Method and equipment for photolithographic assisted degradation of epoxy resin

Abstract

The invention discloses a method for photolithography-assisted degradation of epoxy resin, and discloses equipment with the method for photolithography-assisted degradation of epoxy resin, and the method for photolithography-assisted degradation of epoxy resin comprises the following steps: pre-treating epoxy resin by using a green, safe and environment-friendly laser scribing technology; the decomposition rate of the epoxy resin in a degradation solution system is improved, so that the overall degradation efficiency of the epoxy resin is improved, and meanwhile, the contact area of the epoxy resin and the degradation solution is increased after laser scribing, so that the consumption of a catalyst and the degradation solution can be reduced, the economic cost is reduced, wastewater discharge is reduced, and environmental pollution is reduced.

Description

Technical Field

[0001] The invention relates to the field of solid waste material recovery, and in particular to a photolithography-assisted epoxy resin degradation method and equipment. Background Art

[0002] Epoxy resin is a kind of high molecular polymer, which refers to a general term for a class of polymers containing two or more epoxy groups in the molecule. The cured epoxy resin has excellent mechanical properties, good dimensional stability, excellent chemical stability, good bonding properties and insulation properties. Therefore, epoxy resin has been widely used in many fields such as composite materials, adhesives, coatings and electrical packaging materials due to its excellent mechanical properties, electrical insulation, solvent resistance and heat resistance. For example, in the electrical industry, especially dry-type transformers, epoxy resin is widely used as a casting and packaging material for components. However, the irreversible covalent cross-linking network of epoxy resin makes it infusible and difficult to recycle after the end of its service life, resulting in serious waste of resources and environmental pollution.

[0003] The current methods for degrading epoxy resins include physical crushing, thermochemical degradation and chemical degradation. The physical crushing method is to mechanically crush the thermosetting epoxy resin and then recycle it as a filler. This method consumes a lot of energy, the product added value ratio is low, and it is difficult to crush and recycle in a workpiece containing metal such as a cast dry-type transformer. The thermochemical degradation method is a method of degrading thermosetting epoxy resin into various small molecules by thermal action, and recycling the physicochemically inert carbon fiber. However, this method consumes a lot of energy, and the generated products are complex, which seriously pollutes the environment. The chemical degradation method is to selectively break some chemical bonds of the epoxy resin under the action of a catalyst in a certain solvent system. The reaction is controllable, easy to recycle, and has low energy consumption. It is currently the most effective degradation method. Patent Publication No.: CN108779286A discloses a method for treating a thermosetting resin cured product, wherein the epoxy resin cured product or the acid anhydride cured epoxy resin is contacted with an alkali metal hydroxide and an alcohol solvent to decompose and dissolve the thermosetting resin cured product. Patent CN105153461A discloses a recycling process for epoxy resin composite materials, in which anhydrous ethanol and p-toluene acid are mixed to form an organic solvent, and ionic liquid is added to degrade the epoxy resin. The ionic liquid of this invention is relatively expensive and the degradation process is complicated. Patent Publication No.: CN114479177A discloses an epoxy resin degradation method, a solution system for epoxy resin degradation, and a recovery method. DMF and EG in a certain mass ratio are added to the solution system and the epoxy resin is degraded by heating. The degradation procedure of this method is complicated and the degradation conditions are harsh. In summary, the current epoxy resin degradation has problems such as slow degradation rate, difficult recovery of catalysts, high cost of degradation solution, complex reaction procedure, and harsh reaction conditions. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a method for photolithography-assisted degradation of epoxy resin, which can increase the decomposition rate of epoxy resin in a degradation solution system, reduce the amount of catalyst and degradation solution, reduce economic costs, reduce wastewater discharge, and reduce environmental pollution.

[0005] The present invention also provides a system having a method for selecting a controllable ratio of a controllable lightning arrester under the above-mentioned restricted conditions.

[0006] The photolithography-assisted epoxy resin degradation method according to the first aspect of the present invention is characterized by comprising the following steps:

[0007] Determine the shape of the workpiece to be processed and the thickness of the epoxy resin that needs to be degraded;

[0008] Place the workpiece to be processed flat on the rotating frame so that it can rotate around the horizontal axis;

[0009] Determine the laser and the field lens specifications to be configured according to the thickness of the epoxy resin;

[0010] The motion mechanism is adjusted so that the surface of the workpiece to be degraded is located at the laser focus, the spot size is obtained, and the workpiece rotation speed and / or the laser movement speed are adjusted according to the spot size;

[0011] According to the diameter and length of the workpiece to be processed, the side area of ​​the workpiece to be processed is obtained, and the interval of laser scribing is arranged according to the side area;

[0012] The workpiece to be processed is cut according to the set laser.

