A bulb planting machine

Abstract

The present invention relates to the field of chip ball implantation technology, and in particular to a ball implantation machine, which comprises a bracket, a support plate, a prism, a separator and a conveyor. When implanting solder balls into a chip, the chip is placed on the support plate, the prism is at a first station at this time, and the conveyor conveys a solder ball into each conveying channel inside the prism. The prism moves from the first station to the second station. When the prism is at the second station, one end of the prism can fit the chip, and the separator arranged at the end of the prism can prevent two adjacent solder balls from contacting each other. Since the solder ball falls on the chip through the conveying channel, the direct contact between the separator and the solder ball is reduced, thereby avoiding the adhesion of the solder ball and the separator, improving the accuracy of implanting the solder ball on the chip, and thereby reducing the probability of chip performance degradation due to solder implantation.

Description

Technical Field

[0001] The invention relates to the technical field of chip implantation, and in particular to a chip implantation machine. Background Art

[0002] In the field of chip manufacturing, implanting solder balls into chips is a key process step. The quality of the solder balls on the chip directly affects the performance and reliability of the chip.

[0003] Existing chip implantation generally uses steel mesh to complete the chip implantation operation. On the one hand, if the solder ball is heated without removing the steel mesh, the steel mesh may get stuck on the solder ball. This is because the solder ball will undergo physical changes such as melting and solidification during the heating process, and may adhere to the steel mesh. This adhesion will interfere with subsequent process steps and may damage the solder ball and the chip surface structure. On the other hand, if the solder ball is heated after removing the steel mesh, the problem of solder ball adhesion is likely to occur. This is because the solder ball is not constrained by the steel mesh. When heated, the solder balls may approach each other and adhere together due to factors such as surface tension, resulting in uneven implantation and affecting chip performance. Summary of the invention

[0004] The present invention provides a ball implanting machine to solve the problem that the existing chip ball implanting method easily affects the chip performance.

[0005] A bulb planting machine of the present invention adopts the following technical solution:

[0006] A bulb planting machine comprises a bracket, a support plate, a prism, a partition and a conveying member.

[0007] A support plate is slidably arranged on the bracket up and down, and the support plate is used to support the chip; a prism is arranged on the bracket, and the prism has a first station and a second station on the bracket. The prism is initially in the first station. When the prism is in the second station, one end of the prism can fit with the chip. When the prism slides on the bracket, the prism can be transferred from the second station to the first station; a plurality of conveying channels passing through the upper and lower end surfaces are arranged inside the prism; a separator is arranged at the end of the prism, and when the prism is in the second station, the separator can prevent two adjacent solder balls from contacting each other when the solder ball leaves the conveying channel; the conveying member is used to convey a solder ball into each conveying channel when the prism is in the first station.

[0008] Furthermore, a driving member is provided on the bracket, and the driving member is used to switch the prism between the first station and the second station; the prism has a first end and a second end, and the diameter of the circumscribed circle of the first end of the prism is larger than the diameter of the circumscribed circle of the second end of the prism; when the prism is in the second station, the first end of the prism is above the second end; the conveying channel runs through the first end and the second end of the prism, and the aperture of the conveying channel gradually decreases in the process of approaching from the first end to the second end; wherein the diameter of the solder ball is slightly smaller than the aperture of the conveying channel near the second end.

[0009] Furthermore, the driving member includes a first driving cylinder, a first clamping member and a slide rail; when the prism is in the first station, the first end of the prism is below the second end; the slide rail is arranged on the bracket, the first clamping member is used to clamp the prism, the first driving cylinder is used to drive the clamping member to slide along the slide rail, a rack is arranged on the slide rail, and a unidirectional rotating gear sleeve is arranged on the first clamping member, the gear sleeve is always engaged with the rack, and when the first driving cylinder drives the prism clamped by the first clamping member to move from the second station to the first station, the prism can be flipped up and down.

[0010] Furthermore, the driving member also includes a flipping motor, a flipping frame is fixedly arranged on the power output shaft of the flipping motor, and the flipping frame is rotatably connected to the bracket; the flipping frame is arranged at the first working position of the prism, and the flipping frame can flip the prism; when the prism is in the first working position, the prism has a first working condition in which the first end is below the second end, and the prism also has a second working condition in which the first end is above the second end. In the initial state, the prism is in the first working condition of the first working position; the conveying member can convey a solder ball into each conveying channel when the prism is in the first working condition of the first working position.

