LED epitaxial wafer testing device and testing method thereof

Abstract

The present invention discloses an LED epitaxial wafer testing device and a testing method thereof, which belongs to the field of LED epitaxial wafer testing, and comprises a testing chassis, wherein a testing cavity is provided therein, a left tail plate is detachably arranged on one side of the testing chassis, and a right tail plate is detachably arranged on the other side of the testing chassis. The LED epitaxial wafer testing device and the testing method of the present invention, through the arranged wiping components, when the lower wiping plate completely contacts and covers the LED epitaxial wafer, the LED epitaxial wafer can be wiped in a circular manner through the rotation of the lower wiping plate, and the arranged first spring can limit the position of the LED epitaxial wafer when the LED epitaxial wafer is installed, and can prevent the lower wiping plate from being flexibly moved upward at all times during the wiping process of the LED epitaxial wafer, thereby avoiding the situation that the LED epitaxial wafer is damaged when the lower wiping plate is in hard contact with the LED epitaxial wafer.

Description

Technical Field

[0001] The invention belongs to the field of LED epitaxial wafer testing, and in particular relates to an LED epitaxial wafer testing device and a testing method thereof. Background Art

[0002] After growing, grinding, polishing and slicing, gallium arsenide forms LED epitaxial wafers. Domestic LED epitaxial wafer production lines are mainly 4-inch and 6-inch. Generally, the appearance of LED epitaxial wafers needs to be tested after processing to distinguish qualified or defective products. However, when testing the appearance of LED epitaxial wafers, the colloid and impurities on the surface of LED epitaxial wafers will affect the test results of the appearance. How to quickly and accurately test multiple groups of LED epitaxial wafers has become a technical problem that needs to be solved urgently.

[0003] The present invention seeks to mitigate or at least alleviate such problems or deficiencies by providing new or otherwise improved LED epitaxial wafer testing. Summary of the invention

[0004] In view of one or more of the above defects or improvement needs in the prior art, the present invention provides an LED epitaxial wafer testing device and a testing method thereof, which have the advantage of being able to quickly and accurately test multiple groups of LED epitaxial wafers.

[0005] To achieve the above-mentioned object, the present invention provides an LED epitaxial wafer testing device, which includes a testing chassis, a testing cavity inside which a left tail plate is detachably arranged on one side of the testing chassis, a right tail plate is detachably arranged on the other side of the testing chassis, and a bearing shell is detachably arranged on the left tail plate;

[0006] A wiping component for wiping the LED epitaxial wafer to be tested, which is detachably mounted on the left tail plate, and has a first solution tank and a second solution tank in the wiping component;

[0007] Two sets of follow-up piercing members are detachably installed in the wiping member, and the two sets of follow-up piercing members can be triggered separately when the wiping member moves, one set of the follow-up piercing members can pierce the first solution tank when triggered, and the other set of the follow-up piercing members can pierce the second solution tank when triggered;

[0008] An air-drying component is detachably mounted on the left tail plate and connected to the wiping component. The air-drying component can move with the wiping component when the wiping component moves, so as to perform an air-drying operation from top to bottom on the LED epitaxial wafer placed on the carrying shell;

[0009] A belt conveyor is detachably mounted in the test cabinet, and a displacement plate is detachably mounted on the belt conveyor;

[0010] A linkage drying component for drying the LED epitaxial wafer, which is detachably mounted on the left tail plate and connected to the displacement plate, and can be triggered when the displacement plate is displaced, wherein when the linkage drying component is triggered, a half portion of the LED epitaxial wafer can be dried from bottom to top, and when the linkage drying component is displaced to an extreme position, it can self-rotate to dry the other half portion of the LED epitaxial wafer from bottom to top;

[0011] A testing component for testing LED epitaxial wafers, which is detachably installed in the testing machine box;

[0012] A pushing component for pushing the LED epitaxial wafer, which is detachably installed in the test box;

[0013] A collection box is detachably mounted on the right tail plate.

[0014] As a further improvement of the present invention, the wiping member comprises:

[0015] A wiping machine box is detachably mounted on the left tail plate, and a bearing slot is provided at the bottom of the wiping machine box;

[0016] A leak plate is detachably mounted on the middle part of the wiping machine case and has a plurality of leak holes in the leak plate;

[0017] A sealing plate, which is removably arranged on the wiping chassis;

[0018] A first side support is detachably mounted on the wiping machine case, a first driving motor is detachably mounted on the first side support, a wiping rod is detachably arranged on the output end of the first driving motor, and the wiping rod can penetrate into the inner bottom of the wiping machine case;

[0019] An incomplete gear detachably mounted on the wiping rod, wherein the incomplete gear is composed of a smooth section and a gear section, and the smooth section and the gear section both occupy half of the incomplete gear;

[0020] A driving wheel detachably mounted on the top of the wiping rod;

[0021] A sub-wiping member, which is detachably mounted on the tail of the wiping rod;

[0022] A second side support is detachably arranged on the top of the wiping machine case, and a first solution tank is detachably mounted on the second side support;

[0023] The third side support is detachably arranged on the top of the wiping machine case, and a second solution box is detachably mounted on the third side support.

[0024] As a further improvement of the present invention, the sub-wiping member comprises:

[0025] An upper wiping plate, on which an external shaft seat is detachably mounted, and the external shaft seat is detachably connected to the tail of the wiping rod;

[0026] A lower wiping plate is located below the upper wiping plate, and multiple groups of penetration rods are detachably installed on the lower wiping plate, and the multiple groups of penetration rods can pass through the upper wiping plate, and a limit block is detachably provided on each group of the penetration rods, and a first spring is also removably provided on each group of the penetration rods, and the first spring is located between the upper wiping plate and the lower wiping plate.

[0027] As a further improvement of the present invention, the follow-up piercing member comprises:

[0028] A fourth side support is detachably mounted on the drain plate, a connecting frame is detachably mounted on the fourth side support, and a slide groove is provided on one side of the connecting frame;

[0029] A first connecting screw rod is rotatably arranged in the connecting machine frame and can pass through the connecting machine frame. A first connecting gear is detachably mounted on one end of the first connecting screw rod passing through the connecting machine frame, and the first connecting gear can mesh with the gear segment of the wiping rod;

[0030] A first ball bearing base is slidably arranged in the connecting frame, and the first connecting screw rod can pass through the first ball bearing base;

[0031] A side rod, which is detachably mounted on the first ball bearing base and can pass through the slide groove;

[0032] A puncture rod, which is detachably arranged on the side rod;

[0033] A follower rod is rotatably arranged on one side of the connecting frame, and a second connecting gear is detachably mounted on the follower rod, and the second connecting gear is meshed with the first connecting gear;

[0034] A Jiaolong blade is detachably mounted on the follower rod;

[0035] A plurality of groups of tilting blades can be detachably arranged on the follower rod.

[0036] As a further improvement of the present invention, the air-drying component comprises:

[0037] a fifth side support detachably mounted on the left tail plate, a drying rod rotatably arranged on the fifth side support, and a third connecting gear detachably mounted on the drying rod;

[0038] a belt, which is removably sleeved on the third connecting gear and is capable of enclosing the driving wheel therein;

[0039] The fan blade bottom plate is detachably mounted on the tail end of the air-drying rod, and a plurality of groups of fan blades are detachably mounted on the outer circumferential surface of the fan blade bottom plate.

