A camera module

Abstract

The present application discloses a camera module, including an image sensor component, the camera module is suitable for being electrically connected to an external circuit to realize power supply and signal transmission to the image sensor component, the image sensor component includes a first circuit board, a second circuit board and a photosensitive chip, the circuit on the first circuit board and the circuit on the second circuit board are independent of each other, the photosensitive chip includes a first side circuit and a second side circuit, the circuit on the first circuit board is conductively connected to the first side circuit of the photosensitive chip, the circuit on the second circuit board is conductively connected to the second side circuit of the photosensitive chip, and the circuit on the first circuit board and the circuit on the second circuit board are respectively suitable for being electrically connected to the external circuit. The present application is to provide a camera module with a smaller circuit board width.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and mainly to a camera module. Background Art

[0002] In modern electronic devices, printed circuit boards (PCBs) play an important role in all walks of life as the support for electronic components. They are not only the physical support for electronic components, but also responsible for the electrical connection of the circuit.

[0003] At present, thinness and lightness is one of the important development trends of terminal devices such as smartphones, notebooks, and tablets. With the development of technology, the size of the camera module has become the main factor restricting the further thinning of terminal devices. The camera module usually includes a lens, a bracket, a circuit board, a photosensitive chip, etc. Among them, the circuit board serves as a supporting base, the bracket and the photosensitive chip are arranged on the circuit board, and the lens is arranged on the bracket. Figure 1 As shown, a photosensitive element 1A is disposed in the middle of the circuit board 2A, and both ends of the photosensitive element 1A are electrically connected to the circuit board 2A through metal pins or solder joints. The circuit board 2A is electrically connected to an external connector, and a bracket (not shown in the figure) is disposed on the circuit board 2A. The lens (not shown in the figure) is held above the photosensitive element 1A by the bracket. Since it is difficult to further reduce the thickness of the lens, reducing the size of the circuit board and the bracket has become the current direction of improvement. Summary of the invention

[0004] One purpose of the present application is to provide a camera module with a smaller size.

[0005] Another object of the present application is to provide a camera module with a smaller circuit board width.

[0006] To achieve the above objectives, the technical solution adopted in the present application is: a camera module, including an image sensor component, the camera module is suitable for being electrically connected to an external circuit to realize power supply and signal transmission for the image sensor component, the image sensor component includes a first circuit board, a second circuit board and a photosensitive chip, the circuit on the first circuit board and the circuit on the second circuit board are independent of each other, the photosensitive chip includes a first side circuit and a second side circuit, the circuit on the first circuit board is conductively connected to the first side circuit of the photosensitive chip, the circuit on the second circuit board is conductively connected to the second side circuit of the photosensitive chip, and the circuit on the first circuit board and the circuit on the second circuit board are respectively suitable for being electrically connected to the external circuit.

[0007] Preferably, the circuits on the first circuit board and the circuits on the second circuit board are located on opposite sides of the photosensitive chip.

[0008] Preferably, the photosensitive chip is rectangular, and includes a first side, a second side, a third side and a fourth side in sequence, the first side is opposite to the third side, the first side circuit of the photosensitive chip is arranged close to the first side, the second side circuit is arranged close to the third side, the first circuit board is connected to the first side of the photosensitive chip, the second circuit board is connected to the third side of the photosensitive chip, and the outer sides of the second side and the fourth side are adjacent areas without electrical circuits.

[0009] Preferably, the first circuit board is connected to the second circuit board via at least one connecting portion, the connecting portion is disposed on the outside of the second side and / or the fourth side of the photosensitive chip, the connecting portion is not provided with a signal transmission line or a power supply line, and the width of the connecting portion does not exceed 0.15 mm.

[0010] Preferably, the camera module further includes a first connector and a second connector, the first connector being used to electrically connect the circuit on the first circuit board with the external circuit, and the second connector being used to electrically connect the circuit on the second circuit board with the external circuit.

[0011] Preferably, the first connector is connected to the first circuit board via a first flexible connecting strip, and the second connector is connected to the second circuit board via a second flexible connecting strip.

[0012] Preferably, the external circuit has at least one power supply, and the first connector and the second connector are suitable for being electrically connected to the same power supply, or respectively being electrically connected to two power supplies with the same timing.

[0013] Preferably, the first side line of the photosensitive chip includes a first power side line, the second side line includes a second power side line, the first power side line and the line of the first circuit board form a first power line, the second power side line and the line on the second circuit board form a second power line, the length difference between the first power line and the second power line does not exceed ±5%, and / or the first power line and the second power line have the same shape.

[0014] As a preference, it further includes a first main board and a second main board which are independent of each other, wherein the first main board is electrically connected to the first circuit board, and the second main board is electrically connected to the second circuit board, and the first main board and the second main board are suitable for being electrically connected to the external circuit.

[0015] As a preferred embodiment, the first main board includes a first main board electronic component portion, and the second main board includes a second main board electronic component portion.

[0016] A first connection circuit is provided on a side of the first main board close to the first circuit board, and the first circuit board is electrically connected to the first main board through the first connection circuit. A second connection circuit is provided on a side of the second main board close to the second circuit board, and the second circuit board is electrically connected to the second main board through the second connection circuit.

[0017] A first connector is connected to a side of the first mainboard away from the first circuit board, and a second connector is connected to a side of the second mainboard away from the second circuit board. The first mainboard and the second mainboard are adapted to be electrically connected to the external circuit through the first connector and the second connector.

[0018] A circuit loop is formed between the first mainboard electronic component portion and the first connector, so that the first mainboard electronic component portion has the ability to control communication with an external controller.

[0019] As a preferred embodiment, the first main board includes a first main board electronic component portion, and the second main board includes a second main board electronic component portion.

[0020] A first connector is disposed on a side of the first mainboard close to the first circuit board, and the first circuit board is electrically connected to the first mainboard through the first connector. A second connector is disposed on a side of the second mainboard close to the second circuit board, and the second circuit board is electrically connected to the second mainboard through the second connector.

