Computing power inductor and preparation method thereof

Abstract

The invention discloses a computing power inductance device and a preparation method thereof. The computing power inductance device comprises a magnetic core, a conductor and a terminal electrode, the conductor is arranged in the magnetic core and led out of the magnetic core to form the terminal electrode, a soft magnetic composite material of the magnetic core comprises flat particles, and the flat particles are arranged in the soft magnetic composite material of the magnetic core. The ratio of the maximum width of the bottom / top surface of the flat particles to the thickness of the flat particles is 2.5-15. The computing force inductance device is higher in inductance value, higher in saturation current, higher in temperature rise current, lower in direct current resistance and more excellent in comprehensive electrical performance.

Description

Technical Field

[0001] The present invention relates to the field of inductor components, and in particular to a computing power inductor device and a preparation method thereof. Background Art

[0002] The rapid development of renewable energy, mobile communications and robotics has put forward higher requirements for power supplies and electronic devices. With the trend of thinning of AI servers, high-end PCs, Pads, mobile phones and other products, as well as the inherent requirements of high power, the size and power consumption requirements of the components used in the whole machine are getting higher and higher. In addition, the DC / DC circuit as the power supply end also needs to achieve the requirement of low profile while maintaining high power. In order to meet these higher standards, a new type of inductor component, copper-magnetic co-fired power inductor, has emerged. Higher reliability, higher saturation current and lower loss are the highlights of copper-magnetic co-fired inductors and the development goals they are constantly pursuing. Computing power inductors are key components of the power supply module of AI and consumer electronic products chips. They store and release energy through the principle of electromagnetic induction, and play the role of filtering, voltage stabilization, energy storage, and electromagnetic interference suppression. The copper-magnetic co-fired power inductor has excellent comprehensive electrical performance and flattening characteristics, which meets the requirements of computing power inductor devices. However, the existing copper-magnetic co-fired inductors have low inductance values ​​and high power losses, which makes it difficult to meet the ever-increasing performance requirements of computing power inductor devices.

[0003] It should be noted that the information disclosed in the above background technology section is only used for understanding the background of the present application, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the invention

[0004] In order to make up for the deficiencies of the prior art, the present invention provides a computing power inductor device and a preparation method thereof.

[0005] The present invention adopts the following technical solution:

[0006] In a first aspect, a computing power inductor device is provided, which includes a magnetic core, a conductor and an end electrode, wherein the conductor is arranged inside the magnetic core and the conductor is led out of the magnetic core to form the end electrode, and the soft magnetic composite material of the magnetic core includes flat particles, wherein the ratio of the maximum width of the bottom / top surface of the flat particles to the thickness of the flat particles is 2.5-15.

[0007] In a second aspect, a method for preparing a computing power inductor device is provided, comprising the step of making a magnetic core of the computing power inductor device from a soft magnetic composite material powder, wherein the soft magnetic composite material powder comprises flat particles, wherein the ratio of the maximum width of the bottom / top surface of the flat particles to the thickness of the flat particles is 2.5-15.

[0008] The present invention has the following beneficial effects:

[0009] The soft magnetic composite material of the magnetic core in the computing power inductor device of the present invention includes flat particles. The computing power inductor device obtained by adding flat particles of a specific size has a higher inductance value, a higher saturation current, a higher temperature rise current, a lower DC resistance, and better comprehensive electrical performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a front view of a computing power inductor device in a specific embodiment of the present invention;

[0011] Figure 2 is a side view of a computing power inductor device in a specific embodiment of the present invention;

[0012] Figure 3 This is a scanning electron microscope image of the computing power inductor device of Example 1 of the present invention;

[0013] Figure 4 This is a scanning electron microscope image of the computing power inductor device of Example 2 of the present invention. DETAILED DESCRIPTION

[0014] The following is a detailed description of the embodiments of the present invention. It should be emphasized that the following description is only exemplary and is not intended to limit the scope and application of the present invention. In the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other.

