Hot stamping film based on digital printing technology and preparation method and application thereof

Abstract

The invention relates to a hot stamping film based on a digital printing technology and a preparation method and application thereof, and relates to the technical field of hot stamping films. The hot stamping film comprises a base material, a release layer, a protective layer and a bonding layer which are sequentially arranged from bottom to top, the release layer comprises the following raw materials in parts by weight: 20-30 parts of thermoplastic polyurethane resin and 2-4 parts of micronized polyethylene wax; the protective layer comprises the following raw materials in parts by weight: 10-20 parts of organic silicon modified acrylic resin, 5-9 parts of fluorine modified organic silicon resin, 0.1-0.3 part of a drier, 0.5-1 part of a light stabilizer, 0.5-1 part of a light absorber and 1-3 parts of a curing agent. The hot stamping film prepared through the method has water resistance, fragmentation resistance and contamination resistance, the production efficiency is higher, flowing liquid is avoided, high quality and environmental protection are guaranteed, and the production cost can be reduced. According to the hot stamping film based on digital printing, personalized customization can be achieved, operation is easy and convenient, and the hot stamping film has exquisite patterns printed through thermal sublimation and further has good base material applicability and adhesive force.

Description

Technical Field

[0001] The invention relates to the technical field of hot stamping films, and in particular to a hot stamping film based on digital printing technology and a preparation method and application thereof. Background Art

[0002] Hot stamping film is a composite film formed by coating a release agent, pigment, and heat-sensitive resin on a plastic film. The coating of this film can be transferred to the printing material under a certain temperature and pressure. Therefore, hot stamping film can replace the currently widely used screen printing, roller printing, spraying, brushing, etc. For example, the coating of the surface protective layer of furniture and electrical appliances can be replaced by hot stamping technology. The advantage of hot stamping technology is that it can significantly improve the user's operating environment. Unlike traditional printing technology, there is no large amount of VOC emissions during hot stamping, and ink drying is not required.

[0003] Recently, a method of forming a thermal transfer film composed of acrylonitrile-styrene-acrylate (ASA) using a thermal transfer film transfer method is used to achieve high-quality decoration of vehicle interior and exterior parts. However, it is difficult to ensure durability such as water resistance, chip resistance and weather resistance using only ASA film in the thermal transfer process. In addition, compared with conventional ABS resin, the adhesion of the film and the coating is significantly reduced, and the weather resistance is also poor. Summary of the invention

[0004] In order to solve the above technical problems, the purpose of the present invention is to provide a hot stamping film based on digital printing technology and a preparation method and application thereof. The hot stamping film prepared by the present invention has enhanced water resistance, crack resistance and stain resistance, higher production efficiency and no flowing liquid, ensuring high quality and environmental protection. In addition, the production cost can be reduced. The hot stamping film based on digital printing of the present invention can be customized and easy to operate. It has exquisite patterns of thermal sublimation printing and has good substrate applicability and adhesion.

[0005] The technical solution of the present invention to solve the above technical problems is as follows:

[0006] The first object of the present invention is to provide a hot stamping film based on digital printing technology, wherein the hot stamping film comprises a substrate, a release layer, a protective layer, and an adhesive layer arranged in sequence from bottom to top;

[0007] The release layer comprises the following raw materials in parts by weight: 20 to 30 parts of thermoplastic polyurethane resin and 2 to 4 parts of micronized polyethylene wax;

[0008] The protective layer comprises the following raw materials in parts by weight: 10-20 parts of silicone-modified acrylic resin, 5-9 parts of fluorine-modified silicone resin, 0.1-0.3 parts of drying agent, 0.5-1 parts of light stabilizer, 0.5-1 parts of light absorber and 1-3 parts of curing agent.

[0009] The beneficial effects of the present invention are as follows: the present invention uses a light stabilizer and a light absorber to simultaneously block short wavelengths to increase weather resistance. Finally, a silicone-modified acrylic resin, a fluorine-modified silicone resin and a curing agent are mixed to enhance the chipping resistance, stain resistance and water resistance of the hot stamping film of the present invention.

[0010] Based on the above technical solution, the present invention can also be improved as follows.

