A CHUCK disk for semiconductor detection

Abstract

The present invention relates to the field of semiconductor technology, and discloses a CHUCK disk for semiconductor detection, which includes a chip silicon wafer adsorbed on the lower surface of an annular groove. A spraying component for cleaning the chip silicon wafer is installed on the disk body. A cleaning component is connected to a rotating member. When the rotating member is driven by a motor and a gear, the cleaning component makes a circular motion on the disk body to clean the chip silicon wafer. Through the arrangement of the cleaning component, the second roller brush installed on the lower surface of the connecting block continuously cleans the upper surface of the chip silicon wafer as the connecting block rotates. When the chip silicon wafer is adsorbed, the second roller brush is at the upper surface of the chip silicon wafer at this time, thereby reducing the stains on the surface of the chip silicon wafer and improving the accuracy of the detection result.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly to a CHUCK disk for semiconductor detection. Background Art

[0002] A CHUCK disk for semiconductor detection is a device used to fix and position wafers, especially during three-temperature testing. Three-temperature testing is a chip testing method used to detect the reliability and stability of chips at different temperatures.

[0003] The CHUCK disk fixes the wafer in a specific position by mechanical vacuum adsorption or electrostatic adsorption for accurate testing. Existing CHUCK disks are usually set on a robotic arm. The CHUCK disk adsorbs the wafer and then adjusts the CHUCK disk and the wafer to the side of the detection device by adjusting the robotic arm. However, before detection, there may be a small amount of dust and impurities on the surface of the wafer, which may affect the accuracy of the wafer detection results. Summary of the Invention

[0004] The purpose of the present invention is to provide a CHUCK disk for semiconductor detection to solve the problems raised in the above background art.

[0005] To solve the above technical problems, the present invention is realized through the following technical solutions:

[0006] The present invention is a CHUCK disk for semiconductor detection, including a disk body. A motor is installed on the disk body, and a rotating member is installed on the disk body. A gear is installed on the output shaft of the motor for driving the rotating member.

[0007] An annular cavity and a plurality of channels are provided inside the disk body. The plurality of channels communicate with the annular cavity, and one end of the channels away from the annular cavity converges and communicates in the middle of the disk body. A trachea is connected and extends to the inside of the channels at the middle of the upper surface of the disk body.

[0008] A plurality of annular grooves are provided on the lower surface of the disk body, and the annular grooves communicate with the channels.

[0009] A chip silicon wafer is adsorbed on the lower surface of the annular groove, and a spray component for cleaning the chip silicon wafer is installed on the disk body.

[0010] A cleaning component is connected to the rotating member. When the rotating member is driven by the motor and the gear, the cleaning component makes a circular motion on the disk body for cleaning the chip silicon wafer.

[0011] The purpose of the above settings is to connect the trachea to an external vacuum pump to extract the trachea. By applying an appropriate negative pressure to the trachea, gas can flow in the channel and the annular cavity. Since the annular groove is connected to the channel, under the action of air pressure, the lower surface of the annular groove can adsorb the chip silicon wafer, so that the chip silicon wafer is stably fixed on the lower surface of the annular groove;

[0012] When the motor starts, the output shaft of the motor drives the gear to rotate. The gear cooperates with the rotating part, thereby driving the rotating part to rotate. When the rotating part is driven to rotate, the cleaning component connected to the rotating part makes a circular motion on the disc body. During the circular motion, the cleaning component cleans the chip silicon wafer adsorbed on the lower surface of the annular groove to remove impurities on the surface of the chip silicon wafer. At the same time, the spraying component installed on the disc body is used to clean the chip silicon wafer. The spraying component can spray cleaning liquid, which cooperates with the cleaning action of the cleaning component to clean the chip silicon wafer comprehensively to achieve a better cleaning effect.

[0013] Further, the spraying component includes a liquid storage box and a cavity. The liquid storage box is installed on the outer wall of the connecting piece. The top of the liquid storage box is provided with a liquid inlet. The bottom of the liquid storage box is communicated with the top of the cavity. The bottom of the cavity is communicated with a spray pipe, and the port of the spray pipe faces the chip silicon wafer.

