Electronic device

Abstract

The embodiment of the invention relates to an electronic device. The electronic device comprises a first circuit board and a base, the base is configured to receive a first side of a device under test (DUT). The first circuit board is configured to electrically connect with an electrical contact on a second side of the DUT and to transmit a signal to a first waveguide channel.

Description

Technical Field

[0001] The present invention relates to an electronic device, and more particularly, to a testing device having a waveguide channel. Background Art

[0002] The existing signal test device includes a socket for carrying the device under test (DUT) and a circuit board coupled to the socket. The electrical signal is transmitted from the DUT to the tester using the conductive structure on the circuit board and the socket. As the operating frequency of the DUT increases, the signal attenuation or loss caused by the long-distance signal transmission path between the DUT and the tester becomes more serious, resulting in poor test efficiency and limiting the test coverage. Summary of the invention

[0003] Embodiments of the present disclosure relate to an electronic device, comprising a first circuit board and a base. The base is configured to accommodate a first side of a device under test (DUT). The first circuit board is configured to electrically connect to an electrical contact on a second side of the DUT and transmit a signal to a first waveguide channel.

[0004] An embodiment of the present disclosure relates to an electronic device, comprising a first circuit board, a base, and a second circuit board. The first circuit board has a first waveguide channel. The base includes a groove for accommodating a DUT, wherein the first waveguide channel and the groove do not overlap in a direction substantially perpendicular to a surface of the base. The second circuit board is disposed above the base and is used to electrically connect the DUT and the base.

[0005] An embodiment of the present disclosure relates to an electronic device, which includes a base, a first circuit board, and a second circuit board. The base is used to accommodate a DUT, wherein the DUT has a first side and a second side opposite to the first side. The first circuit board has a first waveguide channel configured to provide a first signal transmission path to the first side. The second circuit board has a second waveguide channel configured to provide a second signal transmission path to the second side. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Various aspects of the embodiments are discussed below with reference to the drawings, which are not drawn to scale and are provided for illustration only and do not limit the scope of the invention. The reference numerals used in the drawings and the specification are provided for illustration only and do not limit the scope of the invention. Identical or similar elements are indicated by the same reference numerals, where:

[0007] Figure 1A Shown is a cross-sectional view of an electronic device according to some embodiments of the present disclosure;

[0008] Figure 1BShown is a partial bottom view of an electronic device according to some embodiments of the present disclosure;

[0009] Figure 1C Shown is a partial top view of an electronic device according to some embodiments of the present disclosure;

[0010] Figure 2A Shown is a partial cross-sectional view of an electronic device according to some embodiments of the present disclosure;

[0011] Figure 2B Shown is a partial cross-sectional view of an electronic device according to some embodiments of the present disclosure;

[0012] Figure 2C Shown is a partial bottom view of an electronic device according to some embodiments of the present disclosure;

[0013] Figure 2D Shown is a partial top view of an electronic device according to some embodiments of the present disclosure;

[0014] Figure 3A Shown is a partial cross-sectional view of an electronic device according to some embodiments of the present disclosure;

[0015] Figure 3B Shown is a partial top view of an electronic device according to some embodiments of the present disclosure;

[0016] Figure 3C Shown is a partial cross-sectional view of an electronic device according to some embodiments of the present disclosure;

[0017] Figure 3D Shown is a partial cross-sectional view of an electronic device according to some embodiments of the present disclosure;

[0018] Figure 4A Shown is a partial cross-sectional view of an electronic device according to some embodiments of the present disclosure;

[0019] Figure 4B Shown is a partial top view of an electronic device according to some embodiments of the present disclosure;

[0020] Figure 5 Shown is a cross-sectional view of an electronic device according to some embodiments of the present disclosure;

[0021] Fig. 6A Shown is a cross-sectional view of an electronic device according to some embodiments of the present disclosure;

[0022] Figure 6B Shown is a cross-sectional view of an electronic device according to some embodiments of the present disclosure; and

[0023] Figure 7 Shown is a cross-sectional view of an electronic device according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0024] Figure 1A Shown is a cross-sectional view of an electronic device 1 according to some embodiments of the present disclosure. The electronic device 1 includes a base 10, a circuit board 11, and a circuit board 12. In some embodiments, the electronic device 1 can be configured to test, analyze, and / or inspect a device under test (DUT) 13. In some embodiments, the electronic device 1 can be configured to be used with a tester 14 and a handler arm 15. In some embodiments, the electronic device 1 can include a tester 14 and a handler arm 15.

