Microcapsule-based chemical nickel plating solution and method for preparing coating
By introducing microcapsules into the electroless nickel plating solution, the self-repair function of the coating is achieved, solving the problem of easy and irreparable traditional coatings, extending service life and reducing maintenance costs.
Patent Information
- Application Number
- CN202411796944.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-03-28
AI Technical Summary
Traditional electroless nickel coatings are susceptible to damage during use and cannot be self-repaired, resulting in corrosion expansion and equipment failure, and lack of self-repair function in high hardness and corrosion-resistant environments.
By introducing microcapsules into the electroless nickel plating solution, the microcapsule shell material adopts polyurea or polyamide, and the core material is the component of the electroless nickel plating solution. The microcapsules release the core material when the coating is damaged, generating new nickel-phosphorus alloy deposits, repairing cracks and preventing the spread of corrosive media.
The self-healing function of the coating is realized, which extends service life, reduces maintenance costs, and maintains good performance in high hardness and corrosion-resistant environments.