A copper filling device for PCB circuit board and a method thereof

Abstract

The application discloses a copper-filling device for PCB (Printed Circuit Board) and a method thereof. The device comprises a copper cylinder, the top of which is provided with an electroplating groove for copper filling; a floating platform is arranged in the electroplating groove, and a placing opening for placing the PCB is formed in one side of the floating platform; and a bubble-removing assembly is connected to the placing opening. The application relates to the field of PCB. The copper-filling device for PCB and the method thereof can make the PCB horizontally sink into the electrolytic tank, so that the electrolyte can infiltrate the outer wall of the PCB and climb along the pore wall of the micropore to squeeze out the air in the micropore, thereby achieving the effect of removing bubbles. Meanwhile, the pressure generated when the PCB is in contact with the copper-containing electrolyte can drive the vibration platform to move upwards, so that the vibration block can vibrate, the PCB can vibrate during the upward movement, the liquid tension on the surface of the PCB can be changed, the stress condition of the bubbles can be changed, the effect of shaking off the bubbles can be achieved, and the bubble-removing effect can be further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PCB circuit board, in particular to a PCB circuit board copper filling device and method thereof. BACKGROUND

[0002] PCB is a support for electronic components and a carrier for electrical connections between electronic components. PCB is widely used in electronic devices, from household appliances to high-tech devices, and the manufacturing and design of PCB are crucial in the electronics industry.

[0003] In PCB design, via holes are important components that connect different circuit layers. Via holes allow electrical signals to pass between different layers of the circuit board and are key to implementing multi-layer PCB design. However, simply opening via holes cannot connect different layers, so copper needs to be filled on the surface of the PCB circuit board to make the conductivity of the via holes better, reduce resistance, and improve current conduction efficiency.

[0004] Copper filling is a common process in the manufacturing of printed PCBs, mainly used to improve the electrical performance, thermal management, and mechanical strength of the circuit board, which can significantly improve electrical performance and heat dissipation capacity, and is suitable for a variety of application scenarios.

[0005] In the prior art, copper filling refers to injecting copper material into certain areas of the PCB (such as blind holes, through holes, or specific circuit areas) to fill the voids in these areas, thereby forming better electrical connections and heat dissipation performance. However, the openings on the PCB circuit board are relatively small, which causes the PCB circuit board to sink into the electroplating tank. Due to the relatively strong surface tension of the liquid in the small holes, the surface tension makes it difficult for the bubbles to break through the hole wall and escape, resulting in poor copper filling effect of the holes on the PCB circuit board.

[0006] Therefore, the present application provides a PCB circuit board copper filling device and method to solve the problems raised in the background art. SUMMARY

[0007] The present application aims to provide a PCB circuit board copper filling device and method to solve the problems raised in the background art.

[0008] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0009] According to one aspect of the application, a PCB circuit board copper filling device is provided.

[0010] The PCB circuit board copper filling device includes a copper cylinder having an electroplating tank at the top for copper filling.

[0011] A floating platform is arranged in the electroplating tank, one side of the floating platform is concave to form a placing opening for placing the PCB circuit board, and a bubble removing assembly is connected in the placing opening;

[0012] A power unit is connected to the top of the copper cylinder and connected to the floating platform through a connecting block;

[0013] The bubble removing assembly comprises a clamping sleeve, a vibrating table and a vibrating block, the inner wall of the placing opening is concave to form a vibrating groove, and the vibrating table is slidably connected in the vibrating groove;

[0014] One side of the vibrating table in the placing opening is provided with a notch, and a clamping sleeve for clamping the PCB circuit board is fixedly connected in the notch;

[0015] One side wall of the vibrating table is provided with a sliding groove, a sliding block is slidably connected in the sliding groove, a spring is fixedly connected between the sliding block and the sliding groove, and the vibrating block is fixedly connected to one side of the sliding block extending out of the sliding groove;

[0016] The bottom of the vibrating table is concave to form a positioning groove, and a guide block is slidably connected to the bottom of the positioning groove, and the bottom of the guide block is fixedly connected to the inner wall of the vibrating groove.

