A semiconductor defect detection multi-station transfer system

Abstract

The present application relates to wafer detection technical field, specifically to a kind of semiconductor defect detection multi-station transfer system, the present application is equipped with wafer loading area, waiting area, detection area and unloading area four functional areas, and equipped with conveying device and grabbing component, advantage is remarkable;One, the first conveying device of loading area can automatically send the wafer box to be detected to waiting area, without manual intervention, save time, improve production efficiency;Second, detection area grabbing component can efficiently transfer wafer in waiting area and detection area, reduce waiting time, improve detection equipment utilization;Third, the second conveying device of unloading area timely removes the wafer box that has been detected, optimizes process flow.The division of each functional area makes wafer transfer orderly, so that the whole process is smooth.In short, the system is remarkable in improving production efficiency, optimizing process flow and the like.

Description

Technical Field

[0001] This invention relates to the field of wafer inspection technology, and more specifically to a multi-station transfer system for semiconductor defect detection. Background Technology

[0002] In the field of wafer inspection, current technologies primarily employ a single robotic arm at the inspection station for placing wafers before and after inspection. This approach has significant limitations. The sequential nature of the pick-up and placement process leads to considerable time consumption. For example, a new wafer can only be placed after the existing one at the inspection station has been removed. Furthermore, the layout between the inspection and waiting stations is inadequate, failing to fully utilize the inspection process time for wafer transfer. Especially in vacuum environments, the switching between atmospheric and vacuum environments at each station consumes substantial time, resulting in idle inspection stations and a relatively long time required to establish a vacuum environment, severely impacting inspection efficiency. To further improve inspection efficiency, existing technologies need to be improved, the layout of inspection and waiting stations optimized, and more efficient wafer transfer methods explored. Summary of the Invention

[0003] To address the shortcomings of the prior art, this invention proposes a multi-station transfer system for semiconductor defect detection.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0005] A semiconductor defect detection multi-station transfer system includes: a wafer loading area, a wafer waiting area, a wafer inspection area, and a wafer unloading area. The wafer loading area is equipped with a first conveying device for transporting wafer cassettes to be inspected from the wafer loading area to the wafer waiting area. The wafer inspection area is equipped with a gripping component for gripping wafers to be inspected from the wafer waiting area to the wafer inspection area and gripping inspected wafers from the wafer inspection area to the wafer waiting area. The wafer unloading area is equipped with a second conveying device for transferring inspected wafer cassettes from the wafer waiting area to the wafer unloading area. By defining four distinct functional areas—the wafer loading area, the wafer waiting area, the wafer inspection area, and the wafer unloading area—and equipping them with corresponding conveying devices and gripping components, the system offers several significant advantages. First, production efficiency is improved. The first conveying device in the wafer loading area can automatically and quickly deliver the wafer cassette to be inspected to the wafer waiting area, preparing it for inspection without manual intervention, saving time. Second, the gripping component in the wafer inspection area can efficiently transfer wafers between the wafer waiting area and the wafer inspection area, reducing waiting time and improving the utilization rate of the inspection equipment. The second conveying device in the wafer unloading area promptly removes the inspected wafer cassette, optimizing the process flow. The division of functional areas makes wafer transfer more orderly and the entire process smoother. In this embodiment, the inspection time of the last wafer can be utilized to... The second conveying device unloads the inspected wafer cassettes from the wafer waiting area to the wafer unloading area, and the first conveying device again transports the wafer cassettes to be inspected from the wafer loading area to the wafer waiting area. In this way, seamless connection is achieved between the wafer loading area, the wafer waiting area, and the wafer unloading area. The operation of each area is no longer isolated, but cooperates and works together, reducing the time wasted due to waiting and coordination between different links, thereby significantly improving inspection efficiency. In summary, the multi-station transfer system of this embodiment has significant beneficial effects in improving inspection efficiency and optimizing process flow.

[0006] Furthermore, the wafer loading area includes a wafer loading bin and a wafer feeding bin, with an openable and closable first sealed door connecting the two. The clearly defined wafer loading bin and wafer feeding bin make the management of the entire wafer loading area clearer and more convenient. The opening and closing times of the first sealed door can be adjusted to accommodate changes in production rhythm, improving the system's adaptability and flexibility.

[0007] Furthermore, the wafer feeding bin is equipped with a first vacuum pump and a first vacuum sensor. The first vacuum pump is used to evacuate the wafer feeding bin, and the first vacuum sensor is used to detect the vacuum level of the wafer feeding bin. By evacuating the wafer feeding bin, a more stable vacuum environment can be provided for the wafers, which helps to ensure wafer quality. In addition, some demanding testing operations are easier to perform in a vacuum environment. Maintaining the vacuum state of the wafer testing area can also reduce the probability of contact between the equipment in the wafer testing area and air and moisture, reducing the risk of equipment corrosion. For the wafer feeding bin and related transmission and processing equipment, this can extend their service life and reduce maintenance costs. Vacuuming during wafer testing can improve the overall wafer testing efficiency. The first vacuum sensor can work in conjunction with the control system. Based on the accurate detection value provided by the first vacuum sensor, the control system can precisely adjust parameters such as the pumping power of the first vacuum pump to achieve fine control of the vacuum level in the wafer feeding bin, ensuring that the vacuum environment of the wafer feeding bin always meets the stringent vacuum requirements of wafer testing.

[0008] Furthermore, the wafer loading bin is equipped with a third conveying device, which is used to transport the wafer cassette to be inspected from the wafer loading bin to the wafer feeding bin. Automated conveying can quickly and accurately transfer the wafer cassette to the next stage, reducing waiting time and operational delays, making the wafer inspection process smoother and more efficient.

