Radiator for electric load device, manufacturing method thereof and electronic equipment

Abstract

A heat sink for an electrical load device, a manufacturing method thereof and an electronic device wherein the heat sink comprises: a heat dissipation housing having a main body portion and at least one heat dissipation portion protruding outward from a first side of the main body portion, the main body portion defining an evaporation cavity, each heat dissipation portion defining a condensation cavity, the condensation cavities are communicated with the evaporation cavity, the evaporation cavity is provided with an opening in the second side of the main body part, and the first side is opposite to the second side; the cover part is used for sealing the opening, and the cover part is thermally coupled with an electric load device; and the condensation cavity and / or the evaporation cavity are / is filled with a phase change working medium. By adopting the radiator of the technical scheme, the production cost can be reduced, and the radiating effect can be enhanced.

Description

Technical Field

[0001] The present invention relates to the technical field of electric load devices, and in particular to a heat sink for electric load devices, a manufacturing method thereof, and electronic equipment. Background Art

[0002] In electrical load devices, such as LED (Light Emitting Diode), IGBT (Insulated Gate Bipolar Transistor), MOS (Metal-Oxide-Semiconductor), etc., high heat generation is a problem that cannot be ignored. These devices generate a lot of heat during operation. If the heat is not dissipated in time, it will seriously affect the service life of the electrical load device and even cause damage to the device. Therefore, the heat dissipation problem has become one of the key factors restricting the performance improvement and wide application of electrical load devices.

[0003] At present, the heat sinks used for electrical load devices are mainly metal heat sinks, such as fin heat sinks. These heat sinks are usually made of solid aluminum, aluminum alloy or other metal materials. The heat of the heat source device is transferred to the heat dissipation surface of the heat sink by using the thermal conductivity of the metal, and then the heat is dissipated into the air through air convection (natural convection or forced convection). Although this heat dissipation method solves the heat dissipation problem of electrical load devices to a certain extent, it still has some obvious shortcomings.

[0004] First, metal heat sinks are heavy and consume a lot of materials, which not only increases the manufacturing cost of the product, but also limits its application in certain fields. Secondly, in order to pursue a larger heat dissipation area to improve the heat dissipation effect, the size of the heat sink will often increase accordingly, but due to the thermal conductivity of metal materials (the thermal conductivity of existing metal materials used to manufacture heat sinks is generally below 300W / (m·K)), increasing the size of the heat sink does not bring about a significant improvement in the heat dissipation effect.

[0005] In addition, the manufacturing process of metal heat sinks is relatively complicated and requires multiple processing and assembly steps, which not only increases production costs but also prolongs the production cycle. Summary of the invention

[0006] The technical problem solved by the present invention is to provide a radiator for electric load devices with lower production cost and better heat dissipation effect, a manufacturing method thereof and an electronic device.

[0007] To solve the above technical problems, an embodiment of the present invention provides a heat sink for an electric load device, comprising: a heat dissipation shell, the heat dissipation shell having a main body and at least one heat dissipation portion protruding outward from a first side of the main body, the main body defining an evaporation chamber, each of the heat dissipation portions defining a condensation chamber, each of the condensation chambers being connected to the evaporation chamber, the evaporation chamber having an opening on a second side of the main body, the first side and the second side being opposite to each other; a cover portion, sealing the opening, the cover portion being thermally coupled to an electric load device; wherein the condensation chamber and / or the evaporation chamber is filled with a phase change working fluid.

[0008] Optionally, the main body and the heat dissipation portion are integrally formed.

[0009] Optionally, the main body and the heat dissipation portion are formed synchronously or step by step through a stamping process.

[0010] Optionally, each of the heat dissipation parts has a smooth outer wall.

[0011] Optionally, there are multiple heat dissipation parts, and a non-zero gap exists between two adjacent heat dissipation parts among the multiple heat dissipation parts.

[0012] Optionally, there are multiple heat dissipation parts, and the multiple heat dissipation parts include: a first heat dissipation part, extending from the first side of the main body toward a direction away from the second side; and multiple second heat dissipation parts, radially distributed and connected to the periphery of the first heat dissipation part, and the condensation chambers defined by the multiple second heat dissipation parts are respectively connected to the condensation chambers defined by the first heat dissipation part.

[0013] Optionally, there are multiple heat dissipation parts, and the multiple heat dissipation parts are centrally symmetrically arranged or axisymmetrically arranged.

[0014] Optionally, the cover portion has a recessed portion recessed toward the main body portion, and the recessed portion is suitable for receiving at least a portion of the electric load device.

[0015] Optionally, a receiving cavity is formed between at least a portion of the side wall of the cover forming the recess and the side wall of the main body forming the evaporation cavity, and the receiving cavity surrounds the recess and serves as a part of the evaporation cavity.

[0016] Optionally, the cover portion includes a plate portion and a first flange extending from an outer edge of the plate portion toward a first direction, and the heat dissipation shell includes a first extension wall extending from a plane where the plate portion is located toward the first direction, at least a portion of the first flange and at least a portion of the first extension wall are seamlessly fitted together, and the first direction is the same as the direction in which the first side points to the second side.

[0017] Optionally, the cover portion also includes: a second flange, which is formed by folding from the side of the first flange away from the plate portion in the opposite direction of the first direction, the first extension wall is clamped between the first flange and the second flange, and the first flange, the first extension wall and the second flange are seamlessly fitted in sequence.

[0018] Optionally, the cover portion further includes: a second flange, formed by folding from a side of the first flange away from the plate portion in a direction opposite to the first direction; a third flange, formed by folding from a side of the second flange away from the first flange in a direction opposite to the first direction; the heat dissipation shell further includes: a second extension wall, formed by folding from a side of the first extension wall away from the plane where the plate portion is located in a direction toward the first direction; wherein the third flange is clamped between the first extension wall and the second extension wall, the second extension wall is clamped between the second flange and the third flange, and the first flange, the first extension wall, the third flange, the second extension wall and the second flange are seamlessly fitted in sequence.

[0019] Optionally, a capillary structure is provided on the inner wall of the heat dissipation housing, and the liquid phase-change medium flows back from the condensation chamber to the evaporation chamber under the action of the capillary structure.

