Laser punching equipment for processing high-frequency PCB (Printed Circuit Board)

Abstract

The invention discloses laser punching equipment for high-frequency PCB machining, and relates to the technical field of high-frequency PCB machining, the laser punching equipment comprises a support, the surface of the support is fixedly connected with a box body, the top of the support is fixedly connected with a first lead screw sliding table, the output end of the first lead screw sliding table is fixedly connected with a linear motor, and the output end of the linear motor is fixedly connected with a second lead screw sliding table; and the output end of the linear motor is in sliding connection with a laser hot melting device. According to the laser punching equipment for high-frequency PCB machining, the clamping assembly drives the positioning assemblies to get close to a PCB, meanwhile, the clamping assembly slidably supports the positioning assemblies, the two oppositely-arranged positioning assemblies are made to be tightly attached to the PCB, the PCB is completely limited, the four side faces of the PCB are clamped along with driving of the electric cylinder and the clamping assembly, and the clamping assembly is driven by the electric cylinder and the clamping assembly. The stable clamping of the side face position can effectively prevent the board body from being damaged, and the problems that a positioning and clamping mechanism of the PCB is low in precision and a circuit in the board is prone to being damaged are solved.

Description

Technical Field

[0001] The invention relates to the technical field of high-frequency PCB board processing, in particular to a laser punching device for high-frequency PCB board processing. Background Art

[0002] The basic principle of laser perforation is: when a laser beam of a certain energy is irradiated on the surface of a metal sheet, in addition to a part being reflected, the energy absorbed by the metal causes the metal to melt to form a molten pool, and the absorption rate of the molten metal relative to the metal surface increases, that is, it can absorb more energy to accelerate the melting of the metal. At this time, properly controlling the energy and air pressure can remove the molten metal in the molten pool and continuously deepen the molten pool until the metal is penetrated. The Chinese patent announcement number is: CN116618862B discloses "A PCB board processing laser punching equipment". In this patent, through the setting of the processing box, the pressing rod and the active folding plate can be used to cooperate with each other to realize the automatic rotation and pressing of the squeezing roller when the PCB board is pressed down and placed, so that the PCB board can be automatically squeezed and positioned, so that it will not shake during punching, ensuring the stability of the punching operation. Through the setting of the lifting plate, it can be driven by the servo motor and the driving column, and under the cooperation of the lifting mechanism and the reciprocating mechanism to achieve intermittent reciprocating lifting and lowering movement, that is, when the processing box is turned in, multiple laser punchers can be lowered and deepened, which is convenient for laser punching, and when the processing box is turned out, multiple laser punchers can be lifted up to avoid affecting the normal rotation of the processing box, and the synchronization rate is higher.

[0003] The existing laser punching equipment for high-frequency PCB processing has the problem that the positioning and clamping mechanism of the PCB is of low precision and easy to damage the circuit inside the board due to structural design defects, and the bottom of the hole wall formed by the high-frequency PCB board has burnt black carbonized residues under the action of high energy and is difficult to clean. Summary of the invention

[0004] The present invention provides a laser punching device for high-frequency PCB board processing, which solves the problems mentioned in the above background technology.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: A laser punching device for high-frequency PCB board processing, comprising a support, a box body is fixedly connected to the surface of the support, a first screw slide is fixedly connected to the top of the support, a linear motor is fixedly connected to the output end of the first screw slide, a laser fuser is slidably connected to the output end of the linear motor, and further comprising:

[0006] A clamping and positioning mechanism, which is fixedly mounted on the bottom of the inner side of the box body and is used for positioning and clamping the four sides of the PCB board;

[0007] An anti-deposition mechanism, the bottom of which is fixedly mounted on the bottom of the inner side of the box, and the upper position of the surface of the anti-deposition mechanism is fixedly mounted on the top of the support, and the anti-deposition mechanism is used for deposition protection at the bottom of the laser-perforated PCB board;

[0008] The clamping and positioning mechanism includes a thread lifter, which is fixedly installed at the bottom of the inner side of the box body, a fixed block is fixedly connected to the upper position of the inner side of the thread lifter, an electric cylinder is fixedly connected to the surface of the fixed block, a clamping assembly is fixedly connected to the output end of the electric cylinder, and a positioning assembly is slidably connected to the surface of the clamping assembly.