[0011] Furthermore, a plug-in plate is provided on the flip frame, and the plug-in plate is connected to the flip frame in an up-and-down sliding manner. A plurality of plug-in rods are provided on the plug-in plate, and each plug-in rod can be plugged into a conveying channel.

[0012] Furthermore, the conveying member includes a conveying tray and a conveying pump. The conveying tray is connected to the bracket in an up and down sliding manner, and a plurality of solder balls are placed on the conveying tray. The conveying tray can approach the first end of the prism when the prism is in the first working condition of the first station. The plug-in rod has a penetrating air guide channel, and the outer diameter of the plug-in rod is equal to the diameter of the conveying channel near the second end. The conveying pump is used to extract the gas inside multiple plug-in rods when each plug-in rod is inserted into a conveying channel.

[0013] Furthermore, a first limit block is provided on the bracket, and the first limit block can be attached to the side wall of the prism, and the first limit block limits the shaking of the prism when the prism is in the second working position; a second limit block is fixedly provided on the flip frame, and the second limit block can be attached to the side wall of the prism, and limits the shaking of the prism when the prism is in the first working condition of the first working position.

[0014] Furthermore, the separator includes a separator plate, which is arranged at the second end of the prism, and the separator plate is slidably connected to the prism up and down. When the chip is close to the second end of the prism, a part of the separator plate can enter the interior of the prism.

[0015] Furthermore, a sealing disk capable of sliding up and down is provided on the bracket, and the sealing disk can fit the first end of the prism when the prism is in the second working position; an air supply pump is provided on the bracket, and the air supply pump is used to transport gas to multiple delivery channels through the sealing disk; multiple pressure relief channels are provided inside the prism, each pressure relief channel connects a delivery channel with the external environment, and one end of the pressure relief channel is provided near the second end of the prism.

[0016] Furthermore, a heating source is provided on the support plate, and when the temperature of the support plate is increased, the solder balls falling on the chip can be melted.

[0017] The beneficial effects of the present invention are as follows: a ball planting machine of the present invention comprises a bracket, a support plate, a prism, a separator and a conveying member. When implanting solder balls into a chip, the chip is placed on the support plate, the prism is at the first station at this time, and the conveying member conveys a solder ball into each conveying channel inside the prism. The prism moves from the first station to the second station. When the prism is at the second station, one end of the prism can fit the chip, and the separator arranged at the end of the prism can prevent two adjacent solder balls from contacting each other. Since the solder ball falls on the chip through the conveying channel, the direct contact between the separator and the solder ball is reduced, thereby avoiding the adhesion of the solder ball and the separator, improving the accuracy of implanting the solder ball on the chip, and thereby reducing the probability of chip performance degradation due to solder implantation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0019] Figure 1 A schematic diagram of the structure of a bulb planting machine and a manipulator provided in an embodiment of the present invention;

[0020] Figure 2 A structural schematic diagram of a bulb planting machine provided by an embodiment of the present invention;

[0021] Figure 3 A cross-sectional view of a bulb planting machine provided by an embodiment of the present invention when the prism is in a first working state at a first working position;

[0022] Figure 4A cross-sectional view of a bulb planting machine provided by an embodiment of the present invention when the prism is in a second working condition at a first working position;

[0023] Figure 5 A cross-sectional view of a bulb planting machine provided by an embodiment of the present invention when the prism is in the second working position;

[0024] Figure 6 for Figure 5 A partial enlarged view of point A in the middle.

[0025] In the figure: 110, bracket; 120, operating table; 130, manipulator; 140, support plate; 150, chip; 160, prism; 161, conveying channel; 170, solder ball; 180, first cylinder; 210, first drive cylinder; 220, rack; 310, flip motor; 320, flip frame; 330, plug-in plate; 340, plug-in rod; 350, conveying plate; 360, third cylinder; 370, second cylinder; 410, first limit block; 420, second limit block; 510, partition plate; 520, blocking plate; 530, fourth cylinder; 540, pressure relief channel. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0028] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] like Figures 1 to 6 As shown, an embodiment of the present invention provides a bulb planting machine, which includes a bracket 110, a support plate 140, a prism 160, a partition and a conveying member.