[0020] To solve the above technical problems, an embodiment of the present invention further provides a method for manufacturing a heat sink for an electrical load device, comprising: forming a heat dissipation shell, the heat dissipation shell having a main body and at least one heat dissipation portion protruding outward from a first side of the main body, the main body defining an evaporation chamber, each of the heat dissipation portions defining a condensation chamber, each of the evaporation chambers being connected to the condensation chamber, the evaporation chamber having an opening on a second side of the main body, the first side and the second side being opposite; filling a phase change working medium in the condensation chamber and / or the evaporation chamber; and sealing the opening with a cover.

[0021] Optionally, filling the phase change working medium in the condensation chamber and / or the evaporation chamber is performed under a vacuum environment.

[0022] Optionally, before filling the condensation chamber and / or the evaporation chamber with the phase change working medium, the method further includes: evacuating the condensation chamber and the evaporation chamber.

[0023] Optionally, forming the heat dissipation housing includes: providing a profile; and stamping the profile to form the main body and the heat dissipation portion.

[0024] Optionally, stamping the profile includes: performing a first step of stamping the profile to form a columnar middle structure with an opening; and performing a second step of stamping the bottom surface of the columnar middle structure to form the heat dissipation portion.

[0025] Optionally, using a cover to seal the opening includes: providing the cover, the cover including a plate portion and a first flange extending from an outer edge of the plate portion in a first direction, the heat dissipation shell including a first extension wall extending from a plane where the plate portion is located in the first direction, at least a portion of the first flange and at least a portion of the first extension wall are seamlessly fitted together, and the first direction is the same as the direction in which the first side points to the second side; forming a second flange, the second flange is formed by folding from a side of the first flange away from the plate portion in a direction opposite to the first direction, the first extension wall is clamped between the first flange and the second flange, and the first flange, the first extension wall and the second flange are seamlessly fitted together in sequence.

[0026] Optionally, the method further includes: simultaneously applying relative pressing forces to the first flange and the second flange so that the first flange, the first extension wall and the second flange are seamlessly fitted in sequence.

[0027] Optionally, the use of a cover to seal the opening includes: providing the cover, the cover including a plate and a first flange extending from an outer edge of the plate toward a first direction, the heat dissipation shell including a first extension wall extending from a plane where the plate is located toward the first direction, at least a portion of the first flange and at least a portion of the first extension wall being seamlessly fitted together, and the first direction is in the same direction as the direction in which the first side points to the second side; forming a second flange, the second flange being formed by folding from a side of the first flange away from the plate toward a direction opposite to the first direction; forming a second extension wall, the second extension wall being formed by folding from a side of the first extension wall away from the plane where the plate is located toward the first direction, the second extension wall being fitted together with the second flange; forming a third flange, the third flange being formed by folding from a side of the second flange away from the first flange toward the first direction, the third flange being clamped between the first extension wall and the second extension wall, the second extension wall being clamped between the second flange and the third flange, the first flange, the first extension wall, the third flange, the second extension wall and the second flange being seamlessly fitted together in sequence.

[0028] Optionally, the method further includes: simultaneously applying relative pressing forces to the first flange and the second flange so that the first flange, the first extension wall, the third flange, the second extension wall and the second flange are seamlessly fitted in sequence.

[0029] Optionally, a capillary structure is provided on the inner wall of the heat dissipation housing, and the liquid phase-change medium flows back from the condensation chamber to the evaporation chamber under the action of the capillary structure.

[0030] Optionally, the electrical load device is an LED lamp or a power semiconductor device.

[0031] In order to solve the above technical problem, an embodiment of the present invention further provides an electronic device, comprising: an electric load device; and the above heat sink.

[0032] Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

[0033] To solve the above technical problems, an embodiment of the present invention provides a heat sink for an electric load device, comprising: a heat dissipation shell, the heat dissipation shell having a main body and at least one heat dissipation portion protruding outward from a first side of the main body, the main body defining an evaporation chamber, each of the heat dissipation portions defining a condensation chamber, each of the condensation chambers being connected to the evaporation chamber, the evaporation chamber having an opening on a second side of the main body, the first side and the second side being opposite to each other; a cover portion, sealing the opening, the cover portion being thermally coupled to an electric load device; wherein the condensation chamber and / or the evaporation chamber is filled with a phase change working fluid.

[0034] A heat sink for an electric load device using the technical solution of the present application includes a heat sink shell and a cover. The heat sink shell has a main body and a heat sink. The heat sink is connected to the main body to form a condensation chamber and an evaporation chamber. The condensation chamber and / or the evaporation chamber is filled with a phase change medium, and efficient heat dissipation is achieved by utilizing the physical properties of the phase change medium. Specifically, when the electric load device generates heat, the phase change medium in the evaporation chamber is heated to vaporize (or evaporate) and absorb heat, taking the heat away; then the gaseous phase change medium flows to the condensation chamber, exchanges heat with the external air through the heat sink, condenses into a liquid and flows back to the evaporation chamber, forming a circulating heat dissipation. This heat dissipation method is not only efficient, but also stable and reliable.

[0035] Furthermore, the main body and the heat dissipation part are formed synchronously or step by step through a stamping process. This integrated design simplifies the production process and reduces the use of complex processes such as welding, thereby reducing production costs. At the same time, the integrated design also enhances the overall structural strength of the radiator and improves the reliability and durability of the product. In addition, the stamping process can not only realize the integrated forming of the main body and the heat dissipation part, but also provide more optional space for the shape of the heat dissipation shell. By adjusting the shape and size of the stamping die, radiators of different shapes and sizes can be easily produced to meet the heat dissipation requirements of different electrical load devices.

[0036] Furthermore, the number, shape and arrangement of the heat dissipation parts can be flexibly designed according to actual needs. For example, the heat dissipation parts can be in a variety of shapes such as straight lines, arcs, dots, rings, etc., and can also be arranged in a central symmetric or axisymmetric manner. This diversified design not only improves the heat dissipation efficiency of the radiator, but also increases the aesthetics and practicality of the product.

[0037] Furthermore, the connection between the heat dissipation housing and the cover can be closed by physically curling the first flange and the first extension wall, without introducing additional materials or structures. This connection method simplifies the production process, reduces production costs, and ensures the overall structural strength of the heat sink. In addition, by applying relative pressing forces to the first flange and the second flange at the same time, the sealing and stability of the connection can be further enhanced.

[0038] To solve the above technical problems, an embodiment of the present invention also provides a method for manufacturing a heat sink for an electrical load device, comprising: forming a heat dissipation shell, the heat dissipation shell having a main body and at least one heat dissipation portion protruding outward from a first side of the main body, the main body defining an evaporation chamber, each of the heat dissipation portions defining a condensation chamber, each of the condensation chambers being connected to the evaporation chamber, the evaporation chamber having an opening on a second side of the main body, the first side and the second side being opposite; filling a phase change working medium in the condensation chamber and / or the evaporation chamber; and sealing the opening with a cover.

