Elastomer pin array package and electrical connection system thereof

Abstract

The invention discloses an elastomer pin array package, the package structure comprises a substrate, a chip, a package body and a plurality of elastomer pins, two planes of the substrate are respectively provided with a plurality of inner lead bonding pads and outer pin bonding pad arrays, and the lead-out end of the chip is connected with the corresponding inner lead bonding pad of the substrate through a lead bonding and / or flip-chip bonding technology. A chip is packaged on the same side of an inner lead bonding pad of a substrate by adopting a packaging body, and elastic conductor particles with a net-shaped framework structure are welded on the surface of an outer pin bonding pad of the substrate to form an elastic body pin. The invention further discloses an elastic body pin array packaging electric connection system which is easy and convenient to install, reliable in contact and particularly suitable for testing and aging of high-speed and high-density devices and electric connection of devices with replaceable requirements.

Description

Technical Field

[0001] The invention belongs to the field of integrated circuit packaging, and in particular relates to an elastic conductor pin array package and an electrical connection system thereof. Background Art

[0002] Existing large-scale integrated circuits (such as CPU, GPU, FPGA, etc.) usually use BGA, LGA and PGA packaging. BGA packaged integrated circuits use solder balls as external pins, and in actual use, they are connected to the PCB circuit board by welding. For applications that require temporary connection (such as testing and aging), it is necessary to insert a test connector between the solder ball pins and the PCB contacts. Due to the influence of the parasitic parameters of the test connector contact, there will be differences in the transmission performance under the two working conditions of using the test connector and direct welding. Especially when used in high-speed signal (greater than 1000MHz) transmission, this difference will affect the normal performance of the integrated circuit; and when LGA and PGA packages are actually used, the corresponding connection sockets need to be used for transition to complete the connection with the PCB. When used for high-speed signal transmission, there are also high requirements for the parasitic parameters of the connection socket contacts, which will also have an adverse effect on the performance of the integrated circuit. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide an elastomer pin array package and an electrical connection system thereof to make up for the shortcomings and deficiencies of existing BGA, LGA and PGA package devices, and to be suitable for signal transmission between high-speed devices and PCB circuit boards.

[0004] The technical solution adopted by the present invention is: an elastomer pin array package, including a substrate, a chip, an encapsulation body and a plurality of elastomer pins. The two planes of the substrate perpendicular to the thickness direction are respectively provided with a plurality of inner lead pads and an outer pin pad array; the chip is connected to the inner lead pads corresponding to the substrate by wire bonding and / or flip-chip welding process, and the chip is encapsulated on the same side of the inner lead pads of the substrate by the encapsulation body; the elastomer pins are welded to the surface of the outer pin pads of the substrate by elastic conductor particles through solder; the elastic conductor particles are open-cell elastic alloy bodies with a mesh skeleton structure or composite elastic conductors with metal material coatings deposited on the inner and outer surfaces of the open-cell elastic polymer, and are spherical or cylindrical in shape, with an outer size ranging from 0.15 mm to 1.5 mm.

[0005] Furthermore, the elastic conductive particles have interconnected pores distributed in the body, with a porosity between 30% and 70% and a pore size between 2 μm and 100 μm.

[0006] Furthermore, the elastic alloy body is made of beryllium bronze, titanium bronze, phosphor bronze, copper-nickel-tin alloy or other suitable elastic or highly elastic alloy materials.

[0007] Furthermore, the inner and outer surfaces of the pores of the elastic alloy body are covered with a metal protective layer, and the material of the metal protective layer can be one or more of gold, silver, nickel, and tin.

[0008] Furthermore, the elastic polymer is silicone rubber, fluororubber, chloroprene rubber or other suitable thermosetting elastomer materials.

[0009] Furthermore, the metal material coating of the composite elastomer may be made of one or more of gold, silver, copper, nickel, and tin.

