Semiconductor cleaning apparatus and exhaust device therefor

Abstract

The application provides a semiconductor cleaning equipment and an exhaust device thereof. The exhaust device comprises an exhaust pipeline and a pressure adjusting mechanism. The exhaust pipeline is connected with a liquid collecting mechanism of the semiconductor cleaning equipment and is used for exhausting the semiconductor cleaning equipment. The pressure adjusting mechanism comprises a damping part and a driving part. The damping part is plate-shaped and is arranged in the exhaust pipeline. The driving part is fixed to the outer sidewall of the exhaust pipeline and is connected with the damping part through a driving shaft and is used for driving the damping part to rotate. The damping part is arranged in the exhaust pipeline and the driving part drives the damping part to rotate, so that the exhaust area of the exhaust pipeline is changed, the wind speed and the wind pressure are adjusted, and the space occupied by the exhaust device is reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more specifically, to a semiconductor cleaning device and its exhaust device. Background Technology

[0002] In semiconductor cleaning equipment, the process chamber is used to spray chemical solutions to clean wafers. The process chamber includes a rotary chuck, chemical spray arms, a chemical recovery device, an exhaust system, and a housing. The exhaust system comprises a fan filter unit (FFU) and exhaust ductwork. Internally, a fan generates air, which is filtered by a filter element and then blown outwards. The fan filter unit primarily delivers a stable and clean airflow into the process chamber, while the exhaust ductwork promptly removes gases from the chamber. Together, these components influence the airflow velocity and pressure within the process chamber.

[0003] The cleanliness requirements for the process chambers are extremely high, necessitating the control of the internal flow field through an exhaust system to prevent particles from falling onto the wafers; simultaneously, due to the use of related chemical solutions,

[0004] For example, sulfuric acid can easily generate acid mist, which needs to be discharged in time through the exhaust system to avoid crystallization and reduce the cleaning effect. In addition, the exhaust system can maintain a slightly positive pressure in the process chamber to prevent external particles from flowing into the process chamber.

[0005] As the semiconductor industry continues to develop, wafer cleaning processes are becoming increasingly complex, placing higher demands on ventilation systems. It is necessary to dynamically adjust the internal air pressure of the chamber for different process steps. Currently, the industry's fan and filter units cannot achieve real-time automatic changes in internal air pressure according to the process.

[0006] Therefore, how to provide an exhaust system that occupies less space and can automatically adjust air pressure is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0007] This application aims to solve at least one of the technical problems existing in the prior art, and proposes a semiconductor cleaning device and its exhaust device, which can automatically adjust the air pressure and occupy a small space.

[0008] To achieve the purpose of this application, an exhaust device is provided for use in semiconductor cleaning equipment, comprising an exhaust duct and a pressure regulating mechanism, wherein,

[0009] The exhaust duct is connected to the liquid collection mechanism of the semiconductor cleaning equipment for exhausting the semiconductor cleaning equipment.

[0010] The pressure regulating mechanism includes a damping part and a driving part. The damping part is plate-shaped and is disposed in the exhaust duct. The driving part is fixed to the outer wall of the exhaust duct and is connected to the damping part through a driving shaft to drive the damping part to rotate, thereby regulating the exhaust pressure.

[0011] In some embodiments, the driving unit is a drive motor, and the pressure regulating mechanism further includes a mounting base, wherein the drive motor is fixedly connected to the outer wall of the exhaust duct via the mounting base.

[0012] In some embodiments, the drive shaft is arranged along the diameter of the exhaust duct, and the outer edge of the damping portion is spaced from the inner wall of the exhaust duct.

[0013] In some embodiments, the exhaust duct is made of a transparent material.

[0014] In some embodiments, the damping part is circular, the exhaust duct is a circular pipe, the center of the damping part is located on the axis of the exhaust duct, and the diameter of the damping part is smaller than the inner diameter of the exhaust duct.

[0015] This application also provides a semiconductor cleaning device, including a chamber, a liquid collection mechanism, an air supply mechanism, a liquid spraying mechanism, a controller, a chuck, and any one of the exhaust devices described above;

[0016] The chuck is disposed in the chamber for holding the wafer. The air supply mechanism is located at the top of the chamber for providing a downward airflow into the chamber. The cleaning solution spraying mechanism is used to spray cleaning solution onto the wafer to clean the wafer surface. The cleaning solution collection mechanism is disposed around the chuck for collecting the cleaning solution. The bottom of the cleaning solution collection mechanism is provided with a drain port.

