Inverter IGBT module packaging structure and packaging method

Abstract

The invention relates to the field of semiconductor devices, and particularly discloses an inverter IGBT module packaging structure and packaging method.The inverter IGBT module packaging structure comprises a substrate and a chipset arranged on the substrate, a water cooling assembly is arranged on the periphery of the chipset, and the water cooling assembly comprises a water cooling main pipe arranged on the periphery of the upper portion of the chipset; a telescopic pipe assembly is arranged on the water-cooling main pipe and comprises a first water-cooling branch pipe which is horizontally arranged on the side edge of the water-cooling main pipe and extends in the direction of the middle of the upper portion of the chipset; the driving assembly is used for driving the telescopic pipe assembly to stretch out and draw back. According to the inverter IGBT module packaging structure and the packaging method, effective heat dissipation of the packaging structure can be achieved through cooperation of the arranged water cooling assembly, the telescopic pipe assembly and the driving assembly, the heat dissipation effect is good, the heat dissipation effect can be improved in a self-adaptive mode when the temperature rises, and the heat dissipation effect adaptability is reduced when the temperature drops; conditions such as severe environment and abnormal heating can be handled conveniently.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor devices, and in particular to an inverter IGBT module packaging structure and a packaging method. Background Art

[0002] The IGBT module packaging structure is a core device in the field of power semiconductors. It refers to a component formed by packaging multiple IGBT chips in parallel. It is widely used in industries such as photovoltaic power generation, new energy vehicles, rail transportation, and distribution network construction. In the inverter, the IGBT module plays a key role in converting direct current into alternating current, and its performance directly affects the efficiency and reliability of the inverter; the IGBT module will generate a lot of heat during operation. With the increase of current density, the increase of power and the reduction of volume, its internal heat generation will also increase exponentially. If this heat cannot be dissipated in time, it will cause the module temperature to rise, thereby affecting its performance and reliability. Therefore, the heat dissipation requirements are generally considered when designing the IGBT module packaging structure.

[0003] However, the existing heat dissipation methods are mostly to set heat sinks at the bottom or periphery of the IGBT module for heat dissipation. Although this method can alleviate the heat dissipation problem to a certain extent, it has obvious limitations. First, the heat dissipation effect of the heat sink is limited by its material, shape, area and other factors, and cannot meet the heat dissipation requirements of high-power density and high-power IGBT modules. Secondly, in harsh environments or abnormal heating conditions, the heat sink cannot adaptively adjust its heat dissipation capacity, causing the temperature of the IGBT module to rise rapidly, and may even cause thermal failures. Therefore, traditional heat dissipation methods can no longer meet these requirements, and it is necessary to develop more efficient and adaptive heat dissipation technologies.

[0004] Therefore, it is necessary to propose an inverter IGBT module packaging structure and packaging method to solve the above problems. Summary of the invention

[0005] The main purpose of the present invention is to provide an inverter IGBT module packaging structure and packaging method, which can effectively solve the problems in the background technology.

[0006] To achieve the above object, the technical solution adopted by the present invention is: An inverter IGBT module packaging structure comprises a substrate and a chipset arranged on the substrate, a water cooling assembly is arranged around the chipset, the water cooling assembly comprises a water cooling pipe arranged on the upper periphery of the chipset, a storage box for storing cooling water is arranged at one end of the substrate, a micro pump is arranged at one side of the storage box, a liquid outlet pipe is arranged at the output end of the micro pump, a return pipe is connected to the upper end of one side of the storage box, one end of the water cooling pipe is a water inlet, and the other end is a water outlet, and one end of the water inlet is connected to an end of the liquid outlet pipe away from the micro pump, the water outlet extends to the bottom of the substrate and is connected to a cooling pipe, and the end of the cooling pipe away from the water cooling pipe is connected to an end of the return pipe away from the storage box; The water cooling main pipe is provided with a telescopic pipe assembly, the telescopic pipe assembly includes a first water cooling branch pipe horizontally arranged at the side of the water cooling main pipe and extending toward the middle of the upper part of the chipset, a first inner pipe is arranged on the water cooling main pipe at a position corresponding to the first water cooling branch pipe, and an end of the first water cooling branch pipe is movably sealed and connected to the first inner pipe; It also includes a driving assembly for driving the telescopic tube assembly to extend and retract, the driving assembly includes a traction rod fixedly arranged on the side wall of the first water-cooling branch pipe and in an "L" shape, and the traction rod extends to the bottom of the base plate at one end away from the first water-cooling branch pipe, and the two ends of the bottom of the base plate in the width direction are respectively movably connected with sliding plates, and a sliding rod corresponding to the sliding plate is laterally fixed on the end of the traction rod extending to the bottom of the base plate, and the end of the sliding rod away from the traction rod passes through the corresponding sliding plate and is fixedly connected to the side wall of the other sliding plate, and a thermal expansion and contraction component for driving the two sliding plates to relative displacement is arranged between the two sliding plates.