[0017] Further, one side wall of the vibrating groove close to the vibrating block gradually approaches the vibrating block from bottom to top to form an inclined surface, and the side of the vibrating block close to the inclined surface is processed with an inclined angle parallel to the inclined surface, and the inclined angle and the inclined surface are both provided with a plurality of protrusions for vibration from bottom to top.

[0018] Further, a plurality of through holes are provided in the length direction of the top of the guide block, the through holes extend downward and penetrate the floating platform, a jet hole is provided in the outer wall of the vibrating table and communicates with the through hole, and a one-way valve is fixedly connected to the opening of the jet hole and the bottom opening of the through hole.

[0019] Further, the end of the jet hole away from the through hole gradually inclines upward, so that the axis of the jet hole has an inclination angle with the horizontal plane.

[0020] Further, the floating platform, the vibrating table and the clamping sleeve are all in the shape of a Chinese character.

[0021] Further, the inner wall of the clamping sleeve is concave to form a clamping groove for clamping the PCB circuit board, and the depth of the clamping groove is greater than the width of the PCB circuit board.

[0022] Further, the power unit comprises a motor and a lead screw, the top of the copper cylinder is fixedly connected with a support frame, one side of the support frame close to the electroplating tank is provided with a track groove, and the bottom of the track groove extends downward into the electroplating tank;

[0023] A screw rod is rotatably connected in the track groove, the connecting block is threadedly connected on the screw rod, the top of the support frame is fixedly connected with a motor, the output shaft of the motor extends into the track groove and is fixedly connected with the screw rod.

[0024] According to another aspect of the present application, a PCB copper filling method is provided for the PCB copper filling device.

[0025] The PCB copper filling method comprises the following steps:

[0026] S101, inserting the PCB into the clamping groove;

[0027] S102, sinking the PCB into the electroplating tank by the power unit;

[0028] S103, vibrating the PCB after being contacted with the electroplating solution to shake off the air bubbles in the micro-holes;

[0029] S104, completely sinking the PCB into the electroplating tank, resetting the air bubble removing assembly, vibrating the PCB again to remove the air bubbles, and spraying water flow to flush the PCB;

[0030] S105, completing the copper filling of the PCB, and reversing the power unit to lift the PCB out of the electroplating tank.

[0031] Compared with the prior art, the present application has the following beneficial effects:

[0032] 1. The PCB copper filling device can make the PCB horizontally sink into the electrolytic tank by the air bubble removing assembly, so that the electrolyte wets the outer wall of the PCB and climbs along the hole wall of the micro-hole to squeeze out the air in the micro-hole, thereby achieving the effect of removing air bubbles, and the pressure generated when the PCB is contacted with the copper-containing electrolyte drives the vibration table to move upwards, so that the vibration block vibrates, the PCB vibrates during the upward movement, the liquid tension on the surface of the PCB is changed, the stress condition of the air bubbles is changed, the effect of shaking off the air bubbles is achieved, and the air bubble removing effect is further improved.

[0033] 2.The copper filling device for PCB circuit board, through the guide block, the vibration table can be moved up and down, the vibration table is moved up and down more stably, the vibration effect is ensured, the bubble removing is more stable, the through hole is arranged on the guide block, the jet flow hole is arranged on the outer wall of the vibration table and communicated with the through hole, the one-way valve is arranged at the bottom of the through hole and the opening of the jet flow hole, when the vibration table is forced to move up, the gap between the positioning groove and the guide block is increased, the negative pressure is generated, then the negative pressure in the through hole is increased, the one-way valve at the bottom of the through hole is opened, then the electrolyte is sucked into the through hole and the gap, when the vibration table is reset, the gap is reduced, the electrolyte in the gap is pressed, the one-way valve at the jet flow hole is opened, the electrolyte is sprayed out through the jet flow hole, the lower surface of the PCB circuit board is flushed by the jet flow, the stress distribution of the lower surface of the PCB circuit board is disturbed, the stress of the bubble in the micro hole is destroyed, and the bubble removing effect is further enhanced.