[0009] Furthermore, the wafer waiting area includes a first wafer waiting area, and a second, closable, sealed door is provided between the first wafer waiting area and the wafer feeding bin. The presence of the second sealed door allows the two areas to be operated independently; during the last wafer inspection process, opening the second sealed door allows a new wafer cassette to be inspected to be quickly transferred to the first wafer waiting area. This independent operation improves the parallelism of the entire inspection process, reduces waiting time, and thus increases production efficiency.

[0010] Furthermore, the first conveying device is disposed in the wafer feeding bin, and the first conveying device is used to convey the wafer cassette to be inspected from the wafer feeding bin to the first wafer waiting area. This direct conveying method makes the transfer of wafers between the wafer feeding bin and the first wafer waiting area more efficient, thereby increasing the speed of the entire wafer inspection process.

[0011] Furthermore, the wafer waiting area also includes a second wafer waiting area, and a fourth conveying device is provided between the second wafer waiting area and the first wafer waiting area. The fourth conveying device is used to transport empty wafer cassettes from the first wafer waiting area to the second wafer waiting area. By setting up the second wafer waiting area and setting up the fourth conveying device between the two waiting areas, empty wafer cassettes can be transferred in a timely manner; in particular, by utilizing the inspection time of the last wafer for the transfer operation, time resources are fully utilized, which greatly improves production efficiency, allows for seamless connection between wafer loading and inspection processes, and reduces unnecessary waiting time.

[0012] Furthermore, the wafer unloading area includes a wafer receiving hopper, and an openable and closable third sealing door is provided between the wafer receiving hopper and the second wafer waiting area. The third sealing door effectively isolates the wafer receiving hopper from the second wafer waiting area; since the second wafer waiting area is interconnected with the wafer inspection area, the third sealing door further reduces the difficulty of maintaining the vacuum state in the wafer inspection area.

[0013] Furthermore, the second conveying device is installed in the wafer receiving hopper, and is used to transfer the inspected wafer cassettes from the second wafer waiting area to the wafer receiving hopper. Installing the second conveying device in the wafer receiving hopper allows for the rapid removal of the inspected wafer cassettes from the second wafer waiting area, preventing wafer cassette accumulation, ensuring a smooth wafer transfer process, and also helping to maintain a clean and orderly production area, facilitating subsequent operations and management.

[0014] Furthermore, the wafer unloading area also includes a wafer unloading bin, and a fourth, closable sealing door is provided between the wafer unloading bin and the wafer receiving bin. The clearly defined wafer unloading bin and wafer receiving bin make the management of the entire wafer unloading area clearer and more convenient. The opening and closing time of the fourth seal can be adjusted according to changes in production rhythm, improving the system's adaptability and flexibility.

[0015] Furthermore, a second vacuum pump and a second vacuum sensor are installed inside the wafer receiving hopper. The second vacuum pump is used to evacuate the wafer receiving hopper, and the second vacuum sensor is used to detect the vacuum level of the wafer receiving hopper. The second vacuum pump evacuates the wafer receiving hopper; maintaining the vacuum state of the wafer receiving hopper effectively prevents damage to the vacuum environment of the wafer waiting area and the wafer detection area after the third sealing door is opened, avoiding oxidation of the wafers being detected. Simultaneously, advanced extreme ultraviolet (EUV) CDI reflective stacking detection and other special detection methods require a vacuum environment because a vacuum environment ensures more stable propagation of EUV light. In a vacuum environment, the scattering and absorption of light by air are significantly reduced, thereby improving the accuracy of the detection. This high-precision detection method can reveal extremely fine defects on the wafer. Minor defects and irregularities provide crucial assurance for wafer quality control, enhancing the reliability of the entire wafer processing flow. Maintaining the vacuum state of the wafer receiving hopper also effectively prevents wafer contamination after the third sealing door is opened. The second vacuum sensor can work in conjunction with the control system, which, based on the accurate detection values ​​provided by the second vacuum sensor, precisely adjusts parameters such as the pumping power of the second vacuum pump to achieve fine control of the vacuum level in the wafer receiving hopper, ensuring that the vacuum environment of the wafer receiving hopper always meets the stringent requirements of wafer inspection.

[0016] Furthermore, the wafer unloading hopper is equipped with a fifth conveying device, which is used to unload inspected wafer cassettes from the wafer receiving hopper to the wafer unloading hopper. By incorporating the fifth conveying device into the wafer unloading hopper, the inspected wafer cassettes in the wafer receiving hopper can be transferred quickly and efficiently, improving unloading efficiency, preventing wafer cassette accumulation, ensuring the continuity of the wafer processing flow, and facilitating subsequent operations. This provides convenience for the entire wafer production process and enhances production reliability.

[0017] Furthermore, the gripping component includes a first robotic arm, which is used to grip the wafer to be inspected from the first wafer waiting area and transfer it to the wafer inspection area. By using the first robotic arm to grip the wafer to be inspected from the first wafer waiting area, wafer transfer efficiency is improved, ensuring a smooth inspection process.