[0025] The DUT 13 may be or include any object or target that can be tested by the electronic device 1, such as a wafer, a substrate, a circuit board, etc. The DUT 13 may be or include any type of chip integration or packaging unit, such as a system-on-chip (SoC), a system-in-a-package (SiP), a package-on-package (PoP), an antenna-on-Chip (AoC), an antenna-in-Package (AiP), etc.

[0026] The DUT 13 may have a surface 131 (or referred to as a back side, inactive side, passive side or side) and a surface 132 (or referred to as a front side, active side, active side or opposite side) opposite to the surface 131. The DUT 13 may have an electrical contact 13e disposed on or adjacent to the surface 132. The electrical contact 13e may include a solder ball or a solder bump, such as a C4 (Controlled Collapse of Chip Connection) solder ball bump, a ball grid array (BGA) or a land grid array (LGA). In some embodiments, the electrical contact 13e may include a conductive pad, a bonding pad, a contact pad or other contact interconnects.

[0027] The DUT 13 may have a radiation source 13a disposed on or adjacent to the surface 131, including (but not limited to) an electromagnetic (EM) wave source, a signal source, or a radio frequency (RF) signal source. In some embodiments, the radiation source 13a may be or include an antenna unit, an antenna pattern, or an antenna array.

[0028] The radiation source 13a may be configured to generate, retrieve, transmit, and / or receive electromagnetic waves, including (but not limited to) RF signals. In some embodiments, the DUT 13 may be or include a wireless module, such as a mmWave wireless module. In one embodiment, the RF of the DUT 13 may be between about 20 GHz and 300 GHz, between about 20 GHz and 50 GHz, between about 21 GHz and 42 GHz, etc.

[0029] In some embodiments, the electronic device 1 can be used to test the electrical signal and / or its electrical properties (e.g., voltage, current, capacitance, resistance, power, frequency, noise ratio, waveform, etc.) of the DUT 13. In some embodiments, the electronic device 1 can be used to test whether the generation, retrieval, transmission, and / or reception of the RF signal of the DUT 13 is normal (or whether it can operate under the default bandwidth).

[0030] The electrical signal referred to in the present disclosure refers to a signal transmitted in a wired medium (e.g., the electrical contact 13e and the conductive structure on the circuit board 11), which may be in the form of or include voltage. The RF signal referred to herein refers to a signal transmitted wirelessly (e.g., via electrical coupling or a waveguide channel), and the frequency of the RF signal may be higher than that of the electrical signal.

[0031] The base 10 (or referred to as a socket, a socket, a test seat, a carrier) has an opening 10r for carrying, accommodating or receiving the DUT 13. For example, the base 10 may have a surface 101 (or referred to as a lower surface) and a surface 102 (or referred to as an upper surface) opposite to the surface 101. The surface 101 may be configured to face the circuit board 11, and the surface 102 may be configured to face the circuit board 12. The opening 10r is recessed from the surface 102 toward the inside of the base 10. The opening 10r may have a bottom 10rm, and the DUT 13 may be directly supported or indirectly supported (for example, via another connector or support) on the bottom 10rm. When the DUT 13 is placed in the opening 10r, the DUT 13 may be located between the circuit board 11 and the circuit board 12.

[0032] The base 10 may have or define one or more radiation spaces 10h. The radiation spaces 10h may extend from the bottom 10rm of the opening 10r to the surface 102. In some embodiments, the radiation spaces 10h may be hollow.

[0033] When the DUT 13 is placed in the opening 10r, the radiation cavity 10h may be located below the DUT 13. The surface 131 of the DUT 13 may face downward, so that the radiation source 13a may be substantially aligned with the radiation cavity 10h, or at least partially exposed from the radiation cavity 10h (or exposed to the air in the cavity). The radiation source 13a may not contact the base 10. The radiation source 13a may receive an RF signal from the circuit board 11 via a transmission medium (e.g., air) of the radiation cavity 10h, or transmit an RF signal to the circuit board 11 via the transmission medium of the radiation cavity 10h. In some embodiments, the radiation cavity 10h may be Figure 4A and Figure 6B In some embodiments, the radiation cavity 10h can be used together with the waveguide structure 40.

[0034] When the DUT 13 is placed in the opening 10 r , the surface 132 of the DUT 13 may face upward so that the electrical contacts 13 e may contact the conductive structure of the circuit board 12 to transmit electrical signals to the circuit board 12 or receive electrical signals from the circuit board 12 .