[0009] Preferably, the output end of the threaded lifter is connected to a sliding cylinder via a thread, and the surface of the sliding cylinder is fixedly connected to a support plate, and a rectangular hole is opened in the middle position of the surface of the support plate, and the bottom of the PCB board is placed on the top of the support plate. At this time, the PCB board is not accurately positioned, and the sliding cylinder is close to the fixed block. The electric cylinder drives the clamping assembly to approach the side position of the PCB board, and the oppositely arranged clamping assemblies are close to the PCB board at the same time, and the positioning assembly slides with the clamping assembly. When the lower position of the surface of the clamping assembly contacts the side position of the PCB board, the two opposite side positions of the PCB board are restricted. At this time, the clamping assembly and the PCB board are still in a sliding connection state.

[0010] Preferably, the clamping assembly comprises a clamping plate, the clamping plate is fixedly mounted on the output end of the electric cylinder, and an inner sliding groove is provided on a side of the clamping plate away from the electric cylinder.

[0011] Preferably, an inner hole is provided on the surface of the clamping plate away from the inner slide groove, and the clamping assembly also includes a cylinder, which is fixedly installed at the position of the inner hole, and the output end of the cylinder is fixedly connected to a first slider, and the bottom of the PCB board is limited by the support plate. Subsequently, the electric cylinder drives the clamping plate close to the PCB board, and the lower position of the clamping plate surface applies a pushing force to the side position of the PCB board, and the PCB board is pushed to be straightened. During this process, the first slider slides inside the guide groove, and when the bottom of the clamping plate is in contact with the PCB board and there is no extrusion pressure, the extrusion pressure can be detected by adding a pressure detector at the lower position of the inner side surface of the clamping plate.

[0012] Preferably, the positioning assembly comprises a positioning plate, the top and bottom of the positioning plate are provided with cutting edges, and a guide groove is provided on the surface of the positioning plate near the cutting edge.

[0013] Preferably, the positioning assembly further comprises a second slider, the second slider is fixedly mounted on a side of the positioning plate surface away from the guide groove, and the surface of the second slider is slidably connected to the inner side surface of the clamping plate.

[0014] Preferably, the anti-deposition mechanism includes a linear guide rail, which is fixedly installed at the bottom of the inner side surface of the box body, the output end of the linear guide rail is fixedly connected to a support frame, the upper position of the inner side surface of the support frame is fixedly connected to a protective component, and the four side positions of the PCB board are respectively limited and clamped by the clamping component and the positioning component. At this time, the friction resistance at the side position of the PCB board is greater than the gravity of the PCB board, and the threaded lifter drives the sliding cylinder to move downward, and the support plate is driven to the lower position of the inner side surface of the box body, and the linear guide rail drives the support frame close to the PCB board. As the support frame moves, the support frame passes through the rectangular hole and drives the protective component to be directly below the PCB board.

[0015] Preferably, the anti-deposition mechanism also includes a support platform, which is fixedly mounted on the top of the support, and the top of the support platform is fixedly connected to a second screw slide, and the output end of the second screw slide is fixedly connected to a cleaning component.

[0016] Preferably, the protection component includes a fixed platform, which is fixedly installed at an upper position on the inner side of the support frame, a baffle plate is fixedly connected to the surface of the fixed platform, a telescopic cylinder is fixedly connected to the top of the fixed platform, a plurality of holes are opened on the surface of the perforated plate, and these holes are the same as the positions and diameters of the holes required to be opened on the PCB board. After the hot-melt material is cooled, it is deposited at the bottom position of the perforated plate. After the linear guide rail drives the support frame to reset, the second screw slide drives the shell to move close to the perforated plate. The shell is a rectangular shell structure, and two openings are arranged on the surface of the shell. As the shell moves, the opening passes through the C-shaped frame, and the driving platform drives the screw rod to rotate.