[0018] Furthermore, the gripping component includes a second robotic arm, which is used to grip the inspected wafer from the wafer inspection area to the second wafer waiting area; a third vacuum pump and a third vacuum sensor are provided in the wafer waiting area, the third vacuum pump is used to evacuate the wafer waiting area, and the third vacuum sensor is used to detect the vacuum level of the wafer waiting area; a fourth vacuum pump and a fourth vacuum sensor are provided in the wafer inspection area, the fourth vacuum pump is used to evacuate the wafer inspection area, and the fourth vacuum sensor is used to detect the vacuum level of the wafer inspection area.The second robotic arm picks up the inspected wafers and places them in the second wafer waiting area, improving wafer transfer efficiency and ensuring the continuity of the production process. The third vacuum pump evacuates the wafer waiting area, creating a relatively clean environment. Outside air contains numerous tiny dust particles, suspended impurities, and potential chemical contaminants. In a vacuum environment, these contaminants are unlikely to enter the wafer waiting area, greatly reducing the possibility of wafer surface contamination. This ensures that the wafers maintain a good initial state during the next process in the waiting area. Many wafer materials are prone to oxidation when exposed to air; the vacuum operation prevents the wafers from oxidizing. The extremely low oxygen content in the waiting area effectively prevents wafer oxidation during the waiting period, ensuring the stability of the wafer's physical and chemical properties. This avoids adverse consequences such as changes in electrical properties and decreased surface flatness caused by oxidation, maintaining its high quality level to meet the requirements of high-precision manufacturing processes. The vacuum environment created by the fourth vacuum pump is crucial for wafer inspection. During the inspection process, many inspection devices (such as optical inspection instruments and electrical performance testing devices) require highly precise environmental conditions. The refractive index, humidity, and impurities in the external air can interfere with the detection signal. The vacuum environment can eliminate these interfering factors to the greatest extent, making the signal received by the inspection equipment from the wafer more accurate. The vacuum environment ensures purity and accuracy, thereby improving the reliability and precision of the test results and facilitating accurate assessment of wafer quality. In this vacuum environment, the equipment within the wafer inspection area (such as expensive high-precision testing instruments and complex circuit components) is exposed to significantly less moisture, dust, and corrosive substances. This reduces the probability of short circuits, component damage, lens contamination, and other malfunctions, extending the lifespan of the inspection equipment, saving maintenance and replacement costs, and ensuring long-term stable operation of the inspection work. The third and fourth vacuum sensors can work in conjunction with the control system, which, based on the accurate detection values ​​provided by the third and fourth vacuum sensors, precisely adjusts the... The pumping power and other parameters of the third and fourth vacuum pumps are configured to achieve precise control of the vacuum level in the wafer waiting area and the wafer inspection area, ensuring that the vacuum environment in these areas always meets the stringent requirements of wafer inspection. Many advanced wafer inspection processes have strict safety regulations regarding the vacuum level of the environment. The combined use of the fourth vacuum pump and the fourth vacuum sensor ensures that the vacuum environment in the wafer inspection area is always within these safety standards, preventing safety accidents such as equipment overload or wafer damage during inspection caused by uncontrolled vacuum levels, thus ensuring the safety of the inspection operation and the smooth progress of the entire inspection process.

[0019] Furthermore, a fifth, closable sealing door is provided between the wafer waiting area and the wafer inspection area. By setting the fifth sealing door, the originally unified space is divided into multiple sealed spaces, reducing the difficulty of maintaining a vacuum. The operation of each area does not interfere with each other. If a problem occurs in one area, the other area can continue, ensuring the continuity and stability of production.

[0020] The beneficial effects of the multi-station transfer system for semiconductor defect detection of the present invention are as follows:

[0021] This semiconductor defect detection multi-station transfer system offers several significant advantages by defining four distinct functional areas: a wafer loading area, a wafer waiting area, a wafer inspection area, and a wafer unloading area, and equipping them with corresponding conveying devices and gripping components. Firstly, it improves production efficiency. The first conveying device in the wafer loading area automatically and quickly delivers wafer cassettes to the wafer waiting area, preparing them for inspection without manual intervention, saving time. Secondly, the gripping components in the wafer inspection area efficiently transfer wafers between the waiting and inspection areas, reducing waiting time and increasing the utilization rate of the inspection equipment. The second conveying device in the wafer unloading area promptly removes inspected wafer cassettes, optimizing the process flow. The division of functional areas makes wafer transfer more orderly and the entire process smoother. In summary, this semiconductor defect detection multi-station transfer system has significant beneficial effects in improving production efficiency and optimizing the process flow. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the first type of semiconductor defect detection multi-station transfer system according to the present invention;

[0023] Figure 2 This is a schematic diagram of the overall structure of a second type of semiconductor defect detection multi-station transfer system according to the present invention;

[0024] Figure 3 This is a schematic diagram of the overall structure of a third type of semiconductor defect detection multi-station transfer system according to the present invention.

[0025] The components are as follows: 1. Wafer loading area; 11. Wafer loading bin; 12. Wafer feeding bin; 122. First vacuum pump; 123. First vacuum sensor; 13. First sealing door; 2. Wafer waiting area; 21. First wafer waiting area; 22. Second wafer waiting area; 23. Third vacuum pump; 24. Third vacuum sensor; 3. Wafer inspection area; 31. Fourth vacuum pump; 32. Fourth vacuum sensor; 4. Wafer unloading area; 41. Wafer receiving bin; 411. Second vacuum pump; 412. Second vacuum sensor; 42. Wafer unloading bin; 5. First conveying device; 6. Gripping assembly; 7. Second conveying device; 8. Third conveying device; 9. Fourth conveying device; 14. Second sealing door; 15. Third sealing door; 16. Fourth sealing door; 17. Fifth conveying device; 17. Fifth sealing door; 61. First robotic arm; 62. Second robotic arm. Detailed Implementation

[0026] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Example 1

[0028] like Figure 1-3 As shown, a semiconductor defect detection multi-station transfer system includes: a wafer loading area 1, a wafer waiting area 2, a wafer inspection area 3, and a wafer unloading area 4. The entire wafer inspection and transfer process is divided into different functional areas, making the tasks of each link clearer and facilitating management and operation. The wafer loading area 1 is equipped with a first conveying device 5, which is used to send the wafer cassette to be inspected from the wafer loading area 1 to the wafer waiting area 2. This realizes the automatic conveying of the wafer cassette to be inspected, improves the loading speed, and ensures that the wafers to be inspected can enter the wafer waiting area 2 in a timely manner, providing a stable material supply for subsequent inspection processes.

