Connector assembly, first connector, second connector, cable and electronic equipment

Abstract

The embodiment of the invention discloses a connector assembly, a first connector, a second connector, a cable and electronic equipment. Wherein the first connector matched with the second connector comprises a shielding shell, the shielding shell covers the exterior of a first body embedded with a signal terminal and is made of metal materials, the shielding shell comprises an inner pin and an outer pin, the inner pin extends into an inner concave cavity of the first body and is used for being electrically connected with a backflow contact on the side of the second connector, and the outer pin extends into an outer concave cavity of the first body and is used for being electrically connected with the backflow contact on the side of the second connector. And the outer pin is used for being electrically connected with an external reference layer. Thus, after the first connector and the second connector are connected in an inserted mode, the inner pin of the shielding shell on the side of the first connector is electrically connected with the backflow contact on the side of the second connector, a reference shielding link is built and formed, and electromagnetic signals excited by the signal terminals can be absorbed in time through the reference shielding link. The signal terminals in the contact areas of the matched connectors have good isolation performance, and the influence of near-end crosstalk can be effectively improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of computer hardware, and in particular, to a connector assembly, a first connector, a second connector, a cable, and an electronic device. Background Art

[0002] Signal integrity (SI) issues in high-speed links are becoming increasingly prominent, and crosstalk is a key factor that causes SI issues. In high-speed links, connectors usually use enhanced protection wiring to suppress crosstalk effects. Therefore, effective shielding and protection design are essential for connectors to achieve high signal isolation performance.

[0003] A typical shielding scheme uses a ground bar to short-circuit the ground pins on both sides of the signal terminal, thereby enclosing the crosstalk noise generated by the signal terminal in the reference layer, achieving effective shielding between signals and avoiding signal distortion. However, the shielding position is far away from the mating contact area between the connector and the male side. This shielding method has a significant improvement on far-end crosstalk, but the near-end crosstalk problem cannot be effectively improved. Summary of the invention

[0004] The embodiments of the present application provide a connector assembly, a first connector, a second connector, a cable, and an electronic device. Through the structural optimization of the connector, the near-end crosstalk of the connector can be effectively improved, providing a good technical guarantee for improving the SI of the high-speed link.

[0005] The first aspect of the embodiment of the present application provides a first connector for intermate with a second connector, the first connector comprising a shielding shell, a first body and a signal terminal; wherein the first body is provided with an inner concave cavity for inserting the second connector for intermate; the signal terminal is embedded in the first body, and the contact of the signal terminal is located in the inner concave cavity for electrically connecting with the signal pin on the second connector side; wherein the shielding shell is made of metal material and is covered on the outside of the first body; the shielding shell comprises an inner pin and an outer pin, wherein the inner pin extends into the inner concave cavity of the first body for electrically connecting with the return contact on the second connector side, and the outer pin is used for electrically connecting with the external reference layer. The "external reference layer" here refers to the reference layer on the side of the first connector to provide a reliable return path. For example, but not limited to, the ground layer on the PCB board of the device. In this way, on the first connector side, based on the grounding path of the shielding shell, electromagnetic interference can be quickly and effectively eliminated.

[0006] With such an arrangement, after the first connector and the second connector are plugged and connected, the inner pin of the shielding shell on the first connector side is electrically connected to the return contact on the second connector side, thereby establishing a reference shielding link from the second connector, the first connector to the external reference layer, and quickly realizing return flow through the return path established by the shielding shell, avoiding electromagnetic interference between adjacent signal terminals, so that the signal terminals in the contact area of ​​the mating connectors have good isolation performance, significantly improving the impact of near-end crosstalk.

[0007] In practical applications, the extended end of the inner pin can be arranged adjacent to the signal terminal. In other words, the inner pin and the signal terminal are arranged at a small distance to timely absorb the electromagnetic signal excited by the corresponding signal terminal and quickly return it through the constructed reference shielding link. In this way, the assembly space inside the inner concave cavity can be fully utilized to realize the arrangement of the reference shielding link without affecting other functional configurations of the connector.

[0008] Exemplarily, the shielding shell may adopt a split structure, for example but not limited to, two or other number of shell parts assembled into one, and enclosed to form a shielding shell covered outside the first body.

[0009] In other exemplary embodiments, the inner pin may be a spring-like structure with a certain elastic deformation capability. Thus, when the second connector is inserted into the inner concave cavity, it may press against the inner pin to produce a certain deformation, and after being inserted into place, the reliability of the electrical connection between the return contact and the corresponding inner pin may be ensured.

[0010] Based on the first aspect, the embodiment of the present application also provides a first implementation of the first aspect: the inner pin is located at the front side of the shielding shell and extends from the insertion opening into the inner concave cavity. In this way, after being inserted into place, the electrical connection relationship of the inner pin can be reliably achieved. In addition, the structure is simple and reliable, and has good processing and assembly processability.

