Coil component

Abstract

The technical problem of the present invention is to improve the inductance of an embedded coil component. A coil component (100) according to the present invention is provided with conductor layers (L1-L6) embedded in a magnetic element body (110) and laminated with an insulating resin layer (120) interposed therebetween. The conductor layers (L1-L6) each have a coil pattern, a first connection pattern, and a second connection pattern. In the conductor layer (L6), the outer peripheral end of the coil pattern (60) is connected to the connection pattern (62) via the lead-out pattern (63). In at least one of the conductor layers (L1-L5), a magnetic element body (110) is disposed in a separation region (D1-D5) that overlaps the lead-out pattern (63) in plan view from the lamination direction.

Description

Technical Field

[0001] The present disclosure relates to a coil component, and more particularly to a coil component having a structure in which a plurality of conductor layers stacked with insulating resin layers interposed therebetween are embedded in a magnetic body. Background Art

[0002] Patent Document 1 discloses a coil component having a structure in which a plurality of conductor layers stacked with insulating resin layers interposed therebetween are embedded in a magnetic body. In Patent Document 1, each conductor layer includes a coil pattern and a pair of connection patterns exposed from the magnetic body.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-152043 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] In order to increase the inductance of the coil component, it is effective to increase the volume of the magnetic body.

[0008] This disclosure describes a technique for improving the inductance by increasing the volume of a magnetic body in a coil component having a structure in which a plurality of conductor layers stacked with insulating resin layers interposed therebetween are embedded in a magnetic body.

[0009] Methods used to solve problems

[0010] The coil component of one aspect of the present disclosure comprises: a magnetic body having a mounting surface; and a plurality of conductor layers embedded in the magnetic body and stacked with insulating resin layers therebetween, the plurality of conductor layers respectively comprising: a coil pattern having a coil axis direction parallel to the mounting surface, and a first connection pattern and a second connection pattern exposed from the mounting surface of the magnetic body, the first connection patterns respectively included in the plurality of conductor layers overlap with each other when viewed from above in the stacking direction, the second connection patterns respectively included in the plurality of conductor layers overlap with each other when viewed from above in the stacking direction, and the plurality of conductor layers comprise: a first conductor layer located at one end in the stacking direction; a first conductor layer located at another end in the stacking direction; and one or more third conductor layers located between the first conductor layer and the second conductor layer, wherein in the first conductor layer, the outer peripheral end of the coil pattern is connected to the first connection pattern, and the second connection pattern is separated from the coil pattern in a plane, in the second conductor layer, the outer peripheral end of the coil pattern is connected to the second connection pattern via the lead-out pattern, and the first connection pattern is separated from the coil pattern in a plane, in the third conductor layer, both the first connection pattern and the second connection pattern are separated from the coil pattern in a plane, and in at least one of the first conductor layer and the third conductor layer, a magnetic body is arranged in a separation area overlapping with the lead-out pattern when viewed from a top view in the stacking direction.

[0011] Effects of the Invention

[0012] According to the present disclosure, there is provided a technology for improving the inductance by increasing the volume of a magnetic body in a coil component having a structure in which a plurality of conductor layers stacked via an insulating resin layer are buried in a magnetic body. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic perspective view showing the appearance of a coil component 100 according to one embodiment of the present disclosure.

[0014] Figure 2 It is a schematic plan view for explaining the structure of the conductor layers L1 to L6.

[0015] Figure 3 (a) to (c) are respectively along Figure 2 Rough cross-sectional views along lines AA, BB and CC are shown.

[0016] Figure 4 It is a schematic perspective view showing the appearance of a coil component 100A according to a modified example.

[0017] Description of Reference Numerals

[0018] 10, 20, 30, 40, 50, 60 coil patterns

[0019] 11, 12, 21, 22, 31, 32, 41, 42, 51, 52, 61, 62 connection pattern

[0020] 63 Leading pattern

[0021] 71~75, 81~85, 91~95 vias

[0022] 100, 100A coil parts

[0023] 110 Magnetic Body

[0024] 111~116 Surface of magnetic body

[0025] 120 Insulation resin layer

[0026] 131, 132 Terminal electrodes

[0027] D1~D5 separation area

[0028] L1~L6 conductor layer DETAILED DESCRIPTION

[0029] Hereinafter, embodiments of the technology disclosed herein will be described in detail with reference to the drawings.