[0017] The exhaust pipe of the exhaust device is fixed to the bottom of the liquid collection mechanism, and the inlet of the exhaust pipe is higher than the outlet.

[0018] In some embodiments, the chamber is provided with a wind speed measuring mechanism for measuring wind speed in the wind field.

[0019] In some embodiments, the exhaust duct is further provided with a pressure sensor located on the side of the damping section near the liquid collection mechanism.

[0020] In some embodiments, the orthographic projection of the upper surface of the chuck onto the horizontal plane lies inside the orthographic projection of the air supply mechanism onto the horizontal plane.

[0021] In some embodiments, the air supply mechanism includes a fan and a filter element, the filter element being located between the fan and the chuck for filtering the purge gas.

[0022] This application has the following beneficial effects:

[0023] The exhaust device provided in this application is applied to semiconductor cleaning equipment and includes an exhaust duct and a pressure regulating mechanism. The exhaust duct is connected to the chemical collection mechanism of the semiconductor cleaning equipment for exhausting the semiconductor cleaning equipment. The pressure regulating mechanism includes a damping part and a driving part. The damping part is plate-shaped and is disposed in the exhaust duct. The driving part is fixed to the outer wall of the exhaust duct and is connected to the damping part through a driving shaft for driving the damping part to rotate.

[0024] The damping unit is installed in the exhaust duct, and the drive unit rotates the damping unit, thereby changing the exhaust area of ​​the exhaust duct and regulating the air pressure. In addition, only the drive unit of the exhaust device is located outside the exhaust duct, while the damping unit is located inside the exhaust duct, thus reducing the space occupied by the exhaust device.

[0025] This application also provides a semiconductor cleaning device including the above-mentioned exhaust device, and has the above-mentioned advantages. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the semiconductor cleaning equipment provided in this application;

[0027] Figure 2 for Figure 1 Schematic diagram of the central exhaust device;

[0028] Figure 3 for Figure 1 A schematic diagram of the internal structure of the exhaust system.

[0029] in, Figures 1 to 3 The attached figures are labeled as follows:

[0030] 1. Chamber; 2. Liquid spraying mechanism; 3. Air supply mechanism; 4. Chuck; 5. Liquid collection mechanism; 6. Exhaust device; 7. Drain outlet; 8. Wind speed sensor; 61. Exhaust duct; 62. Damping part; 63. Drive motor; 64. Mounting base; 65. Pressure sensor. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solution of this application, the semiconductor cleaning equipment and its exhaust device provided in this application will be described in detail below with reference to the accompanying drawings.

[0032] The exhaust device 6 provided in this application is used in semiconductor cleaning equipment, such as... Figure 1As shown, the semiconductor cleaning equipment includes a chamber 1, a chuck 4, an air supply mechanism 3, a chemical spraying mechanism 2, and a chemical collection mechanism 5. The wafer is placed on the chuck 4, and the chemical collection mechanism 5 is arranged around the chuck 4, with its upper end higher than the upper surface of the chuck 4. The nozzles of the chemical spraying mechanism 2 are located above the chuck 4 and are used to spray cleaning fluid onto the wafer. The air supply mechanism 3 is located above the chuck 4 and provides a stable and clean airflow to the wafer. The cleaning fluid falls onto the wafer surface under the action of the airflow, cleaning the wafer surface. An exhaust device 6 is located at the bottom of the chamber 1 and is connected to the chemical collection mechanism 5. The airflow entering the chamber 1 can be discharged from the chamber 1 by the exhaust device 6. The exhaust device 6 can adjust the air pressure inside the chamber 1 according to process requirements; appropriate air pressure can improve the cleaning effect of the semiconductor cleaning equipment on the wafer.

[0033] The exhaust device 6 includes an exhaust duct 61 and a pressure regulating mechanism. The exhaust duct 61 is located at the bottom of the chamber 1, with one end connected to the inside of the liquid collection mechanism 5 and the other end connected to the outside of the chamber 1. Air from the ventilation field can be discharged from the chamber 1 through the exhaust duct 61.

