Temperature and pressure integrated sensing element, preparation method thereof and sensor

Abstract

The invention provides a temperature and pressure integrated sensing element, a preparation method thereof and a sensor, and the structure of the sensing element is characterized in that a first through channel and a second through channel are arranged between a ceramic substrate and a ceramic diaphragm of a pressure sensing chip base; a first L-shaped pin and a second L-shaped pin which are convenient to wrap are arranged on a seat disc of a boss base of the temperature sensing probe and are connected with a first exposed part and a second exposed part of a through needle, and when the temperature sensing probe is installed, only the first exposed part on the seat disc corresponds to a first through channel, and the second exposed part corresponds to a second through channel, so that the temperature sensing probe can be installed. A first through needle penetrates through a first through channel, a second through needle penetrates through a second through channel, a pin of a temperature sensing probe can be led to one side of a ceramic substrate of a pressure sensing chip base, and finally, the first through channel, the second through channel, a first exposed part and a second exposed part are sealed by epoxy glue. The problem that a temperature-sensing probe lead is inconvenient and easy to damage is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and in particular to a temperature and pressure integrated sensing element and a preparation method thereof, and a sensor. Background Art

[0002] Sensor technology is one of the important technologies of modern measurement and automation systems. Sensors are widely used in production process control and modern technological life. When temperature and pressure need to be measured in multiple places, it is often necessary to use integrated temperature and pressure sensors.

[0003] The sensing element of the temperature and pressure integrated sensor includes a temperature probe and a pressure chip base. The temperature probe is arranged on the deformation surface of the pressure chip base. In the existing temperature and pressure integrated sensor, the lead of the temperature probe needs to go through the side of the pressure chip base and go around to the back of the pressure chip base to connect with the back-end processing circuit. This lead method of the temperature probe is not convenient in the manufacturing process on the one hand, and is also easily damaged because the lead is exposed to the outside, which affects the reliability of the sensor.

[0004] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0005] The present invention provides a temperature and pressure integrated sensor element and a preparation method thereof, and a sensor, aiming to solve the technical problems mentioned in the background technology existing in the prior art.

[0006] The technical solution of the present invention is as follows: The first aspect of the present invention provides a method for preparing a temperature and pressure integrated sensor element, comprising: Providing a ceramic substrate and a ceramic diaphragm, wherein the ceramic substrate is pre-set with a first through hole, a second through hole and a plurality of PIN pin through holes, and the ceramic diaphragm is pre-set with a third through hole and a fourth through hole; Screen printing and sintering a pressure-sensitive circuit on the ceramic substrate and / or the ceramic diaphragm; Silk-screening and sintering an edge-sealing glass layer on the ceramic substrate or the circuit surface of the ceramic diaphragm; The ceramic substrate and the ceramic diaphragm are combined and sintered in a manner that the circuit surfaces face each other to obtain a pressure-sensitive chip base, on which a first through-channel is formed between the first through-hole and the third through-hole, and a second through-channel is formed between the second through-hole and the fourth through-hole; Providing a first L-shaped pin and a second L-shaped pin, placing the first L-shaped pin and the second L-shaped pin back to back and then performing injection molding to obtain a boss base, wherein a seat plate of the boss base is provided with a first exposed portion and a second exposed portion for connecting the first L-shaped pin and the second L-shaped pin to a through pin; An NTC temperature sensing head is welded to the vertical arm end of the first L-shaped pin and the vertical arm end of the second L-shaped pin, and a metal protective cover is used to connect the NTC temperature sensing head to the seat column of the boss base, so that the NTC temperature sensing head is covered in the metal protective cover to obtain a temperature sensing probe; Mounting the base plate of the temperature sensing probe on the ceramic diaphragm of the pressure sensing chip base, and making the first exposed portion correspond to the first through-channel and making the second exposed portion correspond to the second through-channel; Passing a first through-pin through the first through-channel to be electrically connected to the first L-shaped pin, passing a second through-pin through the second through-channel to be electrically connected to the second L-shaped pin, and passing a plurality of PIN pins through a plurality of the PIN pin through-holes to be electrically connected to the pressure sensing circuit; The first through-channel, the second through-channel, the first exposed portion, the second exposed portion and a plurality of the PIN pin holes are filled and sealed with epoxy glue to obtain a temperature and pressure integrated sensor element.

[0007] In some optional implementations of the first aspect of the present invention, if the pressure-sensing circuit is a capacitive pressure-sensing circuit, then the pressure-sensing circuit is screen-printed and sintered on the ceramic substrate and / or the ceramic diaphragm, including: A first electrode pattern is printed with gold silk screen and sintered on the circuit surface of the ceramic substrate, wherein the first electrode pattern includes a first electrode plate electrode and a first peripheral circuit surrounding the first electrode plate electrode; A second electrode pattern is screen-printed and sintered on the circuit surface of the ceramic diaphragm, wherein the second electrode pattern includes a second electrode plate electrode and a second peripheral circuit surrounding the second electrode plate electrode.