[0011] For example, an embedding groove can be provided at the insertion opening of the inner concave cavity of the first body, the root of the inner pin connected to the screen shell is embedded in the embedding groove, and the contact of the inner pin is located in the inner concave cavity to be electrically connected to the return contact on the surface of the second connector. In this way, the body of the inner pin located at the insertion opening is embedded in the embedding groove, which can avoid the second connector from being misplaced and inserted to cause a short circuit, and can provide a positioning and retention function for the corresponding inner pin to establish a stable return path.

[0012] In practical applications, the signal terminal can be provided in multiple numbers, and the contacts of the multiple signal terminals are arranged at intervals on the upper and lower sides of the inner concave cavity; accordingly, the inner pins are also provided in multiple numbers, and the extension ends of the multiple inner pins are located on the upper and lower sides of the inner concave cavity. Thus, a fast return path is provided in a targeted manner to avoid electromagnetic interference between signal terminals on the proximal side.

[0013] Based on the first aspect, or the first implementation of the first aspect, the embodiment of the present application further provides a second implementation of the first aspect: two inner pins are provided for the corresponding signal terminal, and along the arrangement direction of the signal terminal, the extension ends of the two inner pins are staggered on both sides of the signal terminal. In other words, the two inner pins are arranged at intervals, so that the electromagnetic interference generated by the signal terminal is guided out through the inner pins located on both sides, thereby avoiding crosstalk to other signal terminal sides on the proximal side.

[0014] Based on the second implementation of the first aspect, the embodiment of the present application also provides a third implementation of the first aspect: the first connector also includes a ground terminal, and ground terminals are arranged on both sides of the signal terminal; in the insertion direction, the two inner pins corresponding to the signal terminal are arranged opposite to the ground terminals on both sides of the signal terminal. In this way, the arrangement space of the inner concave cavity of the connector is fully utilized, and the electromagnetic crosstalk between the near-end signal terminals is effectively avoided without affecting the existing transmission function of the connector.

[0015] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, or the third implementation of the first aspect, the embodiment of the present application also provides a fourth implementation of the first aspect: the shielding shell also includes a side inner pin, which extends from the side opening of the inner concave cavity into the inner concave cavity, and is used to electrically connect with the side return contact on the second connector side. In this way, after the second connector is inserted into place, on the basis of not affecting the size of the mating connector structure, the return path is further assisted by the matching side inner pins and side return contacts to quickly guide the electromagnetic interference to the reference layer.

[0016] Exemplarily, the side inner pins may be located at the left and right sides of the shielding shell, or a plurality of side inner pins may be provided on each side of the shielding shell.

[0017] Based on the first aspect, or the first implementation of the first aspect, or the second implementation of the first aspect, or the third implementation of the first aspect, or the fourth implementation of the first aspect, the embodiment of the present application also provides a fifth implementation of the first aspect: the external pin and the welding surface of the first connector are located on the same side. In other words, the external pin of the shielding shell and the signal pin lead-out surface of the first connector are located on the same side, so that the external pin can be connected to the reference layer inside the board through the pad of the PCB single board, which has better assembly processability.

[0018] In actual applications, the PCB board is also configured with a solder pad connected to the signal pin of the first connector to build a signal transmission link. In a specific implementation, the external pin can use the same soldering process as the signal pin to achieve electrical connection with the PCB board side.

[0019] Exemplarily, a plurality of external pins may be provided, and the plurality of external pins may be arranged at intervals along the outer circumference of the shielding shell.

[0020] The second aspect of the embodiment of the present application provides a second connector for interoperating with the first connector, the second connector comprising a second body, a signal pin and a return contact; wherein the signal pin is located on the surface of the second body, and is used to be electrically connected to the contact of the signal terminal on the first connector side; the return contact is located on the surface of the second body, and is connected to the reference layer on the second body, and the return contact is used to be electrically connected to the inner pin of the first connector. Similarly, for the second connector side, the reference layer here can be the ground layer on the second body, or it can be other low-level reference layers, so that after the first connector is plugged and connected with the second connector, the inner pin of the shielding shell on the first connector side is electrically connected to the return contact on the second connector side, and a complete reference shielding link is built with the first connector side, so that the electromagnetic signal excited by the signal terminal can be timely absorbed by the above-mentioned reference shielding link, and the return can be quickly realized through the return path built by the shielding shell, so as to avoid electromagnetic interference between adjacent signal terminals on the proximal side.

[0021] Based on the second aspect, the embodiment of the present application further provides a first implementation of the second aspect: the second connector is formed by a PCB process, the second body is a PCB substrate, and the signal pin is a gold finger structure located at the insertion end of the PCB substrate. Based on the characteristics of the PCB molding process, the product manufacturing cost can be further reasonably controlled.

[0022] Based on the first implementation of the second aspect, the embodiment of the present application also provides a second implementation of the second aspect: the return contact is a conductive material layer spaced apart from the signal pin, and is electrically connected to the reference layer of the PCB substrate through a via.

[0023] Exemplarily, the conductive material layer may be bright copper on the surface of a PCB substrate, or may be other conductive material layers.