[0034] The pressure regulating mechanism is used to adjust the exhaust area of ​​the exhaust duct 61, thereby controlling the exhaust pressure and flow rate. Since all the gas in the air field is discharged from chamber 1 through the exhaust duct 61, the exhaust area of ​​the exhaust duct 61 directly affects the air pressure of the air field. When a higher air pressure is required, the pressure regulating mechanism can reduce the exhaust area. With a constant air flow rate, the smaller the exhaust area, the higher the air pressure. Conversely, when a lower air pressure is required, the pressure regulating mechanism can increase the exhaust area.

[0035] In addition, the air supply mechanism 3 of the semiconductor cleaning equipment can be specifically an air source such as a fan or a pressure stabilizing tank. When the air supply mechanism is a fan, the exhaust device is mainly used to control the air pressure; when the air supply mechanism 3 is a pressure stabilizing tank, the exhaust device can change the air pressure and air speed at the same time by changing the exhaust area, and the exhaust device needs to work with the pressure stabilizing tank to control the air speed and air pressure.

[0036] The pressure regulating mechanism includes a damping section 62 and a drive section. The damping section 62 may be plate-shaped and disposed within the exhaust duct 61. The drive section is fixed to the outer wall of the exhaust duct 61 and connected to a drive shaft, which extends through the side wall of the exhaust duct 61 to the inner side. The damping section 62 is fixedly connected to the drive shaft and rotates around the drive shaft under the drive of the drive section. Specifically, the drive shaft may be arranged radially along the exhaust duct 61. When the damping section 62 rotates to a position perpendicular to the axis of the exhaust duct 61, the exhaust area of ​​the exhaust duct 61 is at its minimum, and the air pressure is at its minimum. When the damping section 62 rotates to a position perpendicular to the axis of the exhaust duct 61, the exhaust area of ​​the exhaust duct 61 is at its maximum, and the air pressure is at its maximum. The user can adjust the angle between the damping section 62 and the axis of the exhaust duct 61 as needed to obtain appropriate air pressure. Of course, the position of the drive shaft can also be set according to the user's needs, for example, along the cleaving line of the cross section of the exhaust duct 61, which is not limited here.

[0037] In this embodiment, the drive unit can drive the damping unit 62 to rotate around the drive shaft, changing the exhaust area of ​​the exhaust duct 61, and thus changing the air pressure inside the semiconductor cleaning equipment. The drive unit can operate under the control of devices such as controllers, realizing automatic adjustment of air pressure, avoiding safety hazards caused by manual operation, such as contact with chemical liquids, and greatly saving operation time. In addition, the damping unit 62 is located inside the exhaust duct 61, while the drive unit is located outside the exhaust duct 61. The space required for the drive unit is small, thus reducing the space occupied by the exhaust device 6.

[0038] In some embodiments, the drive unit may be a drive motor 63. For example... Figure 2 As shown, the exhaust duct 61 can be L-shaped, with one section arranged vertically and the other horizontally. A damping part 62 can be located within the horizontal section, and the drive motor 63 is mounted on the outer wall of the horizontal section. Specifically, the pressure regulating mechanism also includes a mounting base 64, which is fixedly connected to the outer wall of the horizontal section, and the drive motor 63 is fixed within the mounting base 64. The horizontal section has a through hole corresponding to the position of the drive motor 63. The drive shaft is located within the through hole and is rotatably connected to the through hole via a sealing mechanism such as a dynamic and static ring seal. The measuring shaft of the drive motor 63 can be connected to the drive shaft via a coupling, and the damping part 62 can be fixedly connected to the drive shaft via screws. Of course, the exhaust duct 61 can also adopt other structures, and the angles of each section of the exhaust duct 61 relative to the horizontal direction can be set according to user needs. The drive motor 63 and the exhaust duct 61 can also be connected in other ways, which are not limited here.

[0039] Optionally, the drive motor 63 can operate under the control of the control device, thereby driving the damping section to change the exhaust area. The control device can be integrated into the exhaust system or can be the controller of the semiconductor cleaning equipment; no limitation is made here.

[0040] Optionally, the exhaust duct 61 can be a circular tube, and the drive shaft can be set along the diameter of the exhaust duct 61, specifically the horizontal diameter of the exhaust duct 61. The damping part 62 rotates around the drive shaft under the drive of the drive motor 63. The outer edge of the damping part 62 is spaced from the inner wall of the exhaust duct 61, thereby ensuring that it does not rub against the inner wall of the exhaust duct 61 during rotation, ensuring smooth adjustment, reducing wear on the exhaust duct 61 and the damping part 62, and extending their service life. Of course, the exhaust duct 61 can also be a square tube or other shaped fittings; this is not limited here.