[0013] The photolithography-assisted epoxy resin degradation method according to the embodiment of the present invention has at least the following beneficial effects: the photolithography-assisted epoxy resin degradation method provided by the present invention can solve the problem of slow degradation rate of epoxy resin cast in existing transformers, can increase the reaction rate, and reduce the utilization of catalysts and solvents, thereby reducing costs.

[0014] According to some embodiments of the present invention, the workpiece to be processed is cylindrical or square cylindrical, and the side area of ​​the workpiece to be processed is obtained by calculating the diameter or the length.

[0015] According to some embodiments of the present invention, in the step of cutting the workpiece to be processed according to the set laser, the workpiece is repeatedly scratched along the circumferential direction until the metal substrate is reached.

[0016] According to some embodiments of the present invention, in the step of cutting the workpiece to be processed according to the set laser, the workpiece is repeatedly scratched along the generatrix direction until the metal substrate is reached.

[0017] According to some embodiments of the present invention, the method further comprises:

[0018] The workpiece having the mesh-like incisions is placed in an epoxy resin degradation solution.

[0019] The photolithography-assisted epoxy resin degradation device according to the second aspect of the present invention is characterized by comprising:

[0020] A measurement module that can determine the shape of the workpiece to be processed and the thickness of the epoxy resin that needs to be degraded;

[0021] The fixed module can place the workpiece to be processed flat on the rotating frame so that it can rotate around the horizontal axis;

[0022] The parameter setting module can determine the laser and the field lens specifications that need to be configured according to the thickness of the epoxy resin;

[0023] A parameter adjustment module, capable of adjusting the motion mechanism so that the surface of the workpiece to be degraded is located at the laser focus, obtaining the spot size and adjusting the workpiece rotation speed and / or the laser movement speed according to the spot size;

[0024] A side area acquisition module, which can acquire the side area of ​​the workpiece to be processed according to the diameter and length of the workpiece to be processed, and arrange the laser scribing interval according to the side area;

[0025] The laser cutting module can cut the workpiece to be processed according to the set laser.

[0026] According to some embodiments of the present invention, the workpiece to be processed is cylindrical or square cylindrical, and the side area of ​​the workpiece to be processed is obtained by calculating the diameter or the length.

[0027] According to some embodiments of the present invention, the laser cutting module repeatedly scratches along a circumferential direction until reaching the metal substrate.

[0028] According to some embodiments of the present invention, the laser cutting module repeatedly scratches along the generatrix direction until reaching the metal substrate.

[0029] According to some embodiments of the present invention, the device further comprises:

[0030] The reaction module is capable of placing the workpiece with mesh-shaped incisions into the epoxy resin degradation solution.

[0031] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0033] Figure 1 A schematic diagram of the steps of a method for photolithography-assisted degradation of epoxy resin according to an embodiment of the present invention;

[0034] Figure 2 A schematic diagram of laser spot arrangement in a method for photolithography-assisted degradation of epoxy resin according to an embodiment of the present invention;

[0035] Figure 3 A schematic diagram of workpiece scratches in the method for photolithography-assisted degradation of epoxy resin provided in an embodiment of the present invention;

[0036] Figure 4 A schematic structural diagram of a photolithography-assisted epoxy resin degradation device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0037] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0038] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0039] In the description of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0040] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0041] Embodiment 1

[0042] Reference Figure 1 The embodiment of the present invention provides a method for photolithography-assisted degradation of epoxy resin, the method comprising at least the following steps:

[0043] Step S100: determining the shape of the workpiece to be processed and the thickness of the epoxy resin to be degraded.

[0044] Usually, a dry-type transformer is cylindrical. In this embodiment, the shape is cylindrical.

[0045] Step S200: Place the workpiece to be processed flat on a rotating frame so that it can rotate around a horizontal axis.

[0046] Step S300: Determine the specifications of the laser and the field lens to be configured according to the thickness of the epoxy resin.

