Mother board assembly for component testing and tester board system

Abstract

The invention discloses a mother board assembly for component testing and a tester board system. The mother board assembly comprises an upper mother board; at least one memory channel disposed on the upper motherboard; the lower mother board is vertically separated from the upper mother board through a gap; the at least one CPU is arranged on the lower mother board; at least one support connector connecting the upper motherboard and the lower motherboard; and at least one electrical connector communicatively coupling the at least one CPU with the at least one memory channel. The tester board system includes a frame on which a plurality of mother board assemblies can be inserted for BI and other types of component testing. Each motherboard assembly has a memory channel disposed on the upper motherboard, the memory channel capable of accommodating a plurality of memory components for testing, the memory channel connected to the CPU. The CPU is arranged on the lower mother board, the memory channel is connected to the CPU through a communication connector, and the memory channel is transmitted through a connecting column between the upper mother board and the lower mother board.

Description

Technical Field

[0001] The field of the invention is memory testing systems. Background Art

[0002] The Background Description includes information that may be useful in understanding the present invention. No admission is made that any of the information provided herein is prior art or relevant to the presently claimed invention, nor is an admission made that any publication referenced, either explicitly or implicitly, is prior art.

[0003] Dynamic Random Access Memory (DRAM) and Flash memory technology have been well known for many years. Over time, the interfaces have changed over time, but the basic underlying technology has remained largely the same, such as Fast Page Mode (FPM), Extended Data Out (EDO), Synchronous Dynamic Random Access Memory (SDRAM), Double Data Rate (DDR) 1-4 (DDR1, DDR2, DDR3, DDR4), etc. In some applications, DRAM components are soldered to a PCB substrate to form a module, such as a Dual Inline Memory Module (DIMM) module that is inserted into the motherboard of a computer system.

[0004] The testing of packaged memory components is traditionally done with several steps and multiple insertions. Typically, packaged DRAM components are first subjected to aging ("burn-in, BI") testing. This test is performed with high parallelism in expensive BI systems. For example, current BI systems may cost $500,000 to $1,000,000 per test system. Due to the large number of parts tested and contacted, such systems operate at a low frequency of about 5-20MHz, which is far from the normal operating frequency of 1GHz for such semiconductors. In order to reduce the need for signaling, most methods use internal on-chip test circuits to compress all data signals onto a single external data pin (e.g., reducing 16 DQs to a single DQ), and use other test modes to modify internal voltages for more effective stress of memory components. The purpose of BI testing is to age semiconductors under stress for several hours to avoid early failures that occur at the customer level. The associated stress tests are typically performed at elevated voltages and temperatures up to 125 degrees Celsius. Typically, thousands of components are tested in parallel in a single BI test system.

[0005] After the BI test is successful, the component will be subjected to weak unit or core testing. Those tests are designed to identify weak DRAM memory cells, which may fail at the customer level due to poor memory cell retention or other weaknesses. The test is performed on expensive automatic test equipment, running at a frequency of 200-500MHz and testing 200-1000 components in parallel, and the cost of automatic test equipment is usually 1 million to 3 million US dollars. Due to the large number of signals provided, some signals such as address / commands will be shared between multiple components and test modes for data compression provided by chip vendors, so that a reduced number of DQs need to be contacted (for example, only 4 data signals instead of all 16 signals through data compression (read) and copy (write) methods). Such tests can be performed at different temperatures. For example, a group of components can be tested at high temperature (for example, at 95 degrees Celsius), removed from the system, and tested at a very low temperature (for example, -40 degrees Celsius) on a different test system at a later time. Removal is required because the test processor cannot change the temperature so quickly without other adverse effects. The processor is attached to the test system for feeding the DRAM components to be tested to the test head and providing the expected test temperature.

[0006] After the weak unit test is successful, as known in the art, the component will be subjected to a speed test performed by a DRAM speed tester. During this test, all electrical signals of the component need to be connected to the speed tester to ensure that all signals and circuits are fully functional. A DRAM with 16 DQs will have to be connected to 16 separate DQ signals without a compression mode. Therefore, the parallelism of such a test system is relatively low in the range of 50-200 components. In addition, the parts must operate at full system speeds in the range of 1GHz. Therefore, such systems are very expensive, typically costing between $3 million and $5 million. It may also be necessary to test at different temperatures (e.g., 95C and later again at -40C) to ensure that the customer's specifications for fully functional parts are met.

