Multi-Mark positioning rapid cutting method, device and equipment for MLCC (Multiplayer Ceramic Chip Capacitor) micro component and medium

Abstract

The invention relates to the technical field of ceramic capacitor production, in particular to an MLCC micro component multi-Mark positioning rapid cutting method, device and equipment and a medium. The method comprises the steps that product adsorption information is obtained, a cutting starting instruction is triggered, cutting direction data is obtained, and a first cutting direction and other cutting directions are obtained from the cutting direction data; the method comprises the following steps: acquiring a to-be-cut product image in a first cutting direction, acquiring a start Mark positioning point in the first cutting direction from the to-be-cut product image, and triggering a cutter cutting instruction according to the start Mark positioning point; when a cutter lifting instruction is obtained, a next Mark positioning point is obtained from the cutting image of the to-be-cut product, and a cutter cutting instruction is triggered according to the next Mark positioning point; and obtaining a cutting end message of the first cutting direction, and triggering a carrier rotation instruction and a corresponding cutter cutting instruction according to the other cutting directions. The method has the effect of improving the cutting efficiency of the MLCC tiny original part.

Description

Technical Field

[0001] The present application relates to the technical field of ceramic capacitor production, and in particular to a method, device, equipment and medium for rapid cutting of MLCC micro-components with multiple marks. Background Art

[0002] At present, when making ceramic capacitors, a cutting machine is needed to mark and cut the blocks. With the continuous development of electronic products, the size specifications of ceramic capacitors are getting smaller and smaller. Therefore, during production, multi-mark positioning is adopted to achieve rapid positioning and cutting, thereby further improving the cutting efficiency while ensuring the cutting accuracy.

[0003] Existing cutting machines generally perform regional alignment on the product's Mark line and calculate the average position for cutting. This method ensures cutting efficiency while ensuring cutting accuracy. However, due to the miniaturization of capacitors, the blade will have a certain degree of displacement of the product during cutting. This displacement will have a greater impact on the cutting accuracy of the miniaturized product. Therefore, to ensure the cutting accuracy of such miniaturized products, it is necessary to align the cutting of each Mark line. If the existing cutting machine adopts the method of aligning and cutting each Mark line, the production efficiency is very low and it is difficult to meet the production needs of customers. Summary of the invention

[0004] In order to improve the efficiency of cutting MLCC tiny components, the present application provides a method, device, equipment and medium for fast cutting of MLCC tiny components with multi-mark positioning.

[0005] The above-mentioned invention objective of the present application is achieved through the following technical solutions: A method for fast cutting of MLCC micro components with multiple Mark positioning, the method comprising: Acquire product adsorption information, trigger a cutting start instruction, and acquire cutting direction data, and acquire a first cutting direction and other cutting directions from the cutting direction data; Acquire the image of the product to be cut in the first cutting direction, and acquire the starting Mark positioning point of the first cutting direction from the image of the product to be cut, and trigger the cutter cutting instruction according to the starting Mark positioning point; When the cutter lifting instruction is obtained, the next Mark positioning point is obtained from the cutting image of the product to be cut, and the cutter cutting instruction is triggered according to the next Mark positioning point; The cutting completion message of the first cutting direction is obtained, and the carrier rotation instruction and the corresponding cutter cutting instruction are triggered according to the other cutting directions.

[0006] By adopting the above technical solution, in the multi-Mark positioning and rapid cutting method of MLCC micro-components, the parallel processing of image alignment and motion is realized, which significantly improves the overall production efficiency. Specifically: after obtaining the information of the product adsorbed on the carrier, the cutting start instruction is triggered, and the cutting direction data is obtained. These data include the information of the first cutting direction and other cutting directions, which provide a basis for subsequent cutting operations; the image of the product to be cut in the first cutting direction is obtained by a horizontal camera installed on the side of the carrier. This process uses high-precision camera shooting technology to ensure that a clear image is obtained, which is convenient for subsequent Mark point identification and positioning; the exact position of the product to be cut is identified from the image of the product to be cut in the first cutting direction, and the starting Mark positioning point is extracted from it. This process ensures the accurate identification of the Mark point through image processing algorithms such as edge detection and template matching; according to the position of the starting Mark positioning point, the cutter cutting instruction is triggered, and the cutter cuts the product from the alignment position. This process ensures the accuracy of cutting through precise mechanical control; when the cutter lift instruction is received, Not only does the cutter lift up, but the image alignment is also performed on the next Mark line at the same time. Since traditional cutting machines usually move to the next Mark line position first and then perform image alignment after completing a cut, extra waiting time will be generated in the middle. In the present application, by performing image alignment while the cutter is lifted, this time can be fully utilized to reduce unnecessary waiting, thereby significantly improving the overall production efficiency; the positioning point of the next Mark line is identified from the acquired image, and the cutter cutting instruction is triggered according to the positioning point. This process is executed in a loop until all Mark lines in the first cutting direction are cut; when all Mark lines in the first cutting direction are cut, the cutting end message is obtained, and preparations are made for operations in other cutting directions. According to the rotation angle data between the other cutting directions and the first cutting direction, the stage rotation instruction is triggered to rotate the stage to the next cutting direction. When the carrier finishes rotating, the system immediately triggers the cutter cutting command in that direction and repeats the above cutting process until all cutting directions are completed. This ensures that each Mark line is accurately aligned, and the image alignment of the next Mark line is performed when the cutter is lifted, saving the image alignment time, achieving parallel processing of image alignment and motion, and significantly improving the overall production efficiency. This not only solves the problem of low efficiency of traditional cutting machines, but also greatly improves the production speed while ensuring cutting accuracy, meeting customers' urgent needs for efficient production.

