A dust removal method, apparatus, equipment and medium

Abstract

This invention relates to the field of dust removal technology, and more particularly to a dust removal method, apparatus, equipment, and medium. Based on the specifications of the sticky stick, the mapping relationship between the actual contact area between the sticky stick and the product to be cleaned and the downward pressure is determined. Based on the number of dust particles, the area of ​​each dust particle, and the mapping relationship, the number of sticky areas on the sticky stick and the corresponding downward pressure value are determined. According to the number of sticky areas, the sticky stick is divided into sticky areas. Any unsticky area is selected as the target area. The geometric center of the target area is aligned with the geometric center of the target dust particle, and the sticky stick is pressed down to remove dust using the specified pressure value. In this application, the sticky stick is divided into several sticky areas, ensuring that the geometric center of each sticky area coincides with the geometric center of the dust particle for effective dust removal. This avoids repeated contact between the sticky stick head and the product, preventing secondary contamination and improving the dust removal effect on the product to be cleaned.

Description

Technical Field

[0001] This invention relates to the field of dust removal technology, and in particular to a dust removal method, apparatus, equipment and medium. Background Technology

[0002] For a long time, dust has been a major factor affecting the yield of precision semiconductor components. To address this dust contamination problem, many solutions have been implemented. Existing dust removal devices typically employ wet cleaning or air-blowing cleaning methods to clean the surfaces of electronic components and optical elements. However, these methods often involve cleaning dusty and dust-free electronic components or optical elements together, which can easily lead to secondary contamination of previously dust-free surfaces. Besides causing secondary pollution, the cleaning effect is also less than ideal. Therefore, improving dust removal efficiency is a pressing issue in the process of removing dust from precision semiconductor components. Summary of the Invention

[0003] In view of this, embodiments of the present invention provide a dust removal method, apparatus, equipment and medium to solve the problem that the dust removal effect is not ideal in the process of dust removal of semiconductor precision devices.

[0004] In a first aspect, embodiments of the present invention provide a dust removal method, the dust removal method comprising:

[0005] Obtain the dusty area on the product to be cleaned, and determine the number of dust particles in the dusty area and the area of ​​each dust particle;

[0006] Obtain the specifications of the adhesive stick, and based on the specifications of the adhesive stick, determine the mapping relationship between the actual contact area between the adhesive stick and the product to be cleaned and the downward pressure;

[0007] Based on the number of dust particles, the area of ​​each dust particle, and the mapping relationship, the number of sticky areas of the sticky stick and the corresponding downward pressure value are determined. Based on the number of sticky areas, the sticky stick is divided into sticky areas to obtain at least one sticky area.

[0008] For any target dust, select any unattached dust-adhered area as the target area, align the geometric center of the target area with the geometric center of the target dust, and use the pressure value to press down the sticky stick to remove dust.

[0009] Secondly, embodiments of the present invention provide a dust removal device, the dust removal device comprising:

[0010] The acquisition module is used to acquire the dust area on the product to be cleaned, and determine the number of dust particles in the dust area and the area of ​​each dust particle;

[0011] The first determining module is used to obtain the specifications of the sticky stick and, based on the specifications of the sticky stick, determine the mapping relationship between the actual contact area between the sticky stick and the product to be cleaned and the downward pressure.

[0012] The segmentation module is used to determine the number of sticky areas and the corresponding downward pressure value of the sticky stick based on the number of dust particles, the dust area of ​​each dust particle, and the mapping relationship. Based on the number of sticky areas, the sticky stick is segmented into sticky areas to obtain at least one sticky area.

[0013] The dust removal module is used to select any non-dust-adhered dust area as the target area for any target dust, control the geometric center of the target area to align with the geometric center of the target dust, and use the pressure value to press down the dust removal stick to remove dust.

[0014] Thirdly, embodiments of the present invention provide a computer device, the computer device including a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the processor performs a dust removal method.

[0015] Fourthly, embodiments of the present invention provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the dust removal method as described in the first aspect.

