Chip pitch transfer device and chip tester

Abstract

The present invention discloses a chip variable pitch transfer device and a chip tester. The chip variable pitch transfer device includes: a frame and a variable pitch mechanism. The variable pitch mechanism is configured to adjust the pitch between chips; the variable pitch mechanism includes: a first rotating cylinder, a sliding table and a driving rack. A first spiral limiting groove is provided on the outer peripheral surface of the first rotating cylinder, and a driving gear is provided at one end thereof. A plurality of buffer grooves are provided on the sliding table, and chips are placed in the buffer grooves on the variable pitch mechanism. The driving gear meshes with the driving rack. When the first rotating cylinder rotates, on the basis of the driving gear meshing with the driving rack, it moves along the extension direction of the driving rack; at the same time, the buffer grooves can adjust the pitch between the buffer grooves under the drive of the first spiral limiting groove, and further adjust the pitch of the chips so as to meet the test pitch of the test device, achieving the purpose of facilitating the test device to test the chips.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and particularly relates to a chip variable pitch transfer device and a chip tester. Background Art

[0002] In the production process of chips, rectangular trays are mostly used to hold chips. There are several hollow grooves on the tray, and each groove can store one chip.

[0003] In the subsequent chip testing process, it is necessary to take out the chips in the tray and load them into the detection device for testing. In order to be able to test multiple chips simultaneously, the grasping device can be provided with multiple grasping members, so that the chips to be tested can be grasped from multiple grooves of the tray and transported to the testing device for chip testing.

[0004] However, the test pitch of the testing device is different from the pitch between the grooves in the tray, resulting in the testing device being unable to test multiple chips to be tested simultaneously, which leads to low testing efficiency and is not conducive to chip production. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present invention provides a chip variable pitch transfer device, which can adjust the pitch between the chips in the tray to a pitch suitable for testing by the testing device, facilitating the testing of the chips by the testing device.

[0006] The present invention also provides a chip tester having the above chip variable pitch transfer device.

[0007] According to an embodiment of the present invention, the chip variable pitch transfer device includes:

[0008] A frame, the frame is provided with a sliding seat, the sliding seat is configured to be slidable close to the testing device, one side of the sliding seat has a tray placement area for placing a tray for storing chips; and

[0009] A variable pitch mechanism, the variable pitch mechanism is arranged on the sliding seat, the variable pitch mechanism is located on one side of the tray placement area, and the variable pitch mechanism is configured to adjust the pitch between the chips;

[0010] The variable pitch mechanism includes:

[0011] A first rotating cylinder, the first rotating cylinder is rotatably arranged on the sliding seat, a plurality of first spiral limiting grooves are arranged on the outer peripheral surface of the first rotating cylinder, and a driving gear is arranged at one end of the first rotating cylinder;

[0012] A sliding table is provided on one side of the first rotating cylinder. The length direction of the sliding table is parallel to the axis direction of the first rotating cylinder. A plurality of buffer slots are provided on the sliding table. The buffer slots are configured to slide on the sliding table along the length direction of the sliding table. The buffer slots are used to place the chips. The sliding table is connected to the first rotating cylinder through a first connecting and limiting member, and the first connecting and limiting member is arranged in the first spiral limiting slot; and

[0013] A driving rack is provided on the frame. The length direction of the driving rack extends horizontally perpendicular to the axis direction of the first rotating cylinder. One end of the driving rack is close to the testing device. The initial position of the driving gear meshes with the other end of the driving rack. The driving gear is configured to translate along the length direction of the driving rack.

[0014] The chip variable pitch conveying device according to the embodiment of the present invention has at least the following beneficial effects: The chips are placed in the buffer slots on the variable pitch mechanism. When the first rotating cylinder rotates, the buffer slots can slide along the length direction of the sliding table under the drive of the first spiral limiting slot. Under the guidance of the first spiral limiting slot, the distance between the buffer slots can be adjusted, and then the distance between the chips can be adjusted to meet the testing distance of the testing device, achieving the purpose of facilitating the testing device to test the chips.

[0015] According to some embodiments of the present invention, a plurality of levels of driving gears are provided at the other end of the first rotating cylinder. The plurality of levels of driving gears are arranged at intervals. A plurality of driving racks are provided. The plurality of driving racks are arranged at intervals. The plurality of levels of driving gears and the plurality of driving racks are arranged in one-to-one correspondence. The plurality of driving racks are configured to be able to slide along the axis direction of the first rotating cylinder so that the driving racks can respectively mesh with the corresponding driving gears.

[0016] According to some embodiments of the present invention, the radii of the plurality of levels of driving gears gradually decrease in the direction away from the first rotating cylinder, and the heights of the plurality of driving racks gradually increase in the direction away from the first rotating cylinder.

[0017] According to some embodiments of the present invention, a grasping mechanism is further included. The grasping mechanism is provided on the frame. The grasping mechanism is slidably arranged between the variable pitch mechanism and the tray placement area. The grasping mechanism is configured to grasp the chips from the tray into the buffer slots.

[0018] According to some embodiments of the present invention, the grasping mechanism includes a fixing plate, a first pitch-changing component is arranged on the fixing plate, a plurality of suction components are arranged on the first pitch-changing component, the first pitch-changing component is configured to adjust the distance between the suction components, and the suction components are used for sucking the chips.