[0007] Preferably, the telescopic tube assembly further comprises a second water-cooling branch pipe vertically arranged at the bottom of the side of the water-cooling main pipe and extending toward the outer side of the chipset, the second water-cooling branch pipe corresponds to the first water-cooling branch pipe, a second inner pipe is arranged on the water-cooling main pipe at a position corresponding to the second water-cooling branch pipe, and an end of the second water-cooling branch pipe is movably sealed and connected to the outside of the second inner pipe; The first water-cooling branch pipe and the second water-cooling branch pipe are both "U"-shaped.

[0008] Preferably, a synchronization component is arranged between the first water-cooling branch pipe and the second water-cooling branch pipe, and the synchronization component is arranged between the first water-cooling branch pipe and the second water-cooling branch pipe. The synchronization component includes a first linkage frame arranged at the bottom of the first water-cooling branch pipe near one end of the water-cooling main pipe, and a second linkage frame corresponding to the first linkage frame is arranged on the side wall of the second water-cooling branch pipe, and a guide groove is inclinedly arranged on the side of the second linkage frame, and a guide shaft that cooperates with the movable guide of the guide groove is arranged at one end of the first linkage frame, and is configured so that when the first linkage frame follows the first water-cooling branch pipe to move toward the top middle of the chipset, the second linkage frame drives the second water-cooling branch pipe to move downward.

[0009] Preferably, a pair of heat sinks are provided at the bottom of the substrate, and the pair of heat sinks are stacked, and a groove body corresponding to the substrate is provided at the top of the upper heat sink; The sliding plate is slidably connected to the two ends of the inner side of the tank body; The cooling pipe extends in a "snake-like" shape, and is located between a pair of heat dissipation plates; The storage box is located at the end of the heat dissipation plate.

[0010] Preferably, the thermal expansion and contraction component is a thermal expansion and contraction spring disposed between the two sliding plates, and the thermal expansion and contraction spring is sleeved on the outer side of the portion of the sliding rod located between the two sliding plates.

[0011] Preferably, the thermal expansion and contraction component includes a piston cylinder arranged at the bottom of the base plate, and piston rods corresponding to the piston cylinder are symmetrically arranged on the opposite sides of the two sliding plates, and the adjacent ends of the two piston rods corresponding to the piston cylinder are respectively movably connected to the inner ends of the piston cylinder, and a thermal expansion and contraction fluid is arranged between the two piston rods.

[0012] Preferably, the thermal expansion and contraction component is a thermal expansion and contraction bimetallic strip arranged between two sliding plates.

[0013] Preferably, a flow regulating component is provided at one end of the trough body close to the storage box, and the flow regulating component includes a regulating shell arranged between the cooling tube and the reflux tube and between the water-cooling main pipe and the liquid outlet pipe, the regulating shell is provided with a through hole connected with the cooling tube, the reflux pipe, the water-cooling main pipe and the liquid outlet pipe, the inner side of the regulating shell is provided with a regulating cavity connected with the through hole, the two ends of the inner cavity of the regulating cavity are respectively slidably connected with regulating plates corresponding to the through hole, the top of the regulating plate is fixedly provided with an inner rack, the upper end of the regulating shell is rotatably connected with a rotating shaft at the corresponding part of the regulating cavity, the lower end of the rotating shaft is fixedly provided with an internal gear meshing with the internal rack, the upper end of the rotating shaft is located at the top of the adjusting shell and is fixedly provided with an external gear, one side of the external gear is meshed with an external rack movable along the width direction of the substrate, the two external racks respectively correspond to and are fixedly connected to one end of the two sliding plates, and are configured so that when the two sliding plates are displaced away from each other, the two regulating plates in the regulating cavity can be displaced away from each other.