[0011] Furthermore, the substrate includes at least one of a BOPP film and a BOPET film.

[0012] Furthermore, the adhesive layer comprises the following raw materials in parts by weight: 13 to 15 parts of acrylate-modified chloroacetic acid resin and 5 to 8 parts of maleic anhydride-modified polypropylene.

[0013] The beneficial effect of adopting the above further scheme is that the present invention enhances the adhesion by mixing maleic anhydride modified polypropylene and acrylate modified chlorovinyl resin; the subsequent layer will melt at a high temperature, so that the hot stamping film can be conveniently thermally transferred to the transfer substrate.

[0014] Furthermore, the weight average molecular weight of the thermoplastic acrylic resin is 50,000 to 100,000.

[0015] The beneficial effect of adopting the above further solution is that the above material has a low viscosity and a stable structure, and the structures on both sides of the release layer can be separated by a relatively small force.

[0016] Furthermore, the acid value of the organosilicon-modified acrylic resin is 3-8 mg / KOH, the hydroxyl content is 1-4%, the weight average molecular weight is 10,000-25,000, the glass transition temperature is 55-65° C., and the solid content is 50%-60%.

[0017] Furthermore, the fluorine-modified silicone resin has an acid value of 0.01 to 0.04 mg / KOH, a hydroxyl content of 0.1 to 0.4%, a weight average molecular weight of 10,000 to 14,000, a glass transition temperature of 75 to 85° C., and a solid content of 10% to 15%.

[0018] The beneficial effects of adopting the above further scheme are: (1) The organic silicon modified acrylic resin in the above range can minimize the viscosity of the film, thereby improving the reliability, adhesion and water resistance of the film. When the solid content of the organic silicon modified acrylic resin is less than 50%, it is difficult to achieve the reliability of the film. When the content is greater than 60%, the adhesion and water resistance may be reduced.

[0019] (2) The polyester-modified silicone resin defined in the present invention can provide hardness to the paint film and enhance the chipping resistance. Among them, when the solid content is less than 10%, the chipping resistance of the material may be reduced. When the content is greater than 15%, the processability (leveling) of the coating may be reduced.

[0020] Furthermore, the light stabilizer includes a hindered amine light stabilizer; the light absorber includes a hydroxyphenyl triazine ultraviolet absorber; the drying agent includes at least one of dibutyltin dilaurate and cobalt isooctanoate; and the curing agent is at least one of isophorone diisocyanate trimer and hexamethylene diisocyanate trimer.

[0021] The beneficial effects of adopting the above further scheme are: the light stabilizer can block short wavelengths at the same time, thereby enhancing weather resistance. The reactive catalyst increases the reaction rate of the main material and the curing agent, and when the light stabilizer content is small, the reaction rate of the main material and the curing agent may decrease. When the light stabilizer content is large, the pot life is reduced, and thus the processability may be deteriorated. The curing agent exhibits excellent non-fading characteristics and excellent weather resistance.

[0022] The thickness of the substrate is 12-25 μm; the thickness of the release layer is 0.1-0.5 μm; the thickness of the protective layer is 3-8 μm; and the thickness of the adhesive layer is 1.5-3 μm.

[0023] The beneficial effects of adopting the above further scheme are: (1) The substrate layer is used as the basis for coating the hot stamping film. When in use, it is separated from the other structures of the hot stamping film through the release layer, and then the remaining part is attached to the logo. If the substrate layer is too thin, the substrate layer is easily damaged and deformed during separation, which affects the use of the hot stamping film; conversely, if the substrate layer is too thick, the thermal conductivity of the entire hot stamping film is insufficient, resulting in excessively high hot stamping temperatures. The substrate layer with a thickness of 12-25μm has a uniform bonding strength with the other parts of the hot stamping film, which can quickly and effectively achieve the above-mentioned release process without affecting the use of the hot stamping film;

[0024] (2) A release layer that is too thin or too thick is not only not conducive to release, but also affects the aesthetics of the hot stamping film itself.

