Electronic device including structure for dissipating heat to outside

Abstract

An electronic device according to one embodiment includes: a housing; comprising a through hole; a first display movable relative to the first carriage; a printed circuit board; a fan disposed between the printed circuit board and the first bracket; and a radiation member including a first region attached to a face of the first display facing the face of the first bracket and a second region attached to the other face of the first bracket and facing the fan, in which a portion of the radiation member between the first region and the second region passes through the through hole, and is deformable according to movement of the first display relative to the first bracket.

Description

Technical Field

[0001] The present disclosure relates to an electronic device including a structure for dissipating heat to the outside. Background Art

[0002] An electronic device may include various electronic components to meet the needs of a user. When the electronic device is operated, the electronic components in the electronic device may generate heat. For example, the heat generated from one electronic component may degrade the performance of the electronic device due to being transferred to another electronic component in the electronic device. For example, the heat generated from one electronic component may cause inconvenience to the user due to being transferred to the outside of the electronic device. Summary of the invention

[0003] The electronic device according to the embodiment may include a housing. The electronic device according to the embodiment may include a first bracket including a through hole provided in the housing. According to the embodiment, the electronic device may include a first display provided on a surface of the first bracket, the first display being configured to be movable relative to the first bracket. According to the embodiment, the electronic device may include a printed circuit board provided on another surface of the first bracket opposite to the surface of the first bracket. According to the embodiment, the electronic device may include a fan provided between the printed circuit board and the first bracket. According to the embodiment, the electronic device may include a heat dissipation member including a first area and a second area, the first area being attached to a surface of the first display facing the surface of the first bracket, the second area being attached to another surface of the first bracket facing the fan. According to the embodiment, a portion of the heat dissipation member between the first area and the second area may pass through the through hole, and may be configured to be deformable according to the movement of the first display relative to the first bracket.

[0004] According to an embodiment, an electronic device may include a housing including a first surface facing a user when the electronic device is worn by a user, and a second surface opposite to the first surface. According to an embodiment, the electronic device may include a first bracket including a through hole provided in the housing. According to an embodiment, the electronic device may include a moving flange including a portion of a surface facing the first bracket and another portion provided outside the housing and movable relative to the first bracket. According to an embodiment, the electronic device may include a first display coupled to the portion of the moving flange. According to an embodiment, the electronic device may include a fan provided in the housing and facing another surface of the first bracket opposite to the surface of the first bracket. According to an embodiment, the electronic device may include a printed circuit board provided between the second surface and the fan. According to an embodiment, the electronic device may include a heat dissipation member including a first area and a second area, the first area being attached to a surface of the first display facing the surface of the first bracket, and the second area being attached to another surface of the first bracket facing the fan. According to an embodiment, a portion of the heat dissipation member between the first area and the second area may pass through the through hole and may be foldable according to the movement of the first display relative to the first bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0006] Figure 2a is a perspective view of an exemplary electronic device according to an embodiment.

[0007] Figure 2b is an exploded perspective view of an exemplary electronic device according to an embodiment.

[0008] Figure 2c is a diagram showing an example of an exemplary electronic device according to an embodiment Figure 2a A partial cross-sectional view taken along line AA'.

[0009] Figure 3a is a diagram showing an example of an exemplary electronic device according to an embodiment Figure 2a A cross-sectional view taken along line BB'.

[0010] Figure 3b is a diagram showing an example of an exemplary electronic device according to an embodiment Figure 2a A cross-sectional view taken along line BB'.

[0011] Figure 4 is a rear view of an exemplary electronic device according to an embodiment.

[0012] Figure 5a is a top plan view of a printed circuit board of an exemplary electronic device according to an embodiment.

[0013] Figure 5b is a diagram showing an example of a printed circuit board of an exemplary electronic device according to an embodiment Figure 5a A cross-sectional view taken along line CC'. DETAILED DESCRIPTION

[0014] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0015] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0016] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0017] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0018] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0019] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0020] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0021] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0022] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0023] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0024] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0025] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0026] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0027] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0028] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0029] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0030] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0031] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 198 (e.g., a short-range communication network such as Bluetooth TM ), Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)), or a second network 199 (for example, a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (for example, a LAN or a wide area network (WAN)))) to communicate with an external electronic device. These various types of communication modules can be implemented as a single component (for example, a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (for example, multiple chips). The wireless communication module 192 can use the user information (for example, the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and authenticate the electronic device 101 in the communication network (such as the first network 198 or the second network 199).

[0032] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0033] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0034] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0035] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0036] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the function or service requested, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0037] Figure 2a is a perspective view of an exemplary electronic device according to an embodiment, Figure 2b is an exploded perspective view of an exemplary electronic device according to an embodiment, and Figure 2c is a diagram showing an example of an exemplary electronic device according to an embodiment Figure 2a A partial cross-sectional view taken along line AA'.

[0038] refer to Figure 2a , Figure 2b and Figure 2c According to the electronic device 200 of the embodiment (eg, Figure 1The electronic device 101 may include a housing 210, a first bracket 220, at least one moving flange 230, at least one display 240, a printed circuit board 250, a second bracket 260, a fan 270, a heat sink 280 and / or at least one heat dissipation member 290. According to an embodiment, the electronic device 200 may be referred to as a wearable device worn on a part of a user's body. The electronic device 200 may be configured to provide augmented reality (AR), virtual reality (VR), or mixed reality (MR) that mixes augmented reality and virtual reality to the user. For example, the electronic device 200 may be configured to provide virtual reality through at least one display 240 based on receiving image-related data from outside the electronic device 200. For example, the image provided by the electronic device 200 may include a still image and a video for realizing virtual reality. For example, the electronic device 200 may be configured to provide augmented reality by overlappingly displaying a virtual object on a real image provided by light received from outside the electronic device 200 through at least one display 240. The real image may mean an image or video realized by light received from the outside of the electronic device 200 without separate data processing by the electronic device 200. The virtual object may include at least one of text and an image corresponding to various information related to the object included in the real image. However, it is not limited thereto, and the virtual object may include at least one of text and an image corresponding to various information related to another object different from the object included in the real image.

[0039] The housing 210 may define at least a portion of the outer surface of the electronic device 200. The housing 210 may accommodate various components of the electronic device 200. The housing 210 may surround various components of the electronic device 200. According to an embodiment, when a user wears the electronic device 200, the first surface 210a of the housing 210 may face a part of the user's body. For example, the housing 210 may include a first surface 210a, a second surface 210b, and / or a lateral surface 210c. When the electronic device 200 is worn on the head, the first surface 210a of the housing 210 may face the user's face. The second surface 210b of the housing 210 may be opposite to the first surface 210a of the housing 210. The second surface 210b may be spaced apart from the first surface 210a. The direction (e.g., +z direction) facing the second surface 210b may face the direction opposite to the direction (e.g., -z direction) facing the first surface 210a. For example, when the user wears the electronic device 200, the direction facing the second surface 210b may be substantially parallel to the user's gaze direction. According to an embodiment, the lateral surface 210c of the housing 210 may connect the first surface 210a and the second surface 210b. The lateral surface 210c may extend between the first surface 210a and the second surface 210b. The lateral surface 210c may surround the periphery of the first surface 210a and the periphery of the second surface 210b. According to an embodiment, the lateral surface 210c of the housing 210 may be curved with a curvature, but is not limited thereto. For example, the lateral surface 210c may be perpendicular to the first surface 210a and the second surface 210b.

