Workpiece holding device

Abstract

[Problem] To provide a workpiece holding device that corrects deformation and warpage of a cutting frame and that can be stably adsorbed and held. [Solution] A device for holding a wafer (W) adhered to a dicing frame (11) via a dicing tape (12) is configured so as to be provided with: a chuck table (14) having a chuck part (15) capable of suctioning and holding the wafer (W), and a receiving part (16) concavely provided on the outer periphery of the chuck part (15); and a chuck plate (18) in which a suction hole (18e) open at the upper surface (18d) is formed, the chuck plate (18) being disposed in the receiving portion (16) and capable of sucking and holding the cutting frame (11), the suction hole (18e) communicating with a closed space (27) surrounded by the chuck table (14), the cutting frame (11), and the cutting tape (12), the suction hole (18e) being configured to be capable of sucking and holding the cutting frame (11) when negative pressure is supplied to the closed space (27), and the suction hole (18e) being communicated with the suction hole (18e) when negative pressure is supplied to the closed space (27). A connection region (12a) of the dicing tape (12), which connects the dicing frame (11) and the wafer (W), is bent so as to approach the chuck table (14).

Description

Technical Field

[0001] The present invention relates to a workpiece holding device for holding a workpiece such as a wafer attached to a dicing frame via a dicing tape in a manufacturing process of a semiconductor device. Background Art

[0002] In the manufacturing process of semiconductor devices, a grinding device is used to grind the wafer in order to make it thinner. The grinding device includes a chuck table that sucks and holds the wafer, and a grinding mechanism that has a grinding wheel that grinds the wafer sucked and held on the chuck table.

[0003] Furthermore, when a wafer is ground with a grinding wheel, if the wafer is warped, the wafer may not be held in a desired state even if it is sucked and held on a chuck table.

[0004] Therefore, in the past, as a method for transporting and setting a wafer, the following structure is known: a cutting tape is attached to a cutting frame having an opening in the center, a work unit is prepared on the cutting tape exposed from the opening of the cutting frame to which one surface of the wafer can be attached, and the wafer is transported to a chuck worktable while being set on the work unit (for example, Patent Document 1).

[0005] On the other hand, as a holding device for holding a workpiece unit on which a wafer is mounted, there is known a holding device that uses a chuck table and has a wafer holding portion disposed in the center portion for sucking and holding the wafer via a dicing tape, and a frame holding portion disposed around the outer side of the wafer holding portion for sucking and holding a cutting frame (similarly, Patent Document 1). In the holding device in Patent Document 1, the wafer is sucked and held by the wafer holding portion of the chuck table, and the cutting frame disposed on the wafer holding portion of the chuck table is lowered to a position where the upper surface of the cutting frame is lower than the upper surface height position of the wafer when it is completed, and the wafer is sucked and held on the chuck table at this lowered position.

[0006] In the holding device described in Patent Document 1, the air is sucked out by a suction port (second suction port) provided on the wafer holding portion of the chuck table and a suction port (first suction port) provided on the same chuck table corresponding to the wafer and the cutting frame, respectively, to hold the cutting tape on the chuck table by suction. However, when the thickness and rigidity of the cutting frame are small, or when the cutting frame is deformed or warped due to the tension of the cutting tape, the cutting tape may also warp along with the warping of the cutting frame, and the cutting tape may not be held by suction.

[0007] Therefore, in the grinding process, there is also a workpiece holding device with a structure that forcibly attracts and holds the cutting frame of the workpiece unit together with the cutting belt in the frame holding portion, such as a known Fig. 9 and Fig.10 The structure shown.

[0008] Fig. 9 and Fig.10 The workpiece holding device 100 shown includes a chuck table 110, a chuck plate 120, Fig.10 The workpiece unit 130 is shown. In addition, Fig. 9 is a state before the workpiece unit 130 is set on the chuck table 110 in the workpiece holding device 100, and the workpiece unit 130 is removed. Fig. 9 1 is a perspective view showing the chuck table 110 and the chuck plate 120. On the other hand, Fig.10 It is an enlarged cross-sectional view of a main part in a state where the work unit 130 is set on the chuck table 110 .

[0009] exist Fig. 9 and Fig.10 In the embodiment, the workpiece unit 130 includes a dicing tape 133 which is pasted to block the opening 131 of the dicing frame 132 on a dicing frame 132 having an opening 131 at the center, and a wafer W in the form of a circular plate as a workpiece is pasted on the dicing tape 133 exposed at the opening 131, thereby integrating the wafer W, the dicing tape 133 and the dicing frame 132. The surface of the wafer W is pasted on the dicing tape 133, and the back side is a ground surface ground by a grinding wheel or the like.

[0010] The chuck table 110 includes a chuck portion 111 having a holding surface 111a similar in shape to the wafer W and a storage portion 112, wherein the chuck portion 111 has a holding surface 111a similar in shape to the wafer W, and the storage portion 112 is recessed in the outer periphery of the chuck portion 111 and is annular. A circular chuck plate 120 having an outer diameter substantially equal to an outer inner peripheral surface 112b of the storage portion 112 is disposed on the bottom surface 112a of the storage portion 112.

