Inner wire bonding detection method

Abstract

The invention discloses an inner wire bonding detection method. The method comprises the following steps: providing a base platform extending along the lengthwise direction; a discharging area is arranged above one end of the base table in the extending direction. A flexible packaging winding tape provided with a plurality of packaging units to be tested is conveyed in the extending direction of the base station, the packaging units to be tested are adjacently arranged on the base station and sequentially conveyed to the discharging area, and the packaging units to be tested are provided with joint areas used for being correspondingly connected with joint objects; acquiring width data of a bonding object on the to-be-tested packaging unit in the transmission direction; and according to the width data, judging the bonding state of the to-be-tested packaging unit and the bonding object, and sending out alarm information. According to the invention, the abnormal phenomenon that redundant chips or foreign matters fall into a non-bonding area except for normally bonded chips is detected, and the product quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to an inner lead bonding detection method. Background Art

[0002] In the prior art, a chip packaging process using a chip on film (COF) method is to use a full roll of flexible packaging tape including a plurality of packaging units, and sequentially place the chip on the plurality of packaging units. A plurality of bumps are provided on the active surface of the chip, and a plurality of circuits are provided in each packaging unit of the flexible packaging tape. Each circuit has an inner lead for each bump to be bonded thereto, so that the bumps on the chip and the inner leads are eutectic bonded to achieve electrical connection, which is the so-called inner lead bonding (ILB) process.

[0003] However, in actual production, the equipment for picking up and placing chips runs at high speed, which inevitably leads to unstable suction, and chips falling into non-bonding areas; or multiple chips are sucked and placed on the same packaging unit at the same time, and in addition to the normally bonded chips, the excess chips fall into non-bonding areas; of course, other foreign objects may also fall into the packaging unit. The current inner lead bonding equipment cannot detect this abnormal phenomenon, resulting in the outflow of defective products; and in the subsequent detection stage, if the excess chips cover the test points, the test probe will not be able to detect normally, and the probe is prone to collision, causing the test board to be scrapped, resulting in high losses; in the stage of applying the sealing glue, the presence of excess chips or other fallen foreign objects will also cause the glue brush head to be crooked, contaminating the glue material and affecting the glue brushing quality. Summary of the invention

[0004] The object of the present invention is to provide an inner lead bonding detection method to detect the abnormal phenomenon that a chip or other foreign matter falls into a non-bonding area, thereby improving product quality.

[0005] To achieve the above object, the present invention provides an inner lead bonding detection method, the inner lead bonding detection method comprising the following steps:

[0006] providing an abutment extending in a longitudinal direction;

[0007] A discharge area is provided above one end of the base in the extending direction;

[0008] A flexible packaging tape having a plurality of packaging units to be tested is transmitted along the extension direction of the base, so that the plurality of packaging units to be tested are arranged adjacent to each other on the base and sequentially transmitted to the discharge area, wherein the packaging units to be tested have a bonding area for correspondingly connecting with a bonding object;

[0009] Acquiring width data of the bonded object on the packaging unit to be tested in the transmission direction;

[0010] Determine the bonding state between the package unit to be tested and the bonding object according to the width data, wherein when the width of the bonding object in the transmission direction is equal to or less than a normal threshold, the bonding state is set to a first state, and when the width of the bonding object in the transmission direction exceeds the normal threshold, the bonding state is set to a second state; the normal threshold is the width of the bonding area in the transmission direction;

[0011] When the engagement state is the second state, an alarm message is issued.

[0012] As a further improvement of the present invention, the discharging area includes a detection module, which includes sensors installed opposite to each other on both sides of the vertical base extension direction, and the sensor includes an optical transmitter arranged on one side for outputting a series of spaced detection lights in opposite directions, and an optical receiver arranged on the other side for receiving the detection lights.

[0013] As a further improvement of the present invention, obtaining width data of the bonded object on the packaging unit to be tested in the transmission direction specifically includes:

[0014] Control the optical transmitter on one side of the material discharging area to output a series of detection lights arranged at intervals in opposite directions, and the optical receiver arranged on the other side receives the detection lights;

[0015] The width of the bonded object in the transmission direction is calculated according to the amount of the detection light received by the light receiver.