[0007] As mentioned above, DRAM package components are subjected to a set of at least 3 different test systems for BI, weak unit and speed testing. Some test steps may have to be performed at different temperatures and need to be subjected to up to 5 tests. This means that if retesting is required, the components are handled up to 5 times or more. This can cause handling damage to the contacts (e.g., the contact balls of FBGA components), which is not desirable but cannot be avoided in today's test methods. In addition, very expensive tools are required to feed and handle the DRAM components within the test processor and electrically connect them to the test head. For example, Hifix electrically connects the components to the tester signal channel. Such tools are product-specific and must be provided for each individual DRAM. A 9×11mm FPGA 78 package requires completely different tools and Hifix than, for example, a 7×10mm FBGA 96 package. A set of tools for one product can easily exceed $250,000.

[0008] In view of the above, readers can easily realize that the existing advanced semiconductor testing process is expensive and complicated. In addition, the nature of the test has the risk of damaging the component itself. Therefore, there is still a need for a simpler and safer way to test DRAM components. Summary of the invention

[0009] The present subject matter provides apparatus, systems and methods wherein a tester board includes a frame made of a strong material (e.g., metal such as aluminum, carbon composite, etc.) The frame includes at least two motherboards mounted thereon, each motherboard including at least one central processing unit (CPU) and one memory channel having module slots or memory component slots.

[0010] In an embodiment of the subject matter of the invention, the tester board comprises up to 10 motherboards mounted on a frame. In variations of these embodiments, the number of motherboards may be between 4 and 10, inclusive.

[0011] In embodiments of the inventive subject matter, the motherboards mounted on the testers can be identical. In other embodiments of the inventive subject matter, the motherboards need not be identical.

[0012] In an embodiment of the subject matter of the present invention, the motherboard on the tester board is aligned along a single horizontal plane. In some of these embodiments, the horizontal plane is a horizontal rectangular plane. In yet another variation of these embodiments, the size of the horizontal rectangular plane is between 30cm×30cm and 2m×2m, including 30cm×30cm, 2m×2m.

[0013] In an embodiment of the subject matter of the present invention, at least one module slot and / or memory component slot is located on a first side of the motherboard, and at least one CPU is located on a second side of the motherboard. At least one CPU is electrically connected to at least one module slot / memory component via a connection that can traverse the width of the motherboard to electrically couple these components.

[0014] In an embodiment of the inventive subject matter, at least one memory module slot is arranged on the motherboard such that the memory module is vertically aligned relative to the motherboard when the memory module is inserted into the corresponding memory module slot.

[0015] In an embodiment of the inventive subject matter, at least one memory component slot is arranged on the motherboard such that when a memory component is inserted into a corresponding memory component slot, the memory component is horizontally aligned relative to the motherboard.

[0016] In an embodiment of the inventive subject matter, the tester board system includes an electrical connector located between the frame member and the at least one motherboard, enabling electrical signals and / or electrical charges to be transferred between the frame and the at least one motherboard.

[0017] In an embodiment of the inventive subject matter, a tester board system uses a motherboard assembly whereby memory channels are disposed on an upper motherboard and a CPU is disposed on a lower motherboard separated from the upper motherboard by a gap.

[0018] The gap is used to further isolate the CPU from the test environment. In an embodiment of the inventive subject matter, the gap can be filled with an insulating layer to increase protection for the CPU and other delicate electronic components.

[0019] Various objects, features, aspects and advantages of the inventive subject matter will become more apparent from the following detailed description of preferred embodiments and the accompanying drawings, in which like reference numerals represent like components.

[0020] All publications listed herein are incorporated by reference to the same extent as if each individual publication or patent application was specifically and individually indicated to be incorporated by reference. In the event that a definition or use of a term in an incorporated reference is inconsistent or contrary to the definition of that term provided herein, the definition of that term provided herein applies and the definition of that term in the reference does not apply.

[0021] The following description includes information that may be useful in understanding the present invention. No admission is made that any of the information provided herein is prior art or relevant to the presently claimed invention, nor is an admission made that any publication referenced, either explicitly or implicitly, is prior art.