[0040] As a further improvement of the present invention, the linkage drying component comprises:

[0041] A mounting seat, which is detachably mounted on the left tail plate, and a second spring is detachably mounted in the mounting seat;

[0042] A linkage block is slidably arranged in the mounting seat, and the linkage block is detachably connected to the second spring, a fitting block is detachably arranged on the linkage block, and a roller is detachably mounted on the fitting block;

[0043] A rotating shaft, which is rotatably arranged on the linkage block, and a fourth connecting gear is detachably mounted on the rotating shaft;

[0044] A chassis is detachably mounted on the top of the rotating shaft, and a blower is detachably mounted on the chassis;

[0045] A blast plate, which is detachably arranged at the outlet end of the blower and has a semi-ring shape;

[0046] A driving plate, which is detachably mounted on the displacement plate, and has a plurality of groups of lower arc grooves and a plurality of groups of upper arc grooves in the driving plate, wherein the plurality of groups of lower arc grooves are connected to the plurality of groups of upper arc grooves, and each group of the lower arc grooves is connected to each group of the upper arc grooves, and a straight groove is also opened at the rear end of the driving plate, and the straight groove is connected to the lower arc grooves;

[0047] The gear base is detachably mounted on the driving plate, and a gear plate is detachably mounted on the gear base.

[0048] As a further improvement of the present invention, the testing component comprises:

[0049] A first test frame is detachably mounted in the test chassis, and a first linear module is detachably mounted on the first test frame;

[0050] A second test rack is detachably arranged in the test chassis, and a slide rail is detachably mounted on the second test rack;

[0051] A horizontal plate is detachably arranged on the first linear module, and a sliding block capable of sliding on the slide rail is detachably installed at the bottom of the horizontal plate;

[0052] A second linear module is detachably mounted on the horizontal plate, a vertical plate is detachably mounted on the second linear module, a second connecting screw is rotatably arranged in the vertical plate, a set of rods is detachably arranged in the vertical plate, a second driving motor is detachably mounted on the vertical plate, and an output end of the second driving motor is detachably connected to the second connecting screw;

[0053] A second ball bearing base is slidably arranged in the vertical plate, and the second connecting screw rod and the sleeve rod can pass through the second ball bearing base;

[0054] The detector is detachably mounted on the second ball bearing base.

[0055] As a further improvement of the present invention, a searchlight frame is detachably mounted on the vertical plate, and the size of the searchlight frame is matched with the size of the vertical plate.

[0056] As a further improvement of the present invention, the pushing member comprises:

[0057] A push base is detachably mounted on the test chassis, and a built-in shaft sleeve is detachably mounted on the four corners of the push base;

[0058] An electric cylinder is detachably mounted in the push base, and the output end of the electric cylinder can pass through the push base, a push plate is detachably mounted on the output end of the electric cylinder, and a limit rod is detachably mounted at each of the four corners of the bottom surface of the push plate, and four sets of the limit rods can pass through the built-in sleeves correspondingly;

[0059] A certain distance plate and a push rod are detachably installed at the four corners of the top surface of the push plate, and each set of the push rods is provided with a cone head.

[0060] Another technical problem to be solved by the present invention is a testing method of the above-mentioned LED epitaxial wafer testing device.

[0061] S1. Installing and wiping the LED epitaxial wafer: installing the LED epitaxial wafer in the wiping component, and opening the wiping component to complete the installation and wiping of the LED epitaxial wafer;

[0062] S2. Injection of two different solutions: while the wiping member is working, the two sets of follow-up piercing members can be triggered respectively when the wiping member moves, one set of the follow-up piercing members can pierce the first solution tank when triggered, and the other set of the follow-up piercing members can pierce the second solution tank when triggered;

[0063] S3, air-drying the LED epitaxial wafer after installation and wiping: while the wiping component is working, it can drive the synchronous air-drying component to perform air-drying operation on the LED epitaxial wafer from top to bottom;

[0064] S4. Drying operation of the LED epitaxial wafer after installation and wiping: when the belt conveyor performs the conveying test operation on the LED epitaxial wafer, it can drive the linkage drying component to work, and when the linkage drying component is triggered, it can dry half of the LED epitaxial wafer from bottom to top, and when the linkage drying component is displaced to the limit position, it can rotate to dry the other half of the LED epitaxial wafer from bottom to top;

[0065] S5. Testing the LED epitaxial wafer: After the displacement plate moves to the bottom of the testing component, the testing component is opened to complete the testing of the LED epitaxial wafer;

[0066] S6. Pushing operation on the tested LED epitaxial wafer: After the testing component completes the testing operation on the LED epitaxial wafer, the pushing operation can be performed on the tested LED epitaxial wafer by opening the pushing component.

[0067] In general, compared with the prior art, the above technical solution conceived by the present invention has the following beneficial effects:

[0068] 1. The LED epitaxial wafer testing device and the testing method thereof of the present invention, through the arranged wiping components, the staff first places the LED epitaxial wafer in the bearing slot, and injects the aqueous solution into the wiping machine box, and turns on the first driving motor so that the first driving motor drives the wiping rod to rotate, and when the wiping rod rotates, it can drive the sub-wiping member to wipe the LED epitaxial wafer. When the LED epitaxial wafer is filled into the bearing slot, the lower wiping plate can be pushed to move up first, and the first spring can be compressed. When the lower wiping plate completely contacts and covers the LED epitaxial wafer, the LED epitaxial wafer can be wiped in a circular manner through the rotation of the lower wiping plate. The arranged first spring can limit the position of the LED epitaxial wafer when installing it, and can prevent the lower wiping plate from being able to move up flexibly at all times during the wiping process of the LED epitaxial wafer, thereby avoiding the situation that the LED epitaxial wafer is damaged when the lower wiping plate contacts the LED epitaxial wafer hard.

[0069] 2. The LED epitaxial wafer testing device and the testing method thereof of the present invention, through the arranged follow-up puncture component, when the incomplete gear rotates half a circle clockwise and when the gear segment of the incomplete gear is meshed with one of the first connecting gears, it can drive the first connecting gear to rotate, and after the first connecting gear rotates, it can drive the first ball base and the puncture rod to move upward, and after the puncture rod has moved upward, it can puncture the first solution tank. At this time, the puncture rod inserted into the first solution tank stays in the first solution tank and can infiltrate a small part of the cleaning solution into the wiping machine chassis. When the incomplete gear continues to rotate half a circle, the smooth section of the incomplete gear is meshed with one of the first connecting gears and will not cause the first solution tank to continue to move upward. At the same time, when the incomplete gear continues to rotate half a circle, it will drive another group of puncture rods to penetrate into the second solution tank, and puncture the second solution tank and cause a small part of the cleaning solution in the second solution tank to infiltrate into the wiping machine chassis. This is a clockwise puncture cycle;