[0016] As a further improvement of the present invention, the height at which the optical transmitter outputs the detection light and the optical receiver receives the detection light is set to half the height of the bonded object on the package unit to be tested.

[0017] As a further improvement of the present invention, the range of the output detection light of the optical transmitter and the range of the reception detection light of the optical receiver are set to be the length of the package unit to be tested in the transmission direction.

[0018] As a further improvement of the present invention, the discharging area further includes a plurality of bearings arranged at the edge of the detection module along the transmission direction, and the plurality of bearings cooperate with the base to form a clamping gap for the flexible packaging tape to pass through.

[0019] As a further improvement of the present invention, the discharging area also includes an automatic warning system, which is electrically connected to the detection module and is used to receive and determine the bonding state detected by the detection module to issue an alarm message.

[0020] As a further improvement of the present invention, the automatic warning system includes a signal receiving module, a signal processing module and an alarm module which are electrically connected in sequence.

[0021] As a further improvement of the present invention, after determining the bonding state between the package unit to be tested and the bonding object, the inner lead bonding detection method further includes starting an automatic early warning system to receive the bonding state and control the operation of an alarm module.

[0022] As a further improvement of the present invention, starting the automatic warning system to receive the engagement state and control the operation of the alarm module specifically includes:

[0023] Controlling a signal receiving module of the automatic warning system to receive the engagement state output by the detection module;

[0024] The control signal processing module processes the engagement state and outputs an operation instruction according to the engagement state, wherein when the engagement state is a first state, the signal processing module outputs a holding instruction, and when the engagement state is a second state, the signal processing module outputs a warning instruction;

[0025] The control alarm module adjusts the working state according to the operation instruction. When the signal processing module outputs the hold instruction, the alarm module does not work. When the signal processing module outputs the early warning instruction, the alarm module works and sends out an alarm message.

[0026] The beneficial effect of the present invention is that through the inner lead bonding detection method of the present invention, the width of the bonding object on the packaging unit to be tested of the flexible packaging tape in the transmission direction is detected in the discharge area and compared with the normal threshold value to judge the bonding state of the packaging unit to be tested and the bonding object, thereby realizing the detection and early warning of abnormal phenomena such as abnormal chip falling, or excess chips or other foreign objects falling into non-bonding areas in addition to normally bonded chips, thereby reducing the outflow of defective products and the impact on subsequent processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic diagram of a flexible packaging tape to be tested in the present invention;

[0028] Figure 2 It is a schematic flow chart of the inner lead bonding detection method of the present invention;

[0029] Figure 3 is a schematic structural diagram of a base including a discharge area provided in an embodiment of the present invention;

[0030] Figure 4 It is a schematic diagram of a process of transferring a package unit to be tested from a base to a discharging area provided by an embodiment of the present invention;

[0031] Figure 5is a schematic diagram of a process for detecting the state of a bonded object in a discharging area provided by an embodiment of the present invention;

[0032] Figure 6 yes Figure 4 The schematic diagram of the detection process of the bonded object provided in the figure includes excess chips falling into the non-bonded area in addition to the normally bonded chips. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in combination with the specific implementation methods of this application and the corresponding drawings. Obviously, the described implementation methods are only part of the implementation methods of this application, not all of the implementation methods. Based on the implementation methods in this application, all other implementation methods obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0034] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0035] For ease of explanation, this document uses terms that represent relative positions in space for description, such as "above", "below", "back", "front", etc., to describe the relationship of one unit or feature shown in the drawings relative to another unit or feature. Terms of relative positions in space can include different orientations of the device in use or operation other than the orientation shown in the figure. For example, if the device in the figure is turned over, the unit described as being "below" or "above" other units or features will be located "below" or "above" the other units or features. Therefore, the exemplary term "below" can encompass both the spatial orientations of below and above.