[0022] In some embodiments, the numerals used to describe and claim the amount of expression components of some embodiments of the present invention, characteristics (such as concentration), reaction conditions, etc. should be understood to be modified by the term "about" in some cases. Therefore, in some embodiments, the numerical parameters set forth in written description and the appended claims are approximate values, which can change according to the desired characteristics sought to be obtained in a particular embodiment. In some embodiments, the numerical parameters should be explained according to the number of reported significant figures and by applying common rounding techniques. Although the numerical range and parameters of the wide range of some embodiments of the present invention are approximate values, the numerical value set forth in the specific examples is reported as accurately as possible. In some embodiments of the present invention, the numerical value provided may contain some errors, and these errors are necessarily due to the standard deviation found in their respective test measurements.

[0023] Unless the context dictates otherwise, all ranges set forth herein should be interpreted as including their endpoints, and open ranges should be interpreted as including only commercially practical values. Similarly, unless the context dictates otherwise, all lists of values ​​should be interpreted as including intermediate values.

[0024] As used throughout the specification and claims that follow, the meanings of “a,” “an,” and “the” include plural references unless the context clearly dictates otherwise. Also, as used throughout the specification, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.

[0025] The range of values ​​listed herein is intended only to be used as a shorthand method for individually referring to each individual value falling within the range. Unless otherwise noted herein, each individual value is incorporated into this specification as if it were individually listed herein. Unless otherwise indicated herein or the context otherwise clearly conflicts, all methods described herein may be performed in any suitable order. Using any and all examples or exemplary language (e.g., "such as") to provide certain embodiments of this article is only intended to better illustrate the present invention, and is not intended to limit the scope of the present invention to be protected in addition. The language in the specification should not be interpreted as representing any unclaimed element essential to the practice of the present invention.

[0026] The groups of alternative elements or embodiments of the present invention disclosed herein should not be construed as limiting. Each group member may be mentioned and claimed individually or in any combination with other members of the group or other elements found herein. For convenience and / or patentability reasons, one or more members of the group may be included in the group or deleted from the group. When any such inclusion or deletion occurs, this specification is deemed to include the group as modified herein, so as to meet the written description of all Markush groups used in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1A and Figure 1B Top views of assembled tester board systems including a frame and a plurality of motherboards disposed on the frame are shown according to two variations of embodiments of the inventive subject matter.

[0028] Figure 1C Shown attached to the frame Figure 1A or Figure 1B Bottom view of multiple motherboards.

[0029] Figure 2 Provides views of individual frames.

[0030] Figure 3A and Figure 3B The embodiment according to the subject matter of the present invention is shown Figure 1A ( Figure 3A neutral) and Figure 1B ( Figure 3B A separate front view of the motherboard (center).

[0031] Figure 3C A bottom view of a motherboard and its components according to an embodiment of the inventive subject matter is provided.

[0032] Figure 3D Shown according to Figure 3B A cross-sectional view of a motherboard of an embodiment.

[0033] Figure 4A-4B A front view and a perspective view, respectively, show a motherboard according to another embodiment of the inventive subject matter.

[0034] Figure 5A-Figure 5B They are shown respectively Figure 4A-4B An embodiment wherein the memory module is inserted into the memory module slot.

[0035] Figure 6 The assembled tester system is shown with the microclimate chamber disposed on the top side.

[0036] Figure 7A-7B Side and top views of a multi-layer motherboard assembly according to an embodiment of the inventive subject matter are shown.

[0037] Figure 8 Top and side perspective views are shown of multiple motherboard assemblies inserted into a frame to form an assembled tester system having memory component sockets in accordance with an embodiment of the inventive subject matter.