[0015] In the following specific implementation of the present invention, the computing power inductor device is flat, and the surface in the thickness (height) direction is defined as the side surface. For example, when the computing power inductor device is a rectangular parallelepiped, the four surfaces in the thickness (height) direction are the side surfaces; the upper bottom surface and the lower bottom surface of the computing power inductor device are parallel; the bottom / top surface of the flat particle refers to the surface of the flat particle in the non-thickness direction (such as the top surface or the bottom surface).

[0016] A specific embodiment of the present invention provides a computing power inductor device, which includes a magnetic core, a conductor and an end electrode, wherein the conductor is arranged inside the magnetic core, and the conductor is led out of the outside of the magnetic core to form the end electrode, and the soft magnetic composite material of the magnetic core includes flat particles, wherein the ratio of the maximum width of the bottom / top surface of the flat particles to the thickness of the flat particles is 2.5-15.

[0017] In the soft magnetic composite material, except for the flat particles, other particles are non-flat particles. Preferably, the non-flat particles are particles with a sphericity of ≥50%, including spherical particles and / or irregularly shaped particles.

[0018] In some embodiments, the flat particles have a thickness of 0.3-12 μm.

[0019] In some embodiments, the flat particles have a thickness of 3-7 μm.

[0020] In some embodiments, when observing any side surface of the magnetic core under a scanning electron microscope, the area ratio of the flat particles to the area of ​​the side surface is 20-80%.

[0021] In some embodiments, among the flat particles on the side, the angle between the bottom / top surface of the flat particles accounting for more than 90% of the area and the upper and lower bottom surfaces of the computing power inductor device does not exceed 30°.

[0022] In some embodiments, the soft magnetic composite material of the computing power inductor device contains 75-97wt% Fe and 1-9wt% Si, and further contains at least one of Al, Cr, B, C, Nb, Cu, P, and O:

[0023] When Al is contained, the content of Al is: 0.5-8wt%;

[0024] When Cr is contained, the content of Cr is: 0.5-8wt%;

[0025] When B is contained, the content of B is: 0.5-8wt%;

[0026] When C is contained, the content of C is: 0.5-8wt%;

[0027] When Nb is contained, the content of Nb is: 0.5-8wt%;

[0028] When Cu is contained, the content of Cu is: 0.5-8wt%;

[0029] When P is contained, the content of P is: 0.1 to 5 wt%;

[0030] When O is contained, the content of O is: 0.1-5wt%.

[0031] In some embodiments, the magnetic material in the soft magnetic composite material is one of FeSi, FeSiAl, FeSiBNbCu and FeSiB(C,Cr).

[0032] In some embodiments, the soft magnetic composite material is FeSiAl(P,O).

[0033] In some embodiments, the computing power inductor device is a co-fired inductor, which is formed by co-firing a conductor and the soft magnetic composite material powder forming the magnetic core into one piece; preferably, the co-fired inductor is a copper-magnetic co-fired inductor, and the conductor is copper.

[0034] In some embodiments, the computing power inductor device further includes a surface coating, which is disposed on an area on the outer surface of the magnetic core other than the end electrode. The surface coating can provide corrosion resistance and rust prevention for the surface of the computing power inductor device. For example, the surface coating is preferably made of materials such as epoxy resin.

[0035] A specific embodiment of the present invention also provides a method for preparing a computing power inductor device, comprising the step of making a magnetic core of the computing power inductor device from a soft magnetic composite material powder, wherein the soft magnetic composite material powder includes flat particles, wherein the ratio of the maximum width of the bottom / top surface of the flat particles to the thickness of the flat particles is 2.5-15.

[0036] In some embodiments, the following step of forming the flat particles is further included: putting spherical powder and / or irregular powder into a bead mill, and flattening the spherical powder and / or irregular powder using grinding beads.

[0037] The specific embodiments of the present invention are further described below.