[0016] The advantages of this invention compared to the prior art are:

[0017] The process involves identifying dusty areas on the product to be cleaned, determining the number of dust particles and the area of ​​each dust particle, obtaining the specifications of the adhesive stick, and determining the mapping relationship between the actual contact area between the adhesive stick and the product and the downward pressure based on the specifications of the adhesive stick. Based on the number of dust particles, the area of ​​each dust particle, and the mapping relationship, the number of adhesive areas on the adhesive stick and the corresponding downward pressure value are determined. The adhesive stick is then divided into adhesive areas to obtain at least one adhesive area. For any target dust, any unadhesive area is selected as the target area. The geometric center of the target area is aligned with the geometric center of the target dust, and the adhesive stick is pressed down to remove dust using the specified pressure value. In this application, the adhesive stick is divided into several adhesive areas, ensuring that the geometric center of the adhesive area coincides with the geometric center of the dust particle for effective dust removal. This avoids repeated contact between the used area of ​​the adhesive stick head and the product, preventing secondary contamination and improving the dust removal effect on the product to be cleaned. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic flowchart of a dust removal method provided in an embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram illustrating the relationship between actual contact area and compression amount provided in an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram illustrating the relationship between downward pressure and compression amount provided in an embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the structure of a dust removal device provided in an embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of the structure of a computer device provided in an embodiment of the present invention. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of the invention. However, those skilled in the art will understand that the invention can be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, circuits, and methods are omitted so as not to obscure the description of the invention with unnecessary detail.

[0026] It should be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0027] It should also be understood that the term “and / or” as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0028] As used in this specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if [described condition or event] is detected" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once [described condition or event] is detected," or "in response to detection of [described condition or event]."

[0029] Furthermore, in the description of this invention and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0030] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of the invention include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0031] It should be understood that the sequence number of each step in the following embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0032] To illustrate the technical solution of the present invention, specific embodiments are described below.

[0033] See Figure 1 This is a schematic flowchart of a dust removal method provided in Embodiment 1 of the present invention, as shown below. Figure 1 As shown, the dust removal method may include the following steps.

[0034] S101: Obtain the dusty area on the product to be cleaned, and determine the number of dust particles in the dusty area and the area of ​​each dust particle.

[0035] In step S101, a dusty area on the product to be cleaned is obtained, and the number of dust particles in the dusty area and the dust area of ​​each dust particle are determined. The dusty area is an area containing at least one dust particle, and the number of dust particles and the dust area of ​​each dust particle are determined in the dusty area.

[0036] In this embodiment, a surface image of the product to be cleaned is acquired, and the surface image is then subjected to grayscale and binarization processing to obtain a grayscale image. Binarization is the process of resetting the pixel values ​​of the grayscale image to 0 or 255 according to a certain rule, so that the surface image contains only black and white colors. Binarization greatly reduces the amount of data in the image while retaining a certain amount of information, which helps to shorten the subsequent image processing process.

[0037] To obtain the dust area on the product to be cleaned, the grayscale image can be compared with the standard grayscale image of the standard surface image of the product to be cleaned. The pixel values ​​at the same position in the grayscale image and the standard grayscale image are compared. If the difference between the pixel values ​​at the same position is greater than a preset threshold, then the pixel position is considered to be the corresponding dust, and the corresponding dust area is obtained.

[0038] It should be noted that the standard surface image and the surface image are dust-free product surface images taken by the same equipment at the same location and under the same environment.

[0039] After obtaining the dust area on the cleaning product, determine the number of dust particles in the dust area and the area of ​​each dust particle. The number of dust particles can be determined based on the connected regions of the dust particles, that is, dust particles in a connected region are defined as one dust particle. The area of ​​each dust particle can be determined based on the number of pixels of the dust particle. The number of pixels containing the dust particle is multiplied by the area of ​​each pixel to obtain the corresponding dust area of ​​each dust particle.

[0040] Optionally, the dusty areas on the product to be cleaned are obtained, including:

[0041] Obtain a surface image of the product to be cleaned;

[0042] Based on the pixel values ​​of the surface image, determine the dusty areas of the product to be cleaned.

[0043] In this embodiment, a surface image of the product to be cleaned is obtained, and the dust area of ​​the product to be cleaned is determined based on the pixel value of the surface image. That is, it is determined based on the difference in pixel value between the pixel point in the surface image and the normal pixel point. When the difference in pixel value is greater than a preset threshold, it is considered that there is corresponding dust.