[0014] Preferably, a shell for covering the chipset is disposed on the top of the substrate, and the inner side of the shell is filled with a filling colloid; Side grooves corresponding to the second water-cooling branch pipe and the traction rod are respectively arranged on both sides of the filling colloid, and transverse grooves corresponding to the first water-cooling branch pipe and the water-cooling main pipe are arranged on the upper ends of the side grooves.

[0015] A packaging method for an inverter IGBT module packaging structure comprises the following steps: S1: welding the chipset and bonding wires onto the substrate; S2: Covering the housing and filling the interior of the housing with colloid to fix the chipset and the wiring harness; S3: opening the shell, and forming side grooves and transverse grooves on the side walls of the solidified filling colloid; S4: The cooling pipe is arranged between the two heat sinks and merged, the water cooling component and the driving component are arranged in the groove body, the side groove and the horizontal groove on the top of the heat sink, and one end of the return pipe and the liquid outlet pipe is extended to the outside of the heat sink, and then the heat sink is arranged at the bottom of the substrate; S5: a storage box and a micro pump are arranged outside, and then one end of the reflux pipe and the liquid outlet pipe are connected to the micro pump and the storage box respectively.

[0016] Compared with the prior art, the present invention provides an inverter IGBT module packaging structure and packaging method, which have the following beneficial effects: The inverter IGBT module packaging structure and packaging method can achieve effective heat dissipation of the packaging structure by setting a water cooling component in conjunction with a telescopic tube component and a driving component. The water cooling component is distributed on the periphery of the chipset, which not only has a good heat dissipation effect, but also can adaptively increase the heat dissipation effect when the temperature rises, and the heat dissipation effect is less adaptable when the temperature drops, thereby ensuring that a better heat dissipation effect can be maintained at any temperature, making it easy to cope with harsh environments, abnormal heating, etc., and increasing the service life of the packaging structure. The inverter IGBT module packaging structure and packaging method can adjust the flow rate synchronously when the temperature changes through the flow regulating component. When the temperature rises, more cooling water passes through the water cooling component in the same time, thereby taking away more heat, which can further increase the heat dissipation efficiency. It is linked with the drive component, has a compact structure, and is easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a schematic diagram of the structure of the present invention in a disassembled state; Figure 3 It is a schematic diagram of the structure of the filling colloid of the present invention; Figure 4 It is a schematic diagram of the overall structure of the heat sink and substrate of the present invention; Figure 5 It is a schematic diagram of the structure of the heat sink and the substrate of the present invention when they are separated; Figure 6 It is a schematic diagram of the structure of the heat sink and water cooling assembly of the present invention in a disassembled state; Figure 7 It is a schematic diagram of the overall structure of the water cooling component, the driving component and the flow regulating component of the present invention; Figure 8 The present invention Figure 7 A structural diagram from another perspective based on the above; Fig. 9 It is a partial structural schematic diagram of the first water-cooling branch pipe, the water-cooling main pipe, and the second water-cooling branch pipe of the present invention; Fig.10 It is a schematic diagram of the structure of the synchronization component of the present invention in a disassembled state; Fig.11 2 is a schematic structural diagram of a first embodiment of a thermal expansion and contraction component of the present invention; Fig.12 The present invention Fig.11 Schematic diagram of the structure when the foundation is disassembled; Fig.13 is a schematic structural diagram of a second embodiment of a thermal expansion and contraction component of the present invention; Fig.14 It is a schematic diagram of the cross-sectional structure of the piston cylinder of the present invention; Fig.15 is a schematic structural diagram of a third embodiment of a thermal expansion and contraction component of the present invention; Fig.16 is a schematic structural diagram of a flow regulating assembly of the present invention; Fig.17 It is a disassembly schematic diagram of the regulating shell of the present invention in a cross-section state.