[0017] Preferably, the protection component also includes a lifting block, which is fixedly installed on the output end of the telescopic cylinder, the inner side of the lifting block is slidably connected to the surface of the support frame, the surface of the lifting block is fixedly connected to a C-shaped frame, and the inner side of the C-shaped frame is fixedly connected to a perforated plate.

[0018] Preferably, the cleaning assembly includes a shell, which is fixedly mounted on the output end of the second screw slide, a fan is fixedly connected to the middle position of the shell surface, and a purifier is fixedly connected to the output end of the fan, and two clamping plates and a positioning plate arranged opposite to each other accurately clamp the side position of the PCB board, and the holes close to the edge of the PCB board are not easily interfered with during hot melt impact, and the size of the perforated plate is the same as that of the PCB board. When the perforated plate is driven to the position directly below the PCB board, the telescopic cylinder drives the lifting block to move upward, and the support frame supports and guides the movement of the lifting block, so that the top of the perforated plate can be close to the bottom of the PCB board.

[0019] Preferably, the cleaning assembly further comprises a driving platform, and there are two driving platforms, which are respectively fixedly mounted on the top and bottom of the inner side surface of the shell, and the output end of the driving platform is fixedly connected with a spiral rod.

[0020] The present invention provides a laser punching device for high-frequency PCB board processing. It has the following beneficial effects:

[0021] 1. In the laser punching equipment for high-frequency PCB processing, the clamping assembly drives the positioning assembly close to the PCB board. At the same time, the clamping assembly slides and supports the positioning assembly, so that the two oppositely arranged positioning assemblies are close to the PCB board, and the PCB board is completely limited. With the drive of the electric cylinder and the clamping assembly, the four sides of the PCB board are clamped. The firm clamping of the side position can effectively prevent the board from being damaged, solving the problem that the positioning and clamping mechanism of the PCB board has low precision and is easy to damage the circuit inside the board.

[0022] 2. In the laser punching equipment for high-frequency PCB processing, the cylinder drives the positioning plate to approach another side position of the PCB board. The lack of squeezing force between the clamping plate and the positioning plate helps the PCB board to be pushed smoothly, so that the other two sides of the PCB board are pushed and limited. In this process, the positioning plate is pulled close to the clamping plate. When the size of the PCB board is small, the cut edge of the positioning plate slides into the inner hole of the clamping plate, and the four sides of the PCB board are accurately clamped and limited. At the same time, PCB boards of different sizes can be clamped and punched.

[0023] 3. In the laser punching equipment for high-frequency PCB processing, the top of the protective component is in close contact with the bottom of the PCB, the linear motor and the first screw slide adjust the position of the laser fuser, the laser fuser performs hot-melt punching on the PCB, and the protective component guides the hot-melt material so that the material is deposited on the bottom of the protective component instead of on the bottom of the PCB, thus solving the problem that the bottom of the hole wall formed by the high-frequency PCB under the action of high energy has burnt carbonized residue and is difficult to clean.

[0024] 4. The laser punching equipment for high-frequency PCB processing has a spiral rod surface in close contact with the surface of the perforated plate. As the spiral rod rotates, the hot-melt material deposited on the surface of the perforated plate is scraped off. The fan drives the gas flow inside the shell. The scraped impurities are transported to the purifier with the airflow. The purifier deposits and blocks the impurities in the gas. The perforated plate can be used repeatedly to protect the PCB. At the same time, it prevents the scraped impurities from being deposited on the surface of the clamping component and the positioning component with the gas, resulting in a decrease in the subsequent clamping accuracy.

