OLED display screen manufacturing substrate laser cutting equipment and method

Abstract

The invention discloses OLED display screen manufacturing substrate laser cutting equipment and method, and relates to the technical field of laser cutting, the OLED display screen manufacturing substrate laser cutting equipment comprises a rack, the rack is slidably connected with a lifting frame, guide blocks are fixedly connected to the four sides of the interior of the rack, and sliding frames are slidably connected to the four sides of the lifting frame in a penetrating mode; the sliding frame is slidably connected with a positioning frame used for clamping and positioning the side edge of the edge of the base plate, and the positioning frame is slidably connected with a pressing frame used for pressing and limiting the top of the edge of the base plate in the vertical direction. According to the laser cutting device, by means of limiting cooperation of the guide block and the sliding frame, the positioning frame and the pressing frame can be automatically driven to flexibly limit the side edge and the top of the edge of the base plate in the process that the base plate is upwards close to the laser generator, and the phenomenon that the base plate is layered or warped due to temperature change generated during laser cutting is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of laser cutting, and in particular to a laser cutting device and method for a substrate for manufacturing an OLED display screen. Background Art

[0002] OLED substrates are usually composed of multiple layers of different materials (such as glass, plastic, metal, etc.). The thermal expansion coefficients and elastic moduli of these materials are different. The heat generated during the laser cutting process may cause the local temperature of the substrate to rise. When the substrate changes in temperature or is subjected to external forces, it will cause thermal expansion or contraction, thereby changing the stress distribution inside the substrate, which is prone to delamination or warping.

[0003] Although existing fixing devices and technologies, such as vacuum adsorption platforms, can effectively fix most areas, their control over the edges is relatively weak. Especially when the substrate size is large, the processing effect of the vacuum adsorption platform is limited, making the edges of large-sized substrates more susceptible to external factors and warping. In particular, maintaining the flatness of the substrate during long-term processing is still a challenge.

[0004] In order to further optimize the fixing measures for the substrate during the laser cutting process, the present invention provides a laser cutting device and method for a substrate in manufacturing an OLED display screen. Summary of the invention

[0005] In order to overcome the shortcoming that the edge of a large-sized substrate is easily warped, the present invention provides a laser cutting device and method for a substrate for manufacturing an OLED display screen.

[0006] A laser cutting device for manufacturing substrates of an OLED display screen comprises a frame, a first fixed frame is fixedly connected to the top of the frame, a laser generator is arranged in the first fixed frame, the frame is slidably connected to a lifting frame, an adsorption plate for vacuum adsorption of the substrate is fixedly connected in the middle of the lifting frame, guide blocks are fixedly connected to the four sides inside the frame, the guide blocks are provided with guide grooves, the four sides of the lifting frame are slidably connected to sliding frames, the guide blocks are slidably connected to the adjacent sliding frames through the guide grooves, the sliding frame is slidably connected to a positioning frame for clamping and positioning the side of the edge of the substrate, a spring is fixedly connected between the positioning frame and the adjacent sliding frame, and the positioning frame is slidably connected to a pressing frame for pressing and limiting the top of the edge of the substrate in an up-and-down direction.

[0007] In a preferred embodiment of the present invention, it also includes a first linear motor symmetrically distributed along the first fixed frame, the first linear motor is fixed to the inside of the first fixed frame, a sliding frame is slidably connected between the symmetrically distributed first linear motors, and the laser generator is slidably connected to the sliding frame.

[0008] In a preferred embodiment of the present invention, it further includes a second fixed frame symmetrically distributed along the frame, the second fixed frame is fixedly connected to the frame, the second fixed frame is fixedly connected to a second linear motor, and the moving part of the second linear motor is fixedly connected to the lifting frame.

[0009] In a preferred embodiment of the present invention, a negative pressure pump is further included. The negative pressure pump is fixed in the frame and is connected to the adsorption plate through an air suction pipe.

[0010] In a preferred embodiment of the present invention, it also includes a cylinder, the cylinder is fixedly connected in the frame, a guide plate is slidably connected in the frame, the guide plate is fixedly connected to the telescopic rod of the cylinder, a first fixed cylinder is fixed in the frame, the first fixed cylinder is slidably connected to a first sliding valve, the guide plate is slidably connected to the first sliding valve through an inclined groove, the first sliding valve has a triangular valve hole, the first fixed cylinder is connected to the suction pipe of the negative pressure pump through the valve hole of the first sliding valve, the laser generator is fixedly connected to a speed sensor, and the speed sensor is electrically connected to the cylinder through a control module.