[0047] In this embodiment, the thickness of the epoxy resin is 6 mm. Confirm the laser power and the field lens model. Generally, the thicker the thickness, the greater the corresponding laser power and the smaller the field lens model. In this embodiment, a pulsed laser with an average power of 500W and an F254 field lens are selected.

[0048] Step S400, adjusting the motion mechanism so that the surface of the workpiece to be degraded is located at the laser focus, obtaining the spot size and adjusting the workpiece rotation speed and / or the laser movement speed according to the spot size.

[0049] Adjust the height of the motion mechanism in the Z-axis direction so that the surface of the workpiece to be processed is located at the positive focus of the laser, and measure the spot size at the focus. In this embodiment, the diameter D of the laser spot acting on the workpiece surface is φ0.12 mm;

[0050] Adjust the laser cleaning parameters. The average laser power has been determined above. In this embodiment, a pulse width of 500ns is selected, and a laser frequency of 330kHz corresponding to a pulse width of 500ns is selected. The linear speed of the workpiece rotation and the moving speed of the motion mechanism are set according to the laser frequency.

[0051] See also Figure 2 , the diameter D of the laser spot acting on the workpiece surface is φ0.12mm. At this time, the laser spots are arranged tangentially, and the laser power is 330kHz×spot diameter 0.12mm÷1s=39.6m / s, that is, the linear velocity of movement is set to 39.6m / s.

[0052] Step S500: Obtain the side area of ​​the workpiece to be processed according to the diameter and length of the workpiece to be processed, and arrange the laser scribing interval according to the side area.

[0053] Determine the diameter and length of the cylindrical workpiece. In this embodiment, the bottom diameter of the cylindrical workpiece is 200 mm, and the length of the cylindrical workpiece is 500 mm;

[0054] According to the diameter and length of the cylindrical workpiece, the scoring interval and the motion trajectory of the motion mechanism are set. In this embodiment, the bottom diameter of the cylindrical workpiece is 200 mm, the length of the cylindrical workpiece is 500 mm, the scoring interval is set to 20 mm, the number of scoring lines in the circumferential direction is 500 ÷ 20-1 = 24, and the number of scoring lines in the generatrix direction is 3.14 × 200 mm ÷ 20 mm-1 = 30 for the circumference of the bottom surface of the cylinder.

[0055] Step S600: cutting the workpiece to be processed according to the set laser.

[0056] Turn on the laser and smoke purifier, rotate the workpiece, fix the laser, and repeatedly scratch along the circumference until it reaches the metal substrate.

[0057] Preferably, the specific cutting method needs to be in a mesh shape, such as Figure 3 As shown, step S600 further includes:

[0058] Change the movement mode, fix the workpiece, and repeatedly scratch along the X-axis direction until it reaches the metal substrate. Finally, the marks are distributed in a network on the workpiece.

[0059] Embodiment 2

[0060] Based on the first embodiment, the following steps can be performed to improve the photolithography-assisted degradation of epoxy resin.

[0061] Step S700: quality assessment after the scribing is completed.

[0062] Since the scratches are obvious, observe with naked eyes whether each scratch reaches the metal substrate. If not, the scratches can be deepened in the manner of the above steps S100 to S600.

[0063] Step S800: placing the workpiece with mesh-shaped incisions into an epoxy resin degradation solution.

[0064] The scribed sample is placed in an epoxy resin degradation solution system, and the epoxy resin is waited for to be completely degraded, and the degradation products of the epoxy resin and the metal substrate are recovered respectively.

[0065] Laser scribing increases the contact area between the epoxy resin and the degradation solution, thereby reducing the amount of catalyst and degradation solution, lowering economic costs, reducing wastewater discharge, and reducing environmental pollution.

[0066] Embodiment 3

[0067] Another embodiment of the present application provides a photolithography-assisted epoxy resin degradation device, such as Figure 4 As shown, the device 40 includes:

[0068] The measuring module 401 is capable of determining the shape of the workpiece to be processed and the thickness of the epoxy resin to be degraded;

[0069] The fixing module 402 can place the workpiece to be processed flat on the rotating frame so that it can rotate around the horizontal axis;

[0070] The parameter setting module 403 can determine the laser and the field lens specifications to be configured according to the thickness of the epoxy resin;

[0071] The parameter adjustment module 404 is capable of adjusting the motion mechanism so that the surface of the workpiece to be degraded is located at the laser focus, obtaining the spot size and adjusting the workpiece rotation speed and / or the laser movement speed according to the spot size;

[0072] The side area acquisition module 405 can acquire the side area of ​​the workpiece to be processed according to the diameter and length of the workpiece to be processed, and arrange the laser scribing interval according to the side area;

[0073] The laser cutting module 406 can cut the workpiece to be processed according to the set laser.