[0041] Furthermore, the damping part 62 can be circular, with its center located on the axis of the exhaust duct 61 when perpendicular to the axis of the exhaust duct 61. The diameter of the damping part 62 is smaller than the inner diameter of the exhaust duct 61, so the damping part 62 will never rub against the inner wall of the exhaust duct 61 regardless of its angle. Of course, the damping part 62 can also be configured in other shapes as needed, such as elliptical, etc., without limitation.

[0042] Optionally, the exhaust duct 61 can be made of a transparent material. Specifically, the exhaust duct 61 can be made of transparent PVC (Polyvinyl chloride). PVC material is suitable for chambers using non-strong acid processes. Users can also choose the material of the exhaust duct 61 according to their needs; no limitation is made here. Using a transparent material for the exhaust duct 61 allows for easy observation of the actual rotation state of its internal damping part 62, facilitating adjustment and subsequent maintenance.

[0043] The shielding area of ​​the damping part 62 on the exhaust duct 61 varies depending on the rotation angle. Figure 3 The damping part 62 in the diagram is shown in solid line (before rotation) and dashed line (after rotation). Before rotation, the damping part 62 is parallel to the axis of the exhaust duct 61, barely obstructing it. At this state, the exhaust area is at its maximum and the air pressure is at its minimum. If, in the current state, the drive motor 63 rotates the damping part 62 90° via the drive shaft, then the damping part 62 becomes perpendicular to the axis of the exhaust duct 61, obstructing it. Gas in the process chamber can only escape through the gap between the outer edge of the damping part 62 and the inner wall of the exhaust duct 61. At this state, the exhaust area is at its minimum and the air pressure is at its maximum.

[0044] In this embodiment, there is a certain gap between the outer edge of the damping part 62 and the inner wall of the exhaust duct 61. Even when the damping part 62 is closed, the exhaust device 6 still has a certain exhaust area, ensuring that an airflow field can always be formed in the process chamber, thereby ensuring the smooth progress of the cleaning process. In addition, the exhaust duct 61 is made of transparent material, which facilitates observation of the actual working status of the damping part 62 during debugging and subsequent maintenance.

[0045] This application also provides a semiconductor cleaning apparatus, including a chamber 1, a chemical solution collection mechanism 5, an air supply mechanism 3, a chemical solution spraying mechanism 2, a controller (not shown in the figure), a chuck 4, and an exhaust device 6 as described in any of the above embodiments. The structure of other parts of the semiconductor cleaning apparatus can be referred to the prior art, and will not be described in detail here.

[0046] like Figure 1 As shown, chamber 1 is the process chamber, and chuck 4 is installed inside chamber 1 to hold the wafer. Air supply mechanism 3 is located at the top of chamber 1 to provide a stable and clean airflow. The nozzle of the cleaning solution spraying mechanism 2 is located above chuck 4 to spray cleaning solution onto the wafer. Under the action of the airflow, the cleaning solution falls evenly onto the surface of the wafer, cleaning the wafer surface. A liquid collection mechanism is arranged around chuck 4, and the upper end of the liquid collection mechanism 5 is higher than the upper surface of chuck 4, used to collect the cleaning solution after cleaning the wafer. A drain port 7 is provided at the bottom of the liquid collection mechanism 5, through which the collected cleaning solution is discharged from the liquid collection device. The exhaust pipe 61 of the exhaust device 6 is fixed to the bottom of the liquid collection mechanism 5 and connected to it. The airflow entering chamber 1 can be discharged from chamber 1 by the exhaust device 6. The controller controls the exhaust device 6 to change the exhaust area, thereby adjusting the air pressure. The inlet of the exhaust duct 61 is higher than the drain outlet 7, thereby preventing the cleaning fluid from entering the exhaust duct 61.