[0011] In addition, on the bottom surface 112a of the storage portion 112, corresponding to the position where the chuck plate 120 is arranged, 12 suction holes 112d are dispersedly provided along the circumferential direction of the storage portion 112, which penetrate the upper and lower parts of the storage portion 112. In addition, on the bottom surface 112a of the storage portion 112, at a position separated from the area of ​​the inner peripheral surface 112c that does not overlap with the chuck plate 120, a plurality of drainage holes 112e are dispersedly provided along the circumferential direction, and the plurality of drainage holes 112e, for example, discharge the cleaning liquid remaining in the storage portion 112 to the outside during the rinsing process, and the other end opens at the outer peripheral surface of the chuck table 110.

[0012] On the other hand, 12 suction holes 120a are formed on the chuck plate 120 disposed in the storage section 112 corresponding to the suction holes 112d of the storage section 112. That is, the suction holes 120a of the chuck plate 120 disposed in the storage section 112 correspond to the suction holes 112d in the storage section 112 and are connected to each other. Moreover, a negative pressure source of a negative pressure supply mechanism (not shown) is connected to the suction holes 112d and the suction holes 120a, and the cutting frame 132 on the chuck plate 120 disposed in the storage section 112 can be sucked and held on the chuck plate 120 via the cutting belt 133 by utilizing the negative pressure from the negative pressure source. Fig.10 (a) shows a state where the chuck table 110 attracts and holds the work unit 130 together with the wafer W in this manner.

[0013] [Prior art literature]

[0014] [Patent Document]

[0015] [Patent Document 1]: Japanese Patent Application Publication No. 2015-88565 Summary of the invention

[0016] [Problems to be solved by the invention]

[0017] However, in Fig. 9 and Fig.10 In the workpiece holding device shown in (a), the chuck portion 111 sucks and holds the wafer W, and the cutting frame 132 is sucked and held toward the bottom surface 112a of the storage portion 112 via the chuck plate 120 in the storage portion 112. However, when the cutting frame 132 is bent due to the tension of the cutting tape 133, the cutting frame 132 cannot be sucked and held by the chuck plate 120.

[0018] In addition, Fig. 9 and Fig.10 In the workpiece holding device shown in (a), a drainage hole 112e is provided on the bottom surface 112a of the storage portion 112 of the chuck table 110. Therefore, when the cutting frame 132 is sucked by the suction hole 120a, for example, Fig.10 As shown in (b), the external gas enters the storage part 112 through the drain hole 112e as a leakage flow 121a, and the attraction generated by the negative pressure is weakened by the leakage flow 121a, and the cutting frame 132 cannot be instantly pulled vertically onto the chuck plate 120 for attraction, so the outer peripheral surface of the cutting frame 132 is inclined relative to the outer inner peripheral surface 112b of the storage part 112, and a gap is generated between the outer peripheral surface of the cutting frame 132 and the outer inner peripheral surface 112b of the storage part 112, and sometimes the leakage flow 121b is generated. When the leakage flow 121a and the leakage flow 121b are generated, the adsorption error of the cutting frame 132 occurs.

[0019] Therefore, in order to provide a workpiece holding device that can correct the deformation and warping of the cutting frame and stably hold the workpiece by adsorption, a technical problem that needs to be solved arises, and an object of the present invention is to solve this problem.

[0020] [Technical solution to the problem]

[0021] The present invention is proposed to achieve the above-mentioned purpose. The invention described in Technical Solution 1 provides a workpiece holding device, which is a device for holding a workpiece attached to a cutting frame via a cutting tape, and is characterized in that it comprises: a chuck worktable, which has a chuck portion capable of adsorbing and holding the workpiece and a storage portion recessed around the outer periphery of the chuck portion; and a chuck plate, which is formed with an adsorption hole opened on the top, and is arranged in the storage portion so as to adsorb and hold the cutting frame, the adsorption hole is connected to a closed space surrounded by the chuck worktable, the cutting frame and the cutting tape, and when negative pressure is supplied to the closed space, the connecting area of ​​the cutting tape connecting the cutting frame and the workpiece is bent in a manner close to the chuck worktable.

[0022] According to this structure, the suction hole for supplying negative pressure is connected to the closed space surrounded by the chuck worktable, the cutting frame and the cutting belt. Therefore, when negative pressure is supplied to the closed space through the suction hole, the connection area of ​​the cutting belt connecting the cutting frame and the workpiece is bent in a manner close to the chuck worktable, and the tension of the cutting belt is relaxed. In addition, in the case where the cutting frame is deformed or warped, the tension of the cutting belt is relaxed, the warping is corrected, and the cutting frame is closely attached to the chuck plate.

[0023] The invention described in Technical Solution 2 provides a workpiece holding device, characterized in that, in the structure described in Technical Solution 1, the opening of the adsorption hole is formed across from the loading area to the non-loading area, the loading area is the area of ​​the chuck plate where the cutting frame is loaded, and the non-loading area is closer to the inside than the loading area and does not load the cutting frame.

[0024] According to this structure, the opening of the adsorption hole is formed across from the loading area to the non-loading area, the loading area is the area of ​​the chuck plate where the cutting frame is loaded, and the non-loading area is closer to the inside than the loading area and does not load the cutting frame. Therefore, even if the cutting frame is loaded on the chuck plate, negative pressure can be stably supplied to the closed space in a wide range through the adsorption holes in the non-loading area.

