Packaging adhesive film, preparation method of packaging adhesive film and heterojunction photovoltaic module

By designing a composite packaging film, using thermoplastic polymers with excellent bonding performance and supporting layers with crosslinking agents and coupling agents, combined with an insulating layer of elastomer and aerogel, the existing packaging film has solved the problems of poor bonding effect and insufficient impact resistance at low temperatures, and achieved the improvement of the stability and performance of photovoltaic modules.

CN119709042APending Publication Date: 2025-03-28TUNGHSU GRP
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Patent Information

Application Number
CN202411762412.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-03
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

The existing packaging film has poor bonding effect at low temperatures, which affects the performance of heterojunction cells, and the sheeted heterojunction cells have poor impact resistance, affecting the stability of photovoltaic modules.

Method used

Design a composite encapsulation film, including a support layer and a heat insulation layer. The support layer uses thermoplastic polymers with excellent bonding properties, and a crosslinking agent and coupling agent are added to improve bonding strength and interface compatibility. Elastomers and aerogels are added to the insulation layer to improve sealing pressure, impact resistance and thermal insulation.

Benefits of technology

It improves the bonding effect and impact resistance of the packaging film at low temperatures, ensures the stability and performance of photovoltaic modules, and meets the low temperature requirements of heterojunction batteries.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a packaging adhesive film, a preparation method of the packaging adhesive film and a heterojunction photovoltaic module. The packaging adhesive film comprises a supporting layer and a heat insulation layer which are compounded into a whole, the supporting layer comprises the following components in parts by mass: 100 parts of thermoplastic polymer; 1-5 parts of a cross-linking agent A; 0.1 to 1 part of a thermal initiator A; 0.1 to 1 part of a coupling agent A; 0.1 to 1 part of a light stabilizer A; 0.1 to 1 part of an antioxidant A; the thermal insulation layer comprises the following components by mass: 100 parts of an elastomer; 1 to 10 parts of aerogel; 1-5 parts of a cross-linking agent B; 0.1 to 0.5 part of a thermal initiator B; 0.1 to 0.5 part of a photoinitiator; 0.1 to 1 part of a coupling agent B; 0.1 to 1 part of a light stabilizer B; and 0.1 to 1 part of an antioxidant B. According to the packaging adhesive film provided by the invention, the sealing effect and the impact resistance are ensured through the elastomer; the porous structure of the aerogel can reduce the deformation of the elastomer so as to improve the compression performance and the sealing effect, and the thermal insulation characteristic of the aerogel can maintain the low-temperature requirement of the heterojunction battery piece in the packaging process, so that the performance of the heterojunction battery piece is ensured.
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Description

Technical Field

[0001] The present disclosure relates to the field of photovoltaic technology, and in particular to an encapsulation film, a method for preparing the encapsulation film, and a heterojunction photovoltaic module. Background Art

[0002] Photovoltaic modules include glass cover plates and cells. The glass cover plate is located on the outermost layer of the photovoltaic module, which protects the cells from the external environment (such as wind, sand, rain, ultraviolet rays, etc.). The cells are responsible for converting the received solar energy into electrical energy. Cells include heterojunction cells, monocrystalline silicon cells and other types. Among them, heterojunction cells are regarded as one of the important technical development directions of the photovoltaic industry in the future because of their high conversion efficiency and easy thin-film production.

[0003] In the prior art, in order to firmly combine the glass cover plate and the heterojunction cell, the two are bonded together by an encapsulation film. The encapsulation film not only plays a role of physical connection, but also has multiple functions of sealing, insulation, and protecting the cell from environmental factors. Among them, ethylene-vinyl acetate copolymer (EVA) is one of the commonly used encapsulation film materials.

[0004] However, the inventors found that during the implementation of the invention, since the heterojunction cell needs to be kept at a low temperature (the temperature cannot exceed 200 degrees) during the packaging process to ensure that its performance is not affected, the existing packaging film has poor bonding effect at low temperatures, resulting in reduced performance of the heterojunction cell, and the thinned heterojunction cell has poor impact resistance, which ultimately affects the stability of the photovoltaic module. Summary of the invention

[0005] A technical problem to be solved by the present disclosure is: how to design a packaging film to improve the bonding effect and impact resistance of heterojunction solar cells and ensure the stability of photovoltaic modules.

[0006] In order to solve the above technical problems, the present disclosure provides a packaging film in a first aspect, comprising:

[0007] Composite support layer and heat insulation layer;

[0008] The support layer contains the following quality components:

[0009] Thermoplastic polymer: 100 parts; Crosslinking agent A: 1-5 parts, for example, it can be 1 part, 2 parts, 3 parts, 4 parts or 5 parts; Thermal initiator A: 0.1-1 parts, for example, it can be 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts or 1 parts; Coupling agent A: 0.1-1 parts, for example, it can be 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.9 parts or 1 parts. 6 parts, 0.7 parts, 0.8 parts, 0.9 parts or 1 parts, etc.; Light stabilizer A: 0.1-1 parts, for example, it can be 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts or 1 parts, etc.; Antioxidant A: 0.1-1 parts, for example, it can be 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts or 1 parts, etc.;

[0010] The thermal insulation layer contains the following quality components:

[0011] Elastomer: 100 parts; Aerogel: 1-10 parts, for example, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts or 10 parts; Crosslinking agent B: 1-5 parts, for example, 1 part, 2 parts, 3 parts, 4 parts or 5 parts; Thermal initiator B: 0.1-0.5 parts, for example, 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts or 0.5 parts; Photoinitiator: 0.1-0.5 parts, for example, 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts or 0.5 parts; Coupling agent B: 0.1-1 Part, for example, it can be 0.1 part, 0.2 part, 0.3 part, 0.4 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part, 0.9 part or 1 part, etc.; Light stabilizer B: 0.1-1 part, for example, it can be 0.1 part, 0.2 part, 0.3 part, 0.4 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part, 0.9 part or 1 part, etc.; Antioxidant B: 0.1-1 part, for example, it can be 0.1 part, 0.2 part, 0.3 part, 0.4 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part, 0.9 part or 1 part, etc.

[0012] In some embodiments, the thermoplastic polymer includes one or more of polyurethane, ethylene vinyl acetate, polyolefin, and polyvinyl butyral.