[0007] In a preferred example, the present application can be further configured as follows: the image of the product to be cut in the first cutting direction is obtained, and the starting Mark positioning point of the first cutting direction is obtained from the image of the product to be cut, and the cutting instruction of the cutter is triggered according to the starting Mark positioning point, specifically including: Triggering a product shooting command to a horizontal camera installed on the side of the stage, and acquiring a horizontal shooting image corresponding to the first cutting direction according to the product shooting command; Identify the position of the product to be cut from the horizontal captured image, and locate the image of the product to be cut from the horizontal image according to the position of the product to be cut; Mark point recognition is performed on the image of the product to be cut to obtain the product Mark position, and the starting Mark positioning point is obtained from the product Mark position.

[0008] By adopting the above technical solution, by adjusting the installation angle of the image lens to 0 degrees horizontally, the alignment height of the cutter is greatly reduced, so that the movement stroke of the cutter is shortened to 1 / 10 of the original, significantly reducing the movement time, and further improving production efficiency. Specifically, the lens of a traditional cutting machine is usually installed in a vertical or side direction of 20-50 degrees, which will cause the cutter to block the lens's field of view during the cutting process. In order to ensure that the lens can accurately capture the mark point, the up and down movement stroke of the cutter must be increased to avoid the lens's line of sight. This design not only increases the movement distance of the cutter, but also prolongs the time of each alignment, seriously affecting the overall production efficiency. In the present application, by adjusting the mounting angle of the image lens to 0 degrees horizontally, that is, installing it on the side of the platform, the cutter can effectively avoid blocking the lens. In this way, the cutter does not need to move up and down significantly when aligning, and only needs to be finely adjusted within a smaller range, thereby greatly shortening the movement stroke of the cutter. For example, the alignment height of the cutter in the prior art is usually 50mm, and after adjusting the lens mounting angle, the alignment height of the cutter can be reduced to 5mm, and the movement stroke is shortened to 1 / 10 of the original. This improvement not only significantly reduces the movement time of the cutter, but also improves the response speed and stability of the entire system, making the alignment process more efficient and accurate. In addition, by reducing the movement stroke of the cutter, the mechanical wear and failure rate caused by frequent large-scale movement can also be reduced, and the service life of the equipment can be extended. At the same time, due to the shortening of the cutter movement stroke, more cutting operations can be completed in unit time, thereby significantly improving production efficiency. In summary, by adjusting the mounting angle of the image lens to 0 degrees horizontally, not only the problem of the cutter blocking the lens in the prior art is solved, but also the movement stroke of the cutter is significantly shortened, the movement time is greatly reduced, and the production efficiency is further improved.

[0009] In a preferred example, the present application can be further configured as follows: when the cutter lifting instruction is obtained, the next Mark positioning point is obtained from the cutting image of the product to be cut, and the cutter cutting instruction is triggered according to the next Mark positioning point, specifically including: Acquire product thickness data from the horizontally shot image, generate a cutter lift distance according to the product thickness data, and generate the cutter lift instruction according to the cutter lift distance; Starting from the starting Mark positioning point, the next Mark positioning point is obtained cyclically, and the cutter cutting instruction is triggered according to the next Mark positioning point until the cutting end message of the first cutting direction is triggered.

[0010] By adopting the above technical solution, when obtaining the cutter lifting instruction, the product thickness data can be accurately obtained from the horizontal shooting image, and then the cutter lifting distance can be generated, and the cutter lifting instruction can be generated accordingly. This process not only ensures that the cutter can be accurately lifted to the predetermined height after each cut, but also effectively reduces the cutting error caused by improper cutter lifting. Specifically, the horizontal shooting image obtained by the horizontal camera can accurately measure the thickness of the product. This step is particularly important for tiny components, because the thickness change of tiny components may have a significant impact on the cutting accuracy. By obtaining the product thickness data, the cutter lifting distance can be dynamically adjusted according to the actual thickness to ensure that the cutter can accurately return to the preset alignment position after each cut, thereby ensuring the accuracy of subsequent cutting. In addition, starting from the starting Mark positioning point, the next Mark positioning point is obtained cyclically, and the cutter cutting instruction is triggered according to each Mark positioning point. This process realizes continuous and efficient cutting operations. By obtaining the next Mark positioning point immediately after each cut, the system can complete the alignment and cutting of multiple Mark points in one cutting cycle, greatly improving the cutting efficiency. This design not only reduces the frequent image alignment time in traditional cutting methods, but also synchronizes the image alignment and cutting actions through parallel processing, further saving time.

[0011] In a preferred example, the present application may be further configured as follows: the obtaining of the cutting completion message of the first cutting direction and triggering the stage rotation instruction and the corresponding cutter cutting instruction according to the other cutting directions specifically include: Acquire rotation angle data between other cutting directions and the first cutting direction, and trigger the stage rotation instruction according to the rotation angle data; When the carrier rotation completion message is obtained, the cutter cutting instructions corresponding to the other cutting directions are triggered.

