Retaining ring dressing device, chemical mechanical polishing unit, control method of chemical mechanical polishing unit and chemical mechanical polishing equipment

Abstract

The embodiment of the invention provides a retaining ring trimming device, a chemical mechanical polishing unit, a control method of the chemical mechanical polishing unit and chemical mechanical polishing equipment. The device comprises a base, a trimming disc, a detection piece and a controller. The finishing disc is arranged on one side of the base and used for grinding and finishing the ground surface of the retaining ring after the polishing head drives the retaining ring to move until the ground surface of the retaining ring abuts against the side face, away from the base, of the finishing disc and in the process that the polishing head drives the retaining ring to rotate around the axis of the retaining ring relative to the finishing disc; the detection piece is arranged on the base and is used for detecting shape data of a ground surface of the retaining ring in the process of grinding and finishing the retaining ring by the finishing disc; and the controller is used for controlling the polishing head to stop driving the retaining ring to rotate relative to the finishing disc after determining that the shape data meets a target condition for indicating that the shape of the ground surface of the retaining ring is normal, so that the finishing disc finishes grinding and finishing the retaining ring. The scheme can save resources.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of wafer polishing technology, and in particular to a retaining ring dressing device, a chemical mechanical polishing unit and a control method thereof, and a chemical mechanical polishing device. Background Art

[0002] Chemical Mechanical Polishing (CMP) is a technology used to polish wafers. It polishes the wafer surface in a combination of mechanical and chemical methods to achieve flattening of the wafer surface morphology.

[0003] CMP can generally be achieved through CMP equipment, which includes a polishing head and a retaining ring. During the process of polishing the wafer using CMP, the wafer can be first adsorbed and installed on the polishing head so that the wafer is located in the space surrounded by the retaining ring. The polishing head can then drive the wafer for polishing. During the polishing process, the retaining ring can limit the wafer and also affect the stress state of the wafer edge to achieve a better polishing effect for the wafer.

[0004] However, the surface condition of the retaining ring has a significant impact on the polishing effect of the wafer. For example, after a period of polishing using a CMP device that includes a retaining ring with uniform thickness, different positions on the same radius of the retaining ring will usually have different degrees of wear, resulting in the retaining ring being in a state of uneven thickness. In order to minimize the impact of the surface condition of the retaining ring on the polishing effect of the wafer, the retaining ring is usually replaced frequently, resulting in a waste of resources. Summary of the invention

[0005] In view of this, embodiments of the present application provide a retaining ring dressing device, a chemical mechanical polishing unit and a control method thereof, and a chemical mechanical polishing device to at least partially solve the above problems.

[0006] According to a first aspect of an embodiment of the present application, a retaining ring dressing device is provided, comprising: a base, a dressing disk, a detection member and a controller; the dressing disk is arranged on one side of the base, and is used to grind and dress the ground surface of the retaining ring after the polishing head of the chemical mechanical polishing unit drives the retaining ring to move until the ground surface of the retaining ring away from the polishing head abuts against the side of the dressing disk away from the base, and in the process in which the polishing head drives the retaining ring to rotate relative to the dressing disk around the axis of the retaining ring; the detection member is arranged on the base and is electrically connected to the controller, and is used to detect and obtain shape data of the ground surface of the retaining ring during the process in which the dressing disk grinds and dresses the retaining ring, and send the shape data to the controller; the controller is used to receive the shape data, and after determining that the shape data meets the target condition for indicating that the shape of the ground surface of the retaining ring is normal, control the polishing head to stop driving the retaining ring to rotate relative to the dressing disk, so that the grinding and dressing of the retaining ring by the dressing disk is completed.

[0007] According to the second aspect of the embodiment of the present application, a chemical mechanical polishing unit is provided for use in conjunction with the retaining ring dressing device described in the first aspect above, the chemical mechanical polishing unit comprising a retaining ring and a polishing head; the retaining ring is connected to one side of the polishing head; the polishing head is used to drive the retaining ring to move until the ground surface of the retaining ring away from the polishing head abuts against the side of the dressing disk away from the base, and drives the retaining ring to rotate around the axis of the retaining ring relative to the dressing disk to grind and dress the ground surface of the retaining ring, and is also used to connect a wafer so that the wafer is located in the area surrounded by the retaining ring, and drive the wafer to perform chemical mechanical polishing.

[0008] According to a third aspect of an embodiment of the present application, a chemical mechanical polishing unit control method is provided, which is used to control the chemical mechanical polishing unit described in the second aspect above, and the chemical mechanical polishing unit control method includes: when the chemical mechanical polishing unit is not connected to a wafer, controlling the polishing head of the chemical mechanical polishing unit to drive the retaining ring to move until the ground surface of the retaining ring away from the polishing head abuts against the side of the dressing disk away from the base; controlling the polishing head to drive the retaining ring to rotate around the axis of the retaining ring relative to the dressing disk, so as to grind and dress the ground surface of the retaining ring.

[0009] According to the fourth aspect of the embodiment of the present application, a chemical mechanical polishing device is provided, comprising a polishing disk, a liquid supply component and the chemical mechanical polishing unit described in the second aspect above; the polishing disk is provided with a polishing pad on one side; the liquid supply component is used to provide polishing liquid to the side of the polishing pad away from the polishing disk; the polishing head is also used to connect the wafer so that the wafer is located in the area surrounded by the retaining ring, and drives the polished layer of the wafer to abut against the polishing pad, and drives the wafer to move relative to the polishing pad, so as to perform chemical mechanical polishing on the wafer.