[0034] 3.The copper filling method for PCB circuit board, through the method, the copper filling process of the PCB circuit board is optimized, the bubble in the micro hole is automatically cleaned in the copper filling process, the copper-containing electrolyte can completely cover the surface of the PCB circuit board, the operation difficulty of the PCB circuit board in the copper filling process is reduced, the copper filling efficiency of the PCB circuit board is effectively improved, and the production efficiency of the PCB circuit board is improved. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0036] Figure 1 It is a structure schematic view of a copper filling device for PCB circuit board according to an embodiment of the present application.

[0037] Figure 2 It is a structure schematic view of a copper filling device for PCB circuit board according to an embodiment of the present application.

[0038] Figure 3 It is a structure schematic view of a floating table in a copper filling device for PCB circuit board according to an embodiment of the present application.

[0039] Figure 4 It is a structure schematic view of a bubble removing assembly in a copper filling device for PCB circuit board according to an embodiment of the present application.

[0040] Figure 5It is a structural schematic view of the de-bubble assembly moving up in a PCB copper filling device according to the embodiment of the application;

[0041] Figure 6 It is an internal structural schematic view of the de-bubble assembly in a PCB copper filling device according to the embodiment of the application;

[0042] Figure 7 It is a flow chart of a PCB copper filling method according to the embodiment of the application.

[0043] Reference signs:

[0044] 1, copper cylinder; 2, floating table; 3, power unit; 31, motor; 32, screw rod; 4, electroplating tank; 5, placing opening; 6, de-bubble assembly; 61, clamping sleeve; 62, vibrating table; 63, vibrating block; 7, connecting block; 8, vibrating groove; 9, notch; 10, sliding groove; 11, sliding block; 12, positioning groove; 13, guide block; 14, inclined surface; 15, bevel; 16, through hole; 17, jet hole; 18, one-way valve; 19, clamping groove; 20, support frame; 21, track groove. DETAILED DESCRIPTION

[0045] In the following, the application is further described in conjunction with the drawings and the specific embodiments: Embodiment one:

[0046] According to one aspect of the application, a PCB copper filling device is provided.

[0047] Reference Figure 1 - Figure 6 The disclosed PCB copper filling device comprises a copper cylinder 1 having an electroplating tank 4 at the top for copper filling;

[0048] A floating table 2 is arranged in the electroplating tank 4, and one side of the floating table 2 is recessed to form a placing opening 5 for placing a PCB circuit board, and the placing opening 5 is connected with a de-bubble assembly 6;

[0049] A power unit 3 is connected to the top of the copper cylinder 1 and connected with the floating table 2 through a connecting block 7;

[0050] The de-bubble assembly 6 comprises a clamping sleeve 61, a vibrating table 62 and a vibrating block 63, the inner wall of the placing opening 5 is recessed to form a vibrating groove 8, and the vibrating table 62 is slidingly connected in the vibrating groove 8;

[0051] One side of the vibrating table 62 in the placing opening 5 is provided with a notch 9, and the notch 9 is fixedly connected with the clamping sleeve 61 for clamping the PCB circuit board;

[0052] One of the side walls of the vibration table 62 is provided with a sliding groove 10, a sliding block 11 is slidably connected in the sliding groove 10, springs are fixedly connected between the sliding block 11 and the sliding groove 10, and the side of the sliding block 11 extending out of the sliding groove 10 is fixedly connected with a vibration block 63.

[0053] A positioning groove 12 is formed in the bottom of the vibration table 62, a guide block 13 is slidably connected to the bottom of the positioning groove 12, and the bottom of the guide block 13 is fixedly connected with the inner wall of the vibration groove 8.