[0019] According to some embodiments of the present invention, the first pitch-changing component includes:

[0020] A sliding plate, the sliding plate is slidably arranged on the fixing plate, and the sliding plate is configured to slide up and down in the vertical direction;

[0021] A plurality of guiding hanging rings, the guiding hanging rings are provided with a plurality of guiding hanging rings, both ends of the guiding hanging rings are arranged on the sliding plate, and each of the plurality of guiding hanging rings has a guiding groove; and

[0022] A mounting plate, the mounting plate is mounted on the guiding hanging ring through a second connecting and limiting member, the mounting plate is slidably arranged on one side of the fixing plate in the horizontal direction, and the suction component is arranged at the lower end of the mounting plate.

[0023] According to some embodiments of the present invention, the grasping mechanism further includes two groups of second pitch-changing components, the second pitch-changing components are arranged on the fixing plate, the second pitch-changing components are respectively connected to both ends of the guiding hanging ring, the guiding hanging ring can expand and contract along the length direction of the guiding hanging ring, and the second pitch-changing component is configured to adjust the distance between both ends of the guiding hanging ring.

[0024] According to some embodiments of the present invention, both groups of the second pitch-changing components include second rotating cylinders, the second rotating cylinders are rotatably arranged on the fixing plate, the two second rotating cylinders are respectively located on one side of both ends of the guiding hanging ring, a plurality of second spiral limiting grooves are arranged on the outer peripheral surface of the second rotating cylinder, both ends of the guiding hanging ring are respectively connected to the second rotating cylinder through a third connecting and limiting member, and the third connecting and limiting member is located in the second spiral limiting groove.

[0025] According to some embodiments of the present invention, the guiding hanging ring includes a first half ring and a second half ring, the connection end between the first half ring and the second half ring is connected through an elastic member, and the outer ends of the first half ring and the second half ring are respectively connected to the second pitch-changing component.

[0026] According to the chip testing machine of the second aspect embodiment of the present invention, the chip testing machine includes the chip pitch-changing and conveying device described in any one of the above first aspect embodiments, the chip testing machine further includes the testing device, the testing device includes a manipulator, the manipulator is used for grasping the chips in the chip pitch-changing and conveying device, and the testing device is configured to test the chips.

[0027] The chip testing machine according to the embodiments of the present invention has at least the following beneficial effects: Through the chip variable pitch conveying device, the distance between the buffer slots can be adjusted, and then the distance between the chips can be adjusted, so that the distance between the chips on the tray is adjusted to meet the test pitch of the test device, thereby facilitating the grasping of the test device and achieving the purpose of facilitating the test device to test the chips.

[0028] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention will be further described below in conjunction with the drawings and embodiments, where:

[0030] Figure 1 is a schematic structural diagram of the chip variable pitch conveying device according to the embodiment of the present invention;

[0031] Figure 2 is Figure 1 a schematic structural diagram of the variable pitch mechanism of the chip variable pitch conveying device shown;

[0032] Figure 3 is Figure 1 a schematic structural diagram of the grasping mechanism of the chip variable pitch conveying device shown;

[0033] Figure 4 is Figure 3 a partial structural diagram of the grasping mechanism shown (the mounting plate is omitted);

[0034] Figure 5 is Figure 4 a schematic structural diagram of the guiding hanging ring of the grasping mechanism shown.

[0035] Reference numerals in the drawings:

[0036] Frame 10; Slide 11; Tray placement area 12;

[0037] Variable pitch mechanism 20; First rotating cylinder 21; First spiral limiting groove 211; Driving gear 212; Slide table 22; Buffer slot 221; Driving rack 23;

[0038] Grasping mechanism 30; Fixed plate 31; First variable pitch component 32; Slide plate 321; Guiding hanging ring 322; Guiding groove 3221; First half ring 3222; Second half ring 3223; Mounting plate 323; Second variable pitch component 33; Second rotating cylinder 331; Second spiral limiting groove 3311. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0039] In the description of the present invention, it should be understood that regarding the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0040] In the description of the present invention, if the first and second are described only for the purpose of distinguishing technical features, it should not be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features or implicitly specifying the sequence relationship of the indicated technical features.

[0041] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0042] Referring to Figures 1 to 4