[0025] The second object of the present invention is to provide a method for preparing a hot stamping film based on digital printing technology, comprising the following steps:

[0026] S1: Prepare solution:

[0027] Release liquid: Thermoplastic polyurethane and micronized polyethylene wax are mixed and dissolved to prepare release liquid for standby use; Protective liquid: Silicone-modified acrylic resin, fluorine-modified silicone resin, drier, light stabilizer, light absorber and curing agent are dissolved in solvent and mixed and dissolved to prepare protective liquid for standby use; Adhesive liquid: Acrylate-modified chlorovinyl resin and maleic anhydride-modified polypropylene are dissolved in solvent to prepare adhesive liquid for standby use;

[0028] S2: Preparation of release layer: coating the release liquid on one side of the substrate layer, and then drying to form the release layer; Preparation of protective layer: coating the protective liquid on one side of the release layer away from the substrate layer, and then drying to form the protective layer; coating the adhesive liquid on one side of the protective layer away from the substrate layer, and then drying to form the adhesive layer; thereby obtaining a hot stamping film.

[0029] The third object of the present invention is to provide an application of a hot stamping film based on digital printing technology, wherein the hot stamping film is used in pattern transfer of printed products, plastic products, electronic appliances, etc.

[0030] Further, the specific steps of the transfer are as follows:

[0031] The hot stamping film is covered on the surface of the substrate with the pattern side facing upward (if it is a blank hot stamping film, the pattern direction does not need to be considered), the hot stamping equipment is started, and hot stamping is performed at a hot stamping temperature of 130 to 180° C. and a pressure of 15KN for 1s to 60s to complete the pattern transfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic diagram of the structure of the hot stamping film prepared in Example 1 of the present invention.

[0033] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0034] 1-hot stamping film, 10-release layer, 20-protective layer, 30-adhesive layer, 40-substrate. DETAILED DESCRIPTION

[0035] The principles and features of the present invention are described below, and the examples are only used to explain the present invention and are not used to limit the scope of the present invention. If no specific technology or conditions are specified in the embodiments, the technology or conditions described in the literature in this field or the product instructions are used. If the manufacturer of the reagents or instruments used is not specified, they are all conventional products that can be purchased through regular channels.

[0036] Example 1: Preparation of hot stamping film

[0037] S1: Prepare liquid: Release liquid: 20 parts of thermoplastic polyurethane resin (Desmopan487; Bayer, Germany) and 2 parts of micronized polyethylene wax (Honeywell, USA; AC 6A) are mixed together and dissolved in 39 parts of 2-butanone and 39 parts of toluene to prepare release liquid for use; Protective liquid: 10 parts of silicone-modified acrylic resin (X-22-164A Shin-Etsu Chemical, Japan), 5 parts of fluorine-modified silicone resin (Teflon AF 1600; DuPont, USA), 0.1 parts of drying agent (Cobalt Octoate 8% Akzo Nobel, Netherlands), 0.5 parts of light stabilizer (BASF; Tinuvin460), 0.5 parts of light absorber (BASF; Tinuvin 479), 1 part of curing agent (Desmodur Z 4470; Bayer, Germany) was dissolved in 34.25 parts of 2-butanone and 34.25 parts of toluene, and mixed and dissolved to prepare a protective solution for standby use; Adhesive solution: 15 parts of acrylate-modified chloroacetic acid resin (Paraloid B-44; Rohm and Haas, USA) and 5 parts of maleic anhydride-modified polypropylene (F-2P; Toyobo, Japan) were dissolved in 40 parts of 2-butanone and 40 parts of toluene to prepare an adhesive solution for standby use;

[0038] S2: Preparation of release layer: coating the release liquid on one side of the substrate 40 (12.5 μm BOPET film (Guangdong Shunming)), and then drying to form a 0.1-0.5 μm release layer 10; Preparation of protective layer: coating the protective liquid on one side of the release layer 10 away from the substrate layer, and then drying to form a 3-8 μm protective layer 20; coating the adhesive liquid on one side of the protective layer 20 away from the substrate layer, and then drying to form a 1.5-3 μm adhesive layer 30; thereby obtaining a hot stamping film 1.