[0029] The wafer inspection area 3 is equipped with a gripping component 6, which is used to grip wafers to be inspected from the wafer waiting area 2 to the wafer inspection area 3 and to grip inspected wafers from the wafer inspection area 3 to the wafer waiting area 2. The component 6 can flexibly transfer wafers between the wafer waiting area 2 and the wafer inspection area 3 according to the inspection progress and requirements. This improves the utilization rate of the inspection equipment, reduces waiting time, and makes the entire inspection process more efficient.

[0030] The wafer unloading area 4 is equipped with a second conveying device 7, which moves the inspected wafer cassettes in the wafer waiting area 2 to the wafer unloading area 4. This achieves automatic removal of the inspected wafer cassettes, improves unloading speed and accuracy, ensures that inspected wafers can enter subsequent production processes in a timely manner, and maintains the continuity of the production process.

[0031] This embodiment can adjust the size, layout, and number of equipment in each area according to actual production needs; complete the transfer logic between each area according to actual production needs and factory planning; and bring many significant advantages by setting up four distinct functional areas: wafer loading area 1, wafer waiting area 2, wafer inspection area 3, and wafer unloading area 4, and equipping them with corresponding conveying devices and gripping components. Firstly, production efficiency is improved. The first conveying device 5 in the wafer loading area 1 can automatically and quickly deliver the wafer cassette to be inspected to the wafer waiting area 2, preparing it for inspection without manual intervention, saving time. Secondly, the gripping component 6 in the wafer inspection area 3 can efficiently transfer wafers between the wafer waiting area 2 and the wafer inspection area 3, reducing waiting time and improving the utilization rate of the inspection equipment. The second conveying device 7 in the wafer unloading area 4 promptly removes the inspected wafer cassette, optimizing the process flow. The division of functional areas makes wafer transfer more orderly and the entire process smoother. In this embodiment, the inspection time of the last wafer can be utilized to transfer the inspected wafer cassette (containing inspected wafers) in the wafer waiting area 2 to the second conveying device 7 via the second conveying device 7. In the wafer inspection process, qualified and unqualified wafers are staggered, so the wafers at the top of the empty slots in the inspected wafer cassette are qualified wafers, and the wafers at the bottom of the empty slots are unqualified wafers, which can be used for differentiation. The wafers are then fed into the wafer unloading area 4, and the wafer cassettes to be inspected in the wafer loading area 1 are transported to the wafer waiting area 2 via the first conveying device 5. This method achieves seamless connection between the wafer loading area 1, the wafer waiting area 2, and the wafer unloading area 3. The operations in each area are no longer isolated but cooperate and work together, reducing the time wasted due to waiting and coordination between different stages, thereby significantly improving inspection efficiency. In summary, the multi-station transfer system of this embodiment has significant beneficial effects in improving production efficiency and optimizing process flow.

[0032] The wafer loading area 1 includes a wafer loading bin 11 and a wafer feeding bin 12, and a first sealing door 13 that can be opened and closed is provided between the wafer loading bin 11 and the wafer feeding bin 12.

[0033] In this embodiment, the first sealing door 13 can effectively isolate the wafer loading bin 11 and the wafer feeding bin 12 from the environment, ensuring that the environments of the two bins are independent and do not interfere with each other to a great extent, and the wafer loading bin 11 is always in a normal pressure environment.

[0034] By clearly defining the wafer loading bin 11 and the wafer feeding bin 12, the management of the entire wafer loading area 1 becomes clearer and more convenient. The opening and closing time of the first sealing door 13 can be adjusted according to changes in the production rhythm, thereby improving the adaptability and flexibility of the system.

[0035] The wafer feeding bin 12 is equipped with a first vacuum pump 122 and a first vacuum sensor 123. The first vacuum pump 122 is used to evacuate the wafer feeding bin 12, and the first vacuum sensor 123 is used to detect the vacuum level of the wafer feeding bin 12. Vacuuming the wafer feed bin 12 creates a stable vacuum environment for the wafer, reducing contamination from airborne impurities and preventing oxidation, thus ensuring wafer quality and performance. Vacuuming also provides a more stable environment, further enhancing wafer quality. Furthermore, high-requirement testing operations are easier to perform in a vacuum environment. Maintaining the vacuum in the wafer testing area reduces the likelihood of contact between the equipment and air / moisture, lowering the risk of corrosion. This extends the lifespan of the wafer feed bin 12 and related transmission and processing equipment, reducing maintenance costs. The first vacuum sensor 123 works in conjunction with the control system. Based on the accurate readings from the first vacuum sensor 123, the control system precisely adjusts parameters such as the pumping power of the first vacuum pump 122, achieving fine-tuned control of the vacuum level within the wafer feed bin 12 and ensuring that the vacuum environment of the wafer feed bin 12 always meets the stringent requirements of wafer testing.

[0036] In this embodiment, the wafer feed hopper 12 needs to be kept in a vacuum state according to the wafer transfer route.

[0037] Before the wafer inspection work, the wafer loading bin 11 contains multiple sets of wafer boxes to be inspected (containing wafers to be inspected). When the wafer boxes to be inspected are transported from the wafer loading bin 11 to the wafer feeding bin 12 by the conveying device, the first sealing door 13 is closed. At this time, the wafer feeding bin 12 needs to be evacuated.

