A device for detecting deformation of nickel-titanium alloy gaskets at different temperatures

Abstract

The present invention discloses a deformation variable detection device for nickel-titanium alloy gaskets at different temperatures, which relates to the field of gasket detection and includes an operating base, a support frame and a processing table are installed on the top of the operating base, a torsion motor is installed on the top of the support frame, the output end of the torsion motor faces downward and the output end of the torsion motor is connected to an extrusion cylinder, and the extrusion cylinder is located directly above the processing table, a torsion table is installed on the top of the processing table, and multiple groups of limiting mechanisms are evenly distributed on the outer side of the torsion table at the top of the processing table. The present invention, through the processing table, torsion motor, extrusion cylinder, limiting mechanism, torsion table and positioning mechanism, can drive the limiting mechanism to move through the positioning mechanism when processing the gasket, and the limiting mechanism positions and clamps the gasket, making it convenient for the gasket to be aligned with each group of equipment, and then start the extrusion cylinder to drive the pressure plate to move downward, clamping the gasket between the fixed plate and the torsion table.

Description

Technical Field

[0001] The invention relates to the field of gasket detection, in particular to a device for detecting the deformation of a nickel-titanium alloy gasket at different temperatures. Background Art

[0002] Nitinol gaskets, an alloy composed of nickel and titanium, are commonly known as "memory alloys" or "shape memory alloys," and possess unique properties. They can restore their original shape under specific temperature changes, making them widely used in devices requiring temperature response or shape recovery. During the gasket production process, the gasket's deformation needs to be measured. Existing measurements typically utilize various equipment, such as stretching, extrusion, and bending. Nitinol gaskets, due to their unique physical properties, require temperature adjustment during testing, requiring the degree of deformation to be measured at different temperatures.

[0003] Prior art, such as China Publication No. CN219694721U, discloses a torque testing machine for a DNC friction pad, comprising a casing, a motor installed inside the casing, a support rod installed on the upper surface of the casing, a bracket installed on the upper end of the support rod, limiting grooves are provided on both sides of the middle of the bracket, a fixing valve for fixing to the support rod is installed on one side of the bracket, a fixing rod is installed in the middle of the bracket, a fixing plate is installed inside the fixing rod, and a group of fixing components are provided below the fixing plate.

[0004] During use, the gasket is not treated by temperature changes, so the changes of the gasket at different temperatures cannot be detected. Moreover, in the existing technology, the gasket is usually treated only by heating, but the use environment of the gasket usually also includes a low-temperature environment. Therefore, the detection range of the existing technology is relatively small. Secondly, in the process of detecting the gasket, the gasket is detected by torsional friction. At this time, the gasket is fixed by a clamping mechanism at the edge, but under normal use conditions, the fixing force on the gasket is fixed by the friction force of the fit with external components. Therefore, during the torsion process, clamping the gasket from the edge will interfere with the detection effect of the gasket. Summary of the Invention

[0005] Based on this, the purpose of the present invention is to provide a deformation detection device for nickel-titanium alloy gaskets at different temperatures to solve the technical problems that the existing technology cannot perform different temperature treatments on gaskets and the clamping device causes interference to the gasket during detection.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a deformation variable detection device for a nickel-titanium alloy gasket at different temperatures, comprising an operating base, a support frame and a processing table are installed on the top of the operating base, a torsion motor is installed on the top of the support frame, the output end of the torsion motor faces downward and the output end of the torsion motor is connected to an extrusion cylinder, and the extrusion cylinder is located directly above the processing table, a torsion table is installed on the top of the processing table, the outer side of the torsion table is located at the top of the processing table and multiple groups of limit mechanisms are evenly distributed, a top plate is installed inside the torsion table, and the top of the top plate is provided with multiple groups of grooves running through the top and bottom of the top plate, and the top plate is provided with a plurality of grooves running through the top and bottom of the top plate. Semiconductor cooling fins are rotatably connected in multiple groups of grooves. The operating base is located below the processing table and is equipped with an adjusting cylinder. The output end of the adjusting cylinder is connected to a driving disk. The top of the driving disk is connected to a movable disk. The bottom end of the movable disk is connected to a support column. The movable disk is fixedly connected to the driving disk through the support column. Multiple groups of heat exchangers are installed on the top of the movable disk, and each group of heat exchangers is aligned with the bottom of the semiconductor cooling fins. The top plate is located on the side of each group of semiconductor cooling fins and is connected to a power supply structure. The power supply structure supplies power to the semiconductor cooling fins. The outside of the processing table is connected to a ventilation mechanism, and the ventilation mechanism is connected to the heat exchanger.