[0025] 5. The laser punching equipment for high-frequency PCB board processing has the top of the perforated plate higher than the top of the C-shaped frame, so that the top of the perforated plate can be in close contact with the bottom of the PCB board, and the perforated plate and the PCB board are accurately aligned, so that the hot melt material generated by punching can pass through the PCB board and the perforated plate. The hot melt material is cooled and deposited at the bottom of the perforated plate. The blocking of the shielding plate can prevent the material from sputtering to the top of the support plate, causing subsequent PCB board alignment errors, thereby making the high-frequency PCB board laser punching processing more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A perspective view of the front of the laser punching equipment for high-frequency PCB processing of the present invention;

[0027] Figure 2 A three-dimensional diagram of the back side of the laser punching equipment for processing high-frequency PCB boards of the present invention;

[0028] Figure 3 It is a schematic diagram of the overall structure of the clamping and positioning mechanism of the present invention;

[0029] Figure 4 It is a structural schematic diagram of the first part of the clamping and positioning mechanism of the present invention;

[0030] Figure 5 It is a structural schematic diagram of the second part of the clamping and positioning mechanism of the present invention;

[0031] Figure 6 It is a schematic diagram of the structure of the clamping assembly and the positioning assembly of the present invention;

[0032] Figure 7 It is a structural schematic diagram of the anti-deposition mechanism of the present invention;

[0033] Figure 8 It is a schematic diagram of the structure of the protection component of the present invention;

[0034] Fig. 9 It is a schematic diagram of the structure of the cleaning component of the present invention.

[0035] In the figure: 1, support; 2, box; 3, first screw slide; 4, linear motor; 5, laser fuser; 6, clamping and positioning mechanism; 61, thread lifter; 62, slide cylinder; 63, support plate; 64, rectangular hole; 65, fixing block; 66, electric cylinder; 67, clamping assembly; 671, clamping plate; 672, inner slide groove; 673, inner hole; 674, cylinder; 675, first slide block; 68, positioning assembly; 681, positioning plate; 682, trimming; 683. Guide groove; 684. Second slider; 7. Anti-deposition mechanism; 71. Linear guide rail; 72. Support frame; 73. Protection assembly; 731. Fixed table; 732. Shielding plate; 733. Telescopic cylinder; 734. Lifting block; 735. C-shaped frame; 736. Perforated plate; 74. Support table; 75. Second screw slide; 76. Cleaning assembly; 761. Shell; 762. Fan; 763. Purifier; 764. Driving table; 765. Screw rod. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] First embodiment: Figure 1-Figure 5 As shown, the present invention provides a technical solution: a laser punching device for high-frequency PCB board processing, comprising a support 1, a box 2 is fixedly connected to the surface of the support 1, a first screw slide 3 is fixedly connected to the top of the support 1, a linear motor 4 is fixedly connected to the output end of the first screw slide 3, and a laser heat fuser 5 is slidably connected to the output end of the linear motor 4, and also includes:

[0038] A clamping and positioning mechanism 6, which is fixedly mounted on the bottom of the inner side of the box body 2, and is used for positioning and clamping the four sides of the PCB board;

[0039] The anti-deposition mechanism 7 has its bottom fixedly mounted on the bottom of the inner side of the box 2, and its upper surface fixedly mounted on the top of the support 1. The anti-deposition mechanism 7 is used for preventing deposition at the bottom of the laser-perforated PCB board.

[0040] The clamping and positioning mechanism 6 includes a thread lifter 61, which is fixedly mounted on the bottom of the inner side of the box body 2, and a fixing block 65 is fixedly connected to the upper position of the inner side of the thread lifter 61, and an electric cylinder 66 is fixedly connected to the surface of the fixing block 65, and a clamping assembly 67 is fixedly connected to the output end of the electric cylinder 66, and a positioning assembly 68 is slidably connected to the surface of the clamping assembly 67;

[0041] The output end of the thread lifter 61 is connected to a slide cylinder 62 via a thread, a support plate 63 is fixedly connected to the surface of the slide cylinder 62, and a rectangular hole 64 is opened in the middle of the surface of the support plate 63.