[0038] Example 1

[0039] The computing power inductor device of this embodiment is a copper-magnetic co-fired inductor, such as Figure 1 and 2 As shown, it includes a magnetic core 1, a conductor 2, an end electrode 3 and a surface coating 4, wherein the conductor 2 is arranged inside the magnetic core 1, and the conductor is led out of the magnetic core to form the end electrode 3, and the surface coating 4 is arranged on the outer surface of the magnetic core co-fired inductor except for the end electrode. The soft magnetic composite material of the magnetic core contains 88.1wt% Fe, 8wt% Si, 3.5wt% Al, 0.2wt% P and 0.2wt% O, and the soft magnetic composite material includes flat particles, the ratio of the maximum width of the bottom surface of the flat particles to the thickness of the flat particles is 2.5-5, and the thickness of the flat particles is 3 to 7 microns.

[0040] The preparation process of the computing power inductor device of this embodiment includes the following steps (the process parameters are well known in the art):

[0041] 1. Powder preparation: putting spherical magnetic powder and / or irregular magnetic powder into a bead mill, adding insulating medium, and flattening the spherical powder and / or irregular powder by grinding beads to obtain flat magnetic particles; coating and granulating the spherical magnetic particles and flat magnetic particles to prepare soft magnetic composite material powder with good fluidity and good pressing properties (including 40wt% non-flat particles and 60% flat particles);

[0042] 2. Compression molding: inserting a copper core into the soft magnetic composite material powder and leading out a portion of the conductor, and performing compression molding to form a green body;

[0043] 3. Heat treatment: heat treat the green body;

[0044] 4. Forming terminal electrodes: bend the lead-out copper core to form terminal electrodes;

[0045] 5. Forming a surface coating: depositing a functional coating such as corrosion resistance on the surface of the inductor device, and laser stripping the end electrodes to obtain the computing power inductor device.

[0046] like Figure 3 As shown, it is a side view of the device of this embodiment observed under a scanning electron microscope. Viewed from the side of the magnetic core of the computing power inductor device, based on the area of ​​the side, the area ratio of the flat particles is 43%, the area ratio of the non-flat particles is 57%, and, among the flat particles, the angle between the bottom / top surface of the flat particles accounting for more than 92% of the area and the upper and lower bottom surfaces of the computing power inductor device does not exceed 30°.

[0047] Comparative Example 1

[0048] The difference from Example 1 is that the powder preparation does not contain flat particles, and the production process and other structures are the same as those of Example 1.

[0049] The inductance of the copper-magnetic co-fired inductor device prepared in Example 1 is 153nH (1MHz), the saturation current is 71A, the temperature rise current is 64A, and the DC resistance is 0.17mΩ. The inductance of the inductor device in Comparative Example 1 is 138nH (1MHz), the saturation current is 70A, the temperature rise current is 55A, and the DC resistance is 0.19mΩ. In comparison, the copper-magnetic co-fired inductor device of Example 1 has a higher inductance value, a higher saturation current and a higher temperature rise current, a lower DC resistance (and thus a lower power loss), and a more excellent comprehensive electrical performance.

[0050] Example 2

[0051] The computing power inductor device of this embodiment is a copper magnetic co-fired inductor. The difference from Example 1 is that the soft magnetic composite material of the magnetic core in this embodiment contains 89.5wt% Fe, 7wt% Si, 1.5wt% Al, 1wt% P and 1wt% O, the ratio of the maximum width of the bottom surface of the flat particles to the thickness of the flat particles is 3.5-7, and the thickness of the flat particles is 3 to 7 microns. In the powder preparation process, the obtained soft magnetic composite material powder contains 50wt% non-flat particles and 50% flat particles. Other structures and processes are the same as in Example 1.

[0052] like Figure 4As shown, it is a side view of the device of this embodiment observed under a scanning electron microscope. Viewed from the side of the magnetic core of the computing power inductor device, based on the area of ​​the side, the area ratio of the flat particles is 36%, the area ratio of the non-flat particles is 64%, and, among the flat particles, the angle between the bottom / top surface of the flat particles accounting for more than 94% of the area and the upper and lower bottom surfaces of the computing power inductor device does not exceed 30°.

[0053] Comparative Example 2

[0054] The difference from Example 2 is that the powder preparation does not contain flat particles, and the production process and other structures are the same as those of Example 2.