[0014] The purpose of the above settings is to add cleaning liquid to the liquid storage box through the liquid inlet at the top;

[0015] The liquid flowing from the bottom of the liquid storage box into the cavity is sprayed out through the spray pipe communicated at the bottom. The port of the spray pipe faces the chip silicon wafer, so as to realize the spraying of the cleaning liquid on the chip silicon wafer.

[0016] Further, a rotating shaft is rotatably connected to the middle of the cavity. A plurality of blade plates are evenly connected to the outer wall of the rotating shaft. The blade plates are in mutual fit with the inner wall of the cavity. The output shaft of the motor is connected to the rotating shaft.

[0017] The purpose of the above settings is that when the motor starts, the output shaft of the motor drives the rotating shaft in the middle of the cavity to rotate. When the rotating shaft rotates, the blade plates evenly connected to its outer wall rotate in the cavity. Since the blade plates are in mutual fit with the inner wall of the cavity, the rotation of the blade plates will generate pressure on the liquid in the cavity. At the same time, each two blade plates form a small chamber to transport the cleaning liquid from the top to the bottom of the cavity.

[0018] Further, the rotating part includes a rotating ring and a toothed ring. The rotating ring and the toothed ring are connected to each other. The rotating ring is rotatably connected to the port of the annular groove and closed. The toothed ring is arranged on the upper surface of the disc body and meshes with the gear.

[0019] The purpose of the above setting is that when the motor starts, the gear on the output shaft of the motor drives the toothed ring to rotate. Since the toothed ring is connected to the rotating ring, the rotation of the toothed ring will drive the rotating ring to rotate. The rotating ring is rotatably connected to the port of the annular groove and seals it, ensuring its sealing performance and stability.

[0020] Further, the cleaning assembly includes a connecting block. The connecting block is installed on the upper surface of the rotating ring and is communicated with the inside of the annular groove through the rotating ring.

[0021] The distance between the bottom of the liquid storage box and the rotating ring is greater than the height of the connecting block. A sliding cavity is provided inside the connecting block. A first spring is installed on the inner wall of the sliding cavity. An activity frame is slidably connected to the inner wall of the sliding cavity. A limiting ring is installed on the inner wall of the sliding cavity to block the first spring.

[0022] The purpose of the above setting is that when the rotating ring rotates, the connecting block connected to the upper surface of the rotating ring rotates accordingly. The inside of the connecting block is communicated with the inside of the annular groove through the rotating ring. The air inside the connecting block is extracted. The activity frame and the first roller brush move towards the lower surface of the chip silicon wafer. Since the first spring is installed on the inner wall of the sliding cavity, the activity frame will compress the first spring when sliding in the sliding cavity. The limiting ring blocks the first spring to prevent its excessive displacement and avoid blocking the exhaust hole of the connecting block. The first roller brush rotatably connected to the end of the activity frame away from the first spring contacts the lower surface of the chip silicon wafer, and the lower surface of the chip silicon wafer is cleaned as the connecting block rotates.

[0023] Further, a first roller brush is rotatably connected to the end of the activity frame away from the first spring. When the activity frame and the first roller brush move towards the lower surface of the chip silicon wafer, they clean its lower surface.

[0024] A second roller brush is installed on the lower surface of the connecting block.

[0025] The purpose of the above setting is that the second roller brush installed on the lower surface of the connecting block continuously cleans the upper surface of the chip silicon wafer as the connecting block rotates. When the chip silicon wafer is adsorbed, the second roller brush is at the upper surface of the chip silicon wafer at this time.

[0026] Further, several of the annular grooves have different diameters and are arranged in a progressive and uniform manner on the lower surface of the disk body.

[0027] Several through grooves are provided between several of the annular grooves for communication. One end of several of the through grooves is centrally connected to the middle of the disk body. The annular groove is communicated with the channel through the through groove.

[0028] The purpose of the above setting is that several annular grooves are arranged in a progressive and uniform distribution with different diameters on the lower surface of the disk body. The through grooves arranged between the annular grooves connect them, and one end of the through groove is centrally connected to the middle of the disk body. The annular grooves are connected to the channel through the through groove. Such a structure helps the gas to be evenly distributed on the entire lower surface of the disk body, ensuring the adsorption stability of the chip silicon wafer at each annular groove.

[0029] Furthermore, three bumps are evenly arranged on the outer wall of the connecting piece, and an auxiliary component for cooperating with the bumps is installed on the outer wall of the connecting block.

