Semiconductor device and preparation method thereof

By designing cross-set active regions and gates on the substrate and gate layers of the semiconductor device, additional transistors are formed, and the problem of increasing the number of transistors and increasing the integration is solved, and performance improvement is achieved.

CN119698069AActive Publication Date: 2025-03-25NEXCHIP SEMICON CO LTD
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Patent Information

Application Number
CN202510209347.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-25
Publication Date
2025-03-25
Estimated Expiration
2045-02-25

AI Technical Summary

Technical Problem

In semiconductor devices, how to increase the number of transistors through arrangement designs to improve integration and performance, especially when the process node reaches its limit.

Method used

A semiconductor device is designed, wherein the substrate includes at least two first active regions and a second active regions, the gate layer includes at least two first gates and a second gate, at least four transistors are formed by cross-arrangement, and additional transistors are formed at the second active region and the second gate.

Benefits of technology

Without changing the structure of the semiconductor device, the number of transistors is increased, the degree of integration is improved, and the performance of the device is improved, which is specifically manifested as an increase in the number of transistors by 25%.

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Abstract

The invention relates to a semiconductor device and a preparation method thereof, and relates to the technical field of semiconductors, in the semiconductor device, at least two first grids and at least two first active regions are arranged in a crossed manner, a second active region is positioned between the adjacent first active regions, and a second grid is positioned on the second active region; when at least four transistors are formed on the semiconductor device, a fifth transistor is formed on the second active region and the second grid electrode. According to the arrangement, the number of the transistors is increased while the structure of the semiconductor device is not changed, the integration level of the semiconductor device is increased, and the performance of the semiconductor device is further improved.
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