[0011] In a preferred embodiment of the present invention, it also includes a rotating rod corresponding to the positioning frame, the rotating rod is rotatably connected to the corresponding positioning frame, the rotating rod is fixedly connected to a first connecting rod, the side of the sliding frame close to the adjacent first connecting rod is set as an inclined surface, the sliding frame is squeezed and matched with the adjacent first connecting rod through the inclined surface, at least one second connecting rod is rotatably connected between the rotating rod and the adjacent pressing frame, and at least one torsion spring is fixedly connected between the rotating rod and the adjacent positioning frame.

[0012] In a preferred embodiment of the present invention, a servo motor is further included, wherein the servo motor is fixedly connected to the sliding frame, the output shaft of the servo motor is fixedly connected to a screw rod, the screw rod is rotationally connected to the sliding frame, the laser generator is threadedly connected to the screw rod, the sliding frame is fixedly connected to guide columns symmetrically distributed along the sliding frame, and the laser generator is slidably connected to the guide columns.

[0013] In a preferred embodiment of the present invention, it also includes a cold air pump, the cold air pump is fixedly connected in the frame, a second fixed cylinder is fixedly connected in the frame, the second fixed cylinder is slidably connected to a second sliding valve, the guide plate is slidably connected to the second sliding valve through an inclined groove, the second sliding valve has a triangular valve hole, a nozzle surrounded by four sides is fixedly connected to the bottom of the laser generator, the cold air pump is connected to the nozzle through an air blowing pipe, and the second fixed cylinder is connected to the air blowing pipe of the cold air pump through the valve hole of the second sliding valve.

[0014] A method for laser cutting a substrate for manufacturing an OLED display screen comprises the following steps:

[0015] S1: placing a substrate on the adsorption plate;

[0016] S2: controlling the first linear motor and the servo motor to adjust the laser generator to be directly above the substrate;

[0017] S3: starting the negative pressure pump so that the substrate is adsorbed on the adsorption plate;

[0018] S4: starting the second linear motor to control the lifting frame to move upward until the positioning frame and the pressing frame are in contact with the substrate;

[0019] S5: Turn on the laser generator, and control the first linear motor and the servo motor to make the laser generator start to move, so as to start laser cutting of the substrate, and at the same time turn on the cold air pump to cool down the laser cutting area.

[0020] Compared with the prior art, the present invention has the following advantages: 1. The present invention utilizes the limiting cooperation of the guide block and the sliding frame, so that in the process of moving the substrate upward close to the laser generator, the positioning frame and the pressing frame can be automatically driven to flexibly limit the edge sides and the top of the substrate respectively, thereby avoiding the phenomenon of delamination or warping of the substrate caused by the temperature change generated during laser cutting.

[0021] 2. The present invention can uniformly adsorb the substrate through the porous adsorption plate to enhance the fixation of the substrate. At the same time, the cold air pump allows cold air to flow to the nozzle to cool the laser cutting area, further reducing the impact of temperature changes on the substrate.

[0022] 3. The present invention utilizes the fact that the thicker the substrate, the slower the laser cutting speed, to control the extension and retraction degree of the cylinder telescopic rod, thereby controlling the valve opening degree of the first sliding valve and the second sliding valve, and then controlling the amount of air adsorbed by the negative pressure pump and the amount of cold air sprayed by the cold air pump, so that when the substrate is thicker, the adsorption plate adsorbs the substrate more tightly, and the nozzle sprays more cold air on the laser cutting part of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0024] Figure 2 It is a three-dimensional structural cross-sectional view of the present invention.

[0025] Figure 3 It is a three-dimensional structural schematic diagram of the lifting frame, adsorption plate, guide block and other components of the present invention.

[0026] Figure 4It is a three-dimensional structural schematic diagram of the sliding frame, the positioning frame, the pressing frame and other components of the present invention.

[0027] Figure 5 It is a three-dimensional structural schematic diagram of the guide plate, the first fixed cylinder, the first sliding valve and other components of the present invention.

[0028] Figure 6 It is a schematic diagram of the three-dimensional structure of the lifting frame, adsorption plate, second linear motor and other components of the present invention.

[0029] Figure 7 It is a three-dimensional structural schematic diagram of the negative pressure pump, the first fixed cylinder and the first sliding valve of the present invention.

[0030] Figure 8 It is a schematic diagram of the three-dimensional structure of the first fixed cylinder and the first sliding valve of the present invention.