[0030] The purpose of the above setting is that when the connecting block rotates with the rotating ring, the auxiliary component on the outer wall of the connecting block interacts with the bumps on the outer wall of the connecting piece.

[0031] Furthermore, the auxiliary component includes groove rails. Two groove rails are respectively installed on the outer wall of the connecting block. A second spring is installed on the inner wall of the groove rail. An arc-shaped claw is slidably connected to the groove rail. A connecting frame is connected between the two arc-shaped claws. One end of the connecting frame forms an arc for pushing and cooperating with the bump.

[0032] The arc-shaped claw is formed in an arc-shaped bend and extends towards the lower surface of the chip silicon wafer. The two arc-shaped claws are respectively located outside the first roller brush.

[0033] The purpose of the above setting is that the arc-shaped claw is formed in an arc-shaped bend and extends towards the lower surface of the chip silicon wafer. The two arc-shaped claws are respectively located outside the first roller brush. When the connecting block rotates, the second spring in the groove rail where the arc-shaped claw is located will elastically deform according to the pushing and cooperating situation between the bump and the arc-shaped end of the connecting frame, so that the arc-shaped claw can adapt to the pushing of the bump, and the arc-shaped claw shrinks to the outside of the chip silicon wafer, thus facilitating the subsequent detachment of the chip silicon wafer.

[0034] During the cleaning process, the cleaning component rubs against the chip silicon wafer, which may cause the chip silicon wafer to fall off from the lower surface of the annular groove to a certain extent. The spacing between each bump is relatively large, forming a large space, so that the arc-shaped claw is long-term located under the chip silicon wafer to lift the chip silicon wafer and prevent the chip silicon wafer from accidentally falling. After the chip silicon wafer is cleaned, the bump and the arc-shaped end of the connecting frame maintain a pushing and cooperating state, keeping the arc-shaped claw away from the chip silicon wafer, facilitating the detachment and placement of the chip silicon wafer.

[0035] The present invention has the following beneficial effects:

[0036] (1) Through the arrangement of the cleaning component, when the rotating ring rotates, the connecting block connected to the upper surface of the rotating ring rotates accordingly. The inside of the connecting block communicates with the inside of the annular groove through the rotating ring, and the air inside the connecting block is extracted. The movable frame and the first roller brush move towards the lower surface of the chip silicon wafer. Since the first spring is installed on the inner wall of the sliding cavity, the movable frame will compress the first spring when sliding in the sliding cavity. The limiting ring blocks the first spring to prevent it from excessive displacement, avoiding the blockage of the exhaust hole of the connecting block. One end of the movable frame far from the first spring is rotatably connected to the first roller brush, which contacts the lower surface of the chip silicon wafer. As the connecting block rotates, the lower surface of the chip silicon wafer is cleaned. The second roller brush installed on the lower surface of the connecting block continuously cleans the upper surface of the chip silicon wafer as the connecting block rotates. When the chip silicon wafer is adsorbed, at this time, the second roller brush is on the upper surface of the chip silicon wafer, thereby reducing the stains on the surface of the chip silicon wafer and improving the accuracy of the detection result.

[0037] Of course, any product implementing the present invention does not necessarily need to achieve all the above-mentioned advantages simultaneously. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0039] Figure 1 Schematic diagram of the overall structure of the present invention;

[0040] Figure 2 Schematic diagram of the rotating part of the present invention;

[0041] Figure 3 Schematic diagram of the internal structure of the disk body of the present invention;

[0042] Figure 4 Schematic diagram of the rotating part and the cleaning component of the present invention;

[0043] Figure 5 Schematic diagram of the cleaning component of the present invention;

[0044] Figure 6 Schematic diagram of the spraying component of the present invention;

[0045] Figure 7 Schematic diagram of the auxiliary component of the present invention;

[0046] Figure 8 Schematic diagram of the disk body structure of the present invention;

[0047] In the drawings, the list of components represented by each reference numeral is as follows:

[0048] In the figure: 1. Disc body; 101. Annular cavity; 102. Channel; 103. Annular groove; 2. Connecting piece; 3. Air pipe; 4. Bump; 5. Motor; 6. Spraying component; 601. Liquid storage box; 602. Spray pipe; 603. Cavity; 604. Vane; 7. Cleaning component; 701. Connecting block; 702. Movable frame; 703. First roller brush; 704. First spring; 705. Second roller brush; 8. Rotating ring; 9. Tooth ring; 10. Auxiliary component; 1001. Groove track; 1002. Second spring; 1003. Arc claw; 1004. Connecting frame; 11. Gear. Specific embodiments