[0038] Fig. 9Top and side perspective views of multiple motherboard assemblies inserted into a frame to form an assembled tester system having memory module slots according to an embodiment of the inventive subject matter are shown. DETAILED DESCRIPTION

[0039] Throughout the following discussion, many references will be made to servers, services, interfaces, engines, modules, clients, peers, portals, platforms, or other systems formed from computing devices. It should be understood that the use of such terms is considered to mean one or more computing devices having at least one processor (e.g., Application Specific Integrated Circuit (ASIC), Field-Programmable Gate Array (FPGA), Digital Signal Processor (DSP), x86, ARM, ColdFire, Graphics Processing Unit (GPU), multi-core processor, etc.) programmed to execute software instructions stored on a computer-readable tangible non-temporary medium (e.g., hard disk drive, solid state drive, random access memory (RAM), flash memory, read-only memory (ROM), etc.). For example, a server may include one or more computers operating as a network server, database server, or other type of computer server in a manner that implements the described roles, responsibilities, or functions. It should be further understood that the disclosed computer-based algorithms, processes, methods or other types of instruction sets can be implemented as a computer program product, which includes a non-temporary, tangible computer-readable medium storing instructions that cause a processor to perform the disclosed steps. Different servers, systems, databases or interfaces can use standardized protocols or algorithms to exchange data, which may be based on Hypertext Transfer Protocol (HTTP), Hypertext Transfer Protocol Secure (HTTPS), Advanced Encryption Standard (AES) in cryptography, public-private key exchange, network service application programming interface (API), known financial transaction protocols, or other electronic information exchange methods to exchange data. Data exchange can be carried out through a packet switching network, the Internet, a local area network (LAN), a wide area network (WAN), a virtual private network (VPN) or other types of packet switching networks.

[0040] The following discussion provides many example embodiments of the subject matter of the present invention. Although each embodiment represents a single combination of inventive elements, the subject matter of the present invention is considered to include all possible combinations of the disclosed elements. Thus, if one embodiment includes elements A, B, and C, and a second embodiment includes elements B and D, then the subject matter of the present invention is considered to include other remaining combinations of A, B, C, or D, even if not explicitly disclosed.

[0041] As used herein, unless the context dictates otherwise, the term "coupled to" is intended to include both direct coupling (where two elements coupled to each other are in contact with each other) and indirect coupling (where at least one additional element is located between the two elements). Therefore, the terms "coupled to" and "coupled with..." are used synonymously.

[0042] Figure 1A and Figure 1B A top view (or referred to as a front view) of an assembled tester board system 100 according to an embodiment of the present subject matter is shown, and the assembled tester board system 100 includes a frame 110 and a plurality of motherboards 120 disposed on the frame 110 . Figure 1A The embodiment of FIG. 1 shows a memory channel 123 in the form of a memory component socket 123A that is configured to receive a memory module for testing. Figure 1B The embodiment of FIG. 1 shows a memory channel 123 in the form of a memory module slot 123B that accommodates a memory module for testing. The following will discuss in more detail Figure 1A , Figure 1B In each embodiment. Figure 1A-1B In each of the FIG. 1B , the CPU 121 provided on the lower side of the motherboard 120 is shown via a dotted line.

[0043] Figure 1C Attached to the frame 110 Figure 1A or Figure 1B For the sake of clarity and simplicity in the illustration, the memory channels 123 ( Figure 1A memory component slot 123A, Figure 1B The memory module slot 123B) is not shown via a dotted line. Figure 1A The memory component slot 123A and Figure 1B The memory module slots 123B may be soldered to the motherboard 120 .

[0044] The motherboard 120 is attachable to and removable from the frame 110. In a preferred embodiment, the motherboard 120 can be attached to the frame 110 via plastic screws that minimize temperature transfer between the top and bottom sides of the motherboard 120. Screws of other types of materials with low heat transfer are also suitable. Other types of suitable attachment methods are also contemplated.

[0045] Without limiting the general applicability of our approach, we further describe the invention by way of an example of a dynamic random access memory (DRAM) test flow.

[0046] Figure 2 A separate frame 110 is shown. The frame 110 is made of a strong material. Suitable materials may include, but are not limited to, metals such as aluminum or other materials such as carbon composites, fiberglass composites, or other rigid non-metallic materials. The frame 110 includes a space or cavity 111. When the motherboard 120 is set (e.g., mounted) to the frame, the cavity 111 allows access to the lower side components of the motherboard 120 from the lower side. When the motherboard 120 is mounted to the frame 110, the components on the lower side of the motherboard 120 (such as the CPU 121) will protrude into the cavity 111.