[0031] Fig. 9 It is a three-dimensional structural schematic diagram of the first connecting rod, the second connecting rod, the torsion spring and other components of the present invention.

[0032] Fig.10 It is a three-dimensional structural schematic diagram of the servo motor, screw rod, guide column and other components of the present invention.

[0033] Fig.11 It is a schematic diagram of the three-dimensional structure of the guide plate, the second fixed cylinder and other components of the present invention.

[0034] Fig.12 It is a three-dimensional structural schematic diagram of components such as the cold air pump and the second sliding valve of the present invention.

[0035] Fig.13 It is a three-dimensional structural schematic diagram of components such as the laser generator and the cold air pump of the present invention.

[0036] Among them, the above-mentioned drawings include the following drawing marks: 101, frame, 102, first fixed frame, 103, first linear motor, 104, sliding frame, 105, laser generator, 106, lifting frame, 107, adsorption plate, 108, guide block, 109, sliding frame, 110, positioning frame, 111, spring, 112, pressing frame, 201, second fixed frame, 202, second linear motor, 203, negative pressure pump, 204, cylinder, 205, guide plate, 206, first fixed cylinder, 207, first sliding valve, 208, speed sensor, 301, rotating rod, 302, first connecting rod, 303, second connecting rod, 304, torsion spring, 401, servo motor, 402, screw, 403, guide column, 501, cold air pump, 502, second fixed cylinder, 503, second sliding valve, 504, nozzle. DETAILED DESCRIPTION

[0037] First of all, it should be pointed out that in the different described embodiments, the same parts are provided with the same reference numerals or the same component names, wherein the disclosure contained in the entire description can be transferred to the same parts with the same reference numerals or the same component names. Selected positional descriptions in the description, such as top, bottom, lateral, etc., also refer to the directly described and shown figures and are transferred to the new positions in the case of a change in position.

[0038] Embodiment 1: A laser cutting device for manufacturing a substrate of an OLED display screen, such as Figure 1-Figure 4 As shown, it includes a frame 101, a first fixed frame 102 is fixedly connected to the top of the frame 101, first linear motors 103 symmetrically distributed along the left and right sides of the first fixed frame 102 are fixedly connected inside the first fixed frame 102, a sliding frame 104 is slidably connected between the first linear motors 103 symmetrically distributed along the front-to-back direction, a laser generator 105 is slidably connected inside the sliding frame 104 along the left-to-right direction, the laser generator 105 generates a high-energy-density laser beam, which quickly heats the substrate material to the melting point, thereby achieving the purpose of cutting, a lifting frame 106 is slidably connected to the middle of the frame 101 along the up-down direction, an adsorption plate 107 is fixedly connected in the middle of the lifting frame 106, and the adsorption plate 107 is used for vacuum adsorption of the substrate, and the front, back, left, and right sides of the upper inner side of the frame 101 are A guide block 108 is fixedly connected, and a guide groove is opened on the guide block 108. Slide frames 109 are slidably connected to the four sides of the lifting frame 106. The guide block 108 is slidably connected to the adjacent slide frame 109 through the guide groove, so that when the lifting frame 106 drives the slide frame 109 to rise, the slide frame 109 is guided by the guide groove of the guide block 108 and moves toward the middle along the lifting frame 106. A positioning frame 110 is slidably connected to the slide frame 109. The positioning frame 110 is used to clamp and position the side of the edge of the substrate. A spring 111 is fixed between the positioning frame 110 and the adjacent slide frame 109. The opposite end surfaces of the four positioning frames 110 are slidably connected to the pressing frame 112 in the up-and-down direction. The pressing frame 112 is used to press and limit the top of the edge of the substrate.

[0039] Embodiment 2: Based on embodiment 1, Figure 5-Figure 8As shown, it also includes a second fixed frame 201 symmetrically distributed along the frame 101, the second fixed frame 201 is fixedly connected to the frame 101, the second fixed frame 201 is fixedly connected to a second linear motor 202, the moving part of the second linear motor 202 is fixedly connected to the lifting frame 106, a negative pressure pump 203 is fixedly connected to the left side of the frame 101, the negative pressure pump 203 is connected to the adsorption plate 107 through an air suction pipe, a cylinder 204 is fixedly connected to the rear side of the frame 101, and a guide plate 205 is slidably connected to the frame 101 in the up and down direction, and the guide plate 205 and the cylinder 204 are connected. The telescopic rod is fixed, and a first fixed cylinder 206 is fixed on the left side of the frame 101. A first sliding valve 207 is slidably connected in the first fixed cylinder 206 along the left and right directions. The guide plate 205 is slidably connected to the first sliding valve 207 through the inclined groove on the left. The first sliding valve 207 has a triangular valve hole. The first fixed cylinder 206 is connected to the suction pipe of the negative pressure pump 203 through the valve hole of the first sliding valve 207. A speed sensor 208 is fixed on the lower front side of the laser generator 105, and the speed sensor 208 is electrically connected to the cylinder 204 through the control module.