[0035] The circuit board 11 and the circuit board 12 may each be or include a load board or an interface board. According to the relative position with the base 10, the circuit board 12 and the circuit board 11 may also be referred to as an upper circuit board and a lower circuit board. In some embodiments, the circuit board 11 may be referred to as a first circuit board and the circuit board 12 may be referred to as a second circuit board. In other embodiments, the circuit board 12 may be referred to as a first circuit board and the circuit board 11 may be referred to as a second circuit board. The ordinal numbers such as first, second, third, etc. referred to in the present disclosure refer to one, another, and yet another of the same or similar elements, rather than limiting the order of use or importance of the elements. The spatial descriptions such as upper, middle, and lower referred to in the present disclosure refer to the relative spatial position of the elements, rather than limiting the elements to be used under absolute coordinates. The circuit board 11 and the circuit board 12 may each be connected or electrically connected to the base 10.

[0036] The circuit board 11 may have a surface 111 (or referred to as a first surface or a lower surface) and a surface 112 (or referred to as a second surface or an upper surface) opposite to the surface 111. The circuit board 11 may have a conductive structure, including (but not limited to) one or more redistribution layers (RDL), one or more metal layers, one or more traces, one or more electrical contacts 11p, one or more radiation sources 11a1, one or more radiation sources 11a2, and one or more conductive vias 11v.

[0037] The electrical contacts 11p may be disposed on or adjacent to the surface 111. In some embodiments, the electrical contacts 11p may include conductive pads, bonding pads, contact pads, or other contact interconnects. In some embodiments, the electrical contacts 11p may be configured to be electrically connected to the tester 14.

[0038] The radiation source 11a1 may be disposed on the surface 111 or adjacent to the surface 111. In some embodiments, the radiation source 11a1 may have the same function of generating, retrieving, transmitting, and / or receiving electromagnetic waves (e.g., RF signals) as the radiation source 13a, and may also include an antenna unit. In some embodiments, the radiation source 11a1 may also include a microstrip line. In some embodiments, the radiation source 11a1 may be configured to mutually transmit and / or receive electromagnetic waves (e.g., RF signals) with a matching element 30m1. The matching element 30m1 may include an impedance matching element. In some embodiments, the radiation source 11a1 may be configured to electrically couple with the waveguide structure 30.

[0039] The radiation source 11a2 may be disposed on the surface 112 or adjacent to the surface 112. In some embodiments, the radiation source 11a2 may have the same function of generating, retrieving, transmitting, and / or receiving electromagnetic waves (e.g., RF signals) as the radiation source 13a, and may also include an antenna unit. In some embodiments, the radiation source 11a2 and the radiation source 13a may transmit and / or receive signals to each other via the radiation cavity 10h.

[0040] The conductive via 11v may provide wired transmission (e.g., electrical signal transmission) in a direction substantially perpendicular to the surface 112 or the surface 111, for example, providing electrical signal transmission in a perpendicular direction between the radiation source 11a2 and the electrical contact 11p. In some embodiments, the radiation source 11a2 and the electrical contact 11p may transmit RF signals via wireless transmission (e.g., via electrical coupling or a waveguide channel).

[0041] The direction, type, quantity, position, etc. of the conductive structure of the circuit board 11 can be adjusted based on design requirements (e.g., the circuit density of the circuit board 11), and is not limited to the specific embodiment depicted in the figure. For example, in this embodiment, the circuit board 11 can be configured to receive RF signals from the surface 112, which can be received by wireless transmission via the matching element 30m1 and / or the radiation source 11a2. However, in other embodiments, the electrical signal can also be received via a physical connection (e.g., using a wired transmission method such as a cable, wire, or electrical contact).

[0042] The circuit board 11 can be configured to transmit an RF signal (or an electrical signal) from the surface 112 to the surface 111, and the transmission can be via wireless transmission (e.g., electrical coupling between the matching element 30m1 and the radiation source 11a1) and / or a physical connector (e.g., connection between the radiation source 11a2 and the electrical contact 11p via a conductive via 11v).

[0043] The circuit board 11 can be configured to transmit an RF signal (or electrical signal) from the surface 111 to the tester 14, and the transmission can be via wireless transmission (e.g., electrical coupling between the radiation source 11a1 and the tester 14) and / or a physical connector (e.g., a physical connection between the electrical contact 11p and the tester 14).