[0010] According to the retaining ring dressing device provided in the embodiment of the present application, when the chemical mechanical polishing unit does not adsorb the wafer, the polishing head can be controlled to drive the retaining ring to move until the ground surface of the retaining ring abuts against the side of the dressing disk away from the base, and the polishing head can be controlled to drive the retaining ring to rotate relative to the dressing disk around the axis of the retaining ring, so that the dressing disk grinds and dresses the ground surface of the retaining ring. During the grinding and dressing process, the detection part can detect and obtain the shape data of the ground surface of the retaining ring, and send the shape data to the controller. After receiving the shape data, if the controller determines that the shape data meets the target condition (i.e., the condition for indicating that the shape of the ground surface of the retaining ring is normal), the controller controls the polishing head to stop driving the retaining ring to rotate relative to the dressing disk around the axis of the retaining ring, so that the grinding and dressing of the retaining ring is completed. Therefore, compared to the scheme of frequently replacing the retaining ring in order to replace the retaining ring before the shape of the ground surface of the retaining ring becomes abnormal, the retaining ring dressing device in the present application can dress the ground surface of the retaining ring and stop dressing after the shape of the ground surface of the retaining ring becomes normal, so as to extend the service life of the retaining ring and reduce the replacement frequency of the retaining ring, thereby saving resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0012] Figure 1 is a schematic structural diagram of a chemical mechanical polishing unit according to an embodiment of the present application;

[0013] Figure 2 is a schematic structural diagram of a retaining ring dressing device according to an embodiment of the present application;

[0014] Figure 3 is a structural schematic diagram of a base according to an embodiment of the present application;

[0015] Figure 4 is a schematic structural diagram of a trimming disk according to an embodiment of the present application;

[0016] Figure 5 is a schematic structural diagram of a cleaning component according to an embodiment of the present application;

[0017] Figure 6 is a side view of a cleaning assembly according to another embodiment of the present application;

[0018] Figure 7 is a schematic diagram of the working state of a retaining ring dressing device according to an embodiment of the present application;

[0019] Figure 8 yes Figure 7 An enlarged view of part A in FIG.

[0020] Fig. 9 is a schematic diagram of the working state of a retaining ring dressing device according to another embodiment of the present application;

[0021] Fig.10 yes Fig. 9 An enlarged view of part B in FIG.

[0022] Fig.11 is a schematic diagram of the working state of a retaining ring dressing device according to another embodiment of the present application;

[0023] Fig.12 yes Fig.11 An enlarged view of part C in FIG.

[0024] Fig.13 It is a flow chart of a chemical mechanical polishing unit control method according to an embodiment of the present application.

[0025] Description of reference numerals:

[0026] 1. Polishing head; 2. Retaining ring; 3. Air film; 4. Base; 41. Enclosure; 42. Chamber; 43. Second nozzle; 5. Dressing plate; 51. Carrying plate; 511. Detection opening; 52. Dressing block; 6. Detection piece; 7. Cleaning assembly; 71. Connecting shaft; 711. First cantilever; 72. Cleaning brush; 721. Brush head; 7211. First head; 7212. Second head; 722. Brush rod; 73. First nozzle; 8. Wafer receiving ring; 81. Second cantilever; 82. Avoidance. DETAILED DESCRIPTION

[0027] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0028] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] The retaining ring dressing device provided in the embodiment of the present application is described in detail below with reference to the accompanying drawings.

[0030] The embodiment of the present application provides a retaining ring dressing device, which is used to dress the retaining ring 2 in a chemical mechanical polishing unit. Figure 1 Schematic diagram of the structure of a chemical mechanical polishing unit according to an embodiment of the present application. Figure 1 As shown, the chemical mechanical polishing unit includes a polishing head 1, a retaining ring 2 and a wafer connector (hereinafter described as an air film 3 as the wafer connector), the retaining ring 2 is connected to one side of the polishing head 1, the air film 3 is arranged in the space surrounded by the retaining ring 2, and the air film 3 is connected to the polishing head 1. In the process of polishing the wafer using the chemical mechanical polishing unit, the air film 3 can be first driven by the polishing head 1 to move to one side of the wafer and adsorb the wafer so that the wafer is mounted on the polishing head 1 and the wafer is located in the space surrounded by the retaining ring 2. Then the polishing head 1 can drive the wafer to polish the side of the wafer away from the air film 3. During the polishing process, the retaining ring 2 can limit the wafer and can also affect the stress state of the edge of the wafer, so as to achieve a better polishing effect of the wafer.

[0031] Figure 2 Schematic diagram of the structure of a retaining ring dressing device according to an embodiment of the present application. Figure 2 As shown, the retaining ring dressing device includes: a base 4, a dressing disk 5, a detection member 6 and a controller.

[0032] The dressing disk 5 is arranged on one side of the base 4, and is used to grind and dress the ground surface of the retaining ring 2 after the polishing head 1 of the chemical mechanical polishing unit drives the retaining ring 2 to move until the ground surface of the retaining ring 2 away from the polishing head 1 abuts against the side of the dressing disk 5 away from the base 4, and in the process in which the polishing head 1 drives the retaining ring 2 to rotate around the axis of the retaining ring 2 relative to the dressing disk 5, optionally, in the process in which the dressing disk 5 grinds and dresses the ground surface of the retaining ring 2, the polishing head 1 can apply a certain pressure in the direction close to the dressing disk 5.

[0033] The detection member 6 is disposed on the base 4 and is electrically connected to the controller. The detection member 6 is used to detect and obtain shape data of the ground surface of the retaining ring 2 during the process of the dressing disc 5 grinding and dressing the retaining ring 2, and send the shape data to the controller.

[0034] The controller is used to receive shape data, and after determining that the shape data meets the target condition for indicating that the shape of the ground surface of the retaining ring 2 is normal, controls the polishing head 1 to stop driving the retaining ring 2 to rotate relative to the dressing disk 5, so that the grinding and dressing of the retaining ring 2 by the dressing disk 5 is completed.

[0035] Among them, the target condition is set according to actual needs. For example, the target condition can be used to indicate that the ground surface of the retaining ring 2 is parallel to the side of the retaining ring 2 away from the ground surface, and can also be used to indicate that the distance between the ground surface and the side of the retaining ring 2 away from the ground surface gradually increases or decreases from the inside to the outside. The embodiments of the present application are not limited to this.