[0018] In the figure: 1, heat sink; 2, shell; 3, storage box; 4, micro pump; 5, filling colloid; 6, tank; 7, base plate; 8, chipset; 9, side groove; 10, horizontal groove; 11, water cooling main pipe; 12, traction rod; 13, first water cooling branch pipe; 14, second water cooling branch pipe; 15, return pipe; 16, liquid outlet pipe; 17, sliding plate; 18, cooling pipe; 19, adjustment shell; 20, sliding rod; 21, first Inner tube; 22. Second inner tube; 23. First linkage frame; 24. Second linkage frame; 25. Guide shaft; 26. Guide groove; 27. Thermal expansion and contraction spring; 28. Piston cylinder; 29. ​​Piston rod; 30. Thermal expansion and contraction fluid; 31. Thermal expansion and contraction bimetallic strip; 32. External rack; 33. External gear; 34. Through hole; 35. Adjustment chamber; 36. Adjustment sheet; 37. Rotating shaft; 38. Internal rack; 39. Internal gear. DETAILED DESCRIPTION

[0019] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0020] like Figure 1-Figure 6As shown, an inverter IGBT module packaging structure includes a substrate 7 and a chipset 8 arranged on the substrate 7. A shell 2 for covering the chipset 8 is arranged on the top of the substrate 7. The inner side of the shell 2 is filled with a filling colloid 5. A pair of heat sinks 1 are arranged at the bottom of the substrate 7. A heat-conducting structure can also be arranged between the heat sink 1 and the substrate 7 for separation. The pair of heat sinks 1 are stacked and arranged. A slot 6 corresponding to the substrate 7 is arranged on the top of the upper heat sink 1. A water cooling component is arranged around the chipset 8. The water cooling component includes a water cooling main pipe 11 arranged on the periphery of the chipset 8. One end of the substrate 7 is provided with a heat sink 1 for storing A storage box 3 for storing cooling water, the storage box 3 is located outside the end of the heat sink 1, a micro pump 4 is provided on one side of the storage box 3, a liquid outlet pipe 16 is provided on the output end of the micro pump 4, a return pipe 15 is connected to the upper end of one side of the storage box 3, one end of the water cooling main pipe 11 is a water inlet, and the other end is a water outlet, and one end of the water inlet is connected to an end of the liquid outlet pipe 16 away from the micro pump 4, the water outlet extends to the bottom of the substrate 7 and is connected to a cooling pipe 18, the cooling pipe 18 extends in a "snake shape", and the cooling pipe 18 is located between a pair of heat sinks 1, and the end of the cooling pipe 18 away from the water cooling main pipe 11 is connected to an end of the return pipe 15 away from the storage box 3; Further, such as Figure 4-Figure 9 As shown, a telescopic tube assembly is provided on the water-cooling main pipe 11, and the telescopic tube assembly includes a first water-cooling branch pipe 13 horizontally arranged on the side of the water-cooling main pipe 11 and extending toward the middle of the upper part of the chipset 8. A first inner tube 21 is arranged on the water-cooling main pipe 11 and is connected to the corresponding position of the first water-cooling branch pipe 13. The end of the first water-cooling branch pipe 13 is movably sealed and connected to the first inner tube 21. In order to further increase the heat dissipation effect, the telescopic tube assembly also includes a second water-cooling branch pipe 14 vertically arranged at the bottom of the side of the water-cooling main pipe 11 and extending toward the outer side of the chipset 8. The second water-cooling branch pipe 14 corresponds to the first water-cooling branch pipe 13. A second inner tube 22 is arranged on the water-cooling main pipe 11 and is connected to the corresponding position of the second water-cooling branch pipe 14. The end of the second water-cooling branch pipe 14 is movably sealed and connected to the outside of the second inner tube 22. The first water-cooling branch pipe 13 and the second water-cooling branch pipe 14 are both "U"-shaped; like Figure 9-10As shown, in order to synchronously extend and retract the first water-cooling branch pipe 13 and the second water-cooling branch pipe 14, a synchronization component is arranged between the first water-cooling branch pipe 13 and the second water-cooling branch pipe 14, and the synchronization component includes a first linkage frame 23 arranged at the bottom of the first water-cooling branch pipe 13 near one end of the water-cooling main pipe 11, and a second linkage frame 24 corresponding to the first linkage frame 23 is arranged on the side wall of the second water-cooling branch pipe 14, and a guide groove 26 is obliquely arranged on the side of the second linkage frame 24, and a guide shaft 25 that is movably guided and matched with the guide groove 26 is arranged at one end of the first linkage frame 23, and is configured so that when the first linkage frame 23 follows the first water-cooling branch pipe 13 to move toward the top middle of the chipset 8, the second linkage frame 24 drives the second water-cooling branch pipe 14 to move downward; like Figure 4-Figure 8 As shown, it also includes a driving component for driving the telescopic tube component to extend and retract, the driving component includes a traction rod 12 fixedly arranged on the side wall of the first water-cooling branch pipe 13 and in an "L" shape, and the traction rod 12 extends to the bottom of the base plate 7 at one end away from the first water-cooling branch pipe 13, and the two ends of the bottom width direction of the base plate 7 are respectively movably connected with sliding plates 17, and the sliding plates 17 are slidably connected to the two ends of the inner side of the trough body 6, and the traction rod 12 extends to the end of the bottom of the base plate 7. A sliding rod 20 corresponding to the sliding plate 17 is transversely fixedly arranged, and the end of the sliding rod 20 away from the traction rod 12 passes through the corresponding sliding plate 17 and is fixedly connected to the side wall of the other sliding plate 17, so that when the two sliding plates 17 are displaced away from each other, the first water-cooling branch pipes 13 on both sides of the heat sink 1 can be displaced closer, and vice versa, the displacement is recovered away from each other, and a thermal expansion and contraction component for driving the two sliding plates 17 to move relative to each other is provided between the two sliding plates 17; like Figure 11-Figure 12 As shown, for the above-mentioned thermal expansion and contraction component, in the first embodiment, the thermal expansion and contraction component is a thermal expansion and contraction spring 27 arranged between the two sliding plates 17, and the thermal expansion and contraction spring 27 is made of a memory alloy, preferably a nickel-titanium alloy spring, and the thermal expansion and contraction spring 27 is sleeved on the outer side of the portion of the slide rod 20 located between the two sliding plates 17.