[0039] The technical solution of the present application is adopted, and the manufacturing method includes the steps of forming a heat dissipation shell, filling a phase change medium, and sealing an opening with a cover. Among them, filling the phase change medium can be carried out in a vacuum environment to reduce the influence of air on the heat dissipation effect; at the same time, the heat dissipation efficiency of the radiator can be further improved by vacuuming. In addition, the heat dissipation shell and the heat dissipation part are formed by a stamping process, and the connection between the heat dissipation shell and the cover is achieved by physical curling, which simplifies the production process and reduces the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 is a schematic diagram of a heat sink for an electric load device according to an embodiment of the present invention;

[0041] Figure 2 yes Figure 1 A cross-sectional view of the structure shown along the AA perspective;

[0042] Figure 3 yes Figure 1 A schematic diagram of another specific implementation of the heat sink shown;

[0043] Figure 4 yes Figure 1 A schematic diagram of another specific implementation of the heat sink shown;

[0044] Figure 5 yes Figure 1 A schematic diagram of another specific implementation of the heat sink shown;

[0045] Figure 6 yes Figure 1 A schematic diagram of another specific implementation of the heat sink shown;

[0046] Figure 7 yes Figure 2 A schematic diagram of a connection method between the heat dissipation housing and the cover in the middle area B;

[0047] Figure 8 yes Figure 7 A schematic diagram of a variation of the structure shown;

[0048] Fig. 9 The present invention is a flowchart of a method for manufacturing a heat sink for an electric load device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0049] As mentioned in the background art, the existing heat sinks for electrical load devices have complex structures, complicated manufacturing processes, high production costs and insufficient heat dissipation efficiency.

[0050] To solve the problems of the prior art, an embodiment of the present invention provides a heat sink for an electric load device, a manufacturing method thereof, and an electronic device, wherein the heat sink for an electric load device comprises: a heat dissipation shell, the heat dissipation shell having a main body and at least one heat dissipation portion protruding outward from a first side of the main body, the main body defining an evaporation chamber, each of the heat dissipation portions defining a condensation chamber, each of the condensation chambers being connected to the evaporation chamber, the evaporation chamber having an opening on a second side of the main body, the first side and the second side being opposite; a cover portion, sealing the opening, the cover portion being thermally coupled to an electric load device; wherein the condensation chamber and / or the evaporation chamber is filled with a phase change working fluid.

[0051] A heat sink for an electric load device using the technical solution of the present application includes a heat sink shell and a cover. The heat sink shell has a main body and a heat sink. The heat sink is connected to the main body to form a condensation chamber and an evaporation chamber. The condensation chamber and / or the evaporation chamber is filled with a phase change medium, and efficient heat dissipation is achieved by utilizing the physical properties of the phase change medium. Specifically, when the electric load device generates heat, the phase change medium in the evaporation chamber is heated to vaporize (or evaporate) and absorb heat, taking the heat away; then the gaseous phase change medium flows to the condensation chamber, exchanges heat with the external air through the heat sink, condenses into a liquid and flows back to the evaporation chamber, forming a circulating heat dissipation. This heat dissipation method is not only efficient, but also stable and reliable.

[0052] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0053] Figure 1 is a schematic diagram of a heat sink 100 for an electric load device according to an embodiment of the present invention. Figure 2 yes Figure 1 The structure shown is a cross-sectional view along the AA perspective.

[0054] refer to Figure 1 and Figure 2 The heat sink 100 for an electric load device comprises: a heat dissipation housing 1, the heat dissipation housing 1 having a main body 11 and at least one heat dissipation portion 12 protruding outward from a first side 111 of the main body 11, the main body 11 defining an evaporation chamber 101, each of the heat dissipation portions 12 defining a condensation chamber 102, each of the condensation chambers 102 being connected to the evaporation chamber 101, the evaporation chamber 101 having an opening on a second side 112 of the main body 11, the first side 111 and the second side 112 being opposite to each other; a cover 2, sealing the opening, the cover 2 being thermally coupled to an electric load device; wherein the condensation chamber 102 and / or the evaporation chamber 101 are filled with a phase change medium.

[0055] The electrical load device refers to a component or device used to consume or absorb electrical energy in a circuit. These devices may have different characteristics and functions depending on the application requirements.

[0056] In an optional embodiment, the electric load device is an LED lamp or a power semiconductor device. Further, the power semiconductor device may include an insulated gate bipolar transistor (IGBT) or a power metal oxide semiconductor field effect transistor (power MOS tube).

[0057] Specifically, the main body 11 has a first side 111 and a second side 112 opposite to each other, wherein the second side 112 is closer to a heat source than the first side 111, and the heat source is also an electric load device to be dissipated (not shown in the figure). In other words, in a specific application scenario, the heat generated by the electric load device is transferred to the second side 112 of the main body 11 by heat conduction.

[0058] Furthermore, the cover portion 2 is disposed on the second side 112 of the main body portion 11 and is thermally coupled to the electric load device.

[0059] Furthermore, the heat dissipation housing 1 is indirectly thermally coupled to the electric load device through the cover 2 .

[0060] Furthermore, the main body 11 defines an evaporation chamber 101, and the at least one heat dissipation portion 12 disposed on the first side 111 of the main body 11 defines a condensation chamber 102. In other words, the evaporation chamber 101 is closer to the heat source than the condensation chamber 102.

[0061] Furthermore, the phase-change working medium can at least change between a gas state and a liquid state within a phase-change temperature range, and flow back and forth between the evaporation chamber 101 and the condensation chamber 102 .

[0062] In a specific application scenario, the initial state of the phase change medium can be, for example, liquid, and the liquid phase change medium is contained in the evaporation chamber 101 and is closer to the second side 112 than the first side 111. The electric load device as a heat source transfers heat to the phase change medium by heat transfer, causing the temperature of the phase change medium to rise and gradually vaporize (or evaporate), and absorb heat in the process. The gaseous phase change medium diffuses from the evaporation chamber 101 in the opposite direction of the first direction D1 to at least one condensation chamber 102 (such as Figure 2 The first direction D1 is the same as the direction from the first side 111 to the second side 112.