[0044] The circuit board 12 may be configured to be placed over the opening 10r and cover the DUT 13. The circuit board 12 may have a surface 121 (or referred to as a first surface or a lower surface) and a surface 122 (or referred to as a second surface or an upper surface) opposite to the surface 121. The circuit board 12 may have a conductive structure, including (but not limited to) one or more redistribution layers (RDLs), one or more metal layers, one or more traces, one or more electrical contacts 12p, one or more radiation sources 12a, and one or more conductive vias 12v.

[0045] The electrical contacts 12p may be disposed on the surface 121 or adjacent to the surface 121. In some embodiments, the electrical contacts 12p may include conductive pads, bonding pads, contact pads, or other contact interconnects. In some embodiments, the electrical contacts 12p may be configured to be electrically connected to the electrical contacts 13e of the DUT 13. In some embodiments, the DUT 13 may be first carried on the circuit board 12 and then accommodated in the opening 10r, so the circuit board 12 may also be used to carry the DUT 13.

[0046] The radiation source 12a may be disposed on the surface 122 or adjacent to the surface 122. In some embodiments, the radiation source 12a may have the same function of generating, retrieving, transmitting, and / or receiving electromagnetic waves (e.g., RF signals) as the radiation source 13a, and may also include an antenna unit. In some embodiments, the radiation source 12a may also include a microstrip line. In some embodiments, the radiation source 12a may transmit and / or receive electromagnetic waves (e.g., RF signals) with the matching element 30m2. The matching element 30m2 may include an impedance matching element. In some embodiments, the radiation source 12a may be configured to be electrically coupled to the waveguide structure 30. In some embodiments, the radiation source 12a may be configured to electrically couple the DUT 13 to the waveguide structure 30.

[0047] The conductive via 12v may provide wired transmission (eg, electrical signal transmission) in a direction substantially perpendicular to the surface 122 or the surface 121 , for example, providing electrical signal transmission in a perpendicular direction between the radiation source 12a and the electrical contact 12p.

[0048] Similar to the circuit board 11, the direction, type, quantity, position, etc. of the conductive structure of the circuit board 12 can be adjusted based on design requirements (e.g., the circuit density of the circuit board 12), and is not limited to the specific embodiment depicted in the figure. For example, in some embodiments, the radiation source 12a and the electrical contact 12p can transmit RF signals via wireless transmission (e.g., via electrical coupling or waveguide channels).

[0049] The waveguide structure 30 may be disposed in the base 10 and adjacent to the opening 10r. In a direction substantially perpendicular to the surface 122 or the surface 121, the waveguide structure 30 does not overlap with the opening 10r. In a direction substantially parallel to the surface 122 or the surface 121, the waveguide structure 30 overlaps with the opening 10r. In a direction substantially perpendicular to the surface 122 or the surface 121, the circuit board 12 may cover the waveguide structure 30 or overlap with the waveguide structure 30. When the DUT 13 is placed in the opening 10r, the waveguide structure 30 may be adjacent to the DUT 13. The waveguide structure 30 may include a connector 30a, a conductive member 30b, and a transmission medium 30c.

[0050] The connector 30a may extend from the surface 101 of the base 10 to the surface 102, or extend between the surface 101 and the surface 102 and beyond the surface 101 and the surface 102. The connector 30a may be or include a pogo pin or a spring-loaded contact. The connector 30a may include a metal material, such as copper, tin, zinc, gold, or other feasible conductive materials or alloys.

[0051] The connector 30a may be configured to be electrically connected to the circuit board 11 via the electrical contact 30g1. The connector 30a may be configured to be electrically connected to the circuit board 12 via the electrical contact 30g2. The electrical contact 30g1 and the electrical contact 30g2 may each include a conductive pad, a bonding pad, a contact pad or other contact interconnects. In some embodiments, the electrical contact 30g1 and the electrical contact 30g2 may each include a ground pad or may be grounded.

[0052] The electrical contact 30g1 may be disposed on the surface 112 of the circuit board 11 or adjacent to the surface 112. The electrical contact 30g2 may be disposed on the surface 121 of the circuit board 12 or adjacent to the surface 121. The connector 30a may mitigate mechanical shock and vibration. For example, the connector 30a may have a gap in which a portion is located between the base 10 and the circuit board 11. For example, the connector 30a may mitigate the contact stress between the base 10 and the circuit board 11, and / or the contact stress between the base 10 and the circuit board 12. In other words, the connector 30a may serve as a buffer between the base 10 and the circuit board 11, and / or between the base 10 and the circuit board 12. In addition, when there is relative displacement between the base 10 and the circuit board 11, and / or between the base 10 and the circuit board 12, the connector 30a may remain against the electrical contact 30g1 and the electrical contact 30g2 to maintain electrical connection therebetween.