[0008] In some optional implementations of the first aspect of the present invention, if the pressure-sensing circuit is a resistive pressure-sensing circuit, then the pressure-sensing circuit is screen-printed and sintered on the ceramic substrate and / or the ceramic diaphragm, including: Printing a Wheatstone bridge circuit on the circuit surface of the ceramic diaphragm with gold silk screen and sintering it; The circuit resistor of the Wheatstone bridge is screen-printed and sintered on the circuit surface of the ceramic diaphragm. In some optional implementations of the first aspect of the present invention, the step of silk-screening and sintering an edge-sealing glass layer on the circuit surface of the ceramic substrate or the ceramic diaphragm comprises: A sealing glass layer is screen-printed and sintered on the circuit surface of the ceramic diaphragm, and the sealing glass layer surrounds the outer circle of the sensing body of the pressure sensing circuit; and the sealing glass layer is provided with a fifth through hole and a sixth through hole for respectively exposing the third through hole and the fourth through hole, and a plurality of avoidance holes for exposing a plurality of the PIN pin through holes.

[0009] A second aspect of the present invention provides a temperature and pressure integrated sensor element, which is manufactured by the preparation method of the temperature and pressure integrated sensor element described in any one of the first aspects of the present invention.

[0010] In some optional embodiments of the second aspect of the present invention, the temperature and pressure integrated sensor element includes a pressure sensing chip base and a temperature sensing probe; The pressure-sensitive chip base comprises a ceramic substrate, a ceramic diaphragm, an edge-sealed glass layer and a pressure-sensitive circuit; the pressure-sensitive circuit is arranged on the ceramic substrate and / or the ceramic diaphragm, the ceramic substrate and the ceramic diaphragm are connected through the edge-sealed glass layer laminate, a plurality of PIN pin through-holes are arranged on the ceramic substrate, and a first through-channel and a second through-channel are arranged between the ceramic substrate and the ceramic diaphragm; The temperature sensing probe comprises a boss base with a first L-shaped pin and a second L-shaped pin facing each other, an NTC temperature sensing head welded to the vertical arm end of the first L-shaped pin and the vertical arm end of the second L-shaped pin, and a metal protective cap connected to the seat column of the boss base and used to accommodate the NTC temperature sensing head; the seat plate of the boss base is provided with a first exposed portion and a second exposed portion for connecting the first L-shaped pin and the second L-shaped pin to a through pin; The seat plate of the temperature sensing probe is mounted on the ceramic diaphragm of the pressure sensing chip base, and the first exposed portion corresponds to the first through-channel and the second exposed portion corresponds to the second through-channel; A first through-pin is arranged in the first through-channel and electrically connected to the first L-shaped pin, a second through-pin is arranged in the second through-channel and electrically connected to the second L-shaped pin, and a plurality of PIN pins are arranged in the plurality of PIN pin through-holes and electrically connected to the pressure sensing circuit; the first through-channel, the second through-channel, the first exposed portion, the second exposed portion and the plurality of PIN pin through-holes are all filled and sealed with epoxy glue.

[0011] In some optional embodiments of the second aspect of the present invention, both the vertical arm end of the first L-shaped pin and the vertical arm end of the second L-shaped pin are provided with a step portion for facilitating lead welding of the NTC temperature sensing head.

[0012] In some optional embodiments of the second aspect of the present invention, reinforcing ribs are provided between the seat column and the seat plate of the boss base.

[0013] A third aspect of the present invention provides a temperature-pressure integrated sensor, comprising the temperature-pressure integrated sensor element as described in any one of the second aspects of the present invention.

[0014] In some optional embodiments of the third aspect of the present invention, the temperature and pressure integrated sensor also includes a sensor front shell that is adapted to the shape of the temperature and pressure integrated sensor element, the temperature and pressure integrated sensor element is accommodated in the sensor front shell and exposes a metal protective cap of the temperature sensing probe, and in the sensor front shell, a sealing ring is arranged between the pressure sensing chip base and the sensor front shell, and an FPC circuit and a connector are arranged on one side of the ceramic substrate of the pressure sensing chip base, and the connector is electrically connected to a first through pin, a second through pin and a plurality of PIN pins on the ceramic substrate through the FPC circuit.