[0007] By adopting the above technical solution, the gasket can be conveniently positioned, and after positioning, the temperature of the gasket can be adjusted by the semiconductor refrigeration sheet, so that the gasket can be conveniently treated at different temperatures.

[0008] The present invention is further configured such that a support plate is provided on the outside of the processing table, the support plate supports the processing table, and the ventilation mechanism is installed on the outer wall of the support plate.

[0009] As a preference, it is possible to facilitate gas exchange between the ventilation mechanism and the outside air.

[0010] The present invention is further configured such that the output end of the extrusion cylinder is connected to a pressure plate, and the bottom end of the pressure plate is connected to a fixed plate, and a temperature sensor is installed on the top of the fixed plate, the detection end of the temperature sensor extends to the bottom of the fixed plate, and the fixed plate is aligned with the top of the torsion table.

[0011] As a preferred embodiment, the gasket is conveniently clamped, and after clamping, the temperature of the gasket is detected by a temperature sensor.

[0012] The present invention is further configured such that the ventilation mechanism includes a first ventilator and a second ventilator, the end of the first ventilator is connected to a first pipe, the end of the second ventilator is connected to a second pipe, the first ventilator and the second ventilator are connected to the heat exchanger through the first pipe, the second pipe and the heat exchanger, the ends of the first ventilator and the second ventilator are both installed with a shielding net, the interior of the first ventilator and the second ventilator are both installed with a ventilation component, and the ventilation component is composed of a motor and fan blades.

[0013] Preferably, the delivery direction of the ventilator can be adjusted according to needs, so as to facilitate the airflow to enter the heat exchanger from different directions, so that the airflow can lift the adjustment plate in different directions.

[0014] The present invention is further configured such that a side pressure sensing mechanism is installed on the side of the limiting mechanism, and an extrusion block is installed on the side of the side pressure sensing mechanism, and the side pressure sensing mechanism is fitted with the edge of the gasket through the extrusion block. The interior of the limiting mechanism is hollow, and the side pressure sensing mechanism is installed inside the hollow interior of the limiting mechanism. Two sets of outer shells are installed on the outside of the limiting mechanism, and a positioning rod is installed inside the outer shell, and the outer shell is fixed by the positioning rod.

[0015] As a preferred embodiment, the position of the gasket can be easily adjusted, so that the gasket can be easily aligned.

[0016] The present invention is further configured to include a positioning mechanism, which includes an adjusting cylinder, a fixing rod and a base plate. The fixing rod is fixed to the output end of the adjusting cylinder, and the limiting mechanism is sleeved on the top end of the fixing rod. The limiting mechanism is movably connected to the fixing rod through a reset spring. The top end of the base plate is connected to an output wire, and the output wire is connected to the side pressure sensing mechanism. The bottom end of the base plate is connected to multiple groups of reinforcing ribs.

[0017] Preferably, the position of the limiting mechanism can be adjusted by a positioning mechanism to facilitate clamping of the gasket.

[0018] The present invention is further configured such that the top plate is provided with a groove on the side surface of each group of semiconductor refrigeration plates, a flexible power transmission sheet is installed in the middle position of the groove, the flexible power transmission sheet includes a fixed insulating sheet, a second power connection rod and a torsion spring rod, the two ends of the flexible power transmission sheet are respectively fixedly connected to the fixed insulating sheet and the second power connection rod, the fixed insulating sheet is fixed to the top end of the torsion spring rod, the torsion spring rod is rotatably connected to the inner wall of the top plate, the side surface of the flexible power transmission sheet is connected to a power supply, the second power connection rod is inserted into the interior of the power supply, the bottom end of the power supply is connected to a power transmission line, and the power transmission line is connected to an external power supply.