[0042] When in use, the bottom of the PCB board is placed on the top of the support plate 63. At this time, the PCB board is not accurately positioned, the sliding cylinder 62 is in a position close to the fixed block 65, the electric cylinder 66 drives the clamping assembly 67 to approach the side position of the PCB board, and the clamping assembly 67 arranged oppositely approaches the PCB board at the same time, and the positioning assembly 68 slides with the clamping assembly 67. When the lower position of the surface of the clamping assembly 67 contacts the side position of the PCB board, the two opposite side positions of the PCB board are restricted. At this time, the clamping assembly 67 and the PCB board are still in a sliding connection state. The clamping assembly 67 drives the positioning assembly 68 to approach the PCB board. At the same time, the clamping assembly 67 slidingly supports the positioning assembly 68, so that the two opposite positioning assemblies 68 are close to the PCB board, and the PCB board is completely limited. With the drive of the electric cylinder 66 and the clamping assembly 67, the four sides of the PCB board are clamped. The firm clamping of the side position can effectively prevent the board from being damaged, thereby solving the problem that the positioning and clamping mechanism of the PCB board has low precision and is easy to damage the circuit inside the board.

[0043] Second embodiment: Figure 3-Figure 6 As shown, the clamping assembly 67 includes a clamping plate 671, which is fixedly mounted at the output end of the electric cylinder 66. An inner groove 672 is provided on the side of the clamping plate 671 away from the electric cylinder 66. An inner hole 673 is provided on the surface of the clamping plate 671 away from the inner groove 672. The clamping assembly 67 also includes a cylinder 674, which is fixedly mounted at the position of the inner hole 673. The output end of the cylinder 674 is fixedly connected with a first slider 675.

[0044] The positioning assembly 68 includes a positioning plate 681, which has cutting edges 682 on the top and bottom. A guide groove 683 is provided on the surface of the positioning plate 681 near the cutting edge 682. The positioning assembly 68 also includes a second slider 684, which is fixedly mounted on the side of the surface of the positioning plate 681 away from the guide groove 683, and the surface of the second slider 684 is slidably connected to the inner side surface of the clamping plate 671.

[0045] When in use, the bottom of the PCB board is limited by the support plate 63, and then the electric cylinder 66 drives the clamping plate 671 to approach the PCB board. The lower position of the surface of the clamping plate 671 applies a pushing force to the side position of the PCB board, and the PCB board is pushed to be aligned. In this process, the first slider 675 slides inside the guide groove 683. When the bottom of the clamping plate 671 is in contact with the PCB board and there is no squeezing force, the squeezing force can be detected by adding a pressure detector at the lower position of the inner side of the clamping plate 671. The cylinder 674 drives The positioning plate 681 is close to another side position of the PCB board. There is no squeezing force between the clamping plate 671 and the positioning plate 681, which is conducive to the smooth pushing of the PCB board, so that the other two sides of the PCB board are pushed and limited. In this process, the positioning plate 681 is pulled close to the clamping plate 671. When the size of the PCB board is small, the cut edge 682 of the positioning plate 681 slides into the inner hole 673 of the clamping plate 671, and the four sides of the PCB board are accurately clamped and limited. At the same time, PCB boards of different sizes can be clamped and punched.

[0046] The third embodiment: Figure 3 , Figure 7 As shown, the thread lifter 61 is fixedly installed at the bottom of the inner side of the box body 2, and a fixing block 65 is fixedly connected to the upper position of the inner side of the thread lifter 61. The surface of the fixing block 65 is fixedly connected to an electric cylinder 66. The output end of the electric cylinder 66 is fixedly connected to a clamping assembly 67. The surface of the clamping assembly 67 is slidably connected to a positioning assembly 68.