[0015] The beneficial effects are as follows: the present invention provides a temperature and pressure integrated sensing element and a preparation method and a sensor thereof. In terms of the structure of the sensing element, the sensing element of the present invention is provided with a first through channel and a second through channel between the ceramic substrate and the ceramic diaphragm of the pressure-sensitive chip base, and a first exposed portion and a second exposed portion of a first L-shaped pin and a second L-shaped pin connecting a through needle are provided on the seat plate of the boss base of the temperature sensing probe for easy wrapping. When the temperature sensing probe is installed, it is only necessary to make the first exposed portion on the seat plate correspond to the first through channel, and the second exposed portion correspond to the second through channel, and then use the first through needle to pass through the first through channel and the second through needle to pass through the second through channel, so as to lead the pin of the temperature sensing probe to the ceramic substrate side of the pressure-sensitive chip base, and finally use epoxy glue to seal the first through channel, the second through channel, the first exposed portion and the second exposed portion, thereby solving the problem that the lead wires of the temperature sensing probe are inconvenient and easy to damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The present invention is a flowchart of a method for preparing a temperature and pressure integrated sensor element.

[0017] Figure 2 The figure is a schematic diagram of the structure of a temperature and pressure integrated sensor element of the present invention.

[0018] Figure 3 The present invention is a flowchart illustrating a method for preparing a pressure-sensitive chip base.

[0019] Figure 4 The present invention is a flowchart illustrating another method for preparing a pressure-sensitive chip base.

[0020] Figure 5 The present invention is a schematic diagram of the installation structure of a temperature sensing probe and a pressure sensing chip base.

[0021] Figure 6The present invention is a schematic diagram of the vertical arm end structure of a first L-shaped pin and a second L-shaped pin.

[0022] Figure 7 The figure is a schematic cross-sectional structure diagram of a temperature and pressure integrated sensor of the present invention.

[0023] Figure 8 This is a comparison chart of the assembly time of the temperature and pressure integrated sensor of the present invention and the prior art.

[0024] The reference numerals in the figures are as follows: 01-pressure sensing chip base; 02-temperature sensing probe; 10-ceramic base; 20-ceramic diaphragm; 30-first through hole; 40-second through hole; 50-PIN foot through hole; 60-third through hole; 70-fourth through hole; 80-pressure sensing circuit; 90-edge-sealed glass layer; 100-first through channel; 110-second through channel; 120-first L-shaped pin; 130-second L-shaped pin; 140-boss base; 150-first exposed part; 160-second exposed part Output part; 170-NTC temperature sensing head; 180-metal protective cover; 190-first pass needle; 200-second pass needle; 210-PIN needle; 220-first plate electrode; 230-first peripheral circuit; 240-second plate electrode; 250-second peripheral circuit; 260-circuit circuit; 270-circuit resistance; 280-step part; 290-reinforcement rib; 300-sensor front shell; 310-sealing ring; 320-FPC circuit; 330-connector. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0026] In the description of the present invention, it should be understood that if there are terms, the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present application.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0028] Reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, when the phrases "in one embodiment" or "in some embodiments" appear in various places throughout the specification, not all references are to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0029] See also Figure 1 The first aspect of the present invention provides a method for preparing a temperature and pressure integrated sensor element, see Figure 2 The temperature and pressure integrated sensor element includes a pressure sensing chip base 01 and a temperature sensing probe 02 arranged on the pressure sensing chip base 01. Figure 1 The preparation method of the temperature and pressure integrated sensor element comprises: S100, see Figure 3 and Figure 4 , providing a ceramic substrate 10 and a ceramic diaphragm 20, wherein the ceramic substrate 10 is pre-set with a first through hole 30, a second through hole 40 and a plurality of PIN pin through holes 50, and the ceramic diaphragm 20 is pre-set with a third through hole 60 and a fourth through hole 70; in the present invention, the ceramic substrate 10 and the ceramic diaphragm 20 are the main components of the pressure sensing chip base 01, and since the ceramic substrate 10 and the ceramic diaphragm 20 are both made of ceramic materials, a good insulation effect can be achieved. In the present invention, the thickness of the ceramic diaphragm 20 needs to satisfy that it can undergo a certain bending deformation, so as to facilitate subsequent manufacturing The pressure-sensitive chip base 01 can measure pressure by changing the spacing between the ceramic substrate 10 and the ceramic diaphragm 20; in addition, in the present invention, the first spacing between the first through hole 30 and the second through hole 40 on the ceramic substrate 10 and the second spacing between the third through hole 60 and the fourth through hole 70 on the ceramic diaphragm 20 need to be the same, so that after the ceramic substrate 10 and the ceramic diaphragm 20 are assembled, the first through hole 30 can correspond to the third through hole 60, and the second through hole 40 can correspond to the fourth through hole 70, so that the through needle can pass through.