[0040] According to an embodiment, the housing 210 may include a first housing 211 and a second housing 212. The first housing 211 and the second housing 212 may be coupled to each other to define (or form) the housing 210. The first housing 211 may define a first surface 210a of the housing 210. According to an embodiment, the first housing 211 may include a first drive hole 211a and a second drive hole 211b. The first drive hole 211a and the second drive hole 211b may define a space in which at least one moving flange 230 may move. For example, the first drive hole 211a may define a space in which the first moving flange 231 may move. For example, the second drive hole 211b may define a space in which the second moving flange 232 may move. According to an embodiment, the first drive hole 211a and the second drive hole 211b may penetrate the first housing 211. The first drive hole 211a and the second drive hole 211b may be spaced apart from each other. According to an embodiment, the size of each of the first drive hole 211a and the second drive hole 211b may be greater than the size of each of the first moving flange 231 and the second moving flange 232. For example, the size of the cross-sectional area of ​​each of the first driving hole 211a and the second driving hole 211b may be greater than the size of the cross-sectional area of ​​each of the first moving flange 231 and the second moving flange 232. The second housing 212 may define a second surface 210b of the housing 210. According to an embodiment, a lateral surface 210c of the housing 210 may be defined by coupling the first housing 211 and the second housing 212.

[0041] According to an embodiment, the housing 210 may include a nose pad 213. When the user wears the electronic device 200, the nose pad 213 may support the electronic device 200 by contacting a part of the user's body. The nose pad 213 may have a shape corresponding to the shape of a part of the user's body. For example, when the electronic device 200 is worn on the user's head, the nose pad 213 may contact the user's nose. According to an embodiment, the electronic device 200 may be symmetrical in the left-right direction (e.g., the x-axis direction) about the nose pad 213.

[0042] According to an embodiment, the housing 210 may include a first inlet 214, a second inlet 215, and an outlet 216. The first inlet 214 may connect the outside of the housing 210 and the inside of the housing 210. The first inlet 214 may transfer air from the outside of the housing 210 to the inside of the housing 210. According to an embodiment, the first inlet 214 may penetrate the first surface 210a of the housing 210. The first inlet 214 may be disposed on the first surface 210a. The number of the first inlet 214 may be one or more. The second inlet 215 may connect the outside of the housing 210 and the inside of the housing 210. The second inlet 215 may transfer air from the outside of the housing 210 to the inside of the housing 210. According to an embodiment, the second inlet 215 may penetrate the lateral surface 210c of the housing 210. The second inlet 215 may be disposed on the lateral surface 210c. The number of the second inlet 215 may be one or more. The outlet 216 may connect the outside of the housing 210 and the inside of the housing 210. The outlet 216 may transfer air from the inside of the housing 210 to the outside of the housing 210. For example, the outlet 216 may transfer air passing through the radiator 280 to the outside of the housing 210. According to an embodiment, at least a portion of the outlet 216 may overlap the radiator 280 when viewed from above. For example, the outlet 216 may penetrate the lateral surface 210c of the housing 210. For example, the outlet 216 may be provided on the lateral surface 210c of the housing 210. The number of the outlets 216 may be one or more.

[0043] The first bracket 220 may support a portion of the components of the electronic device 200 in the housing 210. According to an embodiment, the first bracket 220 may be disposed in the housing 210. For example, the first bracket 220 may be disposed between at least one moving flange 230 and the second bracket 260. According to an embodiment, a surface 220a of the first bracket 220 may face at least one display 240. Another surface 220b of the first bracket 220 may be opposite to the surface 220a of the first bracket 220. The direction (e.g., +z direction) that the other surface 220b of the first bracket 220 faces may be opposite to the direction (e.g., -z direction) that the surface 220a of the first bracket 220 faces. Another surface 220b of the first bracket 220 may be spaced apart from the surface 220a of the first bracket 220.

[0044] According to an embodiment, the first bracket 220 may include at least one through hole 221. The at least one through hole 221 may penetrate the first bracket 220. The at least one through hole 221 may extend between a surface 220a of the first bracket 220 and another surface 220b of the first bracket 220. According to an embodiment, the at least one through hole 221 may include a first through hole 221a and a second through hole 221b. The second through hole 221b may be spaced apart from the first through hole 221a.

[0045] According to an embodiment, the electronic device 200 may include a pinion 222 coupled to the first bracket 220. The pinion 222 may be rotatable relative to the first bracket 220. The pinion 222 may include a plurality of gears. The pinion 222 may face a surface 220a of the first bracket 220. The pinion 222 may be arranged on the surface 220a of the first bracket 220. When an element is referred to as being "on" another element, it should be understood that it may be directly on the other element, or there may be an intermediate element between the two. Conversely, when an element is referred to as being "directly on another element," there are no intermediate elements.

[0046] At least one moving flange 230 may be coupled to the housing 210 in a movable manner relative to the housing 210. For example, the at least one moving flange 230 may be movable relative to the first bracket 220 in the housing 210. According to an embodiment, the at least one moving flange 230 may include a first moving flange 231 and a second moving flange 232. The first moving flange 231 may pass through the first drive hole 211a. For example, the first moving flange 231 may pass through the first drive hole 211a by extending from the inside of the housing 210. The second moving flange 232 may pass through the second drive hole 211b. For example, the second moving flange 232 may pass through the second drive hole 211b by extending from the inside of the housing 210. According to an embodiment, a portion of the moving flange 230 may be disposed in the housing 210. For example, the portion of the moving flange 230 may be coupled to at least one display 240 in the housing 210. For example, a portion 231a of the first moving flange 231 may be coupled to the first display 241 in the housing 210. For example, a portion 232a of the second moving flange 232 may be coupled to the second display 242 in the housing 210. According to an embodiment, a portion of the moving flange 230 may face the first bracket 220. For example, a portion 231a of the first moving flange 231 may face the surface 220a of the first bracket 220. For example, a portion 232a of the second moving flange 232 may face the surface 220a of the first bracket 220. According to an embodiment, another portion of the moving flange 230 may be disposed outside the housing 210. For example, another portion 231b of the first moving flange 231 may be disposed outside the housing 210. For example, another portion 232b of the second moving flange 232 may be disposed outside the housing 210. According to an embodiment, another portion 231b of the first moving flange 231 may protrude outside the housing 210. For example, another portion 231b of the first moving flange 231 may penetrate the first driving hole 211a. For example, the other part 231b of the first moving flange 231 may be disposed outside the first driving hole 211a. According to an embodiment, the other part 232b of the second moving flange 232 may protrude outside the housing 210. For example, the other part 232b of the second moving flange 232 may penetrate the second driving hole 211b. For example, the other part 232b of the second moving flange 232 may be disposed outside the second driving hole 211b.