[0013] In some embodiments, the elastomer includes one or more of a polyolefin elastomer, a styrenic thermoplastic elastomer, a thermoplastic polyurethane elastomer, and a thermoplastic polyester elastomer.

[0014] In some embodiments, the aerogel includes one or more of silica aerogel, titania aerogel and alumina aerogel, among which silica aerogel is preferred.

[0015] In some embodiments, the photoinitiator includes one or more of 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and hydroxycyclohexyl phenyl ketone; and / or,

[0016] The crosslinking agent A includes one or more of triallyl isocyanurate, trimethylolpropane trimethacrylate and propoxylated glycerol triacrylate; and / or,

[0017] The thermal initiator A includes one or more of dibenzoyl peroxide, azobisisobutyronitrile and tert-butyl peroxide-2-ethylhexyl carbonate; and / or,

[0018] The coupling agent A includes one or more of vinyl triisopropoxy silane, 3-aminopropyl methyl dimethoxy silane and 3-acetoxypropyl trimethoxy silane; and / or,

[0019] The light stabilizer A includes one or more of 2,4-dihydroxybenzophenone, bis-2,2,6,6-tetramethylpiperidinol sebacate and 3,5-di-tert-butyl-4-hydroxybenzoic acid hexadecyl; and / or,

[0020] Antioxidant A includes one or more of tris[2,4-di-tert-butylphenyl]phosphite, pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, and octadecylβ-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate;

[0021] The crosslinking agent B includes one or more of triallyl isocyanurate, trimethylolpropane trimethacrylate and propoxylated glycerol triacrylate; and / or,

[0022] The thermal initiator B includes one or more of dibenzoyl peroxide, azobisisobutyronitrile and tert-butyl peroxide-2-ethylhexyl carbonate; and / or,

[0023] The coupling agent B includes one or more of vinyl triisopropoxy silane, 3-aminopropyl methyl dimethoxy silane and 3-acetoxypropyl trimethoxy silane; and / or,

[0024] The light stabilizer B includes one or more of 2,4-dihydroxybenzophenone, bis-2,2,6,6-tetramethylpiperidinol sebacate and 3,5-di-tert-butyl-4-hydroxybenzoic acid hexadecyl; and / or,

[0025] The antioxidant B includes one or more of tris[2,4-di-tert-butylphenyl]phosphite, pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, and octadecylβ-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate.

[0026] In some embodiments, the thickness of the support layer is 0.1-0.4 mm, for example, it can be 0.1 mm, 0.2 mm, 0.3 mm or 0.4 mm, etc., among which 0.2 mm is preferred; and / or the thickness of the thermal insulation layer is 0.025-0.1 mm, for example, it can be 0.025 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.08 mm or 0.1 mm, etc., among which 0.05 mm is preferred.

[0027] A second aspect of the present disclosure provides a method for preparing a packaging adhesive film, which is used to manufacture the packaging adhesive film of the first aspect, comprising:

[0028] The raw materials of the support layer and the raw materials of the heat insulation layer are compounded into one by a melt co-extrusion process to form a double-layer co-extrusion structure, wherein the melting temperature is 110-180° C., for example, 110° C., 120° C., 130° C., 140° C., 150° C., 160° C., 170° C. or 180° C., etc.;

[0029] Placing the double-layer co-extruded structure under ultraviolet irradiation environment for pre-crosslinking to form a pre-crosslinked adhesive film;

[0030] The pre-crosslinked adhesive film is processed into an encapsulation adhesive film.

[0031] In some embodiments, before the raw materials of the support layer and the raw materials of the heat insulation layer are compounded into one by melt co-extrusion process, the method further includes:

[0032] After mixing the raw materials of the support layer according to the mass components, stirring them under the first condition;

[0033] After mixing the raw materials of the heat insulation layer according to the mass components, stirring them under the first condition;

[0034] Among them, the first condition is a stirring speed of 500-1000r / min, for example, it can be 500r / min, 600r / min, 700r / min, 800r / min, 900r / min or 1000r / min, etc.; a stirring temperature of 30-50℃, for example, it can be 30℃, 40℃ or 50℃, etc., and a stirring time of 0.5-2h, for example, 1 can be 0.5h, 1h, 1.5h or 2h, etc.

[0035] In some embodiments, placing the double-layer co-extruded structure under ultraviolet irradiation environment for pre-crosslinking includes:

[0036] The double-layer co-extruded structure is placed under a 100-200W / cm mercury lamp, for example, 100W / cm, 120W / cm, 140W / cm, 160W / cm, 180W / cm or 200W / cm, etc. The double-layer co-extruded structure is pre-cross-linked by the mercury lamp at a speed of 3-10m / min, for example, 3m / min, 4m / min, 5m / min, 6m / min, 7m / min, 8m / min, 9m / min or 10m / min, etc.

[0037] A third aspect of the present disclosure provides a heterojunction photovoltaic module, comprising:

[0038] Glass cover;

[0039] Heterojunction solar cells; and

[0040] The packaging film of the first aspect has a support layer connected to the glass cover plate, and a heat insulating layer connected to the heterojunction battery cell.

[0041] Through the above technical scheme, the packaging film provided by the present disclosure uses a thermoplastic polymer with excellent bonding performance at low temperatures in the support layer to ensure good bonding strength at low temperatures; by adding a crosslinking agent A and a thermal initiator A, the crosslinking reaction of the thermoplastic polymer at low temperatures is promoted to improve the bonding strength; by adding a coupling agent A, the interface compatibility between the thermoplastic polymer and the glass cover is improved to improve the bonding effect; by using a light stabilizer A and an antioxidant A, the weather resistance and chemical resistance of the packaging film are improved;

[0042] By adding elastomer to the insulation layer, the elastomer can quickly recover to its original shape after being compressed. This elastic property enables it to provide continuous sealing pressure, ensure the sealing effect, and enhance the impact resistance of the packaging film. The porous structure of the aerogel can absorb part of the energy during compression, reduce the deformation of the elastomer, thereby improving the overall compression performance and sealing effect. Due to the thermal insulation characteristics of the aerogel, the low temperature requirement of the heterojunction battery cell can be maintained during the packaging process, ensuring the performance of the heterojunction battery cell. In addition, the porous structure of the aerogel can also reduce the fluidity of the material, making the packaging film suitable for bonding with the main grid heterojunction battery cell, which can ensure that the packaging film is suitable for bonding with the main grid heterojunction battery cell during the lamination process. During the bonding process, it will not flow between the soldering ribbon and the battery cell, ensuring the close connection between the main grid-free heterojunction battery cell and the soldering ribbon; coupling agent B is used to improve the interface compatibility with the heterojunction battery cell; cross-linking agent B and thermal initiator B are added to promote the cross-linking reaction of the elastomer at low temperature, thereby improving the cohesion and stability; light stabilizer B and antioxidant B are used to improve the weather resistance and chemical resistance of the encapsulation film, ensuring that it will not age or degrade during long-term use in outdoor environments; photoinitiators are used to promote light curing reactions, ensuring that the encapsulation film is quickly and evenly cured under light conditions, ensuring that the thermal insulation layer forms a tight sealing layer at the bonding interface, preventing the penetration of gas or liquid, and improving the sealing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0044] Figure 1 It is a schematic diagram of the structure of the photovoltaic module disclosed in the present invention.