[0030] The support 110 is placed on an operating table 120 , and a robot 130 is provided in the workshop. The robot 130 can take the chip 150 .

[0031] The support plate 140 is arranged horizontally, and the support plate 140 is connected to the bracket 110 in a sliding manner up and down. The bracket 110 is provided with a first cylinder 180, and the first cylinder 180 is arranged vertically. The lower end of the first cylinder 180 is fixedly connected to the bracket 110, and the upper end of the first cylinder 180 is fixedly connected to the support plate 140. The length change of the first cylinder 180 can drive the support plate 140 to slide on the bracket 110. The support plate 140 is used to support the chip 150, and the manipulator 130 can place the chip 150 on the support plate 140. After the chip 150 is tinned, the manipulator 130 can remove the chip 150 from the support plate 140.

[0032] The prism 160 is horizontally slidably disposed on the bracket 110. In the present embodiment, the prism 160 is a quadrangular prism 160, and the prism 160 has four side walls of the same area. The prism 160 has a first position and a second position on the bracket 110. The prism 160 is initially in the first position. When the prism 160 is in the first position, the prism 160 is not directly above the support plate 140. When the prism 160 is in the second position, the prism 160 is directly above the support plate 140. Directly above the prism 160, one end of the prism 160 can fit with the chip 150. When the prism 160 slides on the bracket 110, the prism 160 can be transferred from the second station to the first station. A plurality of conveying channels 161 penetrating the upper and lower end surfaces are arranged inside the prism 160. When the prism 160 is in the second station, the solder ball 170 entering the conveying channel 161 can fall on the chip 150. After the chip 150 is heated, the tin implantation of the chip 150 is completed.

[0033] The separator is arranged at the end of the prism 160. When the prism 160 is in the second working position, when the support plate 140 is close to the end face of the prism 160, the separator directly contacts the chip 150. After the solder ball 170 in the conveying channel 161 is separated from the conveying channel 161, the separator will not contact the solder ball 170. At the same time, the separator can block two adjacent solder balls 170 falling on the chip 150, so that the solder balls 170 on the chip 150 will not stick to each other.

[0034] The conveying member is used to convey a solder ball 170 into each conveying channel 161 when the prism 160 is in the first station. When the prism 160 is in the first station, the conveying member conveys a solder ball 170 into each conveying channel 161. At this time, the solder ball 170 does not directly separate from the conveying channel 161. After the prism 160 slides on the bracket 110, the prism 160 is transferred to the second station. At this time, the solder ball 170 in the conveying channel 161 separates from the conveying channel 161 and falls on the chip 150. Subsequently, the chip 150 and the solder ball 170 are heated, and the solder ball 170 melts on the chip 150, thereby completing the tin implantation of the chip 150.

[0035] A ball planting machine of the present invention, when implanting solder balls 170 into a chip 150, places the chip 150 on a support plate 140, and the prism 160 is at the first station at this time. The conveying member conveys a solder ball 170 into each conveying channel 161 inside the prism 160, and the prism 160 moves from the first station to the second station. When the prism 160 is at the second station, one end of the prism 160 can fit the chip 150, and the partition provided at the end of the prism 160 can prevent two adjacent solder balls 170 from contacting each other. Since the solder ball 170 falls on the chip 150 through the conveying channel 161, the direct contact between the partition and the solder ball 170 is reduced, thereby avoiding the adhesion of the solder ball 170 to the partition, thereby improving the accuracy of implanting the solder ball 170 on the chip 150, and thereby reducing the probability of performance degradation of the chip 150 due to tin implantation.