[0063] Furthermore, since it is far away from the heat source, the temperature in the condensation chamber 102 is lower than the temperature in the evaporation chamber 101, and the heat carried by the gaseous phase change medium is dissipated in the condensation chamber 102, and the temperature gradually decreases until it is recondensed (or liquefied) into a liquid phase change medium. Furthermore, the liquid phase change medium flows back to the evaporation chamber 101 (such as Figure 2 Thus, in the phase change process of the cycle, the phase change medium continuously carries the heat of the heat source to the condensation chamber and then transfers it to the external environment through the heat dissipation part 12.

[0064] In some embodiments, the phase change working fluid may be alcohol substances such as ethanol, methanol, and related mixtures, or the type of the phase change working fluid may be determined according to a specific application scenario.

[0065] Furthermore, the boiling point of the phase-change working fluid should be lower than the maximum temperature threshold at which the electric load device can operate stably, so as to ensure that the temperature of the electric load device is always kept below the maximum temperature threshold.

[0066] In some embodiments, the evaporation chamber 101 and the condensation chamber 102 may both be vacuum chambers before being filled with the phase-change working medium, thereby preventing mixed air and other substances from affecting the normal operation of the phase-change working medium.

[0067] In some embodiments, the heat dissipation housing 1 and the cover 2 may be made of materials with high thermal conductivity, such as aluminum alloy, stainless steel, copper and copper alloy, to ensure the heat dissipation efficiency of the heat sink 100 .

[0068] Continue to refer Figure 1 and Figure 2In some embodiments, the main body 11 and the heat dissipation part 12 are integrally formed. That is, the entire heat dissipation housing 1 is integrally formed. Therefore, the integrally formed main body 11 and the heat dissipation part 12 can make the heat dissipation housing 1 have a higher structural strength. In addition, the integrally formed main body 11 and the heat dissipation part 12 are easier to manufacture, and the production of the entire heat dissipation housing 1 can be completed through fewer manufacturing steps. Therefore, the manufacturing cost can be reduced and the production efficiency can be improved.

[0069] In some embodiments, the main body 11 and the heat dissipation part 12 are formed synchronously or step by step by a stamping process. The stamping process is a commonly used metal processing method, which uses a mold on a press to apply an external force to a metal sheet to cause it to undergo plastic deformation, thereby obtaining a part of a desired shape and size.

[0070] In a typical application scenario, a mold of a specific shape can be selected according to actual production requirements, and the main body 11 and the heat dissipation portion 12 can be stamped and formed simultaneously by the mold. In this way, the process steps can be simplified and the production efficiency of the heat dissipation housing 1 can be improved.

[0071] In another typical application scenario, the main body 11 may be first formed by stamping with one die, and then the heat dissipation portion 12 may be formed by stamping with another die. Thus, stamping the heat dissipation housing 1 step by step can improve the yield rate and reduce the risk of profile breakage during the stamping process.

[0072] In other embodiments, the heat dissipation housing 1 may also be integrally formed by vacuum forming, hot pressing or injection molding.

[0073] In some embodiments, each of the heat dissipation parts 12 has a smooth outer wall. The heat dissipation part 12 having a smooth outer wall means that the outer wall of the heat sink 12 is no longer provided with other heat dissipation structures (such as fins), and the outer wall of the heat dissipation part 12 directly exchanges heat with the external environment. As a result, the smooth outer wall of the heat dissipation part 12 directly exchanges heat with the external environment instead of dissipating heat through heat dissipation structures such as fins, which reduces the occupation of the heat sink 100 in three-dimensional space and avoids the increase in the overall size of the heat sink 100 due to heat dissipation structures such as fins. In addition, there is no need to provide heat dissipation mechanisms such as fins, which is also conducive to reducing costs.

[0074] Furthermore, the heat dissipation portion 12 has a smooth outer wall, so that each heat dissipation portion 12 forms a convex polyhedron (or called an Euler polyhedron). Such a structure allows the heat dissipation portion 12 to be formed by simple processing methods such as stamping, which is conducive to further reducing costs.

[0075] Furthermore, heat dissipation structures such as fins will also limit the number and layout of the heat dissipation parts 12, affecting the heat dissipation effect. Therefore, each heat dissipation part 12 has a smooth outer wall, which can form more heat dissipation parts 12 on the heat dissipation housing 1, thereby achieving a better heat dissipation effect.

[0076] Furthermore, in a heat sink provided with a heat dissipation structure such as fins, the manufacture and installation of the heat dissipation structure such as fins usually require additional process steps, such as cutting, welding or riveting, etc. These steps not only increase the processing time and cost, but may also introduce potential failure points. In comparison, the heat dissipation portion 12 having a smooth outer wall simplifies the manufacturing process of the heat sink 100, reduces the processing steps and required equipment, and thus reduces the production cost. In addition, the heat sink 100 without a heat dissipation structure such as fins is also simpler in subsequent surface treatment (such as spraying, electroplating, etc.), further reducing the processing cost.

[0077] refer to Figure 1 , Figures 3 to 6 In some embodiments, along a plane perpendicular to the direction from the first side 111 to the second side 112 (i.e., the first direction D1), the cross-section of the main body 11 is one of a circle, an ellipse, a rectangle, and a polygon. In other words, the cross-section is perpendicular to the first direction D1.

[0078] In some embodiments, the cross-sectional shape of the main body 11 is adapted to the electric load device. Thus, the shape and size of the main body 11 can be customized according to the specific shape, size and heat dissipation requirements of the electric load device to ensure a close fit between the heat sink 100 and the electric load device, thereby improving heat dissipation efficiency and reducing thermal resistance. At the same time, the cross-sectional shape of the main body 11 is adapted to the electric load device and can also help optimize the overall appearance and installation convenience of the electric load device.

[0079] Continue to refer Figure 1 , Figures 3 to 6 The number of the heat dissipation parts 12 is multiple. The multiple heat dissipation parts 12 are dispersedly arranged on the first side of the main body 11. In this way, the area of ​​the heat sink 100 can be increased and the heat dissipation efficiency can be improved.

[0080] In some embodiments, along a plane perpendicular to a direction from the first side 111 to the second side 112 (ie, the first direction D1 ), a cross-sectional shape of at least one of the plurality of heat dissipation portions 12 extends in a straight line.

[0081] In a specific implementation, refer to Figure 3, along a plane perpendicular to the first direction D1, the cross section of each of the plurality of heat dissipation portions 12 can extend in a straight line. Thus, the difficulty of processing can be simplified. For example, in the scheme of manufacturing the heat dissipation housing 1 by a stamping process, the structure of the mold can be simplified, thereby indirectly controlling the production cost of the heat sink 100.