[0047] According to an embodiment, at least one moving flange 230 may include a lens 233. The lens 233 may refract light emitted from at least one display 240 so that the electronic device 200 can provide virtual reality. According to an embodiment, the lens 233 may be coupled to another portion 230b of at least one moving flange 230 disposed outside the housing 210. When the user wears the electronic device 200, the lens 233 may face the user's body. For example, when the electronic device 200 is worn on the user's head, the lens 233 may face the user's eyes. According to an embodiment, the lens 233 may include a plurality of lenses disposed on each of the first moving flange 231 and the second moving flange 232.

[0048] According to an embodiment, at least one moving flange 230 may include a rack gear 234. The rack gear 234 may include a plurality of gears. The rack gear 234 may mesh with the pinion gear 222. The teeth of the plurality of gears of the rack gear 234 may mesh with the teeth of the plurality of gears of the pinion gear 222. In an embodiment, the rack gear 234 may be disposed in the housing 210. For example, the rack gear 234 may be disposed in a portion 230a of at least one moving flange 230. According to an embodiment, the rack gear 234 may include a first rack gear 234a and a second rack gear 234b. The first rack gear 234a may be coupled to the first moving flange 231. The second rack gear 234b may be coupled to the second moving flange 232. According to an embodiment, the rack gear 234 may have a shape extending in a direction parallel to the surface 220a of the first bracket 220 (e.g., the +x direction or the -x direction). For example, the first rack gear 234 a and the second rack gear 234 b may be parallel to the surface 220 a of the first bracket 220 .

[0049] At least one display 240 may be configured to provide visual information. For example, at least one display 240 may be configured to display information based on a slave processor (e.g., Figure 1According to an embodiment, at least one display 240 may be electrically connected to the printed circuit board 250. For example, at least one display 240 may be electrically connected to the printed circuit board 250 through a flexible printed circuit board. According to an embodiment, at least one display 240 may be coupled to at least one movable flange 230. For example, at least one display 240 may be disposed in a portion 230a of at least one movable flange 230 disposed in the housing 210. According to an embodiment, at least one display 240 may include a first display 241 and a second display 242. The first display 241 may be coupled to the first movable flange 231. The first display 241 may be disposed on the surface 220a of the first bracket 220. The first display 241 may face the surface 220a of the first bracket 220. The first display 241 may be spaced apart from the surface 220a of the first bracket 220. The second display 242 may be coupled to the second movable flange 232. The second display 242 may be disposed on the surface 220a of the first bracket 220. The second display 242 may be spaced apart from the surface 220 a of the first bracket 220 .

[0050] According to an embodiment, at least one display 240 may be movable in the housing 210. At least one display 240 may be movable relative to the first bracket 220. For example, at least one display 240 may be movable on the surface 220a of the first bracket 220. For example, at least one display 240 may be movable in a direction parallel to the surface 220a of the first bracket 220. According to an embodiment, the second display 242 may be movable in a direction approaching the first display 241 (e.g., -x direction) or in a direction away from the first display 241 (e.g., +x direction). According to an embodiment, at least one display 240 may be movable relative to the first bracket 220 by movement of at least one moving flange 230 relative to the first bracket 220. For example, the user may move at least one moving flange 230 by another portion 230b of at least one moving flange 230. According to an embodiment, the distance between the first display 241 and the second display 242 may be reduced or increased by movement of the first moving flange 231 and the second moving flange 232. For example, in the case where the first moving flange 231 moves in a direction (e.g., +x direction) close to the second moving flange 232 by an external force of the user, the pinion 222 meshed with the first rack gear 234a may rotate. By the rotation of the pinion 222, the second rack gear 234b meshed with the pinion 222 may move in a direction (e.g., -x direction) close to the first moving flange 231. As the first moving flange 231 moves in a direction close to the second moving flange 232 and the second moving flange 232 moves in a direction close to the first moving flange 231, the distance between the first display 241 and the second display 242 may decrease. For example, in the case where the first moving flange 231 moves in a direction (e.g., -x direction) away from the second moving flange 232 by an external force of the user, the pinion 222 meshed with the first rack gear 234a may rotate. By the rotation of the pinion 222, the second rack gear 234b meshed with the pinion 222 can move in a direction away from the first moving flange 231 (e.g., +x direction). As the first moving flange 231 moves in a direction away from the second moving flange 232 and the second moving flange 232 moves in a direction away from the first moving flange 231, the distance between the first display 241 and the second display 242 increases. Through at least one moving flange 230, the distance between the first display 241 and the second display 242 can correspond to the interpupillary distance of the user. When the distance between the first display 241 and the second display 242 is adjusted to correspond to the interpupillary distance, the electronic device 200 can provide a three-dimensional virtual reality to the user.

[0051] The printed circuit board 250 may form electrical connections between components in the electronic device 200. For example, the printed circuit board 250 may form electrical connections between electronic components disposed on a surface 250a of the printed circuit board 250 or on another surface 250b of the printed circuit board 250 opposite to the surface 250a of the printed circuit board 250. The printed circuit board 250 may form electrical connections between other electronic components disposed outside the printed circuit board 250. The printed circuit board 250 may form electrical connections between electronic components disposed on the surface 250a of the printed circuit board 250 (e.g., Figure 1 The printed circuit board 250 may be electrically connected to the housing 210. For example, the printed circuit board 250 may be electrically connected to at least one display 240. According to an embodiment, the printed circuit board 250 may be disposed in the housing 210. For example, the printed circuit board 250 may be disposed on the other surface 220b of the first bracket 220. For example, the printed circuit board 250 may be spaced apart from the other surface 220b of the first bracket 220 along the direction (e.g., +z direction) to which the other surface 220b of the first bracket 220 faces. The surface 250a of the printed circuit board 250 may face the second bracket 260.

[0052] The second bracket 260 may support another part of the components of the electronic device 200. For example, the second bracket 260 may support the first battery 261 and the second battery 262. The first battery 261 may be coupled to the second bracket 260. The second battery 262 may be spaced apart from the first battery 261 and coupled to the second bracket 260. According to an embodiment, the second bracket 260 may surround the first battery 261 and the second battery 262. The first battery 261 and the second battery 262 may be electrically connected to the printed circuit board 250. According to an embodiment, the second bracket 260 may be disposed in the housing 210. For example, the second bracket 260 may be disposed between the printed circuit board 250 and the first bracket 220.