[0049] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0050] The present invention is a CHUCK disc for semiconductor detection, as Figures 1-8 shown, including a disc body 1, a motor 5 is installed on the disc body 1, a rotating member is installed on the disc body 1, and a gear 11 is installed on the output shaft of the motor 5 for driving the rotating member;

[0051] An annular cavity 101 and several channels 102 are arranged inside the disc body 1. The several channels 102 are communicated with the annular cavity 101. One end of the channel 102 far from the annular cavity 101 is centrally communicated in the middle of the disc body 1. A trachea 3 is communicated with the middle of the upper surface of the disc body 1 and extends into the inside of the channel 102;

[0052] Several annular grooves 103 are arranged on the lower surface of the disc body 1, and the annular grooves 103 are communicated with the channels 102;

[0053] A chip silicon wafer is adsorbed on the lower surface of the annular groove 103, and a spraying component 6 for cleaning the chip silicon wafer is installed on the disc body 1;

[0054] A cleaning component 7 is connected to the rotating member. When the rotating member is driven by the motor 5 and the gear 11, the cleaning component 7 makes a circular motion on the disc body 1 for cleaning the chip silicon wafer.

[0055] In this embodiment, the purpose of the above settings is that the trachea 3 is connected to an external vacuum pump to extract the trachea 3. By applying an appropriate negative pressure to the trachea 3, gas can flow in the channel 102 and the annular cavity 101. Since the annular groove 103 is connected to the channel 102, under the action of air pressure, the lower surface of the annular groove 103 can adsorb the chip silicon wafer, so that the chip silicon wafer is stably fixed on the lower surface of the annular groove 103;

[0056] The motor 5 is started, and the output shaft of the motor 5 drives the gear 11 to rotate. The gear 11 cooperates with the rotating member, thereby driving the rotating member to rotate. When the rotating member is driven to rotate, the cleaning assembly 7 connected to the rotating member makes a circular motion on the disc body 1. During the circular motion, the cleaning assembly 7 cleans the chip silicon wafer adsorbed on the lower surface of the annular groove 103 to remove impurities on the surface of the chip silicon wafer. At the same time, the spraying assembly 6 installed on the disc body 1 is used to clean the chip silicon wafer. The spraying assembly 6 can spray cleaning liquid, which cooperates with the cleaning action of the cleaning assembly 7 to clean the chip silicon wafer in all directions to achieve a better cleaning effect.

[0057] As an implementation manner, as Figure 6 shown, further:

[0058] The spraying assembly 6 includes a liquid storage box 601 and a cavity 603. The liquid storage box 601 is installed on the outer wall of the connecting member 2. The top of the liquid storage box 601 is provided with a liquid inlet. The bottom of the liquid storage box 601 and the top of the cavity 603 are communicated with each other. The bottom of the cavity 603 is communicated with a spray pipe 602, and the port of the spray pipe 602 faces the chip silicon wafer.

[0059] In this embodiment, the purpose of the above settings is that the cleaning liquid is added to the liquid storage box 601 through the liquid inlet at the top;

[0060] The liquid flowing from the bottom of the liquid storage box 601 into the cavity 603 is sprayed out through the spray pipe 602 communicated at the bottom. The port of the spray pipe 602 faces the chip silicon wafer, so as to realize the spraying of the cleaning liquid on the chip silicon wafer,

[0061] As an implementation manner, as Figure 6 shown, further:

[0062] A rotating shaft is rotatably connected to the middle of the cavity 603. A plurality of blade plates 604 are evenly connected to the outer wall of the rotating shaft. The blade plates 604 are in mutual contact with the inner wall of the cavity 603. The output shaft of the motor 5 is connected to the rotating shaft.

[0063] In this embodiment, the purpose of the above setting is that when the motor 5 starts, the output shaft of the motor 5 drives the rotating shaft in the middle of the cavity 603 to rotate. When the rotating shaft rotates, the blade plates 604 uniformly connected to its outer wall rotate in the cavity 603. Since the blade plates 604 are in mutual contact with the inner wall of the cavity 603, the rotation of the blade plates 604 will generate pressure on the liquid in the cavity 603. At the same time, every two blade plates 604 form a small chamber, and the cleaning liquid is transported from the top to the bottom of the cavity 603.