[0025] The invention described in claim 3 provides a workpiece holding device, characterized in that, in the structure described in claim 1, the opening of the adsorption hole is formed in a mounting area of ​​the chuck plate on which the cutting frame is mounted.

[0026] According to this structure, when negative pressure is supplied to the enclosed space through the adsorption hole, the connection area of ​​the cutting belt connecting the cutting frame and the workpiece is bent in a manner close to the chuck worktable, thereby alleviating the tension of the cutting belt, thereby correcting the warping of the cutting piece, etc., and the cutting frame is tightly attached to the chuck plate.

[0027] The invention described in claim 4 provides a workpiece holding device, characterized in that, in the structure described in claim 1, a chuck support loader is further provided, which can press the cutting frame toward the chuck plate.

[0028] According to this configuration, the chuck support loader presses the cutting frame disposed on the chuck plate toward the chuck plate, and negative pressure is supplied while the cutting frame is in close contact with the chuck plate, so that the cutting frame can be more reliably sucked and held on the chuck plate.

[0029] The invention described in Technical Solution 5 provides a workpiece holding device, characterized in that in the structure described in Technical Solution 4, the chuck support loader presses the cutting frame toward the chuck plate when the cutting frame is in a non-holding state where the cutting frame is not held on the chuck plate, and releases the pressing of the cutting frame when the cutting frame is in a holding state where the cutting frame is held on the chuck plate.

[0030] According to this structure, during a period in which the cutting frame transported to the cutting board is in a non-held state where it is not attracted and held, the cutting frame is pressed toward the chuck plate by the chuck support loader. When the cutting frame is in the attracted and held state, the pressure on the cutting frame by the chuck support loader is released. Therefore, the cutting frame can be reliably held on the chuck plate before it is transported to the cutting board and is attracted and held on the cutting board.

[0031] The invention described in claim 6 provides a workpiece holding device, characterized in that, in the structure described in claim 1, the chuck plate is formed to cover the bottom surface of the storage portion.

[0032] According to this structure, because the chuck plate is formed as the state of the bottom surface of the covering receiving section, the chuck plate can be made to be close to the bottom surface of the receiving section and to be configured with a stable state. In addition, thus, the cutting plate that remains on the chuck plate also can be remained on the receiving section with a stable state by the chuck plate.

[0033] [Effects of the Invention]

[0034] According to the present invention, the suction hole for supplying negative pressure is connected to the closed space surrounded by the chuck table, the cutting frame and the cutting belt. Therefore, when negative pressure is supplied to the closed space through the suction hole, the connection area of ​​the cutting belt connecting the cutting frame and the workpiece is bent in a manner close to the chuck table, thereby relieving the tension of the cutting belt, thereby correcting the warping of the cutting frame, etc., and the cutting frame is closely attached to the chuck plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a perspective view schematically showing a general structure of a workpiece holding device according to an embodiment of the present invention.

[0036] Figure 2 This is a perspective view of the general appearance of a chuck table in the work holding device, showing a state where a chuck plate is arranged.

[0037] Figure 3 The drawings show a schematic structure of a chuck support loader in the workpiece holding device, (a) is a perspective view of the chuck support loader, and (b) is an enlarged cross-sectional view of (a) taken along a substantially AA line.

[0038] Figure 4 The figures are an example of the process flow of an operation process of grinding a workpiece using the workpiece holding device, (a) is a figure showing the state just after the workpiece unit with the workpiece mounted thereon is transported to the chuck table, (b) is a figure showing the state of the cutting frame of the workpiece unit being pressed toward the chuck plate, (c) is a figure showing the state of the workpiece unit with the workpiece mounted thereon being adsorbed and held on the chuck table, and (d) is a figure showing the state of grinding the workpiece adsorbed and held on the chuck table with a grinding wheel.

[0039] Figure 5 The figures illustrate the flexure stroke in the connection area of ​​the cutting belt when negative pressure is supplied from the suction port, (a) is a figure showing the state before the negative pressure is supplied, (b) is a figure showing the state just after the negative pressure is supplied, and (c) is a figure showing the state in which the connection area is fully attracted to maintain the workpiece unit at a specified position.

[0040] Figure 6 This is a perspective view showing a state in which a partially deformed chuck plate is arranged on the chuck table of the work holding device.

[0041] Figure 7 The figures illustrate the flexure stroke in the connection area of ​​the cutting belt when negative pressure is supplied from the suction port using the deformed chuck plate, (a) is a figure showing the state before the negative pressure is supplied, (b) is a figure showing the state just after the negative pressure is supplied, and (c) is a figure showing the state in which the connection area is fully attracted to maintain the workpiece unit at a specified position.

[0042] Figure 8 Yes means Figures 1 to 5 FIG. 1 is an enlarged cross-sectional view of a main part of a further modified example of the workpiece holding device shown.

[0043] Fig. 9 An example of a conventional work holding device is shown in a perspective view showing a schematic appearance of a chuck table in a state where a chuck plate is arranged.