[0047] The air supply mechanism 3 can be specifically a fan or a pressure stabilizing tank, etc. When the air supply mechanism is a fan, it can provide a stable airflow field. The fan speed can adjust the airflow speed, and the exhaust area of ​​the exhaust device can adjust the air pressure. When the air supply mechanism 3 is a pressure stabilizing tank, reducing the exhaust area of ​​the exhaust device can increase the air pressure and decrease the airflow speed; conversely, increasing the exhaust area can decrease the air pressure and increase the airflow speed. The pressure stabilizing tank can increase or decrease the air supply pressure as needed, and the exhaust device works in conjunction with the pressure stabilizing tank to control the airflow speed and air pressure.

[0048] In this embodiment, the semiconductor cleaning equipment includes an exhaust device 6, and the controller automatically adjusts the air pressure through the exhaust device. The damping part 62 of the exhaust device 6 is disposed in the exhaust duct 61, which reduces the size of the exhaust device and facilitates its arrangement within the semiconductor cleaning equipment.

[0049] Optionally, chamber 1 is equipped with a wind speed measuring mechanism for measuring the wind speed of the wind field. Specifically, the wind speed measuring mechanism can be a wind speed sensor 8. The wind speed sensor 8 can measure the actual wind speed of the wind field in real time. If there is a deviation between the actual wind speed and the set wind speed, negative feedback adjustment can be performed based on the difference until the actual wind speed reaches the set wind speed. The semiconductor cleaning equipment can improve the accuracy of the control process and thus improve the cleaning effect by adjusting and controlling the wind speed of the wind field through negative feedback. In addition, measuring the wind speed at a single point is often not accurate enough. Therefore, two or more wind speed sensors 8 can be installed in chamber 1 to measure simultaneously, and the actual wind speed can be determined based on the measurement results. The specific number of wind speed sensors 8 can be set according to user needs and is not limited here.

[0050] Optionally, a pressure sensor 65 may also be installed in the exhaust duct 61, such as... Figure 1 As shown, the pressure sensor 65 is located on the side of the damping section 62 near the liquid collection mechanism 5. The pressure sensor 65 can monitor whether the pressure in the exhaust pipe 61 is consistent with the set pressure. If they are inconsistent, negative feedback adjustment is performed to change the angle of the damping section 62. The pressure sensor 65 can improve the accuracy of air pressure control in the process chamber and improve the cleaning effect.

[0051] Optionally, the air supply mechanism 3 includes a fan and a filter element. The fan delivers airflow into the process chamber, and the filter element, located between the fan and the chuck 4, filters the airflow. The fan speed is adjustable, specifically from 600 to 1500 r / min. Users can also select the appropriate speed range as needed; this is not limited here. The fan rotation generates airflow, which, after being filtered by the filter element, is blown downwards into the process chamber. During this process, the air velocity and pressure within the process chamber depend on the fan speed and the airtightness of the process chamber, which is primarily determined by the exhaust device 6. With a fixed exhaust area in the exhaust duct 61, a faster fan speed results in a higher air velocity within the process chamber.

[0052] The exhaust device 6 primarily affects the air pressure within the chamber, and the damping part 62 is installed inside the exhaust duct 61. The drive motor 63 drives the damping part 62 to rotate via the drive shaft, changing the exhaust area of ​​the exhaust duct 61. With the fan speed of the air supply mechanism 3 fixed, the larger the angle between the damping part 62 and the axis of the exhaust duct 61, the greater the air pressure within the process chamber.

[0053] Specifically, to achieve high air velocity and high air pressure within the process chamber, the fan speed of the air supply mechanism 3 can be increased while simultaneously increasing the angle between the axis of the damping part 62 and the axis of the exhaust duct 61. Conversely, to achieve low air velocity and low air pressure within the process chamber, the fan speed of the air supply mechanism 3 can be decreased while simultaneously decreasing the angle between the axis of the damping part 62 and the axis of the exhaust duct 61. Of course, the above examples are only qualitative analyses; the actual effect depends on the rate of change of the two variables, which is not limited here.

[0054] Optionally, the air supply mechanism 3 supplies air downwards, and the orthographic projection of the upper surface of the chuck 4 on the horizontal plane is located inside the orthographic projection of the air supply mechanism 3 on the horizontal plane, thereby ensuring that the air field can cover the entire area where the chuck 4 is located.

[0055] Because different stages of the cleaning process have different requirements for air velocity and air pressure in the process chamber, process engineers develop a requirement parameter table based on internal databases or relevant parameters of competing equipment, and then convert the parameters in the requirement parameter table into executable control parameters. The conversion is mainly carried out through two methods: fluid simulation and experimental measurement.