[0030] S200, see Figure 3 and Figure 4, a pressure-sensing circuit 80 is screen-printed and sintered on the ceramic substrate 10 and / or the ceramic diaphragm 20; in the present invention, there are mainly two types of pressure-sensing circuits 80 on the ceramic substrate 10 and / or the ceramic diaphragm 20, one is a resistive pressure-sensing circuit, and the other is a capacitive pressure-sensing circuit, so step S200 of the present invention includes at least two implementation methods.

[0031] In a first optional implementation of step S200 of the present invention, see Figure 3 If the pressure sensing circuit 80 is a capacitive pressure sensing circuit, the pressure sensing circuit 80 is screen-printed and sintered on the ceramic substrate 10 and / or the ceramic diaphragm 20, including: screen-printing with gold (using gold as the screen-printing material) and sintering a first plate pattern on the circuit surface of the ceramic substrate 10, the first plate pattern including a first plate electrode 220 and a first peripheral circuit 230 surrounding the first plate electrode 220; screen-printing with gold and sintering a second plate pattern on the circuit surface of the ceramic diaphragm 20, the second plate pattern including a second plate electrode 240 and a second peripheral circuit 250 surrounding the second plate electrode 240. In this embodiment of the present invention, when the ceramic diaphragm 20 is bent and deformed, the distance between the first plate electrode 220 and the second plate electrode 240 will change, and the capacitance value between the first plate electrode 220 and the second plate electrode 240 will change. The corresponding pressure value can be converted by collecting and measuring the capacitance value between the first plate electrode 220 and the second plate electrode 240.

[0032] In a second optional implementation of step S200 of the present invention, see Figure 4 If the pressure sensing circuit 80 is a capacitive pressure sensing circuit, the pressure sensing circuit 80 screen-printed and sintered on the ceramic substrate 10 and / or the ceramic diaphragm 20 includes: If the pressure sensing circuit 80 is a resistive pressure sensing circuit, the pressure sensing circuit screen-printed and sintered on the ceramic substrate 10 and / or the ceramic diaphragm 20 includes: a circuit line 260 of a Wheatstone bridge is screen-printed and sintered on the circuit surface of the ceramic diaphragm 20; a circuit resistor 270 of the Wheatstone bridge is screen-printed (using resistor as screen-printing material) and sintered on the circuit surface of the ceramic diaphragm 20. In this embodiment of the present invention, when the ceramic diaphragm 20 is deformed, the resistance value of the circuit resistor 270 on the ceramic diaphragm 20 will change, and the output voltage of the Wheatstone bridge will change. By collecting the specific voltage value of the Wheatstone bridge, the corresponding pressure value can be converted.

[0033] S300, see Figure 3 and Figure 4, screen printing and sintering an edge-sealing glass layer 90 on the circuit surface of the ceramic substrate 10 or the ceramic diaphragm 20; in the present invention, the main function of the edge-sealing glass layer 90 is to connect the ceramic diaphragm 20 and the ceramic substrate 10 and simultaneously seal the pressure-sensing circuit 80 inside the gap between the ceramic diaphragm 20 and the ceramic substrate 10; in some optional embodiments of step S300 of the first aspect of the present invention, the screen printing and sintering of the edge-sealing glass layer 90 on the circuit surface of the ceramic diaphragm 20 includes: The circuit surface of the ceramic diaphragm 20 is screen-printed with glass (using glass glaze as the screen-printing material) and sintered with an edge-sealed glass layer 90, which surrounds the outer circle of the sensing body of the pressure-sensing circuit 80 (for example, the circuit resistor 270 of the resistance-sensing circuit or the second plate pattern of the capacitance-sensing circuit); and the edge-sealed glass layer 90 is provided with a fifth through hole and a sixth through hole for respectively exposing the third through hole 60 and the fourth through hole 70, and a plurality of avoidance holes for exposing a plurality of the PIN pin through holes 50. In this embodiment of step S300 of the present invention, since the corresponding holes are reserved on the edge-sealed glass layer 90, the through pin and the PIN pin can pass through the edge-sealed glass layer 90 more conveniently.

[0034] S400, see Figure 3 and Figure 4 The ceramic substrate 10 and the ceramic diaphragm 20 are assembled and sintered in a manner that the circuit surfaces face each other to obtain the pressure-sensitive chip base 01. On the pressure-sensitive chip base 01, a first through-channel 100 is formed between the first through-hole 30 and the third through-hole 60, and a second through-channel 110 is formed between the second through-hole 40 and the fourth through-hole 70. The assembled cross-sectional view of the pressure-sensitive chip base 01 can be as shown in FIG. Figure 4 shown.