[0024] In practical applications, the signal pins can be multiple, and the multiple signal pins are arranged at intervals on two opposite surfaces of the second body; accordingly, the return contacts are also multiple, and the multiple return contacts are located on two opposite surfaces of the second body. In this way, electromagnetic interference between signal terminals is avoided on the proximal side.

[0025] Based on the second aspect, or the first implementation of the second aspect, or the second implementation of the second aspect, the embodiment of the present application also provides a third implementation of the second aspect: the second connector also includes a ground pin, and ground pins are arranged on both sides of the signal pin; in the insertion direction, two return contacts are arranged corresponding to the signal pin, and are respectively arranged opposite to the ground pins on both sides of the signal pin. In this way, without affecting the existing transmission function of the connector, electromagnetic crosstalk between the proximal signal terminals is effectively avoided.

[0026] Based on the third implementation of the second aspect, the embodiment of the present application further provides a fourth implementation of the second aspect: two return contacts corresponding to the ground pins are formed by the same conductive material layer located on the surface of the second body. In this way, on the basis of satisfying a reliable conductive connection relationship, it has better processability.

[0027] Based on the second aspect, or the first embodiment of the second aspect, or the second embodiment of the second aspect, or the third embodiment of the second aspect, or the fourth embodiment of the second aspect, the embodiment of the present application also provides a fifth embodiment of the second aspect: the second connector also includes a side return contact, which is located on the side of the second body of the second connector and is used for electrical connection of the side inner pins on the first connector side. With such a configuration, after the mating connector is inserted into place, without affecting the size of the mating connector structure, the matching side inner pins and side return contacts are further used to build a return path to quickly guide electromagnetic interference to the reference layer.

[0028] Exemplarily, the side return contacts are arranged on the left and right side surfaces of the second body, or a plurality of side inner pins are arranged on each side surface of the second body. Of course, the plurality of side inner pins located on the same side can be formed by the same conductive material layer.

[0029] A third aspect of an embodiment of the present application provides a connector assembly, which includes a first connector and a second connector that are interconnected and adapted to each other; the first connector adopts the first connector described above, and the second connector adopts the second connector described above.

[0030] A fourth aspect of an embodiment of the present application provides a connecting cable, an end of which is provided with a connector, and the connector is the second connector as described above.

[0031] Exemplarily, the second connector may be provided at both ends of the connecting cable to meet the assembly requirements of actual application scenarios.

[0032] A fifth aspect of an embodiment of the present application provides an electronic device, which includes a first component and a second component connected by a cable. The cable uses the connecting cable as described above, and the first component and the second component are respectively provided with the first connector as described above.

[0033] In practical applications, the electronic device may be a computing device, a server, a network device, etc. The connector assembly provided by each embodiment of the present application can be constructed to form a complete reference shielding link, ensure the isolation performance between the connector signal terminals, and meet the SI performance requirements of high-speed signal transmission in different application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram of an electronic device provided in an embodiment of the present application;

[0035] Figure 2 A schematic diagram of a first connector provided in an embodiment of the present application;

[0036] Figure 3 A schematic diagram of the plug-in adaptation state of a connector assembly provided in an embodiment of the present application;

[0037] Figure 4 for Figure 2 A view of the first connector shown in FIG.

[0038] Figure 5 for Figure 2 A cross-sectional view of the inner pin assembly relationship located above the inner concave cavity as shown in ;

[0039] Figure 6 for Figure 2 A cross-sectional view of the inner pin assembly relationship located below the inner concave cavity as shown in FIG.

[0040] Figure 7 A top view of a second connector provided in an embodiment of the present application;

[0041] Figure 8 for Figure 2 An exploded view of the assembly of the first connector shown in ;

[0042] Fig. 9 This is a connector near-end crosstalk test curve obtained through simulation testing;

[0043] Fig.10 This is a connector far-end crosstalk test curve obtained through simulation testing. DETAILED DESCRIPTION

[0044] The embodiment of the present application provides a connector with high isolation, which can be constructed to form a complete reference shielding link through structural optimization to ensure good isolation performance between the signal terminals of the connector.

[0045] As signal integrity issues in high-speed links become increasingly prominent, connectors used to build high-speed links need to have good anti-crosstalk performance in different scenarios to meet SI requirements for signal transmission from the source to the receiver. Figure 1 , which is a schematic diagram of an electronic device that establishes a connection relationship between components based on a connector provided in an embodiment of the present application.

[0046] like Figure 1 As shown, the first component 200 and the second component 300 of the electronic device 1000 are connected. The first component 200 and the second component 300 are respectively provided with a female connector 10 (first connector), and an electrical connection between the two is established through a cable 30 provided with a male connector 20 (second connector). The mating female connector 10 (first connector) and the male connector 20 (second connector) constitute a connector assembly 100. The electrical connection between the two includes but is not limited to data signal transmission, control signal transmission, and power supply signal transmission.