[0010] An elastic pin array package electrical connection system comprises an elastic pin device, a positioning frame, a limiting part and a PCB board. The elastic pin device is the device of the aforementioned elastic pin array package; the positioning frame is provided with a containing space surrounded by side walls for placing and positioning the elastic pin device; the limiting part is provided for limiting the installation height of the elastic pin device in the containing space; the PCB board is provided with electrical connection contacts corresponding to the elastic pins of the elastic pin device; the positioning frame is fixed to the same side surface of the PCB board electrical connection contacts, the elastic pin device is placed in the containing space, and the elastic pin contacts the corresponding electrical connection contacts of the PCB board; the limiting part limits the distance between the outer pin pad surface of the elastic pin device and the surface of the electrical connection contacts of the PCB board by mechanical limiting means, so that the elastic pins of the elastic pin device are in an elastically compressed state.

[0011] Optionally, the limiting portion is an elastic clip, which is arranged on the side wall of the positioning frame. The elastic pin device is placed in the accommodating space of the positioning frame after the elastic clip is deformed by force. After the deformation is recovered, the clip chamfer buckles and fixes the elastic pin device in the accommodating space.

[0012] Optionally, the limiting portion is a limiting cover plate, which is arranged on the top surface of the positioning frame, and the inner surface of the limiting cover plate faces the electrical contact point surface of the PCB board and is parallel to the electrical connection contact surface of the PCB board. The limiting cover plate can be fixed to the top surface of the positioning frame by means of threaded connection, snap connection or hinge connection, and the inner surface of the limiting cover plate is attached to the top surface of the elastic pin device.

[0013] Optionally, a heat dissipation portion is provided on the outer surface of the limiting cover plate.

[0014] According to the present invention, the following beneficial effects can be achieved but are not limited to: the elastic pin package can be directly contacted with the PCB contact, eliminating the influence of the parasitic parameters of the transfer socket contact, and is suitable for high-speed signal transmission; the elastic body pin can be connected by soldering or by elastic compression contact, which is flexible to use and has small performance differences in different connection methods; the connection with the PCB does not require transition through the transfer socket, the connection structure is simple, maintenance and installation are convenient, and it is suitable for the interchange or upgrade of the same function and the same package circuit; the elastic body pin is compressible, has good adaptability to the coplanarity difference of the connected PCB contact, has good relief effect on the thermal stress and mechanical stress after welding, has high connection reliability, and strong environmental adaptability; the elastic body pin has a vibration reduction effect, and when used in a high acceleration vibration environment, it can reduce the influence of PCB vibration conduction on the device, and has better vibration resistance than the existing solder ball package; the elastic body pin with a porous structure can significantly increase the contact area between the pin and the flux, which is more conducive to welding and prevents the generation of cold solder joints; the porous structure pin can be fully impregnated with the flux, so that the undesired connection between the multiple pins caused by the reduced distance between the multiple pins can be prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Simplified schematic of an elastomeric lead array package device.

[0016] Figure 2 Schematic diagram of the cross-section of an elastic conductor particle.

[0017] Figure 3 Schematic diagram of the structure of an electrical connection system in which the limiting part is an elastic buckle.

[0018] Figure 4 The limiting part is a schematic diagram of the electrical connection system structure of the limiting cover plate.

[0019] Figure 5 Schematic diagram of the structure of an electrical connection system with a heat dissipation component.

[0020] In the figure: 100, elastomeric pin array package device; 10, substrate; 11, inner lead pad; 12, outer pin pad; 20, chip; 30, encapsulation body; 40, elastomeric pin; 50, elastic conductor particles; 51, mesh skeleton; 52, elastic alloy skeleton; 53, elastic polymer skeleton; 54, metal protective layer; 55, metal coating; 56, pores; 200, elastic pin device; 300, positioning frame; 310, side wall; 320, accommodating space; 330, positioning frame mounting hole; 400, PCB board; 410, PCB electrical connection contact; 420, PCB mounting hole; 500 limiting part; 510 elastic buckle; 520, limiting cover; 530, heat dissipation cover; 540, fixing screw. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the accompanying drawings and specific implementation examples: Figure 1 , Figure 2 As shown, an elastic pin array package device 100 according to the present invention includes a substrate 10, a chip 20, an encapsulation body 30 and elastic pins 40.

[0022] The substrate 10 is provided with a plurality of inner lead pads 11 and an outer pin pad array 12 on two planes perpendicular to the thickness direction; the chip 20 is connected to the inner lead pads 11 corresponding to the substrate by wire bonding and / or flip chip welding process, and the package 30 encapsulates the chip on the same side of the inner lead pads 11 of the substrate; the elastomer pins 40 are soldered to the surface of the outer pin pads 12 of the substrate by elastic conductor particles 50 through solder.