[0021] like Figure 13-Figure 14 As shown, in the second embodiment, the thermal expansion and contraction component includes a piston cylinder 28 arranged at the bottom of the base plate 7. The piston cylinder 28 is generally fixed on the bottom wall of the groove body 6. Piston rods 29 corresponding to the piston cylinder 28 are symmetrically arranged on the opposite side of the two sliding plates 17, and the adjacent ends of the two piston rods 29 corresponding to the piston cylinder 28 are respectively movably connected to the inner two ends of the piston cylinder 28, and a thermal expansion and contraction fluid 30 is arranged between the two piston rods 29. The thermal expansion and contraction fluid 30 is liquid or gas. The gas can be argon, nitrogen or air. It has a significant thermal expansion and contraction effect when the temperature changes. Silicone oil is preferably used as the liquid.

[0022] like Fig.15As shown, in the third embodiment, the thermal expansion and contraction component is a thermal expansion and contraction bimetallic strip 31 disposed between the two sliding plates 17. The thermal expansion and contraction bimetallic strip 31 is preferably in a plate shape, and its two ends are movably connected to the side walls of the two sliding plates 17, preferably hinged. The thermal expansion and contraction bimetallic strip 31 is formed by pressing two metal sheets with different thermal expansion coefficients, and the difference in thermal expansion coefficients of the two metals should be as large as possible. When the thermal expansion and contraction bimetallic strip 31 is heated, due to the different thermal expansion coefficients of the two metals, bending deformation will occur, and the metal side with a larger thermal expansion coefficient will bend toward the side with a smaller thermal expansion coefficient. Therefore, in order to obtain the required driving force direction, the metal side with a larger thermal expansion coefficient faces the direction of the substrate 7 and the chipset 8, and this direction is the surface where heat is generated. The bimetallic strip materials used in the thermal expansion and contraction bimetallic strip 31 include combinations of copper-iron, copper-nickel, copper-aluminum, etc. In order to ensure the displacement of the traction rod 12, a hole groove corresponding to the traction rod 12 is provided on the base plate 7; like Figure 7-Figure 8 , Figure 16-Figure 17 As shown, in order to increase the heat dissipation effect and adapt to the changes in the lengths of the water-cooling main pipe 11, the first water-cooling branch pipe 13, and the second water-cooling branch pipe 14, a flow regulating component is provided at one end of the tank body 6 close to the storage box 3. The flow regulating component includes a regulating shell 19 arranged between the cooling pipe 18 and the return pipe 15 and between the water-cooling main pipe 11 and the liquid outlet pipe 16. The regulating shell 19 is provided with a through hole 34 connected to the cooling pipe 18, the return pipe 15, the water-cooling main pipe 11, and the liquid outlet pipe 16. The inner side of the regulating shell 19 is provided with a regulating cavity 35 connected to the through hole 34. The two ends of the inner cavity of the regulating cavity 35 are respectively slidably connected with the through hole 34. The corresponding adjusting piece 36 has an inner rack 38 fixedly arranged on the top of the adjusting piece 36. A rotating shaft 37 is rotatably connected to the corresponding part of the upper end of the adjusting shell 19 and the adjusting cavity 35. An inner gear 39 meshing with the inner rack 38 is fixedly arranged on the lower end of the rotating shaft 37. The upper end of the rotating shaft 37 is located at the top of the adjusting shell 19 and is fixedly provided with an outer gear 33. One side of the outer gear 33 is meshed with an outer rack 32 movable along the width direction of the substrate 7. The two outer racks 32 correspond to and are fixedly connected to one end of the two sliding plates 17 respectively, and are configured so that when the two sliding plates 17 are displaced away from each other, the two adjusting pieces 36 in the adjusting cavity 35 can be displaced away from each other.