[0038] Since the wafer loading bin 11 and the wafer feeding bin 12 have different environments, when the first sealing door 13 is opened, it will disrupt the vacuum environment of the wafer feeding bin 12. Therefore, the wafer feeding bin 12 can be evacuated during the wafer detection time until the wafer feeding bin 12 reaches the same vacuum environment as the wafer waiting area 2 and the wafer detection area 3.

[0039] By evacuating the wafer feed hopper 12, a more stable vacuum environment can be provided for the wafer, which helps to ensure wafer quality. In addition, some demanding testing operations are easier to perform in a vacuum environment. Maintaining the vacuum state in the wafer testing area can also reduce the probability of the equipment in the wafer testing area coming into contact with air and moisture, reducing the risk of equipment corrosion. For the wafer feed hopper 12 and related transmission and processing equipment, this can extend their service life and reduce maintenance costs. Vacuuming during wafer testing can improve the overall wafer testing efficiency.

[0040] The wafer loading bin 11 is equipped with a third conveying device 8, which is used to send the wafer cassette to be inspected from the wafer loading bin 11 to the wafer feeding bin 12. The automatic conveying can quickly and accurately transfer the wafer cassette to be inspected to the next stage, reducing waiting time and operation delay, and making the wafer inspection process smoother and more efficient.

[0041] The wafer waiting area 2 includes a first wafer waiting area 21, and a second, closable, sealed door 14 is provided between the first wafer waiting area 21 and the wafer feeding bin 12.

[0042] In this embodiment, the presence of the second sealing door 14 allows the two areas to be operated independently. During the last wafer inspection process, opening the second sealing door 14 can quickly transfer a new wafer cassette to the first wafer waiting area 21. This independent operation can improve the parallelism of the entire inspection process, reduce waiting time, and thus improve production efficiency.

[0043] The first conveying device 5 is disposed in the wafer feeding bin 12, and the first conveying device 5 is used to convey the wafer cassette to be inspected from the wafer feeding bin 12 to the first wafer waiting area 21.

[0044] This direct transfer method makes the transfer of wafers between the wafer feed bin 12 and the first wafer waiting area 21 more efficient, thereby increasing the speed of the entire wafer inspection process.

[0045] The wafer waiting area 2 further includes a second wafer waiting area 22. A fourth conveying device 9 is provided between the second wafer waiting area 22 and the first wafer waiting area 21. The fourth conveying device 9 is used to transport empty wafer cassettes in the first wafer waiting area 21 to the second wafer waiting area 22.

[0046] In this embodiment, when the last wafer in a set of wafer cassettes is detected by the wafer detection area 3, the wafer cassette in the first wafer waiting area 21 is empty; while the wafer cassette in the second wafer waiting area 22 will have an empty wafer slot. Since qualified and unqualified wafers are placed in a staggered manner, the wafers above the empty slot are qualified wafers, and the wafers below the empty slot are unqualified wafers, which can be used for differentiation; after the inspected wafer cassette in the second wafer waiting area 22 is removed, the empty wafers in the first wafer waiting area 21 can be transported to the second wafer waiting area 22 by the fourth conveying device 9.

[0047] By setting up the second wafer waiting area 21 and the fourth conveying device 9 in the two waiting areas, empty wafer cassettes can be transferred in a timely manner; in particular, by utilizing the inspection time of the last wafer for the transfer operation, time resources are fully utilized, which greatly improves production efficiency, enables seamless connection between wafer loading and inspection, and reduces unnecessary waiting time.

[0048] The wafer unloading area 4 includes a wafer receiving bin 41, and a third sealing door 15 that can be opened and closed is provided between the wafer receiving bin 41 and the second wafer waiting area 22.

[0049] In this embodiment, a third sealing door 15 is provided between the wafer receiving hopper 41 and the second wafer waiting area 22, which can effectively isolate the wafer receiving hopper 41 from the second wafer waiting area 22. Since the second wafer waiting area 22 is interconnected with the wafer detection area 3, the third sealing door 15 further reduces the difficulty of maintaining the vacuum state of the wafer detection area 3. In a vacuum environment, some high-requirement detection operations are easier to achieve. For example, when detecting the electrical performance parameters of the wafer (such as resistivity, capacitance, etc.), the external electromagnetic field may induce current in the wafer or change its charge distribution, thereby affecting the accuracy of the electrical performance test. Maintaining the wafer in a stable vacuum environment during the detection process can eliminate the interference of external electric and magnetic fields. In a vacuum environment, this interference is minimized, enabling the electrical detection equipment to more accurately measure the true electrical characteristics of the wafer, etc.

[0050] The second conveying device is installed in the wafer receiving hopper. The second conveying device is used to transfer inspected wafer cassettes from the second wafer waiting area to the wafer receiving hopper. In this embodiment, the second conveying device 7 is installed in the wafer receiving hopper 41, which can quickly remove inspected wafer cassettes from the second wafer waiting area 22, avoiding wafer cassette accumulation, ensuring a smooth wafer transfer process, and also helping to maintain a clean and orderly production area, facilitating subsequent operations and management.

[0051] The wafer unloading area 4 also includes a wafer unloading bin 42, and a fourth sealing door 16 that can be opened and closed is provided between the wafer unloading bin 42 and the wafer receiving bin 41.

[0052] In this embodiment, the fourth sealing door 16 can effectively isolate the wafer unloading bin 42 and the wafer receiving bin 41 from the environment, ensuring that the environments of the two bins are independent and do not interfere with each other to a great extent. The wafer unloading bin 42 is always in a normal pressure environment.

[0053] By clearly defining the wafer unloading bin 42 and the wafer receiving bin 41, the management of the entire wafer unloading area 4 becomes clearer and more convenient. The opening and closing time of the fourth sealing door 16 can be adjusted according to changes in the production rhythm, thereby improving the system's adaptability and flexibility.