[0044] Fig.10 is Fig. 9 The enlarged cross-sectional views of the main parts are shown in a state where a workpiece unit with a workpiece mounted thereon is sucked and held on a chuck table. (a) is a view before the problem is pointed out, and (b) is a view explaining the existing problem. DETAILED DESCRIPTION

[0045] In order to achieve the purpose of providing a workpiece holding device that can correct the deformation and warping of a cutting frame and can stably adsorb and hold the workpiece, the present invention is realized by the following configuration. A device for holding a workpiece attached to a cutting frame via a cutting tape, characterized in that it comprises: a chuck table, the chuck table having a chuck portion capable of adsorbing and holding the workpiece, and a storage portion recessed on the outer periphery of the chuck portion; and a chuck plate, the chuck plate having an adsorption hole opened on the top, arranged in the storage portion and capable of adsorbing and holding the cutting frame, the adsorption hole being connected to a closed space surrounded by the chuck table, the cutting frame and the cutting tape, and when negative pressure is supplied to the closed space, the connection area of ​​the cutting tape connecting the cutting frame and the workpiece is flexed in a manner close to the chuck table.

[0046] [Example]

[0047] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In addition, in the following embodiments, when referring to the number, value, amount, range, etc. of constituent elements, except for the cases specifically indicated and the cases clearly limited to a specific number in principle, it is not limited to the specific number and may be more or less than the specific number.

[0048] Furthermore, when referring to the shapes and positional relationships of components, shapes similar to or approximate to such shapes are substantially included, except for cases where such shapes are particularly noted or cases where it is obvious that such shapes are not so in principle.

[0049] In addition, the drawings may be exaggerated to make the features easier to understand, and the size ratios of the components may not be the same as the actual ones. In addition, in the cross-sectional drawings, the shadows of some components may be omitted to make the cross-sectional structure of the components easier to understand.

[0050] In addition, in the following description, the expressions indicating directions such as up and down or left and right are not absolute, and are appropriate in describing the postures of the various parts of the workpiece holding device of the present invention, but in the case of changes in the posture, they should be interpreted in accordance with the changes in the posture. In addition, in the description of the entire embodiment, the same elements are marked with the same symbols.

[0051] Figure 1 This is a three-dimensional diagram schematically showing the general structure of the workpiece holding device 10 of the present invention, and takes a case where a wafer W is used as a workpiece in the manufacturing process of a semiconductor device, and a grinding process is performed using the workpiece holding device 10 in order to thin the wafer W as an example. In addition, as a method for transporting and setting the wafer W, the following case is taken as an example. A workpiece unit 13 is prepared, in which a cutting tape 12 is pasted on a cutting frame 11 having an opening 11a in the center, and one surface of the wafer W can be pasted on the cutting tape 12 exposed from the opening of the cutting frame 11, and the wafer W is set on the workpiece unit 13, and is transported toward the chuck table 14 together with the workpiece unit 13.

[0052] The chuck table 14 includes: a chuck portion 15 having a holding surface 15a similar in shape to the wafer W and capable of holding the wafer W by negative pressure adsorption via the dicing tape 12; and a frame holding mechanism 17 having an annular storage portion 16 recessed in the outer periphery of the chuck portion 15. The chuck portion 15 is connected to a negative pressure supply mechanism (not shown) and can supply negative pressure to the holding surface 15a from the negative pressure supply mechanism. On the other hand, the uppermost portion of the frame holding mechanism 17 is formed at a height position lower than the holding surface 15a of the chuck portion 15. In addition, on the bottom surface 16a of the storage portion 16 of the frame holding mechanism 17, an annular chuck plate 18 having an outer periphery substantially equal to the outer inner periphery 16b of the storage portion 16 and an inner periphery substantially equal to the inner inner periphery 16c of the storage portion 16 is arranged.

[0053] Figure 2 This is a perspective view of the general appearance of the chuck table 14 showing the state in which the chuck plate 18 is configured. Figure 1 Add Figure 2 , further describing the structure of the chuck table 14 and the chuck plate 18. On the bottom surface 16a of the storage portion 16 of the chuck table 14, a plurality of adsorption holes 16d are formed in a dispersed manner along the circumferential direction of the storage portion 16, which are vertically penetrated. One end of the adsorption hole 16d is opened at the bottom surface 16a. On the other hand, the other end of the adsorption hole 16d is guided to the bottom of the chuck table 14, and is connected to a negative pressure supply mechanism (not shown), so that negative pressure can be supplied from the negative pressure supply mechanism to the storage portion 16.

[0054] The chuck plate 18 is substantially equal to the annular shape of the storage portion 16 of the chuck table 14, and is configured so that the bottom surface 18a is substantially in close contact with the bottom surface 16a, the outer peripheral surface 18b is in contact with the outer inner peripheral surface 16b, and the inner peripheral surface 18c is in contact with the inner inner peripheral surface. In addition, the chuck plate 18 is formed so that when the cutting frame 11 of the workpiece unit 13 is placed on the chuck plate 18, the upper surface 11b of the cutting frame 11 is located at a height position lower than the uppermost portion 17a of the frame holding mechanism 17. In addition, the chuck plate 18 is formed with a plurality of adsorption holes 18e penetrating the upper surface 18d and the lower surface 18a, respectively corresponding to the adsorption holes 16d formed on the bottom surface 16a of the storage portion 16. The chuck plate 18 is disposed in the storage portion 16 so that the suction holes 18 e correspond to the suction holes 16 d of the storage portion 16 in the up-down direction. Figure 1 and Figure 2 The suction holes 18 e and 16 d are formed in the placement region of the dicing frame 11 on which the chuck plate 18 is placed, that is, substantially directly below the dicing frame 11 .