[0047] Figure 1A-Figure 2 The frame 110 is shown as having six motherboards 120 mounted thereon, but it is contemplated that the frame 110 may have more or fewer motherboards 120 mounted thereon. For example, other configurations that may accommodate four to ten motherboards 120 are contemplated.

[0048] Figure 1A-Figure 2 The embodiment shown in is sized to the size of a standard BI board. The reader will appreciate that the system and method of the subject matter of the present invention negates the need for existing large, expensive BI test systems. However, the use of standard BI sizes allows other aspects of standard BI processes to be used, such as automatic loaders and unloaders to load / unload memory components. In addition, software and analysis of slot performance can be performed in a manner similar to existing BI systems.

[0049] exist Figure 1A and Figure 1B In the example shown in , the top of the motherboard 120 is aligned on the frame 110 so that they are touching and the frame 110 is not visible between the boards. The motherboard 120 is aligned so that the edge contact creates a continuous surface that is used to separate and thermally isolate the top side of the board 120 with the memory channels 123 from the underside of the board with the CPU 121 and other sensitive electronic components.

[0050] The frame 110 includes an electrical connector 124A that is aligned to couple with an electrical connector 124B of the motherboard 120 to provide power to the CPU 121 and other components of the motherboard 120. Figure 1A As seen in FIG. 1 , the frame 110 may include a connector 124A to connect with the connectors 124B of all installed motherboards 120 .

[0051] Figure 3A and Figure 3B The embodiment according to the subject matter of the present invention is shown Figure 1A ( Figure 3A neutral) and Figure 1B ( Figure 3B ) is a separate front view of the motherboard 120. Figure 3C Shows Figure 3A , Figure 3B 1 is a rear (lower side) view of the motherboard 120.

[0052] Figure 3A and Figure 3B The motherboard 120 shown in FIG. 1 includes a CPU 121 (shown in phantom) which is electrically connected to a module slot 123A ( Figure 3A ) and memory component slot 123B ( Figure 3B ). The memory component slot 123A is configured to accommodate a corresponding memory component for testing, and the memory module slot 123B is configured to accommodate a corresponding memory module for testing, and the memory module contains one or more memory components. Figure 1A-1B and Figure 3A-3B , the CPU 121 is shown in dotted lines to illustrate that the CPU 121 is located on the opposite side of the motherboard 120.

[0053] like Figure 3A and Figure 3B As seen in the figure, the CPU 121 is arranged on the bottom side (also called the back side) of the motherboard 120 via its depiction with dotted lines, while the memory channels 123 (memory component slots 123A and / or module slots 123B) are on or near the top side (also called the front side) of the motherboard 120.

[0054] This arrangement enables the CPU 121 to be protected from temperature variations provided by the microclimate chamber when a test memory unit or memory component is inserted into the memory component slot 123A and / or the module slot 123B, respectively. For example, during testing, the temperature surrounding the CPU 121 can differ by at least 5 degrees Celsius from the temperature surrounding the memory channel 123 (and the memory module or memory component connected thereto).

[0055] and Figure 1A-1B Same, in Figure 3Aand Figure 3B In the figure, the CPU 121 is shown via a dotted line to show that it is located on the motherboard 120 and is connected to the memory component slot 123A ( Figure 3A ) and memory module slot 123B ( Figure 3B On the opposite side of the Figure 3C These memory channels 123 are not shown by dashed lines in order to maintain clarity of the figure.

[0056] In an embodiment of the inventive subject matter, the motherboard 120 also includes a wireless communication component, which includes a wireless antenna, which is communicatively coupled to the CPU 121 and enables the CPU 121 to send data to an external computing device and receive data from an external computing device. For example, in the embodiment shown here, the wireless antenna can be integrated with the CPU 121, or the wireless antenna can be a separate antenna component. In order to protect the antenna and other communication components from the temperature experienced in the test environment, the antenna and other communication components are also located on the lower side of the motherboard 120 opposite the memory channel 123 (when separated from the CPU 121). Examples of contemplated wireless data transmission modalities include WiFi, Bluetooth, Near Field Communication (NFC), etc. In an embodiment of the inventive subject matter, some or all of the communication functions and / or command functions can be handled by a separate board (such as a Raspberry Pi board), which can issue commands to components on the motherboard 120.