[0035] S500, see Figure 5 , provide a first L-shaped pin 120 and a second L-shaped pin 130, and place the first L-shaped pin 120 and the second L-shaped pin 130 back to back and then perform injection molding to obtain a boss base 140, see Figure 2, the base plate of the boss base 140 is provided with a first exposed portion 150 and a second exposed portion 160 for facilitating the connection of the first L-shaped pin 120 and the second L-shaped pin 130 with a through needle; in this embodiment of the present invention, when the boss base 140 is installed on the ceramic diaphragm 20 of the pressure-sensing chip base 01, the first exposed portion 150 can cover the position of the third through hole 60 on the ceramic diaphragm 20, and the second exposed portion 160 can cover the position of the fourth through hole 70 on the ceramic diaphragm 20. In order to facilitate the through needle connection, the first L-shaped pin 120 of the first exposed portion 150 is provided with a first through hole, and the second L-shaped pin 130 of the second exposed portion 160 is provided with a second through hole. The third spacing between the first through hole and the second through hole on the bottom plate of the boss base 140 is equal to the second spacing between the third through hole 60 and the fourth through hole 70 on the ceramic diaphragm 20.

[0036] S600, see Figure 5 , an NTC temperature sensing head 170 is welded to the vertical arm end of the first L-shaped pin 120 and the vertical arm end of the second L-shaped pin 130, and a metal protective sleeve 180 is used to connect the seat column of the boss base 140, so that the NTC temperature sensing head is covered in the metal protective sleeve 180 to obtain a temperature sensing probe; in the present invention, in order to facilitate the connection of the two leads of the NTC temperature sensing head 170, the vertical arm end of the first L-shaped pin 120 and the vertical arm end of the second L-shaped pin 130 are both exposed to the seat column of the boss base 140, and the metal protective sleeve 180 is connected to the seat column of the boss base 140. The connection mode may be a detachable connection, so that the NTC temperature sensing head 170 can be replaced when it is damaged. In addition, in order to further improve the temperature sensing effect of the NTC temperature sensing head 170, a convex bulge for accommodating the NTC resistor of the NTC temperature sensing head 170 is provided at the end of the metal protective cover 180. The size of the convex bulge is adapted to the size of the NTC resistor, and the NTC resistor is in contact with the inner wall of the convex bulge. Through the above arrangement, the present invention can protect the NTC temperature sensing head 170 through the metal protective cover 180 while ensuring the temperature sensing effect of the NTC temperature sensing head 170.

[0037] S700, see Figure 5, the seat plate of the temperature sensing probe 02 is installed on the ceramic diaphragm 20 of the pressure sensing chip base 01, and the first exposed portion 150 corresponds to the first through channel 100 and the second exposed portion 160 corresponds to the second through channel 110; in the present invention, more specifically, the first through hole on the first L-shaped pin 120 of the first exposed portion 150 corresponds to the first through channel 100, and the second through hole on the second L-shaped pin 130 of the second exposed portion 160 corresponds to the second through channel 110. In the present invention, the first exposed portion 150 and the second exposed portion 160 not only facilitate the needle to pass through the through channel to connect the first L-shaped pin 120 and the second L-shaped pin 130, but also can use resin to firmly connect the seat plate and the ceramic diaphragm 20 when the first L-shaped pin 120 and the second L-shaped pin 130 are sealed by resin.

[0038] S800, see Figure 5 , the first through-pin 190 is passed through the first through-channel 100 to be electrically connected to the first L-shaped pin 120, the second through-pin 200 is passed through the second through-channel 110 to be electrically connected to the second L-shaped pin 130, and a plurality of PIN pins 210 are passed through a plurality of the PIN pin through-holes 50 to be electrically connected to the pressure sensing circuit 80; in the present invention, by means of setting the first exposed portion 150 and the second exposed portion 160 on the seat plate of the boss base 140, by using the first through-channel 100 and the second through-channel 110 on the ceramic diaphragm 20, the back-end processing circuit of the temperature sensing probe 02 The leads between the pressure-sensitive chip base 01 no longer need to go around to the rear end through the side of the pressure-sensitive chip base 01, thereby avoiding damage to the leads of the temperature sensing probe 02 caused by squeezing between the pressure-sensitive chip base 01 and the housing of the temperature and pressure integrated sensor, thereby improving the reliability of the temperature and pressure integrated sensor. Compared with bending the leads of the temperature sensing probe 02 to fit the side of the pressure-sensitive chip base 01, the temperature sensing probe 02 is led to the rear end of the pressure-sensitive chip base 01 through a through needle, and the processing method is more convenient. In addition, the through needle that penetrates the pressure-sensitive chip base 01 can be used to protect it, and the airtightness of the device can be improved by resin sealing.