[0023] It should be noted that in order to facilitate the layout of the water cooling components, side grooves 9 corresponding to the second water cooling branch pipe 14 and the traction rod 12 are respectively provided on both sides of the filling colloid 5, and the upper end of the side groove 9 is provided with a transverse groove 10 corresponding to the first water cooling branch pipe 13 and the water cooling main pipe 11.

[0024] In addition, an embodiment is also included, a packaging method of an inverter IGBT module packaging structure, comprising the following steps: Step 1: Solder the chipset 8 and bonding wires onto the substrate 7; Step 2: Cover the housing 2 and fill the interior of the housing 2 with colloid 5 to reinforce the chipset 8, wiring harness and other structures; Step 3: The housing 2 is removed again, and a side groove 9 and a transverse groove 10 are formed on the side wall of the solidified filling colloid 5; Step 4: Arrange the cooling pipe 18 between the two heat sinks 1 and merge them, arrange the water cooling assembly and the driving assembly in the groove body 6, the side groove 9 and the transverse groove 10 at the top of the heat sink 1, and extend one end of the return pipe 15 and the liquid outlet pipe 16 to the outside of the heat sink 1, and then place the heat sink 1 at the bottom of the substrate 7; Step 5: The storage box 3 and the micro pump 4 are arranged outside, and then one end of the reflux pipe 15 and the liquid outlet pipe 16 are connected to the micro pump 4 and the storage box 3 respectively.

[0025] As for the working principle of the above heat dissipation, specifically, when in use, the micro pump 4 can supply the cooling water stored in the storage box 3 to the liquid outlet pipe 16, and enter the water cooling main pipe 11 after passing through the regulating shell 19. During this period, the cooling water will flow through multiple first water cooling branches 13 and second water cooling branches 14, and the first water cooling branches 13 and the second water cooling branches 14 can take away the heat around the substrate 7 and the chipset 8. At the same time, the heat sink 1 at the bottom can also take away a part of the heat at the bottom of the substrate 7. The cooling water flowing through the water cooling main pipe 11 will enter the cooling pipe 18, and the cooling water will be cooled by the cooling pipe 18 and the heat sink 1. Then, after passing through another regulating shell 19, it will return to the storage box 3 again through the reflux pipe 15, and then it will be pumped out by the micro pump 4 again for circulation; When the temperature around the chipset 8 changes, if the temperature rises and the thermal expansion and contraction components expand due to the heat, the two sliding plates 17 move away from each other. Since the sliding rod 20 passes through the corresponding sliding plate 17 and is fixedly connected to the side wall of the sliding plate 17 at the other end, the sliding plate 17 can drive the two groups of first water-cooling branch pipes 13 to approach and extend toward the upper middle part of the chipset 8 through the sliding rod 20 and the traction rod 12, so that the second inner tube 22 and the first inner tube 21 are more exposed, and the distance between the pipes composed of the water-cooling main pipe 11, the first water-cooling branch pipe 13, and the second water-cooling branch pipe 14 becomes longer, and the distance between .... The contact area increases, and thus the heat dissipation effect increases. At the same time, when the two sliding plates 17 move away from each other, the two outer racks 32 are driven to move away from each other, and then the outer gear 33 drives the rotating shaft 37 to rotate, and the rotating shaft 37 drives the inner rack 38 to move through the internal gear 39, and then the two adjusting plates 36 in each adjusting cavity 35 move away from each other, the through holes 34 increase, and the flow rate increases while the micro pump 4 remains unchanged, and the heat dissipation effect is further increased. When the temperature decreases, the above action is opposite, ensuring that a better heat dissipation effect can be maintained at any temperature within a certain range.