[0054] In this embodiment, it can be found that the top of the copper cylinder 1 is provided with a groove containing a copper electrolyte electroplating tank 4, which can be used for sinking a PCB circuit board, and the copper ions are deposited in the holes by using current to fill the holes, thereby realizing the copper filling work of the PCB circuit board. Figure 1 Figure 2 It can be found that the top of the copper cylinder 1 is provided with a power unit 3, the power unit 3 is connected with a floating table 2 through a connecting block 7, then a placing opening 5 for placing the PCB circuit board is formed on one side of the floating table 2, and a clamping sleeve 61 is fixedly connected at the placing opening 5, which can be used for clamping the PCB circuit board, then the connecting block 7 is driven to move downward by the power unit 3, so that the connecting block 7, the floating table 2 and the PCB circuit board move downward, thereby slowly sinking the PCB circuit board into the electroplating tank 4.

[0055] However, due to the small size of the holes of the PCB circuit board, when the PCB circuit board is sunk into the electroplating tank, the surface tension of the liquid in the small holes is relatively strong, and after the bubbles are formed in the holes, the surface tension makes it difficult for the bubbles to break through the hole wall and be discharged, thereby reducing the copper filling effect of the holes of the PCB circuit board.

[0056] Therefore, it can be found that the top of the copper cylinder 1 is provided with a power unit 3, the power unit 3 is connected with a floating table 2 through a connecting block 7, then a placing opening 5 for placing the PCB circuit board is formed on one side of the floating table 2, and a clamping sleeve 61 is fixedly connected at the placing opening 5, which can be used for clamping the PCB circuit board, then the connecting block 7 is driven to move downward by the power unit 3, so that the connecting block 7, the floating table 2 and the PCB circuit board move downward, thereby slowly sinking the PCB circuit board into the electroplating tank 4. Figure 2 Figure 3 It can be found that the top of the copper cylinder 1 is provided with a power unit 3, the power unit 3 is connected with a floating table 2 through a connecting block 7, then a placing opening 5 for placing the PCB circuit board is formed on one side of the floating table 2, and a clamping sleeve 61 is fixedly connected at the placing opening 5, which can be used for clamping the PCB circuit board, then the connecting block 7 is driven to move downward by the power unit 3, so that the connecting block 7, the floating table 2 and the PCB circuit board move downward, thereby slowly sinking the PCB circuit board into the electroplating tank 4.

[0057] When the PCB circuit board is sunk into the electroplating tank 4, the PCB circuit board gradually approaches the electrolyte, so that the electrolyte wets the outer wall of the PCB circuit board, then as the PCB circuit board gradually moves downward, the PCB circuit board gradually presses the electrolyte, so that the electrolyte climbs along the hole wall of the micro hole and squeezes out the air in the micro hole, thereby achieving the effect of removing bubbles.

[0058] However, the efficiency of the electrolyte climbing upward in the micro hole and squeezing out the air will decrease as the hole diameter decreases, which will cause the electrolyte to rapidly spread on the upper surface of the PCB circuit board under the action of tension when the PCB circuit board is completely sunk below the liquid level of the electrolyte, at this time, the electrolyte will rapidly spread on the upper surface of the PCB circuit board, which will cause the air in part of the micro holes to be unable to be completely discharged, thereby reducing the effect of removing bubbles.