[0036] In one embodiment, a driving member is provided on the bracket 110, and the driving member is used to switch the prism 160 between the first station and the second station; the prism 160 has a first end and a second end, and the diameter of the circumscribed circle of the first end of the prism 160 is greater than the diameter of the circumscribed circle of the second end of the prism 160; when the prism 160 is in the second station, the first end of the prism 160 is above the second end, and when the prism 160 is in the second station, the prism 160 is directly above the support plate 140, and the second end of the prism 160 can be attached to the chip 150. The conveying channel 161 runs through the first end and the second end of the prism 160, and the aperture of the conveying channel 161 gradually decreases in the process of approaching from the first end to the second end; wherein, the diameter of the solder ball 170 is slightly smaller than the aperture of the conveying channel 161 near the second end. At the first station, the conveying member conveys the solder ball 170 into the conveying channel 161. According to the diameter setting of the conveying channel 161, the solder ball 170 blocks the conveying channel 161 to ensure that there is only one solder ball 170 entering the conveying channel 161. After the prism 160 is transferred from the first station to the second station, the solder ball 170 inside the conveying channel 161 will not actively separate from the conveying channel 161. After the prism 160 moves to the second station, the solder ball 170 in the conveying channel 161 begins to separate from the conveying channel 161.

[0037] In one embodiment, when the prism 160 is in the first station, the first end of the prism 160 is below the second end, and the conveying member conveys the solder ball 170 into the conveying channel 161 in a direction from bottom to top. When the prism 160 is in the first station, the conveying member conveys the solder ball 170 into the conveying channel 161. In the same conveying channel 161, if multiple solder balls 170 enter the same conveying channel 161, according to the setting of the diameter of the conveying channel 161, the top solder ball 170 first contacts the inner wall of the conveying channel 161, and the other solder balls 170 actively leave the conveying channel 161 under the action of their own gravity. Since the prism 160 at the first station and the prism 160 at the second station are in an inverted state, when the prism 160 moves from the first station to the second station, the prism 160 is first flipped at the first station so that the orientation of the prism 160 at the first station is consistent with the orientation of the prism 160 at the second station, and then the prism 160 is moved to the second station; when the prism 160 moves from the second station to the first station, since there is no solder ball 170 inside the conveying channel 161 at this time, in order to improve the overall efficiency of solder implantation of the chip 150, the prism 160 can be flipped during the movement on the bracket 110.

[0038] Further, the driving member includes a first driving cylinder 210, a first clamping member and a slide rail; the slide rail is arranged on the bracket 110, the slide rail is arranged horizontally on the bracket 110, and the first clamping member is used to clamp the prism 160. Specifically, the first clamping member includes two clamping rods, the two clamping rods are coaxially arranged on the front and rear sides of the prism 160, the two clamping rods are fixedly connected to the side walls of the prism 160, the clamping rods are horizontally slidably connected to the bracket 110, and the clamping rods can rotate on the bracket 110. Further, the clamping rod is arranged on the slide rail, and the clamping rod can slide and rotate on the slide rail. The first drive cylinder 210 is used to drive the clamping rod to slide along the slide rail, a rack 220 is provided on the slide rail, a unidirectionally rotating gear sleeve is provided on the clamping rod, the gear sleeve always engages the rack 220, the first drive cylinder 210 is horizontally arranged, one end of the first drive cylinder 210 is fixedly connected to the bracket 110, the output end of the first drive cylinder 210 is rotatably connected to the clamping rod, and when the first drive cylinder 210 drives the prism 160 clamped by the clamping rod to move from the second station to the first station, the prism 160 can flip up and down. Furthermore, by setting the gear sleeve as a unidirectionally rotating gear sleeve, that is, setting a ratchet structure between the gear sleeve and the clamping rod, when the prism 160 moves from the first station to the second station, the prism 160 will not flip.