[0044] It should be noted that when determining the pixel value difference between pixels, the pixel values ​​of normal pixels in the surface image are first determined. The pixel values ​​of normal pixels are then subtracted from the pixel values ​​of each individual pixel to obtain the pixel value difference between pixels. Pixels with pixel value differences greater than a preset threshold are identified as dusty areas of the product to be cleaned.

[0045] S102: Obtain the specifications of the adhesive stick and, based on the specifications, determine the mapping relationship between the actual contact area between the adhesive stick and the product to be cleaned and the downward pressure.

[0046] In step S102, the specifications of the sticky stick, i.e. the size of the sticky stick, are used to determine the mapping relationship between the actual contact area between the sticky stick and the product to be cleaned and the downward pressure. The mapping relationship represents the one-to-one correspondence between the downward pressure and the surface area of ​​the product to be cleaned when the size of the sticky stick is fixed.

[0047] In this embodiment, the sticky stick is a semi-solid, teardrop-shaped substance. It continuously dries in the air, releasing energy during the drying process. The internal molecular motion generates adsorption force, which then removes dust upon contact. Different stick specifications result in different mapping relationships between the actual contact area between the stick and the product to be cleaned and the downward pressure. After obtaining the stick's specifications, the mapping relationship between the actual contact area and the downward pressure is determined based on these specifications. That is, when the area to be covered by the stick is determined, the downward pressure of the stick can be determined according to the mapping relationship, ensuring that the actual contact area between the stick and the product to be cleaned meets the required standards under the corresponding downward pressure.

[0048] In this embodiment, when determining the mapping relationship between the actual contact area between the sticky stick and the product to be cleaned and the downward pressure, the relationship between the compression amount and the actual contact area is first determined. The compression amount is the deformation of the sticky stick under downward pressure when it contacts the product to be cleaned. The actual contact area increases with the continuous increase of the compression amount, and eventually tends to remain constant. (See also...) Figure 2 , Figure 2 This is a schematic diagram illustrating the relationship between actual contact area and compression amount according to an embodiment of the present invention. The horizontal axis represents the compression amount in millimeters, and the vertical axis represents the actual contact area between the sticky stick and the product to be cleaned in square millimeters. Then, the relationship between compression amount and downward pressure is determined, see [reference needed]. Figure 3 , Figure 3 This is a schematic diagram illustrating the relationship between downward pressure and compression amount provided in an embodiment of the present invention. The horizontal axis represents the compression amount in millimeters, and the vertical axis represents the downward pressure of the sticky stick in gauge pressure.

[0049] according to Figure 2 and Figure 3 To determine the mapping relationship between the actual contact area between the sticky stick and the product to be cleaned and the downward pressure, that is, when the required actual contact area between the sticky stick and the product to be cleaned is determined, according to... Figure 2 Determine the compression amount of the adhesive stick, based on Figure 3 This determines the downforce required for the corresponding compression amount.

[0050] In this embodiment, the mapping relationship between the actual contact area between the sticky stick and the product to be cleaned and the downward pressure is determined according to the specifications of the sticky stick, so as to determine the corresponding downward pressure. This allows the dust removal device to apply pressure to the sticky stick according to the downward pressure, so as to better remove the corresponding dust.

[0051] S103: Based on the number of dust particles, the dust area of ​​each dust particle, and the mapping relationship, determine the number of sticky areas of the sticky stick and the corresponding downward pressure value. Based on the number of sticky areas, divide the sticky stick into sticky areas to obtain at least one sticky area.

[0052] In step S103, based on the number of dust particles, the area of ​​each dust particle, and the mapping relationship, the number of sticky areas of the sticky stick and the corresponding downward pressure value are determined, wherein the number of sticky areas is not less than the number of dust particles. Based on the number of sticky areas, the sticky stick is divided into sticky areas to obtain at least one sticky area, wherein one sticky area is used to remove dust from one of the dust particles.