[0019] As a preference, it is convenient to supply power to the semiconductor refrigeration sheet, and when the semiconductor refrigeration sheet rotates, the flexible power transmission sheet can be attached to the semiconductor refrigeration sheet at different angles, thereby facilitating power supply.

[0020] The present invention is further configured such that two groups of first power connection rods are connected to the side of the semiconductor refrigeration plate, each group of the first power connection rods is located inside the slot, and a rotating shaft is provided on the side of the semiconductor refrigeration plate, and the semiconductor refrigeration plate is rotatably connected to the top plate through the rotating shaft, and a sliding groove matching the rotation trajectory of the first power connection rod is provided inside the slot.

[0021] As a preferred embodiment, it is possible to facilitate the bonding of the semiconductor refrigeration sheet and the flexible power transmission sheet.

[0022] The present invention is further configured such that two groups of adjustment plates are symmetrically installed at the top of the heat exchanger, the adjustment plates are rotatably connected to the heat exchanger, and the bottom end of each group of adjustment plates is connected to a guide surface, and two groups of connecting heads are installed at the bottom end of the heat exchanger, and the connecting heads are respectively connected to the first ventilator and the second ventilator, and the two groups of connecting heads are respectively aligned with the bottom ends of the two groups of adjustment plates.

[0023] As a preferred embodiment, the heat exchanger is convenient for adjusting the angle of the semiconductor refrigeration plate.

[0024] In summary, the present invention mainly has the following beneficial effects:

[0025] The present invention is equipped with a processing table, a torsion motor, an extrusion cylinder, a limit mechanism, a torsion table and a positioning mechanism. When processing the gasket, the positioning mechanism drives the limit mechanism to move, and the limit mechanism positions and clamps the gasket, which is convenient for aligning the gasket with each group of equipment. Then, the extrusion cylinder is started to drive the pressure plate to move downward, clamping the gasket between the fixed plate and the torsion table, and then the torsion motor is started to perform a torsion test on the gasket.

[0026] The set adjustment cylinder, semiconductor refrigeration plate, ventilation mechanism, movable disk, top plate, flexible power transmission plate and heat exchanger can start the ventilation mechanism according to the gasket processing method, such as heating or cooling, before placing the gasket. The ventilation mechanism pushes the adjustment plates at different positions to rotate, and the adjustment plates at different positions will contact different positions of the semiconductor refrigeration plate. The adjustment cylinder pushes the movable disk upward, so that the adjustment plate rotates the semiconductor refrigeration plate. When cooling, the cooling surface of the semiconductor refrigeration plate faces upward, and the heat-generating surface is in contact with the heat exchanger. When heating, the heat-generating surface of the semiconductor refrigeration plate faces upward, and the cooling surface is in contact with the heat exchanger, thereby realizing heating or cooling of the gasket and improving the detection range. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of the present invention;

[0028] Figure 2 This is a schematic structural diagram of the torsion motor and the extrusion cylinder of the present invention;

[0029] Figure 3 It is a structural schematic diagram of the cross section of the processing table of the present invention;

[0030] Figure 4 It is a structural schematic diagram of the positioning mechanism of the present invention;

[0031] Figure 5This is a schematic diagram of the exploded structure of the positioning mechanism of the present invention;

[0032] Figure 6 Schematic diagram of the structure of the ventilation mechanism of the present invention;

[0033] Figure 7 Schematic diagram of the cross-section of the ventilation mechanism of the present invention;

[0034] Figure 8 It is a structural schematic diagram of the torsion platform of the present invention;

[0035] Figure 9 Schematic diagram of the structure of the top plate of the present invention;