[0055] The transport mechanism 19 includes a transport arm 20 and a gripping arm body 22 mounted on the transport arm 20 so as to be rotatable and movable in the vertical direction via a shaft body 21. The transport arm 20 moves the gripping arm body 22 from a predetermined position to a predetermined position, and the gripping arm body 22 grips the workpiece unit 13, and the workpiece unit 13 is reciprocatedly transported from the predetermined position to the chuck table 14 by the movement of the transport arm 20.

[0056] The grip arm body 22 includes a chuck support arm 23 disposed on the upper side so as to overlap in the vertical direction of the shaft body 21 with the shaft body 21 as the center, and a chuck support loader 24 disposed on the lower side of the chuck support arm 23 .

[0057] The chuck support loader 24 has an annular cushioning material 25 protruding toward the cutting frame 11 at the outer peripheral front end that can be opposite to the cutting frame 11. The cushioning material 25 can be horizontally moved in the up-down direction under the control of the lifting control mechanism 24a provided in the chuck support loader 24. By moving horizontally in the downward direction, the cutting frame 11 arranged on the chuck plate 18 in the storage part 16 can be pushed substantially parallel to the upper surface 18d of the chuck plate 18, so that the cutting frame 11 is closely attached to the chuck plate 18 and is held.

[0058] The chuck support arm 23 has four adsorption units 26 arranged concentrically at the front end of the outer circumference that can be opposite to the cutting frame 11. The adsorption units 26 are connected to a negative pressure supply mechanism (not shown) and adsorb the cutting frame 11 with the wafer W mounted thereon at a predetermined position with negative pressure. After the workpiece unit 13 is held and transported to the chuck table 14, the negative pressure is released and the workpiece unit 13 can be placed on the chuck table 14.

[0059] Figure 4 FIG. 2 is a schematic operation diagram showing an example of the operation sequence of the workpiece holding device 10 when the workpiece holding device 10 is used to perform grinding processing on the wafer W. Figure 5 This is a partially enlarged cross-sectional view illustrating that in a closed space 27 surrounded by the chuck table 14, the cutting frame 11 and the cutting tape 12, when negative pressure is supplied from the negative pressure supply mechanism through the adsorption holes 16d and the adsorption holes 18e, the connection area 12a of the cutting tape 12 connecting the cutting frame 11 and the wafer W is bent toward the cutting table 14 side to ease the tension of the cutting tape 12, and in the case where the cutting frame 11 is warped, the warping of the cutting frame 11 is corrected roughly flatly.

[0060] Combine the following Figure 4 and Figure 5 illustrate Figures 1 to 3 The action of the workpiece holding device 10 shown in FIG. Figure 1 As shown, a workpiece unit 13 is prepared in which the surface of the wafer W is attached to the dicing tape 12 and the back surface is arranged to face upward as the surface to be ground.

[0061] Then, if Figure 1 As shown by the arrow (A), at a predetermined position, the suction portion 26 of the holding arm 22 in the conveying mechanism 19 suctions and holds the dicing frame 11 in the work unit 13 on which the wafer W is mounted by negative pressure, thereby holding the work unit 13 .

[0062] Then, if Figure 1 As shown by the arrow (B), the transport mechanism 19 transports the workpiece unit 13 to the chuck table 14. Then, the wafer W is placed on the holding surface 15a of the chuck portion 15 via the dicing tape 12, and the dicing frame 11 is placed at a position corresponding to the chuck plate 18 in the storage portion 16. In addition, when the dicing frame 11 is placed on the chuck plate 18, the negative pressure supply to the adsorption portion 26 is stopped, and the adsorption and holding of the workpiece unit 13 by the adsorption portion 26 is released, so that the workpiece unit 13 is put into a non-holding state (see Figure 4 (a)). In addition, in this state, the cutting frame 11 is not closely arranged on the chuck plate 18.

[0063] Then, if Figure 4As shown in (b), the chuck support loader 24 in the holding arm body 22 is lowered onto the workpiece unit 13 together with the cushioning material 25. Then, the lifting control mechanism 24a is driven, and the cushioning material 25 abuts against the cutting frame 11, pressing the cut sheet 11 onto the chuck plate 18. When the cutting frame 11 is pressed onto the chuck plate 18, a closed space 27 surrounded by the chuck worktable 14, the cutting frame 11 and the cutting belt 12 is formed. In the closed space 27, the adsorption hole 18e connected to the negative pressure supply mechanism is connected to the adsorption hole 16d. Therefore, when the negative pressure supply mechanism is activated, the closed space 27 can be made negative pressure through the adsorption holes 16d and the adsorption holes 18e, and the holding surface 15a of the chuck part 15 can be made negative pressure.

[0064] When negative pressure is applied to the holding surface 15 a of the chuck unit 15 by the negative pressure supply mechanism, the wafer W is sucked and held on the holding surface 15 a via the dicing tape 12 .