[0039] Example 2: Preparation of hot stamping film II

[0040] When preparing the hot stamping film 1, the present embodiment differs from the embodiment 1 only in that the amount of raw materials for the protective layer 20 is changed, and the remaining preparation steps, preparation conditions, and material sources are consistent with those of the embodiment 1. S1 is specifically as follows:

[0041] S1: Prepare liquid: Release liquid: 20 parts of thermoplastic polyurethane resin (Desmopan487; Bayer, Germany) and 2 parts of micronized polyethylene wax (Honeywell, USA; AC 6A) are mixed and dissolved in 39 parts of 2-butanone and 39 parts of toluene to prepare release liquid for use; Protective liquid: 10 parts of silicone-modified acrylic resin (X-22-164A Shin-Etsu Chemical, Japan), 5 parts of fluorine-modified silicone resin (Teflon AF 1600; DuPont, USA), 0.5 parts of light stabilizer (BASF; Tinuvin 460), 0.5 parts of light absorber (BASF; Tinuvin 479), 1 part of curing agent (DesmodurZ 4470; Bayer, Germany) are dissolved in 34.25 parts of 2-butanone and 34.25 parts of toluene to prepare protective liquid for use; Adhesive liquid: 15 parts of acrylate-modified chlorovinyl resin (Paraloid B-44; Rohm and Haas, USA), 5 parts of maleic anhydride modified polypropylene (F-2P; Toyobo, Japan) were dissolved in 40 parts of 2-butanone and 40 parts of toluene to prepare a bonding solution for use.

[0042] Example 3: Preparation of hot stamping film

[0043] When preparing the hot stamping film 1, the present embodiment is different from the embodiment 1 only in that the raw material of the adhesive layer is changed, and the remaining preparation steps, preparation conditions, and material sources are consistent with those of the embodiment 1. S1 is specifically as follows:

[0044] S1: Prepare liquid: Release liquid: Mix 20 parts of thermoplastic acrylic resin (MB-2, Bolier Chemical) and 2 parts of micronized polyethylene wax (Honeywell, USA; AC 6A) in 39 parts of 2-butanone and 39 parts of toluene to dissolve to prepare release liquid for use; Protective liquid: Mix 10 parts of silicone-modified acrylic resin (X-22-164A, Shin-Etsu Chemical, Japan), 5 parts of fluorine-modified silicone resin (Teflon AF 1600; DuPont, USA), 0.1 parts of drying agent (Cobalt Octoate 8% Akzo Nobel, Netherlands), 0.5 parts of light stabilizer (BASF Tinuvin 460), 0.5 parts of light absorber (BASF Tinuvin 479), 1 part of curing agent (Desmodur Z 4470; Bayer, Germany) was dissolved in 36.5 parts of 2-butanone and 36.5 parts of toluene, mixed and dissolved together to prepare a protective liquid for use; bonding liquid: 20 parts of ternary chloroacetic acid resin (H15 / 45M Wacker, Germany), 5 parts of acrylic acid modified epoxy resin (A-102 Xieyu New Materials), 1 part of polyisocyanate curing agent (MHG-80B Asahi Chemical Multi-Nite) was dissolved in 37 parts of 2-butanone and 37 parts of toluene to prepare a bonding liquid for use.

[0045] Example 4: Preparation of hot stamping film

[0046] When preparing the hot stamping film 1, the present embodiment is different from the embodiment 1 only in that the raw material of the release layer 10 is changed, and the remaining preparation steps, preparation conditions, and material sources are consistent with those of the embodiment 1. S1 is specifically as follows:

[0047] S1: Prepare liquid: Release liquid: 20 parts of thermoplastic polyurethane resin (Desmopan487; Bayer, Germany) and 2 parts of micronized polyethylene wax (Honeywell, USA; AC 6A) are mixed and dissolved in 39 parts of 2-butanone and 39 parts of toluene to prepare release liquid for use; Protective liquid: 10 parts of silicone-modified acrylic resin (X-22-164A Shin-Etsu Chemical, Japan), 5 parts of fluorine-modified silicone resin (Teflon AF 1600; DuPont, USA), 0.1 parts of drying agent (Dabco T12 Gas Chemical), 0.5 parts of light stabilizer (Tinuvin 460), 0.5 parts of light absorber (Tinuvin 479), 1 part of curing agent (Desmodur Z 4470; Bayer, Germany) was dissolved in 36.5 parts of 2-butanone and 36.5 parts of toluene, and mixed and dissolved to prepare a protective solution for use; bonding solution: 15 parts of acrylate-modified chloroacetic acid resin (Paraloid B-44; Rohm and Haas, USA) and 5 parts of maleic anhydride-modified polypropylene (F-2P; Toyobo, Japan) were dissolved in 40 parts of 2-butanone and 40 parts of toluene to prepare a bonding solution for use.