[0045] Description of reference numerals:

[0046] 1. Encapsulation film; 11. Support layer; 12. Thermal insulation layer; 2. Heterojunction cell; 3. Glass cover. DETAILED DESCRIPTION

[0047] The following is a further detailed description of the embodiments of the present disclosure in conjunction with the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure. The present disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

[0048] The present disclosure provides these embodiments to make the present disclosure thorough and complete, and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the parts and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary, and not as limiting.

[0049] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "multiple" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0050] In addition, the words "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. "Vertical" does not mean vertical in the strict sense, but is within the tolerance range. "Parallel" does not mean parallel in the strict sense, but is within the tolerance range. "Include" or "comprising" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements.

[0051] It should also be noted that in the description of the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.

[0052] All terms used in the present disclosure have the same meanings as those understood by those of ordinary skill in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, for example, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined as such herein.

[0053] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0054] A heterojunction is an interface structure composed of two different semiconductor materials. In the photovoltaic field, a heterojunction cell 2 can be composed of a wide bandgap semiconductor material and a narrow bandgap semiconductor material to improve the photoelectric conversion efficiency of the cell. The low temperature process characteristics of heterojunction technology (no more than 200°C) make it more suitable for thin-film production, improving production efficiency.

[0055] However, the current encapsulation film 1 cannot well encapsulate the cover glass and the heterojunction cell 2 at low temperatures, thereby affecting the performance of the heterojunction cell 2 and reducing the stability of the photovoltaic module in long-term use.

[0056] After in-depth research, the inventors found that the inner layer of the packaging film 1 can be set as an insulation layer 12. By adding elastomers and aerogels in the insulation layer 12, the elastic properties of the elastomer are used to provide continuous sealing pressure to ensure the sealing effect and enhance the impact resistance. The porous structure of the aerogel can absorb part of the energy during compression and reduce the deformation of the elastomer, thereby improving the overall compression performance and sealing effect. Due to the insulation properties of the aerogel, the low temperature requirement of the heterojunction battery cell 2 is maintained during the packaging process.

[0057] like Figure 1 As shown, the first aspect of the present application provides a packaging film 1, comprising:

[0058] A support layer 11 and a heat insulating layer 12 are composited into one;

[0059] The support layer 11 comprises the following mass components:

[0060] Thermoplastic polymer: 100 parts; crosslinking agent A: 1-5 parts; thermal initiator A: 0.1-1 parts; coupling agent A: 0.1-1 parts; light stabilizer A: 0.1-1 parts; antioxidant A: 0.1-1 parts;

[0061] The thermal insulation layer 12 comprises the following mass components:

[0062] Elastomer: 100 parts; aerogel: 1-10 parts; crosslinking agent B: 1-5 parts; thermal initiator B: 0.1-0.5 parts; photoinitiator: 0.1-0.5 parts; coupling agent B: 0.1-1 parts; light stabilizer B: 0.1-1 parts; antioxidant B: 0.1-1 parts.

[0063] Specifically, the support layer 11 and the heat insulating layer 12 can be composited into one by a hot pressing composite process or an adhesive composite process to form a final packaging adhesive film 1 .

[0064] The support layer 11 is used to bond with the glass cover plate 3. The support layer 11 contains a thermoplastic polymer with excellent bonding properties at low temperatures, and a coupling agent A is added to improve the interfacial compatibility with the glass cover plate 3. The surface of the glass cover plate 3 is usually smooth, and the material needs to be well bonded to it. The combination of the thermoplastic polymer and the coupling agent can ensure that a strong and lasting bond is formed between the support layer 11 and the glass cover plate 3. In addition, the support layer 11 promotes the cross-linking reaction at low temperatures through the cross-linking agent A and the thermal initiator A, thereby improving the bonding strength, helping to maintain a close connection with the glass cover plate 3 under complex environmental conditions, such as temperature changes, vibrations, etc., and protecting the internal heterojunction battery cell 2 from direct influences of external factors. The light stabilizer A and the antioxidant A in the support layer 11 can improve the weather resistance and chemical resistance of the encapsulation film 1, prevent these harmful factors from further penetrating into the interior, and play the role of the first barrier of protection.

[0065] The thermal insulation layer 12 is used to bond with the heterojunction battery cell 2. The thermal insulation layer 12 has thermal insulation and impact resistance. The elastomer in the thermal insulation layer 12 can quickly return to its original state after being compressed. This elastic property enables the elastomer to provide continuous sealing pressure, ensure the sealing effect, and ensure that the heterojunction battery cell 2 is in a stable and sealed environment during use, preventing external water vapor, oxygen, etc. from entering and causing oxidation or short circuit of the heterojunction battery cell 2. The elastomer fits tightly to the heterojunction battery cell 2, which can effectively seal the space around the heterojunction battery cell 2, and when subjected to slight collisions or vibrations, the elastomer can absorb and disperse energy to prevent damage to the heterojunction battery cell 2 and improve the impact resistance.