[0012] By adopting the above technical solution, after completing the cutting in the first cutting direction, the rotation angle data between other cutting directions and the first cutting direction can be quickly obtained, and the stage rotation command can be triggered according to the rotation angle data, so that the stage can be accurately rotated to the position of the next cutting direction. This process not only ensures the precise conversion of the cutting direction, but also significantly reduces the time of stage rotation and improves the overall cutting efficiency. At the same time, when the rotation of the stage is completed, the cutter cutting command corresponding to other cutting directions is immediately triggered, so that the cutting process is seamlessly connected and the decrease in production efficiency due to long waiting time is avoided. In this way, the present invention greatly improves the rapid cutting efficiency of multi-mark positioning while ensuring cutting accuracy, and is particularly suitable for the high-precision cutting requirements of miniaturized MLCC components.

[0013] In a preferred example, the present application can be further configured as follows: after the carrier rotation end message is obtained, the cutter cutting instruction corresponding to the other cutting directions is triggered, specifically including: Triggering a product shooting command to a horizontal camera installed on the side of the stage, and acquiring horizontal shooting images corresponding to the other cutting directions according to the product shooting command; Identify the position of the product to be cut from the horizontal captured image, and locate the image of the product to be cut from the horizontal image according to the position of the product to be cut; Acquire product thickness data from the horizontally shot image, generate a cutter lift distance according to the product thickness data, and generate the cutter lift instruction according to the cutter lift distance; Starting from the next Mark positioning point, the Mark positioning points are acquired cyclically, and the cutter cutting instruction is triggered according to the Mark positioning point until the product cutting completion message is triggered.

[0014] By adopting the above technical solution, first, the horizontal camera installed on the side of the stage triggers the product shooting instruction, and the horizontal shooting images corresponding to other cutting directions are obtained according to the instruction. This process ensures that after the stage completes the rotation, the product image in the new cutting direction can be obtained in time, providing an accurate reference basis for the subsequent cutting operation; secondly, the position of the product to be cut is identified from the horizontal shooting image, and the image of the product to be cut is obtained from the horizontal image according to the position of the product to be cut. This step uses image processing technology to accurately determine the actual position of the product to be cut, laying the foundation for the subsequent Mark point recognition, and then obtain the product thickness data from the horizontal shooting image, generate the cutter lifting distance according to the product thickness data, and generate the cutter lifting instruction according to the cutter lifting distance. This process effectively avoids the cutting error caused by the fixed lifting distance by accurately measuring the product thickness and dynamically adjusting the cutter lifting distance, thereby improving the cutting accuracy and reliability; then, starting from the starting Mark positioning point, the next Mark positioning point is obtained cyclically, and the cutter cutting instruction is triggered according to the next Mark positioning point until the cutting end message of the first cutting direction is triggered. This cyclic process ensures that each mark point can be accurately identified and cut, avoiding omissions or wrong cutting, and further improving the precision and efficiency of cutting. Through the above technical solution, not only can the product image in the new cutting direction be quickly and accurately acquired after the rotation of the carrier is completed, but also the precision and reliability of cutting are ensured by dynamically adjusting the lift distance of the cutter. The whole process significantly improves the efficiency and quality of cutting through automated and intelligent control, especially when processing tiny components, effectively solving the problems of inefficiency and lack of precision in traditional cutting methods. In summary, the present invention realizes efficient and accurate multi-mark positioning and rapid cutting by optimizing each link in the cutting process, thus meeting the needs of modern electronic product production.

[0015] The second object of the invention is achieved by the following technical solutions: A multi-mark positioning and fast cutting device for MLCC micro-components, the multi-mark positioning and fast cutting device for MLCC micro-components comprising: A cutting direction acquisition module, used to acquire product adsorption information, trigger a cutting start instruction, acquire cutting direction data, and acquire a first cutting direction and other cutting directions from the cutting direction data; A positioning point recognition module is used to obtain the image of the product to be cut in the first cutting direction, and obtain the starting Mark positioning point of the first cutting direction from the image of the product to be cut, and trigger the cutter cutting instruction according to the starting Mark positioning point; The product cutting instruction is used to obtain the next Mark positioning point from the cutting image of the product to be cut when the cutter lifting instruction is obtained, and trigger the cutter cutting instruction according to the next Mark positioning point; The cyclic cutting instruction is used to obtain the cutting completion message of the first cutting direction, and trigger the carrier rotation instruction and the corresponding cutter cutting instruction according to the other cutting directions.