[0059] Therefore, it can be found that the top of the copper cylinder 1 is provided with a power unit 3, the power unit 3 is connected with a floating table 2 through a connecting block 7, then a placing opening 5 for placing the PCB circuit board is formed on one side of the floating table 2, and a clamping sleeve 61 is fixedly connected at the placing opening 5, which can be used for clamping the PCB circuit board, then the connecting block 7 is driven to move downward by the power unit 3, so that the connecting block 7, the floating table 2 and the PCB circuit board move downward, thereby slowly sinking the PCB circuit board into the electroplating tank 4. Figure 4 Figure 6 ​​​It can be found that the sliding groove 10 is arranged on one side wall of the vibration table 62, the sliding block 11 is slidably connected in the sliding groove 10, the spring is fixedly connected between the sliding block 11 and the sliding groove 10, the sliding block 11 is fixedly connected on one side of the sliding groove 10, and the vibration block 63 is fixedly connected on the side of the sliding block 11 extending out of the sliding groove 10. When the floating table 2 is moved under the driving of the connecting block 7, the PCB circuit board is pressed on the page of the electrolyte and bears a large pressure, the pressure pushes the PCB circuit board to move upward relative to the floating table 2, the vibration block 63 is in contact with the inner wall of the vibration groove 8 to generate vibration, the liquid tension on the surface of the PCB circuit board is changed, the stress condition of the bubbles is changed, the bubbles are shaken off, and the bubble removing effect is further improved.

[0060] Since the vibration table 62 slides up and down in the vibration groove 8, in order to avoid that the vibration table 62 is inclined to affect the vibration effect, it can be found that Figure 6 A positioning groove 12 is arranged at the bottom of the vibration table 62, a guide block 13 is slidably connected in the positioning groove 12, the bottom of the guide block 13 is fixedly connected with the bottom of the vibration groove 8, the vibration table 62 is limited by the guide block 13 when sliding up and down, the movement of the vibration table 62 is more stable, the vibration effect is ensured, and the bubble removing is more stable.

[0061] In the further preferable embodiment of the present application, as shown in Figure 4 and Figure 5 One side wall of the vibration groove 8 close to the vibration block 63 is gradually close to the vibration block 63 from bottom to top to form an inclined surface 14, the side of the vibration block 63 close to the inclined surface 14 is processed with an inclined angle 15 parallel to the inclined surface 14, and the inclined angle 15 and the inclined surface 14 are both provided with a plurality of protrusions for vibration at intervals from bottom to top.

[0062] In the embodiment, it can be found that Figure 4 and Figure 5 One side wall of the vibration groove 8 close to the vibration block 63 is gradually close to the vibration block 63 from bottom to top to form an inclined surface 14, the side of the vibration block 63 close to the inclined surface 14 is processed with an inclined angle 15 parallel to the inclined surface 14, and then a plurality of protrusions are arranged at the inclined angle 15 and the inclined surface 14 at intervals from bottom to top. When the vibration table 62 moves upward in the vibration groove 8, the inclined angle 15 of the vibration block 63 is in friction with the inclined surface 14 of the vibration groove 8, the protrusions of the vibration block 63 are shaken due to friction with the protrusions of the inclined surface 14, the vibration effect is generated, the effect of shaking off the bubbles is realized.

[0063] At this time, when the PCB circuit board is in contact with the electrolyte, the large pressure between the PCB circuit board and the electrolyte pushes the PCB circuit board to move relative to the floating table 2, so that the vibration table 62 moves from Figure 4 to Figure 5At this state, the protrusions provided on the vibration block 63 will rub and vibrate against the protrusions of the inclined surface 14 to vibrate the PCB circuit board to remove air bubbles, improving the air bubble removal effect.

[0064] When the PCB circuit board completely sinks to the bottom of the electroplating tank 4, at this time, the floating table 2 stops moving, causing the force on the PCB circuit board to disappear. Therefore, the pressure applied to the vibration table 62 disappears. At this time, under the push of the spring, the vibration block 63 squeezes the side wall of the vibration groove 8, and the inclined surface of the inclined surface 14 decomposes the received pressure, so that part of the pressure applied by the extrusion block 63 is converted into a traction force that moves the extrusion block 63 downward, so that the extrusion block 63 moves downward, resetting the vibration table 62. And during the reset process, the vibration block 63 will generate vibrations again, further strengthening the air bubble removal effect.