[0057] Figure 3D A cross section of the motherboard 120 is shown showing a connector 122 that traverses the width of the motherboard 120 to connect the CPU 121 on the underside of the board with a memory channel 123 (module slot 123B in this example) on the top side of the motherboard 120. Figure 3D The embodiment shown in FIG. 1 shows only the module slot 123B, but an embodiment having a memory component slot 123A would be the same except that the component slot 123A replaces the module slot 123B.

[0058] exist Figure 1A-1B In each of the embodiments shown in FIG. 1 , the motherboard 120 attached to each frame 110 is shown to be identical. In other embodiments, the motherboard 120 may be different to accommodate a different number of memory cells to be tested, or to allow simultaneous testing of different types of memory cells.

[0059] Figure 1A-Figure 1CThe tester board system 100 of FIG. 1 shows a motherboard 120 arranged along a single horizontal plane. In these embodiments, the tester board system 100 (with the motherboard 120) has a size (including the frame 110) between 30 cm×30 cm and 2 m×2 m. In a preferred embodiment, the size including the frame is 40 cm×60 cm.

[0060] Figure 4A-4B A top view and a perspective view, respectively, of an embodiment of the inventive subject matter are shown, wherein the memory channels 123 (module slots 123B in this example) are arranged so that when a memory module is inserted, the memory channels 123 are vertically aligned with the motherboard 120 (e.g., the memory channels 123 are oriented perpendicular to the motherboard 120).

[0061] Figure 5A-Figure 5B Shows Figure 4A-4B 123B. Figure 4A-4B As can be seen in FIG. 1 , the memory module 510 extends vertically (e.g., no more than 15 degrees from vertical) from the motherboard 120. Each module 510 may include one or more memory component slots, and one or more memory component slots may accommodate memory components for testing (by Figure 5B ). The square representation on each module 510 visible in FIG.

[0062] Figure 6 Shows Figure 1A The system 100 is shown in FIG. 1 , wherein the microclimate chamber 200 is disposed on the upper side or top side of the assembled system 100. The microclimate chamber 200 can provide a heating and / or cooling environment to test memory components attached to the motherboard 120. The microclimate chamber 200 can have a heat source and / or a cooling source (not shown for clarity) that provides a heating environment and / or a cooling environment for component testing.

[0063] As described above, when attached to the frame 110, the edges of the motherboards 120 contact each other, thereby creating a continuous or nearly continuous surface with no gaps between the motherboards 120. This helps to isolate the underside of the motherboards 120 from the climate created by the microclimate chamber 200.

[0064] In the illustrated embodiment, the microclimate chamber 200 is sized to fit over all of the motherboards 120 attached to the frame 110. In other embodiments, it is contemplated that the microclimate chamber 200 may be smaller, such that the microclimate chamber 200 fits over some but not all of the motherboards 120. The astute reader will readily appreciate that the microclimate chamber 200 does not require the use of large, conventional, expensive BI testing equipment.

[0065] The above embodiments are used to provide a temperature difference between the memory component being tested on the motherboard and the CPU on the same board. However, the PCB can be relatively thin and have a metal trace layer. Therefore, if the memory component on the front side is exposed to very high or low temperatures for a long time, such temperature will eventually be transferred to the back side, causing damage or a large amount of thermomechanical stress or water condensation. Therefore, it may be desirable to further isolate the CPU and other sensitive electronic components from the excessively high temperatures required to test the semiconductor memory component. Thus, in an embodiment of the subject matter of the present invention, the motherboard further separates the memory component from the CPU by vertically spacing the CPU from the memory component being tested.

[0066] Figure 7A-7B Side and top views, respectively, of a motherboard assembly 710 are shown in accordance with these embodiments of the inventive subject matter.

[0067] like Fig. 7A As shown in , the motherboard assembly 710 includes an upper motherboard 711 and a lower motherboard 712 .

[0068] The upper motherboard 711 includes one or more memory channels 723 . Figure 7A-7B The embodiment includes a memory component slot 723A (which is configured to accommodate a memory component for testing). However, the general structure of the assembly 710 is applicable to an embodiment having a memory module slot 723B (which is configured to accommodate a memory module for testing), as shown in FIG. Fig. 9 Thus, for embodiments using module slot 723B, the structure would be similar to that of FIG. 1 except that assembly 710 would have module slot 723B instead of memory component slot 723A. Figure 7A-7B The structure shown in is the same.