[0054] The wafer receiving bin 41 is equipped with a second vacuum pump 411 and a second vacuum sensor 412. The second vacuum pump 411 is used to evacuate the wafer receiving bin 41, and the second vacuum sensor 412 is used to detect the vacuum level of the wafer receiving bin 41.

[0055] In this embodiment, the second vacuum pump 411 can evacuate the wafer receiving bin 41; maintaining the vacuum state of the wafer receiving bin 41 can effectively prevent the vacuum environment of the wafer waiting area 2 and the wafer detection area 3 from being disrupted after the third sealing door 15 is opened, thus avoiding oxidation of the wafer being detected; at the same time, special detection methods such as advanced extreme ultraviolet CDI reflective stacking detection need to be carried out in a vacuum environment, because a vacuum environment can ensure more stable propagation of extreme ultraviolet light. In a vacuum environment, the scattering and absorption of light by air is greatly reduced, thereby improving the accuracy of detection. This high-precision detection method can reveal extremely high oxidative stresses on the wafer. Minor defects and irregularities provide crucial assurance for wafer quality control, enhancing the reliability of the entire wafer processing flow. Maintaining the vacuum state of the wafer receiving hopper 41 also effectively prevents wafer contamination after opening the third sealing door 15. The second vacuum sensor 412 can work in conjunction with the control system. Based on the accurate detection values ​​provided by the second vacuum sensor 412, the control system precisely adjusts parameters such as the pumping power of the second vacuum pump 411 to achieve fine control of the vacuum level within the wafer receiving hopper 41, ensuring that the vacuum environment of the wafer receiving hopper 41 always meets the stringent requirements of wafer inspection for a vacuum environment.

[0056] The wafer unloading bin 42 is equipped with a fifth conveying device 17, which is used to unload the inspected wafer cassettes from the wafer receiving bin 41 into the wafer unloading bin 42.

[0057] In this embodiment, the wafer unloading bin 42 is equipped with the fifth conveying device 17, which can quickly and efficiently transfer the inspected wafer cassettes in the wafer receiving bin 41, improving unloading efficiency, avoiding wafer cassette accumulation, ensuring the continuity of the wafer processing flow, and facilitating subsequent operations. This provides convenience for the entire wafer production process and enhances production reliability.

[0058] The gripping component 6 includes a first robotic arm 61, which is used to grip the wafer to be inspected from the first wafer waiting area 21.

[0059] In this embodiment, the first robotic arm 61 picks up the wafer to be inspected from the first wafer waiting area 21, which improves the wafer transfer efficiency and ensures the smooth progress of the inspection process.

[0060] The gripping component 6 includes a second robotic arm 62, which is used to grip the inspected wafer from the wafer inspection area 3 and transfer it to the second wafer waiting area 22;

[0061] The wafer waiting area 2 is equipped with a third vacuum pump 23 and a third vacuum sensor 24. The third vacuum pump 23 is used to evacuate the wafer waiting area 2, and the third vacuum sensor 24 is used to detect the vacuum level of the wafer waiting area 2.

[0062] The wafer inspection area 3 is equipped with a fourth vacuum pump 31 and a fourth vacuum sensor 32. The fourth vacuum pump 31 is used to evacuate the wafer inspection area 3, and the fourth vacuum sensor 32 is used to detect the vacuum level of the wafer inspection area 3.

[0063] In this embodiment, the second robotic arm 62 picks up the inspected wafer and places it in the second wafer waiting area 22, improving wafer transfer efficiency and ensuring the continuity of the production process. The third vacuum pump 23 evacuates the wafer waiting area 2, creating a relatively clean environment. Outside air contains numerous tiny dust particles, suspended impurities, and potential chemical contaminants. In a vacuum environment, these contaminants are unlikely to enter the wafer waiting area 2, greatly reducing the possibility of wafer surface contamination and ensuring that the wafer maintains a good initial state during the next process in the wafer waiting area 2. Many wafer materials are prone to oxidation when exposed to air, and the vacuum operation prevents oxidation. The extremely low oxygen content in the wafer waiting area 2 effectively prevents oxidation of the wafer during the waiting period, ensuring the stability of its physical and chemical properties and avoiding adverse consequences such as changes in electrical properties and decreased surface flatness caused by oxidation. This maintains its high quality level to meet the requirements of high-precision manufacturing processes. The vacuum environment created by the fourth vacuum pump 31 is crucial for wafer inspection. During the inspection process, many inspection devices (such as optical inspection instruments and electrical performance testing devices) require highly precise environmental conditions. The refractive index, humidity, and impurities in the outside air can interfere with the detection signal. The vacuum environment can eliminate these interfering factors to the greatest extent, making the signal received by the inspection equipment from the wafer purer. The accuracy of the detection results is improved, thus enhancing the reliability and precision of the test results and helping to accurately determine the quality status of the wafer. In a vacuum environment, the equipment (such as expensive high-precision testing instruments and complex circuit components) within the wafer detection area 3 is exposed to significantly less moisture, dust, and corrosive components, reducing the probability of short circuits, component damage, lens contamination, and other malfunctions. This extends the service life of the testing equipment, saves on maintenance and replacement costs, and ensures long-term stable operation of the testing process. The third vacuum sensor 24 and the fourth vacuum sensor 32 can work in conjunction with the control system. Based on the accurate detection values ​​provided by the third vacuum sensor 24 and the fourth vacuum sensor 32, the control system precisely adjusts the third... The pumping power and other parameters of vacuum pump 23 and the fourth vacuum pump 31 enable precise control of the vacuum level in the wafer waiting area 2 and the wafer inspection area 3, ensuring that the vacuum environment in the wafer waiting area 2 and the wafer inspection area 3 always meets the stringent requirements of wafer inspection. Many advanced wafer inspection processes have strict safety specifications for the vacuum level of the environment. The combined use of the fourth vacuum pump 31 and the fourth vacuum sensor 32 ensures that the vacuum environment in the wafer inspection area 3 is always within the range that meets these safety standards, avoiding safety accidents such as overload of inspection equipment and damage to wafers during inspection caused by vacuum level runaway, thus ensuring the safety of the inspection operation and the smooth progress of the entire inspection process.