[0039] In one embodiment, the driving member further includes a flip motor 310, a flip frame 320 is fixedly arranged on the power output shaft of the flip motor 310, the flip frame 320 is rotatably connected to the bracket 110, and the flip motor 310 is fixedly arranged on the bracket 110. The flip frame 320 is arranged at the first working position of the prism 160, and the flip frame 320 can flip the prism 160; when the prism 160 is in the first working position, the prism 160 has a first working condition in which the first end is below the second end, and the prism 160 also has a second working condition in which the first end is above the second end. In the initial state, the prism 160 is in the first working condition of the first station. At this time, the conveyor conveys the solder ball 170 into the conveying channel 161 inside the prism 160. In the same conveying channel 161, if multiple solder balls 170 enter the same conveying channel 161, according to the setting of the diameter of the conveying channel 161, the top solder ball 170 first contacts the inner wall of the conveying channel 161, and the other solder balls 170 actively leave the conveying channel 161 under the action of their own gravity; then, the flip motor 161 is turned over. 310 is started, and the flip motor 310 drives the flip frame 320 to flip. During the flipping process, the flip frame 320 drives the prism 160 to flip, so that the prism 160 is transformed from the first working state of the first station to the second working state of the first station. At this time, the solder ball 170 in the conveying channel 161 will not actively separate from the conveying channel 161, and there is only one solder ball 170 in each conveying channel 161. Subsequently, the first driving cylinder 210 pulls the prism 160 from the first station to the second station through two clamping rods.

[0040] In one embodiment, a plug-in tray 330 is provided on the flip frame 320, and the plug-in tray 330 is connected to the flip frame 320 in a sliding manner. A plurality of plug-in rods 340 are provided on the plug-in tray 330, and each plug-in rod 340 can be plugged into a conveying channel 161. In the initial state, the prism 160 is in the first working state of the first position, the size of the plug-in tray 330 is the same as the size of the second end of the prism 160, and the plug-in rod 340 on the plug-in tray 330 can be inserted into the conveying channel 161 at the second end of the prism 160. When the flip motor 310 is started, the flip frame 320 drives the prism 160 to flip through the plug-in tray 330 and the plug-in rod 340. Further, a vertical second cylinder 370 is fixedly provided on the flip frame 320, and the output end of the second cylinder 370 is fixedly connected to the plug-in tray 330, and the length change of the second cylinder 370 can drive the plug-in rod 340 on the plug-in tray 330 to be inserted into the conveying channel 161.

[0041] In one embodiment, the conveying member includes a conveying tray 350 and a conveying pump. The conveying tray 350 is connected to the bracket 110 in a sliding manner. Specifically, a vertical third cylinder 360 is fixedly provided on the bracket 110. The output end of the third cylinder 360 is fixedly connected to the conveying tray 350. In the initial state, the prism 160 is in the first working condition of the first station, and the conveying tray 350 is below the first end of the prism 160. Moreover, the size of the conveying tray 350 is the same as the size of the first end of the prism 160. A plurality of solder balls 170 are placed on the conveying tray 350, and the third cylinder 360 can drive the conveying tray 350 to approach the first end of the prism 160. The plug rod 340 has an air guide channel that runs through it. The outer diameter of the plug rod 340 is equal to the inner diameter of the delivery channel 161 near the second end. When the plug rod 340 is inserted into the delivery channel 161 at the second end of the prism 160, the plug rod 340 blocks the end of the delivery channel 161. The delivery pump is used to extract the gas inside multiple plug rods 340 when each plug rod 340 is inserted into a delivery channel 161. The air pressure inside the delivery channel 161 is reduced, and the solder balls 170 on the delivery tray 350 can actively enter the delivery channel 161. In the same delivery channel 161, if multiple solder balls 170 enter the same delivery channel 161, according to the setting of the diameter of the delivery channel 161, the top The solder ball 170 first contacts the inner wall of the conveying channel 161, so that the solder ball 170 blocks the conveying channel 161, and the other solder balls 170 actively separate from the conveying channel 161 under the action of their own gravity. After there is a solder ball 170 in each conveying channel 161, the flip motor 310 is started, and the flip frame 320 drives the prism 160 to flip through the plug-in plate 330 and the plug-in rod 340. After the prism 160 is transformed from the first working condition of the first station to the second working condition of the first station, the second cylinder 370 drives the plug-in rod 340 on the plug-in plate 330 to separate from the conveying channel 161, and the flip motor 310 is started to rotate in the opposite direction, and the flip motor 310 drives the flip frame 320 to return to its initial state.