[0040] like Fig. 9 As shown, it also includes a rotating rod 301 corresponding to the positioning frame 110, the rotating rod 301 is rotatably connected to the corresponding positioning frame 110, a first connecting rod 302 is fixedly connected in the middle of the rotating rod 301, a side of the sliding frame 109 close to the adjacent first connecting rod 302 is set as an inclined surface, the sliding frame 109 is squeezed and matched with the adjacent first connecting rod 302 through the inclined surface, two second connecting rods 303 are rotatably connected between the rotating rod 301 and the adjacent pressing frame 112, and two torsion springs 304 are fixedly connected between the rotating rod 301 and the adjacent positioning frame 110.

[0041] like Fig.10 As shown, it also includes a servo motor 401, which is fixedly connected to the sliding frame 104. The output shaft of the servo motor 401 is fixedly connected to a screw 402, which is rotatably connected to the sliding frame 104. The laser generator 105 is threadedly connected to the screw 402. The sliding frame 104 is fixedly connected to guide columns 403 symmetrically distributed along the front and back of the sliding frame 104, and the laser generator 105 is slidably connected to the guide columns 403.

[0042] like Figure 11-13As shown, it also includes a cold air pump 501, which is fixedly connected to the right side of the frame 101. A second fixed cylinder 502 is fixedly connected to the right side of the frame 101. A second sliding valve 503 is slidably connected in the second fixed cylinder 502 along the left and right directions. The guide plate 205 is slidably connected to the second sliding valve 503 through the right inclined groove. The second sliding valve 503 has a triangular valve hole. A nozzle 504 surrounded by four sides is fixedly connected to the bottom of the laser generator 105. The cold air pump 501 is connected to the nozzle 504 through an air blowing pipe, and the second fixed cylinder 502 is connected to the air blowing pipe of the cold air pump 501 through the valve hole of the second sliding valve 503.

[0043] Working principle: First, place the substrate on the adsorption plate 107, then start the first linear motor 103, control the sliding frame 104 to drive the laser generator 105 to move back and forth, and then start the servo motor 401 to control the screw 402 to rotate, so that the laser generator 105 moves left and right along the guide column 403, and the laser generator 105 can be adjusted to be directly above the substrate.

[0044] Next, the negative pressure pump 203 is started. Under the action of negative pressure, the air between the adsorption plate 107 and the substrate is sucked into the negative pressure pump 203 by the negative pressure. Thus, the substrate can be evenly adsorbed through the porous adsorption plate 107, thereby enhancing the fixation of the substrate.

[0045] Subsequently, the second linear motor 202 is started to control the lifting frame 106 to move upward, thereby driving the guide block 108 to move upward. The guide block 108 pushes the sliding frame 109 to slide toward the side close to the adsorption plate 107 through the guide groove. The sliding frame 109 drives the positioning frame 110 to move through the spring 111, so that the rubber pad of the positioning frame 110 moves to contact the side surfaces of the substrate, thereby flexibly clamping the four sides of the edge of the substrate to avoid damage to the substrate.

[0046] In the above process, the rotating rod 301, the first connecting rod 302, the second connecting rod 303 and the torsion spring 304 move synchronously with the pressing frame 112 on the same side. When the rubber pad of the positioning frame 110 contacts the side surfaces of the substrate, the positioning frame 110, the pressing frame 112, the rotating rod 301, the first connecting rod 302, the second connecting rod 303 and the torsion spring 304 stop moving, while the lifting frame 106 continues to move upward, so that the sliding frame 109 continues to slide toward the side close to the adsorption plate 107. At this time, the spring 111 is compressed, and the sliding frame 109 swings upward by squeezing the first connecting rod 302 through the inclined surface, and the torsion spring 304 is deformed. The rod 302 drives the rotating rod 301 to rotate, and the rotating rod 301 pushes the pressing frame 112 to move downward through the second connecting rod 303, so that the rubber pad on the pressing frame 112 moves downward to contact the top surface of the substrate. In this way, a downward pressing clamping force is applied to the substrate to prevent the edge from warping. In summary, the present invention utilizes the limiting cooperation of the guide block 108 and the sliding frame 109, so that in the process of moving the substrate upward close to the laser generator 105, the positioning frame 110 and the pressing frame 112 can be automatically driven to flexibly limit the edge sides and top of the substrate respectively, thereby avoiding the phenomenon of delamination or warping of the substrate caused by temperature changes caused by laser cutting.