[0066] The porous structure of the aerogel can absorb part of the energy during compression, reduce the deformation of the elastomer, and thus improve the overall compression performance and sealing effect. In addition, the porous structure of the aerogel can effectively prevent the conduction of heat, so that it has a heat-insulating property in the heat-insulating layer 12, which can effectively reduce the introduction of external heat, maintain the low temperature requirement of the heterojunction battery cell 2 during the packaging process, and ensure the performance of the heterojunction battery cell 2; in addition, the porous structure of the aerogel can also reduce the fluidity of the material, which is suitable for bonding with the main grid-free heterojunction battery cell 2, and can ensure that it will not flow between the welding strip and the heterojunction battery cell 2 during the lamination process, ensuring the close connection between the heterojunction battery cell 2 and the welding strip. By adding crosslinking agent B and thermal initiator B, the crosslinking reaction of the elastomer at low temperature is promoted to improve the cohesion and stability; by using light stabilizer B and antioxidant B, the weather resistance and chemical resistance of the packaging film 1 are improved to ensure that it will not age or degrade during long-term use in outdoor environments, and coupling agent B is used to improve the interface compatibility with the heterojunction battery cell 2; by using photoinitiator to promote photocuring reaction, it is ensured that the packaging film 1 is quickly and evenly cured under light conditions, and it is ensured that the thermal insulation layer 12 forms a tight sealing layer at the bonding interface to prevent the penetration of gas or liquid and improve the sealing effect.

[0067] Through the above technical scheme, the packaging film 1 provided in the first aspect of the present disclosure uses a thermoplastic polymer with excellent bonding performance at low temperatures in the support layer 11 to ensure good bonding strength at low temperatures; by adding a crosslinking agent A and a thermal initiator A, the crosslinking reaction of the thermoplastic polymer at low temperatures is promoted to improve the bonding strength; by adding a coupling agent A, the interface compatibility between the thermoplastic polymer and the glass cover plate 3 is improved to improve the bonding effect; by using a light stabilizer A and an antioxidant A, the weather resistance and chemical resistance of the packaging film 1 are improved;

[0068] By adding an elastomer to the thermal insulation layer 12, the elastomer can quickly recover to its original shape after being compressed. This elastic property enables it to provide continuous sealing pressure, ensure the sealing effect, and enhance the impact resistance of the packaging film 1. The porous structure of the aerogel can absorb part of the energy during compression, reduce the deformation of the elastomer, thereby improving the overall compression performance and sealing effect. In addition, due to the thermal insulation properties of the aerogel, the low temperature requirement of the heterojunction battery cell 2 can be maintained during the packaging process, thereby ensuring the performance of the heterojunction battery cell 2. In addition, the porous structure of the aerogel can also reduce the fluidity of the material, making the packaging film 1 suitable for bonding with the main grid-free heterojunction battery cell 2, which can ensure that during the lamination process It will not flow between the soldering ribbon and the heterojunction battery cell 2, ensuring the close connection between the main grid-free heterojunction battery cell 2 and the soldering ribbon; the coupling agent B is used to improve the interface compatibility with the heterojunction battery cell 2; the cross-linking agent B and the thermal initiator B are added to promote the cross-linking reaction of the elastomer at low temperature, thereby improving the cohesion and stability; the light stabilizer B and the antioxidant B are used to improve the weather resistance and chemical resistance of the packaging film 1, ensuring that it will not age or degrade during long-term use in outdoor environments; the photoinitiator is used to promote the photocuring reaction, ensuring that the packaging film 1 is quickly and evenly cured under light conditions, ensuring that the thermal insulation layer 12 forms a tight sealing layer at the bonding interface, preventing the penetration of gas or liquid, and improving the sealing effect.

[0069] In some embodiments, the thermoplastic polymer includes one or more of polyurethane, ethylene vinyl acetate, polyolefin, and polyvinyl butyral.

[0070] Specifically, when high adhesion and weather resistance are required, polyurethane can be selected; when economy and good adhesion are required, ethylene-vinyl acetate copolymer can be selected. When high transparency and heat resistance are required, polyolefin can be selected. When high transparency and sound insulation performance are required, polyvinyl butyral can be selected. One thermoplastic polymer or a mixture of several thermoplastic polymers can be selected according to the needs and performance requirements of the specific application.

[0071] In some embodiments, the elastomer includes one or more of a polyolefin elastomer, a styrenic thermoplastic elastomer, a thermoplastic polyurethane elastomer, and a thermoplastic polyester elastomer.

[0072] Specifically, when excellent elasticity, chemical resistance, weather resistance and temperature resistance are required, polyolefin elastomers can be selected. When good flexibility, aging resistance and low temperature performance are required, polyolefin elastomers can be selected. When excellent soft touch and chemical resistance are required, styrene-based thermoplastic elastomers can be selected, wherein the styrene-based thermoplastic elastomer can be selected from styrene-butadiene-styrene block copolymers or styrene-ethylene / butylene-styrene block copolymers. When better elasticity and temperature resistance are required, thermoplastic polyurethane elastomers can be selected. When higher strength, wear resistance and heat resistance are required, thermoplastic polyester elastomers can be selected. One elastomer or a mixture of several elastomers can be selected according to the needs and performance requirements of the specific application.

[0073] In some embodiments, the aerogel includes one or more of silica aerogel, titania aerogel, and alumina aerogel.

[0074] Specifically, aerogel materials can be selected according to the needs and performance requirements of specific applications. For example, when extremely low thermal conductivity and high transparency are required, silica aerogel can be selected; when medium thermal insulation performance and photocatalytic activity are required, titanium dioxide aerogel can be selected; when high temperature resistance and high hardness are required, alumina aerogel can be selected.

[0075] Aerogels may also include at least two of the above, for example, a mixture of silica aerogel and titania aerogel, combining the low thermal conductivity and high transparency of silica aerogel and the photocatalytic activity of titania aerogel; or, a mixture of silica aerogel and alumina aerogel, combining the low thermal conductivity and high transparency of silica aerogel and the high temperature resistance and high hardness of alumina aerogel, suitable for applications requiring high temperature resistance and transparency; or, a mixture of titania aerogel and alumina aerogel, combining the photocatalytic activity and medium thermal insulation performance of titania aerogel and the high temperature resistance and high hardness of alumina aerogel, suitable for applications requiring high temperature resistance and photocatalytic activity; or, a mixture of silica aerogel, titania aerogel and alumina aerogel, combining the advantages of the three materials, suitable for applications requiring comprehensive performance improvement. The specific ratio can be specifically designed according to the actual application scenario to achieve the best performance and cost-effectiveness.