[0039] S900, the first through channel 100, the second through channel 110, the first exposed portion 150, the second exposed portion 160 and the plurality of PIN pin through holes 50 are filled and sealed with epoxy glue to obtain a temperature and pressure integrated sensor element. As described in step S700 and step S800 of the present invention, after the first through channel 100, the second through channel 110, the first exposed portion 150, the second exposed portion 160 and the plurality of PIN pin through holes 50 are filled and sealed with epoxy glue, the sealing property of the device can be improved, thereby improving the reliability and service life of the temperature and pressure integrated sensor element.

[0040] Furthermore, the second aspect of the present invention provides a temperature and pressure integrated sensor element, which is manufactured by the preparation method of the temperature and pressure integrated sensor element described in any one of the first aspect of the present invention.

[0041] In some optional embodiments of the second aspect of the present invention, see Figure 2 The temperature and pressure integrated sensor element includes a pressure sensing chip base 01 and a temperature sensing probe 02.

[0042] See also Figure 3 and Figure 4 The pressure-sensitive chip base 01 includes a ceramic substrate 10, a ceramic diaphragm 20, an edge-sealed glass layer 90 and a pressure-sensitive circuit 80; the pressure-sensitive circuit 80 is arranged on the ceramic substrate 10 and / or the ceramic diaphragm 20, the ceramic substrate 10 and the ceramic diaphragm 20 are connected by the edge-sealed glass layer 90, and a plurality of PIN pin through holes 50 are arranged on the ceramic substrate 10, see Figure 5 A first through channel 100 and a second through channel 110 are disposed between the ceramic substrate 10 and the ceramic diaphragm 20 .

[0043] See also Figure 5 The temperature sensing probe 02 includes a boss base 140 with a first L-shaped pin 120 and a second L-shaped pin 130 facing each other, an NTC temperature sensing head 170 welded to the vertical arm end of the first L-shaped pin 120 and the vertical arm end of the second L-shaped pin 130, and a metal protective cap 180 connected to the seat column of the boss base 140 and used to accommodate the NTC temperature sensing head 170; the seat plate of the boss base 140 is provided with a first exposed portion 150 and a second exposed portion 160 for facilitating the connection of the first L-shaped pin 120 and the second L-shaped pin 130 with a through pin.

[0044] See also Figure 3 , Figure 4 and Figure 5The base plate of the temperature sensing probe 02 is mounted on the ceramic diaphragm 20 of the pressure sensing chip base 01 , and the first exposed portion 150 corresponds to the first through-channel 100 and the second exposed portion 160 corresponds to the second through-channel 110 .

[0045] See also Figure 2 and Figure 5 A first through-pin 190 is disposed in the first through-channel 100 and is electrically connected to the first L-shaped pin 120; a second through-pin 200 is disposed in the second through-channel 110 and is electrically connected to the second L-shaped pin 130; a plurality of PIN pins 210 are disposed in the plurality of PIN pin through-holes 50 and are electrically connected to the pressure sensing circuit 80; the first through-channel 100, the second through-channel 110, the first exposed portion 150, the second exposed portion 160 and the plurality of PIN pin through-holes 50 are all filled and sealed with epoxy glue.

[0046] See also Figure 6 In some optional embodiments of the second aspect of the present invention, the vertical arm end of the first L-shaped pin 120 and the vertical arm end of the second L-shaped pin 130 are both provided with a step portion 280 for facilitating the welding of the lead wires of the NTC temperature sensing head 170. In the present invention, in order to better ensure the conductive effect of the first L-shaped pin 120 and the second L-shaped pin 130, the material of the first L-shaped pin 120 and the second L-shaped pin 130 can be selected as flat copper. The present invention provides a step portion 280 at the vertical arm end of the first L-shaped pin 120 and the vertical arm end of the second L-shaped pin 130. During welding, the solder can be more firmly fixed on the end of the first L-shaped pin 120 and the end of the second L-shaped pin 130, thereby ensuring the connection quality of the lead wires of the NTC temperature sensing head 170.

[0047] See also Figure 2 In some optional embodiments of the second aspect of the present invention, a reinforcing rib 290 is provided between the seat column and the seat plate of the boss base 140. In order to facilitate the subsequent assembly of the reinforcing rib 290 into the sensor housing and to better ensure the reinforcing effect, the reinforcing rib 290 can be provided in a long strip shape, and in terms of height, the height of the reinforcing rib 290 is at least greater than one-third of the height of the seat column of the boss base 140. In order to prevent the boss base 140 from rotating after being assembled in the sensor housing, a slot for inserting the reinforcing rib 290 is provided at a corresponding position inside the sensor housing.

[0048] In addition, the third aspect of the present invention provides a temperature-pressure integrated sensor, comprising the temperature-pressure integrated sensor element described in any one of the second aspects of the present invention.