[0016] By adopting the above technical solution, in the multi-Mark positioning and rapid cutting method of MLCC micro-components, the parallel processing of image alignment and motion is realized, which significantly improves the overall production efficiency. Specifically: after obtaining the information of the product adsorbed on the carrier, the cutting start instruction is triggered, and the cutting direction data is obtained. These data include the information of the first cutting direction and other cutting directions, which provide a basis for subsequent cutting operations; the image of the product to be cut in the first cutting direction is obtained by a horizontal camera installed on the side of the carrier. This process uses high-precision camera shooting technology to ensure that a clear image is obtained, which is convenient for subsequent Mark point identification and positioning; the exact position of the product to be cut is identified from the image of the product to be cut in the first cutting direction, and the starting Mark positioning point is extracted from it. This process ensures the accurate identification of the Mark point through image processing algorithms such as edge detection and template matching; according to the position of the starting Mark positioning point, the cutter cutting instruction is triggered, and the cutter cuts the product from the alignment position. This process ensures the accuracy of cutting through precise mechanical control; when the cutter lift instruction is received, Not only does the cutter lift up, but the image alignment is also performed on the next Mark line at the same time. Since traditional cutting machines usually move to the next Mark line position first and then perform image alignment after completing a cut, extra waiting time will be generated in the middle. In the present application, by performing image alignment while the cutter is lifted, this time can be fully utilized to reduce unnecessary waiting, thereby significantly improving the overall production efficiency; the positioning point of the next Mark line is identified from the acquired image, and the cutter cutting instruction is triggered according to the positioning point. This process is executed in a loop until all Mark lines in the first cutting direction are cut; when all Mark lines in the first cutting direction are cut, the cutting end message is obtained, and preparations are made for operations in other cutting directions. According to the rotation angle data between the other cutting directions and the first cutting direction, the stage rotation instruction is triggered to rotate the stage to the next cutting direction. When the carrier finishes rotating, the system immediately triggers the cutter cutting command in that direction and repeats the above cutting process until all cutting directions are completed. This ensures that each Mark line is accurately aligned, and the image alignment of the next Mark line is performed when the cutter is lifted, saving the image alignment time, achieving parallel processing of image alignment and motion, and significantly improving the overall production efficiency. This not only solves the problem of low efficiency of traditional cutting machines, but also greatly improves the production speed while ensuring cutting accuracy, meeting customers' urgent needs for efficient production.

[0017] The third objective of the present application is achieved through the following technical solutions: A computer device comprises a memory, a processor and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the steps of the above-mentioned MLCC micro-component multi-mark positioning rapid cutting method are implemented.

[0018] The fourth objective of the present application is achieved through the following technical solutions: A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the steps of the above-mentioned MLCC micro-component multi-mark positioning rapid cutting method.

[0019] In summary, the present application includes at least one of the following beneficial technical effects: 1. By performing image alignment processing on the next Mark line while cutting the previous Mark line, the parallel operation of image alignment and motion is realized, which effectively saves image alignment time and greatly improves cutting efficiency.

[0020] 2. Adjust the installation angle of the image lens to 0 degrees horizontally, which significantly reduces the alignment height of the cutter and shortens the cutter movement stroke to 1 / 10 of the original, greatly reducing the movement time and further improving production efficiency.

[0021] 3. Combining the above two optimization measures, while ensuring the precise alignment of each mark line, the overall efficiency of image alignment and cutting is significantly improved, and the production efficiency is increased by more than 3 times compared with the existing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a flow chart of a method for fast cutting of MLCC micro-components with multiple marks in one embodiment of the present application.

[0023] Figure 2 It is a schematic diagram of Mark positioning point recognition in one embodiment of the present application.

[0024] Figure 3 It is a structural schematic diagram of the prior art.

[0025] Figure 4 It is a schematic diagram of the structure of the cutting device in this embodiment.

[0026] Figure 5 This is a principle block diagram of a multi-mark positioning and fast cutting device for MLCC micro-components in one embodiment of the present application; Figure 6 It is a schematic diagram of a device in an embodiment of the present application. In the picture, 1. stage; 2. cutter; 3. camera. DETAILED DESCRIPTION

[0027] The present application is further described in detail below in conjunction with the accompanying drawings.

[0028] In one embodiment, if Figure 1 As shown, the present application discloses a method for fast cutting of MLCC micro-components with multiple Mark positioning, which specifically includes the following steps: S10: Acquire product adsorption information, trigger a cutting start instruction, acquire cutting direction data, and acquire a first cutting direction and other cutting directions from the cutting direction data.

[0029] In this embodiment, the product adsorption information refers to the information of the product to be cut placed on the stage. The cutting start instruction refers to the instruction to start a series of operations for cutting the product to be cut. The cutting direction data refers to the data of the total direction to be cut on the product to be cut.

[0030] Specifically, after the product to be cut, such as MLCC micro-components, is moved to the stage below the cutter by means of a robotic arm, a vacuum adsorption instruction is triggered to send to the adsorption device of the stage to adsorb the product to be cut to prevent the product from moving on the stage. After the product to be cut is adsorbed, the adsorption information of the product is obtained, and a cutting start instruction is triggered to obtain the position where the product to be cut needs to be cut, thereby controlling the cutter to cut.

[0031] Furthermore, the direction in which the product needs to be cut is obtained from the preset information of the product as cutting direction data. In the present embodiment, the cutting direction data includes the X-axis direction and the Y-axis direction. In other embodiments, a plurality of cutting directions in different directions can be set according to the properties of different products to be cut.

[0032] Further, after obtaining the data of the to-be-cut direction, one of the data is obtained as the first cutting direction, and the rest are used as other cutting directions.

[0033] S20: Acquire an image of the product to be cut in a first cutting direction, and acquire a starting Mark positioning point in the first cutting direction from the image of the product to be cut, and trigger a cutter cutting instruction according to the starting Mark positioning point.

[0034] Specifically, the product to be cut is photographed and identified by a camera installed next to the stage, thereby obtaining an image of the product to be cut corresponding to the first cutting direction. Furthermore, in the image of the product to be cut, at least two Mark points are identified, i.e., positioning points for controlling the cutting position of the cutter, and the Mark positioning point closest to the edge of the product to be cut is used as the starting Mark positioning point, and the cutter cutting instruction is triggered according to the starting Mark positioning point.

[0035] S30: When the cutter lifting instruction is obtained, the next Mark positioning point is obtained from the cutting image of the product to be cut, and the cutter cutting instruction is triggered according to the next Mark positioning point.