[0048] Example 5: Preparation of hot stamping film

[0049] When preparing the hot stamping film 1, the present embodiment is different from the embodiment 1 only in that the raw material of the protective layer 20 is changed, and the remaining preparation steps, preparation conditions, and material sources are consistent with those of the embodiment 1. S1 is specifically as follows:

[0050] S1: Prepare liquid: Release liquid: 20 parts of thermoplastic polyurethane resin (Desmopan487; Bayer, Germany) and 2 parts of micronized polyethylene wax (Honeywell, USA; AC 6A) are mixed and dissolved in 39 parts of 2-butanone and 39 parts of toluene to prepare release liquid for use; Protective liquid: 10 parts of hydroxyl acrylic resin (BA870 Allnex), 5 parts of fluorine-modified silicone resin (TeflonAF1600; DuPont, USA), 0.1 parts of drying agent (Cobalt Octoate 8% Akzo Nobel, Netherlands), 0.5 parts of light stabilizer (BASF; Tinuvin 460), 0.5 parts of light absorber (BASF; Tinuvin 479), 1 part of curing agent (DesmodurZ4470; Bayer, Germany) are dissolved in 34.25 parts of 2-butanone and 34.25 parts of toluene to prepare protective liquid for use; Adhesive liquid: 15 parts of acrylate-modified chlorovinyl resin (Paraloid B-44; Rohm and Haas, USA), 5 parts of maleic anhydride modified polypropylene (F-2P; Toyobo, Japan) were dissolved in 40 parts of 2-butanone and 40 parts of toluene to prepare a bonding solution for use.

[0051] Comparative Example 1: Preparation of hot stamping film

[0052] When preparing the hot stamping film 1 , the comparative example is different from Example 1 in that the release layer 10 and the adhesive layer 30 are not prepared, and the remaining preparation steps, preparation conditions, and material sources are consistent with those of Example 1.

[0053] Comparative Example 2: Preparation of hot stamping film

[0054] When preparing the hot stamping film, the comparative example is different from Example 1 in that the protective layer 20 and the adhesive layer 30 are not prepared, and the remaining preparation steps, preparation conditions, and material sources are consistent with those of Example 1.

[0055] Comparative Example 3: Preparation of hot stamping film

[0056] When preparing the hot stamping film 1 , the comparative example is different from Example 1 in that the release layer 10 and the protective layer 20 are not prepared, and the remaining preparation steps, preparation conditions, and material sources are consistent with those of Example 1.

[0057] Comparative Example 4: Preparation of hot stamping film

[0058] When preparing the hot stamping film 1, the comparative example is different from the example 1 only in the raw materials of the protective layer 20, and the remaining preparation steps, preparation conditions, and material sources are consistent with the example 1. S1 is specifically as follows:

[0059] S1: Prepare liquid: Release liquid: 20 parts of thermoplastic polyurethane resin (Desmopan487; Bayer, Germany) and 2 parts of micronized polyethylene wax (Honeywell, USA; AC 6A) are mixed together in 39 parts of 2-butanone and 39 parts of toluene to dissolve to prepare release liquid for standby use; Protective liquid: 20 parts of ternary chloroacetic acid (H15 / 45M Wacker, Germany), 0.3 parts of plasticizer (A110 Maoheng Chemical), and 0.5 parts of epoxy modified silicone oil (KF-105 Shin-Etsu Silicone) are dissolved in 39.6 parts of 2-butanone and 39.6 parts of toluene to mix and dissolve to prepare protective liquid for standby use; Adhesive liquid: 15 parts of acrylate modified chloroacetic acid resin (Paraloid B-44; Rohm and Haas, USA) and 5 parts of maleic anhydride modified polypropylene (F-2P; Toyobo, Japan) are dissolved in 40 parts of 2-butanone and 40 parts of toluene to prepare adhesive liquid for standby use.