[0065] On the other hand, on the storage portion 16 side, a negative pressure supply mechanism is used to gradually supply negative pressure into the enclosed space 27 through the suction holes 16d and suction holes 18e via the small gap between the lower surface 11c of the cutting frame 11 and the upper surface 18d of the chuck plate 18. In addition, as the enclosed space 27 becomes negative pressure, the negative pressure acts on the connection area 12a of the dicing tape 12 connecting the cutting frame 11 and the wafer W, causing the connection area 12a to bend inward (toward the upper surface 18d of the chuck plate 18), Figure 5 The force shown by arrow 30a in (b). Figure 4 (c) and Figure 5 As shown in (c), in conjunction with the negative pressure supply, the connection area 12a is attracted to the storage portion 16 side and flexed, and the tension acting on the cutting belt 12 in the radial direction is relaxed. Therefore, when the tension of the cutting belt 12 is too large relative to the rigidity of the cutting frame 11, and deformation or warping occurs on the cutting frame 11, the warping etc. generated on the cutting frame 11 is corrected, and the cutting frame 11 is adsorbed and held to be approximately parallel to the upper surface 18d of the chuck plate 18. In this case, in the workpiece holding device 10 of this embodiment, since the drainage hole provided in the previous device is not provided, the negative pressure control in the closed space 27 can be well performed, and the flexure of the connection area 12a, the correction of the warping etc. of the cutting frame 11, and the adsorption of the cutting frame 11 can be performed at the same time. In addition, when the cutting frame 11 is adsorbed and held on the upper surface 18d of the chuck plate 18, the cushion material 25 rises under the control of the lifting control mechanism 24a, leaves the cutting frame 11 and returns to a predetermined position.

[0066] In addition, when in the suction and holding state (adsorption and holding), even after the pressure of the cushioning material 25 in the chuck support loader 24 on the cutting frame 11 is released, the workpiece unit 13 can continue to be adsorbed and held on the chuck worktable 14, and the wafer W can be adsorbed and held on the holding surface 15a of the chuck part 15 through the cutting tape 12.

[0067] When the wafer W is held by suction on the holding surface 15a of the chuck portion 15, the holding arm 22 is returned to a predetermined position while the workpiece unit 13 is retained on the chuck table 14. Figure 1 The arrow (C) and Figure 4 As shown in (d), the grinding wheel 30 with the grinding wheel 31 mounted on the lower surface is sent to the holding surface 15a, and the rotating grinding wheel 31 is pressed against the back surface of the wafer W to perform grinding processing.

[0068] After the grinding process by the grinding wheel 31 is completed, the grinding wheel 30 returns to a predetermined position together with the grinding wheel 31. In addition, the negative pressure supply of the negative pressure supply mechanism is also stopped, the negative pressure of the chuck portion 15 toward the holding surface 15a disappears, and the negative pressure on the cutting frame 11 also disappears.

[0069] Next, the gripping arm 22 moves again onto the chuck table 14. The dicing frame 11 is then held by the suction unit 26, and the gripping arm 22 carries the ground wafer W to a predetermined position together with the workpiece unit 13. Thus, a series of grinding operations are completed.

[0070] Therefore, according to the workpiece holding device 10 of the present embodiment, the suction holes 18e of the chuck plate 18 (and the suction holes 16d of the storage portion 16) as openings are formed across the loading area of ​​the chuck plate 18 where the cutting frame 11 is loaded to the non-loading area which is inside the loading area and does not load the cutting frame 11. Thus, even if the cutting frame 11 is loaded on the chuck plate 18, negative pressure can be supplied to a large area of ​​the enclosed space through the suction holes 18e in the non-loading area, without reducing the close contact function.

[0071] In addition, since the opening of the adsorption hole 18e (adsorption hole 16d) is formed across the loading area of ​​the chuck plate 18 where the cutting frame 11 is loaded to the non-loading area which is inside the loading area and where the cutting frame 11 is not loaded, the negative pressure supply mechanism can smoothly supply negative pressure to the enclosed space 27.

[0072] In addition, since there is a chuck support loader 24, the chuck support loader 24 is provided with a cushioning material 25 capable of pressing the cutting frame 11 toward the chuck plate 18. The cutting frame 11 arranged on the chuck plate 18 is pressed toward the chuck plate 18 by the cushioning material 25 in the chuck support loader 24, and negative pressure can be supplied while the cutting frame 11 and the chuck plate 18 are tightly attached. Therefore, the cutting frame 11 can be reliably attracted and held relative to the chuck plate 18.

[0073] In addition, the chuck support loader 24 presses the cutting frame 11 toward the chuck plate 18 in a non-holding state where the cutting frame 11 is not held by the chuck plate 18, and releases the pressing of the cutting frame 11 in a holding state where the cutting frame 11 is held by the chuck plate 18. Therefore, the cutting frame 11 can be reliably held relative to the chuck plate 18 until the cutting frame 11 is transported onto the chuck plate 18 and is attracted and held.

[0074] In addition, in the present embodiment, a structure in which a plurality of adsorption holes 16d and a plurality of adsorption holes 18e are provided is disclosed, but it is sufficient to provide at least one adsorption hole 16d and at least one adsorption hole 18e.