[0049] See also Figure 7In some optional embodiments of the third aspect of the present invention, the temperature and pressure integrated sensor also includes a sensor front shell 300 that is adapted to the shape of the temperature and pressure integrated sensor element, the temperature and pressure integrated sensor element is accommodated in the sensor front shell 300 and exposes the metal protection cap 180 of the temperature sensing probe 02, and in the sensor front shell 300, a sealing ring 310 is arranged between the pressure sensing chip base 01 and the sensor front shell 300, and an FPC circuit 320 and a connector 330 are arranged on one side of the ceramic substrate 10 of the pressure sensing chip base 01, and the connector 330 is electrically connected to the first through pin 190, the second through pin 200 and a plurality of PIN pins 210 on the ceramic substrate 10 through the FPC circuit 320.

[0050] See also Figure 8 In order to better illustrate the technical effect of saving time in manufacturing a sensor using the temperature and pressure integrated sensor element of the present invention, the present invention conducts statistics on the time consumption required for manufacturing processes of several existing temperature and pressure integrated sensors. Figure 8 It is not difficult to see that the time required to manufacture a sensor using the temperature and pressure integrated sensor element of the present invention is the shortest. In addition, the sensor manufactured based on the temperature and pressure integrated sensor element of the present invention has better sealing than the existing process, which can improve the reliability and service life of the sensor.

[0051] In summary, the present invention provides a temperature and pressure integrated sensing element and a preparation method and a sensor thereof. In terms of the structure of the sensing element, the sensing element of the present invention is provided with a first through channel and a second through channel between the ceramic substrate and the ceramic diaphragm of the pressure sensing chip base, and a first exposed portion and a second exposed portion for connecting the first L-shaped pin and the second L-shaped pin to a through needle are provided on a base plate of a boss base including a first L-shaped pin and a second L-shaped pin of the temperature sensing probe. When the temperature sensing probe is installed, it is only necessary to make the first exposed portion correspond to the first through channel and the second exposed portion correspond to the second through channel, and then use the first through needle to pass through the first through channel and the second through needle to pass through the second through channel, so that the pin of the temperature sensing probe can be led to one side of the ceramic substrate of the pressure sensing chip base, and finally the first through channel, the second through channel, the first exposed portion and the second exposed portion are sealed with epoxy glue, thereby solving the problem that the lead wires of the temperature sensing probe are inconvenient and easy to be damaged.

[0052] Although the present invention has been disclosed as above in terms of preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A method for preparing a temperature and pressure integrated sensor element, characterized in that: include: Providing a ceramic substrate and a ceramic diaphragm, wherein the ceramic substrate is pre-set with a first through hole, a second through hole and a plurality of PIN pin through holes, and the ceramic diaphragm is pre-set with a third through hole and a fourth through hole; Screen printing and sintering a pressure-sensitive circuit on the ceramic substrate and / or the ceramic diaphragm; Silk-screening and sintering an edge-sealing glass layer on the ceramic substrate or the circuit surface of the ceramic diaphragm; The ceramic substrate and the ceramic diaphragm are combined and sintered in a manner that the circuit surfaces face each other to obtain a pressure-sensitive chip base, on which a first through-channel is formed between the first through-hole and the third through-hole, and a second through-channel is formed between the second through-hole and the fourth through-hole; Providing a first L-shaped pin and a second L-shaped pin, placing the first L-shaped pin and the second L-shaped pin back to back and then performing injection molding to obtain a boss base, wherein a seat plate of the boss base is provided with a first exposed portion and a second exposed portion for connecting the first L-shaped pin and the second L-shaped pin to a through pin; An NTC temperature sensing head is welded to the vertical arm end of the first L-shaped pin and the vertical arm end of the second L-shaped pin, and a metal protective cover is used to connect the NTC temperature sensing head to the seat column of the boss base, so that the NTC temperature sensing head is covered in the metal protective cover to obtain a temperature sensing probe; Mounting the base plate of the temperature sensing probe on the ceramic diaphragm of the pressure sensing chip base, and making the first exposed portion correspond to the first through-channel and making the second exposed portion correspond to the second through-channel; Passing a first through-pin through the first through-channel to be electrically connected to the first L-shaped pin, passing a second through-pin through the second through-channel to be electrically connected to the second L-shaped pin, and passing a plurality of PIN pins through a plurality of the PIN pin through-holes to be electrically connected to the pressure sensing circuit; The first through-channel, the second through-channel, the first exposed portion, the second exposed portion and a plurality of the PIN pin holes are filled and sealed with epoxy glue to obtain a temperature and pressure integrated sensor element.