[0030] Figure 1 It is a schematic perspective view showing the appearance of a coil component 100 according to one embodiment of the present disclosure.

[0031] like Figure 1 As shown, the coil component 100 of this embodiment includes: a magnetic body 110 composed of a composite material of a magnetic filler composed of a metal magnetic body and a resin binder; and a plurality of conductor layers L1 to L6 embedded in the magnetic body 110 and stacked via an insulating resin layer 120. The conductor patterns provided in the conductor layers L1 to L6 are insulated from the magnetic body 110 by the insulating resin layer 120. The conductor patterns provided in the conductor layers L1 to L6 are composed of a good conductor such as Cu (copper). The insulating resin layer 120 is composed of a non-magnetic insulating resin.

[0032] The coil component 100 of the present embodiment is an embedded type coil component having an insulating resin layer 120 and a structure in which the conductor layers L1 to L6 are embedded in the magnetic body 110, and the structure is different from that of a laminated type coil component in which magnetic sheets and coil patterns made of ceramics or the like are alternately laminated. For example, in a laminated type coil component, a magnetic sheet is interposed between coil patterns adjacent in the lamination direction, but in the coil component 100 of the present embodiment, coil patterns adjacent in the lamination direction are insulated by the insulating resin layer 120, and the magnetic body 110 is not interposed between the two. In addition, the structure of the sheet coil (sheet coil) of the type in which the coil pattern is formed on the printed circuit board is also different.

[0033] The magnetic body 110 has: surfaces 111 and 112 constituting the XZ plane and located on opposite sides; surfaces 113 and 114 constituting the YZ plane and located on opposite sides; and surfaces 115 and 116 constituting the XY plane and located on opposite sides. The surface 111 constitutes the mounting surface facing the surface of the circuit board when actually used. In addition, the Z direction is the stacking direction of the conductor layers L1 to L6. That is, in the coil component 100 of this embodiment, the mounting surface is parallel to the stacking direction.

[0034] Figure 2 1 is a schematic top view for explaining the structure of the conductor layers L1 to L6. Figure 3 (a) to (c) are respectively along Figure 2 Rough cross-sectional views along lines AA, BB and CC are shown.

[0035] like Figure 2 and Figure 3 As shown in (a) to (c) of FIG. 1 , the conductor layer L1 has a coil pattern 10 and connection patterns 11 and 12. A magnetic body 110 is arranged in the inner diameter area surrounded by the coil pattern 10 and in the outer area located on the radial outside of the coil pattern 10 via an insulating resin layer 120. The coil pattern 10 is wound around for about 2 turns, and adjacent turns are insulated by the insulating resin layer 120. The outer peripheral end of the coil pattern 10 is connected to the connection pattern 11. The connection pattern 12 is not connected to the coil pattern 10 in the plane and is independent in the plane. The coil pattern 10 and the connection pattern 12 are separated not only by the insulating resin layer 120 but also by the magnetic body 110. The portion of the magnetic body 110 located in the conductor layer L1 that separates the coil pattern 10 and the connection pattern 12 constitutes a separation area D1.

[0036] The conductor layer L2 includes a coil pattern 20 and connection patterns 21 and 22. A magnetic body 110 is disposed in an inner diameter region surrounded by the coil pattern 20 and in an outer region located outside the coil pattern 20 in the radial direction via an insulating resin layer 120. The coil pattern 20 is wound around approximately two turns, and adjacent turns are insulated by the insulating resin layer 120. The inner peripheral end of the coil pattern 20 is connected to the inner peripheral end of the coil pattern 10 via a via hole 71 provided in the insulating resin layer 120. The connection patterns 21 and 22 are not connected to the coil pattern 20 in the plane, but are independent in the plane and are connected to the connection patterns 11 and 12 via via holes 81 and 91 provided in the insulating resin layer 120, respectively. The coil pattern 20 and the connection pattern 21 are separated by the insulating resin layer 120. In contrast, the coil pattern 20 and the connection pattern 22 are separated not only by the insulating resin layer 120 but also by the magnetic body 110. The portion of the magnetic body 110 located in the conductive layer L2 where the coil pattern 20 and the connection pattern 22 are separated constitutes a separation region D2.

