Copper oxidation equipment

Abstract

The invention discloses copper oxidation equipment which comprises an oxidation pond, a control unit and a circulating device, an oxidation tank is arranged in the oxidation pond, an ultrasonic unit and a heating unit are arranged in the oxidation tank, a backflow water inlet is formed in the upper portion of the oxidation tank, the backflow water inlet is connected with the circulating device through a backflow pipe, and the control unit is connected with the circulating device. A circulating water outlet is formed in the lower part of the oxidation tank and is connected with the circulating device through a water inlet pipe. The ultrasonic unit is arranged in the oxidation pond, reaction liquid is vibrated through ultrasonic waves, temperature distribution is uniform, the reaction efficiency in the oxidation pond is improved, and the oxidation effect of the metal copper surface layer can be better; the circulating unit enables the reaction solution in the oxidation equipment to continuously and circularly flow, so that the concentration and the temperature of the reaction solution at each position are always kept uniform.

Description

Technical Field

[0001] The invention relates to the technical field of oxidation reaction tanks, in particular to the technical field of copper oxidation equipment. Background Art

[0002] The main purpose of copper oxidation blackening process is matte, decoration and anti-corrosion; through oxidation blackening treatment, a dense black oxide film can be formed on the surface of copper products, improving the wear resistance and corrosion resistance of copper products.

[0003] When the phosphor bronze filler is oxidized, the filler needs to be immersed in an oxidation tank and react with the reaction liquid in the oxidation tank at a certain temperature. When the existing oxidation tank is used, the temperature and liquid concentration in the oxidation tank are unevenly distributed, resulting in uneven oxidation, which leads to unsatisfactory oxidation effect. Summary of the invention

[0004] The purpose of the present invention is to solve the problems in the prior art and to provide a copper oxidation device that can solve the above problems.

[0005] To achieve the above-mentioned purpose, the present invention proposes a copper oxidation device, comprising an oxidation pool, a control unit and a circulation device, wherein an oxidation tank is provided in the oxidation pool, an ultrasonic unit and a heating unit are provided in the oxidation tank, a reflux water inlet is provided above the oxidation tank, the reflux water inlet is connected to the circulation device through a reflux pipe, and a circulation water outlet is provided below the oxidation tank, the circulation water outlet is connected to the circulation device through a water inlet pipe.

[0006] Preferably, the ultrasonic unit comprises an ultrasonic generator and an ultrasonic vibration plate, the ultrasonic generator is connected to the ultrasonic vibration plate, the ultrasonic generator is arranged in the control unit, and the ultrasonic vibration plate is installed in the oxidation tank.

[0007] Preferably, the ultrasonic vibration plate is installed on the bottom wall and / or side wall of the oxidation tank.

[0008] Preferably, the heating unit includes a heater and a temperature controller, a temperature sensor is provided in the oxidation tank, the temperature sensor is connected to the temperature controller, the heater is connected to the temperature controller, the temperature controller is arranged in the control unit, and the heater is installed on the bottom wall and / or side wall of the oxidation tank.

[0009] Preferably, four groups of heaters are centrally symmetrically distributed on the inner walls of the oxidation tank.

[0010] Preferably, a circulating water outlet plate is provided on the inner walls around the oxidation tank, the circulating water outlet plate matches the side wall width of the oxidation tank, a plurality of circulating water outlets are opened on the surface of the circulating water outlet plate, a circulating water nozzle is installed on the circulating water outlet, a water outlet channel is provided in the circulating water outlet plate, the water outlet channel is connected to the water inlet pipe, the circulating water outlet is connected to the water outlet channel, and a circulating water pump is provided on the water inlet pipe.

[0011] Preferably, a thermal insulation layer is provided in the wall of the oxidation pool, and a detachable thermal insulation cover is provided on the top of the oxidation tank.

[0012] Preferably, the circulation device includes a box body, a buffer plate is provided in the box body, the buffer plate divides the box body into a water inlet chamber and a water outlet chamber, the water inlet chamber and the water outlet chamber are connected at the top, the water inlet chamber and the water outlet chamber are separated at the bottom by the buffer plate, through holes are provided on both sides of the bottom of the buffer plate, the bottom of the water inlet chamber and the water outlet chamber are connected through the through holes, the reflux pipe is connected to the top of the water inlet chamber, and the water inlet pipe is connected to the bottom of the water outlet chamber.