[0043] According to the chip pitch-changing transfer device of an embodiment of the present invention, the chip pitch-changing transfer device includes a frame 10 and a pitch-changing mechanism 20. The frame 10 is provided with a sliding seat 11, and the sliding seat 11 is configured to be slidably close to a testing device (not shown in the figure). One side of the sliding seat 11 has a tray placement area 12, and the tray placement area 12 is used for placing a tray for storing chips; the pitch-changing mechanism 20 is arranged on the sliding seat 11, the pitch-changing mechanism 20 is located on one side of the tray placement area 12, and the pitch-changing mechanism 20 is configured to adjust the pitch between chips. The pitch-changing mechanism 20 includes: a first rotating cylinder 21, a sliding table 22, and a driving rack 23. The first rotating cylinder 21 is rotatably arranged on the sliding seat 11, a plurality of first spiral limiting grooves 211 are arranged on the outer peripheral surface of the first rotating cylinder 21, a driving gear 212 is arranged at one end of the first rotating cylinder 21, the sliding table 22 is arranged on one side of the first rotating cylinder 21, the length direction of the sliding table 22 is parallel to the axis direction of the first rotating cylinder 21, a plurality of buffer grooves 221 are arranged on the sliding table 22, the buffer grooves 221 are configured to slide on the sliding table 22 along the length direction of the sliding table 22, the buffer grooves 221 are used for placing chips, the sliding table 22 is connected to the first rotating cylinder 21 through a first connecting limiting member (not shown in the figure), and the first connecting limiting member is arranged in the first spiral limiting groove 211; the driving rack 23 is arranged on the frame 10, the length direction of the driving rack 23 extends horizontally perpendicular to the axis direction of the first rotating cylinder 21, one end of the driving rack 23 is close to the testing device, and the initial position of the driving gear 212 meshes with the other end of the driving rack 23, and the driving gear 212 is configured to translate along the length direction of the driving rack 23.The chip variable pitch transfer device of the present invention integrates a frame 10, a slide 11 and a variable pitch mechanism 20, realizing the efficient and precise transfer of chips from a tray (not shown in the figure) to a testing device, and solving the problem of the mismatch between the test pitch of the testing device and the groove pitch in the tray. The variable pitch mechanism 20 realizes the flexible adjustment of the chip pitch by the cooperation of the first spiral limiting groove 211 on the first rotating cylinder 21, the buffer groove 221 on the slide 22 and the first connecting limiting member. When the driving rack 23 drives the driving gear 212 to translate, the first rotating cylinder 21 rotates, and then drives the buffer groove 221 to slide along the length direction of the slide 22 through the first spiral limiting groove 211, thereby adjusting the pitch between the chips. This design not only improves the efficiency of chip testing, but also enhances the versatility of the testing device, enabling it to adapt to the testing requirements of chips with different specifications and pitches, greatly improving the flexibility and production efficiency of the chip production line.

[0044] Specifically, the chip pitch adjustment transfer device of this embodiment includes a frame 10 and a sliding seat 11 disposed on the frame 10. The frame 10 serves as the support structure of the entire device and has sufficient rigidity and stability. The sliding seat 11 is configured to slide along the frame 10 and approach the testing device. A tray placement area 12 is provided on one side of it for placing trays containing chips. On the sliding seat 11, on one side of the tray placement area 12, a pitch adjustment mechanism 20 is provided. The pitch adjustment mechanism 20 is the core component of the present invention and is used to adjust the pitch between chips. The pitch adjustment mechanism 20 specifically includes a first rotating cylinder 21, a sliding table 22, and a driving rack 23. The first rotating cylinder 21 is rotatably disposed on the sliding seat 11, and a plurality of first spiral limiting grooves 211 are provided on its outer peripheral surface. These first spiral limiting grooves 211 are spirally distributed and are used to provide the trajectory for the sliding of the buffer grooves 221. One end of the first rotating cylinder 21 is provided with a driving gear 212 for meshing and driving with the driving rack 23. The sliding table 22 is disposed on one side of the first rotating cylinder 21, and its length direction is parallel to the axis direction of the first rotating cylinder 21. A plurality of buffer grooves 221 are provided on the sliding table 22, and these buffer grooves 221 are configured to slide on the sliding table 22 along the length direction of the sliding table 22. The buffer grooves 221 are used to place the chips taken out from the trays. The sliding table 22 is connected to the first rotating cylinder 21 through a first connection limiting member, and the first connection limiting member is disposed in the first spiral limiting groove 211. When the first rotating cylinder 21 rotates, the first connection limiting member slides in the first spiral limiting groove 211, driving the buffer grooves 221 on the sliding table 22 to slide along the length direction of the sliding table 22, thereby realizing the adjustment of the chip pitch. The driving rack 23 is disposed on the frame 10, and its length direction extends horizontally along a direction perpendicular to the axis direction of the first rotating cylinder 21. One end of the driving rack 23 is close to the testing device and is used to drive the driving gear 212 to translate. The initial position of the driving gear 212 meshes with the other end of the driving rack 23. When the first rotating cylinder 21 rotates, the driving gear 212 at one end of the first rotating cylinder 21 can rotate, and the driving gear 212 translates along the length direction of the driving rack 23, driving the sliding of the sliding table 22, and further realizing the adjustment of the chip pitch while also driving the chips to approach the testing device, so as to facilitate the testing device to test the chips.

[0045] During actual use, the operator first places the tray containing the chips on the tray placement area 12. Then, by driving the first rotating cylinder 21 to rotate, the driving gear 212 is rotated, and then the driving gear 212 is driven by the driving rack 23 to translate along the length direction of the driving rack 23, ultimately achieving the purpose of bringing the chips closer to the testing device. At the same time, the rotation of the first rotating cylinder 21 drives the buffer slot 221 on the sliding table 22 to slide along the length direction of the sliding table 22 through the cooperation of the first spiral limiting groove 211 and the first connecting limiting member. When the buffer slot 221 slides to an appropriate position, the spacing between the chips is adjusted to match the testing spacing of the testing device. At this time, the operator or automated equipment can take out the chips in the buffer slot 221 and load them into the testing device for testing.