[0053] In this embodiment, the total area of ​​dust is calculated based on the number of dust particles and the area of ​​each dust particle. The actual contact area between the sticky stick and the product to be cleaned is then determined based on this total area. The actual contact area is greater than or equal to the total dust area to ensure that the sticky stick can completely remove dust from the corresponding dusty areas upon contact with the product. The number of sticky areas on the stick is determined based on the number of dust particles, and this number is not less than the number of dust particles.

[0054] Based on the corresponding mapping relationship and the actual contact surface, determine the pressure value of the dust removal rod so that the dust removal rod can achieve the corresponding actual contact area size under the corresponding pressure value.

[0055] Based on the number of dust-collecting areas, the sticky stick is divided into dust-collecting areas, with the number of areas equal to the number of dust-collecting areas. This ensures that if only one dust particle is removed from each dust-collecting area, the divided dust-collecting areas can remove all the dust.

[0056] It should be noted that when dividing the sticky stick into sticky areas based on the number of sticky areas, the sticky stick can be divided into sticky areas of equal size, that is, regardless of the size of the dust area, the sticky stick should be divided into equal areas. The number of sticky areas should not be less than the number of dust particles.

[0057] In this embodiment, the number of sticky areas of the sticky stick is determined according to the number of dust particles. The number of sticky areas is not less than the number of dust particles to ensure that during dust removal, a sticky area that has not been in contact with the dust can be used to contact the corresponding dust particles to remove them. This prevents the use of sticky areas that have been in contact with the dust particles to contact the corresponding dust particles, which could cause secondary pollution to the cleaning product.

[0058] In another embodiment, when determining the number of sticky areas of the sticky stick, it can also be determined according to a preset number of sticky areas, that is, the number of sticky areas is not related to the number of dust particles. The number of sticky areas is determined as a fixed value, and the sticky stick is divided into sticky areas according to the corresponding fixed value to obtain at least one sticky area.

[0059] It should be noted that after dividing the sticky stick into sticky areas according to the corresponding fixed values, one sticky area is still used to remove dust from one of the dust particles.

[0060] Optionally, the sticky stick is divided into sticky areas based on the number of sticky areas, resulting in at least one sticky area, including:

[0061] The area corresponding to the actual contact area is processed to obtain the processed area to be divided.

[0062] Based on the number of dust-adhesive areas, the area to be divided is divided into dust-adhesive areas to obtain at least one dust-adhesive area.

[0063] In this embodiment, the area corresponding to the actual contact area is processed to obtain the processed area to be divided. When processing the area corresponding to the actual contact area, the actual contact area can be inscribed in a square to obtain the inscribed square of the actual contact area. The inscribed square is then determined as the processed area to be divided.

[0064] Based on the number of dusty areas, the area to be divided is divided into dusty areas, and the number of dusty areas is equal to the number of dusty areas.

[0065] S104: For any target dust, select any non-dust-adhered dust-adhered area as the target area, control the geometric center of the target area to align with the geometric center of the target dust, and use pressure to press down the sticky stick to remove dust.

[0066] In step S104, for any target dust, any non-dust-adhered dust-adhered area is selected as the target area. The geometric center of the target area is aligned with the geometric center of the target dust, and the dust-adhering stick is pressed down to remove dust using a pressure value. When the geometric center of the target area is aligned with the geometric center of the target dust, and the dust-adhering stick is pressed down to remove dust using a pressure value, the target area is controlled to make contact with the dust for dust removal.

[0067] In this embodiment, to prevent secondary contamination of the product to be cleaned, a non-dusty dust-adhered area is used for dust removal. Any non-dusty dust-adhered area is designated as the target area. When using the target area for dust removal, the geometric center of the target area is aligned with the geometric center of the target dust, and pressure is applied to the dust-adhering stick for removal. Aligning the geometric center of the target area with the geometric center of the target dust ensures maximum contact area between the two, facilitating the removal of the corresponding dust from the target area.

[0068] Apply pressure to the sticky stick to remove dust, ensuring that the contact area between the stick and the product to be cleaned meets the actual contact area requirements, thus ensuring that the target area is divided based on the actual contact area.

[0069] It should be noted that when removing dust particles sequentially, the dust removal order can be arbitrary, determined based on the dust particle coordinates, or determined based on the size of the dust particles. This embodiment does not impose any limitations.