[0036] Figure 10 It is a structural schematic diagram of the top plate and the movable disk of the present invention;

[0037] Figure 11 For the present invention Figure 11 Schematic diagram of the local enlarged structure at A in the middle;

[0038] Figure 12 Schematic diagram of the structure of the flexible power transmission sheet of the present invention;

[0039] Figure 13 This is a schematic structural diagram of the semiconductor refrigeration plate of the present invention when it rotates;

[0040] Figure 14 Schematic diagram of the structure of the heat exchanger and semiconductor refrigeration plate of the present invention;

[0041] Figure 15 It is a structural schematic diagram of the cross section of the heat exchanger of the present invention.

[0042] Description of reference numerals:

[0043] 1. Operating base; 101. Support frame; 102. Adjusting cylinder; 2. Processing table; 201. Support plate; 3. Torsion motor; 4. Extrusion cylinder; 401. Pressing plate; 402. Fixing plate; 403. Temperature sensor; 5. Operating panel; 6. Ventilation mechanism; 601. First ventilator; 602. Second ventilator; 603. First pipeline; 604. Second pipeline; 605. Shielding net; 606. Ventilation assembly; 7. Limiting mechanism; 701. Side pressure sensing mechanism; 7011. Extrusion block; 702. Return spring; 703. Positioning rod; 8. Torsion table ;9. Positioning mechanism;901. Adjusting cylinder;902. Fixed rod;903. Output wire;904. Bottom plate;905. Reinforcement rib;10. Drive disk;11. Semiconductor refrigeration plate;1101. First power connection pole;12. Movable disk;1201. Support column;13. Top plate;1301. Slot;14. Flexible power transmission plate;1401. Fixed insulating plate;1402. Second power connection pole;1403. Torsion spring rod;15. Power supply;1501. Power transmission line;16. Heat exchanger;1601. Adjustment plate;1602. Guide surface;1603. Connector. DETAILED DESCRIPTION

[0044] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0045] The following describes an embodiment of the present invention based on its overall structure. Example

[0046] See also Figures 1 to 4, including an operating base 1, a support frame 101 and a processing table 2 are installed on the top of the operating base 1, a torsion motor 3 is installed on the top of the support frame 101, the output end of the torsion motor 3 faces downward and the output end of the torsion motor 3 is connected to the extrusion cylinder 4, and the extrusion cylinder 4 is located directly above the processing table 2, and a torsion table 8 is installed on the top of the processing table 2, the output end of the extrusion cylinder 4 is connected to a pressing plate 401, and the bottom end of the pressing plate 401 is connected to a fixed plate 402, and a temperature sensor 403 is installed on the top of the fixed plate 402, the detection end of the temperature sensor 403 extends to the bottom of the fixed plate 402, and the fixed plate 402 is aligned with the top of the torsion table 8. When testing the gasket, the gasket is first placed on the torsion table 8, and the outer side of the torsion table 8 is located at the top of the processing table 2. There are multiple groups of limit mechanisms 7 evenly distributed, and the side of the limit mechanism 7 is installed with a side pressure sensing mechanism 701, and the side of the side pressure sensing mechanism 701 is installed with an extrusion block 7 011, the side pressure sensing mechanism 701 is fitted with the edge of the gasket through the extrusion block 7011, the interior of the limiting mechanism 7 is hollow, and the side pressure sensing mechanism 701 is installed in the hollow interior of the limiting mechanism 7, two sets of shells are installed on the outside of the limiting mechanism 7, and a positioning rod 703 is installed inside the shell, and the shell is fixed by the positioning rod 703, the positioning mechanism 9 includes an adjusting cylinder 901, a fixing rod 902 and a bottom plate 904, the fixing rod 902 is fixed to the output end of the adjusting cylinder 901, the limiting mechanism 7 is sleeved on the top of the fixing rod 902, the limiting mechanism 7 is movably connected to the fixing rod 902 through the return spring 702, the top of the bottom plate 904 is connected to the output wire 903, the output wire 903 is connected to the side pressure sensing mechanism 701, and the bottom end of the bottom plate 904 is connected to multiple sets of reinforcing ribs 905. After the gasket is placed, the limiting mechanism 7 can be driven to move by the adjusting cylinder 901, so that the limiting mechanism 7 clamps and positions the gasket.