[0046] Therefore, it can be understood that the chip pitch-changing transfer device according to the embodiments of the present invention has at least the following beneficial effects: By placing the chips in the buffer slot 221 on the pitch-changing mechanism 20, when the first rotating cylinder 21 rotates, the buffer slot 221 can slide along the length direction of the sliding table 22 under the drive of the first spiral limiting groove 211, and under the guidance of the first spiral limiting groove 211, the spacing between the buffer slots 221 can be adjusted, and then the spacing between the chips can be adjusted to meet the testing spacing of the testing device, achieving the purpose of facilitating the testing of the chips by the testing device.

[0047] Refer to Figure 2 , in some embodiments of the present invention, multiple-stage driving gears 212 are provided at the other end of the first rotating cylinder 21, the multiple-stage driving gears 212 are arranged at intervals, multiple driving racks 23 are provided, the multiple driving racks 23 are arranged at intervals, the multiple-stage driving gears 212 and the multiple driving racks 23 are arranged in one-to-one correspondence, and the multiple driving racks 23 are configured to be able to slide along the axial direction of the first rotating cylinder 21 so that the driving racks 23 can be respectively engaged with the corresponding driving gears 212.

[0048] Specifically, in the chip variable pitch transfer device of the present invention, since there are thousands of chip specifications and the sizes of different chips are inconsistent, the required effects of pitch adjustment are also different. For example, for some chips with larger sizes, the requirement for pitch adjustment is smaller, while for some chips with smaller sizes, the requirement for pitch adjustment is larger. Therefore, in order to further improve the flexibility and adaptability of the variable pitch mechanism 20, the other end of the first rotating cylinder 21 is designed with multiple-stage driving gears 212. These driving gears 212 are arranged at intervals to ensure that they can each independently mesh and drive with the driving rack 23. Correspondingly, multiple driving racks 23 are also provided, and the multiple driving racks 23 are also arranged at intervals. The multiple-stage driving gears 212 and the multiple driving racks 23 are arranged in one-to-one correspondence to form multiple independent transmission units. These driving racks 23 are configured to be able to slide along the axis direction of the first rotating cylinder 21. Specifically, corresponding slide rails or guiding structures (not shown in the figure) may be provided on the frame 10, so that the driving rack 23 can perform precise sliding movement along the axis direction of the first rotating cylinder 21 under the guidance of these slide rails or guiding structures. Through such a design, the driving rack 23 can selectively mesh with the corresponding driving gear 212 according to actual needs.

[0049] When it is necessary to adjust the chip pitch, the operator or the control system can control the corresponding driving rack 23 to slide along the axis direction of the first rotating cylinder 21 to make it mesh with the corresponding driving gear 212. Then, through the movement of the driving rack 23, the driving gear 212 is driven to rotate, and further the first rotating cylinder 21 rotates. The rotation of the first rotating cylinder 21 drives the buffer slot 221 on the sliding table 22 to slide along the length direction of the sliding table 22 through the cooperation of the first spiral limiting slot 211 and the first connecting limiting member, so as to achieve precise adjustment of the chip pitch. The design of the multiple-stage driving gears 212 and the multiple driving racks 23 not only improves the transmission efficiency and stability of the variable pitch mechanism 20, but also enhances its adaptability and flexibility. By selectively meshing different driving gears 212 and driving racks 23, it is possible to easily adjust the chip pitch of different specifications and meet the diverse requirements in the chip testing process.

[0050] Referring to Figure 2 , further, in some embodiments of the present invention, the radius of the multiple-stage driving gears 212 gradually decreases in the direction away from the first rotating cylinder 21, and the height of the multiple driving racks 23 gradually increases in the direction away from the first rotating cylinder 21.

[0051] In the chip variable pitch conveying device of the present invention, in order to further optimize the transmission efficiency and adapt to the chip pitch adjustment in different ranges, the multi-stage drive gear 212 is designed with a structure whose radius gradually decreases. Specifically, starting from one end of the first rotating cylinder 21 and along the direction away from the first rotating cylinder 21, the radius of each stage of the drive gear 212 is smaller than that of the previous stage. Such a design enables the first rotating cylinder 21 to generate different rotation angles under the same horizontal displacement by different stages of the drive gear 212, thereby realizing the adjustment of different pitches for different chips. At the same time, the heights of the multiple drive racks 23 also increase one by one along the direction away from the first rotating cylinder 21. This is to match the radius change of the multi-stage drive gear 212 to ensure that each stage of the drive gear 212 can be well meshed with the drive rack 23 of the corresponding height. When the chip pitch needs to be adjusted, the drive rack 23 and the drive gear 212 that match the required adjustment range can be selected for meshing transmission.

[0052] In actual operation, the operator or the control system can, according to the adjustment requirements of the chip pitch, control the corresponding drive rack 23 to slide along the axis direction of the first rotating cylinder 21 to make it meshed with the drive gear 212 with a suitable radius. Then, through the movement of the drive rack 23, the drive gear 212 is driven to rotate, and further the first rotating cylinder 21 rotates. Since the radius of the drive gear 212 and the height of the drive rack 23 both change gradually, different combinations of the drive gear 212 and the drive rack 23 can be selected to realize the adjustment of different pitches for different specifications of chips. The design of the multi-stage drive gear 212 with a gradually decreasing radius and the multiple drive racks 23 with a gradually increasing height not only improves the transmission flexibility and adaptability of the chip variable pitch conveying device, but also enables the device to more precisely meet the diverse pitch adjustment requirements in the chip testing process.