[0036] In an embodiment of the present application, when the chemical mechanical polishing unit does not adsorb the wafer, the polishing head 1 can be controlled to drive the retaining ring 2 to move until the ground surface of the retaining ring 2 abuts against the side of the dressing disk 5 away from the base 4, and the polishing head 1 can be controlled to drive the retaining ring 2 to rotate around the axis of the retaining ring 2 relative to the dressing disk 5, so that the dressing disk 5 grinds and dresses the ground surface of the retaining ring 2. During the grinding and dressing process, the detection component 6 can detect the shape data of the ground surface of the retaining ring 2 and send the shape data to the controller. After receiving the shape data, if the controller determines that the shape data meets the target condition (i.e., the condition for indicating that the shape of the ground surface of the retaining ring 2 is normal), the polishing head 1 is controlled to stop driving the retaining ring 2 to rotate around the axis of the retaining ring 2 relative to the dressing disk 5, so that the grinding and dressing of the retaining ring 2 is completed. Therefore, compared to the scheme of frequently replacing the retaining ring 2 in order to replace the retaining ring 2 before the shape of the ground surface of the retaining ring 2 becomes abnormal, the retaining ring dressing device in the present application can dress the ground surface of the retaining ring 2 and stop dressing after the shape of the ground surface of the retaining ring 2 becomes normal, so as to extend the service life of the retaining ring 2 and reduce the replacement frequency of the retaining ring 2, thereby saving resources.

[0037] In addition, the replacement frequency of the retaining ring 2 is reduced, the flatness stability of the wafer after chemical mechanical polishing can be improved, and the cost can be reduced.

[0038] In one possible implementation, Figure 2 and Figure 3 As shown, the base 4 is connected to a driving member (such as a motor or a cylinder, etc.), and the driving member is used to drive the base 4 to move in a direction perpendicular to the surface of the trimming disk 5.

[0039] In a specific embodiment, the base 4 is placed horizontally, and the dressing disk 5 is located above the base 4. The base 4 can have a down position and an up position. The up position of the base 4 is higher than the down position. When the retaining ring dressing device is in the initial state, the base 4 is in the down position. Before the grinding surface of the retaining ring 2 is ground and dressed, the base 4 can be driven by a driving member to move upward in a direction perpendicular to the surface of the dressing disk 5, so that the base 4 is in the up position, which is convenient for the polishing head 1 to drive the retaining ring 2 to abut against the dressing disk 5. Before the grinding surface of the retaining ring 2 is ground and dressed, the polishing head 1 can drive the retaining ring 2 to abut against the dressing disk 5. Afterwards, the base 4 can be driven by the driving member to move downward in a direction perpendicular to the surface of the trimming disk 5 to make the base 4 return to the down position, so that the polishing head 1 can drive the retaining ring 2 to separate from the trimming disk 5. The driving member drives the base 4 from the up position back to the down position, which can be before the polishing head 1 drives the retaining ring 2 to move away from the trimming disk 5, or after the polishing head 1 drives the retaining ring 2 to move away from the trimming disk 5, or at the same time as the polishing head 1 drives the retaining ring 2 to move away from the trimming disk 5. The embodiments of the present application are not limited to this.

[0040] In the embodiment of the present application, before and after the retaining ring dressing device grinds and dresses the ground surface of the retaining ring 2, the base 4 can be adjusted by the driving member to move in a direction perpendicular to the surface of the dressing disk 5. Thus, the base 4 can be driven by the driving member to drive the dressing disk 5 to a position convenient for abutting or separating from the retaining ring 2 on the polishing head 1, so as to facilitate the polishing head 1 to drive the retaining ring 2 to abut or separate from the dressing disk 5.

[0041] In one possible implementation, Figure 2 and Figure 3 As shown, a side of the base 4 close to the trimming disk 5 is connected to a panel 41, and the connection between the panel 41 and the base 4 can be a fixed connection, an integral connection or a detachable connection, etc. The panel 41 is perpendicular to the disk surface of the trimming disk 5, and the trimming disk 5 is located in the space surrounded by the panel 41.

[0042] Therefore, the provision of the enclosure 41 can reduce the possibility of debris and other impurities of the retaining ring 2 falling outside the retaining ring dressing device when the dressing disk 5 grinds and dresses the retaining ring 2, thereby improving the cleanliness of the environment around the retaining ring dressing device.

[0043] In one possible implementation, Figure 2 and Figure 4 As shown, the trimming disc 5 includes a carrier disc 51 and at least one trimming block 52 .

[0044] The carrier disk 51 is connected to the base 4, and the connection can be a fixed connection, an integral connection or a detachable connection, etc. The shape of the carrier disk 51 is an annular disk, that is, the two opposite side surfaces of the carrier disk 51 are annular surfaces, and one annular surface of the carrier disk 51 abuts against the base 4. When the dressing disk 5 grinds and dresses the retaining ring 2, the axis of the carrier disk 51 coincides with the axis of the retaining ring 2. Based on this, the detection part 6 is arranged at a position close to the carrier disk 51 on the base 4, and a detection opening 511 is opened on the carrier disk 51 and penetrates the carrier disk 51 along the thickness direction of the carrier disk 51, so as to detect the shape of the ground surface of the retaining ring 2 during the grinding and dressing process of the retaining ring 2.

[0045] The trimming block 52 is connected to the annular surface of the carrier plate 51 away from the base 4. If multiple trimming blocks 52 are provided, the multiple trimming blocks 52 can be evenly arranged along the circumference of the carrier plate 51. The trimming block 52 is used to grind and trim the ground surface of the retaining ring 2 after the polishing head 1 drives the retaining ring 2 to move until the ground surface of the retaining ring 2 abuts against the side of the trimming block 52 away from the carrier plate 51, and while the polishing head 1 drives the retaining ring 2 to rotate around the axis of the retaining ring 2 relative to the trimming block 52.