[0053] The conductive member 30b may penetrate from the surface 101 to the surface 102, or extend between the surface 101 and the surface 102. The conductive member 30b may be located inside the connecting member 30a, or surrounded by the connecting member 30a. Figure 1A As can be seen from the cross-sectional view of , the conductive member 30b may be located between the two connectors 30a. For example, the connector 30a may include two connectors (or referred to as a first connector and a second connector, a first portion and a second portion) separated from each other, and the conductive member 30b may be located between the two connectors. The conductive member 30b may include a metal material, such as copper, tin, zinc, gold, other feasible conductive materials or alloys. In some embodiments, the conductive member 30b may include a metal wall, a metal wall, a metal bar, a metal block, etc. In some embodiments, the conductive member 30b may be grounded.

[0054] The connector 30a and the conductive member 30b may define or restrict a waveguide channel (not shown) extending between the surface 101 and the surface 102. The waveguide channel may be filled with a transmission medium 30c. In some embodiments, the transmission medium 30c may be or include the material of the base 10, such as plastic, wood, acrylic, or aerogel. In some embodiments, in addition to being a buffer, the connector 30a may surround the waveguide channel and serve as a shield to prevent electromagnetic waves (such as RF signals) passing through the waveguide channel from being subjected to electromagnetic interference, thereby reducing signal attenuation or loss in the signal transmission path between the circuit board 11 and the circuit board 12.

[0055] The waveguide structure 30 can transmit and / or receive RF signals (or be electrically coupled) with the radiation source 11a1 on the circuit board 11 via the matching element 30m1. The matching element 30m1 can be disposed on the surface 112 of the circuit board 11 or adjacent to the surface 112. The matching element 30m1 can be surrounded by the electrical contact 30g1. The matching element 30m1 and the electrical contact 30g1 may not be electrically connected.

[0056] The waveguide structure 30 can transmit and / or receive RF signals (or electrically couple) with the radiation source 12a on the circuit board 12 via the matching element 30m2. The matching element 30m2 can be disposed on the surface 121 of the circuit board 12 or adjacent to the surface 121. The matching element 30m2 can be surrounded by the electrical contact 30g2. The matching element 30m2 and the electrical contact 30g2 may not be electrically connected.

[0057] The electronic device 1 provides different signal transmission paths for the electrical signal and the RF signal on opposite sides of the DUT 13 .

[0058] For example, for the electrical signal of the DUT 13, in the signal transmission path, the electrical signal is electrically coupled to the matching element 30m2 from the electrical contact 13e of the surface 132 through the conductive structure (such as the electrical contact 12p, the conductive through hole 12v, the radiation source 12a, etc.) on the circuit board 12. The matching element 30m2 can be configured to feed the RF signal into the waveguide channel defined by the connecting member 30a and the conductive member 30b, so that the RF signal is transmitted from the surface 102 of the base 10 to the surface 101 via wireless transmission. The RF signal from the waveguide channel can be fed into the matching element 30m1. The matching element 30m1 can be configured to electrically couple the RF signal to the radiation source 11a1.

[0059] In another signal transmission direction, the radiation source 11a1 can be configured to electrically couple the RF signal to the matching element 30m1. The matching element 30m1 can be configured to feed the RF signal into the waveguide channel defined by the connecting member 30a and the conductive member 30b, so that the RF signal is transmitted from the surface 101 of the base 10 to the surface 102 via wireless transmission. The RF signal from the waveguide channel can be fed into the matching element 30m2. The matching element 30m2 can be configured to electrically couple the RF signal to the conductive structure (e.g., the radiation source 12a, the conductive via 12v, the electrical contact 12p, etc.) on the circuit board 12, and transmit it to the electrical contact 13e.

[0060] For example, for the RF signal of DUT 13, the RF signal is transmitted between the radiation source 13a on the surface 131 and the conductive structure on the circuit board 11 (such as radiation source 11a2, conductive through hole 11v, electrical contact 11p, etc.) through the radiation cavity 10h via wireless transmission (such as electrical coupling).