[0082] Furthermore, the extension directions of the plurality of heat dissipation parts 12 can be parallel to each other and extend from one side to the other side of the main body 11 along the extension direction. Thus, the space utilization rate can be improved, the number of heat dissipation parts 12 can be increased in a limited space, and the heat dissipation effect can be further improved and optimized.

[0083] In some embodiments, along a plane perpendicular to the first direction D1 , a cross-section of at least one of the plurality of heat dissipation portions 12 extends in an arc shape.

[0084] In a specific implementation, refer to Figure 4 , along a plane perpendicular to the first direction D1, the cross section of each heat dissipation portion 12 in the plurality of heat dissipation portions 12 may extend in an arc shape. Thus, the heat dissipation portion 12 extending in an arc shape may provide a larger heat dissipation area to improve heat exchange efficiency.

[0085] exist Figure 4 In the heat sink 100 shown, at least two of the plurality of heat dissipation portions 12 are arranged around the first side 111 of the main body 11 from the outer edge, and the remaining heat dissipation portions 12 can be arranged in the space surrounded by the two heat dissipation portions 12 close to the edge to form a layer structure. Thus, a winding airflow channel is formed between the heat dissipation portions 12 of two adjacent layers, which can effectively increase the area of ​​heat exchange between the heat dissipation portions 12 of the heat sink 100 and the air in the external environment, thereby improving the heat dissipation efficiency.

[0086] In some embodiments, reference Figure 1 , along a plane perpendicular to the first direction D1, a cross-sectional shape of at least one of the plurality of heat dissipation portions 12 is dot-shaped.

[0087] In some embodiments, a cross-sectional shape of at least one of the plurality of heat dissipation portions 12 is annular.

[0088] In a specific implementation, refer to Figure 6 The cross-sectional shape of at least two of the plurality of heat dissipation parts 12 is mutually nested concentric circular rings.

[0089] In some embodiments, the cross-sectional shape of some of the heat dissipation parts 12 is linear and radially distributed, and the cross-sectional shape of another part of the heat dissipation parts 12 is dot-shaped and dispersedly arranged between two adjacent heat dissipation parts 12 whose cross-sectional shapes are linear. In this way, the number of heat dissipation parts 12 can be increased, thereby optimizing the heat dissipation effect of the heat sink 100.

[0090] In some embodiments, the cross-sectional shape of at least one of the plurality of heat dissipation portions 12 is different from that of the other heat dissipation portions 12. In practical applications, the distribution of the plurality of heat dissipation portions 12 can be specifically designed according to the cross-sectional shape of the main body 11 and the actual heat dissipation requirements.

[0091] In some embodiments, there is a non-zero gap between two adjacent heat dissipation parts 12 among the plurality of heat dissipation parts 12. Thus, the non-zero gap provides space for heat exchange between the gas and the outside of the heat dissipation part 12.

[0092] In a specific embodiment, referring to Figure 5 , the number of the heat dissipation parts 12 is multiple, and the multiple heat dissipation parts 12 include: a first heat dissipation part 121, extending from the first side 111 of the main body 11 in a direction away from the second side 112; multiple second heat dissipation parts 122, radially distributed and connected to the outer periphery of the first heat dissipation part 121, and the condensation chambers 102 defined by the multiple second heat dissipation parts 122 are respectively connected to the condensation chambers 102 defined by the first heat dissipation part 121. In this way, the uniformity of heat dissipation can be improved, and the gaseous phase-change working medium can flow between the first heat dissipation part 121 and the multiple second heat dissipation parts 122, avoiding the accumulation of phase-change working medium in some heat dissipation parts 12, which affects the heat dissipation efficiency.

[0093] In some embodiments, there are multiple heat dissipation parts 12, and the multiple heat dissipation parts 12 are centrally symmetrically arranged or axisymmetrically arranged. Therefore, compared with the disorderly arrangement of multiple heat dissipation parts 12, the centrally symmetrically or axisymmetrically arranged heat dissipation parts 12 can improve space utilization, and more heat dissipation parts 12 can be arranged in a limited space to improve the heat dissipation effect.

[0094] Continue to refer Figure 2 The cover portion 2 is recessed toward the first side 111 of the main body portion 11 to form a recessed portion 201 , and the recessed portion 201 is suitable for receiving at least a portion of the electric load device.

[0095] In a specific embodiment, the electric load device can be connected to the wall of the recessed portion 201 by gluing or clamping.

[0096] Furthermore, a receiving cavity 103 is formed between at least a portion of the side wall of the cover portion 2 forming the recessed portion 201 and the side wall of the main body portion 11 forming the evaporation cavity 101, and the receiving cavity 103 is suitable for forming a portion of the evaporation cavity 101. Thus, the annular wall 103 is arranged around the heat source (for example, an electric load device), which can increase the area for heat exchange between the phase change working medium and the heat source, and further optimize the heat dissipation effect.

[0097] Continue to refer Figure 2 , the cover 2 includes a plate portion 21 and a first flange 22 extending from the outer edge of the plate portion 21 toward the first direction D1, and the heat dissipation housing 1 includes a first extension wall 13 extending from the plane where the plate portion 21 is located toward the first direction D1, and at least a portion of the first flange 22 and at least a portion of the first extension wall 13 are seamlessly fitted. As a result, the first flange 22 and the first extension wall 13 in surface-to-surface contact can strengthen the connection between the heat dissipation housing 1 and the cover 2, and enhance the connection stability of the radiator 100. Furthermore, the surface-to-surface contact between the first flange 22 and the first extension wall 13 has a better sealing effect than other contact methods (such as line contact). Surface-to-surface contact can provide a larger contact area, thereby increasing the reliability and stability of the seal, avoiding accidental leakage of the phase change medium, and effectively reducing the risk of performance degradation or failure due to poor sealing.

[0098] Combination Figure 2 and Figure 7 In some embodiments, the cover 2 further includes: a second flange 23, which is formed by folding from the side of the first flange 22 away from the plate 21 in the opposite direction of the first direction D1, and the first extension wall 13 is clamped between the first flange 22 and the second flange 23, and the first flange 22, the first extension wall 13 and the second flange 23 are seamlessly fitted in sequence. Therefore, by setting the second flange 23, the connection area between the cover 2 and the heat dissipation housing 1 is further increased, thereby further strengthening the sealing effect. In addition, a tight and seamless connection between the heat dissipation housing 1 and the cover 2 can be achieved through physical folding and clamping processes without the need for additional welding processes or other connection materials, which significantly simplifies the production process and reduces production costs.