[0046] For processes with relatively low requirements for impurity interference, the material of the side of the trimming block 52 that abuts against the ground surface of the retaining ring 2 can be an inorganic ceramic abrasive material. For processes with high requirements for impurity interference, the material of the side of the trimming block 52 that abuts against the ground surface of the retaining ring 2 can be a hard organic material similar to the material of the polishing pad. For example, the material of the side of the trimming block 52 that abuts against the ground surface of the retaining ring 2 can be PPS (polyphenylene sulfide) or PEEK (polyetheretherketone). etc., which are not limited in the embodiments of the present application; the amount of dressing of the ground surface of the retaining ring 2 by the dressing block 52 is generally very small, for example, 20 to 30 μm, etc.; the shape of the dressing block 52 can be set according to the above-mentioned target conditions, for example, the target conditions are used to indicate that the distance between the ground surface and the side of the retaining ring 2 away from the ground surface gradually increases from the inside to the outside, and the dressing block 52 is used to be inclined from the inside to the outside and from the direction away from the carrier plate 51 to the direction close to the carrier plate 51.

[0047] Optionally, the trimming block 52 is detachably connected to the carrier plate 51 so that the trimming block 52 of different shapes can be replaced according to target conditions, thereby improving the applicability of the retaining ring trimming device.

[0048] Therefore, by setting up the supporting plate 51 and the trimming block 52, the supporting plate 51 can support the retaining block, that is, the overall structure of the trimming plate 5 can have a certain rigidity and stability, and the trimming block 52 can grind and trim the ground surface of the retaining ring 2, thereby extending the service life of the retaining ring and reducing costs.

[0049] In one possible implementation, based on the shape of the retaining ring 2 being a circular ring, the same shape data detected by the same detection member 6 of the retaining ring 2 includes the distances between multiple position points on any ring width line of the ground surface of the retaining ring 2 and the detection head of the detection member 6, wherein the ring width line of the ground surface of the retaining ring 2 is a line segment of the radius of the ground surface on the ground surface.

[0050] In a specific embodiment, the detection member 6 can be an optical ranging sensor, which is used to emit white light from the detection head of the detection member 6 through the detection opening 511 to any ring width line in the ground surface of the retaining ring 2, so as to measure the distance between the detection head of the detection member 6 and multiple position points on any ring width line of the ground surface of the retaining ring 2 through the principle of white light interference, and then obtain shape data including multiple distances, and the shape data is related to the shape of the ground surface of the retaining ring 2. For example, if the ground surface of the retaining ring 2 is parallel to the side of the retaining ring 2 away from the ground surface, then the multiple distances included in the shape data obtained at this time are almost the same; if the distance between the ground surface and the side of the retaining ring 2 away from the ground surface gradually increases or decreases from the inside to the outside, then the multiple distances included in the shape data obtained at this time are almost different.

[0051] Therefore, the detection part 6 can obtain the shape data of the ground surface of the retaining ring 2 by detecting the distance between different position points on the same ring width line of the ground surface of the retaining ring 2 and the detection head of the detection part 6, which is simple, convenient and low-cost.

[0052] In one possible implementation, Figure 2 and Figure 5 As shown, the retaining ring dressing device also includes a cleaning component 7; the cleaning component 7 is connected to the base 4, and is used to clean the dust or debris of the retaining ring 2 attached to the ground surface after the dressing disc 5 completes the grinding and dressing of the retaining ring 2, and / or to clean the dust or debris of the retaining ring 2 attached to the side of the supporting plate 51 away from the base 4 and the side of the dressing block 52 away from the base 4.

[0053] In a specific embodiment, after the dressing disk 5 finishes grinding and dressing the retaining ring 2, the cleaning component 7 can be controlled by the controller to perform a cleaning operation, so that the cleaning component 7 cleans the impurities attached to the ground surface of the retaining ring 2, and / or cleans the impurities attached to the side of the carrier plate 51 away from the base 4 and the side of the dressing block 52 away from the base 4. Thus, the cleaning component 7 cleans the impurities attached to the ground surface of the retaining ring 2, which can reduce the damage caused to the wafer by the impurities attached to the ground surface of the retaining ring 2 when polishing the wafer (for example, direct damage to the wafer caused by the impurities attached to the ground surface of the retaining ring 2 when polishing the wafer, and for example The impurities attached to the ground surface of the retaining ring 2 may fall onto the polishing pad used for polishing the wafer, and the impurities on the polishing pad may cause damage to the wafer when polishing the wafer. The impurities attached to the ground surface of the retaining ring 2 may also be prevented from contaminating the wafer placed on the retaining ring dressing device (the wafer placed on the retaining ring dressing device will be described in detail later, and the embodiments of the present application will not be repeated here). The cleaning component 7 cleans the impurities attached to the side of the carrier plate 51 away from the base 4 and the side of the dressing block 52 away from the base 4, so as to clean the dressing plate 5 to ensure the grinding effect of the dressing plate 5 on other retaining rings 2 as much as possible.