[0021] A controller is also provided on the first mainboard, a circuit loop is formed between the controller and the first mainboard electronic component part, a circuit loop is formed between the first mainboard electronic component part and the first connector, and a control signal line is provided between the first mainboard electronic component part and the first connector.

[0022] As a preferred embodiment, it further includes a lens assembly and a molding part, wherein the molding part supports the lens assembly above the photosensitive chip, and the molding part is formed on the first circuit board and the second circuit board, so that the first circuit board and the second circuit board are connected through the molding part.

[0023] Preferably, the outer contour of the lens assembly is in the shape of an elongated strip, and both side edges of the lens assembly extending along the length direction are straight edges.

[0024] Preferably, the bottom surface of the molding portion is lower than the bottom surface of the photosensitive chip.

[0025] Preferably, the molded portion includes a first convex portion located above the first circuit board, and a second convex portion located above the second circuit board, the first convex portion and the second convex portion are connected by a bridging portion, a light-through hole is formed in the middle of the bridging portion, the light-through hole is arranged corresponding to the photosensitive area of ​​the photosensitive chip to allow the photosensitive area to receive light, the lens assembly is bonded to the bridging portion, and the first convex portion, the second convex portion and the bridging portion are integrally injection molded.

[0026] As a preference, electronic components are encapsulated in the first convex portion and / or the second convex portion; the top surfaces of the first convex portion and the second convex portion are at the same height; and the outer side of the bridging portion is not connected to other structures.

[0027] Preferably, the photosensitive chip is rectangular, and includes a first side, a second side, a third side and a fourth side in sequence, the first side is opposite to the third side, the first side circuit of the photosensitive chip is arranged close to the first side, the second side circuit is arranged close to the third side, the first circuit board is connected to the first side of the photosensitive chip, the second circuit board is connected to the third side of the photosensitive chip, the outer side of the second side and the fourth side is an adjacent area without an electrically conductive circuit, and the molding portion extends to the adjacent area.

[0028] Compared with the prior art, the beneficial effects of this application are:

[0029] (1) After the circuit board of the present application is separated, it can be electrically connected to the external circuit independently to achieve normal power supply and signal transmission of the camera module.

[0030] (2) The circuit board of the present application can further shorten the width of the camera module without affecting the normal operation of the camera module, thereby making a narrower camera module and applying it to more microelectronic product fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram of a photosensitive chip installed on a circuit board in the prior art.

[0032] Figure 2 This is a schematic diagram of an image sensor component according to the first embodiment of the present application.

[0033] Figure 3 This is a schematic diagram of the arrangement of the photosensitive chip, the first circuit board and the second circuit board in the first embodiment of the present application.

[0034] Figure 4 This is a schematic diagram of the arrangement of the photosensitive chip, the first circuit board and the second circuit board in the second embodiment of the present application.

[0035] Figure 5This is a schematic diagram of the arrangement of the photosensitive chip, the first circuit board and the second circuit board in the third embodiment of the present application.

[0036] Figure 6 This is a schematic diagram of the arrangement of a photosensitive chip, a first circuit board and a second circuit board in the fourth embodiment of the present application.

[0037] Figure 7 This is a schematic diagram of the power circuit connection of the photosensitive chip in the first embodiment of the present application.

[0038] Figure 8 This is a schematic diagram of the circuit principle of the photosensitive chip power supply circuit in the first embodiment of the present application.

[0039] Fig. 9 This is a schematic diagram of the power circuit connection of the photosensitive chip in the first embodiment of the present application.

[0040] Fig.10 This is a schematic diagram of the signal connection circuit principle in the first embodiment of the present application.

[0041] Fig.11 This is a specific schematic diagram of the power supply circuit connection of the photosensitive chip in the first embodiment of the present application.

[0042] Fig.12 This is a schematic diagram of the power supply circuit connection of the photosensitive chip in the prior art.

[0043] Fig.13 This is a schematic diagram of an image sensor component according to the fifth embodiment of the present application.

[0044] Fig.14 This is a schematic diagram of an image sensor component according to the sixth embodiment of the present application.

[0045] Fig.15 It is a stereoscopic schematic diagram of an embodiment of the camera module of the present application.

[0046] Fig.16 It is a three-dimensional schematic diagram of the molding part of the camera module in the embodiment of the present application.

[0047] Fig.17 This is a top view of the molding part of the camera module in the embodiment of the present application.

[0048] Fig.18 This is a top view of an embodiment of the camera module of the present application.

[0049] Fig.19 A cross-sectional schematic diagram of an embodiment of the camera module of the present application.

[0050] In the figure:

[0051] 10. Image sensing component;

[0052] 11. First circuit board; 12. Second circuit board;

[0053] 13, photosensitive chip; 131, first side; 1311, first side line; 13111, first power side line; 132, second side; 1322, second side line; 13222, second power side line; 133, third side; 134, fourth side;

[0054] 14. Connecting part;

[0055] 30. External circuit; 31. First power supply circuit; 32. Second power supply circuit;

[0056] 40. Connector; 41. First connector; 411. First power pin; 412. First ground pin; 413. First clock signal pin; 42. Second connector; 421. Second power pin; 422. Second ground pin; 423. Second clock signal pin; 51. First flexible connecting belt; 52. Second flexible connecting belt;

[0057] 71, first main board; 711, first connecting circuit; 712, first main board electronic component portion; 72, second main board; 721, second connecting circuit; 722, second main board electronic component portion;

[0058] 80. Controller;

[0059] 60. lens assembly; 61. lens barrel; 62. first section of the lens barrel; 63. second section of the lens barrel;

[0060] 90, molding part; 91, first convex part; 92, second convex part; 93, bridging part; 931, lens assembly supporting top; 9311, supporting top first side; 9312, supporting top second side; 9313, supporting top third side; 9314, supporting top fourth side; 932, concave part; 933, light hole;

[0061] 100. Reinforcement. DETAILED DESCRIPTION

[0062] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0063] In the description of the present application, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of narrating the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific scope of protection of the present application.