[0053] The fan 270 may generate an airflow for cooling the housing 210 and the components located inside the housing 210. For example, the fan 270 may generate an airflow for introducing air outside the housing 210 into the inlets 214 and 215 of the housing 210. The fan 270 may generate an airflow for discharging air inside the housing 210 to the outlet 216 of the housing 210. According to an embodiment, the fan 270 may be electrically connected to the printed circuit board 250. The fan 270 may be electrically connected to at least one of the first battery 261 and the second battery 262. The fan 270 may receive power from at least one of the first battery 261 and the second battery 262. According to an embodiment, the fan 270 may be coupled to the second bracket 260. For example, the fan 270 may be disposed between the first battery 261 and the second battery 262. According to an embodiment, the fan 270 may be disposed between the printed circuit board 250 and the first bracket 220. The fan 270 may face the first bracket 220. For example, the fan 270 may face the other surface 220b of the first bracket 220. According to an embodiment, the fan 270 may face at least one through hole 221 of the first bracket 220. For example, the fan 270 may face the first through hole 221a and the second through hole 221b. For example, when the first bracket 220 is viewed vertically (e.g., in the -z direction), at least one through hole 221 may at least partially overlap with the fan 270.

[0054] The heat sink 280 may dissipate heat generated from the printed circuit board 250 to the outside of the housing 210. For example, the heat sink 280 may include a plurality of fins 281 for increasing the surface area inside the heat sink 280. According to an embodiment, the heat sink 280 may face the surface 250a of the printed circuit board 250. For example, the heat sink 280 may face a portion of the electronic components (e.g., Figure 1 120). According to an embodiment, the region 251 of the printed circuit board 250 may face the heat sink 280. For example, when the printed circuit board 250 is viewed vertically (e.g., in the +z direction or the -z direction), the region 251 of the printed circuit board 250 may at least partially overlap with the heat sink 280. According to an embodiment, in the region 251 of the printed circuit board 250, an electronic component having relatively high heat generation among a plurality of electronic components provided in the printed circuit board 250 may be provided. For example, the electronic component provided in the first region 251 of the printed circuit board 250 may include the processor 120. When the heat sink 280 faces the region 251 of the printed circuit board 250, heat generated from the electronic components of the printed circuit board 250 may be dissipated to the outside of the housing 210.

[0055] According to an embodiment, the heat sink 280 may pass through the airflow generated by the fan 270. The heat sink 280 may dissipate the heat transferred from the airflow generated by the fan 270 to the outside of the housing 210. According to an embodiment, the heat sink 280 may be coupled to the second bracket 260. For example, the heat sink 280 may be disposed between the first battery 261 and the second battery 262. According to an embodiment, when the housing 210 is viewed from above (e.g., in the -y direction), the heat sink 280 may at least partially overlap with the fan 270.

[0056] According to an embodiment, air outside the housing 210 may be introduced into the housing 210 through the inlets 214 and 215 by virtue of the airflow generated by the fan 270. The air introduced into the housing 210 through the inlets 214 and 215 may be delivered to components (e.g., at least one display 240 and / or the printed circuit board 250) in the housing 210. Heat generated in the housing 210 may be transferred to the air introduced into the housing 210. The air heated in the housing 210 may move toward the fan 270. As the air passes through the radiator 280 and the outlet 216 and is discharged to the outside of the housing 210, the interior of the housing 210 may be cooled.

[0057] At least one heat dissipation member 290 may cool the inside of the housing 210. For example, at least one heat dissipation member 290 may transfer heat generated from at least one display 240 to the fan 270. According to an embodiment, at least one heat dissipation member 290 may be coupled to at least one display 240 and the first bracket 220. According to an embodiment, at least one heat dissipation member 290 may pass through at least one through hole 221. For example, at least one heat dissipation member 290 may extend from a surface of at least one display 240 facing the surface 220a of the first bracket 220. At least one heat dissipation member 290 may pass through at least one through hole 221 and extend to another surface 220b of the first bracket 220. For example, at least one heat dissipation member 290 may include at least one of graphite and metal, but is not limited thereto.

[0058] According to an embodiment, at least one heat dissipation member 290 may include a first heat dissipation member 291 and a second heat dissipation member 292. The first heat dissipation member 291 may be disposed on a surface of the first display 241 facing the surface 220a of the first bracket 220. For example, the first heat dissipation member 291 may contact the first moving flange 231. The first heat dissipation member 291 may pass through the first through hole 221a. The second heat dissipation member 292 may be disposed on a surface of the second display 242 facing the surface 220a of the first bracket 220. For example, the second heat dissipation member 291 may contact the second moving flange 232. The second heat dissipation member 292 may pass through the second through hole 221b. According to an embodiment, the first heat dissipation member 291 may be spaced apart from the second heat dissipation member 292. For example, the first heat dissipation member 291 and the second heat dissipation member 292 may be disconnected from each other. However, not limited thereto, the first heat dissipation member 291 and the second heat dissipation member 292 may be connected to each other or may be integrally formed.

[0059] According to an embodiment, at least one heat dissipation member 290 may include a first region 290a and a second region 290b. The first region 290a may be attached to a surface of at least one display 240 facing the surface 220a of the first bracket 220. According to an embodiment, the size of the first region 290a may correspond to the size of the surface of at least one display 240 facing the surface 220a of the first bracket 220. For example, the area of ​​the first region 290a may correspond to the area of ​​the surface of at least one display 240 facing the surface 220a of the first bracket 220. However, it is not limited thereto, and according to an embodiment, the area of ​​the first region 290a may be greater than the area of ​​the at least one display 240. For example, the area of ​​the first region 290a may have a size corresponding to the cross section of at least one moving flange 230. The second region 290b may be provided on the other surface 220b of the first bracket 220. The second region 290b may be attached to the other surface 220b of the first bracket 220. According to an embodiment, the second region 290b may face the fan 270. For example, when the first bracket 220 is viewed vertically (eg, +z direction or −z direction), the second region 290 b may at least partially overlap with the fan 270 .

[0060] According to an embodiment, at least one heat dissipation member 290 may transfer heat dissipated from at least one display 240 to the other surface 220b of the first bracket 220. For example, the heat dissipated from the at least one display 240 may pass through the at least one through hole 221 through the at least one heat dissipation member 290. The heat passing through the at least one through hole 221 may be conducted to the other surface 220b of the first bracket 220 through the at least one heat dissipation member 290. The heat conducted to the other surface 220b of the first bracket 220 may be dissipated to the outside of the housing 210 by the airflow generated by the fan 270 facing the other surface 220b of the first bracket 220. For example, in the case where at least one heat dissipation member 290 is omitted, the heat dissipated from the at least one display 240 may be discharged only by the airflow generated by the fan 270. The electronic device 200 according to an embodiment may provide a structure capable of dissipating the heat generated by the display 240 to the outside of the housing 210 by conduction of at least one heat dissipation member 290 attached to at least one surface of the display 240.