[0047] After completing the above-mentioned adsorption fixation and clamping fixation operations, the laser generator 105 can be turned on, and the laser generator 105 starts to move by controlling the first linear motor 103 and the servo motor 401, so as to start laser cutting of the substrate. At the same time, the cold air pump 501 is turned on to allow the cold air to flow to the nozzle 504 to cool down the local area of ​​the laser cutting. Since thick substrates may generate greater internal stress or greater heat during cutting, it is necessary to slow down the cutting speed to prevent the occurrence of other defects such as cracks, delamination or warping. Specifically: the speed of the laser generator 105 moving forward and backward or left and right is slowed down by artificial control, and according to the detected moving speed of the laser generator 105, the speed sensor 208 controls the laser generator 105 to move forward and backward or left and right. The control module controls the extension degree of the telescopic rod of the cylinder 204. The thicker the substrate, the slower the cutting speed, and thus the longer the telescopic rod of the cylinder 204 is extended, thereby driving the guide plate 205 to move upward for a longer distance, and further pushing the first sliding valve 207 to move to the left for a longer distance, and at the same time, the longer the second sliding valve 503 moves to the right, the larger the valve opening of the first sliding valve 207 and the second sliding valve 503, the larger the valve opening of the first sliding valve 207, the more air is sucked into the negative pressure pump 203, and the greater the negative pressure, the tighter the adsorption plate 107 adsorbs the substrate, increasing the adsorption force on the thick substrate, and the larger the valve opening of the second sliding valve 503, the more cold air is ejected from the cold air pump 501, thereby enhancing the cooling effect on the thick substrate.

[0048] Example 3: Based on Example 2, a method for laser cutting a substrate for manufacturing an OLED display screen includes the following steps: S1: placing a substrate on an adsorption plate 107; S2: controlling the first linear motor 103 and the servo motor 401 to adjust the laser generator 105 to be directly above the substrate; S3: starting the negative pressure pump 203 to adsorb the substrate on the adsorption plate 107; S4: starting the second linear motor 202 to control the lifting frame 106 to move upward until the positioning frame 110 and the pressing frame 112 are in contact with the substrate; S5: turning on the laser generator 105, and controlling the first linear motor 103 and the servo motor 401 to start the laser generator 105 to start laser cutting the substrate, and at the same time turning on the cold air pump 501 to cool down the laser-cut part.

[0049] Although the present disclosure has been described with respect to only a limited number of embodiments, those skilled in the art having benefit of this disclosure will appreciate that various other embodiments can be devised without departing from the scope of the present invention. Accordingly, the scope of the present invention should be limited only by the appended claims.

Claims

1. A laser cutting device for substrates used in manufacturing OLED display screens, characterized in that: The invention comprises a frame (101), the top of the frame (101) is fixedly connected to a first fixed frame (102), a laser generator (105) is arranged inside the first fixed frame (102), the frame (101) is slidably connected to a lifting frame (106), a suction plate (107) for vacuum suction of a substrate is fixedly connected in the middle of the lifting frame (106), guide blocks (108) are fixedly connected to the four sides of the frame (101), the guide blocks (108) are provided with guide grooves, and the lifting frame (106) is fixedly connected to the lifting frame (106). The four sides are all slidably connected with a sliding frame (109); the guide block (108) is slidably connected to the adjacent sliding frame (109) through a guide groove; the sliding frame (109) is slidably connected to a positioning frame (110) for clamping and positioning the side of the edge of the substrate; a spring (111) is fixedly connected between the positioning frame (110) and the adjacent sliding frame (109); the positioning frame (110) is slidably connected to a pressing frame (112) for pressing and limiting the top of the edge of the substrate along the up and down directions.

2. The laser cutting device for manufacturing substrate of OLED display screen according to claim 1, characterized in that: It also includes first linear motors (103) symmetrically distributed along the first fixed frame (102), the first linear motors (103) are fixedly connected to the inside of the first fixed frame (102), a sliding frame (104) is slidably connected between the symmetrically distributed first linear motors (103), and the laser generator (105) is slidably connected to the sliding frame (104).