[0047] The output end of the thread lifter 61 is connected to a slide cylinder 62 through a thread, and a support plate 63 is fixedly connected to the surface of the slide cylinder 62. A rectangular hole 64 is opened in the middle of the surface of the support plate 63.

[0048] The anti-deposition mechanism 7 includes a linear guide rail 71, which is fixedly installed at the bottom of the inner side of the box body 2. The output end of the linear guide rail 71 is fixedly connected to a support frame 72, and the upper position of the inner side of the support frame 72 is fixedly connected to a protective component 73. The anti-deposition mechanism 7 also includes a support table 74, which is fixedly installed on the top of the support 1. The top of the support table 74 is fixedly connected to a second screw slide 75, and the output end of the second screw slide 75 is fixedly connected to a cleaning component 76.

[0049] When in use, the four side positions of the PCB board are limited and clamped by the clamping assembly 67 and the positioning assembly 68 respectively. At this time, the friction resistance on the side position of the PCB board is greater than the gravity of the PCB board, and the threaded lifter 61 drives the sliding cylinder 62 to move downward, and the support plate 63 is driven to the lower position of the inner side of the box body 2, and the linear guide rail 71 drives the support frame 72 close to the PCB board. As the support frame 72 moves, the support frame 72 passes through the rectangular hole 64 and drives the protective assembly 73 to be located directly below the PCB board. The top of the protective assembly 73 is in close contact with the bottom of the PCB board, and the linear motor 4 and the first screw slide 3 adjust the position of the laser fuser 5. The laser fuser 5 performs hot-melt punching on the PCB board, and the protective assembly 73 guides the hot-melt material so that the material is deposited at the bottom of the protective assembly 73 instead of the bottom of the PCB board, which solves the problem that the bottom of the hole wall formed by the high-frequency PCB board under the action of high energy has burnt carbonized residue and is not easy to clean.

[0050] Fourth embodiment: Figure 7-Figure 9 As shown, the protection component 73 includes a fixed platform 731, which is fixedly installed at an upper position of the inner side surface of the support frame 72, a shielding plate 732 is fixedly connected to the surface of the fixed platform 731, and a telescopic cylinder 733 is fixedly connected to the top of the fixed platform 731. The protection component 73 also includes a lifting block 734, which is fixedly installed at the output end of the telescopic cylinder 733, and the inner side surface of the lifting block 734 is slidably connected to the surface of the support frame 72, and a C-shaped frame 735 is fixedly connected to the surface of the lifting block 734, and a perforated plate 736 is fixedly connected to the inner side surface of the C-shaped frame 735;

[0051] The cleaning component 76 includes a shell 761, which is fixedly installed on the output end of the second screw slide 75. A fan 762 is fixedly connected to the middle position of the surface of the shell 761, and a purifier 763 is fixedly connected to the output end of the fan 762. The cleaning component 76 also includes a driving platform 764. There are two driving platforms 764, which are respectively fixedly installed on the top and bottom of the inner side of the shell 761, and the output end of the driving platform 764 is fixedly connected to a spiral rod 765.

[0052] When in use, a plurality of holes are provided on the surface of the perforated plate 736. These holes have the same positions and diameters as the holes required to be provided on the PCB board. After the hot melt material cools down, it is deposited at the bottom position of the perforated plate 736. After the linear guide rail 71 drives the support frame 72 to reset, the second screw slide 75 drives the shell 761 to move close to the perforated plate 736. The shell 761 is a rectangular shell structure. Two openings are provided on the surface of the shell 761. As the shell 761 moves, the opening passes through the C-shaped frame 735, and the driving platform 764 drives the screw rod 765 to rotate. The surface of the rod 765 is in close contact with the surface of the perforated plate 736. As the spiral rod 765 rotates, the hot melt material deposited on the surface of the perforated plate 736 is scraped off. The fan 762 drives the gas flow inside the shell 761. The scraped impurities are transported to the purifier 763 with the air flow. The purifier 763 deposits and blocks the impurities in the gas. The perforated plate 736 can be used repeatedly to protect the PCB board. At the same time, it prevents the scraped impurities from being deposited on the surfaces of the clamping component 67 and the positioning component 68 with the gas, resulting in a decrease in the subsequent clamping accuracy.