[0047] For the female connector, the method of enhanced protective wiring is usually used to suppress the crosstalk effect in order to improve the signal integrity in the high-speed link. A typical protective shielding solution is to short-circuit the ground terminals on both sides of the signal terminal through a grounding rod, so that the crosstalk noise excited by the signal terminal is enclosed in the reference layer to avoid signal distortion. For the mating connector, "far end" refers to the position away from the mating contact area, and "near end" refers to the position where the mating contact area is located. However, the shielding protection position is far away from the mating contact area between the female connector and the male side. This protective shielding method can improve the far-end crosstalk, but the near-end crosstalk problem cannot be effectively improved.

[0048] Based on this, an embodiment of the present application provides a connector assembly, including a first connector and a second connector that are mutually compatible, and signal terminals are fixedly arranged on the bodies of the two connectors, and the signal terminals are used to transmit data signals, for example but not limited to transmitting high-speed data. After being plugged into place, the contacts of the signal terminals on the first connector are adapted to the contacts of the signal terminals on the second connector to establish a corresponding connection relationship. Based on the mutually compatible plug-in relationship, one can be a female connector and the other can be a male connector.

[0049] Among them, the first connector is a female connector, including a shielding shell, a first body and a signal terminal. The first body is an insulating body made of insulating material, and an inner concave cavity is provided on the first body for inserting a mating male connector. The signal terminal is embedded in the first body, and the contact of the signal terminal is located in the inner concave cavity, which is used to electrically connect with the signal pin on the male connector side. The shielding shell is made of metal material, and the shielding shell cover is installed on the outside of the first body. The shielding shell includes inner pins and outer pins; wherein, the inner pins extend into the inner concave cavity of the first body, and the inner pins are used to electrically connect with the return contact on the male connector side; wherein, the outer pins are used to electrically connect with the external reference layer.

[0050] The "external reference layer" here refers to the reference layer connected to the adapter side of the first connector to provide a reliable return path. For example, but not limited to, the ground layer on the PCB (Printed Circuit Board) of the device (not shown in the figure). Specifically, the outer pins of the shielding shell can be welded to the ground pads on the PCB to construct a ground path for the shielding shell. In this way, based on the low resistance characteristics of the ground layer, electromagnetic interference can be quickly and effectively eliminated.

[0051] In addition, in other possible implementations, the reference layer connected to the first connector at the adapter side may also be other low-level reference layers. The low-level reference layer may be determined according to the electromagnetic interference to be eliminated, such as but not limited to a power supply layer or other layer with an appropriate potential.

[0052] Among them, the second connector is a male connector, including a second body, a signal pin and a return contact. The second body has an outer contour shape that is adapted to the inner concave cavity of the first connector to meet the functional requirements of the second connector and the first connector for plugging and mating. The signal pin is located on the surface of the second body and is used to electrically connect to the contact of the signal terminal on the female connector side; the return contact is located on the surface of the second body and is connected to the reference layer on the second body, and the return contact is used to electrically connect to the inner pin of the female connector. Similarly, for the second connector side, the reference layer here can be the ground layer on the second body, or it can be other low-level reference layers, which is not limited in the embodiments of the present application.

[0053] With such a configuration, after the first connector and the second connector are plugged and connected, the inner pins of the shielding shell on the first connector side are electrically connected to the return contacts on the second connector side, thereby building a reference shielding link from the male connector and the female connector to the external reference layer (PCB). Based on the structural characteristics of the inner pins extending into the inner concave cavity of the first body, the electromagnetic signal excited by the signal terminal can be timely absorbed by the above-mentioned reference shielding link, and quickly return through the return path built by the shielding shell. Thus, electromagnetic interference between adjacent signal terminals can be avoided, so that the signal terminals in the contact area of ​​the mating connectors have good isolation performance, significantly improving the impact of near-end crosstalk. On this basis, technical support is provided for improving the SI of high-speed links.

[0054] In order to better understand the technical solution and technical effects of the present application, without losing generality, the specific embodiments will be described in detail below in conjunction with the accompanying drawings. Figure 2 , Figure 3 and Figure 4 ,in, Figure 2 A schematic diagram of a first connector provided in an embodiment of the present application, Figure 3 A schematic diagram of the plug-in adaptation state of a connector assembly provided in an embodiment of the present application, Figure 4 for Figure 2 A view of the first connector shown in FIG.

[0055] like Figure 2 As shown, the first connector 10 provided in this embodiment has a concave cavity 11, which is a female connector. The concave cavity 11 is opened on the first body 1 of the first connector 10, and the contact of the signal terminal 2 is located in the concave cavity 11, which is used for plug-in adaptation with the male connector (second connector 20). Figure 3 As shown, the first connector 10 and the second connector 20 are mated to form a connector assembly 100. For ease of description, in the mating direction, the insertion opening side of the inner concave cavity 11 is defined as the front side, and the other side away from the insertion opening is defined as the rear side, which is used to electrically connect with the contacts of the signal terminal on the male connector side.

[0056] The first body 1 is made of insulating material, such as but not limited to plastic or rubber. On the one hand, as a basic structure for fixing the terminals, it can provide a stable support; on the other hand, reliable physical insulation can be formed between the terminals. In a specific implementation, the material selection of the first body 1 can be determined according to the overall design requirements of the product, and the embodiment of the present application is not limited thereto.