3. The laser cutting device for manufacturing substrate of OLED display screen according to claim 2, characterized in that: It also includes a second fixed frame (201) symmetrically distributed along the frame (101), the second fixed frame (201) is fixedly connected to the frame (101), the second fixed frame (201) is fixedly connected to a second linear motor (202), and the moving part of the second linear motor (202) is fixedly connected to the lifting frame (106).

4. The laser cutting device for manufacturing substrate of OLED display screen according to claim 3 is characterized in that: It also includes a negative pressure pump (203), which is fixed inside the frame (101) and is connected to the adsorption plate (107) via an air suction pipe.

5. The laser cutting device for manufacturing substrate of OLED display screen according to claim 4, characterized in that: It also includes a cylinder (204), the cylinder (204) is fixedly connected in the frame (101), a guide plate (205) is slidably connected in the frame (101), the guide plate (205) is fixedly connected to the telescopic rod of the cylinder (204), a first fixed cylinder (206) is fixedly connected in the frame (101), the first fixed cylinder (206) is slidably connected to a first sliding valve (207), the guide plate (205) is slidably connected to the first sliding valve (207) through an inclined groove, the first sliding valve (207) is provided with a triangular valve hole, the first fixed cylinder (206) is connected to the suction pipe of the negative pressure pump (203) through the valve hole of the first sliding valve (207), the laser generator (105) is fixedly connected to a speed sensor (208), and the speed sensor (208) is electrically connected to the cylinder (204) through a control module.

6. The laser cutting device for manufacturing substrate of OLED display screen according to claim 5, characterized in that: It also includes a rotating rod (301) corresponding to the positioning frame (110), the rotating rod (301) is rotatably connected to the corresponding positioning frame (110), the rotating rod (301) is fixedly connected to a first connecting rod (302), the side of the sliding frame (109) close to the adjacent first connecting rod (302) is set as an inclined surface, the sliding frame (109) is squeezed and matched with the adjacent first connecting rod (302) through the inclined surface, at least one second connecting rod (303) is rotatably connected between the rotating rod (301) and the adjacent pressing frame (112), and at least one torsion spring (304) is fixedly connected between the rotating rod (301) and the adjacent positioning frame (110).

7. The laser cutting device for manufacturing substrate of OLED display screen according to claim 6, characterized in that: The invention also includes a servo motor (401), wherein the servo motor (401) is fixedly connected to the sliding frame (104), the output shaft of the servo motor (401) is fixedly connected to a screw rod (402), the screw rod (402) is rotationally connected to the sliding frame (104), the laser generator (105) is threadedly connected to the screw rod (402), the sliding frame (104) is fixedly connected to guide posts (403) symmetrically distributed along the sliding frame (104), and the laser generator (105) is slidably connected to the guide posts (403).

8. The laser cutting device for manufacturing substrate of OLED display screen according to claim 7, characterized in that: The invention also includes a cold air pump (501), wherein the cold air pump (501) is fixedly connected to the frame (101), a second fixed cylinder (502) is fixedly connected to the frame (101), the second fixed cylinder (502) is slidably connected to a second sliding valve (503), the guide plate (205) is slidably connected to the second sliding valve (503) through an inclined groove, the second sliding valve (503) is provided with a triangular valve hole, the bottom of the laser generator (105) is fixedly connected to a nozzle (504) surrounded by four sides, the cold air pump (501) is connected to the nozzle (504) through an air blowing pipe, and the second fixed cylinder (502) is connected to the air blowing pipe of the cold air pump (501) through the valve hole of the second sliding valve (503).

9. A method for laser cutting a substrate for manufacturing an OLED display screen, using the laser cutting device for manufacturing a substrate for an OLED display screen as claimed in claim 8, comprising the following steps: S1: placing a substrate on the adsorption plate (107); S2: controlling the first linear motor (103) and the servo motor (401) to adjust the laser generator (105) to be directly above the substrate; S3: starting the negative pressure pump (203) so that the substrate is adsorbed on the adsorption plate (107); S4: starting the second linear motor (202) to control the lifting frame (106) to move upward until the positioning frame (110) and the pressing frame (112) are both in contact with the substrate; S5: Turn on the laser generator (105), and control the first linear motor (103) and the servo motor (401) to start the movement of the laser generator (105), thereby starting laser cutting of the substrate, and at the same time turn on the cold air pump (501) to cool down the laser-cut area.

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