[0061] According to an embodiment, at least one heat dissipation member 290 may penetrate at least one through hole 221. When at least one heat dissipation member 290 penetrates at least one through hole 221, at least one heat dissipation member 290 may quickly transfer heat dissipated from at least one display 240 to the fan 270. For example, in a case where at least one heat dissipation member 290 does not penetrate at least one through hole 221, at least one heat dissipation member 290 may be provided only on the surface 220a of the first bracket 220. In a case where at least one heat dissipation member 290 is provided only on the surface 220a of the first bracket 220, heat dissipated from at least one display 240 may be conducted to the entire first bracket 220 through at least one heat dissipation member 290. In a case where heat is conducted to the entire first bracket 220, heat may not be quickly dissipated to the outside of the housing 210. The electronic device 200 according to an embodiment may provide a structure capable of quickly dissipating heat dissipated from at least one display 240 to the outside of the housing 210 through at least one heat dissipation member 290 passing through at least one through hole 221. For example, since the second region 290 b of the at least one heat dissipation member 290 faces the fan 270 on the other surface 220 b of the first bracket 220 , heat emitted from the at least one display 240 may be quickly dissipated to the outside of the housing 210 through the fan 270 .

[0062] According to an embodiment, at least one heat dissipation member 290 may transfer heat to at least one moving flange 230. For example, at least one heat dissipation member 290 may transfer heat radiated from at least one display 240 to a portion 230a of at least one moving flange 230 surrounding at least one display 240. For example, the heat transferred to at least one heat dissipation member 290 may be transferred to at least one moving flange 230 in contact with at least one heat dissipation member 290. For example, the heat transferred to at least one heat dissipation member 290 may be transferred to at least one moving flange 230 spaced apart from at least one heat dissipation member 290. The at least one heat dissipation member 290 transferring heat to at least one moving flange 230 may prevent heat from being concentrated on at least one display 240.

[0063] As described above, the electronic device 200 according to the embodiment may provide a structure capable of quickly dissipating heat generated from at least one display 240 to the outside of the housing 210 through the first region 290a of at least one heat dissipation member 290 attached to the surface of the at least one display 240. The electronic device 200 according to the embodiment may provide a structure capable of quickly dissipating heat generated from at least one display 240 to the outside of the housing 210 through the second region 290b of at least one heat dissipation member 290 facing the fan 270.

[0064] Figure 3a is a diagram showing an example of an exemplary electronic device according to an embodiment Figure 2a A cross-sectional view taken along line BB' of Figure 3b is a diagram showing an example of an exemplary electronic device according to an embodiment Figure 2a A cross-sectional view taken along line BB'.

[0065] refer to Figure 3a and Figure 3b According to an embodiment, the printed circuit board 250 may face a surface 270 a of the fan 270 . Another surface 270 b of the fan 270 opposite to the surface 270 a of the fan 270 may face a second region 290 b of the at least one heat dissipation member 290 .

[0066] According to an embodiment, a portion 290c of at least one heat dissipation member 290 may be disposed in at least one through-hole 221. The portion 290c of at least one heat dissipation member 290 may be disposed between the first region 290a and the second region 290b. The portion 290c of at least one heat dissipation member 290 may connect the first region 290a and the second region 290b. The portion 290c of at least one heat dissipation member 290 may pass through at least one through-hole 221. For example, heat generated by at least one display 240 may be transferred to the first region 290a attached to the surface of the at least one display 240. The heat transferred to the first region 290a may be transferred to the second region 290b through the portion 290c of at least one heat dissipation member 290. The heat transferred to the second region 290b facing the other surface 270b of the fan 270 may be dissipated to the housing (e.g., Figure 2a , Figure 2b and Figure 2c The outside of the housing 210).

[0067] According to an embodiment, a portion 290c of at least one heat dissipation member 290 may be deformable in at least one through hole 221 according to movement of at least one display 240 relative to the first bracket 220. For example, a portion 290c of at least one heat dissipation member 290 may be deformable in accordance with movement of the first display 241 relative to the first bracket 220. For example, a portion 290c of at least one heat dissipation member 290 may be bent in at least one through hole 221, but is not limited thereto. According to an embodiment, a portion 290c of at least one heat dissipation member 290 may be foldable in at least one through hole 221. For example, in a case where the distance between the first display 241 and the second display 242 is reduced due to movement of the first display 241 relative to the first bracket 220, a portion 290c of at least one heat dissipation member 290 may be folded. For example, in a case where the distance between the first display 241 and the second display 242 is increased due to movement of the first display 241 relative to the first bracket 220, a portion 290c of at least one heat dissipation member 290 may be unfolded. For example, in the case where the at least one heat dissipation member 290 is not deformable, the at least one heat dissipation member 290 may be damaged due to the movement of the at least one display 240 relative to the first bracket 220. Since the at least one heat dissipation member 290 is deformable, the electronic device 200 according to the embodiment can provide a structure capable of reducing damage to the at least one heat dissipation member 290 due to the movement of the at least one display 240.

[0068] According to an embodiment, the portion 290c of at least one heat dissipation member 290 may include a plurality of extension portions 290d. The plurality of extension portions 290d may be connected to each other. The shapes of the plurality of extension portions 290d may be deformed by the movement of at least one display 240 relative to the first bracket 220. The angle θ between the plurality of extension portions 290d may be changed by the movement of at least one display 240 relative to the first bracket 220. For example, the plurality of extension portions 290d may include a first extension portion 290d-1 and a second extension portion 290d-2 disposed in the first through hole 221a. For example, in the case where the distance between the first display 241 and the second display 242 is reduced (e.g., Figure 3b ), the angle θ between the first extension portion 290d-1 and the second extension portion 290d-2 connected to each other may be reduced. For example, in the case where the distance between the first display 241 and the second display 242 increases (for example, Figure 3a ), the angle θ between the first extension portion 290d-1 and the second extension portion 290d-2 connected to each other may be increased. According to an embodiment, since the portion 290c of at least one heat dissipation member 290 includes a plurality of extension portions 290a, the portion 290c of at least one heat dissipation member 290 may have a shape including wrinkles.

[0069] As described above, the electronic device 200 according to the embodiment may provide a strong structure by means of at least one deformable heat dissipation member 290 to prevent damage due to at least one display 240 .

[0070] Figure 4 is a rear view of an exemplary electronic device according to an embodiment.

[0071] refer to Figure 4 According to an embodiment, the housing 210 may include a plurality of temples 217. The plurality of temples 217 may support the electronic device 200. When the user wears the electronic device 200, the plurality of temples 217 may contact a part of the user's body. When the electronic device 200 is worn on the user's head, the plurality of temples 217 may contact the user's ears.

[0072] According to an embodiment, air outside the housing 210 may pass through at least one first inlet 214 by virtue of the airflow generated by the fan 270. The air introduced through the at least one first inlet 214 may cool the at least one display 240 by passing through the at least one display 240. The air passing through the at least one display 240 may pass through the heat sink 280. The air passing through the heat sink 280 may be discharged to the outside of the housing 210 through at least one outlet 216.

[0073] According to an embodiment, air outside the housing 210 may pass through at least one second inlet 215 by virtue of the airflow generated by the fan 270. The air introduced through the second inlet 215 may pass through the fan 270. By virtue of the airflow generated by the fan 270, the air passing through the fan 270 may pass through the radiator 280. The air passing through the radiator 280 may be discharged to the outside of the housing 210 through at least one outlet 216.

[0074] As described above, the electronic device 200 according to the embodiment may provide a structure capable of discharging heat generated by at least one display 240 and the printed circuit board 250 to the outside of the housing 210 through the fan 270 .