[0013] The beneficial effects of the present invention are as follows: a heating unit is arranged in the oxidation pool, and the reaction liquid is heated at a constant temperature by the heating unit, so that the reaction liquid can reach the reaction temperature required for the oxidation reaction; an ultrasonic unit is arranged in the oxidation pool, and the reaction liquid is vibrated by ultrasonic waves to make the temperature distribution uniform, so that the reaction efficiency in the oxidation pool is increased and the oxidation effect of the surface layer of the metal copper is better; the circulation unit allows the reaction solution in the oxidation equipment to circulate continuously, so that the concentration and temperature of the reaction liquid in various places are always kept uniform; the ultrasonic unit and the circulation unit can make the copper oxidized thoroughly, evenly and quickly, improve the oxidation efficiency, and improve the oxidation effect; the thermal insulation layer enables the oxidation equipment to have excellent thermal insulation performance; the circulating water outlets arranged linearly and evenly allow the circulated liquid to be evenly and quickly mixed with the liquid in the pool.

[0014] The features and advantages of the present invention will be described in detail through embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 is a top view of the present invention; Figure 3 It is a schematic diagram of the circulating water outlet plate of the present invention; Figure 4 It is a top view of the box of the present invention.

[0016] In the figure: 1. oxidation tank; 2. control unit; 3. circulation device; 4. ultrasonic unit; 5. heating unit; 6. reflux pipe; 7. circulation outlet; 8. water inlet pipe; 9. circulation outlet plate; 10. circulation water pump; 11. oxidation tank; 12. reflux inlet; 13. insulation layer; 14. insulation cover; 41. ultrasonic vibration plate; 51. heater; 31. box; 32. buffer plate; 33. water inlet chamber; 34. water outlet chamber; 35. through hole. DETAILED DESCRIPTION

[0017] See also Figure 1 , Figure 2 , Figure 3 and Figure 4A copper oxidation device comprises an oxidation pool 1, a control unit 2 and a circulation device 3, wherein the oxidation pool 1 is provided with an oxidation tank 11, wherein the oxidation tank 11 is provided with an ultrasonic unit 4 and a heating unit 5, wherein a reflux water inlet 12 is provided above the oxidation tank 11, wherein the reflux water inlet 12 is connected to the circulation device 3 through a reflux pipe 6, wherein a circulation water outlet 7 is provided below the oxidation tank 11, wherein the circulation water outlet 7 is connected to the circulation device 3 through a water inlet pipe 8; wherein the ultrasonic unit 4 comprises an ultrasonic generator and an ultrasonic vibration plate 41, wherein the ultrasonic generator and the ultrasonic vibration plate 41 is connected, the ultrasonic generator is arranged in the control unit 2, the ultrasonic vibration plate 41 is installed in the oxidation tank 11; the ultrasonic vibration plate 41 is installed in the bottom wall and the side wall of the oxidation tank 11; the heating unit 5 includes a heater 51 and a temperature controller, a temperature sensor is arranged in the oxidation tank 11, the temperature sensor is connected to the temperature controller, the heater 51 is connected to the temperature controller, the temperature controller is arranged in the control unit 2, and the heater 51 is installed in the bottom wall and the side wall of the oxidation tank 11; the four groups of heaters 51 are centrally symmetrically distributed On the inner wall around the oxidation tank 11; a circulating water outlet plate 9 is arranged on the inner wall around the oxidation tank 1, and the circulating water outlet plate 9 matches the side wall width of the oxidation tank 11, and a plurality of circulating water outlets 7 are opened on the surface of the circulating water outlet plate 9, and a circulating water nozzle is installed on the circulating water outlet 7, and a water outlet channel is arranged in the circulating water outlet plate 9, and the water outlet channel is connected to the water inlet pipe 8, and the circulating water outlet 7 is connected to the water outlet channel, and a circulating water pump 10 is arranged on the water inlet pipe 8; a thermal insulation layer 13 is arranged in the wall of the oxidation tank 1, and the oxidation tank 11 A detachable insulation cover 14 is provided on the top; the circulation device 3 includes a box body 31, a buffer plate 32 is provided in the box body 31, and the buffer plate 32 divides the box body 31 into a water inlet chamber 33 and a water outlet chamber 34, the water inlet chamber 33 and the water outlet chamber 34 are connected at the top, and the bottom of the water inlet chamber 33 and the water outlet chamber 34 are separated by the buffer plate 32, and through holes 35 are provided on both sides of the bottom of the buffer plate 32, and the bottom of the water inlet chamber 33 and the water outlet chamber 34 are connected through the through holes 35, the reflux pipe 6 is connected to the top of the water inlet chamber 33, and the water inlet pipe 8 is connected to the bottom of the water outlet chamber 34.