[0036] Specifically, refer to Figure 2 After the cutting at the starting Mark positioning point is completed, the cutter lifting command is triggered to control the cutter to lift up. While the cutter is lifted, the next Mark positioning point is obtained from the image of the product to be cut, that is, from the multiple Mark points obtained when the starting Mark positioning point is obtained, the Mark positioning point adjacent to the starting Mark positioning point is used as the next Mark positioning point, that is, each time a Mark positioning point is obtained, the current positioning point to be cut and the next adjacent positioning point are obtained to improve the cutting efficiency.

[0037] S40: Obtain a cutting completion message for the first cutting direction, and trigger a stage rotation instruction and a corresponding cutter cutting instruction according to other cutting directions.

[0038] Specifically, after completing the cutting of all Mark points in the first cutting direction, the cutting end message is triggered, and the rotation angle between the next cutting direction and the current cutting direction in other cutting directions is obtained, thereby triggering the stage rotation instruction and triggering the corresponding cutter cutting instruction to complete the cutting of the product.

[0039] In this embodiment, in the MLCC micro-component multi-Mark positioning rapid cutting method, the parallel processing of image alignment and motion is realized, which significantly improves the overall production efficiency. Specifically: after obtaining the information of the product adsorbed on the carrier, the cutting start instruction is triggered, and the cutting direction data is obtained. These data include the information of the first cutting direction and other cutting directions, which provide a basis for subsequent cutting operations; the image of the product to be cut in the first cutting direction is obtained by a horizontal camera installed on the side of the carrier. This process uses high-precision camera shooting technology to ensure that a clear image is obtained, which is convenient for subsequent Mark point identification and positioning; the exact position of the product to be cut is identified from the image of the product to be cut in the first cutting direction, and the starting Mark positioning point is extracted from it. This process ensures the accurate identification of the Mark point through image processing algorithms such as edge detection and template matching; according to the position of the starting Mark positioning point, the cutter cutting instruction is triggered, and the cutter cuts the product from the alignment position. This process ensures the accuracy of cutting through precise mechanical control; when the cutter lift instruction is received, Not only does the cutter lift up, but the image alignment is also performed on the next Mark line at the same time. Since traditional cutting machines usually move to the next Mark line position first and then perform image alignment after completing a cut, extra waiting time will be generated in the middle. In the present application, by performing image alignment while the cutter is lifted, this time can be fully utilized to reduce unnecessary waiting, thereby significantly improving the overall production efficiency; the positioning point of the next Mark line is identified from the acquired image, and the cutter cutting instruction is triggered according to the positioning point. This process is executed in a loop until all Mark lines in the first cutting direction are cut; when all Mark lines in the first cutting direction are cut, the cutting end message is obtained, and preparations are made for operations in other cutting directions. According to the rotation angle data between the other cutting directions and the first cutting direction, the stage rotation instruction is triggered to rotate the stage to the next cutting direction. When the carrier finishes rotating, the system immediately triggers the cutter cutting command in that direction and repeats the above cutting process until all cutting directions are completed. This ensures that each Mark line is accurately aligned, and the image alignment of the next Mark line is performed when the cutter is lifted, saving the image alignment time, achieving parallel processing of image alignment and motion, and significantly improving the overall production efficiency. This not only solves the problem of low efficiency of traditional cutting machines, but also greatly improves the production speed while ensuring cutting accuracy, meeting customers' urgent needs for efficient production.

[0040] In one embodiment, in step S20, an image of a product to be cut in a first cutting direction is obtained, and a starting Mark positioning point in the first cutting direction is obtained from the image of the product to be cut, and a cutter cutting instruction is triggered according to the starting Mark positioning point, specifically including: S21: triggering a product shooting instruction to a horizontal camera installed on the side of the stage, and acquiring a horizontal shooting image corresponding to the first cutting direction according to the product shooting instruction.

[0041] Specifically, refer to Figure 3 In the prior art, the camera 3 for identifying the Mark positioning point is installed above the stage, and its shooting angle is 25 degrees to the plane where the stage 1 is located. The Mark positioning point of the product to be cut is on the side of the product. Therefore, when the cutter 2 is cutting, the cutter 2 will block the camera 3 from shooting the picture and cannot locate the position of the next Mark positioning point. After the cutter 2 completes the cutting, the cutter 2 needs to be raised above the camera 3, which affects the efficiency. Therefore, if Figure 4 As shown, in this embodiment, the camera 3 is installed at a horizontal position on the side of the stage 1, so that the shooting angle of the camera 3 can be better, and the cutter 2 can reduce the obstruction of the camera 3 when cutting.

[0042] Furthermore, when the product is cut, a product shooting instruction is triggered toward the horizontal camera on the side, thereby obtaining a horizontal shooting image corresponding to the first cutting direction.

[0043] S22: Identify the position of the product to be cut from the horizontally shot image, and locate the image of the product to be cut from the horizontal image according to the position of the product to be cut.

[0044] Specifically, a model for identifying the product to be cut is obtained through pre-training, and the horizontally shot image is input into the model to identify the position of the product to be cut, that is, the position of the product to be cut in the horizontally shot image, and the image at this position is used as the image of the product to be cut.

[0045] S23: Mark point recognition is performed on the image of the product to be cut to obtain the product Mark position, and the starting Mark positioning point is obtained from the product Mark position.