[0042] In one embodiment, a first stopper 410 is fixedly provided on the bracket 110, and the first stopper 410 can be attached to the side wall of the prism 160. When the prism 160 is in the second working position, the first stopper 410 limits the shaking of the prism 160. By setting the first stopper 410, the stability of the prism 160 in the second working position is improved. A second stopper 420 is fixedly provided on the flip frame 320, and the second stopper 420 can be attached to the side wall of the prism 160. When the prism 160 is in the first working condition of the first working position, the shaking of the prism 160 is limited. By setting the second stopper 420, the stability of the prism 160 in the first working position is improved. When the prism 160 changes from the first working condition of the first working position to the second working condition of the first working position, the second stopper 420 is still in a state of abutting the side wall of the prism 160. When the flip frame 320 rotates in the opposite direction, the second stopper 420 and the flip frame 320 are restored to the initial state together.

[0043] In one embodiment, the partition includes a partition plate 510, which is a mesh structure. The partition plate 510 is arranged at the second end of the prism 160, and the partition plate 510 is connected to the prism 160 by sliding up and down. Specifically, the second end of the prism 160 is provided with a plug-in groove, and the partition plate 510 is plugged into the plug-in groove. The partition plate 510 slides in the plug-in groove. When the chip 150 is close to the second end of the prism 160, a part of the partition plate 510 can enter the interior of the prism 160. When the solder ball 170 leaves the conveying channel 161, the partition plate 510 can prevent the solder balls 170 that fall on the chip 150 from contacting each other.

[0044] In one embodiment, a blocking disk 520 capable of sliding up and down is provided on the bracket 110, and the blocking disk 520 is provided directly above the support plate 140. A vertical fourth cylinder 530 is fixedly provided on the bracket 110, and the output end of the fourth cylinder 530 is fixedly connected to the blocking disk 520. When the prism 160 is in the second station, the blocking disk 520 is above the first end of the prism 160, and the size of the blocking disk 520 is the same as the size of the first end of the prism 160. The blocking disk 520 can fit the first end of the prism 160 when the prism 160 is in the second station. The support 110 is provided with an air supply pump, which is used to deliver gas to multiple delivery channels 161 through the blocking disk 520. When the prism 160 is in the second station, each delivery channel 161 contains a solder ball 170. In one of the delivery channels 161, the solder ball 170 can separate the delivery channel 161 into a relatively isolated first chamber and a second chamber, wherein the first chamber is above the second chamber. The air supply pump is connected to the first chamber of the delivery channel 161. As the air supply pump delivers gas to the first chamber, the air pressure inside the first chamber gradually increases, and the solder ball 170 tends to move downward. Because, when the partition plate 510 provided at the second end of the prism 160 abuts against the chip 150, the second chamber is in a relatively closed state. To ensure that the solder ball 170 can move downward smoothly, a plurality of pressure relief channels 540 are arranged inside the prism 160. Each pressure relief channel 540 connects a delivery channel 161 with the external environment. One end of the pressure relief channel 540 is arranged near the second end of the prism 160. Specifically, one end of the pressure relief channel 540 is connected to the second chamber of the delivery channel 161, and the other end of the pressure relief channel 540 is connected to the external environment. When the air supply pump delivers gas to the first chamber, the air pressure in the second chamber will not change, so that the solder ball 170 can smoothly detach from the delivery channel 161. When the solder ball 170 detaches from the delivery channel 161, the first chamber is connected to the pressure relief channel 540, and part of the gas in the first chamber is discharged through the pressure relief channel 540, and part of the gas in the first chamber continues to push the solder ball 170 to fall on the chip 150.

[0045] In one embodiment, a heating source is provided on the support plate 140. When the temperature of the support plate 140 rises, the solder ball 170 falling on the chip 150 can melt. Specifically, the heating source is an electric heating wire, which is integrated inside the support plate 140. When the electric heating wire is energized, the temperature of the support plate 140 rises, and the chip 150 placed on the support plate 140 gradually heats up, so that the solder ball 170 falling on the chip 150 can melt. After the solder ball 170 melts, the robot 130 is used to remove the chip 150 from the support plate 140.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A bulb planting machine, characterized in that: include: Bracket; A support plate, which is slidably disposed on the bracket, and is used to support the chip; A prism, the prism is arranged on a bracket, the prism has a first station and a second station on the bracket, the prism is initially in the first station, when the prism is in the second station, one end of the prism can be attached to the chip, when the prism slides on the bracket, the prism can be transferred from the second station to the first station; a plurality of conveying channels penetrating the upper and lower end surfaces are arranged inside the prism; A separator, which is arranged at the end of the prism, and when the prism is in the second station, the separator can prevent two adjacent solder balls from contacting each other when the solder balls leave the conveying channel; A conveying member, the conveying member is used to convey a solder ball into each conveying channel when the prism is in the first station; A driving member is provided on the bracket, and the driving member is used to switch the prism between the first station and the second station; the prism has a first end and a second end, and the diameter of the circumscribed circle of the first end of the prism is larger than the diameter of the circumscribed circle of the second end of the prism; when the prism is in the second station, the first end of the prism is above the second end; the conveying channel runs through the first end and the second end of the prism, and the aperture of the conveying channel gradually decreases in the process of approaching from the first end to the second end; wherein the diameter of the solder ball is slightly smaller than the aperture of the conveying channel near the second end.