[0064] As an implementation manner, as Figure 2 shown, further:

[0065] The rotating member includes a rotating ring 8 and a toothed ring 9. The rotating ring 8 and the toothed ring 9 are connected to each other. The rotating ring 8 is rotatably connected to the port of the annular groove 103 and closes it. The toothed ring 9 is arranged on the upper surface of the disk body 1 and meshes with the gear 11.

[0066] In this embodiment, the purpose of the above setting is that when the motor 5 starts, the gear 11 on the output shaft of the motor 5 drives the toothed ring 9 to rotate. Since the toothed ring 9 is connected to the rotating ring 8, the rotation of the toothed ring 9 will drive the rotating ring 8 to rotate. The rotating ring 8 is rotatably connected to the port of the annular groove 103 and closes it, ensuring its sealing performance and stability.

[0067] As an implementation manner, as Figure 5 shown, further:

[0068] The cleaning assembly 7 includes a connecting block 701. The connecting block 701 is installed on the upper surface of the rotating ring 8 and is communicated with the inside of the annular groove 103 through the rotating ring 8;

[0069] The distance between the bottom of the liquid storage box 601 and the rotating ring 8 is greater than the height of the connecting block 701. A sliding cavity is arranged inside the connecting block 701. A first spring 704 is installed on the inner wall of the sliding cavity. A movable frame 702 is slidably connected to the inner wall of the sliding cavity. A limiting ring is installed on the inner wall of the sliding cavity to block the first spring 704.

[0070] In this embodiment, the purpose of the above setting is that when the rotating ring 8 rotates, the connecting block 701 connected to the upper surface of the rotating ring 8 rotates accordingly. The inside of the connecting block 701 is communicated with the inside of the annular groove 103 through the rotating ring 8. The air inside the connecting block 701 is extracted, and the movable frame 702 and the first roller brush 703 move towards the lower surface of the chip silicon wafer. Since the first spring 704 is installed on the inner wall of the sliding cavity, the movable frame 702 will compress the first spring 704 when sliding in the sliding cavity. The limiting ring blocks the first spring 704 to prevent its excessive displacement and avoid blocking the exhaust hole of the connecting block 701. One end of the movable frame 702 away from the first spring 704 is rotatably connected to the first roller brush 703, which contacts the lower surface of the chip silicon wafer. As the connecting block 701 rotates, the lower surface of the chip silicon wafer is cleaned.

[0071] As an implementation manner, as Figure 5 shown, furthermore:

[0072] One end of the movable frame 702 away from the first spring 704 is rotatably connected to the first roller brush 703. When the movable frame 702 and the first roller brush 703 move towards the lower surface of the chip silicon wafer, the lower surface is cleaned.

[0073] The lower surface of the connecting block 701 is provided with a second roller brush 705.

[0074] In this embodiment, the purpose of the above setting is that the second roller brush 705 installed on the lower surface of the connecting block 701 continuously cleans the upper surface of the chip silicon wafer as the connecting block 701 rotates. When the chip silicon wafer is adsorbed, the second roller brush 705 is located on the upper surface of the chip silicon wafer at this time.

[0075] As an implementation manner, as Figure 8 shown, furthermore:

[0076] A number of annular grooves 103 have different diameters and are evenly distributed in a progressive manner on the lower surface of the disk body 1;

[0077] A number of through grooves are provided between the a number of annular grooves 103 for communication. One end of the a number of through grooves is centrally connected to the middle of the disk body 1, and the annular groove 103 is communicated with the channel 102 through the through groove.

[0078] In this embodiment, the purpose of the above setting is that a number of annular grooves 103 have different diameters and are evenly distributed in a progressive manner on the lower surface of the disk body 1. The through grooves provided between the annular grooves 103 connect them, and one end of the through groove is centrally connected to the middle of the disk body 1. The annular groove 103 is communicated with the channel 102 through the through groove. Such a structure helps the gas to be evenly distributed on the entire lower surface of the disk body 1 and ensures the adsorption stability of the chip silicon wafer at each annular groove 103.