[0023] The encapsulation body 30 is formed by epoxy resin potting or metal / ceramic shell sealing to isolate the chip 20 from the external environment.

[0024] The elastic conductor particles 50 are open-cell elastic conductors having a network skeleton 51 structure, and the network skeleton 51 is an elastic alloy body having an elastic alloy skeleton 52 ( Figure 2 a) or a composite elastomer having a metal conductive coating 55 deposited on the inner and outer surfaces of the elastic polymer skeleton 53 ( Figure 4 b) To prevent the surface of the elastic alloy body from being oxidized, a metal protective coating 54 is deposited on the outer surface of the elastic alloy skeleton 52 .

[0025] The elastic alloy skeleton 52 is made of beryllium bronze, titanium bronze, phosphor bronze, copper-nickel-tin (Cu-Ni-Sn) alloy or other suitable elastic or highly elastic alloys, and is made into open-pore elastic alloy particles through powder metallurgy sintering and heat treatment processes.

[0026] The elastic polymer skeleton 53 is made of silicone rubber, fluororubber, chloroprene rubber or other suitable thermosetting elastomer materials, and is formed into open-cell elastic polymer particles through hole making and molding processes.

[0027] The surface deposited metal conductive coating 55 is one or more of gold, silver, copper, nickel, chromium, and tin, and the metal protective coating 54 is one or more of gold, silver, nickel, chromium, and tin.

[0028] The metal conductive coating 55 and the metal protective coating 54 may be a combination of one or more metal materials, and may be deposited by vacuum deposition, chemical plating, electroplating, or the like.

[0029] The elastic conductive particles 50 have interconnecting pores 56 that penetrate the contact body, with a porosity between 30% and 70%, a pore size between 2 μm and 100 μm or other suitable sizes, a spherical or cylindrical shape, and an outer diameter and length ranging from 0.15 mm to 1.5 mm.

[0030] like Figure 3 , Figure 4 , Figure 5 As shown, the elastic pin array package electrical connection system according to the present invention includes an elastic pin device 200, a positioning frame 300, a PCB board 400 and a limiting portion 500.

[0031] The elastic pin device 200 is the aforementioned elastic pin array package device 100, and the positioning frame 300 is provided with a accommodating space 320 surrounded by a side wall 310 for placing and positioning the elastic pin device 200; the limiting portion 500 is used to limit the installation height of the elastic pin device 200 in the accommodating space 320; the PCB board 400 is provided with an electrical connection contact 410 corresponding to the elastic pin 40 of the elastic pin device 200; the positioning frame 300 is fixed on the same side surface of the PCB board 400 as the electrical connection contact 410, the elastic pin device 200 is placed in the accommodating space 320, and the elastic pin 40 is in contact with the electrical connection contact 410 corresponding to the PCB board 400; the limiting portion 500 limits the distance between the surface of the outer pin pad of the elastic pin device 200 and the surface of the electrical connection contact 410 of the PCB board by mechanical limiting means, so that the elastic pin 40 of the elastic pin device 200 is in an elastic compression state.

[0032] The limiting portion 500 may be configured as an elastic buckle 510 (see Figure 3 a. Figure 3 b) is arranged on the side wall 310 of the positioning frame 300, and the elastic pin device 200 is placed in the accommodating space 310 of the positioning frame 300 by deforming the elastic buckle 510 under force. After the deformation is restored, the elastic buckle 510 is chamfered to buckle and fix the elastic pin device 200 in the accommodating space 310. The elastic pin 40 of the elastic pin device 200 contacts the corresponding electrical connection contact 410 of the PCB board 400 and is in an elastic compression state.

[0033] The limiting portion 500 can be configured as a limiting cover plate 520, which is fixed on the top surface of the positioning frame 300 (see Figure 4 a. Figure 4 b), the inner surface of the limiting cover plate 520 faces the surface of the electrical contact point 410 of the PCB board 400 and is parallel to the surface of the electrical connection contact point 410. The elastic pin device 200 is placed in the accommodating space 310 of the positioning frame 300, and its elastic pin 40 is in contact with the corresponding electrical connection contact point 410 of the PCB board 400 and is in an elastic compression state.