[0070] It should be noted that when removing dust, the sticky areas can be sequentially identified as target areas according to their arrangement. For example, if there are four sticky areas arranged in a two-row, two-column order, the sticky area in the first row and first column can be selected as the target area first, followed by the sticky area in the second row and second column, or vice versa. Other embodiments may also select target areas out of order; this embodiment does not impose such a limitation.

[0071] Optionally, before aligning the geometric center of the target area with the geometric center of the target dust and applying pressure to the sticky stick for dust removal, the method further includes:

[0072] Based on the area of ​​each dust particle, sort each dust particle to obtain the corresponding dust removal order;

[0073] Determine the target dust to be removed based on the dust removal sequence.

[0074] In this embodiment, each dust particle is sorted from largest to smallest according to its dust area to obtain the corresponding dust removal order. Based on the dust removal order, the target dust to be removed is determined, and the target area is used to remove the target dust.

[0075] In this embodiment, the corresponding dust removal sequence is determined based on the size of the dust area. When the dust area is larger than the target area, multiple sticky areas can be used as target areas to remove the dust. When using multiple sticky areas to remove dust, the geometric centers of the multiple sticky areas are aligned with the geometric center of the dust, and pressure is applied to the sticky stick to remove the dust.

[0076] It should be noted that after using multiple sticky areas to remove dust from a single dust particle, if the remaining number of dust particles is less than or equal to the number of unsticky areas, the corresponding target area and target dust particle are identified again. The geometric center of the target area is aligned with the geometric center of the target dust particle, and pressure is applied to the sticky stick for dust removal. If, after using multiple sticky areas to remove dust from a single dust particle, the remaining number of dust particles is greater than the number of unsticky areas, the corresponding target area and target dust particle are identified again. The geometric center of the target area is aligned with the geometric center of the target dust particle, and pressure is applied to the sticky stick for dust removal. If some dust particles remain unremoved, a new sticky stick can be used to remove the dust to prevent the previously used sticky areas from being used again.

[0077] In another embodiment, dust can be sorted according to the coordinates of its geometric center, i.e., dust removal is performed in the order of the coordinates of the dust's geometric center. When sorting by the coordinates of the dust's geometric center, sorting can be based on either the magnitude of the x-coordinate or the magnitude of the y-coordinate. If the x-coordinates are equal, then sorting is performed based on the magnitude of the y-coordinate, or vice versa. For example, if the dust's geometric centers are in the same row or column, their corresponding x-coordinates or the total y-coordinate are equal, and then sorting is performed based on either the magnitude of the y-coordinate or the magnitude of the x-coordinate. After sorting, dust is removed sequentially according to the corresponding sorting order.

[0078] The process involves identifying dusty areas on the product to be cleaned, determining the number of dust particles and the area of ​​each dust particle, obtaining the specifications of the adhesive stick, and determining the mapping relationship between the actual contact area between the adhesive stick and the product and the downward pressure based on the specifications of the adhesive stick. Based on the number of dust particles, the area of ​​each dust particle, and the mapping relationship, the number of adhesive areas on the adhesive stick and the corresponding downward pressure value are determined. The adhesive stick is then divided into adhesive areas to obtain at least one adhesive area. For any target dust, any unadhesive area is selected as the target area. The geometric center of the target area is aligned with the geometric center of the target dust, and the adhesive stick is pressed down to remove dust using the specified pressure value. In this application, the adhesive stick is divided into several adhesive areas, ensuring that the geometric center of the adhesive area coincides with the geometric center of the dust particle for effective dust removal. This avoids repeated contact between the used area of ​​the adhesive stick head and the product, preventing secondary contamination and improving the dust removal effect on the product to be cleaned.

[0079] See Figure 4 This is a schematic diagram of a dust removal device provided in an embodiment of the present invention. For ease of explanation, only the parts related to the embodiment of the present invention are shown. See also Figure 4 The dust removal device 40 includes: an acquisition module 41, a first determination module 42, a division module 43, and a dust removal module 44.

[0080] The acquisition module 41 is used to acquire the dust area on the product to be cleaned, and determine the number of dust particles in the dust area and the area of ​​each dust particle.