[0047] See also Figures 6 to 11, a top plate 13 is installed inside the torsion table 8, and the top of the top plate 13 is provided with multiple groups of grooves running through the top plate 13 from top to bottom, and the multiple grooves of the top plate 13 are rotatably connected to the semiconductor cooling plate 11, the operating base 1 is located below the processing table 2 and is installed with an adjusting cylinder 102, the output end of the adjusting cylinder 102 is connected to the driving disk 10, the top of the driving disk 10 is connected to the movable disk 12, the bottom end of the movable disk 12 is connected to the supporting column 1201, the movable disk 12 is fixedly connected to the driving disk 10 through the supporting column 1201, and multiple groups of heat exchangers 16 are installed on the top of the movable disk 12, and each group of heat exchangers 16 is aligned with the bottom of the semiconductor cooling plate 11, the top plate 13 is located on the side of each group of semiconductor cooling plates 11. A flexible power transmission sheet 14 is installed in the middle position of the slot 1301, and the flexible power transmission sheet 14 includes a fixed insulating sheet 1401, a second power connecting rod 1402 and a torsion spring rod 1 403, the two ends of the flexible power transmission sheet 14 are fixedly connected to the fixed insulating sheet 1401 and the second power connecting rod 1402 respectively, the fixed insulating sheet 1401 is fixed to the top of the torsion spring rod 1403, the torsion spring rod 1403 is rotatably connected to the inner wall of the top plate 13, the side of the flexible power transmission sheet 14 is connected to the power supply 15, the second power connecting rod 1402 is inserted into the power supply 15, the bottom end of the power supply 15 is connected to the power supply line 1501, and the power transmission line 1501 is connected to the external power supply, the side of the semiconductor refrigeration sheet 11 is connected to two groups of first power connecting rods 1101, each group of first power connecting rods 1101 is located inside the slot 1301, and a rotating shaft is provided on the side of the semiconductor refrigeration sheet 11, the semiconductor refrigeration sheet 11 is rotatably connected to the top plate 13 through the rotating shaft, and a sliding groove matching the rotation trajectory of the first power connecting rod 1101 is provided inside the slot 1301, so that the semiconductor refrigeration sheet 11 can be easily rotated.

[0048] Further, see Figures 6 to 15, the outside of the processing table 2 is connected to a ventilation mechanism 6, the ventilation mechanism 6 includes a first ventilation machine 601 and a second ventilation machine 602, the end of the first ventilation machine 601 is connected to a first pipe 603, the end of the second ventilation machine 602 is connected to a second pipe 604, the first ventilation machine 601 and the second ventilation machine 602 are connected to the heat exchanger 16 through the first pipe 603 and the second pipe 604, the first ventilation machine 601 and the second ventilation machine 602 are connected to the heat exchanger 16, the ends of the first ventilation machine 601 and the second ventilation machine 602 are both installed with a shielding net 605, the interior of the first ventilation machine 601 and the second ventilation machine 602 are both installed with a ventilation component 606, the ventilation component 606 is composed of a motor and a fan blade, the top of the heat exchanger 16 is symmetrically installed with two groups of adjustment plates 1601, the adjustment plates 1601 are rotatably connected to the heat exchanger 16, and the bottom end of each group of adjustment plates 1601 is connected to the guide surface 1 602. Two groups of connectors 1603 are installed at the bottom end of the heat exchanger 16, and the connectors 1603 are respectively connected to the first ventilator 601 and the second ventilator 602. The two groups of connectors 1603 are respectively aligned with the bottom ends of the two groups of adjustment plates 1601, and can circulate through the airflow in the heat exchanger 16 to exchange the temperature changes generated by the semiconductor refrigeration plate 11 with the outside world, thereby improving the heat exchange effect. Before heat exchange, the direction of the airflow can be changed according to the treatment method of the gasket, so that the airflow pushes different adjustment plates 1601 to unfold. During the rising process of the adjustment cylinder 102, the heat exchanger 16 will be pushed to move upward, so that different adjustment plates 1601 can push the semiconductor refrigeration plate 11 to rotate at different angles, so that the semiconductor refrigeration plate 11 will face different sides upward according to needs, thereby facilitating different heating of the gasket.