[0057] In this embodiment, the first connector 10 further comprises a shielding shell 3, and the shielding shell 3 comprises inner pins 31 and outer pins 32. The inner pins 31 are located at the front side of the shielding shell 3 and extend from the insertion opening into the inner concave cavity 11 respectively.

[0058] Combination Figure 3 As shown, the external pin 32 is located on the same side as the welding surface of the first connector 10 (the lead-out surface of the signal pin 6 of the first connector 10), and multiple external pins 32 are arranged at intervals along the outer periphery of the shielding shell 3, that is, located at the bottom of the shielding shell 3 shown in the figure. In this way, the external pin 32 can be connected to the reference layer in the board through the pad of the PCB single board (not shown in the figure). Of course, the PCB single board is also equipped with a pad connected to the signal pin of the first connector to build a signal transmission link. The external pin 32 can use the same welding process as each signal pin 6 to achieve electrical connection with the PCB single board side. Overall, it has good assembly processability.

[0059] Combination Figure 4 As shown, inner pins 31 are provided on both the upper and lower sides of the inner concave cavity 11, and are respectively arranged adjacent to the corresponding signal terminals 2. It should be understood that "adjacent" here means that the inner pins 31 and the signal terminals 2 are arranged at a small spacing, so as to timely sense and absorb the electromagnetic signals excited by the corresponding signal terminals, and quickly return them through the constructed reference shielding link. In this way, without affecting other functional configurations of the connector, the assembly space inside the inner concave cavity 11 can be fully utilized, and the extended end of the inner pin 31 can be configured to be arranged adjacent to the corresponding signal terminal 2.

[0060] It is understandable that the number of inner pins 31 and the location of the inner pins 31 can be determined according to the product signal terminals 2 to specifically avoid electromagnetic interference between the signal terminals at the proximal side of the connector.

[0061] Exemplarily, the first connector 10 includes four signal terminals 2 that need to be shielded. Two of the signal terminals 2 are located above the inner cavity 11, and the other two signal terminals 2 are located below the inner cavity 11. Figure 2 and Figure 4 As shown, each signal terminal 2 is provided with a ground terminal 4 on both sides thereof, and a power terminal 5 is provided. The ground terminal 4 and the power terminal 5 are also embedded in the first body 1, and their respective contacts are located in the inner concave cavity 11.

[0062] In a specific implementation, the ground terminal and the power terminal can be integrally formed with the first body by injection molding, or mounting grooves for embedding the terminals can be formed on the first body, and then the terminal mounting parts are assembled in the mounting grooves of the first body to achieve the above embedding relationship. This application embodiment is not limited.

[0063] In this embodiment, two inner pins 31 are respectively provided for each signal terminal 2 to be shielded. Figure 4 As shown, along the arrangement direction of the signal terminal 2 and the ground terminal 4, the extension ends of the two inner pins 31 are staggered and arranged on both sides of the corresponding signal terminal 2, that is, the two inner pins 31 are arranged at intervals. In this way, the electromagnetic interference generated by the signal terminal 2 is guided out through the inner pins 31 located on both sides, thereby avoiding crosstalk to other signal terminals 2.

[0064] Optionally, the inner pin 31 may be a spring-like structure. In other words, the inner pin 31 has elastic deformation capability, and when the second connector 20 is inserted into the inner concave cavity 11, it can press against the inner pin 31 to produce a certain deformation, and after being inserted into place, the reflow contact 21 is electrically connected to the corresponding inner pin 31, and the reliability is good.

[0065] See also Figure 5 and Figure 6 ,in, Figure 5 for Figure 2 The cross-sectional view of the inner pin assembly relationship located above the inner concave cavity 11 is shown in FIG. Figure 4 The BB cut position shown in FIG. Figure 6 for Figure 2 The cross-sectional view of the inner pin assembly relationship below the inner concave cavity 11 is shown in FIG. Figure 4 The CC sectioning position is formed.

[0066] like Figure 5 As shown, the inner pin 31 located above the inner concave cavity 11 can be arranged opposite to the ground terminals 4 on both sides of the signal terminal in the insertion direction. After the second connector 20 is inserted into place, the inner pin 31 contacts the return contact 21 on the upper surface of the second connector 20 to establish an electrical connection, thereby building a return path for the upper inner pin 301. Please refer to Figure 5 and Figure 7 ,in, Figure 7 A top view of the second connector 20 provided in an embodiment of the present application.

[0067] In this embodiment, the second connector 20 is formed by PCB technology, and the second body of the second connector 20 is formed by the PCB substrate, and the insertion end thereof is formed with a gold finger structure to form a signal pin 22, a ground pin 23 and a power pin 24. After the second connector 20 is inserted into place, the signal pin 22 on its upper surface contacts with the corresponding signal terminal 2 on the first connector 10 to establish an electrical connection to support the signal transmission function; the ground pin 23 on its upper surface contacts with the corresponding ground terminal 4 on the first connector 10 to establish an electrical connection to achieve the corresponding shielding function; the power pin 24 on its upper surface contacts with the first connector 10.