2. A bulb planting machine according to claim 1, characterized in that: The driving member includes a first driving cylinder, a first clamping member and a slide rail; when the prism is in the first station, the first end of the prism is below the second end; the slide rail is arranged on the bracket, the first clamping member is used to clamp the prism, the first driving cylinder is used to drive the clamping member to slide along the slide rail, a rack is arranged on the slide rail, a unidirectional rotating gear sleeve is arranged on the first clamping member, the gear sleeve is always engaged with the rack, and when the first driving cylinder drives the prism clamped by the first clamping member to move from the second station to the first station, the prism can be flipped up and down.

3. A bulb planting machine according to claim 2, characterized in that: The driving member also includes a flip motor, a flip frame is fixedly arranged on the power output shaft of the flip motor, and the flip frame is rotatably connected to the bracket; the flip frame is arranged at the first working position of the prism, and the flip frame can flip the prism; when the prism is in the first working position, the prism has a first working condition where the first end is below the second end, and the prism also has a second working condition where the first end is above the second end. In the initial state, the prism is in the first working condition of the first working position; The conveying member can convey a solder ball into each conveying channel when the prism is in the first working state of the first working position.

4. A bulb planting machine according to claim 3, characterized in that: The turning frame is provided with a plug-in plate, which is connected to the turning frame in an up-and-down sliding manner. The plug-in plate is provided with a plurality of plug-in rods, and each plug-in rod can be plugged into a conveying channel.

5. A bulb planting machine according to claim 4, characterized in that: The conveying member includes a conveying tray and a conveying pump. The conveying tray is connected to the bracket in an up and down sliding manner, and a plurality of solder balls are placed on the conveying tray. The conveying tray can approach the first end of the prism when the prism is in the first working condition of the first station. The plug-in rod has a penetrating air guide channel, and the outer diameter of the plug-in rod is equal to the diameter of the conveying channel near the second end. The conveying pump is used to extract the gas inside multiple plug-in rods when each plug-in rod is inserted into a conveying channel.

6. A bulb planting machine according to claim 4, characterized in that: A first limit block is arranged on the bracket, and the first limit block can be attached to the side wall of the prism, and the first limit block limits the shaking of the prism when the prism is in the second working position; a second limit block is fixedly arranged on the flip frame, and the second limit block can be attached to the side wall of the prism, and limits the shaking of the prism when the prism is in the first working condition of the first working position.

7. The bulb planting machine according to claim 1, characterized in that: The separator includes a separator plate, which is arranged at the second end of the prism, and the separator plate is slidably connected to the prism up and down. When the chip is close to the second end of the prism, part of the separator plate can enter the interior of the prism.

8. The bulb planting machine according to claim 1, characterized in that: A sealing disk that can slide up and down is arranged on the bracket, and the sealing disk can fit the first end of the prism when the prism is in the second working position; an air supply pump is arranged on the bracket, and the air supply pump is used to transport gas to multiple delivery channels through the sealing disk; multiple pressure relief channels are arranged inside the prism, each pressure relief channel connects a delivery channel with the external environment, and one end of the pressure relief channel is arranged near the second end of the prism.

9. The bulb planting machine according to claim 1, characterized in that: A heating source is provided on the support plate. When the temperature of the support plate rises, the solder balls falling on the chip can melt.

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