[0036] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is two or more, at least two.

[0037] As described in the background technology, the current chip packaging process mainly adopts the inner lead bonding process. On a full-roll flexible packaging tape including multiple packaging units, the bumps on the chip are connected to the inner leads in sequence and transmitted. However, in addition to the normally bonded chips, excess chips will fall into the non-bonding area or other foreign objects will fall onto the packaging unit, and the current equipment cannot detect this abnormal phenomenon, resulting in the outflow of defective products.

[0038] Therefore, in order to solve the above problems during chip packaging, the present invention provides an inner lead bonding detection method. Figures 1 to 6 A preferred embodiment according to the present invention is shown.

[0039] Please refer to Figure 1 Before the test, a plurality of packaging units on the full roll flexible packaging tape 100 have been connected to the corresponding bonding objects 2 in sequence to form a packaging unit 1 to be tested, and the packaging unit 1 to be tested has a bonding area 3 for correspondingly connecting to the bonding object 2;

[0040] Here, the bonding object 2 on the packaging unit 1 to be tested includes a normally bonded chip, or in addition to the normally bonded chip, also includes an abnormally fallen chip or other foreign matter. In the case of normal bonding, the normally bonded chip is arranged in the bonding area 3 of the packaging unit for corresponding bonding; in the case of abnormal bonding, the abnormally fallen chip or other foreign matter will partially or completely exceed the range of the bonding area 3.

[0041] In this embodiment, the shape of the chip corresponding to the bonding area 3 is set to be a long rectangle, located in the middle of the package unit 1 to be tested, and extends longitudinally along the vertical transmission direction. In other embodiments of the present invention, the bonding area 3 can also be other shapes that actually correspond to the chip to be bonded.

[0042] Reference Figure 2 , which is a flow chart of the inner lead bonding detection method provided by an embodiment of the present invention, such as Figure 2 As shown, the inner lead bonding detection method comprises the following steps:

[0043] Step S1: providing a base platform 4 extending in the longitudinal direction, and setting a discharge area 5 above one end of the base platform 4 in the extending direction.

[0044] like Figure 3 and Figure 4 As shown, the base 4 docks and supports the flexible packaging tape 100, and extends in the longitudinal direction to facilitate the transmission of the flexible packaging tape 100 on the base to complete the bonding process. The discharge area 5 is arranged above one end of the extension direction of the base 4 to receive and detect the packaging unit 1 to be tested.

[0045] Step S2 : conveying the flexible packaging tape 100 having the plurality of packaging units 1 to be tested along the extension direction of the base 4 , so that the plurality of packaging units 1 to be tested are arranged adjacent to each other on the base 4 and conveyed to the discharging area 5 in sequence.

[0046] Specifically, the plurality of packaging units 1 to be tested are arranged adjacent to each other along the extension direction of the base 4 , that is, the transmission direction d1 . The packaging units 1 to be tested are provided with connected joining objects 2 and enter the discharging area 5 one by one in sequence.

[0047] Step S3: obtaining width data d of the bonded object 2 on the packaging unit 1 to be tested in the transmission direction d1.

[0048] Specifically, the discharging area 5 includes a detection module, which includes sensors 51 installed opposite to each other on both sides of the extension direction of the vertical base, that is, the sensors 51 are arranged on both sides of the packaging unit 1 to be tested transmitted to the discharging area 5, and can detect each packaging unit 1 to be tested transmitted to the discharging area on both sides of its transmission direction d1.

[0049] like Figure 4 As shown, the sensors 51 installed oppositely include an optical transmitter 511 on one side for outputting a series of spaced detection lights 6 in opposite directions, and an optical receiver 512 on the other side for receiving the detection lights 6. The optical transmitter 511 and the optical receiver 512 are used in conjunction with the opposite settings to detect the width data d on the packaging unit 1 to be tested in the transmission direction d1.

[0050] In some embodiments of the present invention, specific steps for obtaining the width data d are further given below.