[0068] In a specific implementation, corresponding to the ground terminals 4 disposed on both sides of the signal terminal 2 on the first connector 10 side, ground pins 23 are also disposed on both sides of the signal pin 22 of the second connector 20 .

[0069] In a specific implementation, the return contact 21 on the upper surface of the second connector 20 can be a bright copper covering the surface of the PCB substrate, and is electrically connected to the reference layer of the PCB substrate through a via. Exemplarily, the return contact 21 corresponding to the ground pins 23 on both sides of the signal pin 22 can be formed by the same bright copper structure shown in the figure, which has good processability on the basis of satisfying a reliable conductive connection relationship.

[0070] In other possible implementations, the reflow contact 21 may also be other conductive material layers covering the surface of the PCB substrate, rather than being limited to bright copper on the PCB surface.

[0071] like Figure 6 As shown, the inner pin 31 located below the inner concave cavity 11 can also be arranged opposite to the ground terminal 4 next to the signal terminal in the insertion direction. After the second connector 20 is inserted into place, the inner pin 31 contacts the return contact 21 on the lower surface of the second connector 20 to establish an electrical connection, thereby building a return path for the inner pin 301 below.

[0072] It can be understood that, on the lower surface of the second connector 20, the signal pin, the ground pin and the power pin are also formed with a gold finger structure to respectively adapt to the corresponding terminals on the first connector 10 side, and the return contact 21 on the lower surface of the second connector 20 can also be bright copper covered on the surface of the PCB substrate (not shown in the figure). The specific arrangement relationship is consistent with the upper surface, and will not be repeated here.

[0073] In other possible implementations, an inner pin 31 (not shown in the figure) may be provided for each signal terminal 2 to be shielded, and the electromagnetic interference generated by the signal terminal 2 can also be derived based on the shielding link. In comparison, the above-mentioned implementation scheme of providing two inner pins 31 for the signal terminal 2 has better anti-crosstalk performance.

[0074] Furthermore, an embedding groove 12 is provided at the insertion opening of the inner concave cavity 11 of the first body 1, and the embedding groove 12 is provided one-to-one with the inner pins 31. The root of each inner pin 31 connected to the screen shell is embedded in the corresponding embedding groove 12, and the contact of the inner pin 31 is located in the inner concave cavity 11 to be electrically connected to the return contact 21 on the upper and lower surfaces of the second connector 20. In this way, the inner pin 31 located at the insertion opening is embedded in the embedding groove 12, which can avoid the second connector 20 from being misplaced and inserted to cause a short circuit, and at the same time provide a positioning and retention function for the corresponding inner pin 31 to establish a stable return path.

[0075] It should be noted that the shielding shell 3 can be implemented in different structural forms. Optionally, the shielding shell 3 can be a split structure, see Figure 8 , the figure is Figure 2 An exploded view of the assembly of the first connector is shown in FIG.

[0076] In this embodiment, the shielding shell 3 includes a first shell 3 a and a second shell 3 b , which are enclosed together to form the shielding shell 3 which is mounted outside the first body 1 .

[0077] The first shell 3a includes a first portion 3a1, a second portion 3a2 and a third portion 3a3 which are bent in sequence, wherein the first portion 3a1 covers the front side surface of the first body 1 above the inner concave cavity 11, the second portion 3a2 covers the top surface of the first body 1, and the third portion 3a3 covers the rear side surface of the first body 1. The second shell 3b includes a fourth portion 3b1, a fifth portion 3b2 and a sixth portion 3b3 which are bent in sequence, wherein the fifth portion 3b2 covers the front side surface of the first body 1 below the inner concave cavity 11, and the fourth portion 3b1 and the sixth portion 3b3 cover the side surfaces of the first body 1 respectively.

[0078] On the whole, corresponding to the outer surface of the first body 1, the first shell 3a and the second shell 3b provide substantially complete covering to obtain a better backflow guiding effect.

[0079] In a possible implementation, the first shell 3a and the second shell 3b may also adopt a structural implementation mode of providing partial covering (not shown in the figure) corresponding to the outer surface of the first body 1. In other words, the first shell 3a and the second shell 3b adopt other structural forms, and part of the surface of the first body 1 is exposed, which can also form a reliable return path. It should be understood that the shielding shell 3 is mounted on the outside of the first body 1, including the case of complete covering and the case of partial covering.

[0080] In other possible implementations, the shielding shell 3 may be an integrated structure, or may adopt other split structures. In comparison, the configuration of the first shell 3a and the second shell 3b shown in the figure has good processing and assembly processability.

[0081] Alternatively, if Figure 8 As shown, the first connector 10 may also include a low-speed signal terminal 7 for connecting a control signal line. Figure 7 As shown, the second connector 20 has a low-speed pin 25 on its body to support functions such as control and communication between devices. It should be understood that the inner pin 31 is configured for the signal terminal 2 transmitting high-speed signals, and the anti-near-series effect is more significant.