[0061] The tester 14 may be disposed below the circuit board 11. The tester 14 may include a signal source, a digital signal processor (DSP), an up / down converter, a power supply, a test computer, etc. (not shown for simplicity). In some embodiments, the test computer may execute instructions written on a machine-readable medium, such as executing the test process described in the present disclosure. Specifically, it may include commanding a signal source to generate an electrical signal (or RF signal), capturing or retrieving an electrical signal response (or RF signal response) of the DUT 13, storing an electrical signal response (or RF signal response) in digital form, judging an electrical signal and / or its electrical properties based on an electrical signal response, judging whether an RF signal function is normal based on an RF signal response, etc.

[0062] The carrier arm 15 may be disposed above the circuit board 12. The carrier arm 15 may include an automated positioning system. The carrier arm 15 may be configured to pick up the DUT 13 and place the DUT 13 in the base 10. The carrier arm 15 may have a pressing member for holding and pressing the DUT 13. The circuit board 11 and the DUT 13 may be moved by a chuck (e.g., Figure 7 A clamp 15c) is attached to the carrier arm 15. The clamp can be used to apply suction to the circuit board 11 and the DUT 13.

[0063] Figure 1B Shown Figure 1A1 is a partial bottom view of the circuit board 12 of the electronic device 1. In some embodiments, the matching element 30m2 and the electrical contact 30g2 may be disposed on the surface 121 of the circuit board 12. The matching element 30m2 and the electrical contact 30g2 may form an array. The matching element 30m2 may be located at the center of the array. The radiation source 12a (located on the surface 122 of the circuit board 12) and the matching element 30m2 overlap in a direction substantially perpendicular to the surface 121 or the surface 122. The radiation source 12a and the matching element 30m2 are spaced apart from each other in a direction substantially perpendicular to the surface 121 or the surface 122.

[0064] In other embodiments, the matching element 30m2 and the electrical contact 30g2 may have other numbers and shapes, and may be arranged in other shapes. For example, the electrical contact 30g2 may be arranged around the matching element 30m2 in a circular, elliptical, or circular-like shape.

[0065] Figure 1C Shown Figure 1A FIG. 1 is a partial top view of the base 10 of the electronic device 1. In some embodiments, the connector 30a may surround the conductive member 30b. The connector 30a may have a circular, oval, or circular-like shape. The connector 30a may be arranged in a rectangular shape. In other embodiments, the connector 30a may have other numbers, shapes, and may be arranged in other shapes. The conductive member 30b may form a metal wall closed on four sides. In other embodiments, the conductive member 30b may have a plurality of metal walls separated from each other.

[0066] The position of the connecting member 30a may correspond to Figure 1B For example, each of the connectors 30a may be configured to be electrically connected to one of the electrical contacts 30g2. The position of the conductive member 30b may correspond to Figure 1B For example, the conductive element 30b may be configured not to contact the matching element 30m2 or not to overlap with the matching element 30m2.

[0067] In a comparative embodiment, the electrical signal is transmitted from the DUT to the tester using the conductive structures on the circuit board and the base. For example, the electrical signal is transmitted from the DUT to the tester using the traces and conductive vias on the circuit board and the spring pins passing through the base. As the signal frequency of the DUT increases, the signal attenuation or loss caused by the long distance signal transmission path between the DUT and the tester becomes more serious, resulting in poor test efficiency and limiting the test coverage.

[0068] According to the embodiment disclosed in the present invention, a signal transmission path (i.e., a waveguide channel) is provided between the circuit board 11 and the circuit board 12 via the waveguide structure 30, so that the electrical signal can be converted into an RF signal and transmitted between the circuit board 11 and the circuit board 12 by wireless transmission. Compared with the use of spring pins or other physical connectors, the signal attenuation or loss of the waveguide structure 30 is reduced, and it is less restricted by the frequency band. For example, when the DUT 13 operates at a high frequency (such as a millimeter wave), the waveguide structure 30 can still clearly and completely transmit the signal to achieve the test purpose.

[0069] In addition, the connector 30a is used to surround or define a signal transmission path (i.e., a waveguide channel). In addition to serving as a buffer between the base 10 and the circuit board 11, and / or between the base 10 and the circuit board 12 and maintaining the electrical connection therebetween, the connector 30a can also serve as a shielding member to avoid electromagnetic interference, further reduce signal attenuation or loss, and improve the accuracy and efficiency of the test.

[0070] In other embodiments, a waveguide channel may also be used to provide a horizontal signal transmission path in the circuit board 11 and / or the circuit board 12 , and is not limited to a vertical signal transmission path between the base 10 and the circuit board 11 , and / or between the base 10 and the circuit board 12 .