[0069] Figure 7A-7B The memory component slot 723A can be used with Figure 1A and Figure 3A The same as the memory component slot 123A, Fig. 9 The memory module slot 723B can be connected with Figure 1B and Figure 3B The same as the memory module slot 123B.

[0070] The lower motherboard 712 includes a CPU 721 on the lower side. The lower motherboard 712 can be coupled to the upper motherboard 711 via a support connector 713. The arrangement of the upper motherboard 711 and the lower motherboard 712 makes the two boards parallel. In an embodiment, the angle between the upper motherboard 711 and the lower motherboard 712 does not differ by more than 15 degrees.

[0071] In the embodiment of the inventive subject matter shown herein, there is a gap 715 between the upper motherboard 711 and the lower motherboard 712. The gap 715 between the upper motherboard 711 and the lower motherboard 712 helps to separate the CPU 721 from the temperature applied to the memory module and / or memory component being tested. In an embodiment, the width of the gap 715 can be between 1 mm and 100 mm.

[0072] The CPU 721 is connected to the memory component slot 723A and the memory module slot 723B (in Fig. 9 In the embodiment of the present invention, the device is communicatively coupled. Fig. 7A As shown in FIG. 7 , the connector 722 connects the components of the upper motherboard 711 and the upper motherboard 712 via the connection column 714. Thus, the connector traverses the lower motherboard 712, the connection column 714, and the upper motherboard 711 to connect the CPU 721 to the memory component socket 723A.

[0073] In an embodiment of the inventive subject matter, motherboard assembly 710 includes more than one connection stud 714. For example, motherboard assembly 710 may have 2-4 connection studs 714.

[0074] Each connection post 714 may carry multiple signals via connector 722. It is contemplated that each connection post 714 may carry between 100 and 1000 signals via connector 722, respectively.

[0075] In an embodiment of the inventive subject matter, the upper motherboard 711 and the lower motherboard 712 may be connected only via posts 714 without support connectors 713. In other embodiments, the upper motherboard 711 and the lower motherboard 712 are connected via support connectors 713 without posts 714. In these embodiments, the connector 722 is routed via one or more support connectors 713.

[0076] In the embodiment of the inventive subject matter illustrated herein, gap 715 includes an insulating layer 716 between upper motherboard 711 and lower motherboard 712 .

[0077] The insulating layer 716 can be air (e.g., ambient air or a housing containing air), a vacuum (e.g., a housing with a vacuum inside), polystyrene foam, rubber, etc. The insulating layer can be a layer of material (e.g., polystyrene foam) with air or vacuum bubbles. In an embodiment such as that shown here, the insulating layer 716 fills at least 70% of the gap 715.

[0078] The motherboard assembly 710 can be connected with Figure 1A-Figure 6 The motherboard 120 is similar to Figure 2 A plurality of motherboard assemblies 710 may be attached to the frame 110 to test memory modules or memory components.

[0079] When mounted on a frame, such as frame 110, the lower motherboard 712 can be mounted directly on the frame 110. The insulating layer 716 can be a rigid material with air pockets and spacers made of plastic. All of this can then be screwed together with the upper motherboard 711 at the top.

[0080] Figure 8 A top and side perspective view of a plurality of motherboard assemblies 710 inserted into the frame 110 to form an assembled tester system 700 is shown. In this example, the motherboard assembly 710 shown includes only the memory component slot 723A. As described above, Fig. 9 A top perspective view and a side perspective view of a plurality of motherboard assemblies 710 inserted into the frame 110 are shown. Fig. 9 The motherboard assembly has a memory module slot 723B instead of Figure 8 Memory component slot 723A.

[0081] Figure 8 The assembled tester system 800 includes six motherboard assemblies 710 inserted into the frame 110 .

[0082] exist Figure 8 In the embodiment shown in , each motherboard assembly 710 has a CPU 721, which is connected to two rows of memory component sockets 723A via connection pillars 714. In other embodiments, each motherboard assembly 710 may have more than two rows of memory component sockets 723A for each CPU, and each motherboard assembly 710 may have multiple connection pillars 714.