[0054] In one possible implementation, Figure 2 , Figure 3 and Figure 5 As shown, a chamber 42 is provided on the side of the base 4 close to the trimming plate 5, and the bottom surface of the chamber 42 (the bottom surface of the chamber 42 specifically refers to Figure 3The a surface in the figure is perpendicular to the axial direction of the carrier plate 51. The cleaning assembly 7 includes a connecting shaft 71 and at least one cleaning brush 72. The connecting shaft 71 is located in the chamber 42, and is slidably connected to the base 4 along the axial direction parallel to the carrier plate 51 (i.e., perpendicular to the bottom surface of the chamber 42), and is rotatably connected to the base 4 around the axial direction of the carrier plate 51. The cleaning brush 72 is slidably connected to the connecting shaft 71 in a direction close to the connecting shaft 71 and close to the bottom surface of the chamber 42, or in a direction away from the connecting shaft 71 and away from the bottom surface of the chamber 42. If a plurality of cleaning brushes 72 are provided, the plurality of cleaning brushes 72 are evenly distributed along the circumference of the carrier plate 51. The controller is used to, after the grinding and dressing of the retaining ring 2 by the dressing disk 5 is completed, According to the first control instruction received, the polishing head 1 is controlled to drive the retaining ring 2 to separate from the trimming block 52, and the connecting shaft 71 is controlled to drive the cleaning brush 72 to move relative to the base 4 in a direction away from the bottom surface of the base 4, and the cleaning brush 72 is also controlled to slide in a direction away from the connecting shaft 71 and away from the bottom surface of the chamber 42, so that the cleaning brush 72 slides relative to the connecting shaft 71 until at least part of the brush head 721 included in the cleaning brush 72 is located between the retaining ring 2 and the trimming disk 5, and is also used to control the connecting shaft 71 to drive the cleaning brush 72 to rotate relative to the base 4 according to the second control instruction received, and control the cleaning brush 72 to slide reciprocatingly relative to the connecting shaft 71.

[0055] In a specific embodiment, in combination with the above-mentioned “the base 4 is placed horizontally, the dressing disk 5 is located above the base 4, and the base 4 can have a down position and an up position”, the connecting shaft 71 can have at least a down position and a mid position relative to the base 4, the mid position of the connecting shaft 71 is higher than the down position relative to the base 4, the cleaning brush 72 can have a down position and an up position relative to the connecting shaft 71, the up position of the cleaning brush 72 is higher than the down position relative to the connecting shaft 71, when the retaining ring dressing device is in the initial state and the retaining ring dressing device is grinding and dressing the retaining ring 2, the connecting shaft 71 is in the down position, and the cleaning brush 72 is in the down position, based on this:

[0056] After the dressing disk 5 has finished grinding and dressing the retaining ring 2, that is, after the polishing head 1 stops driving the retaining ring 2 to rotate relative to the dressing disk 5 around the axis of the retaining ring 2, the retaining ring dressing device can perform a cleaning operation. Specifically, the controller receives a first control instruction, so that the controller can control the polishing head 1 to drive the retaining ring 2 to move in a direction away from the dressing block 52, and control the connecting shaft 71 to drive the cleaning brush 72 to move relative to the base 4 in a direction away from the bottom surface of the base 4 until the connecting shaft 71 is in the mid position, and also control the cleaning brush 72 to slide in a direction away from the connecting shaft 71 and away from the bottom surface of the chamber 42, so that the cleaning brush 72 is in the up position, and the cleaning brush 72 is relatively When the connecting shaft 71 slides until at least a portion of the brush head 721 included in the cleaning brush 72 is located between the retaining ring 2 and the trimming disk 5, after at least a portion of the brush head 721 included in the cleaning brush 72 is located between the retaining ring 2 and the trimming disk 5, the controller can also receive a second control instruction, so that the controller can control the connecting shaft 71 to drive the cleaning brush 72 to rotate relative to the base 4, and can control the cleaning brush 72 to slide reciprocatingly relative to the connecting shaft 71, and then, the brush head 721 of the cleaning brush 72 can sweep and clean impurities attached to the ground surface of the retaining ring 2, and sweep and clean impurities attached to the side of the supporting plate 51 away from the base 4 and the side of the trimming block 52 away from the base 4.

[0057] Therefore, by setting the sliding connection and the rotating connection of the connecting shaft 71 relative to the base 4, and the sliding connection of the cleaning brush 72 relative to the connecting shaft 71, not only can the brush head 721 of the cleaning brush 72 clean the ground surface of the retaining ring 2 and the dressing disk 5 at the same time, but also the connecting shaft 71 can drive the brush head 721 of the cleaning brush 72 to rotate relative to the base 4 during the cleaning process, and the cleaning brush 72 can reciprocate and slide relative to the connecting shaft 71, thereby improving the cleaning effect.

[0058] In one possible implementation, Figure 2 and Figure 5 As shown, the cleaning brush 72 also includes a brush rod 722; the brush rod 722 is in the shape of a straight rod, and the distance between the first end of the brush rod 722 and the bottom surface of the chamber 42 is smaller than the distance between the second end of the brush rod 722 and the bottom surface of the chamber 42, and the first end of the brush rod 722 is slidably connected to the connecting shaft 71 along the length direction of the brush rod 722. For example, a first cantilever 711 is fixedly connected to the connecting shaft 71, and the first end of the brush rod 722 is slidably connected to the first cantilever 711 along the length direction of the brush rod 722, so as to realize the sliding connection of the cleaning brush 72 with the connecting shaft 71 in the direction close to the connecting shaft 71 and close to the bottom surface of the chamber 42, or in the direction away from the connecting shaft 71 and away from the bottom surface of the chamber 42; the second end of the brush rod 722 is connected to the brush head 721, and the specific connection method may be an integral connection, a detachable connection or a fixed connection, etc.

[0059] Therefore, the sliding connection of the cleaning brush 72 relative to the connecting shaft 71 can be achieved by tilting the brush rod 722 of the cleaning brush 72 relative to the bottom surface of the chamber 42, which has a simple structure and saves costs.

[0060] In one possible implementation, Figure 2 , Figure 5 and Figure 6 As shown, the brush head 721 includes a first head 7211 and a second head 7212; the first head 7211 and the second head 7212 are arranged in a direction perpendicular to the bottom surface of the base 4, and the first head 7211 is farther away from the bottom surface of the base 4 than the second head 7212. When at least part of the brush head 721 is located between the retaining ring 2 and the trimming disk 5, at least part of the bristles of the first head 7211 abut against the ground surface of the retaining ring 2, and at least part of the bristles of the second head 7212 abut against the side of the supporting disk 51 away from the base 4 and / or the side of the trimming block 52 away from the base 4.