[0071] Figure 2A and Figure 2B A partial cross-sectional view of an electronic device according to some embodiments of the present disclosure is shown. In some embodiments, Figure 1A The area within the frame line 2 of the electronic device 1 may also have Figure 2A or Figure 2B The structure shown. Figure 2A and Figure 2B Zhongyu Figure 1A The same or similar components are marked with the same reference numerals. For detailed description, please refer to Figure 1A , I will not go into details here.

[0072] Reference Figure 2A In some embodiments, the radiation source 12a may be manufactured or formed in an inner metal layer or an intermediate metal layer of the circuit board 12. Figure 2B In some embodiments, the radiation source 12 a may be fabricated or formed on a bottom metal layer of the circuit board 12 , on the surface 121 , or adjacent to the surface 121 .

[0073] Reference Figure 2C and Figure 2D , Figure 2C Shown Figure 2B A partial bottom view of the circuit board 12 is shown. Figure 2D Shown Figure 2BFIG. 1 is a partial top view of the base 10 of FIG. The electrical contact 30g2 may be partially around the radiation source 12a. For example, the radiation source 12a may have an extension portion and an end portion. In some embodiments, the extension portion may include a microstrip line, and the end portion may include a patch antenna for feeding the RF signal into the matching element 30m2. The position of the end portion may correspond to the matching element 30m2, and the electrical contact 30g2 may be partially around the end portion. In some embodiments, the electrical contact 30g2 may only be partially around the end portion, and is not arranged around the microstrip line.

[0074] The matching element 30m2 may be manufactured or formed on the surface 102 of the base 10 or adjacent to the surface 102 so as to be spaced a certain distance from the radiation source 12a. The conductive member 30b may surround the matching element 30m2 to form a metal wall with four closed sides. The connecting member 30a may partially surround the conductive member 30b. The position of the connecting member 30a may correspond to Figure 2C For example, each of the connectors 30a may be configured to be electrically connected to one of the electrical contacts 30g2. However, since the connector 30a does not contact the radiation source 12a, the area on the surface 102 of the base 10 that overlaps with the radiation source 12a may not have the connector 30a.

[0075] Figure 3A , 3C and Figure 3D A partial cross-sectional view of an electronic device according to some embodiments of the present disclosure is shown. In some embodiments, Figure 1A The area within the frame line 3 of the electronic device 1 may also have Figure 3A , 3C or Figure 3D The structure shown. Figure 3A , 3C and Figure 3D Zhongyu Figure 1A The same or similar components are marked with the same reference numerals. For detailed description, please refer to Figure 1A , I will not go into details here.

[0076] Reference Figure 3A In some embodiments, the conductive member 30b may be located outside the connecting member 30a or surround the connecting member 30a. Figure 3B , Figure 3B Shown Figure 3A The conductive member 30b can surround the connecting member 30a to form four closed metal walls.

[0077] Reference Figure 3CIn some embodiments, the conductive member 30b may not be included. The connector 30a may define a waveguide channel alone, and the waveguide channel may be filled with a transmission medium 30c. In some embodiments, not using the conductive member 30b may further reduce the cost.

[0078] Reference Figure 3D In some embodiments, the conductive member 30b may not be included. The connecting member 30a may define a waveguide channel alone, and the transmission medium 30c of the waveguide channel may include air. In some embodiments, if a waveguide channel (e.g. Figure 5 , Fig. 6A , Figure 6B As shown in FIG. 1 , using air as the transmission medium can form a continuous waveguide channel without considering the difference in dielectric constants between the circuit board 11 and / or the circuit board 12 and the base 10.

[0079] Figure 4A A partial cross-sectional view of an electronic device according to some embodiments of the present disclosure is shown. In some embodiments, Figure 1A The area within the frame line 4 of the electronic device 1 may also have Figure 4A The structure shown.

[0080] In some embodiments, one or more waveguide structures 40 may be disposed in the base 10 and located between the bottom 10rm and the surface 101. When the DUT 13 is placed in the opening, the waveguide structure 40 may be located below the DUT 13.

[0081] The waveguide structure 40 may include a connector 40a, a conductive member 40b, and a transmission medium 40c. The connector 40a may penetrate from the bottom 10rm of the base 10 to the surface 101, or extend between the bottom 10rm and the surface 101. The connector 40a may be or include a spring pin, an elastic connector, or a conductive through hole. The conductive member 40b may penetrate from the bottom 10rm of the base 10 to the surface 101, or extend between the bottom 10rm and the surface 101. The conductive member 40b may include a metal wall, a metal wall, a metal strip, a metal block, etc. The connector 40a and the conductive member 40b may define a waveguide channel (not shown) extending between the bottom 10rm and the surface 101. The waveguide channel may be filled with a transmission medium 40c.