[0053] Refer to Figure 1 and Figures 3 to 5 , in some embodiments of the present invention, the chip variable pitch conveying device further includes a grasping mechanism 30. The grasping mechanism 30 is arranged on the frame 10. The grasping mechanism 30 is slidably arranged between the variable pitch mechanism 20 and the tray placement area 12. The grasping mechanism 30 is configured to grasp the chips from the tray and place them into the buffer slot 221.

[0054] Specifically, in the chip pitch-changing transfer device of the present invention, in order to achieve the automatic transfer of chips from the tray to the buffer slot 221, a grasping mechanism 30 is particularly provided. This grasping mechanism 30 is ingeniously installed on the frame 10 and is slidably arranged between the pitch-changing mechanism 20 and the tray placement area 12. The grasping mechanism 30 may be equipped with a set of precise mechanical structures or pneumatic / electric actuators, capable of accurately positioning to the position of each chip in the tray. When it is necessary to grasp a chip, the grasping mechanism 30 will first slide above the tray placement area 12, and then accurately grasp the chip in the tray according to the preset program or the information fed back by the sensor. After grasping the chip, the grasping mechanism 30 will transfer the chip smoothly to the buffer slot 221 of the pitch-changing mechanism 20 along the set sliding track. During this process, the grasping mechanism 30 will maintain a firm grip on the chip to prevent the chip from falling or shifting in position during the transfer. By slidably arranging the grasping mechanism 30 between the pitch-changing mechanism 20 and the tray placement area 12 and configuring it to grasp the chip from the tray into the buffer slot 221, the chip pitch-changing transfer device of the present invention realizes the full-automatic processing of chips from the tray to the testing device. This not only greatly improves the efficiency of chip testing, but also reduces manual intervention and the risk of errors during the operation, providing a strong guarantee for the efficient and stable operation of the chip production line.

[0055] Further, referring to Figures 3 to 5 , in some embodiments of the present invention, the grasping mechanism 30 includes a fixing plate 31. A first pitch-changing component 32 is arranged on the fixing plate 31. A plurality of suction components (not shown in the figure) are arranged on the first pitch-changing component 32. The first pitch-changing component 32 is configured to adjust the distance between the suction components, and the suction components are used to suck chips. In the chip pitch-changing transfer device of the present invention, the grasping mechanism 30 better adapts to the grasping requirements of chips of different specifications.

[0056] Specifically, the grasping mechanism 30 includes a fixing plate 31. This fixing plate 31 serves as the basic support structure of the grasping mechanism 30 and is firmly installed on the frame 10. On the fixing plate 31, a first pitch-changing component 32 is arranged. This first pitch-changing component 32 is the core part of the grasping mechanism 30. It is responsible for adjusting the distance between the suction components to adapt to the arrangement distance between different chips. The first pitch-changing component 32 may adopt a slide rail, a lead screw or other precise mechanical structures and is driven by an electric, pneumatic or manual method to realize the flexible adjustment of the distance between the suction components.

[0057] On the first pitch-changing component 32, a plurality of suction components are provided. These suction components may be vacuum suction nozzles, electromagnetic chucks or other components capable of firmly sucking chips. They are evenly distributed on the first pitch-changing component 32 and their spacing can be adjusted as needed. When it is necessary to grasp the chips, the grasping mechanism 30 will first adjust the spacing between the suction components through the first pitch-changing component 32 to match the arrangement spacing of the chips in the tray. Then, the suction components are activated to generate suction or magnetic force to firmly suck the chips. Next, the grasping mechanism 30 will transfer the chips smoothly to the buffer slot 221 of the pitch-changing mechanism 20 along the set sliding track. Through this design, the grasping mechanism 30 can not only flexibly adapt to the grasping requirements of different specifications of chips, but also ensure the stability and accuracy of the chips during the grasping and transfer processes. This greatly improves the versatility and practicality of the chip pitch-changing transfer device and provides strong support for the efficient operation of the chip production line.

[0058] Referring to Figures 3 to 5 , in some embodiments of the present invention, the first pitch-changing component 32 specifically includes a sliding plate 321, a guiding hanging ring 322 and a mounting plate 323. The sliding plate 321 is slidably arranged on the fixing plate 31, and the sliding plate 321 is configured to slide up and down in the vertical direction; a plurality of guiding hanging rings 322 are provided, both ends of the guiding hanging ring 322 are arranged on the sliding plate 321, and a plurality of guiding hanging rings 322 all have guiding grooves 3221; the mounting plate 323 is installed on the guiding hanging ring 322 through a second connecting and limiting member, the mounting plate 323 is slidably arranged on one side of the fixing plate 31 in the horizontal direction, and suction components are arranged at the lower end of the mounting plate 323.