[0076] In some embodiments, the photoinitiator includes one or more of 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and hydroxycyclohexyl phenyl ketone; and / or,

[0077] Specifically, when high-efficiency photoinitiation and low toxicity are required, 2-hydroxy-2-methyl-1-phenyl-1-propanone can be selected. When low yellowing is required, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide can be selected. When high-efficiency photoinitiation, low volatility and low toxicity are required, hydroxycyclohexyl phenyl ketone can be selected. One photoinitiator or a mixture of several photoinitiators can be selected according to the needs and performance requirements of the specific application.

[0078] The crosslinking agent A includes one or more of triallyl isocyanurate, trimethylolpropane trimethacrylate and propoxylated glycerol triacrylate; and / or,

[0079] Specifically, when high-efficiency crosslinking, low volatility, and water and chemical resistance are required, triallyl isocyanurate can be selected. When high-efficiency crosslinking, heat resistance, and aging resistance are required, trimethylolpropane trimethacrylate can be selected. When high-efficiency crosslinking, high flexibility, and water and chemical resistance are required, propoxylated glyceryl triacrylate can be selected. One crosslinking agent A or a mixture of several crosslinking agents A can be selected according to the needs and performance requirements of the specific application.

[0080] The thermal initiator A includes one or more of dibenzoyl peroxide, azobisisobutyronitrile and tert-butyl peroxide-2-ethylhexyl carbonate; and / or,

[0081] Specifically, when high efficiency initiation and wide application range are required, dibenzoyl peroxide can be selected. When high efficiency initiation, controllability and low toxicity are required, azobisisobutyronitrile can be selected. When high efficiency initiation, low volatility and yellowing resistance are required, tert-butyl peroxy-2-ethylhexyl carbonate can be selected. A crosslinking agent A or a mixture of several thermal initiators A can be selected according to the needs and performance requirements of the specific application.

[0082] The coupling agent A includes one or more of vinyl triisopropoxy silane, 3-aminopropyl methyl dimethoxy silane and 3-acetoxypropyl trimethoxy silane; and / or,

[0083] Specifically, when excellent bonding performance, water resistance and low volatility are required, vinyl triisopropoxy silane can be selected. When excellent bonding performance, heat resistance and enhanced mechanical properties are required, 3-aminopropyl methyl dimethoxy silane can be selected. When excellent bonding performance, chemical resistance and enhanced mechanical properties are required, 3-acetoxypropyl trimethoxy silane can be selected. One coupling agent A or a mixture of several coupling agents A can be selected according to the needs and performance requirements of the specific application.

[0084] The light stabilizer A includes one or more of 2,4-dihydroxybenzophenone, bis-2,2,6,6-tetramethylpiperidinol sebacate and 3,5-di-tert-butyl-4-hydroxybenzoic acid hexadecyl; and / or,

[0085] Specifically, when excellent light stability and economy are required, 2,4-dihydroxybenzophenone can be selected. When long-term light stability and heat resistance are required, bis-2,2,6,6-tetramethylpiperidinol sebacate can be selected. When excellent antioxidant performance and versatility are required, 3,5-di-tert-butyl-4-hydroxybenzoic acid hexadecyl can be selected. One light stabilizer A or a mixture of several light stabilizers A can be selected according to the needs and performance requirements of the specific application.

[0086] Antioxidant A includes one or more of tris[2,4-di-tert-butylphenyl]phosphite, pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, and octadecylβ-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate;

[0087] Specifically, when excellent antioxidant performance, versatility and economy are required, tris[2,4-di-tert-butylphenyl]phosphite can be selected. When long-lasting antioxidant performance, versatility and low toxicity are required, tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]pentaerythritol ester can be selected. When excellent antioxidant performance, good processing performance and low volatility are required, β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate octadecyl alcohol ester can be selected. One antioxidant A or a mixture of several photo-antioxidants A can be selected according to the needs and performance requirements of the specific application.

[0088] Crosslinking agent B includes one or more of triallyl isocyanurate, trimethylolpropane trimethacrylate and propoxylated glycerol triacrylate; the choice of crosslinking agent B may be the same as or different from crosslinking agent B; and / or,

[0089] The thermal initiator B includes one or more of dibenzoyl peroxide, azobisisobutyronitrile and tert-butyl peroxide-2-ethylhexyl carbonate; specifically, the thermal initiator B can be the same as or different from the thermal initiator A; and / or,

[0090] The coupling agent B includes one or more of vinyl triisopropoxysilane, 3-aminopropylmethyldimethoxysilane and 3-acetoxypropyltrimethoxysilane; the coupling agent B can be the same as or different from the coupling agent A; and / or,

[0091] Light stabilizer B includes one or more of 2,4-dihydroxybenzophenone, bis-2,2,6,6-tetramethylpiperidinol sebacate and 3,5-di-tert-butyl-4-hydroxybenzoic acid hexadecyl; the light stabilizer B may be the same as or different from the light stabilizer A; and / or,

[0092] Antioxidant B includes one or more of tris[2,4-di-tert-butylphenyl]phosphite, pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, and octadecylβ-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate. The selection of antioxidant B can be the same as or different from that of antioxidant A.

[0093] In some embodiments, the thickness of the support layer 11 is 0.1-0.4 mm to provide sufficient mechanical strength to ensure that the encapsulation film 1 is not easily torn or damaged during use, improve the bonding strength and stability, and ensure the sealing effect; and the thickness of 0.1-0.4 mm makes the encapsulation film 1 have good flexibility and fluidity, and is suitable for application in busbar-free heterojunction photovoltaic modules. And / or,

[0094] The thickness of the thermal insulation layer 12 is 0.025-0.1 mm, so as to provide excellent thermal insulation and impact resistance, ensure appropriate fluidity, and at the same time make the thermal insulation layer 12 have high transparency, ensure the sealing effect and performance of the photovoltaic module, and is suitable for application in busbar-free heterojunction photovoltaic modules.

[0095] A second aspect of the present disclosure provides a method for preparing a packaging adhesive film 1, which is used to manufacture the packaging adhesive film 1 of the first aspect, comprising:

[0096] The raw materials of the support layer 11 and the raw materials of the heat insulation layer 12 are compounded into one by a melt co-extrusion process to form a double-layer co-extrusion structure, wherein the melting temperature is 110-180° C.;

[0097] Before the raw materials of the support layer 11 and the raw materials of the heat insulation layer 12 are compounded into one by a melt co-extrusion process, the following steps are also included:

[0098] After mixing the raw materials of the support layer 11 according to the mass components, stirring them under the first condition;

[0099] After mixing the raw materials of the heat insulation layer 12 according to the mass components, stirring them under the first condition;

[0100] Among them, the first condition is a stirring speed of 500-1000 r / min, a stirring temperature of 30-50° C., and a stirring time of 0.5-2 h.