[0070] 3. The LED epitaxial wafer testing device and the testing method thereof of the present invention, through the arranged follower puncture component, when the incomplete gear rotates counterclockwise half a circle, the puncture rod can be moved down from the second solution tank, at which time most of the cleaning solution in the second solution tank can fall into the wiping machine chassis, and when the incomplete gear drives the first connecting gear to rotate, it can also synchronously drive the second connecting gear and the dragon leaf to rotate, and when the incomplete gear continues to rotate counterclockwise half a circle, the puncture rod can be moved down from the first solution tank, at which time most of the cleaning solution in the first solution tank can fall into the wiping machine chassis, and when the incomplete gear drives the first connecting gear to rotate, it can also synchronously drive the second connecting gear and the dragon leaf to rotate, and when the incomplete gear continues to rotate counterclockwise half a circle, the puncture rod can be moved down from the first solution tank, at which time most of the cleaning solution in the first solution tank can fall into the wiping machine chassis, and when the incomplete gear drives the first connecting gear to rotate, it can also synchronously drive the second connecting gear and the dragon leaf to rotate, and when the incomplete gear drives the first connecting gear to rotate counterclockwise half a circle, it can ... The complete gear drives the first connecting gear to rotate and can drive another set of second connecting gears and the dragon leaf to rotate at the same time. This is a reverse puncture cycle, and the forward puncture cycle and the reverse puncture cycle are cycled in sequence. On the one hand, it can further accelerate the mixing effect of the cleaning solution and the aqueous solution in the second solution tank, so as to further improve the wiping effect of the wiping component on the LED epitaxial wafer as a whole. On the other hand, it can avoid the volatilization problem caused by directly proportioning the solution in the second solution tank. On the other hand, it can also simultaneously and uninterruptedly complete the mixing of the cleaning solution in the second solution tank and the cleaning solution in the first solution tank, reducing the difficulty of liquid preparation.

[0071] 4. The LED epitaxial wafer testing device and the testing method of the present invention can drive the third connecting gear to rotate when the driving wheel rotates through the arranged air-drying component, thereby driving the fan blade bottom plate and the fan blade to rotate, so as to perform a top-down air-drying operation on the LED epitaxial wafer located in the carrying shell. On the one hand, while wiping a group of LED epitaxial wafers, another wiped LED epitaxial wafer can be air-dried from top to bottom. Two different processing procedures can be completed through a set of motors, which greatly reduces the equipment cost;

[0072] 5. The LED epitaxial wafer testing device and the testing method thereof of the present invention, through the arranged linkage drying components, when the staff turns on the belt conveyor to send the wiped and air-dried LED epitaxial wafer for inspection, it can drive the driving plate to move forward. Since the roller is initially located in the lower arc groove, it is located at a low point. As the driving plate continues to move forward, the roller moves from the groove of the lower arc groove to the groove of the upper arc groove, and can drive the blower and the blast plate to move upward. Thereafter, the blast plate can perform continuous rising and falling operations when passing through the lower arc groove and the upper arc groove. On the one hand, when the blast plate moves upward, the bottom-up blast drying effect of the LED epitaxial wafer can be increased, and when the blast plate moves downward, the blast drying effect of the LED epitaxial wafer can be reduced. The blast drying effect of the ED epitaxial wafer from bottom to top, the impurities on the LED epitaxial wafer can fall by their own weight. On the other hand, when the roller moves into the straight groove, it is equivalent to being displaced to the highest point and maintained at the highest point, which is equivalent to the linkage drying component moving to the limit position. At this time, when the fourth connecting gear is meshed with the toothed plate, the blast plate can be driven to rotate to perform blast drying operation on the other half of the LED epitaxial wafer that has not been blast dried. At this time, the impurities on the half of the LED epitaxial wafer that has been blast dried can fall by their own weight. When the belt conveyor moves backward, the blast plate can be driven back to the initial position, and the blast drying operation of the impurities on the other half of the LED epitaxial wafer is completed and can continue to fall by their own weight.

[0073] 6. In the LED epitaxial wafer testing device and testing method of the present invention, the staff can adjust the front, back, left and right positions of the detector by turning on the switches of the first linear module and the second linear module, and can drive the detector to move up or down by turning on the switch of the second drive motor to complete the testing and flaw detection operation of the LED epitaxial wafer that has been wiped, dried and cleaned. BRIEF DESCRIPTION OF THE DRAWINGS

[0074] Figure 1 It is a schematic diagram of the overall structure of the LED epitaxial wafer testing device of the present invention;

[0075] Figure 2 It is a structural schematic diagram of the LED epitaxial wafer testing device of the present invention viewed from another angle;

[0076] Figure 3 It is a schematic diagram of the overall structure of the wiping component of the present invention;

[0077] Figure 4 This is a disassembled diagram of the wiping component of the present invention;

[0078] Figure 5 It is a schematic diagram of the overall structure of the sub-wiping member of the present invention;

[0079] Figure 6 It is a schematic diagram of the structure of the incomplete gear and the follower piercing member of the present invention when they are combined with each other;

[0080] Figure 7 It is a schematic diagram of the overall structure of the follow-up piercing component of the present invention;

[0081] Figure 8 It is a schematic diagram of the overall structure of the air-drying component of the present invention;

[0082] Fig. 9 It is a schematic diagram of the overall structure of the linkage drying component of the present invention;

[0083] Fig.10 This is a schematic diagram of the overall structure of the linkage drying component of the present invention viewed from another angle;

[0084] Fig.11 An exploded view of the linkage drying component of the present invention;

[0085] Fig.12 It is a structural schematic diagram of the belt conveyor of the present invention when it is connected to the displacement plate;

[0086] Fig.13 It is a schematic diagram of the overall structure of the test component of the present invention;

[0087] Fig.14 It is a schematic diagram of the structure of the whole test component from another angle of the present invention;

[0088] Fig.15 It is a schematic structural diagram of the entire pushing member of the present invention.

[0089] In all the drawings, the same reference numerals represent the same technical features, specifically: 1. test chassis; 11. left tail plate; 12. right tail plate; 13. load-bearing shell; 2. wiping member; 21. wiping chassis; 211. load-bearing slot; 22. leak plate; 23. sealing plate; 24. first side support; 25. first drive motor; 26. wiping rod; 261. incomplete gear; 27. drive wheel; 28. sub-wiping member; 281. upper wiping plate; 282. external shaft seat; 283. lower wiping plate; 284. through rod; 285. first a spring; 286, a stop block; 29, a second side support; 291, a first solution tank; 292, a third side support; 293, a second solution tank; 3, a follow-up puncture component; 31, a fourth side support; 32, a connecting frame; 33, a first connecting screw rod; 34, a first connecting gear; 35, a first ball bearing base; 36, a side rod; 37, a puncture rod; 38, a follow-up rod; 39, a second connecting gear; 391, a dragon leaf; 392, a tilting leaf; 4, an air-drying component; 41, a fifth side support; 42, an air-drying rod; 43, a third connecting gear ; 44. belt; 45. fan blade bottom plate; 46. fan blade; 5. belt conveyor; 51. displacement plate; 6. linkage drying component; 61. mounting seat; 62. second spring; 63. linkage block; 64. fitting block; 65. roller; 66. rotating shaft; 67. fourth connecting gear; 68. chassis; 681. blower; 682. blower plate; 69. drive plate; 691. lower arc groove; 692. upper arc groove; 693. straight groove; 694. tooth plate base; 695. tooth plate; 7. test component; 71. first test frame ;72. Second test frame;73. First linear module;74. Slide rail;75. Horizontal plate;76. Sliding block;77. Second linear module;78. Vertical plate;781. Second connecting screw rod;782. Sleeve rod;783. Second driving motor;784. Second ball bearing base;785. Detector;79. Searchlight frame;8. Pushing member;81. Pushing base;82. Built-in bushing;83. Electric cylinder;84. Pushing plate;85. Limiting rod;86. Distance plate;87. Pushing rod;88. Cone head;9. Collection box. DETAILED DESCRIPTION

[0090] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0091] The terms used herein are only for describing specific embodiments and are not intended to limit the present invention. The terms "comprise", "include", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0092] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification, and should not be interpreted in an idealized or overly rigid manner.