[0046] Specifically, the model is used to identify the Mark points of the image of the product to be cut, that is, the model has the ability to identify the product to be cut and to identify the Mark positioning points from the product to be cut. The recognition result is used as the product Mark position, and the Mark positioning point closest to the edge of the product to be cut at the product Mark position is used as the starting Mark positioning point.

[0047] In one embodiment, in step S30, that is, when the cutter lifting instruction is obtained, the next Mark positioning point is obtained from the cutting image of the product to be cut, and the cutter cutting instruction is triggered according to the next Mark positioning point, which specifically includes: S31: Acquire product thickness data from the horizontally shot image, generate a cutter lift distance according to the product thickness data, and generate a cutter lift instruction according to the cutter lift distance.

[0048] Specifically, after acquiring the horizontally shot image, since the camera is installed on the horizontal side of the stage, the size of the product to be cut in the image is identified, and the thickness data of the product is calculated, and the cutter lifting distance is generated according to the product thickness data, that is, the cutter lifting distance can be slightly larger than the product thickness data, so that the cutter can be moved after being lifted. After obtaining the cutter lifting distance, the cutter lifting instruction is triggered.

[0049] S32: starting from the starting Mark positioning point, cyclically obtaining the next Mark positioning point, and triggering the cutter cutting instruction according to the next Mark positioning point, until the cutting completion message of the first cutting direction is triggered.

[0050] Specifically, after the cutting of the position corresponding to the starting Mark positioning point is completed, the next Mark positioning point is obtained while the knife is lifted, and the steps of identifying the starting Mark positioning point, cutting, and finding the next Mark positioning point while the knife is lifted are repeated until the cutting of the positions corresponding to all the Mark positioning points in the first cutting direction is completed, thereby triggering the cutting end message.

[0051] In one embodiment, in step S40, that is, obtaining a cutting completion message of a first cutting direction, triggering a stage rotation instruction and a corresponding cutter cutting instruction according to other cutting directions specifically includes: S41: Obtain rotation angle data between other cutting directions and the first cutting direction, and trigger a stage rotation instruction according to the rotation angle data.

[0052] Specifically, from other cutting directions, the next cutting direction adjacent to the first cutting direction is obtained in the cutting order, and the angle between the cutting direction and the first cutting direction is obtained, and rotation angle data for controlling the rotation of the stage is generated based on the angle, and a corresponding stage rotation instruction is generated.

[0053] S42: After the carrier rotation completion message is obtained, the cutter cutting instructions corresponding to other cutting directions are triggered.

[0054] Specifically, after the stage rotation instruction is sent to the rotation control terminal of the stage, the stage is controlled to rotate accordingly, and after the rotation is completed, the stage rotation end message is triggered. After the stage rotation end message is obtained, the cutter cutting instruction corresponding to the cutting direction is triggered.

[0055] In one embodiment, in step S42, that is, after the carrier rotation completion message is obtained, the cutter cutting instructions corresponding to other cutting directions are triggered, specifically including: S421: triggering a product shooting command to a horizontal camera installed on the side of the stage, and acquiring horizontal shooting images corresponding to other cutting directions according to the product shooting command.

[0056] Specifically, referring to step S21, when the product is cut, the product shooting instruction is triggered toward the horizontal camera on the side, so as to obtain the horizontal shooting image corresponding to the other cutting direction.

[0057] S422: Identify the position of the product to be cut from the horizontally shot image, and locate the image of the product to be cut from the horizontal image according to the position of the product to be cut.

[0058] Specifically, referring to step S22, a model for identifying the product to be cut is obtained through pre-training, and the horizontally shot image is input into the model to identify the position of the product to be cut, that is, the position of the product to be cut in the horizontally shot image, and the image at this position is used as the image of the product to be cut.

[0059] S423: Acquire product thickness data from the horizontally shot image, generate a cutter lift distance according to the product thickness data, and generate a cutter lift instruction according to the cutter lift distance.

[0060] Specifically, after acquiring the horizontally shot image, since the camera is installed on the horizontal side of the stage, the size of the product to be cut in the image is identified, and the thickness data of the product is calculated, and the cutter lifting distance is generated according to the product thickness data, that is, the cutter lifting distance can be slightly larger than the product thickness data, so that the cutter can be moved after being lifted. After obtaining the cutter lifting distance, the cutter lifting instruction is triggered.

[0061] S424: Starting from the next Mark positioning point, the Mark positioning points are obtained cyclically, and the cutter cutting instruction is triggered according to the Mark positioning points until the product cutting completion message is triggered.

[0062] Specifically, after the cutting of the next Mark positioning point corresponding to the starting Mark positioning point is completed, the next Mark positioning point continues to be obtained while the knife is lifted, and the steps of identifying the starting Mark positioning point, cutting, and finding the next Mark positioning point while lifting the knife are executed in a loop until the positions corresponding to all Mark positioning points in all cutting directions are cut, thereby triggering the product cutting completion message.

[0063] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0064] In one embodiment, a device for rapidly cutting MLCC micro-components with multiple Marks is provided, and the device for rapidly cutting MLCC micro-components with multiple Marks is corresponding to the method for rapidly cutting MLCC micro-components with multiple Marks in the above embodiment. Figure 5 As shown, the MLCC micro-component multi-mark positioning fast cutting device includes a cutting direction acquisition module, a positioning point recognition module, a product cutting instruction and a cycle cutting instruction. The detailed description of each functional module is as follows: A cutting direction acquisition module is used to acquire product adsorption information, trigger a cutting start instruction, acquire cutting direction data, and acquire a first cutting direction and other cutting directions from the cutting direction data; A positioning point recognition module is used to obtain an image of the product to be cut in a first cutting direction, and obtain a starting Mark positioning point in the first cutting direction from the image of the product to be cut, and trigger a cutter cutting instruction according to the starting Mark positioning point; Product cutting instructions, used to obtain the next Mark positioning point from the cutting image of the product to be cut when the cutter lifting instruction is obtained, and trigger the cutter cutting instruction according to the next Mark positioning point; The cyclic cutting instruction is used to obtain the cutting completion message of the first cutting direction, and trigger the stage rotation instruction and the corresponding cutter cutting instruction according to other cutting directions.