2. The method for preparing the temperature and pressure integrated sensor element according to claim 1, characterized in that: If the pressure-sensing circuit is a capacitive pressure-sensing circuit, the step of screen-printing and sintering the pressure-sensing circuit on the ceramic substrate and / or the ceramic diaphragm includes: A first electrode pattern is printed with gold silk screen and sintered on the circuit surface of the ceramic substrate, wherein the first electrode pattern includes a first electrode plate electrode and a first peripheral circuit surrounding the first electrode plate electrode; A second electrode pattern is screen-printed and sintered on the circuit surface of the ceramic diaphragm, wherein the second electrode pattern includes a second electrode plate electrode and a second peripheral circuit surrounding the second electrode plate electrode.

3. The method for preparing the temperature and pressure integrated sensor element according to claim 1, characterized in that: If the pressure-sensing circuit is a resistance pressure-sensing circuit, the step of screen-printing and sintering the pressure-sensing circuit on the ceramic substrate and / or the ceramic diaphragm includes: Printing a Wheatstone bridge circuit on the circuit surface of the ceramic diaphragm with gold silk screen and sintering it; The circuit resistor of the Wheatstone bridge is screen-printed and sintered on the circuit surface of the ceramic diaphragm.

4. The method for preparing the temperature and pressure integrated sensor element according to claim 1, characterized in that: The method of silk-screening and sintering an edge-sealing glass layer on the circuit surface of the ceramic substrate or the ceramic diaphragm comprises: A sealing glass layer is screen-printed and sintered on the circuit surface of the ceramic diaphragm, and the sealing glass layer surrounds the outer circle of the sensing body of the pressure sensing circuit; and the sealing glass layer is provided with a fifth through hole and a sixth through hole for respectively exposing the third through hole and the fourth through hole, and a plurality of avoidance holes for exposing a plurality of the PIN pin through holes.

5. A temperature and pressure integrated sensor element, characterized in that: The temperature-pressure integrated sensor element is manufactured by the preparation method of the temperature-pressure integrated sensor element according to any one of claims 1-4.

6. The temperature and pressure integrated sensor element according to claim 5, characterized in that: The temperature and pressure integrated sensor element comprises a pressure sensing chip base and a temperature sensing probe; The pressure-sensitive chip base comprises a ceramic substrate, a ceramic diaphragm, an edge-sealed glass layer and a pressure-sensitive circuit; the pressure-sensitive circuit is arranged on the ceramic substrate and / or the ceramic diaphragm, the ceramic substrate and the ceramic diaphragm are connected through the edge-sealed glass layer laminate, a plurality of PIN pin through-holes are arranged on the ceramic substrate, and a first through-channel and a second through-channel are arranged between the ceramic substrate and the ceramic diaphragm; The temperature sensing probe comprises a boss base with a first L-shaped pin and a second L-shaped pin facing each other, an NTC temperature sensing head welded to the vertical arm end of the first L-shaped pin and the vertical arm end of the second L-shaped pin, and a metal protective cap connected to the seat column of the boss base and used to accommodate the NTC temperature sensing head; the seat plate of the boss base is provided with a first exposed portion and a second exposed portion for connecting the first L-shaped pin and the second L-shaped pin to a through pin; The seat plate of the temperature sensing probe is mounted on the ceramic diaphragm of the pressure sensing chip base, and the first exposed portion corresponds to the first through-channel and the second exposed portion corresponds to the second through-channel; A first through-pin is arranged in the first through-channel and electrically connected to the first L-shaped pin, a second through-pin is arranged in the second through-channel and electrically connected to the second L-shaped pin, and a plurality of PIN pins are arranged in the plurality of PIN pin through-holes and electrically connected to the pressure sensing circuit; the first through-channel, the second through-channel, the first exposed portion, the second exposed portion and the plurality of PIN pin through-holes are all filled and sealed with epoxy glue.

7. The temperature and pressure integrated sensor element according to claim 6, characterized in that: The vertical arm end of the first L-shaped pin and the vertical arm end of the second L-shaped pin are both provided with a step portion for facilitating the lead welding of the NTC temperature sensing head.

8. The temperature and pressure integrated sensor element according to claim 6, characterized in that: Reinforcing ribs are arranged between the seat column and the seat plate of the boss base.

9. A temperature and pressure integrated sensor, characterized in that: It comprises the temperature and pressure integrated sensor element as described in any one of claims 5-8.

10. The temperature and pressure integrated sensor according to claim 9, characterized in that: The temperature and pressure integrated sensor also includes a sensor front shell that is adapted to the shape of the temperature and pressure integrated sensor element. The temperature and pressure integrated sensor element is accommodated in the sensor front shell and exposes a metal protective cap of the temperature sensing probe. In the sensor front shell, a sealing ring is arranged between the pressure sensing chip base and the sensor front shell. An FPC circuit and a connector are arranged on one side of the ceramic substrate of the pressure sensing chip base. The connector is electrically connected to a first through pin, a second through pin and a plurality of PIN pins on the ceramic substrate through the FPC circuit.

Images