[0079] As an implementation, as Figure 1 shown, furthermore:

[0080] Three bumps 4 are evenly arranged on the outer wall of the connecting piece 2, and an auxiliary component 10 for cooperating with the bumps 4 is installed on the outer wall of the connecting block 701.

[0081] In this embodiment, the purpose of the above setting is that when the connecting block 701 rotates with the rotating ring 8, the auxiliary component 10 on the outer wall of the connecting block 701 interacts with the bumps 4 on the outer wall of the connecting piece 2.

[0082] As an implementation, as Figure 7 shown, furthermore:

[0083] The auxiliary component 10 includes groove rails 1001. Two groove rails 1001 are respectively installed on the outer wall of the connecting block 701. A second spring 1002 is installed on the inner wall of the groove rail 1001. An arc-shaped claw 1003 is slidably connected to the groove rail 1001. A connecting frame 1004 is connected between the two arc-shaped claws 1003. One end of the connecting frame 1004 forms an arc for pushing and cooperating with the bump 4.

[0084] The arc-shaped claw 1003 is formed in an arc-shaped bend and extends towards the lower surface of the chip silicon wafer. The two arc-shaped claws 1003 are respectively located outside the first roller brush 703.

[0085] In this embodiment, the purpose of the above setting is that the arc-shaped claw 1003 is formed in an arc-shaped bend and extends towards the lower surface of the chip silicon wafer. The two arc-shaped claws 1003 are respectively located outside the first roller brush 703. When the connecting block 701 rotates, the second spring 1002 in the groove rail 1001 where the arc-shaped claw 1003 is located will elastically deform according to the pushing and cooperating situation between the bump 4 and the arc-shaped end of the connecting frame 1004, so that the arc-shaped claw 1003 can adapt to the pushing of the bump 4, and the arc-shaped claw 1003 shrinks to the outside of the chip silicon wafer, thus facilitating the subsequent detachment of the chip silicon wafer;

[0086] During the cleaning process, the cleaning component 7 rubs against the chip silicon wafer, which may cause the chip silicon wafer to fall off from the lower surface of the annular groove 103 to a certain extent. The distance between each bump 4 is relatively large, forming a large space, so that the arc-shaped claw 1003 is long-term located on the lower surface of the chip silicon wafer to lift the chip silicon wafer and prevent the chip silicon wafer from accidentally falling. After the chip silicon wafer is cleaned, the bump 4 and the arc-shaped end of the connecting frame 1004 maintain a pushing and cooperating state, keeping the arc-shaped claw 1003 away from the chip silicon wafer, facilitating the detachment and placement of the chip silicon wafer.

[0087] During use, the air pipe 3 is connected to an external vacuum pump to extract the air pipe 3. By applying an appropriate negative pressure to the air pipe 3, gas can flow in the channel 102 and the annular cavity 101. Since the annular groove 103 is communicated with the channel 102, under the action of air pressure, the lower surface of the annular groove 103 can adsorb the chip silicon wafer, so that the chip silicon wafer is stably fixed on the lower surface of the annular groove 103;

[0088] The motor 5 is started, and the output shaft of the motor 5 drives the gear 11 to rotate. The gear 11 cooperates with the rotating member, so as to drive the rotating member to rotate. When the rotating member is driven to rotate, the cleaning component 7 connected to the rotating member makes a circular motion on the disk body 1. During the circular motion, the cleaning component 7 cleans the chip silicon wafer adsorbed on the lower surface of the annular groove 103 to remove the impurities on the surface of the chip silicon wafer. At the same time, the spraying component 6 installed on the disk body 1 is used to clean the chip silicon wafer. The spraying component 6 can spray the cleaning liquid, which cooperates with the cleaning action of the cleaning component 7 to clean the chip silicon wafer in all directions to achieve a better cleaning effect.