[0026] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, and these changes and improvements all fall within the scope of the present invention to be protected.

Claims

1. An inverter IGBT module packaging structure, comprising a substrate (7) and a chipset (8) arranged on the substrate (7), characterized in that: A water cooling assembly is arranged around the chipset (8), and the water cooling assembly comprises a water cooling main pipe (11) arranged on the periphery above the chipset (8); a storage box (3) for storing cooling water is arranged at one end of the substrate (7); a micro pump (4) is arranged at one side of the storage box (3); a liquid outlet pipe (16) is arranged at the output end of the micro pump (4); a return pipe (15) is connected to the upper end of one side of the storage box (3); one end of the water cooling main pipe (11) is a water inlet, and the other end is a water outlet, and one end of the water inlet is connected to an end of the liquid outlet pipe (16) away from the micro pump (4); the water outlet extends to the bottom of the substrate (7) and is connected to a cooling pipe (18), and the end of the cooling pipe (18) away from the water cooling main pipe (11) is connected to an end of the return pipe (15) away from the storage box (3); The water cooling main pipe (11) is provided with a telescopic pipe assembly, the telescopic pipe assembly comprising a first water cooling branch pipe (13) horizontally arranged on the side of the water cooling main pipe (11) and extending towards the middle of the upper part of the chipset (8); a first inner pipe (21) is arranged on the water cooling main pipe (11) at a position corresponding to the first water cooling branch pipe (13), and the end of the first water cooling branch pipe (13) is movably sealed and connected to the first inner pipe (21); The invention also comprises a driving assembly for driving the telescopic tube assembly to extend and retract, the driving assembly comprising an "L"-shaped traction rod (12) fixedly arranged on the side wall of the first water-cooling branch pipe (13), and one end of the traction rod (12) away from the first water-cooling branch pipe (13) extends to the bottom of the base plate (7), and two ends of the bottom of the base plate (7) in a width direction are respectively movably connected with sliding plates (17), and a sliding rod (20) corresponding to the sliding plate (17) is transversely fixedly arranged on one end of the traction rod (12) extending to the bottom of the base plate (7), and one end of the sliding rod (20) away from the traction rod (12) passes through the corresponding sliding plate (17) and is fixedly connected to the side wall of the other sliding plate (17), and a thermal expansion and contraction component for driving the two sliding plates (17) to move relative to each other is arranged between the two sliding plates (17).

2. The inverter IGBT module packaging structure according to claim 1, characterized in that: The telescopic pipe assembly further comprises a second water cooling branch pipe (14) vertically arranged at the bottom of the side of the water cooling main pipe (11) and extending toward the outer side of the chipset (8); the second water cooling branch pipe (14) corresponds to the first water cooling branch pipe (13); a second inner pipe (22) is arranged on the water cooling main pipe (11) at a position corresponding to the second water cooling branch pipe (14); an end of the second water cooling branch pipe (14) is movably sealed and connected to the outside of the second inner pipe (22); The first water-cooling branch pipe (13) and the second water-cooling branch pipe (14) are both U-shaped.

3. The inverter IGBT module packaging structure according to claim 2, characterized in that: A synchronization component is provided between the first water-cooling branch pipe (13) and the second water-cooling branch pipe (14), the synchronization component being provided between the first water-cooling branch pipe (13) and the second water-cooling branch pipe (14), the synchronization component comprising a first linkage frame (23) provided at the bottom of the first water-cooling branch pipe (13) near one end of the water-cooling main pipe (11), a second linkage frame (24) corresponding to the first linkage frame (23) provided on the side wall of the second water-cooling branch pipe (14), a guide groove (26) being provided obliquely on the side surface of the second linkage frame (24), a guide shaft (25) movably guided and matched with the guide groove (26) being provided at one end of the first linkage frame (23), and being configured such that when the first linkage frame (23) moves toward the middle of the top of the chipset (8) following the first water-cooling branch pipe (13), the second linkage frame (24) drives the second water-cooling branch pipe (14) to move downward.