[0060] Performance Test:

[0061] The hot stamping films prepared in Examples 1 to 5 and Comparative Examples 1 to 4 were used for printing tests. The pattern film layer was transferred to the surface of the substrate by hot stamping transfer at a high temperature of 130 to 180° C. and a pressure of 15 KN.

[0062] (1) Adhesion test: Use German BYK cross-cut knife test, the grade refers to ISO 2409 cross-cut test standard, the standard is shown in Table 1:

[0063] Table 1 Evaluation criteria

[0064]

[0065]

[0066] ②Alcohol friction resistance test

[0067] Referring to GB17497.1-2012, the MCJ-01A friction tester independently developed and produced by Jinan Languang Electromechanical Technology Co., Ltd. was used to test the wear resistance of the hot stamping films prepared in Examples 1 to 5 and Comparative Examples 1 to 5. The friction pressure was 20±0.2N, the friction speed was 43 times / min, the number of frictions was 40 times, the tip was wrapped with a dust-free cloth, and alcohol was used to wet the tip of the dust-free cloth along the pipe. The wear resistance of the samples was determined by visual inspection, and the judgment criteria are shown in Table 2:

[0068] Table 2 Evaluation criteria

[0069] √ The ink layer on the printed surface does not show the bottom (fading) × The ink layer on the printed surface is exposed (fading)

[0070] ③Anti-fragmentation performance test

[0071] At a launch distance of 100mm, a launch angle of 45° and a load of 5.0Kg f / cm2 Under the condition of the launch pressure, 50g of regulated gravel (JIS Crushed Gravel No 7 Stone, 2.5-5mm, 350-400 stone) and a gravel crushing tester (Gravelo Meter: Standardized Product SAF J 400) were used for testing. The judgment criteria are shown in Table 3:

[0072] Table 3 Evaluation criteria

[0073] √ The ink layer on the printed surface does not show the bottom (fading) × The ink layer on the printed surface is exposed (fading)

[0074] ④Water resistance:

[0075] The hot stamping films prepared in Examples 1 to 5 and Comparative Examples 1 to 5 were immersed in a 40±2° C. water bath for 12 hours, and then subjected to appearance evaluation and adhesion performance testing.

[0076] ⑤Color density:

[0077] The hot stamping film prepared in this embodiment is used to transfer a pattern onto a white sticker. After printing, an X-Rite i1PRO3 colorimeter is used to detect the color density of the pattern, and the color density is taken as an average of 256 points.

[0078] ⑥Fouling resistance test:

[0079] Fix the test sample on the test frame and expose it to the conditions that simulate the actual use environment and are easy to generate dirt. For example, put a mixture of some dust, oil and other common dirt in a closed container, control the temperature and humidity within a certain range (temperature is 25-35℃, relative humidity is 40%-60%), and make the test sample contact with the dirt for a certain period of time (such as 72 hours).

[0080] After the specified time, take out the test sample, use a mild detergent and soft cloth to gently wipe the sample surface to simulate the daily cleaning process, and observe and record the residual dirt on the sample surface. The dirt resistance performance grade standard is shown in Table 4:

[0081] Table 4

[0082]

[0083]

[0084] The above test was repeated three times, and the results are shown in Table 5:

[0085] Table 5

[0086]

[0087]

[0088] From Table 5, we can get:

[0089] The comprehensive performance of the hot stamping films of Examples 1 to 5 is better than that of the hot stamping films of Comparative Examples 1 to 4. The hot stamping films of Comparative Examples 1 to 3 cannot be transferred. The reason is that in the process of preparing the hot stamping film of Comparative Example 1, a release layer and an adhesive layer are missing; the hot stamping film of Comparative Example 2 lacks a protective layer and an adhesive layer; the hot stamping film of Comparative Document 3 lacks a protective layer and a release layer; it can be seen that the release layer, protective layer, and adhesive layer in the embodiments of the present invention can better improve the adhesion between the layers of the hot stamping film. The protective layer of the hot stamping film of Comparative Example 4 does not contain a drying agent and a curing agent, and has poor anti-cracking and water resistance.