[0059] Specifically, in the chip pitch-changing transfer device of the present invention, the first pitch-changing component 32 mainly includes a sliding plate 321, a guiding hanging ring 322, and a mounting plate 323. The sliding plate 321 serves as the sliding foundation of the first pitch-changing component 32 and is arranged to be slidable up and down in the vertical direction along the fixed plate 31. The sliding plate 321 can achieve up and down sliding through a slide rail, a cylinder, or other driving mechanisms (not marked in the figure). On the sliding plate 321, a plurality of guiding hanging rings 322 are provided. Both ends of these guiding hanging rings 322 are fixed to the sliding plate 321, and each guiding hanging ring 322 has a guiding groove 3221. The design of the guiding groove 3221 enables the mounting plate 323 to slide horizontally along the guiding hanging ring 322, thereby realizing the adjustment of the pitch between the suction components. The mounting plate 323 is mounted on the guiding hanging ring 322 through a second connecting and limiting member. The second connecting and limiting member (not shown in the figure) may be a slider, a pin, or other components capable of sliding along the guiding groove 3221. When the sliding plate 321 slides up and down in the vertical direction, the sliding plate 321 drives the guiding hanging ring 322 to move up and down. The guiding hanging ring 322 can drive the second connecting and limiting member to slide horizontally in the left-right direction through the guiding groove 3221, and then drive the mounting plate 323 to be located on one side of the fixed plate 31 and outside the sliding plate 321 (the front side shown in the figure) and be slidable in the horizontal direction. Therefore, this sliding is realized by the second connecting and limiting member in the guiding groove 3221 of the guiding hanging ring 322. A suction component is provided at the lower end of the mounting plate 323. When the mounting plate 323 slides, the suction components will also move accordingly, thereby changing the pitch between them.

[0060] In actual operation, when it is necessary to adjust the pitch between the suction components, first, the driving mechanism can be used to make the sliding plate 321 slide up and down in the vertical direction, so as to drive the mounting plate 323 to slide along the guiding groove 3221 of the guiding hanging ring 322, thereby adjusting the pitch between the suction components. When the pitch between the suction components matches the arrangement pitch of the chips in the tray, the suction components can be activated to firmly suck the chips and transfer them to the buffer slot 221 of the pitch-changing mechanism 20.

[0061] Further, referring to Figures 3 to 5 , in some embodiments of the present invention, the grasping mechanism 30 further includes two groups of second pitch-changing components 33. The second pitch-changing components 33 are arranged on the fixed plate 31. The second pitch-changing components 33 are respectively connected to both ends of the guiding hanging ring 322. The guiding hanging ring 322 can expand and contract along the length direction of the guiding hanging ring 322. The second pitch-changing components 33 are configured to adjust the pitch between both ends of the guiding hanging ring 322.

[0062] Specifically, in the chip pitch-changing transfer device of the present invention, in order to further improve the flexibility of the grasping mechanism 30 and the adaptability to chip sizes, two sets of second pitch-changing components 33 are specially designed. These two sets of second pitch-changing components 33 are arranged on the fixed plate 31 and are respectively connected to both ends of the guiding hanging ring 322. The guiding hanging ring 322, as a part of the first pitch-changing component 32, has both ends connected to the fixed plate 31 through the second pitch-changing components 33. Importantly, the guiding hanging ring 322 is designed to be telescopic along its length direction. This means that by adjusting the second pitch-changing components 33, the overall length of the guiding hanging ring 322 can be changed, thereby affecting the sliding range of the mounting plate 323 in the horizontal direction and the maximum and minimum distances between the suction components. The second pitch-changing components 33 may adopt lead screws, cylinders, electric push rods or other precision driving mechanisms to drive the guiding hanging ring 322 to expand and contract manually or automatically. When it is necessary to adjust the distance between both ends of the guiding hanging ring 322, the operator or the control system will activate the second pitch-changing components 33 to drive the guiding hanging ring 322 to expand and contract along the length direction.

[0063] As the guiding hanging ring 322 expands and contracts, the distance between the suction components on the mounting plate 323 will also change accordingly. This design enables the grasping mechanism 30 to flexibly adapt to the grasping requirements of chips with different specifications and different arrangement pitches. Whether it is chips with a close arrangement or chips with a large pitch, the grasping mechanism 30 can achieve an accurate match of the suction component distances by adjusting the second pitch-changing components 33 and the first pitch-changing component 32 (i.e., the sliding of the mounting plate 323 on the guiding hanging ring 322).

[0064] Furthermore, referring to Figures 3 to 4 , in some embodiments of the present invention, both sets of second pitch-changing components 33 include second rotating cylinders 331. The second rotating cylinders 331 are rotatably arranged on the fixed plate 31. The two second rotating cylinders 331 are respectively located on one side of both ends of the guiding hanging ring 322. A plurality of second spiral limiting grooves 3311 are provided on the outer peripheral surface of the second rotating cylinder 331. Both ends of the guiding hanging ring 322 are respectively connected to the second rotating cylinder 331 through third connecting limiting members (not shown in the figure), and the third connecting limiting members are located in the second spiral limiting grooves 3311.