[0064] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0065] The terms "including" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0066] The width direction mentioned in this application refers to the Y-axis direction in the drawings, the length direction refers to the X-axis direction in the drawings, and the height direction refers to the Z-axis direction in the drawings.

[0067] The present application provides a camera module, which includes an image sensor component 10, and the camera module is suitable for being electrically connected to an external circuit 30 to realize power supply and signal transmission for the image sensor component 10. The camera module also includes a lens component 60 disposed on the image sensor component 10, and external light is converged through the lens component 60 and reaches the image sensor component 10, and the image sensor component 10 converts the optical signal into an electrical signal for output.

[0068] like Figure 2 As shown, the image sensor assembly 10 includes a first circuit board 11, a second circuit board 12, and a photosensitive chip 13. The circuits on the first circuit board 11 and the circuits on the second circuit board 12 are independent of each other. The photosensitive chip 13 includes a first side circuit 1311 and a second side circuit 1322. The circuits on the first circuit board 11 are conductively connected to the first side circuit 1311 of the photosensitive chip 13, and the circuits on the second circuit board 12 are conductively connected to the second side circuit 1322 of the photosensitive chip 13. The circuits on the first circuit board 11 and the circuits on the second circuit board 12 are respectively suitable for being electrically connected to the external circuit 30, so that the first circuit board 11, the second circuit board 12, and the photosensitive chip 13 form a loop through the external circuit 30.

[0069] It is worth mentioning that the circuits on the first circuit board 11 and the circuits on the second circuit board 12 are independent of each other, which means that: the circuits on the first circuit board 11 and the circuits on the second circuit board 12 do not form a signal transmission circuit loop; or, the circuits on the first circuit board 11 and the circuits on the second circuit board 12 do not form a power circuit loop; or, the circuits for electrically connecting the first circuit board 11 to the external circuit 30 do not pass through the second circuit board 12, and the circuits for electrically connecting the second circuit board 12 to the external circuit 30 do not pass through the first circuit board 11.

[0070] In the prior art, the circuit board connected to the photosensitive chip is usually an integral circuit board that can form a loop, which makes the design of the circuit board limited by the photosensitive chip and the overall size is difficult to reduce. However, the present application proposes to divide the circuit board connected to the photosensitive chip 13 into two independent circuit boards, and the two independent circuit boards form a loop through the external circuit 30, so it will not affect the normal operation of the photosensitive chip 13, and the two independent circuit boards can increase the design flexibility, which is conducive to reducing the overall size of the circuit board, thereby providing room for improvement for the miniaturization of the camera module.

[0071] Preferably, the circuit on the first circuit board 11 and the circuit on the second circuit board 12 are respectively located on opposite sides of the photosensitive chip 13. That is, the two parts of the circuit are independently arranged on both sides of the photosensitive chip 13, and the two parts of the circuit form a loop through the circuit located outside the camera module, so that the circuit part for electrically connecting the first circuit board 11 and the second circuit board 12 can be omitted in the camera module, which is conducive to reducing the size of the image sensor component 10 and the camera module.

[0072] It is worth mentioning that the conductive connection mentioned in this application refers to the transmission of electrical signals between the two through wires or welding. The circuit board mentioned in this application refers to a circuit board with circuits or capable of achieving electrical connection, such as a PCB circuit board, which can be a rigid board or a flexible board.

[0073] Furthermore, the photosensitive chip 13 is rectangular, and includes a first side 131, a second side 132, a third side 133 and a fourth side 134 in sequence. The first side 131 is opposite to the third side 133, and the second side 132 is opposite to the fourth side 134. The first side line 1311 of the photosensitive chip 13 is arranged close to the first side 131, and the second side line 1322 is arranged close to the third side 133. The first circuit board 11 is connected to the first side 131 of the photosensitive chip 13, and the second circuit board 12 is connected to the third side 133 of the photosensitive chip 13. The outer side of the second side 132 and the fourth side 134 is an adjacent area without an energized line. The adjacent area refers to the area adjacent to the outer side of the second side 132 and the fourth side 134. No structure may be arranged in the adjacent area, or some structures may be arranged. For example, the connection part 14 mentioned below may be arranged in the adjacent area, or the molding part 90 may extend to the adjacent area.

[0074] In some embodiments, the first side 131 and the third side 133 extend along the Y-axis direction, and the second side 132 and the fourth side 134 extend along the X-axis direction.

[0075] In the prior art, in addition to the circuit boards arranged outside the first side 131 and the third side 133 of the photosensitive chip 13, there are also circuit boards arranged outside the second side 132 and the fourth side 134. The circuit boards outside the second side 132 and the fourth side 134 are used to electrically connect the circuit boards located on both sides of the first side 131 and the third side 133 to form a loop. In the present application, the circuit boards arranged outside the second side 132 and the fourth side 134 are eliminated, so the first circuit board 11 and the second circuit board 12 are not directly electrically connected, and the first circuit board 11 and the second circuit board 12 need to be connected through the external circuit 30 to form a circuit loop. By removing the circuit boards outside the second side 132 and the fourth side 134 of the photosensitive chip 13, the present application can reduce the width of the image sensor component 10 to a large extent, thereby facilitating the reduction of the overall width of the camera module.

[0076] In some embodiments, there is no direct physical connection between the first circuit board 11 and the second circuit board 12 of the image sensor assembly 10, that is, there is no direct electrical connection or direct structural connection between the first circuit board 11 and the second circuit board 12, and the two circuit boards are completely independent. Figure 3 Preferably, the width of the first circuit board 11 and the second circuit board 12 does not exceed the width of the photosensitive chip 13, and no other structures are arranged outside the second side 132 and the fourth side 134 of the photosensitive chip 13, that is, the width of the image sensor component 10 is equal to the width of the photosensitive chip 13, thereby minimizing the width of the image sensor component 10, which is conducive to manufacturing a narrow-sized camera module.