[0064] In one embodiment, a fifth sealing door 18 that can be opened and closed is provided between the wafer waiting area 2 and the wafer detection area 3.

[0065] In this embodiment, when there are two wafer detection areas 3 and both wafer detection areas 3 rely on the same wafer loading area 1, wafer waiting area 2 and wafer unloading area 3 for loading and unloading wafers, the working states of the two wafer detection areas 3 may not be synchronized; when a problem occurs in one wafer detection area 3, the other wafer detection area 3 can continue to work without interfering with each other.

[0066] By setting the fifth sealing door 18, the originally integrated space is divided into multiple sealed spaces, reducing the difficulty of maintaining a vacuum. The work in each area does not interfere with each other. If one area has a problem, the other area can continue, ensuring the continuity and stability of production.

[0067] Before the entire wafer inspection system begins operation: Empty wafer cassettes are placed in the second wafer waiting area 22 to store inspected wafers during the inspection process; multiple sets of wafer cassettes (containing wafers to be inspected) are placed in the wafer loading bin 11, and the wafer cassettes are transported from the wafer loading bin 11 to the wafer feeding bin 12 and then to the first wafer waiting area 21 via the third conveying device 8. Simultaneously, the second set of wafer cassettes is transported from the wafer loading bin 11 to the wafer feeding bin 12; all sealed doors are closed, and vacuum is simultaneously achieved in the five areas: the wafer feeding bin 12, the wafer inspection area 3, the first wafer waiting area 21, the second wafer waiting area 22, and the wafer receiving bin 41. When the vacuum sensor detects that the vacuum level meets the requirements, the inspection operation can be started, at which point the vacuum level in the five areas is consistent.

[0068] The wafer inspection process includes: the first robotic arm 61 picks up the wafer to be inspected from the wafer cassette in the first wafer waiting area 21 and places it on the wafer inspection area 3; after a certain period of time, the first wafer is inspected, and then the second robotic arm 62 places the inspected wafer into the empty wafer cassette in the second wafer waiting area 22 (the qualified wafers are placed from top to bottom, and the unqualified wafers are arranged from bottom to top). At the same time, the first robotic arm 61 simultaneously picks up a new wafer to be inspected from the first wafer waiting area 21 and places it in the wafer inspection area 3, and so on, to complete the inspection of the entire cassette of wafers in the first wafer waiting area 21.

[0069] During the final wafer inspection, the sealed doors between the second wafer waiting area 22 and the wafer receiving bin 41, and between the wafer loading bin 11 and the first wafer waiting area 21 are simultaneously opened. The inspected wafer cassettes in the second wafer waiting area 22 are transported to the wafer receiving bin 41 via the second conveying device 7. Simultaneously, empty wafer cassettes in the first wafer waiting area 21 are transported to the second wafer waiting area 22 to wait, and simultaneously, the second set of wafer cassettes to be inspected in the wafer loading bin 12 is transported to the first wafer waiting area 21. The first wafer waiting area 21 is used to place wafer cassettes to be inspected, and the second wafer waiting area 22 is used to place empty wafer cassettes, thus restoring the initial inspection state. Then, the sealing doors between the second wafer waiting area 22 and the wafer receiving bin 41, and between the first wafer waiting area 21 and the wafer feeding bin 12 are closed. The wafer cassette transfer between the wafer feeding bin 12, the first wafer waiting area 21, the second wafer waiting area 22, and the wafer receiving bin 41 is completed in sequence. The transfer work can be carried out simultaneously to minimize time and ensure cyclical operation.

[0070] The entire wafer transport process can be summarized in chronological order as follows: the wafers in the wafer loading bin 11 are transported to the wafer feeding bin 12 via the third conveying device 8 to wait; the first sealing door 13 is closed, and the vacuum extraction of the wafer feeding bin 12 is completed; the second sealing door 14 is opened, and the wafers in the wafer feeding bin 12 are transported to the first wafer waiting area 21 via the conveying device to wait; the wafers to be inspected in the first wafer waiting area 21 are placed in the wafer inspection area 3 by the first robotic arm 61; the inspected wafers are placed in the second wafer waiting area 22 by the second robotic arm 62; the inspected wafers in the second wafer waiting area 22 are transported to the second conveying device 7 via the conveying device; the inspected wafers in the wafer receiving bin 41 are transported to the wafer unloading bin 42 via the fifth conveying device 17.

[0071] The entire wafer cassette conveying process is as follows: from the wafer loading bin 11 to the wafer feeding bin 12, from the wafer feeding bin 12 to the first wafer waiting area 21, from the first wafer waiting area 21 to the second wafer waiting area 22, from the second wafer waiting area 22 to the wafer receiving bin 41, and from the wafer receiving bin 41 to the wafer unloading bin 42.

