponding to the machine to be picked up from the database according to the corresponding relationship to obtain the target wafer picking rules; send the target wafer picking rules to the equipment automation system; accordingly, the equipment automation system can also be used to: control the machine to be picked up to perform wafer picking processing from the wafer batch according to the target wafer picking rules.

[0081] Furthermore, in one embodiment, the manufacturing execution system can also be used to: query whether there is a rule label corresponding to the machine to be picked up in the corresponding relationship; if so, obtain the film picking rule corresponding to the rule label corresponding to the machine to be picked up from the database to obtain the target film picking rule.

[0082] It should be noted that, although several modules or units of the equipment for action execution are mentioned in the above detailed description, this division is not mandatory. In fact, according to the embodiments of the present application, the features and functions of two or more modules or units described above can be embodied in one module or unit. On the contrary, the features and functions of one module or unit described above can be further divided into being embodied by multiple modules or units.

[0083] Those skilled in the art will appreciate that all or part of the steps in the various methods of the above embodiments may be completed by a computer program, or by controlling related hardware through a computer program. The computer program may be stored in a computer-readable storage medium and loaded and executed by a processor.

[0084] To this end, an embodiment of the present application further provides a storage medium, in which a computer program is stored. The computer program can be loaded by a processor to execute the steps in any method provided in the embodiment of the present application.

[0085] The storage medium may be a computer-readable storage medium, and the storage medium may include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc.

[0086] Since the computer program stored in the storage medium can execute the steps in any method provided in the embodiments of the present application, the beneficial effects that can be achieved by the method provided in the embodiments of the present application can be achieved. Please refer to the previous embodiments for details and will not be repeated here.

[0087] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the embodiments disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary technical means in the art that are not disclosed in the present application.

[0088] It should be understood that the present application is not limited to the embodiments that have been described above and shown in the accompanying drawings, but various modifications and changes may be made without departing from the scope thereof.

Claims

1. A device control method based on an integrated manufacturing system, characterized in that: The integrated manufacturing system includes a manufacturing execution system and an equipment automation system, and the method includes: A database of differentiated film picking rules is established by the manufacturing execution system, wherein the database includes differentiated film picking rules for multiple multi-chamber machines, and each differentiated film picking rule for the multi-chamber machine includes multiple different film picking rules; The equipment automation system is used to configure rule labels corresponding to multi-chamber machines in the production line, wherein the rule labels of multi-chamber machines with the same number of chambers are different, and each rule label corresponds to a film extraction rule in the database.

2. The method according to claim 1, characterized in that After configuring the rule labels corresponding to the multi-chamber machines in the production line through the equipment automation system, the method further includes: The manufacturing execution system receives the corresponding relationship between the multi-chamber machine and the rule label fed back by the equipment automation system, so as to allocate the sheet picking rule during the production of the production line according to the corresponding relationship.

3. The method according to claim 2, characterized in that After receiving the corresponding relationship between the multi-chamber tool and the rule label fed back by the equipment automation system through the manufacturing execution system, the method further includes: Determine the machine station to be taken out during production on the production line through the manufacturing execution system; According to the corresponding relationship, the film picking rule corresponding to the machine to be picked up is obtained from the database to obtain the target film picking rule; Sending the target film-taking rule to the equipment automation system through the manufacturing execution system; The equipment automation system controls the wafer picking machine to pick wafers from the wafer batch according to the target wafer picking rule.

4. The method according to claim 3, characterized in that The step of acquiring the film picking rule corresponding to the machine to be film picked from the database according to the corresponding relationship to obtain the target film picking rule includes: Check whether there is a rule label corresponding to the machine to be taken in the corresponding relationship; If it exists, obtaining the film taking rule corresponding to the rule label corresponding to the machine to be taken from the database; The target film taking rule is obtained according to the film taking rule corresponding to the rule label corresponding to the machine to be film taken.

5. The method according to claim 4, characterized in that The step of obtaining the target film taking rule according to the film taking rule corresponding to the rule label corresponding to the film taking machine to be taken includes: Determine whether the film picking rule corresponding to the rule label corresponding to the machine to be picked up matches the number of available chambers of the machine to be picked up; If there is a match, the film taking rule corresponding to the rule label corresponding to the machine to be film taken is determined as the target film taking rule.

6. The method according to claim 5, characterized in that After determining whether the film picking rule corresponding to the rule label corresponding to the machine to be picked up matches the number of available chambers of the machine to be picked up, the method further includes: If there is no match, the manufacturing execution system obtains from a public library a supplementary film-taking rule that matches the number of available chambers of the machine to be taken and is different from the film-taking rule configured for the multi-chamber machine in the production line; The supplementary film-taking rule is determined as the target film-taking rule.

7. The method according to claim 4, characterized in that After querying whether there is a rule label corresponding to the machine to be taken in the corresponding relationship, the method further includes: If it does not exist and the machine to be taken has multiple chambers, then the manufacturing execution system obtains from the public library a candidate film-taking rule that matches the number of available chambers of the machine to be taken and is different from the film-taking rule configured for the multi-chamber machine in the production line; The candidate slice picking rule is sent to the equipment automation system through the manufacturing execution system.

8. The method according to claim 1, characterized in that: The step of establishing a database of differentiated film-taking rules by the manufacturing execution system includes: Acquiring the number of wafers included in the wafer batch to be processed and the number of chambers of the multi-chamber tool in the production line through the manufacturing execution system; A database of differentiated wafer picking rules is established according to the number of wafers and the number of chambers of a multi-chamber machine in the production line.

9. An integrated manufacturing system, characterized in that: The system comprises: The manufacturing execution system is used to: establish a database of differentiated film picking rules, wherein the database includes differentiated film picking rules for multiple multi-chamber machines, and each differentiated film picking rule for the multi-chamber machine includes multiple different film picking rules; The equipment automation system is used to configure rule labels corresponding to multi-chamber machines in a production line, wherein the rule labels of multi-chamber machines with the same number of chambers are different, and each rule label corresponds to a film extraction rule in the database.

10. The system according to claim 9, characterized in that The manufacturing execution system is also used to receive the corresponding relationship between the multi-chamber machine and the rule label fed back by the equipment automation system, so as to allocate the sheet picking rules during production on the production line according to the corresponding relationship.

11. The system according to claim 10, characterized in that The manufacturing execution system is also used to: determine the machine to be picked up during production on the production line; obtain the wafer picking rules corresponding to the machine to be picked up from the database according to the corresponding relationship to obtain the target wafer picking rules; send the target wafer picking rules to the equipment automation system; accordingly, the equipment automation system is also used to: control the machine to be picked up to perform wafer picking processing from the wafer batch according to the target wafer picking rules.

12. The system according to claim 11, characterized in that The manufacturing execution system is also used to: query whether there is a rule label corresponding to the machine to be picked up in the corresponding relationship; if so, obtain the film picking rule corresponding to the rule label corresponding to the machine to be picked up from the database to obtain the target film picking rule.

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