[0077] In other embodiments, Figure 4 ,5 As shown in FIG. 6 , the first circuit board 11 is connected to the second circuit board 12 via at least one connecting portion 14, which is disposed outside the second side 132 and / or the fourth side 134 of the photosensitive chip 13. The connecting portion 14 has no circuit and only serves as a mechanical connection. The width of the connecting portion 14 does not exceed 0.15 mm. Figure 4 As shown, the connecting portion 14 may include two, which are respectively arranged outside the second side 132 and the fourth side 134 of the photosensitive chip 13. Figure 5 , 6 As shown, there may be only one connection portion 14, which is arranged outside the second side 132 or the fourth side 134 of the photosensitive chip 13. Since the connection portion 14 only serves as a mechanical connection and not an electrical connection, the size of the connection portion 14 can be small enough, thereby helping to reduce the width of the image sensor assembly 10 and simplifying the installation and positioning of the first circuit board 11 and the second circuit board 12. Preferably, the width of the connection portion 14 is L, and L≤0.15mm.

[0078] It is worth mentioning that the first circuit board 11, the second circuit board 12 and the connecting portion 14 can be manufactured in one piece, or can be manufactured separately and then connected into one piece. When the integrated manufacturing process is adopted, the circuits on the first circuit board 11 and the second circuit board 12 are not connected.

[0079] Furthermore, the camera module further includes a first connector 41 and a second connector 42, wherein the first connector 41 electrically connects the circuit on the first circuit board 11 to the external circuit 30, and the second connector 42 is suitable for electrically connecting the circuit on the second circuit board 12 to the external circuit 30, thereby better realizing the formation of a circuit loop between the first circuit board 11 and the second circuit board 12 and the external circuit 30. It is worth mentioning that the connector is a component used to realize electrical connection or signal transmission, which allows current or signal to be transmitted between different circuit boards without direct welding or hard connection.

[0080] In the existing camera module, the circuit board connected to the photosensitive chip is an integral circuit board, so it can be connected to the external circuit through a connector. In the present application, since the first circuit board 11 and the second circuit board 12 are both partial circuits, two connectors are required to connect the first circuit board 11 and the second circuit board 12 to the external circuit respectively through the two connectors.

[0081] Preferably, the first connector 41 is connected to the first circuit board 11 via a first flexible connection belt 51, and the second connector 42 is connected to the second circuit board 12 via a second flexible connection belt 52. The flexible connection belt has certain flexibility and elasticity, and can provide necessary flexibility during the assembly and use of the camera module to adapt to the complex space inside the camera module.

[0082] In the present application, the circuits of the first circuit board 11 and the circuits of the second circuit board 12 are respectively electrically connected to the first side circuit 1311 and the second side circuit 1322 on the photosensitive chip 13. Therefore, when the photosensitive chip 13 is powered on, it is necessary to ensure that the first side circuit 1311 and the second side circuit 1322 are powered on at the same time to ensure the normal operation of the photosensitive chip 13. Specifically, the external circuit 30 has at least one power supply, and the first connector 41 and the second connector 42 are suitable for being electrically connected to the same power supply, or respectively electrically connected to two power supplies with the same timing, so as to ensure the normal operation of the photosensitive chip 13.

[0083] It is worth mentioning that the above-mentioned "same timing" means that the power supply needs to be operated in the same order and time interval when it is powered on and off to ensure that the voltage change of the power supply is synchronized. In other words, ensure that the phase synchronization of the power supply or the voltage fluctuation range remains consistent. This control with the same timing helps to ensure the normal operation of the photosensitive chip 13 and avoid damage to the photosensitive chip 13 due to power timing errors.

[0084] Furthermore, the first side line 1311 of the photosensitive chip 13 includes a first power side line 13111, and the second side line 1322 includes a second power side line 13222. It is worth mentioning that the first power side line 13111 refers to a part of the line used for power supply and grounding in the first side line 1311, and the first side line 1311 includes a line for outputting other electrical signals in addition to the first power side line 13111. Similarly, the second power side line 13222 refers to a part of the line used for power supply and grounding in the second side line 1322. The first power side line 13111 or the second power side line 13222 may include all the power interfaces and ground interfaces of the photosensitive chip 13, or may include a part of the power interfaces and ground interfaces respectively, and no limitation is made in the application.

[0085] like Figure 7 As shown, the first power side line 13111 and the line of the first circuit board 11 form the first power line 31, and the second power side line 13222 and the line on the second circuit board 12 form the second power line 32. To ensure that the external circuit 30 powers on the two side lines of the photosensitive chip 13 at the same time, it is preferred that the length difference between the first power line 31 and the second power line 32 does not exceed ±5%, thereby ensuring that the input signal of the photosensitive chip 13 has the same source and length, so as to ensure the normal operation of the circuit and help reduce the interference received by the power signal. The length mentioned in this application refers to the length of the current from the power supply to the corresponding power interface on both sides of the photosensitive chip 13, for example, when the distance between the positive pole of the first power side line 13111 and the positive pole of the power supply is equal to the distance between the positive pole of the second power side line 13222 and the positive pole of the power supply.

[0086] Furthermore, the first power supply line 31 and the second power supply line 32 have the same shape, so that the interference to the power supply signal can be eliminated as much as possible in a differential manner to ensure the normal operation of the circuit. It is worth mentioning that in the present application, the same shape of the first power supply line 31 and the second power supply line 32 is not limited to being exactly the same, as long as they are roughly symmetrically distributed, so as to meet the normal operation of the circuit while adapting to some complex circuit layout requirements.