[0051] S31: Control the optical transmitter 511 on one side of the discharging area 5 to output a series of detection lights 6 arranged at intervals in opposite directions, and the optical receiver 512 arranged on the other side receives the detection lights 6.

[0052] S32 : Calculate the width d of the bonded object 2 in the transport direction d1 according to the amount of the detection light 6 received by the light receiver 512 .

[0053] Specifically, Figure 5 and Figure 6 As shown, the optical transmitter 511 and the optical receiver 512 of the sensor extend along the transmission direction d1 and are arranged on both sides of the package unit 1 to be tested. The optical transmitter 511 on one side emits a detection light 6, and the optical receiver 512 on the other side receives the detection light 6, forming a detection channel 7 with a certain width;

[0054] The bonding object 2 on the packaging unit 1 to be tested can block part of the detection light 6 in the detection channel 7, so that the optical receiver 512d at the receiving end cannot receive this part of the detection light 6 and only receives the remaining unblocked part of the detection light 6.

[0055] The value of the detection light that can be received by the optical receiver 512 and the total light value emitted by the optical transmitter 511 can be converted into the value of the light blocked by the bonded object 2, thereby obtaining the width data d of the bonded object 2 in the transmission direction.

[0056] In this embodiment, the sensor 51 is preferably a contrast type optical fiber sensor. The optical transmitter of the optical fiber sensor emits infrared rays at one end, and the optical receiver receives infrared rays at one end. The joints of normal height on the packaging unit to be tested can block part of the contrast type infrared rays in the detection channel, so that the receiving end cannot receive the part of the infrared rays.

[0057] Furthermore, to ensure that the detection module performs detection normally, the height at which the optical transmitter 511 outputs the detection light 6 and the optical receiver 512 receives the detection light 6 is set to half the height of the bond 3 on the packaging unit 1 to be tested, so as to ensure that the detection light 6 can scan the bond 2, so that the measured width d of the bond 2 in the transmission direction d1 is more accurate.

[0058] Furthermore, the range of the output detection light 6 of the optical transmitter 511 and the range of the reception detection light 6 of the optical receiver 512 are set to be the length of the packaging unit 1 to be tested in the transmission direction d1.

[0059] The setting range of the output detection light 6 of the optical transmitter 511 and the receiving detection light 6 of the optical receiver 512 enables the single detection range of the detection module to cover the entire packaging unit 1 to be tested, and can detect the width data d of the bonding object 2 on the entire packaging unit 1 to be tested, including the total width d of the bonding object in the transmission direction when there are excess abnormally fallen chips or other foreign objects in the non-bonding area other than the bonding area.

[0060] Furthermore, the discharging area further includes a plurality of bearings 52 disposed on the edge of the detection module along the transmission direction, and the plurality of bearings 52 cooperate with the base 4 to form a clamping gap for the flexible packaging tape 100 to pass through.

[0061] In this embodiment, the bearings are set to be 4, which are distributed at both ends of the optical transmitter 511 and the optical receiver 512 respectively, and the spacing between the bearings 52 located at both ends of the optical transmitter 511 and the optical receiver 512 is greater than the width of one of the packaging units 1 to be tested along the transmission direction d1, so as to avoid blocking the detection light 6 and affecting the detection result.

[0062] On the one hand, the bearing 52 rotates to cooperate with the transmission of the flexible packaging tape 100 on the base 4, and on the other hand, cooperates with the base 4 to clamp the flexible packaging tape 100, so that the flexible packaging tape 100 located in the discharge area 5 can be kept flat on the base 4, and the height of the joint 2 on the flexible packaging tape 100 due to the bending of the tape is reduced, which causes it to be higher or lower than the height of the detection light 6, avoids missed detection or abnormal detection, and ensures that the detection module can perform comprehensive detection on the flexible packaging tape 100, thereby improving the detection coverage.