[0093] In the embodiment, Figure 1-15 A LED epitaxial wafer testing device is provided, wherein the device comprises a testing chassis 1, wherein a testing chamber is provided inside the testing chassis 1, a left tail plate 11 is detachably provided on one side of the testing chassis 1, a right tail plate 12 is detachably provided on the other side of the testing chassis 1, and a carrying shell 13 is detachably provided on the left tail plate 11; a wiping member 2 for wiping the LED epitaxial wafer to be tested is detachably mounted on the left tail plate 11, and a first solution tank 291 and a second solution tank are provided inside the wiping member 2 293; two groups of follow-up puncture components 3, both of which are detachably installed in the wiping component 2, and the two groups of follow-up puncture components 3 can be triggered separately when the wiping component 2 moves, one group of follow-up puncture components 3 can puncture the first solution tank 291 when triggered, and the other group of follow-up puncture components 3 can puncture the second solution tank 293 when triggered; an air-drying component 4, which is detachably installed on the left tail plate 11, and the air-drying component 4 is connected to the wiping component 2, and the air-drying component 4 can be moved when the wiping component 2 moves. The test case 1 is provided with a belt conveyor 5, which is detachably mounted in the test case 1, and a displacement plate 51 is detachably mounted on the belt conveyor 5; a linkage drying component 6 for drying the LED epitaxial wafer is detachably mounted on the left tail plate 11, and the linkage drying component 6 is connected to the displacement plate 51, and the linkage drying component 6 can be triggered when the displacement plate 51 is displaced, wherein when the linkage drying component 6 is When the linked drying component 6 is triggered, it can dry half of the LED epitaxial wafer from bottom to top, and when the linked drying component 6 is displaced to the extreme position, it can rotate by itself to dry the other half of the LED epitaxial wafer from bottom to top; a test component 7 for testing the LED epitaxial wafer, which is detachably installed in the test chassis 1; a pushing component 8 for pushing the LED epitaxial wafer, which is detachably installed in the test chassis 1; a collection box 9, which is detachably installed on the right tail plate 12.

[0094] The present invention is based on an overall idea that, through the arranged wiping member 2, the staff first places the LED epitaxial wafer in the bearing slot 211, and injects aqueous solution into the wiping chassis 21, and turns on the first driving motor 25, so that the first driving motor 25 drives the wiping rod 26 to rotate, and when the wiping rod 26 rotates, it can drive the sub-wiping member 28 to wipe the LED epitaxial wafer. When the LED epitaxial wafer is filled into the bearing slot 211, it can first push the lower wiping plate 283 to move upward, and make the first spring 285 compressed. When the lower wiping plate 283 completely contacts and covers the LED epitaxial wafer, the lower wiping plate 283 can be rotated to perform a circular wiping operation on the LED epitaxial wafer. The first spring 285 can limit the position of the LED epitaxial wafer when installing the LED epitaxial wafer, and can prevent the lower wiping plate 283 from being flexibly moved upward at all times during the wiping process of the LED epitaxial wafer, thereby avoiding the situation where the lower wiping plate 283 is in hard contact with the LED epitaxial wafer and causing damage to the LED epitaxial wafer. The follow-up piercing member 3 is designed, when the incomplete gear 261 rotates half a circle clockwise, and when the gear segment of the incomplete gear 261 is meshed with one of the first connecting gears 34, it can drive the first connecting gear 34 to rotate, and when the first connecting gear 34 rotates, it can drive the first ball base 35 and the piercing rod 37 to move upward, and when the piercing rod 37 has moved upward, it can pierce the first solution tank 291. At this time, the piercing rod 37 inserted into the first solution tank 291 stays in the first solution tank 291 and can pierce a small part of the first solution tank 291. The cleaning solution penetrates into the wiping machine case 21. When the incomplete gear 261 continues to rotate half a circle, the smooth section of the incomplete gear 261 meshes with one of the first connecting gears 34 and does not cause the first solution tank 291 to continue to move upward. At the same time, when the incomplete gear 261 continues to rotate half a circle, it drives another group of puncture rods 37 to penetrate into the second solution tank 293, punctures the second solution tank 293, and allows a small amount of cleaning solution in the second solution tank 293 to penetrate into the wiping machine case 21. This is a forward puncture cycle.When the incomplete gear 261 rotates half a circle counterclockwise, the puncture rod 37 can move down from the second solution tank 293. At this time, most of the cleaning solution in the second solution tank 293 can fall into the wiping machine chassis 21, and when the incomplete gear 261 drives the first connecting gear 34 to rotate, it can also synchronously drive the second connecting gear 39 and the dragon leaf 391 to rotate. When the incomplete gear 261 continues to rotate half a circle counterclockwise, the puncture rod 37 can move down from the first solution tank 291. At this time, most of the cleaning solution in the first solution tank 291 can fall into the wiping machine chassis 21, and when the incomplete gear 261 drives the first connecting gear 34 to rotate, it can also drive another group of second connecting gears 39 and the dragon leaf 391 to rotate. This is a reverse puncture cycle, and the forward puncture cycle and the reverse puncture cycle are cycled in sequence, which can further speed up the second solution tank 293. The mixing effect of the internal cleaning solution and the aqueous solution can further improve the wiping effect of the wiping component 2 on the LED epitaxial wafer as a whole. On the other hand, it can avoid the volatilization problem caused by directly proportioning the solution in the second solution tank 293. On the other hand, it can simultaneously and uninterruptedly complete the mixed liquid preparation of the cleaning solution in the second solution tank 293 and the cleaning solution in the first solution tank 291, reducing the difficulty of liquid preparation; through the arranged air-drying component 4, when the driving wheel 27 rotates, it can drive the third connecting gear 43 to rotate, so as to further drive the fan blade bottom plate 45 and the fan blade 46 to rotate, so as to perform a top-down air-drying operation on the LED epitaxial wafer located in the carrying shell 13. On the one hand, while wiping a group of LED epitaxial wafers, it can also perform a top-down air-drying operation on another wiped LED epitaxial wafer. Two different processing steps can be completed through a set of motors, which greatly reduces the equipment cost;By laying out the interlocking drying component 6, when the staff starts the belt conveyor 5 to send the wiped and air-dried LED epitaxial wafers for inspection, they can drive the driving plate 69 to move forward. Since the roller 65 is initially located in the lower arc groove 691, it is located at a low point. As the driving plate 69 continues to move forward, the roller 65 moves from the groove of the lower arc groove 691 to the groove of the upper arc groove 692, and can drive the blower 681 and the blast plate 682 to move upward. Thereafter, the blast plate 682 can perform continuous rising and falling operations when passing through the lower arc groove 691 and the upper arc groove 692. On the one hand, when the blast plate 682 moves upward, the bottom-up blast drying effect on the LED epitaxial wafer can be increased, and when the blast plate 682 moves downward, the blast drying effect on the LED epitaxial wafer can be reduced. The blast drying effect of the ED epitaxial wafer from bottom to top, the impurities on the LED epitaxial wafer can fall by their own weight. On the other hand, when the roller 65 moves into the straight groove 693, it is equivalent to being displaced to the highest point and maintained at the highest point, which is equivalent to the linkage drying member 6 moving to the limit position. At this time, when the fourth connecting gear 67 is meshed with the tooth plate 695, the blast plate 682 can be driven to rotate to perform blast drying operation on the other half of the LED epitaxial wafer that has not been blast dried. At this time, the impurities on the half of the LED epitaxial wafer that has been blast dried can fall by their own weight. When the belt conveyor 5 moves backward, the blast plate 682 can be driven back to the initial position, and the blast drying operation of the impurities on the other half of the LED epitaxial wafer is completed and can continue to fall by their own weight. ;