[0099] Combination Figure 2 and Figure 8In a variation, the cover 2 may include: a second flange 23, which is formed by folding from the side of the first flange 22 away from the plate 21 in the opposite direction of the first direction D1; a third flange 24, which is formed by folding from the side of the second flange 23 away from the first flange 22 in the first direction D1; the heat dissipation housing 1 also includes: a second extension wall 14, which is formed by folding from the side of the first extension wall 13 away from the plane where the plate 21 is located in the first direction D1; wherein the third flange 24 is clamped between the first extension wall 13 and the second extension wall 14, the second extension wall 14 is clamped between the second flange 23 and the third flange 24, and the first flange 22, the first extension wall 13, the third flange 24, the second extension wall 14 and the second flange 23 are seamlessly attached in sequence. As a result, the connection area between the cover 2 and the heat dissipation housing 1 is further increased, thereby further strengthening the sealing effect.

[0100] In some embodiments, the bending may continue to form more flanges and extended walls, thereby achieving a better sealing effect.

[0101] Therefore, the sealed connection between the heat dissipation housing 1 and the cover 2 is achieved only by physical folding, which simplifies the process and helps reduce production costs.

[0102] In some embodiments, a capillary structure (not shown in the figure) may be further provided on the inner wall of the heat dissipation housing 1, and the liquid phase-change medium flows back from the condensation chamber 102 to the evaporation chamber 101 under the action of the capillary structure. Thus, the circulation of the phase-change medium between the evaporation chamber 101 and the condensation chamber 102 can be accelerated, and the heat dissipation effect of the radiator 100 can be optimized.

[0103] From the above, a heat sink 100 for an electric load device using the technical solution of the present application is provided. The heat sink 100 includes a heat dissipation shell 1 and a cover 2. The heat dissipation shell 1 has a main body 11 and a heat dissipation portion 12. The heat dissipation portion 12 is connected to the main body 11 to form a condensation chamber 102 and an evaporation chamber 101. The condensation chamber 102 and / or the evaporation chamber 101 are filled with a phase change medium, and efficient heat dissipation is achieved by utilizing the physical properties of the phase change medium. Specifically, when the electric load device generates heat, the phase change medium in the evaporation chamber 101 is heated to vaporize (or evaporate) and absorb heat, taking the heat away; then the gaseous phase change medium flows to the condensation chamber 102, exchanges heat with the external environment through the heat dissipation portion 12, condenses into a liquid and flows back to the evaporation chamber 101, forming a circulating heat dissipation. This heat dissipation method is not only efficient, but also stable and reliable.

[0104] Furthermore, the main body 11 and the heat dissipation part 12 are formed synchronously or step by step through a stamping process. This integrated design simplifies the production process and reduces the use of complex processes such as welding, thereby reducing production costs. At the same time, the integrated design also enhances the overall structural strength of the radiator 100 and improves the reliability and durability of the product. In addition, the stamping process can not only realize the integrated forming of the main body 11 and the heat dissipation part 12, but also provide more optional space for the shape of the heat dissipation housing 1. By adjusting the shape and size of the stamping die, radiators 100 of different shapes and sizes can be easily produced to meet the heat dissipation requirements of different electrical load devices.

[0105] Furthermore, the number, shape and arrangement of the heat dissipation parts 12 can be flexibly designed according to actual needs. For example, the heat dissipation parts 12 can be in various shapes such as straight lines, arcs, dots, rings, etc., and can also be arranged in a central symmetric or axial symmetric manner. This diversified design not only improves the heat dissipation efficiency of the heat sink 100, but also increases the aesthetics and practicality of the product.

[0106] Furthermore, the connection between the heat dissipation housing 1 and the cover 2 can be closed by physically curling the first flange 22 and the first extension wall 13, without introducing additional materials or structures. This connection method simplifies the production process, reduces production costs, and ensures the overall structural strength of the heat sink 100. In addition, by applying relative pressing forces to the first flange 22 and the second flange 23 at the same time, the sealing and stability of the connection can be further enhanced.

[0107] It should be understood that in a typical practical application of the heat sink 100 in the embodiment of the present application, the evaporation chamber 102 is located below the condensation chamber 101 along the gravity direction. In some practical application scenarios, the heat sink 100 may also need to be tilted or inverted. In this case, the capillary structure arranged on the inner wall of the heat dissipation housing 1 can play a guiding role, so that at least a part of the liquid phase change medium can overcome gravity and flow back to the evaporation chamber 102.

[0108] refer to Fig. 9 The present invention also provides a method for manufacturing a heat sink for an electric load device, which can be used to manufacture Figures 1 to 8 The heat sink 100 is shown above.

[0109] Specifically, the method may include:

[0110] Step S1, forming a heat dissipation housing, the heat dissipation housing having a main body and at least one heat dissipation portion protruding outward from a first side of the main body, the main body defining an evaporation chamber, each heat dissipation portion defining a condensation chamber, each condensation chamber being connected to the evaporation chamber, the evaporation chamber having an opening on a second side of the main body, the first side and the second side being opposite to each other;

[0111] Step S2, filling the condensation chamber and / or the evaporation chamber with a phase change medium;

[0112] Step S3, sealing the opening with a cover.

[0113] Among them, the specific structure and working principle of the heat sink for the electric load device can be referred to the previous Figures 1 to 8 The relevant description of the illustrated embodiment is not repeated here.

[0114] In some embodiments, step S2 may be performed under a vacuum environment.

[0115] In some embodiments, before executing step S2, the method further includes: evacuating the condensation chamber and the evaporation chamber.

[0116] Therefore, it is possible to avoid the phase change working fluid being mixed with impurities such as air and water vapor, which would affect the phase change process and further affect the heat dissipation effect.

[0117] In some embodiments, step S1 may include:

[0118] Provide profiles;

[0119] The profile is punched to form the main body and the heat dissipation part.

[0120] The profile can be made of materials with good plasticity, such as aluminum and aluminum alloy, stainless steel or copper and copper alloy, so as to ensure the yield of the stamping process.

[0121] In some embodiments, stamping the profile may be performed in steps, for example including:

[0122] The profile is subjected to a first step of stamping to form a columnar intermediate structure having an opening;

[0123] The bottom surface of the columnar intermediate structure is subjected to a second stamping process to form the heat dissipation portion.