[0065] In a further preferred embodiment of the present invention, as Figure 3 and Figure 6 shown, a plurality of through holes 16 are provided at intervals along the length direction on the top of the guide block 13. The through holes 16 extend downward and penetrate through the floating table 2. A jet hole 17 communicating with the through hole 16 is provided on the outer wall of the vibration table 62. One-way valves 18 are fixedly connected to the opening of the jet hole 17 and the bottom opening of the through hole 16;

[0066] The end of the jet hole 17 away from the through hole 16 gradually slopes upward, so that the axis of the jet hole 17 has an inclination angle with the horizontal plane;

[0067] The floating table 2, the vibration table 62 and the clamping sleeve 61 are all in a C shape.

[0068] In this embodiment, it can be observed that Figure 3 By arranging the floating table 2, the vibration table 62 and the clamping sleeve 61 in a C shape, an installation opening for installing the PCB circuit board can be reserved on one side of the floating table 2, the vibration table 62 and the clamping sleeve 61, which is convenient for installing the PCB circuit board, reduces the installation difficulty of the PCB circuit board, thereby reducing the use difficulty of the copper filling device, and further improving the copper filling efficiency of the PCB circuit board and the production efficiency of the PCB circuit board.

[0069] And observing Figure 6It can be found that, since the vibration platform 62 is in the shape of a Chinese character, the guide block 13 for assisting the vibration platform 62 to slide smoothly is also in the shape of a Chinese character, and a plurality of through holes 16 are arranged on the top of the guide block 13 in the length direction and the bottom of the through holes 16 extends downward and penetrates the floating platform 2, then a jet hole 17 is arranged on the outer wall of the vibration platform 62 and communicates with the through hole 16, and finally a one-way valve 18 is fixedly connected at the opening of the jet hole 17 and the bottom of the through hole 16, at this time, when the vibration platform 62 is forced to move upward, the gap between the positioning groove 12 and the guide block 13 increases, thereby generating negative pressure, then the negative pressure in the through hole 16 increases, the one-way valve 18 at the bottom of the through hole 16 is opened, and then the electrolyte is sucked into the through hole 16 and the gap. After the PCB circuit board is completely immersed in the bottom of the electrolytic tank 4, when the vibration platform 62 is reset, the gap is reduced, the electrolyte in the gap is pressurized, at this time, the one-way valve 18 at the jet hole 17 is opened, and the electrolyte is ejected through the jet hole 17, so as to use the jet to flush the lower surface of the PCB circuit board, disturb the stress distribution of the lower surface of the PCB circuit board, thereby destroying the stress of the bubbles in the micro holes, and further enhancing the bubble removal effect.

[0070] And in Figure 6 It can be found that the end of the jet hole 17 away from the through hole 16 gradually inclines upward, so that the axis of the jet hole 17 has an inclination angle with the horizontal plane, for making the electrolyte in the jet hole 17 fly upward when ejected, so that the electrolyte can flush the lower surface of the PCB circuit board, which can effectively ensure the operation stability of the jet bubble removal.

[0071] In a further preferred embodiment of the present application, as shown in Figure 3 And Figure 4 The inner wall of the clamping sleeve 61 is concave and forms a clamping groove 19 for clamping the PCB circuit board, and the depth of the clamping groove 19 is greater than the width of the PCB circuit board.

[0072] In this embodiment, in combination with Figure 3 And Figure 4 It can be found that, by arranging the clamping groove 19 on the inner wall of the clamping sleeve 61, the PCB circuit board can be clamped, which makes the installation of the PCB circuit board more convenient and simple, thereby shortening the preparation time of the PCB circuit board during copper filling and improving the copper filling efficiency of the PCB circuit board.