[0037] The conductor layer L3 includes a coil pattern 30 and connection patterns 31 and 32. A magnetic body 110 is disposed in an inner diameter region surrounded by the coil pattern 30 and in an outer region located outside the coil pattern 30 in the radial direction via an insulating resin layer 120. The coil pattern 30 is wound around approximately two turns, and adjacent turns are insulated by the insulating resin layer 120. The outer peripheral end of the coil pattern 30 is connected to the outer peripheral end of the coil pattern 20 via a via 72 provided in the insulating resin layer 120. The connection patterns 31 and 32 are not connected to the coil pattern 30 in the plane, but are independent in the plane and are connected to the connection patterns 21 and 22 via vias 82 and 92 provided in the insulating resin layer 120, respectively. The coil pattern 30 and the connection pattern 31 are separated by the insulating resin layer 120. In contrast, the coil pattern 30 and the connection pattern 32 are separated not only by the insulating resin layer 120 but also by the magnetic body 110. The portion of the magnetic body 110 located in the conductive layer L3 where the coil pattern 30 and the connection pattern 32 are separated constitutes a separation region D3 .

[0038] The conductor layer L4 includes a coil pattern 40 and connection patterns 41 and 42. A magnetic body 110 is disposed via an insulating resin layer 120 in the inner diameter region surrounded by the coil pattern 40 and in the outer region located outside the coil pattern 40 in the radial direction. The coil pattern 40 is wound around for about two turns, and the adjacent turns are insulated by the insulating resin layer 120. The inner peripheral end of the coil pattern 40 is connected to the inner peripheral end of the coil pattern 30 via a via 73 provided in the insulating resin layer 120. The connection patterns 41 and 42 are not connected to the coil pattern 40 in the plane, but are independent in the plane and are connected to the connection patterns 31 and 32 via vias 83 and 93 provided in the insulating resin layer 120, respectively. The coil pattern 40 and the connection pattern 41 are separated by the insulating resin layer 120. In contrast, the coil pattern 40 and the connection pattern 42 are separated not only by the insulating resin layer 120 but also by the magnetic body 110. The portion of the magnetic body 110 located in the conductive layer L4 where the coil pattern 40 and the connection pattern 42 are separated constitutes a separation region D4.

[0039] The conductor layer L5 includes a coil pattern 50 and connection patterns 51 and 52. A magnetic body 110 is disposed via an insulating resin layer 120 in the inner diameter region surrounded by the coil pattern 50 and in the outer region located outside the coil pattern 50 in the radial direction. The coil pattern 50 is wound around approximately two turns, and the adjacent turns are insulated by the insulating resin layer 120. The outer peripheral end of the coil pattern 50 is connected to the outer peripheral end of the coil pattern 40 via a via 74 provided in the insulating resin layer 120. The connection patterns 51 and 52 are not connected to the coil pattern 50 in the plane, but are independent in the plane and are connected to the connection patterns 41 and 42 respectively via vias 84 and 94 provided in the insulating resin layer 120. The coil pattern 50 and the connection pattern 51 are separated by the insulating resin layer 120. In contrast, the coil pattern 50 and the connection pattern 52 are separated not only by the insulating resin layer 120 but also by the magnetic body 110. The portion of the magnetic body 110 located in the conductive layer L5 where the coil pattern 50 and the connection pattern 52 are separated constitutes a separation region D5 .

[0040] The conductor layer L6 includes a coil pattern 60 and connection patterns 61 and 62. A magnetic body 110 is disposed in the inner diameter region surrounded by the coil pattern 60 and in the outer region located outside the coil pattern 60 in the radial direction via an insulating resin layer 120. The coil pattern 60 is wound around about 1.5 turns, and the adjacent turns are insulated by the insulating resin layer 120. The outer peripheral end of the coil pattern 60 is connected to the connection pattern 62 via the lead pattern 63. The inner peripheral end of the coil pattern 60 is connected to the inner peripheral end of the coil pattern 50 via the via hole 75 provided in the insulating resin layer 120. The connection pattern 61 is not connected to the coil pattern 60 in the plane and is independent in the plane. The connection pattern 61 and the connection pattern 62 are connected to the connection pattern 51 and the connection pattern 52 via the via hole 85 and the via hole 95 provided in the insulating resin layer 120, respectively. The coil pattern 60 and the connection pattern 61 are separated not only by the insulating resin layer 120 but also by the magnetic body 110.