[0087] In some embodiments, Figure 8 As shown, the line on the left side of the figure illustrates the first power line 31, and the line on the right side illustrates the second power line 32, wherein the first power line 31 includes a loop formed by the digital core power supply (DVDD) and the ground line and a loop formed by the digital power supply (DOVDD) and the ground line, and the second power line 32 includes an analog power supply (AVDD) and a loop formed by the ground line. It is worth mentioning that the power PIN and the ground line DGND of the external circuit 30 are respectively connected to the first connector 41 and the second connector 42 at both ends, and the length is kept consistent as much as possible to reduce the difference. The power PIN and the ground line DGND on the two connectors are connected through two circuit boards ( Figure 8 The circuit board is omitted in the figure) and is connected to the power supply and ground of the photosensitive chip 13. When all the power supplies and grounds are connected, the photosensitive chip 13 is powered on and starts to work.

[0088] It is worth mentioning that in Figure 8 In the illustrated embodiment, the lengths and shapes of the lines between the DVDD interface on the photosensitive chip 13 and the DVDD interface of the first connector 41, the lines between the DOVDD interface and the DOVDD interface of the first connector 41, and the lines between the AVDD interface and the VDD interface on the second connector 42 are as similar as possible, and the lengths and shapes of the lines between the DOGND interface on the photosensitive chip 13 and the DGND interfaces on the first connector 41 and the second connector 42 are as similar as possible.

[0089] Furthermore, if Fig. 9As shown, the first connector 41 includes a first power pin 411, a first ground pin 412 and a first clock signal pin 413, the second connector 42 includes a second power pin 421, a second ground pin 422 and a second clock signal pin 423, the lines from the power supply of the external circuit 30 to the first power pin 411 and the second power pin 421 are of equal length, the lines from the power supply of the external circuit 30 to the first ground pin 412 and the second ground pin 422 are of equal length, and the lines from the power supply of the external circuit 30 to the first clock signal pin 413 and the second clock signal pin 423 are of equal length. Ensure that the timing of the power reaching the first connector 41 and the second connector 42 is the same, and the power supply of the first connector 41 and the second connector 42 is synchronized, thereby avoiding the problem of asynchronous reception of signals by the photosensitive chip 13 connected to the first connector 41 and the second connector 42 through the first circuit board 11 and the second circuit board 12.

[0090] Furthermore, the power supply and grounding of the first connector 41 and the second connector 42 are provided by the external circuit 30. The reset signal and DOGND of the external circuit 30 are respectively connected to the first connector 41, and the PIN 17-XSHUTDN (reset signal) and PIN 15-DOGND on the first connector 41 are connected to the corresponding PAD (pad) of the photosensitive chip 13 through the first circuit board 11 to ensure the normal signal transmission of the photosensitive chip 13. Fig.10 shown.

[0091] In one embodiment of the present application, the following pins are arranged in sequence on the first side 131 of the photosensitive chip 13: AGND, XVCLK, FSIN, DOGND, DVDD, MCN, MCP, DOVDD, MDN, MDP, and the pins on the first side 131 are all electrically connected to the circuits of the first circuit board 11; the following pins are arranged in sequence on the third side 133 of the photosensitive chip 13: VN, SDA, SCL, SID, DOGND, TM, XSHUTDN, ATEST, AVDD, AGND, and the pins on the third side 133 are all electrically connected to the circuits of the second circuit board 12.

[0092] Among them, DOVDD is the digital input / output power supply, which provides power for the digital interface circuit to ensure the normal transmission of digital signals and the stability of logic levels; DVDD is the digital core power supply, which provides power for the digital logic circuit to support digital signal processing and control logic; DOGND is the ground line. AVDD is the analog power supply, which provides power for the analog circuit to ensure the accurate processing of analog signals.

[0093] The DOVDD pin, DVDD pin, and DOGND pin on the first side 131 of the photosensitive chip 13 are electrically connected to the DOVDD pin, DVDD pin, and DOGND pin on the first connector 41 through the first circuit board 11, and are electrically connected to the external circuit 30 through the first connector 41. The AVDD pin and DOGND pin on the third side 133 are electrically connected to the AVDD pin and DOGND pin on the second connector 42 through the second circuit board 12, as shown in FIG. Fig.11 As shown (the circuit board is omitted in the figure).

[0094] In contrast, Fig.12 In the prior art shown, while the pins of the photosensitive chip 13 remain unchanged, the DOVDD pin, DVDD pin, AVDD pin and DOGND pin on the photosensitive chip 13 are electrically connected to the DOVDD pin, DVDD pin, AVDD pin and DOGND pin on the connector 40 through an integrated circuit board.

[0095] In some embodiments, Fig.13 , 14 As shown, the camera module of the present application also includes a first main board 71 and a second main board 72 that are independent of each other. The first main board 71 is electrically connected to the first circuit board 11, and the second main board 72 is electrically connected to the second circuit board 12. The first circuit board 11 and the second circuit board 12 are suitable for being electrically connected to the external circuit 30 through the first main board 71 and the second main board 72.

[0096] The first circuit board 11 and the second circuit board 12 have interfaces for communicating with the main boards to which they are connected, such as a GPIO interface, which can be configured as an input or output mode for connecting simple peripherals such as switches and LED lights. Thus, the first circuit board 11 and the second circuit board 12 each have control capabilities, thereby reducing the communication complexity between the first main board 71 and the second main board 72.

[0097] It is worth mentioning that the first main board 71 and the second main board 72 can be used to realize other functions. For example, in a camera module used in a laptop computer, infrared lamps, lighting lamps, light sensors and other devices may be set on the first main board 71 or the second main board 72. In order to drive these devices, corresponding circuits need to be set on the first main board 71 or the second main board 72 to realize the driving of the devices. Specifically, the first main board 71 includes a first main board electronic component part 712, which is used to realize the main functions of the first main board 71, and the second main board 72 includes a second main board electronic component part 722, which is used to realize the main functions of the second main board 72.