[0081] The first determining module 42 is used to obtain the specifications of the sticky stick and, based on the specifications of the sticky stick, determine the mapping relationship between the actual contact area between the sticky stick and the product to be cleaned and the downward pressure.

[0082] The segmentation module 43 is used to determine the number of sticky areas of the sticky stick and the corresponding downward pressure value based on the number of dust particles, the dust area of ​​each dust particle and the mapping relationship. Based on the number of sticky areas, the sticky stick is segmented into sticky areas to obtain at least one sticky area.

[0083] The dust removal module 44 is used to select any non-dust-adhered dust area as the target area for any target dust, control the geometric center of the target area to align with the geometric center of the target dust, and use pressure to press down the dust removal stick to remove dust.

[0084] Optionally, module 43 includes:

[0085] The processing unit is used to process the area corresponding to the actual contact area to obtain the processed area to be divided.

[0086] The unit is used to divide the area to be divided into at least one dusty area based on the number of dusty areas.

[0087] Optionally, the dust removal device 40 also includes:

[0088] The sorting module is used to sort each dust particle according to its area to obtain the corresponding dust removal order.

[0089] The second determining module is used to determine the target dust to be removed based on the dust removal sequence.

[0090] Optionally, the acquisition module 41 includes:

[0091] The acquisition unit is used to acquire a surface image of the product to be cleaned.

[0092] The determining unit is used to determine the dusty area of ​​the product to be cleaned based on the pixel values ​​of the surface image.

[0093] It should be noted that the information interaction and execution process between the above modules are based on the same concept as the method embodiments of the present invention. For details on their specific functions and technical effects, please refer to the method embodiments section, which will not be repeated here.

[0094] Figure 5 This is a schematic diagram of the structure of a computer device provided in an embodiment of the present invention. Figure 5 As shown, the computer device of this embodiment includes: at least one processor ( Figure 5 Only one is shown in the diagram), a memory, and a computer program stored in the memory and executable on at least one processor, which, when executed by the processor, implements the steps in any of the above-described dust removal method embodiments.

[0095] This computer device may include, but is not limited to, a processor and memory. Those skilled in the art will understand that... Figure 5 The examples of computer devices are merely examples and do not constitute a limitation on computer devices. Computer devices may include more or fewer components than shown in the illustration, or combinations of certain components, or different components, such as network interfaces.

[0096] The processor referred to can be a CPU, but it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor or any conventional processor.

[0097] Memory includes readable storage media, internal memory, etc., wherein internal memory can be the RAM of a computer device, providing an environment for the operation of the operating system and computer-readable instructions stored in the readable storage media. The readable storage media can be the hard drive of a computer device, or in other embodiments, it can be an external storage device of the computer device, such as a plug-in hard drive, Smart Media Card (SMC), Secure Digital (SD) card, or Flash Card. Furthermore, memory can include both internal storage units and external storage devices of the computer device. Memory is used to store the operating system, applications, bootloader, data, and other programs, such as program code for computer programs. Memory can also be used to temporarily store data that has been output or will be output.

[0098] Those skilled in the art will understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is used as an example. In practical applications, the functions described above can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this invention. The specific working process of the units and modules in the above device can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here. If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present invention can implement all or part of the processes in the methods of the above embodiments by instructing related hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the above method embodiments. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. A computer-readable medium can include at least: any entity or device capable of carrying computer program code, a recording medium, a computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signals, telecommunication signals, and software distribution media. Examples include USB flash drives, portable hard drives, magnetic disks, or optical disks. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electrical carrier signals or telecommunication signals.

[0099] The present invention can implement all or part of the processes in the methods of the above embodiments, or it can be accomplished by a computer program product. When the computer program product is run on a computer device, the computer device executes the steps in the above method embodiments.