[0041] like Figure 1 As shown, the connection patterns 11, 21, 31, 41, 51, and 61 overlap each other when viewed from the Z direction, and are exposed from both sides of the surfaces 111 and 113 of the magnetic body 110, forming one terminal electrode of the coil component 100 of this embodiment. In addition, the connection patterns 12, 22, 32, 42, 52, and 62 overlap each other when viewed from the Z direction, and are exposed from both sides of the surfaces 111 and 114 of the magnetic body 110, forming another terminal electrode of the coil component 100 of this embodiment.

[0042] The lead pattern 63 of the coil pattern 60 located in the conductor layer L6 is a portion located near the outer peripheral end of the coil pattern 60, and is a portion extending in the -Y direction away from the turns located on the inner peripheral side. In other words, the lead pattern 63 is a portion sandwiched by the magnetic body 110 from both sides in the width direction (X direction) of the coil pattern 60 through the insulating resin layer 120.

[0043] Furthermore, the lead pattern 63 overlaps with the separation regions D1 to D5 located in the conductor layers L1 to L5 when viewed from the stacking direction, i.e., the Z direction. As a result, the volume of the magnetic body 110 located in the conductor layers L1 to L5 increases compared to the case where the separation regions D1 to D5 are buried by the conductor pattern and the insulating resin layer 120, so that a high inductance can be obtained. In addition, the leakage flux is also reduced by increasing the volume of the magnetic body 110.

[0044] When actually manufacturing the coil component 100 of the present embodiment, the insulating resin layer 120 and the conductor layers L1 to L6 are alternately stacked in sequence, and then the magnetic body 110 is filled in the space where the insulating resin layer 120 and the conductor layers L1 to L6 do not exist, thereby completing the coil component 100. In this case, the conductor layer L5 located below the lead pattern 63 needs some base for forming the lead pattern 63, and by forming a sacrificial pattern that is removed before filling the magnetic body 110 in the portion corresponding to the separation area D1 to D5, the sacrificial pattern can be used as a base.

[0045] In addition, when a composite material composed of a magnetic filler and a resin binder is used as the material of the magnetic body 110, it is preferable to mix and use a plurality of magnetic fillers having different particle size distributions. In this way, a small-diameter magnetic filler can be efficiently filled in the narrow separation areas D1 to D5. As a result, the average particle size of the magnetic filler filled in the separation areas D1 to D5 is smaller than the average particle size of the magnetic filler filled in other areas of the magnetic body 110, and voids are less likely to be generated in the separation areas D1 to D5.

[0046] As described above, in the coil component 100 of the present embodiment, the coil pattern 60 located on the top layer is connected to the connection pattern 62 via the lead pattern 63, and the separation areas D1 to D5 overlapping with the lead pattern 63 when viewed from above are provided with the magnetic body 110, so that the volume of the magnetic body 110 is increased, resulting in that a high inductance can be obtained.

[0047] Although the embodiments of the technology of the present disclosure have been described above, the technology of the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the invention, and such modifications are naturally included in the scope of the technology of the present disclosure.

[0048] For example, in the above embodiment, the magnetic body 110 is arranged in all of the separation regions D1 to D5 , but this is not essential in the present disclosure, and the magnetic body 110 may be arranged in at least one of the separation regions D1 to D5 .

[0049] In the above embodiment, six conductor layers L1 to L6 are stacked, but the number of conductor layers is not particularly limited, and for example, a four-layer structure may be employed.

[0050] Furthermore, in the above-mentioned embodiment, the connection patterns 11, 21, 31, 41, 51, 61 exposed from the surface of the magnetic body 110 are used as one terminal electrode, and the connection patterns 12, 22, 32, 42, 52, 62 exposed from the surface of the magnetic body 110 are used as the other terminal electrode. Figure 4 As shown in the coil component 100A of the modified example, terminal electrodes 131 in contact with connection patterns 11, 21, 31, 41, 51, and 61 are provided on the surface 111 of the magnetic body 110, and terminal electrodes 132 in contact with connection patterns 12, 22, 32, 42, 52, and 62 are provided. Thus, the shapes of the terminal electrodes 131 and 132 can be set to any desired shape.