[0018] Working process of the present invention: During the working process of the present invention, pure water is first added to the oxidation pool, and the outlet water must overflow the reflux water inlet. Then, chemical reagents for oxidation are added and stirred evenly, and a heat-insulating cover is put on. The ultrasonic unit, the heating unit and the circulation unit are turned on by the control unit. After heating to a specified temperature, the filler is hoisted by a crane and placed in the oxidation pool, so that the reaction liquid immerses the filler and an oxidation reaction is performed on the filler. During the reaction process, the crane drives the filler to move up and down in the reaction liquid so that it reacts evenly. At the same time, the reaction liquid moves continuously through the circulation unit and the ultrasonic unit so that the concentration and temperature at each location are kept consistent, so that the filler reacts quickly and evenly with the filler.

[0019] The above embodiments are intended to illustrate the present invention, not to limit the present invention. Any solution that is a simple transformation of the present invention belongs to the protection scope of the present invention.

Claims

1. A copper oxidation device, characterized in that: The invention comprises an oxidation pool (1), a control unit (2) and a circulation device (3), wherein an oxidation tank (1) is provided in the oxidation pool (1), an ultrasonic unit (4) and a heating unit (5) are provided in the oxidation tank (11), a return water inlet (12) is provided above the oxidation tank (11), the return water inlet (12) is connected to the circulation device (3) via a return pipe (6), and a circulation water outlet (7) is provided below the oxidation tank (11), the circulation water outlet (7) is connected to the circulation device (3) via a water inlet pipe (8).

2. The copper oxidation device according to claim 1, characterized in that: The ultrasonic unit (4) comprises an ultrasonic generator and an ultrasonic vibration plate (41), wherein the ultrasonic generator is connected to the ultrasonic vibration plate (41), the ultrasonic generator is arranged in the control unit (2), and the ultrasonic vibration plate (41) is installed in the oxidation tank (11).

3. The copper oxidation device according to claim 2, characterized in that: The ultrasonic vibration plate (41) is installed on the bottom wall and / or side wall of the oxidation tank (11).

4. The copper oxidation device according to claim 1, characterized in that: The heating unit (5) comprises a heater (51) and a temperature controller. A temperature sensor is provided in the oxidation tank (11). The temperature sensor is connected to the temperature controller. The heater (51) is connected to the temperature controller. The temperature controller is provided in the control unit (2). The heater (51) is installed on the bottom wall and / or side wall of the oxidation tank (11).

5. The copper oxidation device according to claim 4, characterized in that: The four groups of heaters (51) are centrally symmetrically distributed on the inner walls of the oxidation tank (11).

6. The copper oxidation device according to claim 1, characterized in that: A circulating water outlet plate (9) is provided on the inner walls of the oxidation pond (1), the circulating water outlet plate (9) matches the width of the side wall of the oxidation tank (11), a plurality of circulating water outlets (7) are provided on the surface of the circulating water outlet plate (9), a circulating water nozzle is installed on the circulating water outlet (7), a water outlet channel is provided in the circulating water outlet plate (9), the water outlet channel is connected to the water inlet pipe (8), the circulating water outlet (7) is connected to the water outlet channel, and a circulating water pump (10) is provided on the water inlet pipe (8).

7. The copper oxidation device according to claim 1, characterized in that: A thermal insulation layer (13) is provided in the wall of the oxidation pool (1), and a detachable thermal insulation cover (14) is provided on the top of the oxidation tank (11).

8. The copper oxidation device according to claim 1, characterized in that: The circulation device (3) comprises a box body (31), wherein a buffer plate (32) is provided in the box body (31), wherein the buffer plate (32) divides the box body (31) into a water inlet chamber (33) and a water outlet chamber (34), wherein the water inlet chamber (33) and the water outlet chamber (34) are connected at the top, and the water inlet chamber (33) and the water outlet chamber (34) are separated at the bottom by the buffer plate (32), through holes (35) are provided on both sides of the bottom of the buffer plate (32), and the bottoms of the water inlet chamber (33) and the water outlet chamber (34) are connected through the through holes (35), wherein the return pipe (6) is connected to the top of the water inlet chamber (33), and the water inlet pipe (8) is connected to the bottom of the water outlet chamber (34).

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