[0101] Specifically, the raw materials of the support layer 11 can be weighed by an analytical balance to ensure that the raw materials meet the mass components of the support layer 11 of the encapsulation film 1 of the first aspect, and then the raw materials of the support layer 11 are put into a blender and stirred under a first condition to achieve full mixing, so as to ensure that the components are uniformly mixed in a molten state; the raw materials of the heat-insulating layer 12 can be weighed by an analytical balance, and the raw materials must meet the mass components of the heat-insulating layer 12 of the encapsulation film 1 of the first aspect, and then the raw materials of the support layer 11 are put into a blender and stirred under a first condition to achieve full mixing, and stirred under a first condition to achieve full mixing, so as to ensure that the components are uniformly mixed in a molten state;

[0102] Among them, the first condition is a stirring speed of 500-1000r / min, a stirring temperature of 30-50°C, and a stirring time of 0.5-2h. The first condition when the support layer 11 and the heat insulation layer 12 are mixed can be the same or different. By controlling the first condition, it can be ensured that the raw materials are fully mixed to form a uniform mixture. This helps to maintain stable fluidity and low fluidity in the subsequent melt coextrusion process.

[0103] The mixed support layer 11 mixture is added to a feed port of the melt co-extrusion equipment. The thickness of the support layer 11 can be roughly controlled by controlling the screw speed, and the thickness of the support layer 11 and the thermal insulation layer 12 can be accurately controlled by the multi-layer co-extrusion die head. The support layer 11 is ensured to flow evenly in a molten state by controlling the extrusion speed. The mixed thermal insulation layer 12 mixture is added to another feed port of the melt co-extrusion equipment. The thickness of the thermal insulation layer 12 can be roughly controlled by controlling the screw speed, and the thermal insulation layer 12 can be ensured to flow evenly in a molten state by controlling the extrusion speed. The molten support layer 11 and the thermal insulation layer 12 are compounded into one to form a double-layer co-extrusion structure to ensure that the two layers of materials can be tightly combined during the compounding process.

[0104] The composite double-layer co-extruded structure is cooled and shaped by a cooling device to ensure that the material maintains the required shape and thickness during the cooling process. The cooling device can be water-cooled or air-cooled, and the appropriate cooling method can be selected according to the cooling requirements of the specific material. The cooled double-layer co-extruded structure is shaped by a traction device to ensure that the thickness and width of the material are uniform. The shaped material is reeled by a take-up device for subsequent processing.

[0105] Placing the double-layer co-extruded structure under ultraviolet irradiation environment for pre-crosslinking to form a pre-crosslinked adhesive film;

[0106] The double-layer co-extruded structure is placed under ultraviolet irradiation for pre-crosslinking, including:

[0107] The double-layer co-extruded structure is placed under a 100-200W / cm mercury lamp, and the double-layer co-extruded structure is pre-crosslinked through the mercury lamp at a speed of 3-10m / min to form a pre-crosslinked adhesive film.

[0108] Specifically, the rolled double-layer co-extruded structure is unwound to ensure that the double-layer co-extruded structure is laid flat on the conveyor belt. Then the mercury lamp is turned on to ensure that the mercury lamp is preheated to a working state. Then the double-layer co-extruded structure is passed through the mercury lamp at a speed of 3-10 m / min for ultraviolet irradiation pre-crosslinking. The appropriate conveying speed and mercury lamp power can be selected according to the specific properties of the material and the required degree of crosslinking.

[0109] Pre-crosslinking by ultraviolet irradiation can partially solidify the heat insulation layer 12 and reduce its fluidity. Pre-crosslinking treatment can increase the degree of crosslinking of the material, making it more stable in the subsequent lamination process, suitable for bonding with the busbar-free heterojunction battery cell 2, and will not flow between the welding ribbon and the busbar-free heterojunction battery cell 2, ensuring a tight connection between the welding ribbon and the busbar-free heterojunction battery.

[0110] The pre-crosslinked adhesive film is processed into an encapsulation adhesive film 1.

[0111] Specifically, the pre-cross-linked adhesive film can be processed into the final required packaging adhesive film 1 by cutting, surface dust removal and other treatments.

[0112] Through the above technical scheme, the encapsulation film 1 provided in the second aspect of the present disclosure is prepared by using a melt co-extrusion process to composite the support layer 11 and the heat insulating layer 12 into one. The melt co-extrusion process can ensure that the components are fully mixed in a molten state to form a uniform material layer; the interface compatibility between the support layer 11 and the heat insulating layer 12 is significantly improved, ensuring that the two layers of material can be tightly combined, thereby improving the overall bonding strength and sealing effect;

[0113] like Figure 1 As shown, the third aspect of the present disclosure provides a heterojunction photovoltaic module, comprising:

[0114] Glass cover 3;

[0115] Heterojunction cell 2; and

[0116] In the packaging film 1 of the first aspect, the support layer 11 of the packaging film 1 is connected to the glass cover plate 3 , and the heat insulation layer 12 of the packaging film 1 is connected to the heterojunction battery cell 2 .

[0117] Specifically, the glass cover plate 3 has two layers, the heterojunction cell 2 is located between the two layers of glass cover plates 3, and the heterojunction cell 2 is bonded to the glass cover plate 3 through the packaging film 1. The heterojunction cell 2 can be a heterojunction cell 2 without a main grid or a heterojunction cell 2 with a main grid.

[0118] Example 1

[0119] First, weigh the raw materials of the support layer 11 according to the mass composition:

[0120] Polyethylene vinyl acetate: 100 parts; triallyl isocyanurate: 2 parts; dibenzoyl peroxide: 0.5 parts; 3-acetoxypropyltrimethoxysilane: 0.3 parts; 2,4-dihydroxybenzophenone: 0.2 parts; pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate: 0.4 parts;

[0121] Weigh the raw materials of the thermal insulation layer 12 according to this mass composition:

[0122] Polyolefin: 100 parts; silica aerogel: 5 parts; triallyl isocyanurate: 2 parts; dibenzoyl peroxide: 0.25 parts; 2,4,6-trimethylbenzoyl-diphenylphosphine oxide: 0.25 parts; 3-acetoxypropyltrimethoxysilane: 0.3 parts; 2,4-dihydroxybenzophenone: 0.2 parts; pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate: 0.4 parts.