[0061] It should be noted that the parts of the brush rod 722 used to connect with the first head 7211 and the second head 7212 can be independent of each other or can be an integral whole, which is not limited in this embodiment of the present application.

[0062] Therefore, the ground surface of the retaining ring 2 and the dressing disk 5 can be cleaned simultaneously by the first head 7211 and the second head 7212, thereby improving the cleaning efficiency.

[0063] Optionally, when at least part of the brush head 721 is located between the retaining ring 2 and the trimming disk 5 , the first head 7211 can also abut against the groove between the air film 3 and the retaining ring 2 and / or abut against the gap between the air film 3 , etc., to increase the cleaning range of the cleaning brush 72 .

[0064] In one possible implementation, Figure 2 and Figure 3 As shown, the cleaning component 7 also includes a first nozzle 73; the first nozzle 73 is arranged on the side of the base 4 close to the trimming disk 5, and is used to spray liquid (such as polishing liquid and / or high-purity water, etc.) onto the trimming disk 5 when the cleaning component 7 cleans impurities attached to the side of the supporting plate 51 away from the base 4 and the side of the trimming block 52 away from the base 4, so as to optimize the cleaning effect.

[0065] In one possible implementation, Figure 2 and Figure 5As shown, the retaining ring dressing device also includes a circular wafer receiving ring 8; the axis of the wafer receiving ring 8 is perpendicular to the bottom surface of the chamber 42, and the wafer receiving ring 8 is connected to the connecting shaft 71. For example, the wafer receiving ring 8 can be fixedly connected to the connecting shaft 71 through a second cantilever 81. The wafer receiving ring 8 is used to hold the wafer. The wafer receiving ring 8 is provided with an avoidance opening 82 for avoiding the sliding path of the cleaning brush 72 relative to the connecting shaft 71. The avoidance opening 82 can disconnect the wafer receiving ring 8. For example, a cleaning brush 72 is provided at each avoidance opening 82 of the wafer receiving ring 8. The embodiment of the present application is not limited to this.

[0066] In a specific embodiment, in combination with the above-mentioned “the base 4 is placed horizontally, the trimming disc 5 is located above the base 4, the base 4 can have a down position and an up position, the connecting shaft 71 can have at least a down position and a mid position relative to the base 4, and the cleaning brush 72 can have a down position and an up position relative to the connecting shaft 71”, the connecting shaft 71 can also have an up position relative to the base 4, and the up position of the connecting shaft 71 is higher than the mid position relative to the base 4. Based on this:

[0067] When the retaining ring dressing device has not performed grinding and dressing on the retaining ring 2 and has not performed cleaning operations after grinding and dressing, the base 4 can be adjusted to the up position, the connecting shaft 71 can be adjusted to the mid position relative to the base 4, so that the wafer receiving ring 8 is in a higher position relative to the base 4, and the cleaning brush 72 can be adjusted to the down position relative to the connecting shaft 71, and then the wafer can be unloaded from the polishing head 1 to the wafer receiving ring 8 through the polishing head 1, and the wafer can also be taken away from the wafer receiving ring 8 through the polishing head 1 so that the wafer is installed on the polishing head 1; when the retaining ring dressing device has not performed grinding and dressing on the retaining ring 2 and has not performed cleaning operations after grinding and dressing, the base 4 can be adjusted to the up position, the connecting shaft 71 can be adjusted to the up position relative to the base 4, so that the wafer receiving ring 8 is in the highest position relative to the base 4, and the cleaning brush 72 can be adjusted to the down position relative to the connecting shaft 71, and then the wafer can be placed on the wafer receiving ring 8 by a robot.

[0068] Therefore, by setting up the wafer receiving ring 8, the retaining ring trimming device can provide a wafer placement position for the turnover of the wafer, thereby improving the applicability of the retaining ring trimming device. Moreover, the retaining ring trimming device can be manufactured by modifying the equipment used to place the wafer, which is convenient for manufacturing, reduces costs, and improves manufacturing efficiency.

[0069] In addition, by arranging that both the wafer receiving ring 8 and the cleaning brush 72 are connected to the connecting shaft 71, the connecting shaft 71 can simultaneously drive the wafer receiving ring 8 and the cleaning brush 72 to move relative to the base 4. Compared with the scheme in which the structures for driving the wafer receiving ring 8 and the cleaning brush 72 to move relative to the base 4 are independent of each other, in the present application, the structure for driving the wafer receiving ring 8 and the cleaning brush 72 to move relative to the base 4 is the connecting shaft 71, which has a simple structure and improves the efficiency of driving the wafer receiving ring 8 and the cleaning brush 72 to move relative to the base 4.

[0070] In one possible implementation, Figure 2 and Figure 3 As shown, a second nozzle 43 is also provided on the base 4; the second nozzle 43 is located on the bottom surface of the chamber 42, and is used to spray liquid (such as polishing liquid and / or high-purity water, etc.) onto the wafer when the wafer is placed on the wafer receiving ring 8 to rinse the wafer.

[0071] Based on the above retaining ring trimming device, illustratively, when the polishing head 1 places the wafer w on the wafer receiving ring 8, or the polishing head 1 takes the wafer w from the wafer receiving ring 8, the retaining ring trimming device is in the following state: Figure 7 and Figure 8 When the retaining ring dressing device performs grinding and dressing on the retaining ring 2, the retaining ring dressing device is in the state shown in FIG. Fig. 9 and Fig.10 When the retaining ring dressing device 2 and the retaining ring 5 are cleaned, the retaining ring dressing device is in the state shown in Fig.11 and Fig.12 Status shown.

