Method for processing ceramic heating plate for semiconductor equipment by adopting intaglio processing

Abstract

The invention relates to the field of ceramic heating plate processing methods, in particular to a ceramic heating plate processing method used for semiconductor equipment and adopting intaglio processing, which comprises the following steps: step 1, designing before processing; secondly, a groove pattern template is manufactured; thirdly, the metal wire heating body is embedded into the groove; the heating body is inserted into the intaglio pattern, the position of the electric heating wire can be fixed, the electric heating wire is prevented from deforming or moving in the heating process, the metal-wire-shaped heating body is placed in the intaglio space of the intaglio ceramic heating disc, and due to the fact that the sectional area of the metal-wire-shaped heating body is kept consistent, the heating effect is good. According to the heating disc, the temperature deviation can be reduced to the minimum during heating, so that uniform heating of the heating disc is realized, a relatively simple and convenient manner of intaglio processing and metal wire insertion is adopted, the production cost is greatly reduced, the investment burden of equipment is reduced, and the structural strength and durability are improved by adopting the heating body in a metal wire form.

Description

Technical Field

[0001] The invention relates to the field of ceramic heating disk processing methods, in particular to a ceramic heating disk processing method for semiconductor equipment using intaglio processing. Background Art

[0002] Existing heaters for heating wafers mounted on semiconductor lithography process track equipment use heating wires with specific patterns in order to evenly heat the entire surface of the wafer, and divide the heating area into different blocks according to the required number. In the existing technology, heaters using ALN (aluminum nitride) materials are made by arranging heating elements (such as molybdenum or tungsten coils) and grounding patterns in ceramic powder, and then using a high-temperature and high-pressure sintering process. During this process, due to the high temperature and high pressure, the positions of the heating elements and the grounding patterns may change, making it difficult to maintain the temperature uniformity of the heater.

[0003] In addition, the existing ceramic heaters made by screen printing will inevitably produce thickness differences at the starting point and the ending point during the printing process. This thickness difference will cause uneven temperature when the heating element is heated, making it difficult to achieve uniform heating.

[0004] In addition, the method of manufacturing the heating element and the grounding pattern by metal electroplating followed by photolithography and etching processes requires expensive equipment and a complicated production process, resulting in very high production costs and difficulty in large-scale commercialization.

[0005] Therefore, in order to address the problems of changes in the position of the heating element and uneven temperature due to thickness differences in the above-mentioned traditional sintering or screen printing methods, as well as the high costs caused by the photolithography and etching processes, a ceramic heating plate processing method using intaglio processing can be designed for semiconductor equipment. Summary of the invention

[0006] In order to solve the problems of the change of the heating element position and the uneven temperature caused by thickness difference in the traditional sintering processing method or screen printing method, as well as the high cost caused by the photolithography and etching process.

[0007] The technical solution of the present invention is: a method for processing a ceramic heating plate for semiconductor equipment using intaglio processing, comprising the following contents:

[0008] Step 1: According to the processing requirements of the ceramic heating plate, design the size, shape, position of the engraved groove and the layout of the metal wire heating element;

[0009] Step 2: Make a groove pattern template, fix the template on the upper end of the ceramic heating plate, and carve a groove of a specific shape and depth on the surface of the ceramic heating plate by engraving;

[0010] Step 3: Clear the debris in the groove and embed the metal wire heating element into the groove carved on the ceramic heating plate according to the requirements of the design drawing.

[0011] Preferably, a heating wire in the form of a metal wire is fixed in a pattern below the engraved heating plate, and a constant current is supplied to the heating wire through electrical connection, thereby achieving temperature regulation.

[0012] Preferably, the engraving process in step 2 is performed by one of laser processing, mechanical processing and chemical processing.

[0013] Preferably, the layout of the metal wire heating element in step one is spiral, straight or zigzag.

[0014] Preferably, in order to make the temperature of each area uniform, the heater adopts a current control method using the resistance characteristics of the heating wire and real-time feedback control using a temperature sensor.

[0015] Preferably, in step three, the metal wire heating element is fixed in the groove engraved in the ceramic heating plate by using an adhesive or a physical clamping method.

[0016] Preferably, the ceramic heating plate has an operating temperature range of 50°C to 800°C.

[0017] Beneficial effects of the present invention:

[0018] Compared with these prior arts, the present invention has the unique feature of arranging the heating element by engraving. By inserting the heating element into the engraved pattern, the position of the heating wire can be fixed, thereby preventing the heating wire from being deformed or moved during the heating process, solving the problem of uneven temperature, improving cost-effectiveness and enhancing processing accuracy.

[0019] The prior art mainly focuses on heating by embedding or screen printing the heating element, while the present invention uses precise engraving to accurately arrange the heating element in the form of a metal wire at a specific position, thereby improving the performance of the wafer heating device;

[0020] The present invention improves the problems existing in the sintering processing method or screen printing method of the existing ALN ceramic heater, and also reduces the production cost by applying a simple intaglio processing and metal wire insertion method, thereby solving the high cost problem generated in the existing photolithography and etching process;

[0021] The present invention has the guarantee of temperature uniformity: by solving the problem of position variation and thickness deviation of the heating element in the traditional sintering process or printing method, a heating element in the form of a metal wire is placed in the space processed by intaglio processing. Since its cross-sectional area remains consistent, the temperature deviation can be minimized during heating, thereby achieving uniform heating of the heating plate;

[0022] The present invention improves the efficiency of the manufacturing process: it no longer requires high-cost and complex manufacturing processes such as metal electroplating, photolithography and etching, but adopts a relatively simple method of intaglio processing and metal wire insertion. This method greatly reduces production costs and equipment investment burdens, and is more suitable for large-scale commercial production, with economic advantages;

[0023] The present invention has improved technical stability and reliability: the heating element in the form of a metal wire has improved structural strength and durability, and can better resist physical deformation or thermal stress that may occur during the heating process, thereby extending the service life of the heater and reducing maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 The figure shows the state of the heating plate before processing in the ceramic heating plate processing method of the present invention;

[0025] Figure 2 The figure shows the state of the heating plate after the ceramic heating plate processing method of the present invention is processed without the heating element being arranged;

[0026] Figure 3 The diagram shows the state of the heating element in the form of a metal wire after being inserted into the processed engraved pattern in the ceramic heating plate processing method of the present invention. DETAILED DESCRIPTION

[0027] The present invention will be further described below in conjunction with the embodiments.