[0065] Specifically, in the chip pitch-changing transmission device of the present invention, each group of second pitch-changing components 33 includes a second rotating cylinder 331. These two second rotating cylinders 331 are rotatably arranged on the fixed plate 31 and are respectively located at both ends of the guiding hanging ring 322. A number of second spiral limiting grooves 3311 are designed on the outer peripheral surface of the second rotating cylinder 331, and these spiral limiting grooves extend spirally along the axial direction of the second rotating cylinder 331. This design enables the third connecting limiting member located thereon to move along the spiral limiting groove when the second rotating cylinder 331 rotates, thereby realizing the adjustment of the distance between both ends of the guiding hanging ring 322. Both ends of the guiding hanging ring 322 are respectively connected to the two second rotating cylinders 331 through the third connecting limiting members. These third connecting limiting members may be pins, sliders or other components that can be closely fitted in the second spiral limiting grooves 3311. When the second rotating cylinder 331 rotates, the third connecting limiting member will move along the axial direction of the second rotating cylinder 331 under the guidance of the spiral limiting groove, thereby driving the guiding hanging ring 322 to expand and contract.

[0066] In actual operation, when it is necessary to adjust the distance between both ends of the guiding hanging ring 322, the operator or the control system will drive the two second rotating cylinders 331 to rotate. Since the spiral limiting grooves on the second rotating cylinder 331 are spiral, the third connecting limiting member will move along the spiral limiting groove as the second rotating cylinder 331 rotates, thereby changing the length of the guiding hanging ring 322. This design not only realizes the precise adjustment of the distance of the guiding hanging ring 322, but also ensures the stability and reliability during the adjustment process.

[0067] Furthermore, referring to Figure 5, in some embodiments of the present invention, the guiding hanging loop 322 includes a first half loop 3222 and a second half loop 3223. The connection end between the first half loop 3222 and the second half loop 3223 is connected by an elastic member (not shown in the figure). The outer ends of the first half loop 3222 and the second half loop 3223 are respectively connected to the second pitch-changing assembly 33. The connection end between the first half loop 3222 and the second half loop 3223 is connected by an elastic member. This elastic member may be a spring, an elastic sheet or other elastic components. Its function is to provide necessary elastic support and buffering when the second pitch-changing assembly 33 drives the guiding hanging loop 322 to expand and contract, ensuring that the guiding hanging loop 322 can adjust its length smoothly and accurately. It should be noted that the elastic member should always maintain a tensile force to maintain the stable connection between the first half loop 3222 and the second half loop 3223. It should also be noted that in order to facilitate the stable sliding of the second connection limiting member in the guiding groove 3221, the connection between the first half loop 3222 and the second half loop 3223 should satisfy that at least part of the structure of one half loop is inserted into the other half loop, and the elastic member is arranged in the half loop, so as to achieve the purpose of facilitating the stable sliding of the second connection limiting member in the guiding groove 3221. The outer ends of the first half loop 3222 and the second half loop 3223 are respectively connected to two groups of the second pitch-changing assemblies 33. This connection method enables the first half loop 3222 and the second half loop 3223 to be directly driven to move along their length directions when the second pitch-changing assembly 33 works, so as to realize the overall expansion and contraction of the guiding hanging loop 322.

[0068] In actual operation, when it is necessary to adjust the length of the guiding hanging loop 322, the second pitch-changing assembly 33 will drive the first half loop 3222 and the second half loop 3223 to move outward or inward respectively. Since the first half loop 3222 and the second half loop 3223 are connected by an elastic member, the elastic member will play a role in connection and support during the movement, ensuring that the length of the guiding hanging loop 322 can be adjusted smoothly and accurately and ensuring the stable sliding of the second connection limiting member.

[0069] According to the chip testing machine of the second aspect embodiment of the present invention, the chip testing machine includes the chip pitch-changing conveying device of any one of the above first aspect embodiments. The chip testing machine further includes a testing device. The testing device includes a manipulator, and the manipulator is used to grab the chips in the chip pitch-changing conveying device. The testing device is configured to test the chips. Through the chip pitch-changing conveying device, the distance between the buffer slots 221 can be adjusted, and then the distance between the chips can be adjusted, so that the distance between the chips on the tray is adjusted to meet the testing distance of the testing device, thus facilitating the grabbing of the testing device and achieving the purpose of facilitating the testing device to test the chips.

[0070] Another key component of the chip testing machine is the testing device. Inside the testing device, there is a precision manipulator, which is exquisitely designed and can accurately grasp the chips in the chip pitch-changing transfer device. The actions of the manipulator are precisely controlled by an advanced control system to ensure that the chips will not be damaged during the grasping process and to guarantee the accuracy of the grasping position, laying a solid foundation for subsequent testing work. The testing device itself is configured to comprehensively test the chips. It may include a series of testing modules, such as an electrical performance testing module, a function testing module, etc. These modules can test various indicators of the chips according to the preset testing process. Through the testing device, the performance parameters, functional integrity, and whether there are defects of the chips can be quickly detected, thus providing strong support for the quality control of the chips.

[0071] During the actual working process, the chip pitch-changing transfer device first transfers the chips from the tray to the designated position of the testing device. Subsequently, under the instruction of the control system, the manipulator accurately grasps the chips and places them in the testing area of the testing device. The testing device then starts the testing program to comprehensively test the chips. After the testing is completed, the manipulator will take out the chips from the testing area and classify and place the chips in the corresponding positions according to the test results, such as the qualified product area or the unqualified product area.