[0123] Secondly, the raw materials of the support layer 11 and the raw materials of the heat insulation layer 12 are added into the mixer respectively, with the stirring speed of 800 r / min, the stirring temperature of 45° C. and the stirring time of 1 hour.

[0124] Then, the stirred support layer 11 mixture is added to a feed port of the melt co-extrusion equipment, and the stirred insulation layer 12 mixture is added to another feed port of the melt co-extrusion equipment, the melting temperature is 130°C, and co-extrusion is performed to obtain a double-layer co-extrusion structure, wherein the support film thickness is 0.2mm and the insulation layer 12 thickness is 0.05mm; and then the structure is rolled up after being stretched, cooled and pre-crosslinked by ultraviolet radiation;

[0125] Next, the double-layer co-extruded structure was unrolled and laid flat on a conveyor belt, and placed under a 160W / cm mercury lamp. The double-layer co-extruded structure was pre-crosslinked through the mercury lamp at a speed of 5m / min to form a pre-crosslinked adhesive film.

[0126] Finally, the pre-cross-linked adhesive film is cut and subjected to surface dust removal treatment to be processed into the final required packaging adhesive film 1.

[0127] The encapsulation film 1 is bonded to the glass cover plate 3 and the non-busbar heterojunction cell 2 by lamination, wherein the lamination setting temperature is 150°C, the vacuuming time is 5 minutes, and the lamination time is 10 minutes. After lamination, the following tests are performed:

[0128] Electroluminescence performance: The test is carried out in accordance with the test method provided in "NB / T 11080-2023 Technical Specification for Electroluminescence (EL) Testing of Photovoltaic Modules" to evaluate whether the cell has poor contact with the solder ribbon or hidden cracks after lamination. The wet heat test temperature is 25°C and the relative humidity is 45%h;

[0129] Resistance to moisture and heat: Tested in accordance with the test method provided in IEC 61215 2:2016 to evaluate whether the film is delaminated. The temperature of the moisture and heat test is 85°C, the relative humidity is 85%, and the time is 1000h;

[0130] Long-term aging performance: According to the long-term aging test method specified in GB / T41203 2021 Accelerated aging test method for photovoltaic module encapsulation materials, the high temperature and high humidity aging adhesion performance of the film is evaluated. The test temperature is 121°C, the relative humidity is 100%, and the test time is 48h;

[0131] Hail impact resistance: The test is carried out according to the test method provided in "IEC 61215 2:2016" to evaluate the ability of photovoltaic modules to resist hail impact.

[0132] Example 2

[0133] The difference between Example 2 and Example 1 is that the thickness of the support film is 0.4 mm, and the thickness of the heat insulation layer 12 is 0.1 mm.

[0134] Example 3

[0135] The difference between Example 3 and Example 1 is that the thickness of the support film is 0.1 mm, and the thickness of the heat insulation layer 12 is 0.0025 mm.

[0136] Example 4

[0137] The difference between Example 4 and Example 1 is that the amount of silica aerogel is 1 part.

[0138] Example 5

[0139] The difference between Example 5 and Example 1 is that the amount of silica aerogel is 10 parts.

[0140] Example 6

[0141] The difference between Example 6 and Example 1 is that:

[0142] Triallyl isocyanurate: 1 part; dibenzoyl peroxide: 0.1 part; 2,4,6-trimethylbenzoyl-diphenylphosphine oxide: 0.1 part; 3-acetoxypropyltrimethoxysilane: 0.1 part; 2,4-dihydroxybenzophenone: 0.1 part; pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate: 0.1 part.

[0143] Example 7

[0144] The difference between Example 7 and Example 1 is that:

[0145] Triallyl isocyanurate: 5 parts; dibenzoyl peroxide: 0.5 parts; 2,4,6-trimethylbenzoyl-diphenylphosphine oxide: 0.5 parts; 3-acetoxypropyltrimethoxysilane: 1 part; 2,4-dihydroxybenzophenone: 1 part; pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate: 1 part.

[0146] Comparative Example 1

[0147] The difference between Comparative Example 1 and Example 1 is that no silica aerogel is added.

[0148] Comparative Example 2

[0149] The difference between Comparative Example 2 and Example 2 is that no silica aerogel is added.

[0150] Comparative Example 3

[0151] The difference between Comparative Example 3 and Example 3 is that no silica aerogel is added.

[0152] Table 1 Test data of Examples 1-7 and Comparative Examples 1-3

[0153]

[0154] Through Examples 1-7 and Comparative Examples 1-3, it can be concluded that after adding aerogel to the encapsulation film 1 of the present application, the EL photoelectric performance, long-term aging performance, and hail impact resistance of the obtained photovoltaic module all meet the requirements, and the comprehensive performance is better than that of Comparative Examples 1-3 without adding aerogel. Analysis shows that by adding aerogel to the encapsulation film 1, the fluidity of the encapsulation film 1 is reduced, and the bonding effect between the welding strip and the non-busbar heterojunction battery cell 2 during the lamination process can be improved, and the encapsulation film 1 is prevented from penetrating between the welding strip and the non-busbar heterojunction battery cell 2 to cause poor photoelectric performance. After lamination of Examples 1-7, the glass cover plate 3, the non-busbar heterojunction battery cell 2 and the welding strip are firmly bonded and have a good bonding effect, and their moisture and heat resistance and long-term aging performance are better than those of Comparative Examples 1-3. Due to the buffering effect of aerogel, the non-busbar heterojunction battery cells 2 of Examples 1-7 all passed the hail impact test.

[0155] It can be seen from Examples 1-3 that if the film layer is too thick or too thin, the EL photoelectric performance, long-term aging performance, and hail resistance of the module will be slightly reduced. Analysis shows that when the film layer is too thick, the fluidity increases during lamination, and the encapsulation film 1 penetrates between the soldering ribbon and the heterojunction battery cell 2, causing a slight shadow on the soldering ribbon. When the film layer is too thin, the lamination process is not sufficiently insulated and buffered, and there is a slight shadow on the surface of the non-main grid heterojunction battery cell 2. Therefore, it is necessary to control the thickness of the support film and the thickness of the thermal insulation film within a reasonable range.