4. The inverter IGBT module packaging structure according to claim 1, characterized in that: A pair of heat dissipation plates (1) are arranged at the bottom of the base plate (7), and the pair of heat dissipation plates (1) are arranged in a stacked manner, and a groove body (6) corresponding to the base plate (7) is arranged on the top of the upper heat dissipation plate (1); The sliding plate (17) is slidably connected to two ends of the inner side of the trough body (6); The cooling pipe (18) extends in a "snake-like" shape, and the cooling pipe (18) is located between a pair of heat dissipation plates (1); The storage box (3) is located at the end of the heat dissipation plate (1).

5. The inverter IGBT module packaging structure according to claim 1, characterized in that: The thermal expansion and contraction component is a thermal expansion and contraction spring (27) disposed between the two sliding plates (17), and the thermal expansion and contraction spring (27) is sleeved on the outer side of the portion of the sliding rod (20) located between the two sliding plates (17).

6. The inverter IGBT module packaging structure according to claim 1, characterized in that: The thermal expansion and contraction component comprises a piston cylinder (28) arranged at the bottom of the base plate (7), piston rods (29) corresponding to the piston cylinder (28) are symmetrically arranged on opposite sides of the two sliding plates (17), and the adjacent ends of the two piston rods (29) corresponding to the piston cylinder (28) are movably connected to the inner ends of the piston cylinder (28), and a thermal expansion and contraction fluid (30) is arranged between the two piston rods (29).

7. The inverter IGBT module packaging structure according to claim 1, characterized in that: The thermal expansion and contraction component is a thermal expansion and contraction bimetallic strip (31) arranged between two sliding plates (17).

8. The inverter IGBT module packaging structure according to claim 4, characterized in that: A flow regulating assembly is provided at one end of the tank body (6) close to the storage box (3), and the flow regulating assembly comprises a regulating shell (19) arranged between the cooling tube (18) and the return tube (15) and between the water cooling main tube (11) and the liquid outlet tube (16); the regulating shell (19) is provided with a through hole (34) communicating with the cooling tube (18), the return tube (15), the water cooling main tube (11), and the liquid outlet tube (16); an regulating cavity (35) communicating with the through hole (34) is provided on the inner side of the regulating shell (19); regulating plates (36) corresponding to the through hole (34) are slidably connected to the two ends of the inner cavity of the regulating cavity (35); the top of the regulating plate (36) is fixedly provided with a An inner rack (38) is arranged, and a rotating shaft (37) is rotatably connected to a portion of the upper end of the adjusting shell (19) corresponding to the adjusting cavity (35), and an inner gear (39) meshing with the inner rack (38) is fixedly arranged at the lower end of the rotating shaft (37), and the upper end of the rotating shaft (37) is located at the top of the adjusting shell (19) and is fixedly provided with an outer gear (33), and one side of the outer gear (33) is meshed with an outer rack (32) movable along the width direction of the base plate (7), and the two outer racks (32) correspond to and are fixedly connected to one end of the two sliding plates (17), respectively, and are configured so that when the two sliding plates (17) are displaced away from each other, the two adjusting plates (36) in the adjusting cavity (35) can be displaced away from each other.

9. The inverter IGBT module packaging structure according to claim 3, characterized in that: A housing (2) for covering the chipset (8) is provided on the top of the substrate (7), and a filling colloid (5) is filled inside the housing (2); Side grooves (9) corresponding to the second water-cooling branch pipe (14) and the traction rod (12) are respectively provided on both sides of the filling colloid (5), and transverse grooves (10) corresponding to the first water-cooling branch pipe (13) and the water-cooling main pipe (11) are provided at the upper ends of the side grooves (9).

10. A packaging method for an inverter IGBT module packaging structure according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: welding the chip set (8) and the bonding wires onto the substrate (7); S2: Covering the housing (2) and filling the interior of the housing (2) with a colloid (5) to fix the chipset (8) and the wiring harness; S3: opening the housing (2) and forming side grooves (9) and transverse grooves (10) on the side walls of the solidified filling colloid (5); S4: Arrange the cooling pipe (18) between the two heat sinks (1) and merge them, arrange the water cooling component and the driving component in the groove body (6) at the top of the heat sink (1) and the side groove (9) and the transverse groove (10), extend one end of the return pipe (15) and the liquid outlet pipe (16) to the outside of the heat sink (1), and then place the heat sink (1) at the bottom of the base plate (7); S5: a storage box (3) and a micro pump (4) are arranged outside, and then one end of a return pipe (15) and a liquid outlet pipe (16) are connected to the micro pump (4) and the storage box (3) respectively.

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