[0074] Furthermore, if the workpiece to be processed is cylindrical or square-cylindrical, the side area of ​​the workpiece to be processed is calculated through the diameter or length.

[0075] Furthermore, the laser cutting module 406 can repeatedly scratch along the circumferential direction until reaching the metal substrate.

[0076] Furthermore, the laser cutting module 406 can repeatedly scratch along the generatrix direction until reaching the metal substrate.

[0077] Furthermore, the photolithography-assisted epoxy resin degradation device also includes:

[0078] The reaction module 407 (not shown in the figure) can place the workpiece with mesh-shaped incisions into the epoxy resin degradation solution.

[0079] The device embodiments described above are only illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0080] It will be appreciated by those skilled in the art that all or some of the steps and systems in the disclosed method above may be implemented as software, firmware, hardware and appropriate combinations thereof. Some physical components or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor or a microprocessor, or may be implemented as hardware, or may be implemented as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or a non-transitory medium) and a communication medium (or a temporary medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that may be used to store desired information and may be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0081] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the present application. These equivalent deformations or substitutions are all included in the scope defined by the claims of the present application.

Claims

1. A photolithography-assisted epoxy resin degradation method, characterized in that: The following steps are involved: Determine the shape of the workpiece to be processed and the thickness of the epoxy resin that needs to be degraded; Place the workpiece to be processed flat on the rotating frame so that it can rotate around the horizontal axis; Determine the laser and the field lens specifications to be configured according to the thickness of the epoxy resin; The motion mechanism is adjusted so that the surface of the workpiece to be degraded is located at the laser focus, the spot size is obtained, and the workpiece rotation speed and / or the laser movement speed are adjusted according to the spot size; According to the diameter and length of the workpiece to be processed, the side area of ​​the workpiece to be processed is obtained, and the interval of laser scribing is arranged according to the side area; The workpiece to be processed is cut according to the set laser.

2. The method according to claim 1, characterized in that If the workpiece to be processed is cylindrical or square, the side area of ​​the workpiece to be processed is calculated by diameter or length.

3. The method according to claim 1, characterized in that In the step of cutting the workpiece to be processed according to the set laser, the workpiece is repeatedly scratched along the circumferential direction until the metal substrate is reached.

4. The method according to claim 1, characterized in that: In the step of cutting the workpiece to be processed according to the set laser, the workpiece is repeatedly scratched along the generatrix direction until the metal substrate is reached.

5. The method according to claim 1, characterized in that The method further comprises: The workpiece having the mesh-like incisions is placed in an epoxy resin degradation solution.

6. A photolithography-assisted epoxy resin degradation device, characterized in that: include: A measurement module that can determine the shape of the workpiece to be processed and the thickness of the epoxy resin that needs to be degraded; The fixed module can place the workpiece to be processed flat on the rotating frame so that it can rotate around the horizontal axis; The parameter setting module can determine the laser and the field lens specifications that need to be configured according to the thickness of the epoxy resin; A parameter adjustment module, capable of adjusting the motion mechanism so that the surface of the workpiece to be degraded is located at the laser focus, obtaining the spot size and adjusting the workpiece rotation speed and / or the laser movement speed according to the spot size; A side area acquisition module, which can acquire the side area of ​​the workpiece to be processed according to the diameter and length of the workpiece to be processed, and arrange the laser scribing interval according to the side area; The laser cutting module can cut the workpiece to be processed according to the set laser.

7. The device according to claim 6, characterized in that If the workpiece to be processed is cylindrical or square, the side area of ​​the workpiece to be processed is calculated by diameter or length.

8. The device according to claim 6, characterized in that The laser cutting module repeatedly scratches along the circumferential direction until reaching the metal substrate.

9. The device according to claim 6, characterized in that The laser cutting module repeatedly scratches along the generatrix direction until it reaches the metal substrate.

10. The device according to claim 6, characterized in that The device also includes: The reaction module is capable of placing the workpiece with mesh-shaped incisions into the epoxy resin degradation solution.

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