[0065] Optionally, the positioning point recognition module specifically includes: A first horizontal shooting control submodule, used to trigger a product shooting instruction to a horizontal camera installed on the side of the stage, and obtain a horizontal shooting image corresponding to the first cutting direction according to the product shooting instruction; A horizontal image recognition submodule is used to recognize the position of the product to be cut from the horizontal image, and locate the image of the product to be cut from the horizontal image according to the position of the product to be cut; The positioning point acquisition submodule is used to identify the mark points of the product image to be cut, obtain the product mark position, and obtain the starting mark positioning point from the product mark position.

[0066] Optional, product cutting instructions, including: The cutting formation calculation submodule is used to obtain product thickness data from the horizontal shooting image, generate a cutter lift distance according to the product thickness data, and generate a cutter lift instruction according to the cutter lift distance; The product cutting submodule is used to start from the starting Mark positioning point, cyclically obtain the next Mark positioning point, and trigger the cutter cutting instruction according to the next Mark positioning point until the cutting end message of the first cutting direction is triggered.

[0067] Optionally, the loop cutting instructions include: The stage rotation control module is used to obtain the rotation angle data between the other cutting directions and the first cutting direction, and trigger the stage rotation instruction according to the rotation angle data; The cyclic cutting submodule is used to trigger the cutter cutting instructions corresponding to other cutting directions after obtaining the message that the carrier rotation ends.

[0068] Optionally, the loop cutting submodule includes: A second horizontal shooting control unit is used to trigger a product shooting instruction to a horizontal camera installed on the side of the stage, and obtain horizontal shooting images corresponding to other cutting directions according to the product shooting instruction; A horizontal image recognition unit, used to recognize the position of the product to be cut from the horizontally shot image, and locate the image of the product to be cut from the horizontal image according to the position of the product to be cut; A cutting formation calculation unit is used to obtain product thickness data from a horizontally shot image, generate a cutter lift distance according to the product thickness data, and generate a cutter lift instruction according to the cutter lift distance; The product cutting unit is used to start from the next Mark positioning point, cyclically obtain the Mark positioning point, and trigger the cutter cutting instruction according to the Mark positioning point until the product cutting end message is triggered.

[0069] For the specific definition of the MLCC micro-component multi-mark positioning and rapid cutting device, please refer to the definition of the MLCC micro-component multi-mark positioning and rapid cutting method mentioned above, which will not be repeated here. Each module in the above-mentioned MLCC micro-component multi-mark positioning and rapid cutting device can be implemented in whole or in part through software, hardware and a combination thereof. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0070] In one embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as follows: Figure 6As shown. The computer device includes a processor, a memory, a network interface and a database connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a method for fast cutting of multi-mark positioning of MLCC micro components is implemented.

[0071] In one embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the following steps when executing the computer program: Acquire product adsorption information, trigger a cutting start instruction, and acquire cutting direction data, and acquire a first cutting direction and other cutting directions from the cutting direction data; Acquire an image of the product to be cut in a first cutting direction, and acquire a starting Mark positioning point in the first cutting direction from the image of the product to be cut, and trigger a cutter cutting instruction according to the starting Mark positioning point; When the cutter lifting instruction is obtained, the next Mark positioning point is obtained from the cutting image of the product to be cut, and the cutter cutting instruction is triggered according to the next Mark positioning point; The cutting completion message of the first cutting direction is obtained, and the carrier rotation instruction and the corresponding cutter cutting instruction are triggered according to other cutting directions.

[0072] In one embodiment, a computer readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the following steps are implemented: Acquire product adsorption information, trigger a cutting start instruction, and acquire cutting direction data, and acquire a first cutting direction and other cutting directions from the cutting direction data; Acquire an image of the product to be cut in a first cutting direction, and acquire a starting Mark positioning point in the first cutting direction from the image of the product to be cut, and trigger a cutter cutting instruction according to the starting Mark positioning point; When the cutter lifting instruction is obtained, the next Mark positioning point is obtained from the cutting image of the product to be cut, and the cutter cutting instruction is triggered according to the next Mark positioning point; The cutting completion message of the first cutting direction is obtained, and the carrier rotation instruction and the corresponding cutter cutting instruction are triggered according to other cutting directions.

[0073] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0074] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0075] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for fast cutting of multi-mark positioning of MLCC micro components, characterized in that: The MLCC micro-component multi-mark positioning rapid cutting method comprises: Acquire product adsorption information, trigger a cutting start instruction, and acquire cutting direction data, and acquire a first cutting direction and other cutting directions from the cutting direction data; Acquire the image of the product to be cut in the first cutting direction, and acquire the starting Mark positioning point of the first cutting direction from the image of the product to be cut, and trigger the cutter cutting instruction according to the starting Mark positioning point; When the cutter lifting instruction is obtained, the next Mark positioning point is obtained from the cutting image of the product to be cut, and the cutter cutting instruction is triggered according to the next Mark positioning point; The cutting completion message of the first cutting direction is obtained, and the carrier rotation instruction and the corresponding cutter cutting instruction are triggered according to the other cutting directions.