[0075] Figure 5a is a top plan view of a printed circuit board of an exemplary electronic device according to an embodiment, and Figure 5b is a diagram showing an example of a printed circuit board of an exemplary electronic device according to an embodiment Figure 5a A cross-sectional view taken along line CC'.

[0076] refer to Figure 5a and Figure 5b According to an embodiment, the printed circuit board 250 may include a plurality of electronic components 252. The plurality of electronic components 252 may be disposed on a surface 250a of the printed circuit board 250. For example, the plurality of electronic components 252 may protrude from the surface 250a of the printed circuit board 250. According to an embodiment, the plurality of electronic components 252 may implement an electronic device (e.g., Figure 2a , Figure 2b and Figure 2c For example, the plurality of electronic components 252 may include a processor (e.g., Figure 1 The processor 120 is disposed on the surface 250a of the printed circuit board 250 and controls the overall operation of the electronic device 200.

[0077] According to an embodiment, the printed circuit board 250 may include a shielding cover 253, a thermally conductive material 254, and / or a discharge member 255. The shielding cover 253 may shield electromagnetic waves transmitted to the plurality of electronic components 252. The shielding cover 253 may shield electromagnetic waves emitted from the plurality of electronic components 252. For example, the shielding cover 253 may be electrically connected to the ground of the printed circuit board 250. The shielding cover 253 may include a conductive material, but is not limited thereto. According to an embodiment, the shielding cover 253 may be disposed on the surface 250a of the printed circuit board 250. For example, the shielding cover 253 may surround the plurality of electronic components 252. For example, the shielding cover 253 may surround the plurality of electronic components 252 disposed in the region 251 of the printed circuit board 250. According to an embodiment, the shielding cover 253 may be spaced apart from the plurality of electronic components 252. For example, a gap may be formed in the space between the plurality of electronic components 252 and the shielding cover 253.

[0078] The heat conductive material 254 can transfer the heat generated by the plurality of electronic components 252 to the shielding cover 253. According to an embodiment, the heat conductive material 254 can fill the gap between the plurality of electronic components 252 and the shielding cover 253. For example, the heat conductive material 254 can contact the plurality of electronic components 252 and the shielding cover 253. For example, the heat conductive material 254 can surround the plurality of electronic components 252 and the shielding cover 253. According to an embodiment, the heat conductive material 254 can be made of a material having high thermal conductivity. For example, the heat conductive material 254 can include a thermal interface material (TIM), but is not limited thereto. For example, in the case where the heat conductive material 254 is omitted, the heat generated from the plurality of electronic components 252 may not be quickly dissipated to the outside of the shielding cover 253 through the gap between the plurality of electronic components 252 and the shielding cover 253. The electronic device 200 according to an embodiment can provide a structure that can quickly dissipate the heat generated from the plurality of electronic components 252 to the outside of the electronic device 200 through the heat conductive material 254 filling the gap between the plurality of electronic components 252 and the shielding cover 253.

[0079] The discharge member 255 can dissipate the heat transferred to the shield cover 253 to the outside of the shield cover 253. For example, the discharge member 255 can transfer the heat transferred to the shield cover 253 through the thermal conductive material 254 to the radiator 280. According to an embodiment, the discharge member 255 can be made of a material with high thermal conductivity. For example, the discharge member 255 can include graphite, but is not limited thereto. According to an embodiment, the discharge member 255 can be disposed on the outer surface of the shield cover 253. For example, the outer surface of the shield cover 253 can be opposite to the inner surface of the shield cover 253 facing the plurality of electronic components 252. For example, the outer surface of the shield cover 253 can face the radiator 280. The heat generated by the plurality of electronic components 252 can be transferred to the shield cover 253 through the thermal conductive material 254. The heat transferred to the shield cover 253 can be transferred to the discharge member 255 disposed on the outer surface of the shield cover 253. The heat transferred to the discharge member 255 can be dissipated to the outside of the electronic device 200 through the radiator 280.

[0080] As described above, the electronic device 200 according to the embodiment can provide a structure capable of quickly dissipating heat generated from the plurality of electronic components 252 to the outside of the electronic device 200 through the thermally conductive material 254 in contact with the plurality of electronic components 252 and the shielding case 253. The electronic device 200 according to the embodiment can provide a structure capable of quickly dissipating heat generated from the plurality of electronic components 252 to the outside of the electronic device 200 through the exhaust member 255 provided on the outer surface of the shielding case 253.

[0081] The electronic device may provide visual information to the user while being worn by the user. For example, the electronic device may include multiple displays corresponding to the user's eyes. The multiple displays may be movable relative to each other so that the electronic device may provide three-dimensional visual information to the user. Since the heat generated when the multiple displays are operated may interfere with the operation of the multiple displays, the electronic device may require a structure for dissipating the heat generated inside the electronic device to the outside of the electronic device.

[0082] According to an electronic device (eg, Figure 2a , Figure 2b and Figure 2c The electronic device 200 may include a housing (eg, Figure 2a , Figure 2b and Figure 2c The electronic device according to the embodiment may include a first bracket (eg, Figure 2b The first bracket 220 includes a through hole (eg, Figure 2b According to an embodiment, the electronic device may include a first display (eg, Figure 2bThe first display 241 is disposed on a surface of the first bracket (eg, Figure 2b According to an embodiment, the electronic device may include a printed circuit board (eg, Figure 2b The printed circuit board 250 is disposed on another surface of the first bracket opposite to the surface of the first bracket (eg, Figure 2b According to an embodiment, the electronic device may include a fan (eg, Figure 2b According to an embodiment, the electronic device may include a heat dissipation member (eg, Figure 2b The heat dissipation member 290 includes a first region (eg, Figure 2b The first region 290a and the second region (eg, Figure 2b The first area is in contact with the surface of the first display facing the surface of the first bracket, and the second area is in contact with another surface of the first bracket facing the fan. According to an embodiment, a portion of the heat dissipation member located between the first area and the second area (e.g., Figure 3a and Figure 3b The portion 290c) may pass through the through hole and may be configured to be deformable according to movement of the first display relative to the first bracket.

[0083] The electronic device according to the embodiment may provide a structure capable of quickly dissipating heat generated from at least one display to the outside of a housing through a second region of at least one heat dissipation member facing the fan.

[0084] According to an embodiment, the portion of the heat dissipation member may include a plurality of extension portions (eg, Figure 3a and Figure 3b According to an embodiment, angles between the plurality of extension portions may change due to movement of the first display relative to the first bracket.

[0085] The electronic device according to the embodiment may provide a robust structure against damage due to at least one display by means of at least one deformable heat dissipation member.

[0086] According to an embodiment, an area of ​​the first region may be substantially the same as an area of ​​a surface of the first display.

[0087] The electronic device according to the embodiment may provide a structure capable of dissipating heat from a display to the outside of the electronic device by virtue of a first region of at least one heat dissipation member having at least the same area as that of a surface of the display.