[0082] Alternatively, Figure 7As shown, the first body 1 includes two parts, a first split body 1a and a second split body 1b, and an inner recessed cavity 11 is opened on the first split body 1a; firstly, each terminal (signal terminal 2, ground terminal 4, power terminal 5, signal pin 6 and low-speed signal terminal 7) is fixed on the second split body 1b, for example but not limited to, it can be formed into one piece by injection molding, and then the second split body 1b is inserted into the first split body 1a, and the contact points of each terminal extend into the inner recessed cavity 11.

[0083] As another option, in order to further reduce the resistance of the shielded link, in a specific implementation, a return path may be provided on the sides of the first connector 10 and the second connector 20 .

[0084] For example Figure 2 and Figure 8 As shown, the shielding shell 3 on the first connector 10 side also includes a side inner pin 33, which extends into the inner concave cavity 11 from the side opening. Figure 7 As shown, correspondingly, the second connector 20 further includes side return contacts 26, which are located on both side surfaces of the second connector 20. In this way, after the second connector 20 is inserted into place, the side inner pins 33 contact the side return contacts 26 of the second connector 20 to establish an electrical connection, thereby building a return path on the side of the interconnected connector.

[0085] In a specific implementation, the side return contact 26 can also be bright copper covered on the surface of the PCB substrate and electrically connected to the reference layer of the PCB substrate. In addition, in other specific implementations, the side inner pins 33 and the side return contact 26 adapted on each side can be configured into multiple groups, which can be determined according to the overall design requirements of the actual product, and the embodiment of the present application does not limit it.

[0086] In other possible implementations, the side return contact 26 can also be other conductive material layers covering the surface of the PCB substrate, rather than being limited to bright copper on the PCB surface. In this way, without affecting the size of the intermate connector structure, the electromagnetic interference can be quickly guided to the reference layer with the help of the matching side inner pins and side return contacts.

[0087] against Figure 1 The first connector described was subjected to a crosstalk simulation test under the same test conditions, taking a connector without a shielding shell as a comparative example.

[0088] Among them, the simulation test curve for the near end of the connector as the test basis is shown in Table Fig. 9 shown. Fig. 9 Figure (a) shows the near-end crosstalk simulation test curve based on the comparative connector. Fig. 9 Figure (b) shows the Figure 1Near-end crosstalk simulation test curve of the described connector. Fig. 9 The ordinate is the ratio of input power to output power in dB, dB = 10 × log10 (input power / output power), which is a logarithmic unit, where input power refers to the power of the signal entering the device, and output power refers to the power of the signal leaving the connector; Fig. 9 The horizontal axis is the test frequency in GHz.

[0089] from Fig. 9 It can be seen from the test simulation results that in the 0.1 GHz to 7.5 GHz frequency band, the near-end crosstalk of the connector of the reference shielded link built by the shielded shell in this implementation is significantly better than that of the comparison example, and the near-end crosstalk performance is effectively improved.

[0090] Among them, the simulation test curve for the far end of the connector as the test basis is shown in Table Fig.10 shown. Fig.10 Figure (a) shows the FEXT test curve based on the comparative connector. Fig.10 Figure (b) shows the Figure 1 The far-end crosstalk simulation test curve of the described connector. Fig.10 The ordinate is the ratio of input power to output power in dB, dB = 10 × log10 (input power / output power), which is a logarithmic unit, where input power refers to the power of the signal entering the device, and output power refers to the power of the signal leaving the connector; Fig.10 The horizontal axis is the test frequency in GHz.

[0091] from Fig.10 It can be seen from the test simulation results that in the 0.1 GHz to 7.5 GHz frequency band, the far-end crosstalk of the connector of the reference shielded link built by the shielded shell in this implementation scheme is significantly better than that of the comparison example, and the near-end crosstalk performance is effectively improved.

[0092] In the above embodiment, the inner pin extends from the insertion opening into the inner concave cavity, the structure is relatively compact, and has good processing and assembly processability. In other specific implementations, the inner pin can also extend into the inner concave cavity by passing through the first body (not shown in the figure) and be arranged adjacent to the signal terminal.

[0093] For example, the inner pin 31 located above the concave cavity 11 can pass through the first body above the concave cavity from the outside of the first body and extend into the concave cavity; correspondingly, the inner pin 31 located below the concave cavity 11 can also pass through the first body below the concave cavity from the outside of the first body and extend into the concave cavity. In this way, the reference shielding link constructed based on the shielding shell 3 can also absorb the electromagnetic signal excited by the signal terminal in time, significantly improving the influence of near-end crosstalk.

[0094] The implementation scheme of the connector assembly described in the above embodiments can be widely used in different electronic devices including links to be connected. In a specific implementation, the electronic device can be a computing device, a server, a network device, and other device types. Based on the connector assembly provided in each embodiment of the present application, a complete reference shielding link can be constructed to ensure the isolation performance between the connector signal terminals and meet the SI performance requirements of high-speed signal transmission in different application scenarios.

[0095] It should be understood that the main functional components of the electronic device described above can be implemented based on existing technologies and will not be described in detail here.