2. The MLCC micro-component multi-mark positioning rapid cutting method according to claim 1 is characterized in that: The step of acquiring the image of the product to be cut in the first cutting direction, acquiring the starting Mark positioning point in the first cutting direction from the image of the product to be cut, and triggering the cutter cutting instruction according to the starting Mark positioning point specifically includes: Triggering a product shooting command to a horizontal camera installed on the side of the stage, and acquiring a horizontal shooting image corresponding to the first cutting direction according to the product shooting command; Identify the position of the product to be cut from the horizontal captured image, and locate the image of the product to be cut from the horizontal image according to the position of the product to be cut; Mark point recognition is performed on the image of the product to be cut to obtain the product Mark position, and the starting Mark positioning point is obtained from the product Mark position.

3. The MLCC micro-component multi-mark positioning rapid cutting method according to claim 2 is characterized in that: When the cutter lifting instruction is obtained, the next Mark positioning point is obtained from the cutting image of the product to be cut, and the cutter cutting instruction is triggered according to the next Mark positioning point, which specifically includes: Acquire product thickness data from the horizontally shot image, generate a cutter lift distance according to the product thickness data, and generate the cutter lift instruction according to the cutter lift distance; Starting from the starting Mark positioning point, the next Mark positioning point is obtained cyclically, and the cutter cutting instruction is triggered according to the next Mark positioning point until the cutting end message of the first cutting direction is triggered.

4. The MLCC micro-component multi-mark positioning rapid cutting method according to claim 2 is characterized in that: The obtaining of the cutting completion message of the first cutting direction and triggering the stage rotation instruction and the corresponding cutter cutting instruction according to the other cutting directions specifically include: Acquire rotation angle data between other cutting directions and the first cutting direction, and trigger the stage rotation instruction according to the rotation angle data; When the carrier rotation completion message is obtained, the cutter cutting instructions corresponding to the other cutting directions are triggered.

5. The MLCC micro-component multi-mark positioning rapid cutting method according to claim 4 is characterized in that: After the carrier rotation end message is obtained, the cutter cutting instruction corresponding to the other cutting directions is triggered, specifically including: Triggering a product shooting command to a horizontal camera installed on the side of the stage, and acquiring horizontal shooting images corresponding to the other cutting directions according to the product shooting command; Identify the position of the product to be cut from the horizontal captured image, and locate the image of the product to be cut from the horizontal image according to the position of the product to be cut; Acquire product thickness data from the horizontally shot image, generate a cutter lift distance according to the product thickness data, and generate the cutter lift instruction according to the cutter lift distance; Starting from the next Mark positioning point, the Mark positioning points are acquired cyclically, and the cutter cutting instruction is triggered according to the Mark positioning point until the product cutting completion message is triggered.

6. A multi-mark positioning and fast cutting device for MLCC micro-components, characterized in that: The MLCC micro-component multi-mark positioning fast cutting device comprises: A cutting direction acquisition module, used to acquire product adsorption information, trigger a cutting start instruction, acquire cutting direction data, and acquire a first cutting direction and other cutting directions from the cutting direction data; A positioning point recognition module is used to obtain the image of the product to be cut in the first cutting direction, and obtain the starting Mark positioning point of the first cutting direction from the image of the product to be cut, and trigger the cutter cutting instruction according to the starting Mark positioning point; The product cutting instruction is used to obtain the next Mark positioning point from the cutting image of the product to be cut when the cutter lifting instruction is obtained, and trigger the cutter cutting instruction according to the next Mark positioning point; The cyclic cutting instruction is used to obtain the cutting completion message of the first cutting direction, and trigger the carrier rotation instruction and the corresponding cutter cutting instruction according to the other cutting directions.

7. The MLCC micro-component multi-mark positioning and rapid cutting device according to claim 6 is characterized in that: The positioning point recognition module specifically includes: A first horizontal shooting control submodule, used for triggering a product shooting instruction to a horizontal camera installed on the side of the stage, and obtaining a horizontal shooting image corresponding to the first cutting direction according to the product shooting instruction; A horizontal image recognition submodule, used to recognize the position of the product to be cut from the horizontal captured image, and locate the image of the product to be cut from the horizontal image according to the position of the product to be cut; The positioning point acquisition submodule is used to perform Mark point recognition on the image of the product to be cut, obtain the product Mark position, and obtain the starting Mark positioning point from the product Mark position.

8. The MLCC micro-component multi-mark positioning and rapid cutting device according to claim 7 is characterized in that: The product cutting instructions specifically include: A cutting formation calculation submodule, used for acquiring product thickness data from the horizontally shot image, generating a cutter lift distance according to the product thickness data, and generating the cutter lift instruction according to the cutter lift distance; The product cutting submodule is used to start from the starting Mark positioning point, cyclically obtain the next Mark positioning point, and trigger the cutter cutting instruction according to the next Mark positioning point until the cutting end message of the first cutting direction is triggered.

9. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the MLCC micro-component multi-mark positioning rapid cutting method as described in any one of claims 1 to 5 are implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the MLCC micro-component multi-mark positioning rapid cutting method as described in any one of claims 1 to 5 are implemented.

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