[0088] According to an embodiment, the electronic device may include a heat sink (eg, Figure 2b A heat sink 280) comprising a plurality of fins (e.g., Figure 2b A plurality of fins 281) configured to pass an airflow generated by a fan. According to an embodiment, the housing may include at least one outlet (e.g., Figure 2b An outlet 216) corresponds to the radiator when the housing is viewed from above, and discharges the airflow passing through the radiator to the outside of the housing.

[0089] The electronic device according to the embodiment may provide a structure capable of dissipating heat generated from a printed circuit board to the outside by means of a heat sink including a plurality of fins.

[0090] According to an embodiment, the housing may include a first surface (eg, Figure 2a According to an embodiment, the housing may include a first inlet (eg, Figure 2a The first entrance 214).

[0091] The electronic device according to the embodiment may provide a structure capable of introducing an air flow for cooling the housing through a first inlet formed in the housing.

[0092] According to an embodiment, the housing may include a first surface (eg, Figure 2a According to one embodiment, the housing may include a second surface (eg, Figure 2a According to an embodiment, the housing may include a lateral surface (eg, Figure 2a According to an embodiment, the housing may include a second inlet (eg, Figure 2a The second entrance 215).

[0093] The electronic device according to the embodiment may provide a structure capable of introducing an air flow for cooling the housing through the second inlet formed in the housing.

[0094] According to an embodiment, the electronic device may include a movable flange (eg, Figure 2a , Figure 2b and Figure 2c The movable flange 230 includes a portion of the housing surrounding the first display (eg, Figure 2b A portion 230a of the housing, and another portion protruding to the outside of the housing (eg, Figure 2b According to an embodiment, the moving flange may include a rack gear (e.g., Figure 2b and Figure 2c According to an embodiment, the electronic device may include a pinion gear (e.g., Figure 2b and Figure 2c A pinion 222) is engaged with the rack gear and is rotatable relative to the first bracket.

[0095] The electronic device according to the embodiment may provide a user with three-dimensional virtual reality by adjusting the distance between the first display and the second display by means of a movable flange movable with respect to the first bracket.

[0096] According to an embodiment, the first region may transfer heat radiated from a surface of the display to a portion of the moving flange surrounding the display.

[0097] The electronic device according to the embodiment may provide a structure that enables at least one display to operate normally by virtue of at least one heat dissipation member transferring heat emitted from the at least one display to the moving flange.

[0098] According to an embodiment, the movable flange may include a lens (e.g. Figure 2a A lens 233) is connected to another part of the mobile flange that faces the user's body when the user wears the electronic device.

[0099] The electronic device according to the embodiment may provide a user with three-dimensional virtual reality through a lens that refracts light emitted from at least one display.

[0100] According to an embodiment, the housing may include at least one drive hole (eg, Figure 2a The first driving hole 211a and the second driving hole 211b are formed in the housing, and another part of the moving flange can be arranged outside the housing by penetrating at least one driving hole.

[0101] According to an embodiment, the printed circuit board may include electronic components (eg, Figure 5a and Figure 5b According to an embodiment, the printed circuit board may include a shielding cover (eg, Figure 5b According to an embodiment, the printed circuit board may include a thermally conductive material (eg, Figure 5b thermally conductive material 254).

[0102] The electronic device according to the embodiment may provide a structure capable of rapidly dissipating heat emitted from the electronic component to the outside of the printed circuit board through the thermal conductive material filling a gap between the shield case and the electronic component.

[0103] According to an embodiment, the printed circuit board may include a discharge member (eg, Figure 5b The discharge member 255).

[0104] The electronic device according to the embodiment may provide a structure capable of quickly dissipating heat emitted from a printed circuit board to the outside of the electronic device through a discharge member facing the fan in the outside of the shield case.

[0105] According to an embodiment, the printed circuit board may include a processor disposed on a surface of the printed circuit board facing the fan (eg, Figure 5b on the surface 250a).

[0106] According to an embodiment, the electronic device may include a second bracket (eg, Figure 2b and Figure 2c According to an embodiment, the electronic device may include a first battery (eg, a second bracket 260) coupled to the second bracket. Figure 2b According to an embodiment, the electronic device may include a second battery (eg, Figure 2b According to an embodiment, the fan may be disposed between the first battery and the second battery.

[0107] The electronic device according to the embodiment may provide a structure capable of dissipating heat generated in a housing to the outside of the housing through a fan for circulating air inside the housing.

[0108] According to an embodiment, the electronic device may include a second display (eg, Figure 2b and Figure 2c The second display 242 is spaced apart from the first display and is configured to be movable on a surface of the first bracket in a direction approaching the first display or in a direction away from the first display.

[0109] The electronic device according to the embodiment may provide a user with three-dimensional virtual reality by adjusting the distance between the first display and the second display by means of a movable flange movable with respect to the first bracket.

[0110] According to an embodiment, the electronic device may include a nose pad (eg, Figure 2a Nose pad 213).

[0111] When the user wears the electronic device, the electronic device according to the embodiment may be supported by the nose pad.

[0112] According to an electronic device (eg, Figure 2a , Figure 2b and Figure 2c The electronic device 200 may include a housing (eg, Figure 2a , Figure 2b and Figure 2c The housing 210 includes a first surface (eg, a first surface) facing the user when the user wears the electronic device. Figure 2a A first surface 210a), and a second surface opposite to the first surface (eg, Figure 2a According to an embodiment, the electronic device may include a first bracket (eg, Figure 2b The first bracket 220 includes a through hole (eg, Figure 2b According to an embodiment, the electronic device may include a movable flange (eg, Figure 2a , Figure 2b and Figure 2c The movable flange 230 includes a surface facing the first bracket (eg, Figure 2b A portion of the surface 220a) (e.g., Figure 2b 230a), and another portion (eg, Figure 2b According to an embodiment, the electronic device may include a first display (eg, Figure 2b and Figure 2c According to an embodiment, the electronic device may include a fan (eg, Figure 2b The fan 270 is disposed in the housing and faces another surface of the first bracket opposite to the surface of the first bracket (eg, Figure 2b According to an embodiment, the electronic device may include a printed circuit board (eg, Figure 2b According to an embodiment, the electronic device may include a heat dissipation member (eg, Figure 2b The heat dissipation member 290 includes a first region (eg, Figure 2b The first region 290a and the second region (eg, Figure 2b The first area is attached to the surface of the first display facing the surface of the first bracket, and the second area is attached to the other surface of the first bracket facing the fan. According to an embodiment, a portion of the heat dissipation member between the first area and the second area (e.g., Figure 3a and Figure 3b The portion 290c) may pass through the through hole and may be foldable according to movement of the first display relative to the first bracket.

[0113] According to an embodiment, the electronic device may include a heat dissipation member (eg, Figure 2b The heat dissipation member 290 includes a first region (eg, Figure 2b The first region 290a and the second region (eg, Figure 2b The first area is attached to the surface of the first display facing the surface of the first bracket, and the second area is attached to the other surface of the first bracket facing the fan. According to an embodiment, the portion of the heat dissipation member between the first area and the second area (for example, Figure 3a and Figure 3b The portion 290c) may pass through the through hole and may be configured to be deformable according to movement of the first display relative to the first bracket.