[0095] Next, the wiping component 2 as a whole is given a more specific structure and construction for further explanation. The wiping component 2 includes a wiping case 21, which is detachably mounted on the left tail plate 11, and a bearing groove 211 is provided at the bottom of the wiping case 21; a leak plate 22, which is detachably mounted on the middle part of the wiping case 21, and a plurality of leak holes are provided in the leak plate 22; a sealing plate 23, which is removably arranged on the wiping case 21; a first side support 24, which is detachably mounted on the wiping case 21, and a first drive motor 25 is detachably mounted on the first side support 24, and a wiping rod 26 is detachably arranged on the output end of the first drive motor 25, and the wiping rod 26 can be penetrated to the wiping case 21. The inner bottom of the case 21; an incomplete gear 261, which is detachably mounted on the wiping rod 26, wherein the incomplete gear 261 is composed of a smooth section and a gear section, and the smooth section and the gear section both occupy half of the incomplete gear 261; a driving wheel 27, which is detachably mounted on the top of the wiping rod 26; a sub-wiping member 28, which is detachably mounted on the tail of the wiping rod 26; a second side support 29, which is detachably arranged on the top of the wiping case 21, and a first solution tank 291 is detachably mounted on the second side support 29; a third side support 292, which is detachably arranged on the top of the wiping case 21, and a second solution tank 293 is detachably mounted on the third side support 292;

[0096] Next, the overall usage principle of the wiping component 2 is further explained. The staff first places the LED epitaxial wafer in the supporting groove 211, injects aqueous solution into the wiping chassis 21, and turns on the first driving motor 25 so that the first driving motor 25 drives the wiping rod 26 to rotate. When the wiping rod 26 rotates, it can drive the sub-wiping member 28 to wipe the LED epitaxial wafer.

[0097] Next, the sub-wiping member 28 is given a more specific structure and construction as a whole for further explanation. The sub-wiping member 28 includes an upper wiping plate 281, on which an external shaft seat 282 is detachably mounted, and the external shaft seat 282 is detachably connected to the tail of the wiping rod 26; a lower wiping plate 283, which is located below the upper wiping plate 281, on which multiple groups of penetration rods 284 are detachably mounted, and the multiple groups of penetration rods 284 can all pass through the upper wiping plate 281, and each group of penetration rods 284 is detachably provided with a limit block 286, and each group of penetration rods 284 is also detachably provided with a first spring 285, and the first spring 285 is located between the upper wiping plate 281 and the lower wiping plate 283;

[0098] Next, the overall usage principle of the sub-wiping member 28 is further explained. When the LED epitaxial wafer is loaded into the supporting groove 211, the lower wiping plate 283 can be pushed upward first, and the first spring 285 can be compressed. When the lower wiping plate 283 completely contacts and covers the LED epitaxial wafer, the LED epitaxial wafer can be wiped in a circular motion by the rotation of the lower wiping plate 283. The arranged first spring 285 can, on the one hand, limit the position of the LED epitaxial wafer when installing it, and on the other hand, prevent the lower wiping plate 283 from flexibly moving upward at all times during the wiping process of the LED epitaxial wafer, thereby avoiding the damage of the LED epitaxial wafer caused by the hard contact of the lower wiping plate 283 with the LED epitaxial wafer.

[0099] Next, a more specific structure and construction is given to the follow-up piercing member 3 as a whole for further explanation. The follow-up piercing member 3 includes a fourth side support 31, which is detachably mounted on the leak plate 22, and a connecting frame 32 is detachably mounted on the fourth side support 31, and a slide groove is provided on one side of the connecting frame 32; a first connecting screw rod 33 is rotatably arranged in the connecting frame 32, and the first connecting screw rod 33 can pass through the connecting frame 32, and a first connecting gear 34 is detachably mounted on the end of the first connecting screw rod 33 passing through the connecting frame 32, and the first connecting gear 34 can mesh with the gear segment of the wiping rod 26; the first A ball bearing base 35, which is slidably arranged in the connecting machine frame 32, and the first ball bearing base 35 can be passed through by the first connecting screw rod 33; a side rod 36, which is detachably installed on the first ball bearing base 35, and the side rod 36 can pass through the slide groove; a piercing rod 37, which is detachably arranged on the side rod 36; a follower rod 38, which is rotatably arranged on one side of the connecting machine frame 32, and a second connecting gear 39 is detachably installed on the follower rod 38, and the second connecting gear 39 and the first connecting gear 34 are meshed with each other; a dragon leaf 391, which is detachably installed on the follower rod 38; a plurality of tilting leaves 392, which are all detachably arranged on the follower rod 38;

[0100] Next, the overall use principle of the follow-up piercing member 3 is further explained. When the incomplete gear 261 rotates half a circle clockwise, and when the gear segment of the incomplete gear 261 is meshed with one of the first connecting gears 34, the first connecting gear 34 can be driven to rotate. After the first connecting gear 34 rotates, the first ball base 35 and the piercing rod 37 can be driven to move upward. After the piercing rod 37 has moved upward, the first solution tank 291 can be pierced. At this time, the piercing rod 37 inserted into the first solution tank 291 stays in the first solution tank 291. The incomplete gear 261 rotates half a circle, and a small amount of cleaning solution can be infiltrated into the wiping machine box 21. When the incomplete gear 261 continues to rotate half a circle, the smooth section of the incomplete gear 261 meshes with one of the first connecting gears 34 and does not cause the first solution tank 291 to continue to move upward. At the same time, when the incomplete gear 261 continues to rotate half a circle, it drives another group of puncture rods 37 to penetrate into the second solution tank 293, punctures the second solution tank 293, and allows a small amount of cleaning solution in the second solution tank 293 to infiltrate into the wiping machine box 21. This is a forward puncture cycle.