[0073] And by making the depth of the clamping groove 19 greater than the width of the PCB circuit board, the PCB circuit board can be completely inserted into the clamping groove 19 during installation, so that the edges of the PCB circuit board do not protrude outside the clamping sleeve 61, and when the floating platform 2 moves up and down, the PCB circuit board will not be in contact with the tank wall of the electrolytic tank 4, thereby achieving the protection effect of the PCB circuit board, reducing the scrap rate of the PCB circuit board, and thereby reducing the production cost of the PCB circuit board.

[0074] In further preferable embodiments of the present application, as shown in Figure 1 and Figure 2 The power unit 3 comprises a motor 31 and a screw rod 32, the top of the copper cylinder 1 is fixedly connected with a support frame 20, the support frame 20 is provided with a track groove 21 on one side close to the electroplating tank 4, and the bottom of the track groove 21 extends downward into the electroplating tank 4.

[0075] The track groove 21 is rotatably connected with the screw rod 32, the connecting block 7 is threadedly connected with the screw rod 32, the top of the support frame 20 is fixedly connected with the motor 31, the output shaft of the motor 31 extends into the track groove 21 and is fixedly connected with the screw rod 32.

[0076] In this embodiment, the top of the copper cylinder 1 is fixedly connected with the support frame 20, the support frame 20 is provided with the track groove 21 on one side close to the electroplating tank 4, the bottom of the track groove 21 extends downward into the electroplating tank 4, and the connecting block 7 connected with the floating platform 2 is slidably arranged in the track groove 21, so that the floating platform 2 can be moved above the electroplating tank 4 when the PCB circuit board is installed, which facilitates the installation of the PCB circuit board, and then the PCB circuit board can be sunk into the electroplating tank 4 through the power unit 3 after the installation of the PCB circuit board is completed, thereby improving the safety during the copper filling of the PCB circuit board.

[0077] The motor 31 is installed on the top of the support frame 20, the output shaft of the motor 31 extends into the track groove 21 and is fixedly connected with the screw rod 32, the bottom of the screw rod 32 is rotatably connected with the bottom of the track groove 21, and finally the connecting block 7 is threadedly connected with the screw rod 32, so that the connecting block 7 can slide up and down in the track groove 21 when the motor 31 operates, which has the effect of sinking the PCB circuit board into the electrolytic tank 4 and taking out the PCB circuit board from the electrolytic tank 4 after the copper filling is completed, thereby further reducing the difficulty of the copper filling of the PCB circuit board. Embodiment two:

[0078] According to another aspect of the present application, a PCB circuit board copper filling method is provided for the PCB circuit board copper filling device.

[0079] The PCB circuit board copper filling method comprises the following steps:

[0080] S101, inserting the PCB circuit board into the clamping groove 19;

[0081] S102, sinking the PCB circuit board into the electroplating tank 4 through the power unit 3;

[0082] S103, vibrating the PCB circuit board after being in contact with the electroplating solution to shake off the bubbles in the micropores;

[0083] S104, the PCB circuit board is completely immersed in the electroplating tank 4, the bubble removing assembly 6 is reset, the PCB circuit board is vibrated for a second time to remove bubbles, and water flow is sprayed to flush the PCB circuit board;

[0084] S105, the copper filling of the PCB circuit board is completed, and the power unit 3 reverses to lift the PCB circuit board out of the electroplating tank 4.

[0085] Through the above scheme of the present application, the copper filling process of the PCB circuit board can be optimized, bubbles in the micro-holes are automatically cleaned in the copper filling process, the copper-containing electrolyte can completely cover the surface of the PCB circuit board, the operation difficulty of the PCB circuit board in the copper filling process is reduced, the copper filling efficiency of the PCB circuit board is effectively improved, and the production efficiency of the PCB circuit board is improved.