[0083] To keep it simple, Figure 8 and Fig. 9 The figures do not show insulating layer 716, but it is contemplated that the assembly may include embodiments that include insulating layer 716 as described herein.

[0084] With Figure 1A-Figure 6 In the same manner as in the embodiment of FIG. 7- Fig. 9 Embodiments of the present invention may include communication hardware that may include an antenna and other communication components that enable the CPU 721 to exchange data with an external computing device. The antenna may be integrated with the CPU 721, or the antenna may be separate from the CPU 721. In embodiments where the antenna is separate from the CPU 721, the antenna is also disposed on the lower motherboard 712 to protect it from the test environment.

[0085] and Figure 1A-Figure 6 As in the embodiment of the present invention, the motherboard assembly 710 may include a connector configured to be connected with a corresponding connector of the frame 110 so that power can be supplied to the motherboard assembly 710.

[0086] In an embodiment of the inventive subject matter, the upper motherboard 711 and the lower motherboard 712 have the same or substantially the same area (within 10% of the surface area). In other embodiments of the inventive subject matter, the area of ​​the upper motherboard 711 is less than the area of ​​the lower motherboard 712, where the difference is greater than 10% of the surface area. In these embodiments, the difference area is protected by an insulating material such as those discussed herein. Protected by an insulating material means that at least 80% of the difference area is protected by the insulating material.

[0087] It should be clear to those skilled in the art that, in addition to those already described, more modifications may be made without departing from the inventive concept of this article. Therefore, in addition to the spirit of the appended claims, the subject matter of the present invention is not limited. In addition, when interpreting both the specification and the claims, all terms should be interpreted in the broadest possible manner consistent with the context. Specifically, the terms "comprise" and "comprising" should be interpreted as representing elements, parts or steps in a non-exclusive manner, indicating that the elements, parts or steps mentioned may exist, or utilize, or be combined with other elements, parts or steps not explicitly mentioned. When the specification claims relate to at least one thing selected from the group consisting of A, B, C ... and N, the text should be interpreted as requiring only one element from the group, rather than A plus N, or B plus N, etc.

Claims

1. A motherboard assembly for component testing, comprising: On the motherboard; At least one memory channel is disposed on the upper motherboard; A lower motherboard is vertically separated from the upper motherboard by a gap; At least one CPU, disposed on the lower motherboard; at least one supporting connector, connecting the upper motherboard and the lower motherboard; as well as At least one electrical connector communicatively couples the at least one CPU to the at least one memory channel.

2. The motherboard assembly according to claim 1, further comprising: A connecting post is coupled to the upper motherboard and the lower motherboard.

3. The motherboard assembly according to claim 2, wherein: The at least one electrical connector is routed through the connection posts.

4. The motherboard assembly according to claim 2, comprising: Two to four connecting posts.

5. The motherboard assembly according to claim 1, further comprising: An insulating layer is disposed within the gap.

6. The motherboard assembly according to claim 5, wherein: The insulating layer occupies at least 70% of the volume of the gap.

7. The motherboard assembly according to claim 5, wherein: The insulating layer includes at least one of the following: air, vacuum, polystyrene foam, rubber, or a material containing air or vacuum bubbles.

8. The motherboard assembly according to claim 1, wherein: The upper motherboard and the lower motherboard are parallel to each other.

9. The motherboard assembly according to claim 1, wherein: The upper motherboard and the lower motherboard are spaced apart by a distance between 1 mm and 100 mm.

10. The motherboard assembly according to claim 1, wherein: The area of ​​the upper motherboard and the area of ​​the lower motherboard differ by no more than 10%.

11. The motherboard assembly according to claim 1, wherein: The motherboard assembly is sized to fit within a space on a frame, and the frame is sized to fit at least two motherboard assemblies.

12. A tester board system comprising: a frame sized to accommodate at least two motherboard assemblies; as well as Each of the at least two motherboard assemblies comprises: On the motherboard; At least one memory channel is disposed on the upper motherboard; A lower motherboard is vertically separated from the upper motherboard by a gap; At least one CPU, disposed on the lower motherboard; at least one supporting connector, connecting the upper motherboard and the lower motherboard; and At least one electrical connector communicatively couples the at least one CPU to the at least one memory channel.

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