[0101] When the incomplete gear 261 rotates half a circle counterclockwise, the puncture rod 37 can be moved down from the second solution tank 293. At this time, most of the cleaning solution in the second solution tank 293 can fall into the wiping machine case 21, and when the incomplete gear 261 drives the first connecting gear 34 to rotate, it can synchronously drive the second connecting gear 39 and the dragon leaf 391 to rotate. When the incomplete gear 261 continues to rotate half a circle counterclockwise, the puncture rod 37 can be moved down from the first solution tank 291. At this time, most of the cleaning solution in the first solution tank 291 can fall into the wiping machine case 21, and when the incomplete gear 261 drives the first connecting gear 34 to rotate, it can synchronously drive the second connecting gear 39 and the dragon leaf 391 to rotate. When the connecting gear 34 rotates, it can drive another set of second connecting gears 39 and the dragon blade 391 to rotate. This is a reverse puncture cycle, and the forward puncture cycle and the reverse puncture cycle are cycled in sequence. On the one hand, it can further accelerate the mixing effect of the cleaning solution and the aqueous solution in the second solution tank 293, so as to further improve the overall wiping effect of the wiping component 2 on the LED epitaxial wafer. On the other hand, it can avoid the volatilization problem caused by directly proportioning the solution in the second solution tank 293. On the other hand, it can simultaneously and uninterruptedly complete the mixing of the cleaning solution in the second solution tank 293 and the cleaning solution in the first solution tank 291, reducing the difficulty of liquid preparation.

[0102] It should also be noted that both the first solution tank 291 and the second solution tank 293 have sealing films for the piercing rod 37 to pierce, and the sealing films are used to prevent the cleaning solutions in the first solution tank 291 and the second solution tank 293 from volatilizing.

[0103] Next, the air-drying component 4 is given a more specific structure and construction as a whole for further explanation. The air-drying component 4 includes a fifth side support 41, which is detachably mounted on the left tail plate 11, a air-drying rod 42 is rotatably arranged on the fifth side support 41, and a third connecting gear 43 is detachably mounted on the air-drying rod 42; a belt 44, which is removably sleeved on the third connecting gear 43, and the belt 44 can surround the driving wheel 27 therein; a fan blade bottom plate 45, which is detachably mounted on the tail end of the air-drying rod 42, and a plurality of fan blades 46 are detachably mounted on the outer circumferential surface of the fan blade bottom plate 45;

[0104] Next, the overall usage principle of the air-drying component 4 is further explained. When the driving wheel 27 rotates, it can drive the third connecting gear 43 to rotate, and then drive the fan blade base 45 and the fan blades 46 to rotate, so as to perform a top-down air-drying operation on the LED epitaxial wafers located in the supporting shell 13. On the one hand, while wiping one group of LED epitaxial wafers, another wiped LED epitaxial wafer can be air-dried from top to bottom. Two different processing steps can be completed through a set of motors, which greatly reduces the equipment cost.

[0105] Next, the linkage drying component 6 is given a more specific structure and construction as a whole for further explanation. The linkage drying component 6 includes a mounting seat 61, which is detachably mounted on the left tail plate 11, and a second spring 62 is detachably mounted in the mounting seat 61; a linkage block 63, which is slidably arranged in the mounting seat 61, and the linkage block 63 and the second spring 62 are detachably connected, and a fitting block 64 is detachably arranged on the linkage block 63, and a roller 65 is detachably mounted on the fitting block 64; a rotating shaft 66, which is rotatably arranged on the linkage block 63, and a fourth connecting gear 67 is detachably mounted on the rotating shaft 66; a chassis 68, which is detachably mounted on the top of the rotating shaft 66, and the chassis A blower 681 is detachably mounted on the drive plate 68; a blower plate 682 is detachably arranged at the outlet end of the blower 681, and the shape of the blower plate 682 is semi-circular; a driving plate 69 is detachably mounted on the displacement plate 51, and a plurality of groups of lower arc grooves 691 and a plurality of groups of upper arc grooves 692 are provided in the driving plate 69, wherein the plurality of groups of lower arc grooves 691 are connected to the plurality of groups of upper arc grooves 692, and each group of lower arc grooves 691 is connected to each group of upper arc grooves 692, and a straight groove 693 is also provided at the tail end of the driving plate 69, and the straight groove 693 is connected to the lower arc groove 691; a gear base 694 is detachably mounted on the driving plate 69, and a tooth plate 695 is detachably mounted on the gear base 694;

[0106] Next, the overall working principle of the linkage drying component 6 is further explained. When the staff turns on the belt conveyor 5 to send the wiped and air-dried LED epitaxial wafers for inspection, the driving plate 69 can be driven to move forward. Since the roller 65 is initially located in the lower arc groove 691, it is located at a low point. As the driving plate 69 continues to move forward, the roller 65 moves from the groove of the lower arc groove 691 to the groove of the upper arc groove 692, and can drive the blower 681 and the blast plate 682 to move upward. Thereafter, the blast plate 682 can perform continuous rising and falling operations when passing through the lower arc groove 691 and the upper arc groove 692. On the one hand, when the blast plate 682 moves upward, the bottom-up blast drying effect of the LED epitaxial wafer can be increased, and when the blast plate 682 moves downward, the blast drying effect of the LED epitaxial wafer can be increased. The effect of the air drying from bottom to top on the LED epitaxial wafer can be reduced, and the impurities on the LED epitaxial wafer can fall down by their own weight. On the other hand, when the roller 65 moves into the straight groove 693, it is equivalent to being displaced to the highest point and maintained at the highest point, which is equivalent to the linkage drying component 6 moving to the extreme position. At this time, when the fourth connecting gear 67 is engaged with the tooth plate 695, the blast plate 682 can be driven to rotate to perform air drying on the other half of the LED epitaxial wafer that has not been air dried. At this time, the impurities on the half of the LED epitaxial wafer that has been air dried can fall down by their own weight. When the belt conveyor 5 moves backward, the blast plate 682 can be driven back to the initial position, and the air drying operation of the impurities on the other half of the LED epitaxial wafer is completed and can continue to fall down by their own weight.

[0107] Next, the test component 7 as a whole is given a more specific structure and construction for further explanation. The test component 7 includes a first test frame 71, which is detachably installed in the test box 1, and a first linear module 73 is detachably installed on the first test frame 71; a second test frame 72, which is detachably arranged in the test box 1, and a slide rail 74 is detachably installed on the second test frame 72; a cross plate 75, which is detachably arranged on the first linear module 73, and a slider 76 that can slide on the slide rail 74 is detachably installed at the bottom of the cross plate 75; a second linear module 77, which is detachably installed Mounted on the horizontal plate 75, a vertical plate 78 is detachably mounted on the second linear module 77, a second connecting screw 781 is rotatably arranged in the vertical plate 78, a set of rods 782 is detachably arranged in the vertical plate 78, a second driving motor 783 is detachably mounted on the vertical plate 78, and the output end of the second driving motor 783 is detachably connected to the second connecting screw 781; a second ball base 784 is slidably arranged in the vertical plate 78, and the second ball base 784 can be passed through by the second connecting screw 781 and the set of rods 782; a detector 785 is detachably mounted on the second ball base 784;

[0108] Next, the overall operating principle of the test component 7 is further explained. By turning on the switches of the first linear module 73 and the second linear module 77, the staff can complete the adjustment of the front, back, left and right positions of the detector 785. By turning on the switch of the second drive motor 783, the detector 785 can be driven to move up or down to complete the detector 785 to test the LED epitaxial wafer that has been wiped, dried and cleaned.

[0109] It should also be noted that the first linear module 73 and the second linear module 77 are both known components in the prior art, and therefore will not be described in detail in the present invention.

[0110] In some embodiments, in order to further improve the accuracy of the detector 785 during testing, a searchlight frame 79 is detachably mounted on the vertical plate 78 , and the size of the searchlight frame 79 is matched with the size of the vertical plate 78 .