[0028] See also Figure 1-3 The present invention provides an embodiment: a method for processing a ceramic heating plate for semiconductor equipment using intaglio processing, characterized in that it includes the following contents:

[0029] Step 1: According to the processing requirements of the ceramic heating plate, design the size, shape, position of the engraved groove and the layout of the metal wire heating element;

[0030] Step 2: Make a groove pattern template, fix the template on the upper end of the ceramic heating plate, and carve a groove of a specific shape and depth on the surface of the ceramic heating plate by engraving;

[0031] Step 3: Clear the debris in the groove and embed the metal wire heating element into the groove carved on the ceramic heating plate according to the requirements of the design drawing.

[0032] The ceramic heating plate for semiconductor equipment using intaglio processing is manufactured by the above embodiment, and the heating element is fixed by inserting a heating wire in the form of a metal wire into the intaglio processing pattern, so that the position of the heating wire can be maintained more accurately, and the problem of uneven temperature caused by physical deformation or position change can be avoided during the heating process. Compared with the traditional sintering process, the present invention overcomes the problem of position movement of the heating element during the process, thereby achieving more stable temperature control;

[0033] At the same time, the ceramic heating plate uses metal wires with uniform cross-sectional areas, which can more accurately control the cross-sectional area of ​​the heating wire, thereby making the current distribution more uniform. Through this design, uniform heating can be achieved on the surface of the ceramic heating plate, which is particularly suitable for the requirements of temperature uniformity in high-precision semiconductor processes;

[0034] Moreover, the arrangement pattern and material of the heating wire of the ceramic heating plate can be designed in various ways according to needs, and are not restricted by specific patterns or materials. This flexibility allows for optimized design according to different ceramic heating plate sizes and heating requirements, thereby expanding the application range of the ceramic heating plate.

[0035] Figure 1 The heating plate is shown in the state before processing. In this state, the surface of the heater is flat and the pattern for inserting the heating element has not yet been formed;

[0036] Figure 2 A diagram showing the state of the heating plate after the heating element is not placed. In this state, the surface of the heating plate is engraved mechanically or by laser to form a pattern for the placement of the heating element. These engraved patterns are designed to ensure that the heating element can be accurately fixed in a specific position. The depth and shape of the pattern are adjusted according to the design of the heating plate and the characteristics of the heating element;

[0037] Figure 3 A diagram showing the state of a heating element in the form of a metal wire being inserted into a processed intaglio pattern. The heating element is usually a metal wire such as a nickel-chromium wire, which is precisely positioned in the intaglio pattern to achieve optimal heat conduction efficiency. By embedding the heating element into the intaglio pattern, it can ensure that heat is evenly transferred to each area, preventing temperature unevenness caused by changes in the position or deformation of the heating element during heating;

[0038] In summary, Figure 1-Figure 3 The processing steps of the heater and the insertion process of the heating element are presented in a sequential manner, and the characteristics of the processing method proposed by the present invention are intuitively explained.

Claims

1. A method for processing a ceramic heating plate for semiconductor equipment using intaglio processing, characterized in that: It includes the following: Step 1: According to the processing requirements of the ceramic heating plate, design the size, shape, position of the engraved groove and the layout of the metal wire heating element; Step 2: Make a groove pattern template, fix the template on the upper end of the ceramic heating plate, and carve a groove of a specific shape and depth on the surface of the ceramic heating plate by engraving; Step 3: Clear the debris in the groove and embed the metal wire heating element into the groove carved on the ceramic heating plate according to the requirements of the design drawing.

2. The method for processing a ceramic heating plate for semiconductor equipment using intaglio processing according to claim 1, characterized in that: The heating filaments in the form of metal wires are fixed in a pattern below the engraved heating plate, and a constant current is supplied to the heating filaments through electrical connections, thereby achieving temperature regulation.

3. The method for processing a ceramic heating plate for semiconductor equipment using intaglio processing according to claim 1, characterized in that: In step 2, the engraving process is performed by using one of laser processing, mechanical processing, and chemical processing.

4. The method for processing a ceramic heating plate for semiconductor equipment using intaglio processing according to claim 1, characterized in that: In step 1, the layout of the metal wire heating element adopts one of spiral, straight line and zigzag shapes.

5. The method for processing a ceramic heating plate for semiconductor equipment using intaglio processing according to claim 1, characterized in that: In order to make the temperature of each area uniform, the heater adopts a current control method using the resistance characteristics of the heating wire and real-time feedback control using a temperature sensor.

6. The method for processing a ceramic heating plate for semiconductor equipment using intaglio processing according to claim 1, characterized in that: In step 3, the metal wire heating element is fixed in the groove carved out of the ceramic heating plate by using an adhesive or a physical clamping method.

7. The method for processing a ceramic heating plate for semiconductor equipment using intaglio processing according to claim 1, characterized in that: The ceramic heating plate has an operating temperature range of 50°C to 800°C.

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