[0053] Fifth embodiment: Figure 6 , Figure 8 As shown, the clamping plate 671 is fixedly installed at the output end of the electric cylinder 66, an inner groove 672 is provided on the side of the clamping plate 671 away from the electric cylinder 66, an inner hole 673 is provided on the surface of the clamping plate 671 away from the inner groove 672, and the clamping assembly 67 further includes a cylinder 674, which is fixedly installed at the position of the inner hole 673, and a first slider 675 is fixedly connected to the output end of the cylinder 674;

[0054] The top and bottom of the positioning plate 681 are provided with cutting edges 682, and a guide groove 683 is provided on the surface of the positioning plate 681 near the cutting edge 682. The positioning assembly 68 also includes a second slider 684, which is fixedly mounted on the side of the positioning plate 681 away from the guide groove 683, and the surface of the second slider 684 is slidably connected to the inner side surface of the clamping plate 671;

[0055] The fixed platform 731 is fixedly installed at the upper position of the inner side surface of the support frame 72, the surface of the fixed platform 731 is fixedly connected with a shielding plate 732, the top of the fixed platform 731 is fixedly connected with a telescopic cylinder 733, the protective component 73 also includes a lifting block 734, the lifting block 734 is fixedly installed at the output end of the telescopic cylinder 733, the inner side surface of the lifting block 734 is slidably connected to the surface of the support frame 72, the surface of the lifting block 734 is fixedly connected with a C-shaped frame 735, and the inner side surface of the C-shaped frame 735 is fixedly connected with a perforated plate 736.

[0056] When in use, the two clamping plates 671 and the positioning plate 681 arranged opposite to each other accurately align and clamp the side position of the PCB board, and the holes near the edge of the PCB board are not easily interfered during hot melt impact. The size of the perforated plate 736 is the same as that of the PCB board. When the perforated plate 736 is driven to the position directly below the PCB board, the telescopic cylinder 733 drives the lifting block 734 to move upward, and the support frame 72 supports and guides the movement of the lifting block 734, so that the top of the perforated plate 736 can be close to the bottom of the PCB board. The top of the perforated plate 736 is higher than the top of the C-shaped frame 735, so that the top of the perforated plate 736 can be in close contact with the bottom of the PCB board. The perforated plate 736 and the PCB board are precisely aligned, so that the hot-melt material generated by punching can pass through the PCB board and the perforated plate 736. The hot-melt material is cooled and deposited at the bottom of the perforated plate 736. The blocking of the shielding plate 732 can prevent the material from sputtering to the top of the support plate 63, causing subsequent PCB board alignment errors, thereby making the high-frequency PCB board laser punching processing more accurate.

[0057] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions. The sentence "includes an element defined by... does not exclude the existence of other identical elements in the process, method, article or device including the element".

Claims

1. A laser punching device for high-frequency PCB board processing, comprising a support (1), characterized in that: The surface of the support (1) is fixedly connected to a box body (2), the top of the support (1) is fixedly connected to a first screw slide (3), the output end of the first screw slide (3) is fixedly connected to a linear motor (4), and the output end of the linear motor (4) is slidably connected to a laser heat fuser (5), and further comprises: A clamping and positioning mechanism (6), wherein the clamping and positioning mechanism (6) is fixedly mounted on the bottom of the inner side of the box body (2), and the clamping and positioning mechanism (6) is used for positioning and clamping the four side edges of the PCB board; An anti-deposition mechanism (7), wherein the bottom of the anti-deposition mechanism (7) is fixedly mounted on the bottom of the inner side of the box body (2), and the upper position of the surface of the anti-deposition mechanism (7) is fixedly mounted on the top of the support (1), and the anti-deposition mechanism (7) is used for preventing deposition at the bottom of a laser-perforated PCB board; The clamping and positioning mechanism (6) comprises a thread lifter (61), the thread lifter (61) is fixedly mounted on the bottom of the inner side of the box body (2), a fixing block (65) is fixedly connected to the upper position of the inner side of the thread lifter (61), an electric cylinder (66) is fixedly connected to the surface of the fixing block (65), a clamping assembly (67) is fixedly connected to the output end of the electric cylinder (66), and a positioning assembly (68) is slidably connected to the surface of the clamping assembly (67).