[0089] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principle and practical application of the present invention, so that those skilled in the art can well understand and utilize the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A CHUCK disk for semiconductor detection, comprising a disk body (1), characterized in that: A motor (5) is installed on the disk body (1). A rotating member is installed on the disk body (1). A gear (11) is installed on the output shaft of the motor (5) for driving the rotating member. An annular cavity (101) and a plurality of channels (102) are arranged inside the disk body (1). The plurality of channels (102) communicate with the annular cavity (101). One end of the channel (102) far from the annular cavity (101) is centrally connected to the middle of the disk body (1). A trachea (3) is connected and extends into the interior of the channel (102) in the middle of the upper surface of the disk body (1). A plurality of annular grooves (103) are arranged on the lower surface of the disk body (1). The annular grooves (103) communicate with the channels (102). A chip silicon wafer is adsorbed on the lower surface of the annular groove (103). A spray component (6) for cleaning the chip silicon wafer is installed on the disk body (1). A cleaning component (7) is connected to the rotating member. When the rotating member is driven by the motor (5) and the gear (11), the cleaning component (7) moves in a circular motion on the disk body (1) for cleaning the chip silicon wafer.

2. The CHUCK disk for semiconductor detection according to claim 1, characterized in that: The spray component (6) includes a liquid storage box (601) and a cavity (603). The liquid storage box (601) is installed on the outer wall of the connecting member (2). A liquid inlet is arranged at the top of the liquid storage box (601). The bottom of the liquid storage box (601) communicates with the top of the cavity (603). A spray pipe (602) is connected to the bottom of the cavity (603). The port of the spray pipe (602) faces the chip silicon wafer.

3. The CHUCK disk for semiconductor detection according to claim 2, characterized in that: A rotating shaft is rotatably connected to the middle of the cavity (603). A plurality of vane plates (604) are evenly connected to the outer wall of the rotating shaft. The vane plates (604) are in contact with the inner wall of the cavity (603). The output shaft of the motor (5) is connected to the rotating shaft.

4. The CHUCK disk for semiconductor detection according to claim 3, wherein: The rotating member includes a rotating ring (8) and a toothed ring (9). The rotating ring (8) and the toothed ring (9) are connected to each other. The rotating ring (8) is rotatably connected to the port of the annular groove (103) and closes it. The toothed ring (9) is arranged on the upper surface of the disk body (1) and meshes with the gear (11).

5. The CHUCK disk for semiconductor detection according to claim 4, characterized in that: The cleaning component (7) includes a connecting block (701). The connecting block (701) is installed on the upper surface of the rotating ring (8) and communicates with the inside of the annular groove (103) through the rotating ring (8). The distance between the bottom of the liquid storage box (601) and the rotating ring (8) is greater than the height of the connecting block (701). A sliding cavity is arranged inside the connecting block (701). A first spring (704) is installed on the inner wall of the sliding cavity. A movable frame (702) is slidably connected to the inner wall of the sliding cavity. A limiting ring is installed on the inner wall of the sliding cavity to block the first spring (704).

6. The CHUCK disk for semiconductor detection according to claim 5, wherein: One end of the movable frame (702) far from the first spring (704) is rotatably connected to a first roller brush (703). When the movable frame (702) and the first roller brush (703) move towards the lower surface of the chip silicon wafer, the lower surface is cleaned. The lower surface of the connecting block (701) is provided with a second roller brush (705).

7. The CHUCK disk for semiconductor detection according to claim 6, wherein: A plurality of the annular grooves (103) have different diameters and are evenly distributed on the lower surface of the disc body (1) in a progressive manner layer by layer; A plurality of through grooves are provided between the plurality of annular grooves (103) for communication. One end of the plurality of through grooves is centrally connected to the middle of the disc body (1), and the annular groove (103) is communicated with the channel (102) through the through groove.

8. A CHUCK disk for semiconductor detection according to claim 7, characterized in that: Three convex blocks (4) are evenly arranged on the outer wall of the connecting member (2), and an auxiliary component (10) for cooperating with the convex blocks (4) is installed on the outer wall of the connecting block (701).

9. A CHUCK disk for semiconductor detection according to claim 8, characterized in that: The auxiliary component (10) includes a groove rail (1001). Two groove rails (1001) are respectively installed on the outer wall of the connecting block (701). A second spring (1002) is installed on the inner wall of the groove rail (1001). An arc claw (1003) is slidably connected to the groove rail (1001). A connecting frame (1004) is connected between the two arc claws (1003). One end of the connecting frame (1004) is formed into an arc for pushing and cooperating with the convex block (4).

10. A CHUCK disk for semiconductor detection according to claim 9, characterized in that: The arc claw (1003) is formed into an arc shape and extends towards the lower surface of the chip silicon wafer. The two arc claws (1003) are respectively located outside the first roller brush (703).

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