[0055] The inductance of the copper-magnetic co-fired inductor device prepared in Example 2 is 124nH (1MHz), the saturation current is 91A, the temperature rise current is 62A, and the DC resistance is 0.15mΩ. The inductance of the inductor device in Comparative Example 2 is 119nH (1MHz), the saturation current is 86A, the temperature rise current is 57A, and the DC resistance is 0.17mΩ. In comparison, the copper-magnetic co-fired inductor device prepared in Example 2 has a higher inductance value, a higher saturation current and a higher temperature rise current, a lower DC resistance (and thus a lower power loss), and a more excellent overall electrical performance.

[0056] The above content is a further detailed description of the present invention in combination with specific / preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, without departing from the concept of the present invention, it can also make several substitutions or modifications to these described embodiments, and these substitutions or modifications should be regarded as belonging to the protection scope of the present invention. In the description of this specification, the description of the reference terms "an embodiment", "some embodiments", "preferred embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily target the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In the absence of mutual contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples. Although the embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and modifications can be made herein without departing from the scope of protection of the patent application.

Claims

1. A computing power inductor device, characterized in that: The computing power inductor device includes a magnetic core, a conductor and an end electrode, wherein the conductor is arranged inside the magnetic core and is led out of the magnetic core to form the end electrode, and the soft magnetic composite material of the magnetic core includes flat particles, wherein the ratio of the maximum width of the bottom / top surface of the flat particles to the thickness of the flat particles is 2.5-15.

2. The computing power inductor device according to claim 1, characterized in that: The flat particles have a thickness of 0.3-12 μm.

3. The computing power inductor device according to claim 1, characterized in that: The flat particles have a thickness of 3-7 μm.

4. The computing power inductor device according to claim 1, characterized in that: When observing any side surface of the magnetic core using a scanning electron microscope, the area ratio of the flat particles to the area of ​​the side surface is 20-80%.

5. The computing power inductor device according to claim 4, characterized in that: Among the flat particles on the side, the angle between the bottom / top surface of the flat particles accounting for more than 90% of the area and the upper and lower bottom surfaces of the computing power inductor device does not exceed 30°.

6. The computing power inductor device according to claim 1, characterized in that: The soft magnetic composite material of the computing power inductor device contains 75-97wt% Fe and 1-9wt% Si, and also contains at least one of Al, Cr, B, C, Nb, Cu, P, and O: When Al is contained, the content of Al is: 0.5-8wt%; When Cr is contained, the content of Cr is: 0.5-8wt%; When B is contained, the content of B is: 0.5-8wt%; When C is contained, the content of C is: 0.5-8wt%; When Nb is contained, the content of Nb is: 0.5-8wt%; When Cu is contained, the content of Cu is: 0.5-8wt%; When P is contained, the content of P is: 0.1 to 5 wt%; When O is contained, the content of O is: 0.1-5wt%. Preferably, the magnetic material in the soft magnetic composite material is one of FeSi, FeSiAl, FeSiBNbCu and FeSiB(C,Cr).

7. The computing power inductor device according to claim 1, characterized in that: The computing power inductor device is a co-fired inductor, which is formed by co-firing a conductor and the soft magnetic composite material powder forming the magnetic core into one piece; preferably, the co-fired inductor is a copper-magnetic co-fired inductor, and the conductor is copper.

8. The computing power inductor device according to claim 1, characterized in that: The computing power inductor device also includes a surface coating, which is arranged on an area on the outer surface of the magnetic core except the end electrode.

9. A method for preparing a computing power inductor device, characterized in that: The method comprises the steps of making the magnetic core of the computing power inductor device from soft magnetic composite material powder, wherein the soft magnetic composite material powder comprises flat particles, wherein the ratio of the maximum width of the bottom / top surface of the flat particles to the thickness of the flat particles is 2.5-15.

10. The preparation method according to claim 9, characterized in that: The method further comprises the following steps of forming the flat particles: putting spherical powder and / or irregular powder into a bead mill, and performing a powder flattening treatment on the spherical powder and / or irregular powder by means of grinding beads.

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