[0075] Figure 6 and Figure 7 FIG. 2 shows a modified example of the workpiece holding device 10 of the present invention. Figure 1 to Figure 5 In the workpiece holding device 10 shown in FIG. 1 , a structure is disclosed in which the opening of the suction hole 18e (the suction hole 16d) is set at a position slightly deviated from the loading area of ​​the chuck plate 18 where the cutting frame 11 is loaded. In the structure of the workpiece holding device 10 of this modified example, the opening of the suction hole 18e connected to the suction hole 16d is set in the loading area of ​​the chuck plate 18 where the cutting frame 11 is loaded, and the other structures are the same as those of FIG. Figure 1 to Figure 5 Therefore, the same structural parts are marked with the same symbols and repeated description is omitted.

[0076] in addition, Figure 6 The chuck table 14 and the chuck plate 18 are shown in a three-dimensional view showing the general appearance of the chuck plate 18 in a state where the chuck plate 18 is arranged. Figure 7 Instructions for use Figure 6 The diagram shown is a diagram of the flexure stroke in the connection area of ​​the cutting belt when negative pressure is supplied to the chuck plate 18 from the adsorption hole 18e connected to the adsorption hole 16d, (a) is a diagram showing the state before the negative pressure is supplied, (b) is a diagram showing the state after the negative pressure is just started to be supplied, and (c) is a diagram showing the state in which the connection area is fully attracted to maintain the workpiece unit 13 in the specified position.

[0077] exist Figure 6 and Figure 7 In the embodiment, the structure of the chuck worktable 14 is Figure 2The chuck table 14 shown is substantially the same, and a plurality of suction holes 16d are formed on the bottom surface 16a of the storage portion 16 and are dispersedly formed along the circumference of the storage portion 16 so as to pass through the storage portion 16 from top to bottom. Figure 6 and Figure 7 In the embodiment, the opening of the adsorption hole 18 e communicating with the adsorption hole 16 d is provided in the placement region of the chuck plate 18 where the dicing frame 11 is placed.

[0078] Figure 6 and Figure 7 The chuck plate 18 shown is configured to be approximately equal to the annular shape of the storage portion 16 of the chuck table 14, and on the bottom surface 16a of the storage portion 16, the bottom surface 18a is approximately in close contact with the bottom surface 16a, and the outer peripheral surface 18b is in contact with the outer inner peripheral surface 16b, and the inner peripheral surface 18c is in contact with the inner inner peripheral surface. On the chuck plate 18, a plurality of adsorption holes 18e penetrating the upper surface 18d and the lower surface 18a are formed corresponding to the adsorption holes 16d provided on the bottom surface 16a of the storage portion 16, and negative pressure supply grooves 18f respectively connected to the adsorption holes 18e are provided on the upper surface 18d of the chuck plate 18. The negative pressure supply grooves 18f are open on the upper surface 18d of the chuck plate 18, and are formed on the outer peripheral surface of the chuck plate 18 from the adsorption holes 18e to the inner peripheral surface 16c of the storage portion 16. That is, the negative pressure supply groove 18f extended from the opening of the adsorption hole 18e is formed as an opening extended from the opening of the adsorption hole 18e, spanning from the loading area of ​​the chuck plate 18 on which the cutting frame 11 is loaded to the non-loading area which is closer to the inner side of the loading area and on which the cutting frame is not loaded.

[0079] Then, if you follow Figure 7 The order of (a) to (c) is explained Figure 6 and Figure 7 The movement of the chuck plate 18 shown in FIG. 1A and FIG. 1B are used to move the workpiece unit 13 on which the wafer W is mounted. Figure 1 to Figure 5 The workpiece holding device 10 shown in the figure is similarly held by the suction portion 26 of the holding arm body 22 and is transported to the chuck table 14. Then, the wafer W is placed on the holding surface 15a of the chuck portion 15 via the dicing tape 12, and the dicing frame 11 is placed on the chuck plate 18 in the storage portion 16. In addition, the chuck support loader 24 of the holding arm body 22 is lowered onto the workpiece unit 13 together with the cushion material 25, as shown in FIG. Figure 7As shown in (a), the cushioning material 25 presses the cutting frame 11 onto the chuck plate 18. In addition, when the cutting frame 11 is pressed onto the chuck plate 18, a closed space 27 surrounded by the chuck table 14, the cutting frame 11, and the cutting belt 12 is formed. In the closed space 27, the adsorption hole 18e, the adsorption hole 16d, and the negative pressure supply groove 18f connected to the negative pressure supply mechanism are connected. Therefore, when the negative pressure supply mechanism is activated, the closed space 27 can be negatively pressurized through the adsorption hole 16d, the adsorption hole 18e, and the negative pressure supply groove 18f, and the holding surface 15a of the chuck portion 15 can be negatively pressurized.

[0080] When negative pressure is applied to the holding surface 15 a of the chuck unit 15 by the negative pressure supply mechanism, the wafer W is sucked and held on the holding surface 15 a via the dicing tape 12 .