[0090] In summary, when the hot stamping film provided by the present invention lacks any layer structure, the hot stamping film has a coating structure on the film that cannot be transferred to the substrate, or has poor performance in friction resistance, adhesion, alcohol resistance, crack resistance, and water resistance. In addition, it can be confirmed that when no curing agent or drying agent is used, the alcohol friction resistance performance is significantly deteriorated.

[0091] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A hot stamping film based on digital printing technology, characterized in that: The hot stamping film comprises a substrate, a release layer, a protective layer, and an adhesive layer arranged in sequence from bottom to top; The release layer comprises the following raw materials in parts by weight: 20 to 30 parts of thermoplastic polyurethane resin and 2 to 4 parts of micronized polyethylene wax; The protective layer comprises the following raw materials in parts by weight: 10-20 parts of silicone-modified acrylic resin, 5-9 parts of fluorine-modified silicone resin, 0.1-0.3 parts of drying agent, 0.5-1 parts of light stabilizer, 0.5-1 parts of light absorber and 1-3 parts of curing agent.

2. The hot stamping film based on digital printing technology according to claim 1, characterized in that: The substrate includes at least one of a BOPP film and a BOPET film.

3. The hot stamping film based on digital printing technology according to claim 1, characterized in that: The adhesive layer comprises the following raw materials in parts by weight: 13 to 15 parts of acrylate-modified chloroacetic acid resin and 5 to 8 parts of maleic anhydride-modified polypropylene.

4. The hot stamping film based on digital printing technology according to claim 1, characterized in that: The weight average molecular weight of the thermoplastic acrylic resin is 50,000 to 100,000.

5. The hot stamping film based on digital printing technology according to claim 1, characterized in that: The organosilicon-modified acrylic resin has an acid value of 3-8 mg / KOH, a hydroxyl content of 1-4%, a weight average molecular weight of 10,000-25,000, a glass transition temperature of 55-65° C., and a solid content of 50%-60%.

6. The hot stamping film based on digital printing technology according to claim 1, characterized in that: The fluorine-modified organic silicon resin has an acid value of 0.01-0.04 mg / KOH, a hydroxyl content of 0.1-0.4%, a weight average molecular weight of 10000-14000, a glass transition temperature of 75-85° C., and a solid content of 10%-15%.

7. The hot stamping film based on digital printing technology according to claim 1, characterized in that: The light stabilizer includes a hindered amine light stabilizer; the light absorber includes a hydroxyphenyl triazine ultraviolet absorber; the drying agent includes at least one of dibutyltin dilaurate and cobalt isooctanoate; and the curing agent is at least one of isophorone diisocyanate trimer and hexamethylene diisocyanate trimer.

8. The hot stamping film based on digital printing technology according to claim 1, characterized in that: The thickness of the substrate is 12-25 μm; the thickness of the release layer is 0.1-0.5 μm; the thickness of the protective layer is 3-8 μm; and the thickness of the adhesive layer is 1.5-3 μm.

9. A method for preparing a hot stamping film based on digital printing technology according to any one of claims 1 to 8, characterized in that: The preparation method comprises the following steps: S1: Prepare solution: Release liquid: Thermoplastic polyurethane and micronized polyethylene wax are mixed and dissolved to prepare release liquid for standby use; Protective liquid: Silicone-modified acrylic resin, fluorine-modified silicone resin, drier, light stabilizer, light absorber and curing agent are dissolved in solvent and mixed and dissolved to prepare protective liquid for standby use; Adhesive liquid: Acrylate-modified chlorovinyl resin and maleic anhydride-modified polypropylene are dissolved in solvent to prepare adhesive liquid for standby use; S2: Preparation of release layer: coating the release liquid on one side of the substrate layer, and then drying to form the release layer; Preparation of protective layer: coating the protective liquid on one side of the release layer away from the substrate layer, and then drying to form the protective layer; coating the adhesive liquid on one side of the protective layer away from the substrate layer, and then drying to form the adhesive layer; thereby obtaining a hot stamping film.

10. An application of a hot stamping film based on digital printing technology, characterized in that: The hot stamping film according to claims 1 to 8 is used for pattern transfer.

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