[0098] In some embodiments, Fig.13As shown, a first connecting line 711 is provided on a side of the first main board 71 close to the first circuit board 11, and the first circuit board 11 is electrically connected to the first main board 71 through the first connecting line 711. A second connecting line 721 is provided on a side of the second main board 72 close to the second circuit board 12, and the second circuit board 12 is electrically connected to the second main board 72 through the second connecting line 721.

[0099] Preferably, the first main board 71 is connected to a first connector 41 on a side away from the first circuit board 11, and the second main board 72 is connected to a second connector 42 on a side away from the second circuit board 12. The first main board 71 and the second main board 72 are suitable for being electrically connected to the external circuit 30 through the first connector 41 and the second connector 42.

[0100] Preferably, a circuit loop is formed between the first mainboard electronic component part 712 and the first connector 41, so that the first mainboard electronic component part 712 has the ability to control communication with the controller 80. It is worth mentioning that the controller 80 is a part independent of the camera module and the external circuit 30.

[0101] Preferably, the first mainboard electronic component unit 712 and the external controller 80 include commonly used input and output interfaces such as USB, MIPI, GPIO, SPI, etc. For example, the first mainboard electronic component unit 712 can communicate with the controller 80 through the SPI interface, and the controller 80 is suitable for sending data to the first mainboard electronic component unit 712 through the SPI interface to achieve efficient data transmission.

[0102] Preferably, the first circuit board 11 and the first main board 71 can be electrically connected through the first flexible connecting strip 51, or through direct conductive connection, such as lead connection or welding. Similarly, the second circuit board 12 and the second main board 72 can be electrically connected through the second flexible connecting strip 52, or through direct conductive connection.

[0103] In other embodiments, Fig.14 As shown, a first connector 41 is provided on a side of the first mainboard 71 close to the first circuit board 11, and the first circuit board 11 is electrically connected to the first mainboard 71 through the first connector 41. A second connector 42 is provided on a side of the second mainboard 72 close to the second circuit board 12, and the second circuit board 12 is electrically connected to the second mainboard 72 through the second connector 42. A controller 80 is also provided on the first mainboard 71, and a circuit loop is formed between the controller 80 and the first mainboard electronic component part 712, and a circuit loop is formed between the first mainboard electronic component part 712 and the first connector 41. A control signal line is provided between the first mainboard electronic component part 712 and the first connector 41. Since the first mainboard electronic component part 712 of the first mainboard 71 is a complete circuit, it is beneficial to reduce the overall size of the camera module.

[0104] like Figure 15-18 As shown, the X-axis, Y-axis, and Z-axis of the spatial rectangular coordinate system correspond to the width direction, length direction, and height direction of the camera module, respectively. The camera module of the present application also includes a lens assembly 60 and a molding part 90. The molding part 90 supports the lens assembly 60 above the photosensitive chip 13. The molding part 90 is formed on the first circuit board 11 and the second circuit board 12, so that the first circuit board 11 and the second circuit board 12 are connected through the molding part 90, thereby enhancing the packaging strength of the camera module.

[0105] like Fig.16 As shown, the molding part 90 of the present application includes a first protrusion 91 located above the first circuit board 11, and a second protrusion 92 located above the second circuit board 12, and a bridge part 93 is provided between the first protrusion 91 and the second protrusion 92, wherein the bridge part 93 includes a lens assembly support top 931, and the lens assembly support top 931 is used to install and support the lens assembly 60, and the lens assembly 60 can be connected to the lens assembly support top 931 by glue bonding; preferably, the lens assembly support top 931 is in a rectangular ring shape. The middle part of the lens assembly support top 931 is recessed downward to form a lower concave part 932, and the lower concave part 932 has a height difference with the lens assembly support top 931, and the lower concave part 932 is used to install a filter (not shown in the figure), and the filter can be connected to the lower concave part 932 by glue bonding; the lower concave part 932 can be in a rectangular ring shape, or it can be two ends set at intervals. A light hole 933 is formed in the middle of the lower recess 932 , and the light hole 933 is arranged corresponding to the photosensitive area of ​​the photosensitive chip 13 to ensure that light is efficiently irradiated to the photosensitive area of ​​the photosensitive chip 13 .

[0106] Preferably, the first convex portion 91, the second convex portion 92 and the bridge portion 93 are integrally injection molded. The first convex portion 91 and / or the second convex portion 92 can be used as an injection port or an overflow port for the molten material during transfer molding. Preferably, the first convex portion 91 is used as an injection port during transfer molding. After the molten material is injected from the first convex portion 91, it flows along the multi-step single-direction molding portion 90 structure to the bridge portion 93 and the second convex portion 92, and then overflows from the overflow port of the second convex portion 92 to complete the injection molding. This injection molding method can ensure uniform filling of the molten material and reduce molding defects.

[0107] Preferably, the top surface heights of the first protrusion 91 and the second protrusion 92 are the same, so that both ends of the molded part 90 have the same supporting function, reducing deformation of the molded part 90 during use, especially when subjected to heavy objects or external pressure, and being able to better maintain its shape and function.

[0108] like Fig.17 , 18As shown, the lens assembly support top 931 includes a first support top edge 9311, a second support top edge 9312, a third support top edge 9313, and a fourth support top edge 9314. Since the upper surface width of the bridge portion 93 of the camera module of the present application is extremely shortened along the Y-axis direction with the circuit board, that is, the width of the lens assembly support top 931 close to the second support top edge 9312 and the fourth support top edge 9314 is extremely shortened, the bracket of the lens assembly 60 in the original camera module loses its support point. Therefore, the lens assembly 60 in the camera module of the present application is bonded to the lens assembly support top 931 of the molding portion 90 by glue, thereby reducing the overall width of the camera module along the Y-axis direction.