[0081] On the other hand, on the side of the storage portion 16, when negative pressure is supplied to the enclosed space 27 through the suction holes 16d, the suction holes 18e, and the negative pressure supply grooves 18f by the negative pressure supply mechanism, the negative pressure has the effect of bending the connection area 12a of the dicing tape 12 connecting the dicing frame 11 and the wafer W inward (toward the upper surface 18d of the dicing plate 18). Figure 7 The force shown by arrow 30a in (b). Figure 7 As shown in (c), in conjunction with the negative pressure supply, the connection area 12a is attracted to the storage portion 16 side and flexed, and the tension acting on the cutting belt 12 in the radial direction is relieved. In addition, when the tension of the cutting belt 12 is too large relative to the rigidity of the cutting frame 11, and deformation or warping occurs on the cutting frame 11, the warping etc. generated on the cutting frame 11 is corrected, and the cutting frame 11 is adsorbed and held to be roughly parallel to the upper surface 18d of the chuck plate 18. In this case, in the workpiece holding device 10 of this embodiment, since there is no drainage hole provided in the previous device, the negative pressure control in the closed space 27 can be well performed, and the deflection of the connection area 12a and the warping etc. of the cutting frame 11 can be corrected and the cutting frame 11 can be adsorbed.

[0082] Therefore, in the workpiece holding device 10 shown as this modified example, since the negative pressure supply groove 18f connected to the opening of the adsorption hole 18e, that is, the negative pressure supply groove 18f serving as the opening of the adsorption hole 18e, is formed across the loading area of ​​the chuck plate 18 on which the cutting frame 11 is loaded to the non-loading area which is closer to the inside of the loading area and on which the cutting frame 11 is not loaded, even if the cutting frame 11 is loaded on the chuck plate 18, negative pressure can be supplied to a large area of ​​the enclosed space 27 through the negative pressure supply groove 18f serving as the opening of the adsorption hole 16d and the adsorption hole 18e in the non-loading area.

[0083] In addition, in this modified example, a structure is disclosed in which a plurality of adsorption holes 16d and adsorption holes 18e are respectively provided, and a plurality of negative pressure supply grooves 18f connected to the adsorption holes 18e are provided on the chuck plate 18, but at least one adsorption hole 16d, adsorption hole 18e and negative pressure supply groove 18f only needs to be provided.

[0084] In addition, if Figure 8 As shown, two adsorption holes 18e may be provided in a radial direction of the chuck plate 18 so as to be separated from each other, and the opening of one adsorption hole 18e may be provided in the loading area of ​​the chuck plate 18 where the cutting frame 11 is loaded, and the opening of the other adsorption hole 18e may be provided in a non-loading area which is inside the loading area of ​​the chuck plate 18 and where the cutting frame 11 is not loaded. Thus, even if the cutting frame 11 is loaded on the chuck plate 18, negative pressure can be stably supplied to the enclosed space 27 from the opening of the adsorption hole 18e provided in the non-loading area.

[0085] In addition, the present invention can be modified in various ways without departing from the spirit of the present invention, and the present invention will naturally cover such modifications.

[0086] [Explanation of symbols]

[0087] 10: Workpiece holding device

[0088] 11: Cutting the frame

[0089] 12: Cutting tape

[0090] 12a: Connection area

[0091] 13: Work Unit

[0092] 14: Chuck workbench

[0093] 15: Chuck unit

[0094] 15a: Keep the face

[0095] 16: Storage Department

[0096] 16d: Adsorption hole

[0097] 17: Frame holding mechanism

[0098] 18: Chuck plate

[0099] 18e: Adsorption hole

[0100] 18f: Negative pressure supply tank

[0101] 24: Chuck support loader

[0102] 24a: Lifting control mechanism

[0103] 25: Padding material

[0104] 27: Confined space.

Claims

1. A device for holding a workpiece attached to a cutting frame via a cutting tape, characterized in that: have: A chuck table having a chuck portion capable of sucking and holding the workpiece and a receiving portion recessed in an outer periphery of the chuck portion; and a chuck plate having an adsorption hole opened on the upper surface, arranged in the storage portion and capable of adsorbing and holding the cutting frame, The adsorption hole is connected to a closed space surrounded by the chuck worktable, the cutting frame and the cutting belt. When negative pressure is supplied to the closed space, the connection area of ​​the cutting belt connecting the cutting frame and the workpiece is bent in a manner close to the chuck worktable.

2. The workpiece holding device according to claim 1, characterized in that: The opening of the adsorption hole is formed to span from a loading area, which is an area of ​​the chuck plate where the cutting frame is loaded, to a non-loading area, which is located inside the loading area and where the cutting frame is not loaded.

3. The workpiece holding device according to claim 1, characterized in that: The opening of the adsorption hole is formed in a placement area of ​​the chuck plate where the cutting frame is placed.

4. The workpiece holding device according to claim 1, characterized in that: A chuck support loader is further provided, the chuck support loader being capable of pressing the cutting frame toward the chuck plate.

5. The workpiece holding device according to claim 4, characterized in that: The chuck support loader presses the cutting frame toward the chuck plate in a non-holding state where the cutting frame is not held on the chuck plate, and releases the pressing of the cutting frame in a holding state where the cutting frame is held on the chuck plate.

6. The workpiece holding device according to claim 1, characterized in that: The chuck plate is formed to cover a bottom surface of the storage portion.

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