[0072] After the semiconductor defect detection multi-station transfer system achieves initial vacuum in the five workstation areas of wafer feeding bin 12, wafer receiving bin 41, first wafer waiting area 21, second wafer waiting area 22, and first wafer waiting area 21, it only needs to perform atmospheric pressure-vacuum cyclic switching between the two separate small chambers of wafer feeding bin 12 and wafer receiving bin 41 during the wafer cassette replenishment process. The small space of the two small chambers results in a short vacuum time, and it is completed during the detection time without waiting, which greatly saves the vacuuming time, ensures the stability and controllability of the vacuum degree, and avoids excessive opening and closing of the chamber doors from affecting the detection process.

[0073] The present invention and its embodiments have been described above. This description is not restrictive. The accompanying drawings are only one embodiment of the present invention. The actual content is not limited thereto. In short, if a person skilled in the art is inspired by this description and designs a similar structure and embodiment without departing from the spirit of the present invention, such design should fall within the protection scope of the present invention.

Claims

1. A multi-station transfer system for semiconductor defect detection, characterized in that, include: The wafer loading area (1), wafer waiting area (2), wafer inspection area (3) and wafer unloading area (4) are provided. The wafer loading area (1) is equipped with a first conveying device (5), which is used to send the wafer cassette to be inspected from the wafer loading area (1) to the wafer waiting area (2). The wafer inspection area (3) is provided with a gripping component (6), which is used to grip the wafer to be inspected from the wafer waiting area (2) to the wafer inspection area (3) and to grip the inspected wafer in the wafer inspection area (3) to the wafer waiting area (2). The wafer unloading area (4) is provided with a second conveying device (7), which moves the inspected wafer cassette in the wafer waiting area (2) to the wafer unloading area (4). The wafer loading area (1) includes a wafer loading bin (11) and a wafer feeding bin (12), and a first sealing door (13) that can be opened and closed is provided between the wafer loading bin (11) and the wafer feeding bin (12). The wafer waiting area (2) includes a first wafer waiting area (21), and a second sealing door (14) that can be opened and closed is provided between the first wafer waiting area (21) and the wafer feeding bin (12). The wafer waiting area (2) further includes a second wafer waiting area (22), and a fourth conveying device (9) is provided between the second wafer waiting area (22) and the first wafer waiting area (21). The fourth conveying device (9) is used to transport the empty wafer cassette in the first wafer waiting area (21) to the second wafer waiting area (22).

2. The semiconductor defect detection multi-station transfer system as described in claim 1, characterized in that, include: The wafer feeding bin (12) is equipped with a first vacuum pump (122) and a first vacuum sensor (123). The first vacuum pump (122) is used to evacuate the wafer feeding bin (12), and the first vacuum sensor (123) is used to detect the vacuum level of the wafer feeding bin (12).

3. The semiconductor defect detection multi-station transfer system as described in claim 1, characterized in that, include: The wafer loading bin (11) is equipped with a third conveying device (8), which is used to send the wafer cassette to be inspected from the wafer loading bin (11) to the wafer feeding bin (12).

4. The semiconductor defect detection multi-station transfer system as described in claim 1, characterized in that, include: The first conveying device (5) is installed in the wafer feeding bin (12) and is used to convey the wafer cassette to be inspected from the wafer feeding bin (12) to the first wafer waiting area (21).

5. The semiconductor defect detection multi-station transfer system as described in claim 1, characterized in that, include: The wafer unloading area (4) includes a wafer receiving bin (41), and a third sealing door (15) that can be opened and closed is provided between the wafer receiving bin (41) and the second wafer waiting area (22).

6. The semiconductor defect detection multi-station transfer system as described in claim 5, characterized in that, include: The second conveying device (7) is installed in the wafer receiving bin (41). The second conveying device (7) is used to transfer the inspected wafer cassettes in the second wafer waiting area (22) to the wafer receiving bin (41).

7. The semiconductor defect detection multi-station transfer system as described in claim 5, characterized in that, include: The wafer unloading area (4) also includes a wafer unloading bin (42), and a fourth sealing door (16) that can be opened and closed is provided between the wafer unloading bin (42) and the wafer receiving bin (41).

8. The semiconductor defect detection multi-station transfer system as described in claim 5, characterized in that, include: The wafer receiving bin (41) is equipped with a second vacuum pump (411) and a second vacuum sensor (412). The second vacuum pump (411) is used to evacuate the wafer receiving bin (41), and the second vacuum sensor (412) is used to detect the vacuum level of the wafer receiving bin (41).

9. The semiconductor defect detection multi-station transfer system as described in claim 7, characterized in that, include: The wafer unloading bin (42) is equipped with a fifth conveying device (17), which is used to unload the inspected wafer cassette from the wafer receiving bin (41) to the wafer unloading bin (42).

10. The semiconductor defect detection multi-station transfer system as described in claim 1, characterized in that, include: The gripping component (6) includes a first robotic arm (61) for gripping a wafer to be inspected from the first wafer waiting area (21) to the wafer inspection area (3).

11. The semiconductor defect detection multi-station transfer system as described in claim 1, characterized in that, include: The gripping component (6) includes a second robotic arm (62) for gripping inspected wafers from the wafer inspection area (3) to the second wafer waiting area (22). The wafer waiting area (2) is equipped with a third vacuum pump (23) and a third vacuum sensor (24). The third vacuum pump (23) is used to evacuate the wafer waiting area (2), and the third vacuum sensor (24) is used to detect the vacuum level of the wafer waiting area (2). The wafer inspection area (3) is equipped with a fourth vacuum pump (31) and a fourth vacuum sensor (32). The fourth vacuum pump (31) is used to evacuate the wafer inspection area (3), and the fourth vacuum sensor (32) is used to detect the vacuum level of the wafer inspection area (3).

12. The semiconductor defect detection multi-station transfer system as described in claim 1, characterized in that, include: A fifth sealing door (18) that can be opened and closed is provided between the wafer waiting area (2) and the wafer detection area (3).

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