[0111] Next, a more specific structure and construction is given to the entire push member 8 for further explanation. The push member 8 includes a push base 81, which is detachably mounted on the test chassis 1, and a built-in shaft sleeve 82 is detachably mounted at the four corners of the push base 81; an electric cylinder 83, which is detachably mounted in the push base 81, and the output end of the electric cylinder 83 can pass through the push base 81, and a push plate 84 is detachably mounted on the output end of the electric cylinder 83, and a limit rod 85 is detachably mounted at the four corners of the bottom surface of the push plate 84, and four groups of limit rods 85 can pass through the built-in shaft sleeve 82 correspondingly; a certain distance plate 86 and a push rod 87 are detachably mounted at the four corners of the top surface of the push plate 84, and each group of push rods 87 has a cone head 88;

[0112] Next, the overall use principle of the pushing component 8 is further explained. After completing the test operation on the LED epitaxial wafer, by turning on the electric cylinder 83, the electric cylinder 83 can push the pushing plate 84 to move upward. At the same time, the four groups of pushing rods 87 can be pushed upward, and the four groups of pushing rods 87 can be inserted into the displacement plate 51 from bottom to top to complete the pushing operation of the LED epitaxial wafer, so as to facilitate the staff to carry out the material removal operation. The arranged cone head 88 can further improve the pushing effect of the pushing rod 87 so as to push the LED epitaxial wafer out for subsequent recovery.

[0113] Another technical problem to be solved by the present invention is a method for testing an LED epitaxial wafer, comprising the above-mentioned LED epitaxial wafer testing device,

[0114] S1. Installing and wiping the LED epitaxial wafer: installing the LED epitaxial wafer in the wiping member 2, and opening the wiping member 2 to complete the installation and wiping of the LED epitaxial wafer;

[0115] S2. Injection of two different solutions: while the wiping member 2 is working, the two sets of follow-up piercing members 3 can be triggered separately when the wiping member 2 moves, one set of follow-up piercing members 3 can pierce the first solution tank 291 when triggered, and the other set of follow-up piercing members 3 can pierce the second solution tank 293 when triggered;

[0116] S3, air-drying the LED epitaxial wafer after installation and wiping: while the wiping component 2 is working, it can drive the synchronous air-drying component 4 to perform air-drying operation on the LED epitaxial wafer from top to bottom;

[0117] S4, drying operation of the LED epitaxial wafer after installation and wiping: when the belt conveyor 5 is carrying out the test operation on the LED epitaxial wafer, it can drive the linkage drying component 6 to work, and when the linkage drying component 6 is triggered, it can dry half of the LED epitaxial wafer from bottom to top, and when the linkage drying component 6 is displaced to the limit position, it can rotate by itself to dry the other half of the LED epitaxial wafer from bottom to top;

[0118] S5, testing operation on LED epitaxial wafer: after the displacement plate 51 moves to the bottom of the testing member 7, the testing member 7 is opened to complete the testing operation on the LED epitaxial wafer;

[0119] S6. Pushing operation on the tested LED epitaxial wafer: After the testing component 7 completes the testing operation on the LED epitaxial wafer, the pushing component 8 can be opened to push the tested LED epitaxial wafer.

[0120] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A LED epitaxial wafer testing device, characterized in that: It includes: A test case (1) having a test cavity therein, a left tail plate (11) being detachably arranged on one side of the test case (1), a right tail plate (12) being detachably arranged on the other side of the test case (1), and a bearing shell (13) being detachably arranged on the left tail plate (11); A wiping component (2) for wiping the LED epitaxial wafer to be tested, which is detachably mounted on the left tail plate (11), and has a first solution tank (291) and a second solution tank (293) in the wiping component (2); Two sets of follow-up piercing members (3) are detachably mounted in the wiping member (2), and the two sets of follow-up piercing members (3) can be triggered respectively when the wiping member (2) moves, one set of the follow-up piercing members (3) can pierce the first solution tank (291) when triggered, and the other set of the follow-up piercing members (3) can pierce the second solution tank (293) when triggered; an air-drying component (4) which is detachably mounted on the left tail plate (11), and is connected to the wiping component (2); the air-drying component (4) is capable of following the movement of the wiping component (2) to perform an air-drying operation from top to bottom on the LED epitaxial wafer placed on the carrying shell (13); A belt conveyor (5) is detachably mounted in the test cabinet (1), and a displacement plate (51) is detachably mounted on the belt conveyor (5); A linkage drying component (6) for drying the LED epitaxial wafer, which is detachably mounted on the left tail plate (11), and is connected to the displacement plate (51); the linkage drying component (6) can be triggered when the displacement plate (51) is displaced, wherein when the linkage drying component (6) is triggered, a drying operation can be performed on half of the LED epitaxial wafer from bottom to top, and when the linkage drying component (6) is displaced to an extreme position, it can self-rotate to dry the other half of the LED epitaxial wafer from bottom to top; A testing component (7) for testing an LED epitaxial wafer, which is detachably installed in the testing machine box (1); A pushing component (8) for pushing the LED epitaxial wafer, which is detachably installed in the test box (1); The collecting box (9) is detachably mounted on the right tail plate (12).

2. The LED epitaxial wafer testing device according to claim 1, characterized in that: The wiping member (2) comprises: A wiping machine case (21) is detachably mounted on the left tail plate (11), and a bearing groove (211) is provided at the bottom of the wiping machine case (21); A leak plate (22) is detachably mounted on the middle portion of the wiping machine case (21), and has a plurality of leak holes in the leak plate (22); A sealing plate (23) which is removably arranged on the wiping chassis (21); A first side support (24) is detachably mounted on the wiping machine case (21); a first drive motor (25) is detachably mounted on the first side support (24); a wiping rod (26) is detachably disposed on the output end of the first drive motor (25); and the wiping rod (26) is capable of penetrating into the inner bottom of the wiping machine case (21); An incomplete gear (261) is detachably mounted on the wiping rod (26), wherein the incomplete gear (261) is composed of a smooth section and a gear section, and the smooth section and the gear section both occupy half of the incomplete gear (261); A driving wheel (27) detachably mounted on the top of the wiping rod (26); A sub-wiping member (28) detachably mounted on the rear end of the wiping rod (26); A second side support (29) is detachably arranged on the top of the wiping machine case (21), and a first solution tank (291) is detachably mounted on the second side support (29); The third side support (292) is detachably arranged on the top of the wiping machine case (21), and a second solution tank (293) is detachably mounted on the third side support (292).

3. The LED epitaxial wafer testing device according to claim 2, characterized in that: The sub-wiping member (28) comprises: An upper wiping plate (281) on which an external shaft seat (282) is detachably mounted, and the external shaft seat (282) is detachably connected to the tail of the wiping rod (26); A lower wiping plate (283) is located below the upper wiping plate (281), and a plurality of groups of penetration rods (284) are detachably mounted on the lower wiping plate (283), and the plurality of groups of penetration rods (284) are capable of passing through the upper wiping plate (281), and a limit block (286) is detachably provided on each group of the penetration rods (284), and a first spring (285) is also removably provided on each group of the penetration rods (284), and the first spring (285) is located between the upper wiping plate (281) and the lower wiping plate (283).