[0049] In the above embodiment, please refer to Figure 1 A support plate 201 is provided on the outside of the processing table 2 to support the processing table 2. The ventilation mechanism 6 is installed on the outer wall of the support plate 201 to facilitate the support of the ventilation mechanism 6 and enable the ventilation mechanism 6 to exchange air and heat with the outside air.

[0050] Before use, first adjust the position of the semiconductor refrigeration plate 11 according to whether the gasket detects high temperature or low temperature. If cooling is required, start the first ventilator 601 in the forward direction and the second ventilator 602 in the reverse direction. The first ventilator 601 draws outside air into the heat exchanger 16, and the airflow blows up the adjustment plate 1601 on the right side. Then start the adjustment cylinder 102 to move upward, and the adjustment plate 1601 on the right side first contacts the side of the semiconductor refrigeration plate 11, thereby first pushing the semiconductor refrigeration plate 11 to rotate, so that the cooling surface of the semiconductor refrigeration plate 11 rotates upward. When the heat exchanger 16 is in contact with the semiconductor refrigeration plate 11, the right adjustment plate 1601 is closed by squeezing, and the heat exchanger 16 and the ventilation mechanism 6 form a complete ventilation channel, and the heat exchanger 16 is in contact with the heat generating surface of the semiconductor refrigeration plate 11.

[0051] When heating is required, the first ventilator 601 is started in the reverse direction and the second ventilator 602 is started in the forward direction. The second ventilator 602 draws outside air into the heat exchanger 16, and the airflow blows up the adjustment piece 1601 on the left side. Then the above operation is repeated. The adjustment piece on the left side first contacts the side of the semiconductor cooling plate 11, thereby first pushing the semiconductor cooling plate 11 to rotate, so that the heat generating surface of the semiconductor cooling plate rotates upward. When the heat exchanger 16 and the semiconductor cooling plate 11 are in contact, the adjustment piece 1601 on the left side is squeezed and closed, and the heat exchanger 16 and the cooling surface of the semiconductor cooling plate 11 are in contact.

[0052] When testing the gasket, first place the gasket on the processing table 2 and place it above the torsion table 8. Then start the adjusting cylinder 901, which drives the fixing rod 902 to move. The fixing rod 902 drives the top limit mechanism 7 to move to clamp and limit the gasket so that the gasket can be aligned with the torsion testing equipment. After the adjustment is completed, start the adjusting cylinder 901 again to slightly separate the limit mechanism 7 from the gasket until the side pressure sensing mechanism 701 senses the pressure returns to zero, at which point the movement stops.

[0053] Then, the extrusion cylinder 4 is started, which drives the pressure plate 401 at the output end close to the gasket. At this time, the edge of the pressure plate 401 pushes the limit mechanism 7 to move downward. The limit mechanism 7 slides downward on the top of the fixing rod 902 and squeezes the return spring 702 until the fixing plate 402 is in contact with the gasket. At this time, the side pressure sensing mechanism 701 is still in contact with the outer side of the gasket.