[0034] The limiting cover plate 520 can be connected to the positioning frame 300 and the PCB board 400 by fixing screws 540 (see Figure 4 c) The fixing screws 540 connect the positioning frame 300 and the limiting cover plate 520 to the surface of the PCB board 400 through the positioning frame mounting holes 330 and the PCB mounting holes 420.

[0035] For devices that require top heat dissipation, the limiting cover plate can be a heat dissipation cover plate with heat dissipation fins on the outer surface (see Figure 5 a. Figure 5 b) Its connection method is the same as the aforementioned limit cover.

[0036] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. An elastomer pin array package, comprising a substrate, a chip, an encapsulation body and a plurality of elastomer pins, characterized in that: The two planes of the substrate perpendicular to the thickness direction are respectively provided with a plurality of inner lead pads and an outer pin pad array; the chip is connected to the inner lead pads corresponding to the substrate by wire bonding and / or flip-chip welding process, and the chip is encapsulated on the same side of the inner lead pads of the substrate by the encapsulation body; the elastomer pins are welded to the surface of the outer pin pads of the substrate by elastic conductor particles through solder; the elastic conductor particles are open-cell elastic alloy bodies with a mesh skeleton structure or composite elastic conductors with metal material coatings deposited on the inner and outer surfaces of an open-cell elastic polymer, and are spherical or cylindrical in shape, with an outer size ranging from 0.15 mm to 1.5 mm.

2. The elastomer pin array package according to claim 1, characterized in that: The elastic conductor particles have interconnected pores distributed in the body, with a porosity between 30% and 70% and a pore size between 2 μm and 100 μm.

3. The elastomer pin array package according to claim 1, characterized in that: The elastic alloy body is made of beryllium bronze, titanium bronze, phosphor bronze, copper-nickel-tin alloy or other suitable elastic or highly elastic alloy materials.

4. The elastomeric pin array package according to claim 1, characterized in that: The inner and outer surfaces of the pores of the elastic alloy body are covered with a metal protective layer, and the material of the metal protective layer can be one or more of gold, silver, nickel, and tin.

5. The elastomer pin array package according to claim 1, characterized in that: The elastic polymer is made of silicone rubber, fluororubber, chloroprene rubber or other suitable thermosetting elastic materials.

6. The elastomeric pin array package according to claim 1, characterized in that: The metal material coating of the composite elastomer may be one or more of gold, silver, copper, nickel and tin.

7. An elastic pin array package electrical connection system, comprising an elastic pin device, a positioning frame, a limiter and a PCB board, characterized in that: The elastic pin device is a device of the elastomer pin array package as described in claim 1; the positioning frame is provided with a accommodating space surrounded by side walls for placing and positioning the elastic pin device; the limiting portion is provided for limiting the installation height of the elastic pin device in the accommodating space; the PCB board is provided with electrical connection contacts corresponding to the elastomer pins of the elastic pin device; the positioning frame is fixed to the same side surface of the PCB board as the electrical connection contacts, the elastic pin device is placed in the accommodating space, and the elastomer pins are in contact with the corresponding electrical connection contacts of the PCB board; the limiting portion limits the distance between the surface of the outer pin pad of the elastic pin device and the surface of the electrical connection contact of the PCB board by mechanical limiting means, so that the elastic pins of the elastic pin device are in an elastically compressed state.

8. A connection system according to claim 7, characterized in that: The limiting part is an elastic buckle, which is arranged on the side wall of the positioning frame. The elastic pin device is placed in the accommodating space of the positioning frame after the elastic buckle is deformed by force. After the deformation is restored, the buckle chamfer buckles and fixes the elastic pin device in the accommodating space.

9. A connection system according to claim 7, characterized in that: The limiting part is a limiting cover plate, which is arranged on the top surface of the positioning frame. The inner surface of the limiting cover plate faces the surface of the electrical contact point of the PCB board and is parallel to the surface of the electrical connection contact point of the PCB board. The limiting cover plate can be fixed to the top surface of the positioning frame by means of threaded connection, snap connection or hinge connection, and the inner surface of the limiting cover plate is attached to the top surface of the elastic pin device.

10. A connection system according to claim 9, characterized in that: The outer surface of the limiting cover plate is provided with a heat dissipation portion.

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