[0124] In this way, the damage of the profile during a single stamping can be avoided, and the yield rate of the upper cover part can be effectively improved by stamping in steps.

[0125] In some embodiments, step S3 may include: providing the cover portion, the cover portion including a plate portion and a first flange extending from an outer edge of the plate portion toward a first direction, the heat dissipation housing including a first extension wall extending from a plane where the plate portion is located toward the first direction, at least a portion of the first flange and at least a portion of the first extension wall being seamlessly bonded, and the first direction is the same as a direction in which the first side points to the second side;

[0126] A second flange is formed, wherein the second flange is folded from a side of the first flange away from the plate portion in a direction opposite to the first direction, and the first extension wall is clamped between the first flange and the second flange, and the first flange, the first extension wall and the second flange are seamlessly fitted in sequence.

[0127] The specific structures of the first flange, the first extension wall and the second flange and the way they cooperate with each other can be referred to in the previous Figure 7 The relevant description of the illustrated embodiment is not repeated here.

[0128] Furthermore, sealing the opening with the cover also includes: applying relative pressing forces to the first flange and the second flange simultaneously so that the first flange, the first extension wall and the second flange are seamlessly attached in sequence. Figure 7 As shown in F.

[0129] Furthermore, the pressing force applied to the first flange is equal to the pressing force applied to the second flange.

[0130] In some embodiments, relative pressing forces may be applied to the first flange and the second flange multiple times and at intervals to ensure seamless fit between the first flange, the first extension wall, and the second flange.

[0131] In other embodiments, sealing the opening with a cover may include:

[0132] Provide the cover portion, the cover portion comprising a plate portion and a first flange extending from an outer edge of the plate portion toward a first direction, the heat dissipation housing comprising a first extension wall extending from a plane where the plate portion is located toward the first direction, at least a portion of the first flange and at least a portion of the first extension wall are seamlessly bonded, and the first direction is the same as the direction in which the first side points to the second side;

[0133] forming a second flange, wherein the second flange is formed by folding from a side of the first flange away from the plate portion in a direction opposite to the first direction;

[0134] forming a second extension wall, wherein the second extension wall is formed by folding from a side of the first extension wall away from the plane where the plate portion is located toward the first direction, and the second extension wall is in contact with the second flange;

[0135] A third flange is formed, and the third flange is folded from the side of the second flange away from the first flange toward the first direction. The third flange is clamped between the first extension wall and the second extension wall, and the second extension wall is clamped between the second flange and the third flange. The first flange, the first extension wall, the third flange, the second extension wall and the second flange are seamlessly fitted in sequence.

[0136] The specific structures of the first flange, the first extension wall, the third flange, the second extension wall and the second flange and the manner of cooperation with each other can refer to the above-mentioned Figure 8 The relevant description of the illustrated embodiment is not repeated here.

[0137] Furthermore, sealing the opening with the cover also includes: applying relative pressing forces to the first flange and the second flange simultaneously so that the first flange, the first extension wall, the third flange, the second extension wall and the second flange are seamlessly fitted in sequence. Figure 8 As shown in F.

[0138] Furthermore, the pressing force applied to the first flange is equal to the pressing force applied to the second flange.

[0139] In the above embodiment, the implementation method of sealing the opening with the cover can be, for example, a double crimping sealing connection method. The double crimping is formed by rolling and pressing at least a portion of the heat dissipation housing and the cover together to form a tightly overlapping crimping, thereby ensuring a sealed connection between the two. The double crimping sealing connection method is conducive to further reducing costs.

[0140] The embodiment of the present invention further provides an electronic device, comprising: an electric load device; Figures 1 to 8 The heat sink 100 is shown in the embodiment shown.

[0141] Therefore, the electronic device using the heat sink 100 can dissipate the heat generated by the electrical load device in a timely manner, thereby increasing the overall service life of the electronic device.

[0142] As described above, the method includes the steps of forming a heat dissipation shell, filling a phase change medium, and sealing an opening with a cover. The filling of the phase change medium can be carried out in a vacuum environment to reduce the influence of air on the heat dissipation effect; at the same time, the heat dissipation efficiency of the radiator can be further improved by vacuuming. In addition, the heat dissipation shell and the heat dissipation part are formed by a stamping process, and the connection between the heat dissipation shell and the cover is achieved by physical curling, which simplifies the production process and reduces the production cost.

[0143] It should be understood that the term "and / or" herein is merely an association relationship describing associated objects, indicating that three relationships may exist, for example, A and / or B, which may represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " herein indicates that the associated objects before and after are in an "or" relationship. As used herein, unless otherwise expressly stated, the term "or" covers all possible combinations unless it is not feasible. For example, if a component is stated to include A or B, then unless otherwise expressly stated or not feasible, the component may include A, or B, or A and B. As a second example, if a component is stated to include A, B, or C, then unless otherwise expressly stated or not feasible, the component may include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C. The "multiple" appearing in the embodiments of the present application refers to two or more.

[0144] The relational terms appearing in the embodiments of the present application, such as first, second, etc., are only used to distinguish an entity or operation from another entity or operation, and do not require or imply any actual relationship or order between these entities or operations. In addition, the words "include", "have" and "comprise" and other similar forms are intended to be equivalent in meaning, and are open-ended, and one or more items behind any of these words are not meant to be an exhaustive list of such one or more items, or mean to be limited to one or more items listed. In the accompanying drawings and the specification, exemplary embodiments have been disclosed. However, many changes and modifications can be made to these embodiments. Therefore, although specific terms have been adopted, they are only used in a general and descriptive sense, not for the purpose of limitation.

[0145] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A heat sink for an electrical load device, characterized in that: include: A heat dissipation housing, the heat dissipation housing having a main body and at least one heat dissipation portion protruding outward from a first side of the main body, the main body defining an evaporation chamber, each of the heat dissipation portions defining a condensation chamber, each of the condensation chambers being connected to the evaporation chamber, the evaporation chamber having an opening on a second side of the main body, the first side and the second side being opposite to each other; A cover portion, sealing the opening, wherein the cover portion is thermally coupled to an electric load device; Wherein, the condensation chamber and / or the evaporation chamber is filled with a phase change working medium.

2. The heat sink according to claim 1, characterized in that: The main body and the heat dissipation portion are integrally formed.

3. The heat sink according to claim 2, characterized in that: The main body and the heat dissipation part are formed synchronously or step by step through a stamping process.