[0100] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0101] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0102] In the embodiments provided by this invention, it should be understood that the disclosed apparatus / computer devices and methods can be implemented in other ways. For example, the apparatus / computer device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0103] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0104] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A dust removal method, characterized in that, The dust removal method includes: Identify the dusty areas on the product to be cleaned, and define dust particles located within the same connected region as a single unit. The number of dust particles in the dusty area is obtained, and the dust surface of each dust particle is determined based on the number of pixels in each dust particle. product; Obtain the specifications of the adhesive stick, and determine the actual contact between the adhesive stick and the product to be cleaned based on the specifications. Mapping relationship between area and downforce; Based on the number of dust particles and the area of ​​each dust particle, the total area of ​​the dust is calculated. Based on the total area of ​​the dust, the adhesion is determined. The actual contact area between the dust stick and the product to be cleaned is greater than or equal to the total area of ​​the dust, according to the corresponding mapping. Based on the relationship and actual contact area, determine the pressure value of the sticky stick when pressing down, and determine the sticky stick's sticking area based on the number of dust particles. Quantity; The actual contact area is inscribed in a square to obtain an inscribed square of the actual contact area. The inscribed square... The shape is determined as the area to be divided after processing; based on the number of dust-adhesive areas, only one dust particle is removed from each dust-adhesive area. Constraints are applied to divide the area to be divided into a number of dust-adhesive areas equal to the number of dust-adhesive areas. For any target dust, select any non-dust-adhered dust-adhered area as the target area, and control the geometric center of the target area. Align the center of the sticky stick with the geometric center of the target dust and apply the pressure value to remove the dust.

2. The dust removal method as described in claim 1, characterized in that, The geometric center of the control target area and the Before aligning the geometric center of the target dust and applying the pressure value to the sticky stick for dust removal, the process also includes: Based on the area of ​​each dust particle, sort each dust particle to obtain the corresponding dust removal order; Based on the dust removal sequence, the target dust to be removed is determined.

3. The dust removal method as described in claim 1, characterized in that, The process of obtaining the dusty area on the product to be cleaned includes: Obtain a surface image of the product to be cleaned; The dusty areas of the product to be cleaned are determined based on the pixel values ​​of the surface image.

4. A dust removal device, characterized in that, The dust removal device includes: The acquisition module is used to acquire dusty areas on the product to be cleaned, and to group the dusty areas that are located in the same connected region. A dust particle is defined as a single dust particle, the number of dust particles in the dusty area is obtained, and the number of pixels per dust particle is determined based on the number of pixels in each dust particle. The area of ​​a dust particle; The first determining module is used to obtain the specifications of the adhesive stick and, based on the specifications of the adhesive stick, determine the compatibility of the adhesive stick with the material to be used. The mapping relationship between the actual contact area of ​​a cleaning product and the downward pressure; The segmentation module is used to calculate the total area of ​​dust based on the number of dust particles and the area of ​​each dust particle. The total area determines the actual contact area between the sticky stick and the product to be cleaned. The actual contact area must be greater than or equal to the total area of ​​the dust. Based on the corresponding mapping relationship and the actual contact area, determine the pressure value of the sticky stick and the stickiness based on the number of dust particles. The number of dust-adhesive areas on the dust stick; the actual contact area is inscribed in a square to obtain the inscribed square of the actual contact area. The shape is used to define the inscribed square as the processed area to be divided; based on the number of dust-adhesive areas, each dust-adhesive area is divided into only... Using the removal of one dust particle as a constraint, the area to be divided is divided into dusty areas of equal number to the number of dusty areas. The dust removal module is used to select any non-dust-adhered dust area as the target area for any given dust, and to control the target area... The geometric center of the target area is aligned with the geometric center of the target dust, and the sticky stick is pressed down using the pressure value. Dust removal.

5. The dust removal device as described in claim 4, characterized in that, The dust removal device also includes: The sorting module is used to sort each dust particle according to its area to obtain the corresponding dust removal order; The second determining module is used to determine the target dust to be removed based on the dust removal sequence.

6. The dust removal device as described in claim 4, characterized in that, The acquisition module includes: Acquisition unit, used to acquire surface images of the product to be cleaned; The determining unit is used to determine the dusty area of ​​the product to be cleaned based on the pixel values ​​of the surface image.

7. A computer device, characterized in that, The computer device includes a processor, a memory, and storage devices. A computer program stored in memory and executable on the processor, wherein the processor, when executing the computer program, implements the following: The dust removal method described in any one of claims 1 to 3.

8. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the dust removal method as described in any one of claims 1 to 3.

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