4. The LED epitaxial wafer testing device according to claim 2, characterized in that: The follower piercing member (3) comprises: a fourth side support (31) which is detachably mounted on the leaking plate (22); a connecting frame (32) is detachably mounted on the fourth side support (31); a sliding groove is provided on one side of the connecting frame (32); A first connecting screw rod (33) is rotatably arranged in the connecting machine frame (32), and the first connecting screw rod (33) can pass through the connecting machine frame (32), and a first connecting gear (34) is detachably mounted on the end of the first connecting screw rod (33) passing through the connecting machine frame (32), and the first connecting gear (34) can mesh with the gear section of the wiping rod (26); A first ball bearing base (35) which is slidably arranged in the connecting machine frame (32), and the first connecting screw rod (33) can pass through the first ball bearing base (35); A side rod (36) which is detachably mounted on the first ball bearing base (35), and the side rod (36) can pass through the slide groove; A puncture rod (37) detachably arranged on the side rod (36); A follower rod (38) is rotatably arranged on one side of the connecting machine frame (32), a second connecting gear (39) is detachably mounted on the follower rod (38), and the second connecting gear (39) and the first connecting gear (34) are meshed with each other; A dragon blade (391) is detachably mounted on the follower rod (38); A plurality of groups of tilting leaves (392) are detachably arranged on the follower rod (38).

5. The LED epitaxial wafer testing device according to claim 2, characterized in that: The air-drying component (4) comprises: a fifth side support (41) which is detachably mounted on the left tail plate (11); a drying rod (42) is rotatably arranged on the fifth side support (41); and a third connecting gear (43) is detachably mounted on the drying rod (42); a belt (44) which is removably sleeved on the third connecting gear (43), and the belt (44) is capable of enclosing the driving wheel (27) therein; A fan blade bottom plate (45) is detachably mounted on the tail end of the air-drying rod (42), and a plurality of groups of fan blades (46) are detachably mounted on the outer circumferential surface of the fan blade bottom plate (45).

6. The LED epitaxial wafer testing device according to claim 1, characterized in that: The linked drying component (6) comprises: A mounting seat (61) is detachably mounted on the left tail plate (11), and a second spring (62) is detachably mounted in the mounting seat (61); A linkage block (63) is slidably arranged in the mounting seat (61), and the linkage block (63) is detachably connected to the second spring (62); a fitting block (64) is detachably arranged on the linkage block (63), and a roller (65) is detachably mounted on the fitting block (64); A rotating shaft (66) rotatably disposed on the linkage block (63), and a fourth connecting gear (67) is detachably mounted on the rotating shaft (66); A chassis (68) is detachably mounted on the top of the rotating shaft (66), and a blower (681) is detachably mounted on the chassis (68); A blast plate (682) is detachably arranged at the outlet end of the blower (681), and the blast plate (682) is in the shape of a semi-ring; A driving plate (69) is detachably mounted on the displacement plate (51), wherein the driving plate (69) has a plurality of groups of lower arc grooves (691) and a plurality of groups of upper arc grooves (692), wherein the plurality of groups of the lower arc grooves (691) and the plurality of groups of the upper arc grooves (692) are connected to each other, and each group of the lower arc grooves (691) is connected to each group of the upper arc grooves (692), and a straight groove (693) is also formed at the rear end of the driving plate (69), and the straight groove (693) is connected to the lower arc grooves (691); The gear base (694) is detachably mounted on the driving plate (69), and a toothed plate (695) is detachably mounted on the gear base (694).

7. The LED epitaxial wafer testing device according to claim 1, characterized in that: The test component (7) comprises: A first test frame (71) is detachably mounted in the test case (1), and a first linear module (73) is detachably mounted on the first test frame (71); A second test rack (72) is detachably arranged in the test chassis (1), and a slide rail (74) is detachably mounted on the second test rack (72); A horizontal plate (75) is detachably arranged on the first linear module (73), and a sliding block (76) capable of sliding on the sliding rail (74) is detachably mounted on the bottom of the horizontal plate (75); A second linear module (77) is detachably mounted on the horizontal plate (75); a vertical plate (78) is detachably mounted on the second linear module (77); a second connecting screw (781) is rotatably arranged in the vertical plate (78); a set of rods (782) is detachably arranged in the vertical plate (78); a second driving motor (783) is detachably mounted on the vertical plate (78); and an output end of the second driving motor (783) is detachably connected to the second connecting screw (781); A second ball bearing base (784) is slidably disposed in the vertical plate (78), and the second ball bearing base (784) can be penetrated by the second connecting screw rod (781) and the sleeve rod (782); The detector (785) is detachably mounted on the second ball bearing base (784).

8. The LED epitaxial wafer testing device according to claim 7, characterized in that: A searchlight frame (79) is detachably mounted on the vertical plate (78), and the size of the searchlight frame (79) is adapted to the size of the vertical plate (78).

9. The LED epitaxial wafer testing device according to claim 1, characterized in that: The pushing member (8) comprises: A push base (81) is detachably mounted on the test chassis (1), and a built-in shaft sleeve (82) is detachably mounted at each of the four corners of the push base (81); An electric cylinder (83) is detachably mounted in the push base (81), and the output end of the electric cylinder (83) can pass through the push base (81); a push plate (84) is detachably mounted on the output end of the electric cylinder (83); a limit rod (85) is detachably mounted at each of the four corners of the bottom surface of the push plate (84); and four groups of the limit rods (85) can pass through the built-in shaft sleeve (82) correspondingly; A certain distance plate (86) and a push rod (87) are detachably mounted at the four corners of the top surface of the push plate (84), and each set of the push rods (87) is provided with a cone head (88).

10. A testing method applied to the LED epitaxial wafer testing device according to any one of claims 1 to 9, characterized in that: S1. Installing and wiping the LED epitaxial wafer: installing the LED epitaxial wafer in the wiping component (2), and opening the wiping component (2) to complete the installation and wiping of the LED epitaxial wafer; S2. Injection of two different solutions: while the wiping member (2) is working, the two sets of follow-up piercing members (3) can be triggered respectively when the wiping member (2) moves, one set of the follow-up piercing members (3) can pierce the first solution tank (291) when triggered, and the other set of the follow-up piercing members (3) can pierce the second solution tank (293) when triggered; S3, air-drying the LED epitaxial wafer after installation and wiping: while the wiping component (2) is working, it can drive the synchronous air-drying component (4) to perform an air-drying operation on the LED epitaxial wafer from top to bottom; S4, drying operation of the LED epitaxial wafer after installation and wiping: when the belt conveyor (5) is performing a conveying test operation on the LED epitaxial wafer, it can drive the linkage drying component (6) to work, and when the linkage drying component (6) is triggered, it can dry half of the LED epitaxial wafer from bottom to top, and when the linkage drying component (6) is displaced to the extreme position, it can rotate to dry the other half of the LED epitaxial wafer from bottom to top; S5, testing the LED epitaxial wafer: after the displacement plate (51) moves to the bottom of the testing component (7), the testing component (7) is opened to complete the testing of the LED epitaxial wafer; S6. Pushing operation on the tested LED epitaxial wafer: After the testing component (7) completes the testing operation on the LED epitaxial wafer, the pushing operation on the tested LED epitaxial wafer can be performed by opening the pushing component (8).

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