[0086] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A PCB copper filling apparatus, characterized in that, It includes copper cylinder (1), its top is provided with electroplating groove (4) for filling copper; Floating platform (2) is arranged in the electroplating groove (4), and one side of the floating platform (2) is concave to form a placing opening (5) for placing PCB circuit board, and the placing opening (5) is connected with a bubble removing assembly (6); Power unit (3) is connected at the top of the copper cylinder (1) and connected with the floating platform (2) through the connecting block (7); The bubble removing assembly (6) includes a clamping sleeve (61), a vibrating table (62) and a vibrating block (63), the inner wall of the placing opening (5) is concave to form a vibrating groove (8), and the vibrating table (62) is slidably connected in the vibrating groove (8); One side of the vibrating table (62) in the placing opening (5) is provided with a notch (9), and a clamping sleeve (61) for clamping the PCB circuit board is fixedly connected in the notch (9); One side wall of the vibrating table (62) is provided with a sliding groove (10), a sliding block (11) is slidably connected in the sliding groove (10), a spring is fixedly connected between the sliding block (11) and the sliding groove (10), and a vibrating block (63) is fixedly connected to one side of the sliding block (11) extending out of the sliding groove (10); The bottom of the vibrating table (62) is concave to form a positioning groove (12), and a guide block (13) is slidably connected to the bottom of the positioning groove (12), and the bottom of the guide block (13) is fixedly connected with the inner wall of the vibrating groove (8); One side wall of the vibrating groove (8) near the vibrating block (63) gradually approaches the vibrating block (63) from bottom to top to form an inclined surface (14), and the side of the vibrating block (63) near the inclined surface (14) is processed with an inclined angle (15) parallel to the inclined surface (14), and the inclined angle (15) and the inclined surface (14) are both provided with a plurality of protrusions for vibration from bottom to top; A plurality of through holes (16) are spaced apart along the length direction at the top of the guide block (13), the through holes (16) extend downward and penetrate the floating platform (2), and a jet hole (17) is formed in the outer wall of the vibrating table (62) and communicates with the through holes (16), and a one-way valve (18) is fixedly connected at the opening of the jet hole (17) and the bottom opening of the through hole (16).

2. The PCB copper filling device of claim 1, wherein, The end of the jet hole (17) away from the through hole (16) gradually inclines upward, so that the axis of the jet hole (17) has an inclination angle with the horizontal plane.

3. The PCB copper filling device of claim 2, wherein, The floating platform (2), the vibrating table (62) and the clamping sleeve (61) all have a shape of a Chinese character.

4. The PCB copper filling device of claim 3, wherein, The inner wall of the clamping sleeve (61) is concave to form a clamping groove (19) for clamping the PCB circuit board, and the depth of the clamping groove (19) is greater than the width of the PCB circuit board.

5. The PCB copper filling device of claim 4, wherein, The power unit (3) includes a motor (31) and a lead screw (32), the top of the copper cylinder (1) is fixedly connected with a support frame (20), one side of the support frame (20) near the electroplating groove (4) is provided with a track groove (21), and the bottom of the track groove (21) extends downward into the electroplating groove (4). A rail groove (21) is rotatably connected with a screw rod (32), the screw rod (32) is threadedly connected with the connecting block (7), the top of the support frame (20) is fixedly connected with a motor (31), the output shaft of the motor (31) extends into the rail groove (21) and is fixedly connected with the screw rod (32).

6. A method of filling copper in a PCB circuit board, characterized by, The copper filling device for the PCB circuit board according to any one of claims 1-5 comprises the following steps: S101, inserting the PCB circuit board into the clamping groove (19); S102, sinking the PCB circuit board into the electroplating tank (4) by the power unit (3); S103, vibrating after the PCB circuit board contacts with the electroplating liquid to shake off the bubbles in the micropores; S104, after the PCB circuit board is completely sunk into the electroplating tank (4), the bubble removing assembly (6) is reset, the PCB circuit board is vibrated again to remove bubbles, and water flow is sprayed to flush the PCB circuit board; S105, the copper filling of the PCB circuit board is completed, and the power unit (3) reverses to lift the PCB circuit board out of the electroplating tank (4).

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