[0054] Then, the power supply 15 is powered through the transmission line 1501, and the power supply 15 powers each group of flexible power transmission sheets 14. At this time, different temperatures are generated at the two ends of the semiconductor refrigeration sheet 11. The cooling surface of the semiconductor refrigeration sheet 11 generates a low temperature, and the heat-generating surface generates a high temperature. When cooling, the cooling surface of the semiconductor refrigeration sheet 11 is facing upward, and the heat-generating surface is in contact with the heat exchanger 16. At this time, the ventilation mechanism 6 is started, and the first ventilator 601 and the second ventilator 602 in the ventilation mechanism run in opposite directions, thereby driving the air flow to flow through the first ventilator 601, the first pipe 603, the heat exchanger 16, the second pipe 604 and the second ventilator 602, and the heat exchanger 16 is located below the semiconductor refrigeration sheet 11. At this time, the heat exchanger The airflow in 16 will dissipate the heat from the heat-generating surface of the semiconductor refrigeration sheet 11, thereby cooling it. At this time, the cooling surface of the semiconductor refrigeration sheet 11 cools the gasket. During the cooling process, the temperature sensor 403 at the top of the fixing plate 402 will measure the temperature of the gasket. When the appropriate temperature is reached, the cooling of the semiconductor refrigeration sheet 11 will be stopped. If heating is required, the heat-generating surface of the semiconductor refrigeration sheet 11 will face upward, and the cooling surface will be attached to the heat exchanger 16. The subsequent operation is the same as the above operation, but at this time the cooling surface will continuously absorb the heat from the outside air, thereby achieving temperature increase. The heat-generating surface of the semiconductor refrigeration sheet 11 will heat the gasket. During the heating process, the temperature sensor 403 will also detect the temperature.

[0055] When the temperature reaches the appropriate range, the torsion motor 3 is started, and the torsion motor 3 drives the extrusion cylinder 4 at the bottom to rotate, and the extrusion cylinder 4 drives the pressure plate 401 and the fixed plate 402 to rotate, so as to perform a torsion test on the gasket. The gasket can be temperature-treated as needed without the need for additional temperature treatment equipment, thereby improving the treatment effect.

[0056] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiment without creative contribution as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A device for detecting deformation of a nickel-titanium alloy gasket at different temperatures, comprising an operating base (1), characterized in that: The top of the operating base (1) is equipped with a support frame (101) and a processing table (2), the top of the supporting frame (101) is equipped with a torsion motor (3), the output end of the torsion motor (3) is downward and the output end of the torsion motor (3) is connected to an extrusion cylinder (4), and the extrusion cylinder (4) is located directly above the processing table (2), the top of the processing table (2) is equipped with a torsion table (8), the outer side of the torsion table (8) is located at the top of the processing table (2) and multiple groups of limit mechanisms (7) are evenly distributed, the inside of the torsion table (8) is equipped with a top plate (13), and the top of the top plate (13) is provided with multiple groups of grooves running through the top plate (13) from top to bottom, and the multiple groups of grooves of the top plate (13) are all rotatably connected with semiconductor cooling plates (11), the operating base (1) is located at the processing table (2) An adjusting cylinder (102) is installed below the processing table (2), the output end of the adjusting cylinder (102) is connected to a driving disk (10), the top end of the driving disk (10) is connected to a movable disk (12), the bottom end of the movable disk (12) is connected to a support column (1201), the movable disk (12) is fixedly connected to the driving disk (10) through the support column (1201), a plurality of heat exchangers (16) are installed on the top end of the movable disk (12), and each group of heat exchangers (16) is aligned with the bottom of the semiconductor cooling plate (11), the top plate (13) is located on the side of each group of semiconductor cooling plates (11) and is connected to a power supply structure, the power supply structure supplies power to the semiconductor cooling plate (11), the outer side of the processing table (2) is connected to a ventilation mechanism (6), and the ventilation mechanism (6) is connected to the heat exchanger (16); The ventilation mechanism (6) includes a first ventilation machine (601) and a second ventilation machine (602), the end of the first ventilation machine (601) is connected to a first pipe (603), the end of the second ventilation machine (602) is connected to a second pipe (604), the first ventilation machine (601) and the second ventilation machine (602) are connected to the first pipe (603), the second pipe (604) and the heat exchanger (16) through the first pipe (603), the end of the first ventilation machine (601) and the second ventilation machine (602) are both installed with a shielding net (605), and the interior of the first ventilation machine (601) and the second ventilation machine (602) are both installed with a ventilation component (606), and the ventilation component (606) is composed of a motor and fan blades; Two groups of adjustment plates (1601) are symmetrically installed at the top of the heat exchanger (16), and the adjustment plates (1601) are rotatably connected to the heat exchanger (16), and the bottom end of each group of adjustment plates (1601) is connected to a guide surface (1602). Two groups of connectors (1603) are installed at the bottom end of the heat exchanger (16), and the connectors (1603) are respectively connected to the first ventilator (601) and the second ventilator (602), and the two groups of connectors (1603) are respectively aligned with the bottom ends of the two groups of adjustment plates (1601).

2. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 1, characterized in that: A support plate (201) is provided on the outside of the processing table (2), and the support plate (201) supports the processing table (2). The ventilation mechanism (6) is installed on the outer wall of the support plate (201).

3. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 1, characterized in that: The output end of the extrusion cylinder (4) is connected to a pressing plate (401), and the bottom end of the pressing plate (401) is connected to a fixing plate (402). A temperature sensor (403) is installed on the top end of the fixing plate (402). The detection end of the temperature sensor (403) extends below the fixing plate (402). The fixing plate (402) is aligned with the top end of the torsion platform (8).

4. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 1, characterized in that: A side pressure sensing mechanism (701) is installed on the side of the limiting mechanism (7), and an extrusion block (7011) is installed on the side of the side pressure sensing mechanism (701). The side pressure sensing mechanism (701) is fitted with the edge of the gasket via the extrusion block (7011). The interior of the limiting mechanism (7) is hollow, and the side pressure sensing mechanism (701) is installed inside the hollow interior of the limiting mechanism (7). Two sets of outer shells are installed on the outside of the limiting mechanism (7), and positioning rods (703) are installed inside the outer shells. The outer shells are fixed by the positioning rods (703).

5. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 4, characterized in that: The invention also includes a positioning mechanism (9), wherein the positioning mechanism (9) includes an adjusting cylinder (901), a fixing rod (902) and a bottom plate (904), wherein the fixing rod (902) is fixed to the output end of the adjusting cylinder (901), the limiting mechanism (7) is sleeved on the top end of the fixing rod (902), and the limiting mechanism (7) is movably connected to the fixing rod (902) via a return spring (702), the top end of the bottom plate (904) is connected to an output wire (903), and the output wire (903) is connected to the side pressure sensing mechanism (701), and the bottom end of the bottom plate (904) is connected to multiple groups of reinforcing ribs (905).

6. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 1, characterized in that: The top plate (13) is provided with a slot (1301) on the side of each group of semiconductor cooling sheets (11). A flexible power transmission sheet (14) is installed in the middle of the slot (1301). The flexible power transmission sheet (14) includes a fixed insulating sheet (1401), a second power connection rod (1402) and a torsion spring rod (1403). The two ends of the flexible power transmission sheet (14) are respectively connected to the fixed insulating sheet (1401) and the second power connection rod (1402). ) is fixedly connected, the fixed insulating sheet (1401) is fixed on the top end of the torsion spring rod (1403), the torsion spring rod (1403) is rotatably connected to the inner wall of the top plate (13), the side of the flexible power transmission sheet (14) is connected to the power supply (15), the second power connection rod (1402) is inserted into the power supply (15), the bottom end of the power supply (15) is connected to the power supply line (1501), and the power supply line (1501) is connected to the external power supply.

7. The device for detecting deformation of a nickel-titanium alloy gasket at different temperatures according to claim 6, characterized in that: Two groups of first connecting rods (1101) are connected to the side of the semiconductor refrigeration plate (11), and each group of the first connecting rods (1101) is located inside the slot (1301). A rotating shaft is provided on the side of the semiconductor refrigeration plate (11), and the semiconductor refrigeration plate (11) is rotatably connected to the top plate (13) via the rotating shaft. A sliding groove matching the rotation trajectory of the first connecting rod (1101) is provided inside the slot (1301).

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