[0072] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0073] Certainly, the present invention is not limited to the above-described embodiments. Those skilled in the art can also make equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A chip variable distance transmission device, characterized in that: include: A frame (10), the frame (10) being provided with a slide seat (11), the slide seat (11) being configured to slide close to a testing device, one side of the slide seat (11) being provided with a material tray placement area (12), the material tray placement area (12) being used to place a material tray, and the material tray being used to store chips; as well as a distance-changing mechanism (20), the distance-changing mechanism (20) being arranged on the slide seat (11), the distance-changing mechanism (20) being located on one side of the tray placement area (12), and the distance-changing mechanism (20) being configured to adjust the distance between the chips; The pitch changing mechanism (20) comprises: A first rotating drum (21), the first rotating drum (21) being rotatably arranged on the sliding seat (11), a plurality of first spiral limiting grooves (211) being arranged on the outer peripheral surface of the first rotating drum (21), and a driving gear (212) being arranged at one end of the first rotating drum (21); a slide (22), the slide (22) being arranged on one side of the first rotating drum (21), the length direction of the slide (22) being parallel to the axial direction of the first rotating drum (21), the slide (22) being provided with a plurality of buffer grooves (221), the buffer grooves (221) being configured to slide on the slide (22) along the length direction of the slide (22), the buffer grooves (221) being used for placing the chips, the slide (22) being connected to the first rotating drum (21) via a first connection stopper, the first connection stopper being arranged in the first spiral stopper groove (211); and a driving rack (23), the driving rack (23) being arranged on the frame (10), the length direction of the driving rack (23) extending horizontally in a direction perpendicular to the axis of the first rotating drum (21), one end of the driving rack (23) being close to the testing device, the initial position of the driving gear (212) being meshed with the other end of the driving rack (23), and the driving gear (212) being configured to translate along the length direction of the driving rack (23); The chip variable pitch conveying device further comprises a grabbing mechanism (30), the grabbing mechanism (30) being arranged on the frame (10), the grabbing mechanism (30) being slidably arranged between the variable pitch mechanism (20) and the tray placement area (12), the grabbing mechanism (30) being configured to grab the chip from the tray and place it in the buffer slot (221); The gripping mechanism (30) comprises a fixing plate (31), a first variable distance component (32) being arranged on the fixing plate (31), a plurality of suction members being arranged on the first variable distance component (32), the first variable distance component (32) being configured to adjust the spacing between the suction members, the suction members being used to suction the chip; The first pitch-changing assembly (32) comprises: a slide plate (321), a guide hanging ring (322) and a mounting plate (323); the slide plate (321) is slidably arranged on the fixed plate (31); the slide plate (321) is configured to slide up and down in a vertical direction; a plurality of guide hanging rings (322) are provided, both ends of the guide hanging rings (322) are provided on the slide plate (321), and the plurality of guide hanging rings (322) all have guide grooves (3221); the mounting plate (323) is installed on the guide hanging rings (322) via a second connection stopper; the mounting plate (323) can be slidably arranged on one side of the fixed plate (31) in a horizontal direction, and the suction member is provided at the lower end of the mounting plate (323); The grabbing mechanism (30) further comprises two sets of second variable-distance components (33), the second variable-distance components (33) being arranged on the fixing plate (31), the second variable-distance components (33) being respectively connected to two ends of the guide hanging ring (322), the guide hanging ring (322) being extendable and retractable along the length direction of the guide hanging ring (322), and the second variable-distance components (33) being configured to adjust the distance between the two ends of the guide hanging ring (322); The two sets of the second pitch-changing assemblies (33) each comprise a second rotating cylinder (331), the second rotating cylinder (331) being rotatably disposed on the fixing plate (31), the two second rotating cylinders (331) being respectively located on one side of both ends of the guide hanging ring (322), the outer circumferential surface of the second rotating cylinder (331) being provided with a plurality of second spiral limiting grooves (3311), the two ends of the guide hanging ring (322) being respectively connected to the second rotating cylinder (331) via third connecting limiting members, and the third connecting limiting members being located in the second spiral limiting grooves (3311); The guide hanging ring (322) comprises a first half ring (3222) and a second half ring (3223); the connecting ends between the first half ring (3222) and the second half ring (3223) are connected via an elastic member; the outer end of the first half ring (3222) and the outer end of the second half ring (3223) are respectively connected to the second variable pitch assembly (33).

2. The chip variable distance transmission device according to claim 1, characterized in that: The other end of the first rotating drum (21) is provided with a plurality of driving gears (212), the plurality of driving gears (212) are spaced apart from each other, a plurality of driving racks (23) are provided, the plurality of driving racks (23) are spaced apart from each other, the plurality of driving gears (212) and the plurality of driving racks (23) are arranged in a one-to-one correspondence, and the plurality of driving racks (23) are configured to be able to slide along the axial direction of the first rotating drum (21) so that the driving racks (23) can respectively mesh with the corresponding driving gears (212).

3. The chip variable distance transmission device according to claim 2, characterized in that: The radius of the multiple-stage driving gear (212) gradually decreases in a direction away from the first rotating drum (21), and the height of the multiple driving racks (23) gradually increases in a direction away from the first rotating drum (21).

4. A chip testing machine, characterized in that: The chip variable-pitch conveying device comprises the chip variable-pitch conveying device as described in any one of claims 1 to 3, the chip testing machine also comprises the testing device, the testing device comprises a manipulator, the manipulator is used to grab the chip in the chip variable-pitch conveying device, and the testing device is configured to test the chip.

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