[0056] Fluid simulation can be performed using flow field simulation analysis software. A model is created based on the process chamber structure. The fan speed of the air supply mechanism 3 and the axial angle between the damping part 62 and the exhaust pipe 61 in the exhaust device 6 are set as variables. The variable parameters are adjusted using the controlled variable method to conduct the simulation, ultimately obtaining the combination of control parameters corresponding to the process requirements. The advantage of this method is that it eliminates errors caused by discrepancies between the relevant instruments and equipment and the test conditions and the working conditions during experiments. The disadvantage is that modeling requires detailed structural parameters, including fan blade dimensions and angles; otherwise, the simulation results will have significant discrepancies with the actual results.

[0057] Experimental measurements were taken through actual testing. Using specialized testing equipment, including anemometer 8 and pressure sensor 65, different combinations of control variables were tested using the controlled variable method to find the optimal combination of control parameters that met the process requirements. The advantage of this method is its accuracy, based on actual test results; the disadvantages are that the testing is time-consuming, and the equipment itself can have a certain impact on the airflow environment within the process chamber.

[0058] After completing the above steps, the actual combination of execution parameters is written into the machine control software. Subsequently, as the process steps change, the system automatically executes the corresponding parameters, enabling automatic adjustment of air velocity and air pressure within the process chamber.

[0059] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this application, and this application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this application, and these modifications and improvements are also considered to be within the scope of protection of this application.

Claims

1. An exhaust device, applied to semiconductor cleaning equipment, characterized in that, This includes exhaust ductwork and pressure regulation mechanisms, among which, The exhaust duct is connected to the liquid collection mechanism of the semiconductor cleaning equipment for exhausting the semiconductor cleaning equipment. The pressure regulating mechanism includes a damping part and a driving part. The damping part is plate-shaped and is disposed in the exhaust duct. The driving part is fixed to the outer wall of the exhaust duct and is connected to the damping part through a driving shaft to drive the damping part to rotate, thereby regulating the exhaust pressure.

2. The exhaust device according to claim 1, characterized in that, The drive unit is a drive motor, and the pressure regulating mechanism also includes a mounting base. The drive motor is fixedly connected to the outer wall of the exhaust duct through the mounting base.

3. The exhaust device according to claim 2, characterized in that, The drive shaft is arranged along the diameter of the exhaust duct, and the outer edge of the damping part is spaced from the inner wall of the exhaust duct.

4. The exhaust device according to claim 1, characterized in that, The exhaust duct is made of a transparent material.

5. The exhaust device according to claim 3, characterized in that, The damping part is circular, the exhaust duct is circular, the center of the damping part is located on the axis of the exhaust duct, and the diameter of the damping part is smaller than the inner diameter of the exhaust duct.

6. A semiconductor cleaning device, characterized in that, It includes a chamber, a liquid medicine collection mechanism, an air supply mechanism, a liquid medicine spraying mechanism, a controller, a chuck, and an exhaust device as described in any one of claims 1 to 5; The chuck is disposed in the chamber for holding the wafer. The air supply mechanism is located at the top of the chamber for providing a downward airflow into the chamber. The cleaning solution spraying mechanism is used to spray cleaning solution onto the wafer to clean the wafer surface. The cleaning solution collection mechanism is disposed around the chuck for collecting the cleaning solution. The bottom of the cleaning solution collection mechanism is provided with a drain port. The exhaust pipe of the exhaust device is fixed to the bottom of the liquid collection mechanism, and the inlet of the exhaust pipe is higher than the outlet.

7. The semiconductor cleaning equipment according to claim 6, characterized in that, The chamber is equipped with a wind speed measuring mechanism for measuring wind speed in the wind field.

8. The semiconductor cleaning equipment according to claim 7, characterized in that, The exhaust duct is also equipped with a pressure sensor located on the side of the damping section near the liquid collection mechanism.

9. The semiconductor cleaning equipment according to claim 6, characterized in that, The orthographic projection of the upper surface of the chuck onto the horizontal plane lies inside the orthographic projection of the air supply mechanism onto the horizontal plane.

10. The semiconductor cleaning equipment according to claim 9, characterized in that, The air supply mechanism includes a fan and a filter element, which is located between the fan and the chuck and is used to filter the purge gas.

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