[0063] Step S4: judging the bonding state between the package unit 1 to be tested and the bonding object 2 according to the width data d, wherein when the width d of the bonding object 2 in the transmission direction is equal to or less than a normal threshold, the bonding state is set to a first state, and when the width d of the bonding object 2 in the transmission direction exceeds the normal threshold, the bonding state is set to a second state; the normal threshold is the width D of the bonding area in the transmission direction;

[0064] like Figure 5 As shown, when the bonded object 2 is a single normally bonded chip, the chip is bonded to the bonding area 3 on the packaging unit according to a preset process, and the width data d of the bonded object 2 in the transmission direction d1 is equal to or slightly smaller than the width D of the bonding area 2 in the transmission direction d1.

[0065] Therefore, when the width d of the bonded object 2 in the transmission direction d1 is equal to or smaller than the normal threshold, the bonded state is set to the first state. At this time, the bonded object 2 is a normally bonded chip, that is, the first state is a normal state.

[0066] In this embodiment, the bonding area 3 extends longitudinally along the vertical transmission direction d1, and the width d of the normally bonded bonded object 2 in the transmission direction is the width of the chip itself, which is the minimum value of the width data d that can detect the bonded object 2 in the transmission direction d1.

[0067] When the bonded object 2 is an abnormally bonded chip beyond the range of the bonding area 3 or there are abnormally dropped chips or other foreign objects in addition to the normally bonded chips, the width data d of the bonded object 2 in the transmission direction d1 will exceed the width D of the bonding area 2 in the transmission direction d1.

[0068] When the width d of the bonded object 2 in the transport direction d1 is greater than the normal threshold, the bonded state is set to the second state, and the second state is an abnormal state.

[0069] In this embodiment, if Figure 6As shown, an example is given in which a bonding object 2 includes a normally bonded chip 8 and an abnormally dropped chip 9. The width of the normally bonded chip 8 on the package unit to be tested in the transmission direction d1 is d', and the width of the abnormally dropped chip 9 in the transmission direction is d", then the width d of the bonding object 2 in the transmission direction is the sum of d' and d", and its value is greater than the width D of the bonding area 3 in the transmission direction d1.

[0070] In some other embodiments, the criteria for determining the first state and the second state and the size of the threshold value may be defined according to actual needs.

[0071] Step S5: issuing an alarm message when the engagement state is the second state.

[0072] The second state is an abnormal state. When the second state is detected, an alarm message is issued to remind personnel to pay attention in time to avoid the outflow of abnormal products.

[0073] Furthermore, the discharging area also includes an automatic warning system, which is electrically connected to the detection module and is used to receive and determine the joining state detected by the detection module to issue an alarm message. The automatic warning system includes a signal receiving module, a signal processing module and an alarm module which are electrically connected in sequence.

[0074] After determining the bonding state between the package unit to be tested and the bonding object, the inner lead bonding detection method further comprises starting an automatic early warning system to receive the bonding state and control the operation of an alarm module.

[0075] Specifically, they include:

[0076] Controlling a signal receiving module of the automatic warning system to receive the engagement state output by the detection module;

[0077] The control signal processing module processes the engagement state and outputs an operation instruction according to the engagement state, wherein when the engagement state is a first state, the signal processing module outputs a holding instruction, and when the engagement state is a second state, the signal processing module outputs a warning instruction;

[0078] The control alarm module adjusts the working state according to the operation instruction. When the signal processing module outputs the hold instruction, the alarm module does not work. When the signal processing module outputs the early warning instruction, the alarm module works and sends out an alarm message.

[0079] To sum up, in the inner lead bonding detection method of the present invention, the bonding state of the package unit to be tested and the bonding object is judged by detecting the width of the bonding object in the transmission direction in the discharge area and comparing it with the normal threshold value, thereby realizing the detection and early warning of abnormal phenomena such as abnormal chip falling, or excess chips or other foreign objects falling into the non-bonding area in addition to the normally bonded chips, thereby solving the problem that the above-mentioned defective products cannot be detected in the existing inner lead bonding process, affecting the subsequent coating, testing and other production stages.

[0080] In the embodiments provided in the present invention, it should be understood that the embodiments of the structures described above are merely illustrative. For example, the division of the modules is merely a logical function division. There may be other division methods in actual implementation. For example, multiple modules or components may be combined or integrated into another device, or some features may be ignored or not executed.