[0072] The present application also provides a chemical mechanical polishing unit for use with the above retaining ring dressing device. Figure 1 As shown, the chemical mechanical polishing unit includes a retaining ring 2 and a polishing head 1; the retaining ring 2 is connected to one side of the polishing head 1; the polishing head 1 is used to drive the retaining ring 2 to move until the ground surface of the retaining ring 2 away from the polishing head 1 abuts against the side of the dressing disk 5 away from the base 4, and drives the retaining ring 2 to rotate around the axis of the retaining ring 2 relative to the dressing disk 5 to grind and dress the ground surface of the retaining ring 2, and is also used to connect the wafer so that the wafer is located in the area surrounded by the retaining ring 2, and drive the wafer to perform chemical mechanical polishing.

[0073] In a specific embodiment, the specific structure of the chemical mechanical polishing unit and the specific process in which the polishing head 1 drives the retaining ring 2 to move so that the ground surface of the retaining ring 2 is ground and trimmed have been described above. The specific process in which the polishing head 1 drives the wafer to perform chemical mechanical polishing is also described below, and the embodiments of the present application will not be repeated here.

[0074] It should be noted that the chemical mechanical polishing unit of this embodiment is used in conjunction with the retaining ring dressing device in the aforementioned embodiment and has the corresponding beneficial effects of the aforementioned embodiment, which will not be described in detail here.

[0075] The present application also provides a chemical mechanical polishing unit control method for controlling the chemical mechanical polishing unit. Fig.13 FIG. 1 is a flow chart of a chemical mechanical polishing unit control method according to an embodiment of the present invention. Fig.13 As shown, the chemical mechanical polishing unit control method includes the following steps:

[0076] Step 1301, when the chemical mechanical polishing unit is not connected to the wafer, control the polishing head 1 of the chemical mechanical polishing unit to drive the retaining ring 2 to move until the grinding surface of the retaining ring 2 away from the polishing head 1 abuts against the side of the dressing plate 5 away from the base 4;

[0077] Step 1302 : Control the polishing head 1 to drive the retaining ring 2 to rotate relative to the dressing disk 5 around the axis of the retaining ring 2 , so as to grind and dress the ground surface of the retaining ring 2 .

[0078] In a specific embodiment, the chemical mechanical polishing unit control method can be applied to the above-mentioned controller or other controllers connected to the above-mentioned controller, and the embodiment of the present application is not limited to this. The specific process of grinding and trimming the ground surface of the retaining ring 2 by the chemical mechanical polishing unit control method has been described above and will not be repeated here in the embodiment of the present application.

[0079] It should be noted that the chemical mechanical polishing unit control method of this embodiment is used to control the chemical mechanical polishing unit in the aforementioned embodiments, and has the corresponding beneficial effects of the aforementioned embodiments, which will not be described in detail here.

[0080] The embodiment of the present application also provides a chemical mechanical polishing device, which includes a polishing disk, a liquid supply part and the above-mentioned chemical mechanical polishing unit; the polishing disk has a polishing pad on one side; the liquid supply part is used to provide polishing liquid to the side of the polishing pad away from the polishing disk; the polishing head 1 is also used to connect the wafer so that the wafer is located in the area surrounded by the retaining ring 2, and drives the polished layer of the wafer to abut against the polishing pad, and drives the wafer to move relative to the polishing pad to perform chemical mechanical polishing on the wafer.

[0081] In a specific embodiment, the polishing pad is in the shape of a circular pad, and the polishing disk is used to drive the polishing pad to rotate around the axis of the polishing pad; the liquid supply part can be a spray rod, etc., and the liquid supply part can be connected to the polishing disk to provide polishing liquid to the side of the polishing pad away from the polishing disk (hereinafter referred to as the polishing surface), and the polishing head 1 can adsorb the wafer through the air film 3 so that the wafer is located in the area surrounded by the retaining ring 2. During the chemical mechanical polishing process, the liquid supply part can provide polishing liquid to the polishing surface, and the polishing head 1 can adsorb the wafer through the air film 3 and drive the wafer to move, so that the polished layer of the wafer (that is, the layer of the wafer away from the air film 3 at this time) abuts against the side of the polishing pad away from the polishing disk, and then the polishing head 1 drives the wafer to rotate around the axis of the wafer relative to the polishing pad, and also drives the wafer to reciprocate on the polishing surface along the radial direction of the polishing surface to perform chemical mechanical polishing on the wafer. It should be noted that the chemical mechanical polishing equipment of this embodiment includes the chemical mechanical polishing unit in the aforementioned embodiment, and has the corresponding beneficial effects of the aforementioned embodiment, which will not be repeated here.

[0082] It should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the existence of other identical factors in the process, method, article or device including the elements.

[0083] Finally, it should be noted that the above are only preferred embodiments of the present invention, which are only used to illustrate the technical solution of the present invention, and are not used to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.

Claims

1. A retaining ring dressing device, characterized in that: include: Base, dressing plate, detection parts and controller; The dressing disk is arranged on one side of the base, and is used for grinding and dressing the ground surface of the retaining ring after the polishing head of the chemical mechanical polishing unit drives the retaining ring to move until the ground surface of the retaining ring away from the polishing head abuts against the side of the dressing disk away from the base, and in the process in which the polishing head drives the retaining ring to rotate relative to the dressing disk around the axis of the retaining ring, the grinding disk is used for grinding and dressing the ground surface of the retaining ring; The detection member is arranged on the base and is electrically connected to the controller, and is used to detect and obtain shape data of the ground surface of the retaining ring during the process in which the dressing disk performs grinding and dressing on the retaining ring, and send the shape data to the controller; The controller is used to receive the shape data, and after determining that the shape data meets the target condition for indicating that the shape of the ground surface of the retaining ring is normal, control the polishing head to stop driving the retaining ring to rotate relative to the dressing disk, so that the grinding and dressing of the retaining ring by the dressing disk is completed.