[0109] Preferably, the outer contour of the lens assembly 60 is in the shape of an elongated strip, and the two sides of the lens assembly 60 extending in the length direction are straight sides, and the distance between the two sides is consistent with the width of the image sensor assembly 10. In the prior art, the lens assembly is usually cylindrical. In the present application, if the cylindrical lens assembly 60 is still used, it means that the size of the lens should be reduced, which is not conducive to imaging. Based on this, the present application proposes to cut off the edge of the lens assembly 60. Since the edge of the lens assembly 60 is mainly the lens barrel 61 that plays a supporting role, part of the lens barrel 61 structure is cut off to adapt to the image sensor assembly 10 with a reduced width, and at the same time, the size of the lens is not reduced. The first cut surface 62 and the second cut surface 63 of the lens barrel after cutting are flush with the second edge 9312 of the support top and the fourth edge 9314 of the support top along the Z-axis direction, that is, the central axis length of the lens barrel 61 along the X-axis direction needs to be longer than the central axis along the Y-axis direction, so that the dimensions of the lens assembly 60, the molding part 90 and the circuit board along the Y-axis direction are kept consistent, thereby achieving the limit reduction of the overall size of the camera module.

[0110] Furthermore, the first protrusion 91 can be set as a packaging layer for encapsulating electronic components on the first circuit board 11, and the second protrusion 92 can be set as a packaging layer for encapsulating electronic components on the second circuit board 12, so that the molding part 90 has the function of encapsulating and protecting the electronic components on the circuit board.

[0111] Furthermore, the bottom surface of the molding part 90 is lower than the bottom surface of the photosensitive chip 13, so that the bottom surface of the molding part 90 is the lowest in the entire camera module, and can provide a flat and stable support, so as to facilitate installation or collision prevention.

[0112] Furthermore, the camera module of the present application installs a photosensitive chip 13 below the light hole 933 formed in the middle of the bridge portion 93, and the photosensitive chip 13 is received in the interior of the molding portion 90. The photosensitive chip 13 is wrapped in the molding portion 90, and the first side 131, the second side 132, the third side 133 and the fourth side 134 of the photosensitive chip 13 are outside the injection-molded bridge portion 93. The first circuit board 11, the second circuit board 12 and the photosensitive chip 13 are connected via the injection-molded bridge portion 93, so that the molding portion 90 can protect the photosensitive chip 13.

[0113] Furthermore, the first circuit board 11 and the second circuit board 12 are produced in a panelized form, and the bottom needs to be connected by a reinforcing member 100, so that the positions of the first circuit board 11 and the second circuit board 12 can be kept accurate during the circulation and injection molding of the molding part 90. In addition, since there is no circuit board filling in the middle of the molding part 90, the reinforcing member 100 needs to be extended for a section during the injection molding, and then cut and removed after the injection molding is completed.

[0114] Furthermore, the first circuit board 11 and the second circuit board 12 are connected via the bridge portion 93, thereby enhancing the integral strength of the split circuit board after molding.

[0115] Specifically, the second side 9312 of the support top and the fourth side 9314 of the support top extend downward to the outside of the second side 132 and the fourth side 134 of the photosensitive chip 13, thereby protecting the photosensitive chip 13. The second side 9312 of the support top and the fourth side 9314 of the support top extend toward the photosensitive chip 13 to form the outer side surface of the bridge portion 93.

[0116] In some embodiments, the second support top side 9312 and the fourth support top side 9314 do not extend to the outside of the first circuit board 11 and the second circuit board 12, and the outside of the first circuit board 11 and the second circuit board 12 are flush with the outer side of the bridge portion 93 to ensure that the overall width is minimized while fully utilizing the space. In this embodiment, the width of the first circuit board 11 and the second circuit board 12 is greater than the width of the photosensitive chip 13.

[0117] In some other embodiments, the outer side surface of the bridge portion 93 protrudes from the outer sides of the first circuit board 11 and the second circuit board 12.

[0118] At this time, the outer wall of the bridging portion 93 can serve as the supporting end of the camera module of the present application, and by utilizing its own high strength characteristics, it can first abut against the inside of the frame of the mobile phone or laptop computer, thereby preventing the first circuit board 11 and the second circuit board 12 from being easily deformed when abutting against the inside of the frame of the mobile phone or laptop computer.

[0119] Furthermore, the outer side of the bridge portion 93 is not connected to other structures, that is, the injection port and the overflow port are not set on the outer side of the bridge portion 93, so as to avoid the injection port and the overflow port increasing the width dimension of the molding portion 90 along the Y-axis direction and reducing the overall size of the camera module. In addition, in the camera module of the present application, the outer side surface of the bridge portion 93 and the side surface of the circuit board are flush along the Z-axis direction, and the outer surface of the bridge portion 93 is not connected to any other structure, which can also avoid the problem that other structures on the outer surface of the bridge portion 93 apply pressure to the bridge portion 93 when installing the camera module, causing deformation of the circuit board.

[0120] Furthermore, the IR (infrared filter) and the lens assembly 60 are installed in an integrated manner in the camera module of the present application. Since the width of the upper surface of the bridge portion 93 is shortened along the Y-axis direction as the circuit board is extremely shortened during the injection molding process of the camera module of the present application, the internal space of the molding portion 90 is only sufficient to realize the AA (active calibration) of the camera module, so there is no bonding space for the IR (infrared filter), and the space is small, and there is no space for EMC (electromagnetic compatibility) to make a step, so the IR and the lens assembly 60 are set to be integrated.

[0121] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and the specification only describe the principles of the present application. The present application may have various changes and improvements without departing from the spirit and scope of the present application, and these changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the attached claims and their equivalents.