[0051] The technology of the present disclosure includes the following structural examples, but the present disclosure is not limited thereto.

[0052] The coil component of one aspect of the present disclosure comprises: a magnetic body having a mounting surface; and a plurality of conductor layers embedded in the magnetic body and stacked with insulating resin layers therebetween, the plurality of conductor layers respectively comprising: a coil pattern having a coil axis direction parallel to the mounting surface, and a first connection pattern and a second connection pattern exposed from the mounting surface of the magnetic body, the first connection patterns respectively included in the plurality of conductor layers overlap with each other when viewed from above in the stacking direction, the second connection patterns respectively included in the plurality of conductor layers overlap with each other when viewed from above in the stacking direction, and the plurality of conductor layers comprise: a first conductor layer located at one end in the stacking direction; a first conductor layer located at another end in the stacking direction; The invention relates to a second conductor layer having a first conductor layer and a second conductor layer; and one or more third conductor layers located between the first conductor layer and the second conductor layer, wherein the outer peripheral end of the coil pattern is connected to the first connection pattern in the first conductor layer, and the second connection pattern is separated from the coil pattern in the plane, and the outer peripheral end of the coil pattern is connected to the second connection pattern via the lead pattern in the second conductor layer, and the first connection pattern is separated from the coil pattern in the plane, and the first connection pattern and the second connection pattern are separated from the coil pattern in the third conductor layer, and a magnetic body is arranged in a separation area overlapping with the lead pattern when viewed from the stacking direction in at least one of the first conductor layer and the third conductor layer. Thus, the inductance is improved by the magnetic body arranged in the separation area.

[0053] In the coil component, the magnetic body may be disposed in both the separation regions located in the first conductor layer and the third conductor layer. This can further increase the volume of the magnetic body.

[0054] In the coil component, the magnetic body may be formed of a composite magnetic material including a magnetic filler and a binder resin, and the average particle size of the magnetic filler in the separation region may be smaller than the average particle size of the magnetic filler in other regions of the magnetic body. Thus, voids are less likely to be generated in the separation region.

[0055] The coil component may further include: a first terminal electrode in contact with the first connection pattern exposed from the mounting surface; and a second terminal electrode in contact with the second connection pattern exposed from the mounting surface. Thus, the shapes of the first and second terminal electrodes can be set to any desired shape.

Claims

1. A coil component, wherein: have: a magnetic body having a mounting surface; and A plurality of conductor layers are embedded in the magnetic body and stacked with insulating resin layers interposed therebetween, The plurality of conductor layers each include: a coil pattern whose coil axis direction is parallel to the mounting surface, and a first connection pattern and a second connection pattern exposed from the mounting surface of the magnetic body. The first connection patterns included in the plurality of conductor layers overlap each other in a plan view seen from the stacking direction. The second connection patterns included in the plurality of conductor layers overlap each other in a plan view seen from the stacking direction. The plurality of conductor layers include: a first conductor layer located at one end in the stacking direction; a second conductor layer located at the other end in the stacking direction; and one or more third conductor layers located between the first conductor layer and the second conductor layer. In the first conductor layer, the outer peripheral end of the coil pattern is connected to the first connection pattern, and the second connection pattern is separated from the coil pattern in a plane. In the second conductor layer, the outer peripheral end of the coil pattern is connected to the second connection pattern via the lead pattern, and the first connection pattern is separated from the coil pattern in a plane. In the third conductor layer, the first connection pattern and the second connection pattern are both separated from the coil pattern in a plane. The magnetic body is disposed in at least one of the first conductive layer and the third conductive layer in a separation region overlapping the lead pattern in a plan view as seen in the stacking direction.

2. The coil component according to claim 1, wherein The magnetic body is disposed in the separation region located in both the first conductor layer and the third conductor layer.

3. The coil component according to claim 1, wherein The magnetic body is composed of a composite magnetic material including a magnetic filler and a binder resin. The average particle size of the magnetic filler located in the separation region is smaller than the average particle size of the magnetic filler located in other regions of the magnetic body.

4. The coil component according to any one of claims 1 to 3, wherein: Also available: a first terminal electrode in contact with the first connection pattern exposed from the mounting surface; and A second terminal electrode is in contact with the second connection pattern exposed from the mounting surface.

Images