2. The device according to claim 1, characterized in that The trimming plate includes a carrier plate and at least one trimming block; The carrier plate is connected to the base, the two opposite side surfaces of the carrier plate are annular surfaces, one annular surface of the carrier plate abuts against the base, the detection member is arranged at a position of the base close to the carrier plate, and the carrier plate is provided with a detection opening penetrating the carrier plate along the thickness direction of the carrier plate; The dressing block is connected to the annular surface of the carrier plate away from the base, and is used to grind and dress the ground surface of the retaining ring after the polishing head drives the retaining ring to move until the ground surface of the retaining ring abuts against the side of the dressing block away from the carrier plate, and during the process when the polishing head drives the retaining ring to rotate around the axis of the retaining ring relative to the dressing block.

3. The device according to claim 2, characterized in that The device also includes a cleaning component; The cleaning assembly is connected to the base and is used to clean impurities attached to the ground surface of the retaining ring after the dressing disk completes the grinding and dressing of the retaining ring, and / or to clean impurities attached to the side of the supporting plate away from the base and the side of the dressing block away from the base.

4. The device according to claim 3, characterized in that A chamber is provided on the side of the base close to the trimming disc, the bottom surface of the chamber is perpendicular to the axial direction of the carrier disc, and the cleaning assembly includes a connecting shaft and at least one cleaning brush; The connecting shaft is located in the chamber, and is slidably connected to the base along a direction parallel to the axis of the carrier plate, and is rotationally connected to the base around the axis of the carrier plate; The cleaning brush is slidably connected to the connecting shaft in a direction close to the connecting shaft and close to the bottom surface of the chamber, or in a direction away from the connecting shaft and away from the bottom surface of the chamber; The controller is used to control the polishing head to drive the retaining ring to separate from the dressing block according to the received first control instruction after the dressing disk completes the grinding and dressing of the retaining ring, and control the connecting shaft to drive the cleaning brush to move relative to the base in a direction away from the bottom surface of the base, and also control the cleaning brush to slide in a direction away from the connecting shaft and away from the bottom surface of the chamber, so that the cleaning brush slides relative to the connecting shaft until at least a portion of the brush head included in the cleaning brush is located between the retaining ring and the dressing disk, and is also used to control the connecting shaft to drive the cleaning brush to rotate relative to the base according to the received second control instruction after at least a portion of the brush head is located between the retaining ring and the dressing disk, and control the cleaning brush to slide reciprocatingly relative to the connecting shaft.

5. The device according to claim 4, characterized in that The cleaning brush also includes a brush rod; The brush rod is in the shape of a straight rod, the distance between the first end of the brush rod and the bottom surface of the chamber is smaller than the distance between the second end of the brush rod and the bottom surface of the chamber, the first end of the brush rod is slidably connected to the connecting shaft along the length direction of the brush rod, and the second end of the brush rod is connected to the brush head.

6. The device according to claim 4 or 5, characterized in that The brush head includes a first head and a second head; The first head and the second head are arranged in a direction perpendicular to the bottom surface of the base, and the first head is farther away from the bottom surface of the base than the second head. When at least part of the brush head is located between the retaining ring and the trimming disk, at least part of the bristles of the first head abut against the ground surface of the retaining ring, and at least part of the bristles of the second head abut against the side of the supporting disk away from the base and / or the side of the trimming block away from the base.

7. The device according to claim 3, characterized in that The cleaning assembly also includes a first nozzle; The first nozzle is arranged on a side of the base close to the trimming disk, and is used to spray liquid to the trimming disk when the cleaning assembly cleans impurities attached to the side of the carrier disk away from the base and the side of the trimming block away from the base.

8. The device according to claim 4, characterized in that The device also includes a circular wafer receiving ring; The axis of the wafer receiving ring is perpendicular to the bottom surface of the chamber. The wafer receiving ring is connected to the connecting shaft. The wafer receiving ring is used to hold wafers. The wafer receiving ring is provided with an avoidance opening for avoiding the sliding path of the cleaning brush relative to the connecting shaft.

9. The device according to claim 1, characterized in that The base is connected with a driving member; The driving member is used to drive the base to move along a direction perpendicular to the surface of the trimming disk.

10. The device according to claim 1, characterized in that The same shape data detected by the same detection piece includes the distances between a plurality of position points on any ring width line of the ground surface of the retaining ring and the detection head of the detection piece.

11. A chemical mechanical polishing unit, characterized in that: For use with the retaining ring dressing device as claimed in any one of claims 1 to 10, the chemical mechanical polishing unit comprises a retaining ring and a polishing head; The retaining ring is connected to one side of the polishing head; The polishing head is used to drive the retaining ring to move until the ground surface of the retaining ring away from the polishing head abuts against the side of the dressing disk away from the base, and drives the retaining ring to rotate around the axis of the retaining ring relative to the dressing disk to grind and dress the ground surface of the retaining ring. It is also used to connect the wafer so that the wafer is located in the area surrounded by the retaining ring, and drives the wafer to perform chemical mechanical polishing.

12. A chemical mechanical polishing unit control method, characterized in that: For controlling the chemical mechanical polishing unit according to claim 11, the chemical mechanical polishing unit control method comprises: When the chemical mechanical polishing unit is not connected to a wafer, controlling the polishing head of the chemical mechanical polishing unit to drive the retaining ring to move until the grinding surface of the retaining ring away from the polishing head abuts against the side of the dressing disk away from the base; The polishing head is controlled to drive the retaining ring to rotate relative to the dressing disk around the axis of the retaining ring, so as to grind and dress the ground surface of the retaining ring.

13. A chemical mechanical polishing device, characterized in that: comprising a polishing disc, a liquid supply member and a chemical mechanical polishing unit as claimed in claim 11; The polishing disc has a polishing pad disposed on one side; The liquid supply member is used to supply polishing liquid to the side of the polishing pad away from the polishing plate; The polishing head is also used to connect the wafer so that the wafer is located in the area surrounded by the retaining ring, and drives the polished layer of the wafer to abut against the polishing pad, and drives the wafer to move relative to the polishing pad to perform chemical mechanical polishing on the wafer.

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