[0081] The above implementation modes are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned implementation modes, a person skilled in the art should understand that the technical solutions described in the aforementioned implementation modes can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the implementation modes of the present invention.

Claims

1. A method for detecting inner lead bonding, characterized in that: The following steps are involved: providing an abutment extending in a longitudinal direction; A discharge area is provided above one end of the base in the extending direction; A flexible packaging tape having a plurality of packaging units to be tested is transmitted along the extension direction of the base, so that the plurality of packaging units to be tested are arranged adjacent to each other on the base and sequentially transmitted to the discharge area, wherein the packaging units to be tested have a bonding area for correspondingly connecting with a bonding object; Acquiring width data of the bonded object on the packaging unit to be tested in the transmission direction; Determine the bonding state between the package unit to be tested and the bonding object according to the width data, wherein when the width of the bonding object in the transmission direction is equal to or less than a normal threshold, the bonding state is set to a first state, and when the width of the bonding object in the transmission direction exceeds the normal threshold, the bonding state is set to a second state; the normal threshold is the width of the bonding area in the transmission direction; When the engagement state is the second state, an alarm message is issued.

2. The inner lead bonding detection method according to claim 1, characterized in that: The discharging area includes a detection module, which includes sensors installed opposite to each other on both sides of the vertical base extension direction. The sensor includes an optical transmitter arranged on one side for outputting a series of spaced detection lights in opposite directions, and an optical receiver arranged on the other side for receiving the detection lights.

3. The inner lead bonding detection method according to claim 2, characterized in that: Acquiring width data of the bonded object on the package unit to be tested in the transmission direction specifically includes: Control the optical transmitter on one side of the material discharging area to output a series of detection lights arranged at intervals in opposite directions, and the optical receiver arranged on the other side receives the detection lights; The width of the bonded object in the transmission direction is calculated according to the amount of the detection light received by the light receiver.

4. The inner lead bonding detection method according to claim 3, characterized in that: The height at which the optical transmitter outputs the detection light and the optical receiver receives the detection light is set to be half of the height of the bonded object on the package unit to be tested.

5. The inner lead bonding detection method according to claim 3, characterized in that: The range of the output detection light of the optical transmitter and the range of the reception detection light of the optical receiver are set to the length of the package unit to be tested in the transmission direction.

6. The inner lead bonding detection method according to claim 2, characterized in that: The discharging area further includes a plurality of bearings arranged at the edge of the detection module along the transmission direction, and the plurality of bearings cooperate with the base to form a clamping gap for the flexible packaging tape to pass through.

7. The inner lead bonding detection method according to any one of claims 2 to 6, characterized in that: The discharging area further comprises an automatic warning system, which is electrically connected to the detection module and is used to receive and determine the joining state detected by the detection module and issue an alarm message.

8. The inner lead bonding detection method according to claim 7, characterized in that: The automatic warning system comprises a signal receiving module, a signal processing module and an alarm module which are electrically connected in sequence.

9. The inner lead bonding detection method according to claim 8, characterized in that: After determining the bonding state between the package unit to be tested and the bonding object, the inner lead bonding detection method further comprises starting an automatic early warning system to receive the bonding state and control the operation of an alarm module.

10. The inner lead bonding detection method according to claim 9, characterized in that: The automatic warning system is started to receive the engagement state and control the operation of the alarm module, specifically including: Controlling a signal receiving module of the automatic warning system to receive the engagement state output by the detection module; The control signal processing module processes the engagement state and outputs an operation instruction according to the engagement state, wherein when the engagement state is a first state, the signal processing module outputs a holding instruction, and when the engagement state is a second state, the signal processing module outputs a warning instruction; The control alarm module adjusts the working state according to the operation instruction. When the signal processing module outputs the hold instruction, the alarm module does not work. When the signal processing module outputs the early warning instruction, the alarm module works and sends out an alarm message.

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