[0096] It should be noted that the ordinal numbers "first" and "second" used in this article are only used to describe the same functional composition or structure in the technical solution. It is understandable that the use of the above ordinal numbers does not constitute an understanding of the technical solution for protection of this application.

[0097] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A first connector, used to mate with a second connector, characterized in that: The first connector includes a shielding shell, a first body and a signal terminal; The first body is provided with an inner concave cavity for inserting and receiving a second mating connector; The signal terminal is embedded in the first body, and the contact point of the signal terminal is located in the inner concave cavity, and is used for being electrically connected to the signal pin on the second connector side; The shielding shell is made of metal material and is covered on the outside of the first body; the shielding shell includes inner pins and outer pins, the inner pins extend into the inner concave cavity of the first body and are used to be electrically connected to the return contact on the second connector side, and the outer pins are used to be electrically connected to the external reference layer.

2. The first connector according to claim 1, characterized in that: The extended end of the inner pin is arranged adjacent to the signal terminal.

3. The first connector according to claim 1 or 2, characterized in that: The inner pin is located at the front side of the shielding shell and extends from the insertion opening into the inner concave cavity.

4. The first connector according to any one of claims 1 to 3, characterized in that: There are multiple signal terminals, and the contacts of the multiple signal terminals are arranged at intervals on the upper and lower sides of the concave cavity; accordingly, there are multiple inner pins, and the extension ends of the multiple inner pins are respectively located on the upper and lower sides of the concave cavity.

5. The first connector according to claim 4, characterized in that: Two inner pins are provided corresponding to the signal terminal, and along the arrangement direction of the signal terminal, the extending ends of the two inner pins are alternately arranged on both sides of the signal terminal.

6. The first connector according to claim 5, characterized in that: The first connector also includes a ground terminal, and the ground terminals are arranged on both sides of the signal terminal; in the insertion direction, the two inner pins arranged corresponding to the signal terminal are respectively arranged to face the ground terminals on both sides of the signal terminal.

7. The first connector according to any one of claims 1 to 6, characterized in that: The shielding shell further comprises a side inner pin, which extends from a side opening of the inner concave cavity into the inner concave cavity and is used for being electrically connected to a side return contact on the second connector side.

8. The first connector according to claim 7, characterized in that: The side inner pins are arranged on the left and right sides of the shielding shell.

9. The first connector according to any one of claims 1 to 8, characterized in that: The external pins and the welding surface of the first connector are located on the same side.

10. The first connector according to claim 9, characterized in that: The outer pins are provided in plurality, and the plurality of outer pins are arranged at intervals along the outer circumference of the shielding shell.

11. A second connector, used to mate with a first connector, characterized in that: The second connector includes a second body, a signal pin and a return contact; The signal pin is located on the surface of the second body and is used to electrically connect to the contact of the signal terminal on the first connector side; The reflow contact is located on the surface of the second body and connected to the reference layer on the second body. The reflow contact is used to be electrically connected to the inner pin of the first connector.

12. The second connector according to claim 11, characterized in that: The second connector is formed by using a PCB process, the second body is a PCB substrate, and the signal pin is a gold finger structure located at an insertion end of the PCB substrate.

13. The second connector according to claim 12, characterized in that: The return contact is a conductive material layer spaced apart from the signal pin, and the conductive material layer is electrically connected to the reference layer of the PCB substrate through a via.

14. The second connector according to claim 13, characterized in that: The conductive material layer is bright copper on the surface of the PCB substrate.

15. The second connector according to any one of claims 11 to 14, characterized in that: There are multiple signal pins, which are spaced apart on two opposite surfaces of the second body; accordingly, there are multiple return contacts, which are located on two opposite surfaces of the second body.

16. The second connector according to claim 15, characterized in that: The second connector also includes a ground pin, and the ground pins are arranged on both sides of the signal pin; in the insertion direction, two return contacts are arranged corresponding to the signal pin, and are respectively arranged facing the ground pins on both sides of the signal pin.

17. The second connector according to claim 16, characterized in that: The two return contacts corresponding to the signal pins are formed by a same conductive material layer located on the surface of the second body.

18. The second connector according to any one of claims 11 to 17, characterized in that: The second connector further comprises a side return contact, which is located on the side of the second body of the second connector and is used for electrical connection of the side inner pins of the first connector.

19. The second connector according to claim 18, characterized in that: The side return contacts are arranged on both side surfaces of the second body.

20. A connector assembly, characterized in that: It comprises a first connector and a second connector that are interconnected and adapted; the first connector adopts the first connector described in any one of claims 1 to 10, and the second connector adopts the second connector described in any one of claims 11 to 19.

21. A connecting cable, characterized in that: A connector is provided at the end of the connecting cable, and the connector is the second connector according to any one of claims 11 to 19.

22. An electronic device, characterized in that: It comprises a first component and a second component connected by a cable, the cable is the connecting cable according to claim 21, and the first component and the second component are respectively provided with the first connector according to any one of claims 1 to 10.

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