Claims

1. A camera module, comprising an image sensor component, wherein the camera module is suitable for being electrically connected to an external circuit to realize power supply and signal transmission for the image sensor component, characterized in that: The image sensing component includes a first circuit board, a second circuit board and a photosensitive chip. The circuits on the first circuit board are independent of the circuits on the second circuit board. The photosensitive chip includes a first side circuit and a second side circuit. The circuits on the first circuit board are conductively connected to the first side circuit of the photosensitive chip, and the circuits on the second circuit board are conductively connected to the second side circuit of the photosensitive chip. The circuits on the first circuit board and the circuits on the second circuit board are respectively suitable for being electrically connected to the external circuit.

2. The camera module according to claim 1, characterized in that: The circuits on the first circuit board and the circuits on the second circuit board are respectively located on two opposite sides of the photosensitive chip.

3. The camera module according to claim 1, characterized in that: The photosensitive chip is rectangular, and includes a first side, a second side, a third side and a fourth side in sequence. The first side is opposite to the third side. The first side circuit of the photosensitive chip is arranged close to the first side, and the second side circuit is arranged close to the third side. The first circuit board is connected to the first side of the photosensitive chip, and the second circuit board is connected to the third side of the photosensitive chip. The outer sides of the second side and the fourth side are adjacent areas without electrical circuits.

4. The camera module according to claim 3, characterized in that: The first circuit board is connected to the second circuit board through at least one connecting portion, and the connecting portion is arranged on the outside of the second side and / or the fourth side of the photosensitive chip. The connecting portion is not provided with a signal transmission line or a power line, and the width of the connecting portion does not exceed 0.15 mm.

5. The camera module according to any one of claims 1 to 4, characterized in that: The camera module also includes a first connector and a second connector, the first connector is used to electrically connect the circuit on the first circuit board with the external circuit, and the second connector is used to electrically connect the circuit on the second circuit board with the external circuit.

6. The camera module according to claim 5, characterized in that: The first connector is connected to the first circuit board via a first flexible connection belt, and the second connector is connected to the second circuit board via a second flexible connection belt.

7. The camera module according to claim 5, characterized in that: The external circuit has at least one power source, and the first connector and the second connector are suitable for being electrically connected to the same power source, or respectively being electrically connected to two power sources with the same timing.

8. The camera module according to claim 7, characterized in that: The first side line of the photosensitive chip includes a first power side line, and the second side line includes a second power side line. The first power side line and the line on the first circuit board form a first power line, and the second power side line and the line on the second circuit board form a second power line. The length difference between the first power line and the second power line does not exceed ±5%, and / or the first power line and the second power line have the same shape.

9. The camera module according to any one of claims 1 to 4, characterized in that: It also includes a first main board and a second main board that are independent of each other, the first main board is electrically connected to the first circuit board, the second main board is electrically connected to the second circuit board, and the first main board and the second main board are suitable for being electrically connected to the external circuit.

10. The camera module according to claim 9, characterized in that: The first main board includes a first main board electronic component portion, and the second main board includes a second main board electronic component portion. A first connection circuit is provided on a side of the first main board close to the first circuit board, and the first circuit board is electrically connected to the first main board through the first connection circuit. A second connection circuit is provided on a side of the second main board close to the second circuit board, and the second circuit board is electrically connected to the second main board through the second connection circuit. A first connector is connected to a side of the first mainboard away from the first circuit board, and a second connector is connected to a side of the second mainboard away from the second circuit board. The first mainboard and the second mainboard are adapted to be electrically connected to the external circuit through the first connector and the second connector. A circuit loop is formed between the first mainboard electronic component portion and the first connector, so that the first mainboard electronic component portion has the ability to control communication with an external controller.

11. The camera module according to claim 9, characterized in that: The first main board includes a first main board electronic component portion, and the second main board includes a second main board electronic component portion. A first connector is disposed on a side of the first mainboard close to the first circuit board, and the first circuit board is electrically connected to the first mainboard through the first connector. A second connector is disposed on a side of the second mainboard close to the second circuit board, and the second circuit board is electrically connected to the second mainboard through the second connector. A controller is also provided on the first mainboard, a circuit loop is formed between the controller and the first mainboard electronic component part, a circuit loop is formed between the first mainboard electronic component part and the first connector, and a control signal line is provided between the first mainboard electronic component part and the first connector.

12. The camera module according to any one of claims 1 to 4, characterized in that: It also includes a lens assembly and a molding part, wherein the molding part supports the lens assembly above the photosensitive chip, and the molding part is formed on the first circuit board and the second circuit board, so that the first circuit board and the second circuit board are connected through the molding part.

13. The camera module according to claim 12, characterized in that: The outer contour of the lens assembly is in the shape of an elongated strip, and two side edges of the lens assembly extending along the length direction are straight edges.

14. The camera module according to claim 12, characterized in that: The bottom surface of the molding part is lower than the bottom surface of the photosensitive chip.

15. The camera module according to claim 12, characterized in that: The molding portion includes a first protrusion located above the first circuit board, and a second protrusion located above the second circuit board. The first protrusion and the second protrusion are connected by a bridging portion. A light-through hole is formed in the middle of the bridging portion. The light-through hole is arranged corresponding to the photosensitive area of ​​the photosensitive chip to allow the photosensitive area to receive light. The lens assembly is bonded to the bridging portion, and the first protrusion, the second protrusion and the bridging portion are integrally injection molded.

16. The camera module according to claim 15, characterized in that: Electronic components are encapsulated in the first convex portion and / or the second convex portion; the top surfaces of the first convex portion and the second convex portion have the same height; and the outer side of the bridge portion is not connected to other structures.

17. The camera module according to claim 12, characterized in that: The photosensitive chip is rectangular, and includes a first side, a second side, a third side and a fourth side in sequence. The first side is opposite to the third side. The first side circuit of the photosensitive chip is arranged close to the first side, and the second side circuit is arranged close to the third side. The first circuit board is connected to the first side of the photosensitive chip, and the second circuit board is connected to the third side of the photosensitive chip. The outer sides of the second side and the fourth side are an adjacent area without an energized circuit. The molded portion extends to the adjoining region.

Images