4. The heat sink according to claim 1, characterized in that: Each of the heat dissipation parts has a smooth outer wall.

5. The heat sink according to claim 1, characterized in that There are multiple heat dissipation parts, and a non-zero gap exists between two adjacent heat dissipation parts among the multiple heat dissipation parts.

6. The heat sink according to claim 1, characterized in that The number of the heat dissipation parts is multiple, and the multiple heat dissipation parts include: A first heat dissipation portion extending from the first side of the main body toward a direction away from the second side; A plurality of second heat dissipation parts are radially distributed and connected to the periphery of the first heat dissipation part, and the condensation chambers defined by the plurality of second heat dissipation parts are respectively connected to the condensation chambers defined by the first heat dissipation part.

7. The heat sink according to claim 1, characterized in that: There are multiple heat dissipation parts, and the multiple heat dissipation parts are centrally symmetrically arranged or axisymmetrically arranged.

8. The heat sink according to claim 1, characterized in that The cover portion has a recessed portion recessed toward the main body portion, and the recessed portion is suitable for receiving at least a portion of the electric load device.

9. The heat sink according to claim 8, characterized in that: An accommodating cavity is formed between at least a portion of the side wall of the cover portion forming the recess and the side wall of the main body portion forming the evaporation cavity, and the accommodating cavity surrounds the recess and serves as a part of the evaporation cavity.

10. The heat sink according to claim 1, characterized in that The cover portion includes a plate portion and a first flange extending from an outer edge of the plate portion toward a first direction, the heat dissipation shell includes a first extension wall extending from a plane where the plate portion is located toward the first direction, at least a portion of the first flange and at least a portion of the first extension wall are seamlessly fitted together, and the first direction is the same as the direction in which the first side points to the second side.

11. The heat sink according to claim 10, characterized in that The cover portion further comprises: The second flange is formed by folding from the side of the first flange away from the plate portion in the opposite direction of the first direction, and the first extension wall is clamped between the first flange and the second flange. The first flange, the first extension wall and the second flange are seamlessly fitted in sequence.

12. The heat sink according to claim 10, characterized in that The cover portion further comprises: A second flange is formed by folding from a side of the first flange away from the plate portion in a direction opposite to the first direction; A third flange is formed by folding from a side of the second flange away from the first flange toward the first direction; The heat dissipation housing further comprises: The second extension wall is formed by folding from the first extension wall on a side away from the plane where the plate portion is located toward the first direction; wherein, The third flange is clamped between the first extension wall and the second extension wall, the second extension wall is clamped between the second flange and the third flange, and the first flange, the first extension wall, the third flange, the second extension wall and the second flange are seamlessly fitted in sequence.

13. The heat sink according to claim 1, characterized in that A capillary structure is arranged on the inner wall of the heat dissipation housing, and the liquid phase-change medium flows back from the condensation chamber to the evaporation chamber under the action of the capillary structure.

14. The heat sink according to claim 1, characterized in that The electric load device is an LED lamp or a power semiconductor device.

15. A method for manufacturing a heat sink for an electric load device, characterized in that: include: forming a heat dissipation housing, the heat dissipation housing having a main body and at least one heat dissipation portion protruding outward from a first side of the main body, the main body defining an evaporation chamber, each heat dissipation portion defining a condensation chamber, each condensation chamber being connected to the evaporation chamber, the evaporation chamber having an opening on a second side of the main body, the first side and the second side being opposite to each other; Filling the condensation chamber and / or the evaporation chamber with a phase-change working medium; The opening is sealed with a cover.

16. The method according to claim 15, characterized in that The filling of the phase-change working medium in the condensation chamber and / or the evaporation chamber is performed under a vacuum environment; and / or Before filling the phase-change working medium in the condensation chamber and / or the evaporation chamber, the method further comprises: evacuating the condensation chamber and the evaporation chamber.

17. The method according to claim 15, characterized in that The forming of the heat dissipation housing comprises: Provide profiles; The profile is punched to form the main body and the heat dissipation part.

18. The method according to claim 17, characterized in that The stamping of the profile comprises: The profile is subjected to a first step of stamping to form a columnar intermediate structure having an opening; The bottom surface of the columnar intermediate structure is subjected to a second stamping process to form the heat dissipation portion.

19. The method according to claim 15, characterized in that Using the cover to seal the opening comprises: providing the cover, the cover comprising a plate and a first flange extending from an outer edge of the plate toward a first direction, the heat dissipation housing comprising a first extension wall extending from a plane where the plate is located toward the first direction, at least a portion of the first flange and at least a portion of the first extension wall being seamlessly bonded, and the first direction is the same as a direction in which the first side points to the second side; A second flange is formed, wherein the second flange is folded from a side of the first flange away from the plate portion in a direction opposite to the first direction, and the first extension wall is clamped between the first flange and the second flange, and the first flange, the first extension wall and the second flange are seamlessly fitted in sequence.

20. The method according to claim 19, characterized in that Using the cover to seal the opening also includes: simultaneously applying relative pressing forces to the first flange and the second flange so that the first flange, the first extension wall and the second flange are seamlessly fitted in sequence.

21. The method according to claim 15, characterized in that The using of the cover to seal the opening comprises: Provide the cover portion, the cover portion comprising a plate portion and a first flange extending from an outer edge of the plate portion toward a first direction, the heat dissipation housing comprising a first extension wall extending from a plane where the plate portion is located toward the first direction, at least a portion of the first flange and at least a portion of the first extension wall are seamlessly bonded, and the first direction is the same as the direction in which the first side points to the second side; forming a second flange, wherein the second flange is formed by folding from a side of the first flange away from the plate portion in a direction opposite to the first direction; forming a second extension wall, wherein the second extension wall is formed by folding from a side of the first extension wall away from the plane where the plate portion is located toward the first direction, and the second extension wall is in contact with the second flange; A third flange is formed, and the third flange is folded from the side of the second flange away from the first flange toward the first direction. The third flange is clamped between the first extension wall and the second extension wall, and the second extension wall is clamped between the second flange and the third flange. The first flange, the first extension wall, the third flange, the second extension wall and the second flange are seamlessly fitted in sequence.

22. The method according to claim 21, characterized in that Using the cover to seal the opening also includes: simultaneously applying relative pressing forces to the first flange and the second flange so that the first flange, the first extension wall, the third flange, the second extension wall and the second flange are seamlessly fitted in sequence.

23. An electronic device, characterized in that: include: Electrical load devices; A heat sink as claimed in any one of claims 1 to 14.

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