[0114] According to an embodiment, the electronic device may include a heat sink (eg, Figure 2b A heat sink 280) comprising a plurality of fins (e.g., Figure 2b A plurality of fins 281) configured to pass an airflow generated by a fan. According to an embodiment, the housing may include at least one outlet (e.g., Figure 2b An outlet 216) at least partially overlaps the radiator when the housing is viewed from above, and the outlet transmits the airflow through the radiator to the outside of the housing.

[0115] According to an embodiment, the electronic device may include a pinion gear rotatable relative to the first bracket (eg, Figure 2b and Figure 2c According to an embodiment, the moving flange may include a rack gear (e.g., Figure 2b and Figure 2c Rack gear 233).

[0116] According to an embodiment, the printed circuit board may include electronic components (eg, Figure 5a and Figure 5b According to an embodiment, the printed circuit board may include a shielding cover (eg, Figure 5b According to an embodiment, the printed circuit board may include a thermally conductive material (eg, Figure 5b thermally conductive material 254).

[0117] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to the electronic device described above.

[0118] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being "coupled with" or "coupled to" another element (e.g., the second element), "connected with" or "connected to" another element (e.g., the second element), with or without the terms "operably" or "communicatively", it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0119] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0120] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between a case where data is semi-permanently stored in a storage medium and a case where data is temporarily stored in a storage medium.

[0121] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0122] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities, and some entities in the multiple entities may be separately arranged in different components. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as the corresponding one component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

Claims

1. An electronic device (101; 200), the electronic device (101; 200) comprising: Housing (210); a first bracket (220), the first bracket (220) comprising a through hole (221), and the first bracket (220) is arranged in the housing (210); A first display (241), the first display (241) being disposed on a surface (220a) of the first bracket (220), the first display (241) being configured to be movable relative to the first bracket (220); a printed circuit board PCB (250), the PCB (250) being arranged on another surface (220b) of the first bracket (220) opposite to the surface (220a) of the first bracket (220); a fan (270), the fan (270) being disposed between the PCB (250) and the first bracket (220); as well as A heat dissipation component (290), the heat dissipation component (290) comprising: a first area (290a) attached to a surface of the first display (241) facing the surface (220a) of the first bracket (220), and a second region (290b) attached to the other surface (220b) of the first bracket (220) facing the fan (270), Wherein, a portion (290c) of the heat dissipation member (290) located between the first region (290a) and the second region (290b) passes through the through hole (221) and is configured to be deformable according to movement of the first display (241) relative to the first bracket (220).

2. The electronic device (101; 200) according to claim 1, in, The portion (290c) of the heat dissipation member (290) includes a plurality of extension portions (290d) connected to each other, and The angles between the plurality of extension portions (290d) change due to the movement of the first display (241) relative to the first bracket (220).

3. The electronic device (101; 200) according to any one of claims 1 and 2, in, The area of ​​the first region (290a) corresponds to the area of ​​the surface of the first display (241).

4. The electronic device (101; 200) according to any one of claims 1 to 3, further comprising a heat sink (280), the heat sink (280) being disposed between the PCB (250) and the first bracket (220), the heat sink (280) comprising a plurality of fins (281) configured to pass an airflow generated by the fan (270), in, The housing (210) includes at least one outlet (216), which at least partially overlaps with the heat sink (280) when the housing (210) is viewed from above, and the at least one outlet (216) transmits airflow passing through the heat sink (280) to the outside of the housing (210).

5. The electronic device (101; 200) according to any one of claims 1 to 4, in, The housing (210) further comprises: a first surface (210a), the first surface (210a) facing the user when the electronic device (101; 200) is worn, and At least one first inlet (214), the at least one first inlet (214) penetrates the first surface (210a).

6. The electronic device (101; 200) according to any one of claims 1 to 5, in, The housing (210) further comprises: a first surface (210a), the first surface (210a) facing the user when the electronic device (101; 200) is worn, a second surface (210b), the second surface (210b) being opposite to the first surface (210a) and spaced apart from the first surface (210a), a lateral surface (210c), the lateral surface (210c) connecting the first surface (210a) and the second surface (210b), and At least one second inlet (215), the at least one second inlet (215) extending through the lateral surface (210c).

7. The electronic device (101; 200) according to any one of claims 1 to 6, further comprising: A movable flange (230), the movable flange (230) including a portion in the housing (210) coupled to the first display (241), and another portion disposed outside the housing (210); as well as a pinion gear (222), the pinion gear (222) being rotatable relative to the first bracket (220), The movable flange (230) includes a rack gear (234), and the rack gear (234) is arranged in the part of the movable flange (230) and meshes with the pinion gear (222).

8. The electronic device (101; 200) according to any one of claims 1 to 7, in, The first region (290a) is configured to transfer heat dissipated from the surface of the display to the portion of the movable flange (230) surrounding the first display (241).

9. The electronic device (101; 200) according to any one of claims 1 to 8, in, The movable flange (230) further includes a lens (233), the lens (233) being coupled to the other portion of the movable flange (230), and the lens (233) facing the user's body when the electronic device (101; 200) is worn.

10. The electronic device (101; 200) according to any one of claims 1 to 9, in, The housing (210) comprises at least one driving hole (211a, 211b) penetrating the housing (210), and The other part of the movable flange (230) is arranged outside the housing (210) by passing through the at least one driving hole (211a, 211b).

11. The electronic device (101; 200) according to any one of claims 1 to 10, in, The PCB (250) comprises: an electronic component, the electronic component being arranged on a surface of the PCB (250) facing the fan (270), a shielding cover (253) surrounding the electronic component, and A heat conductive material (254) is provided to fill a gap between the shielding cover (253) and the electronic component.

12. The electronic device (101; 200) according to any one of claims 1 to 11, in, The PCB (250) further includes a discharge member (255) disposed on an outer surface of the shield case (253).

13. The electronic device (101; 200) according to any one of claims 1 to 12, in, The PCB (250) includes a processor, and the processor is disposed on a surface of the PCB (250) facing the fan (270).

14. The electronic device (101; 200) according to any one of claims 1 to 13, comprising: a second bracket (260), the second bracket (260) accommodating the fan (270), the second bracket (260) being disposed between the PCB (250) and the first bracket (220); a first battery (261), the first battery (261) being coupled to the second bracket (260); and a second battery (262), the second battery (262) being spaced apart from the first battery, the second battery (262) being coupled to the second bracket (260), Wherein, the fan (270) is arranged between the first battery and the second battery.

15. An electronic device (101; 200) according to any one of claims 1 to 14, wherein the electronic device (101; 200) further comprises a second display (242), the second display (242) being spaced apart from the first display (241), the second display (242) being configured to be movable on the surface (220a) of the first bracket (220) in a direction approaching the first display (241) or in a direction away from the first display (241).

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