2. The laser punching equipment for high-frequency PCB board processing according to claim 1 is characterized in that: The output end of the thread lifter (61) is connected to a sliding cylinder (62) via a thread, a support plate (63) is fixedly connected to the surface of the sliding cylinder (62), and a rectangular hole (64) is opened in the middle of the surface of the support plate (63).

3. The laser punching equipment for high-frequency PCB board processing according to claim 2 is characterized in that: The clamping assembly (67) comprises a clamping plate (671), wherein the clamping plate (671) is fixedly mounted on the output end of the electric cylinder (66), and an inner sliding groove (672) is provided on a side of the clamping plate (671) away from the electric cylinder (66).

4. The laser punching equipment for high-frequency PCB board processing according to claim 3 is characterized in that: An inner hole (673) is provided on the surface of the clamping plate (671) at a position away from the inner slide groove (672). The clamping assembly (67) further comprises a cylinder (674). The cylinder (674) is fixedly installed at the position of the inner hole (673). The output end of the cylinder (674) is fixedly connected to a first slider (675).

5. The laser punching equipment for high-frequency PCB board processing according to claim 4 is characterized in that: The positioning assembly (68) comprises a positioning plate (681), the top and bottom of the positioning plate (681) are both provided with cutting edges (682), and a guide groove (683) is provided on the surface of the positioning plate (681) near the cutting edge (682).

6. The laser punching equipment for high-frequency PCB board processing according to claim 5 is characterized in that: The positioning assembly (68) also includes a second slider (684), which is fixedly mounted on a side of the surface of the positioning plate (681) away from the guide groove (683), and the surface of the second slider (684) is slidably connected to the inner side surface of the clamping plate (671).

7. The laser punching equipment for high-frequency PCB board processing according to claim 1 is characterized in that: The anti-deposition mechanism (7) comprises a linear guide rail (71), the linear guide rail (71) is fixedly mounted on the bottom of the inner side surface of the box body (2), the output end of the linear guide rail (71) is fixedly connected to a support frame (72), and the upper position of the inner side surface of the support frame (72) is fixedly connected to a protection component (73).

8. The laser punching equipment for high-frequency PCB board processing according to claim 7 is characterized in that: The anti-deposition mechanism (7) further comprises a support platform (74), wherein the support platform (74) is fixedly mounted on the top of the support (1), a second screw slide (75) is fixedly connected to the top of the support platform (74), and a cleaning assembly (76) is fixedly connected to the output end of the second screw slide (75).

9. The laser punching equipment for high-frequency PCB board processing according to claim 8 is characterized in that: The protection component (73) comprises a fixed platform (731), the fixed platform (731) is fixedly installed at an upper position of the inner side surface of the support frame (72), a shielding plate (732) is fixedly connected to the surface of the fixed platform (731), and a telescopic cylinder (733) is fixedly connected to the top of the fixed platform (731).

10. The laser punching equipment for high-frequency PCB board processing according to claim 9 is characterized in that: The protection assembly (73) further comprises a lifting block (734), wherein the lifting block (734) is fixedly mounted on the output end of the telescopic cylinder (733), the inner side surface of the lifting block (734) is slidably connected to the surface of the support frame (72), the surface of the lifting block (734) is fixedly connected to a C-shaped frame (735), and the inner side surface of the C-shaped frame (735) is fixedly connected to a perforated plate (736).

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