[0156] It can be seen from Examples 1, 4 and 5 that too much or too little aerogel added to the thermal insulation layer 12 will lead to the EL photoelectric performance, moisture and heat resistance, and hail resistance of the component. When too little aerogel is added, the fluidity increases during lamination, resulting in a slight shadow of the welding strip, and the hail resistance decreases; when too much aerogel is added, the bonding force is insufficient during lamination, resulting in a slight stratification phenomenon, which leads to a decrease in moisture and heat resistance.

[0157] It can be seen from Examples 1, 6 and 7 that too much or too little additive added to the insulation layer 12 will lead to a slight decrease in the EL photoelectric performance, long-term aging performance and hail resistance of the module. Analysis shows that when there is less additive, the fluidity increases during lamination, and the encapsulation film 1 penetrates between the soldering ribbon and the heterojunction battery cell 2, causing a slight shadow on the soldering ribbon. When there is more additive, the curing is too fast during lamination, the hardness is higher, and there is a slight shadow on the surface of the non-main grid heterojunction battery cell 2.

[0158] So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.

[0159] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict.

Claims

1. A packaging film, characterized in that: include: A support layer (11) and a heat insulating layer (12) composited into one body; The support layer (11) comprises the following mass components: Thermoplastic polymer: 100 parts; crosslinking agent A: 1-5 parts; thermal initiator A: 0.1-1 parts; coupling agent A: 0.1-1 parts; light stabilizer A: 0.1-1 parts; antioxidant A: 0.1-1 parts; The thermal insulation layer (12) comprises the following mass components: Elastomer: 100 parts; Aerogel: 1-10 parts; Crosslinking agent B: 1-5 parts; Thermal initiator B: 0.1-0.5 parts; Photoinitiator: 0.1-0.5 parts; coupling agent B: 0.1-1 parts; Light stabilizer B: 0.1-1 part; Antioxidant B: 0.1-1 part.

2. The packaging film according to claim 1, characterized in that: The thermoplastic polymer includes one or more of polyurethane, ethylene-vinyl acetate copolymer, polyolefin and polyvinyl butyral.

3. The packaging film according to claim 1, characterized in that: The elastomer includes one or more of polyolefin elastomer, styrene-based thermoplastic elastomer, thermoplastic polyurethane elastomer and thermoplastic polyester elastomer.

4. The packaging film according to claim 1, characterized in that: The aerogel includes one or more of silicon dioxide aerogel, titanium dioxide aerogel and aluminum oxide aerogel.

5. The packaging film according to claim 1, characterized in that: The photoinitiator comprises one or more of 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide and hydroxycyclohexyl phenyl ketone; and / or, The crosslinking agent A comprises one or more of triallyl isocyanurate, trimethylolpropane trimethacrylate and propoxylated glycerol triacrylate; and / or, The thermal initiator A comprises one or more of dibenzoyl peroxide, azobisisobutyronitrile and tert-butyl peroxide-2-ethylhexyl carbonate; and / or, The coupling agent A comprises one or more of vinyl triisopropoxy silane, 3-aminopropyl methyl dimethoxy silane and 3-acetoxypropyl trimethoxy silane; and / or, The light stabilizer A comprises one or more of 2,4-dihydroxybenzophenone, bis-2,2,6,6-tetramethylpiperidinol sebacate and 3,5-di-tert-butyl-4-hydroxybenzoic acid hexadecyl; and / or, The antioxidant A includes one or more of tris[2,4-di-tert-butylphenyl]phosphite, pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, and octadecylβ-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate; The crosslinking agent B comprises one or more of triallyl isocyanurate, trimethylolpropane trimethacrylate and propoxylated glycerol triacrylate; and / or, The thermal initiator B comprises one or more of dibenzoyl peroxide, azobisisobutyronitrile and tert-butyl peroxide-2-ethylhexyl carbonate; and / or, The coupling agent B includes one or more of vinyl triisopropoxy silane, 3-aminopropyl methyl dimethoxy silane and 3-acetoxypropyl trimethoxy silane; and / or, The light stabilizer B includes one or more of 2,4-dihydroxybenzophenone, bis-2,2,6,6-tetramethylpiperidinol sebacate and 3,5-di-tert-butyl-4-hydroxybenzoic acid hexadecyl; and / or, The antioxidant B includes one or more of tris[2,4-di-tert-butylphenyl]phosphite, pentaerythritol tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, and octadecylβ-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate.

6. The packaging film according to claim 1, characterized in that: The thickness of the support layer (11) is 0.1-0.4 mm; and / or the thickness of the heat insulation layer (12) is 0.025-0.1 mm.

7. A method for preparing a packaging adhesive film, for manufacturing the packaging adhesive film according to any one of claims 1 to 6, characterized in that: include: The raw materials of the support layer (11) and the raw materials of the heat insulation layer (12) are compounded into one by a melt co-extrusion process to form a double-layer co-extrusion structure, wherein the melting temperature is 110-180° C.; Placing the double-layer co-extruded structure under ultraviolet irradiation environment for pre-crosslinking to form a pre-crosslinked adhesive film; The pre-crosslinked adhesive film is processed into a packaging adhesive film (1).

8. The method for preparing a packaging adhesive film according to claim 7, characterized in that: Before the raw materials of the support layer (11) and the raw materials of the heat insulation layer (12) are compounded into one by a melt co-extrusion process, the method further comprises: After mixing the raw materials of the support layer (11) according to the mass components, stirring under the first condition; After mixing the raw materials of the heat insulation layer (12) according to the mass components, stirring under the first condition; Wherein, the first condition is a stirring speed of 500-1000 r / min, a stirring temperature of 30-50° C., and a stirring time of 0.5-2 h.

9. The method for preparing a packaging adhesive film according to claim 7, characterized in that: Placing the double-layer co-extruded structure under ultraviolet irradiation environment for pre-crosslinking comprises: The double-layer co-extruded structure is placed under a 100-200 W / cm mercury lamp, and the double-layer co-extruded structure passes through the mercury lamp at a speed of 3-10 m / min for pre-crosslinking.

10. A heterojunction photovoltaic module, characterized in that: include: Glass cover (3); Heterojunction solar cell (2); as well as, The encapsulation film (1) according to any one of claims 1 to 6, wherein the support layer (11) of the encapsulation film (1) is connected to the glass cover plate (3), and the heat insulation layer (12) of the encapsulation film (1) is connected to the heterojunction cell (2).

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