[0082] The waveguide structure 40 can transmit and / or receive RF signals with the radiation source 11a2 on the circuit board 11 via the matching element 40m1. The matching element 40m1 can be disposed on the surface 101 or adjacent to the surface 101. The waveguide structure 40 can transmit and / or receive RF signals with the radiation source 13a of the DUT 13 via the matching element 40m2. The matching element 40m2 can be disposed on the bottom 10rm or adjacent to the bottom 10rm. In some embodiments, the waveguide structure 40 can also have a Figure 3A , Figure 3C or Figure 3D The changes shown are not limited to Figure 4A The specific aspects depicted. Figure 4B , Figure 4B Shown Figure 4A A partial top view of the bottom 10rm of the base 10. Figure 4A The surface 101 of the base 10 may also have Figure 4B The conductive member 40b may surround the matching element 40m2 to form a four-sided closed metal wall. The connecting member 40a may surround the conductive member 40b.

[0083] Figure 5 FIG. 5 is a cross-sectional view of an electronic device 5 according to some embodiments of the present disclosure. Figure 1A The electronic device 5 is similar to the electronic device 1 of the embodiment of the present invention, except that the electronic device 5 further includes a waveguide structure 50 disposed in the circuit board 11. In a direction substantially perpendicular to the surface 122 or the surface 121, the waveguide structure 50 does not overlap with the opening 10r. In a direction substantially perpendicular to the surface 122 or the surface 121, the circuit board 12 may cover the waveguide structure 50 or overlap with the waveguide structure 50. The waveguide structure 50 may include a connector 50a, a conductive member 50b, and a transmission medium 50c. The connector 50a, the conductive member 50b, and the transmission medium 50c are Figure 4A The connecting member 40a, the conductive member 40b and the transmission medium 40c are the same and will not be described in detail herein.

[0084] The position of the connector 50a may correspond to the connector 30a. The connector 30a may be connected to the connector 50a via the electrical contact 30g1. However, in some embodiments, the connector 30a may be directly connected to or contact the connector 50a, such as Figure 7 As shown. The connecting member 50a and the conductive member 50b may define a waveguide channel (not shown) in the circuit board 11. The waveguide channel may be filled with a transmission medium 50c. The waveguide channels of the connecting member 50a and the conductive member 50b may be substantially aligned with the waveguide channels of the connecting member 30a and the conductive member 30b. The waveguide structure 50 may transmit and / or receive RF signals with the radiation source 11a1 on the circuit board 11 via the matching element 50m.

[0085] Fig. 6A FIG. 6 is a cross-sectional view of an electronic device 6a according to some embodiments of the present disclosure. Figure 5 The electronic device 5 is similar to the electronic device 6a, except that the electronic device 6a further includes a waveguide structure 60 disposed in the circuit board 12. The waveguide structure 60 may include a connecting member 60a, a conductive member 60b, and a transmission medium 60c. The connecting member 60a, the conductive member 60b, and the transmission medium 60c are Figure 4AThe connecting member 40a, the conductive member 40b and the transmission medium 40c are the same and will not be described in detail herein.

[0086] The position of the connector 60a may correspond to the connector 30a. The connector 30a may be connected to the connector 60a via the electrical contact 30g2. However, in some embodiments, the connector 30a may be directly connected to or contact the connector 60a, such as Figure 7 As shown. The connector 60a and the conductive member 60b may define a waveguide channel (not shown) in the circuit board 12. The waveguide channel may be filled with a transmission medium 60c. The waveguide channels of the connector 60a and the conductive member 60b may be substantially aligned with the waveguide channels of the connector 30a and the conductive member 30b. The waveguide structure 60 may transmit and / or receive RF signals with the radiation source 12a on the circuit board 12 via the matching element 60m.

[0087] Figure 6B FIG. 6 is a cross-sectional view of an electronic device 6b according to some embodiments of the present disclosure. Fig. 6A The electronic device 6b is similar to the electronic device 6a of FIG. 1 , except that the electronic device 6b further includes a waveguide structure 40 disposed in the base 10, and the conductive structure (including the electrical contact 11p, the radiation source 11a2, and the conductive via 11v) in the circuit board 11 for transmitting the RF signal from the radiation source 13a can be replaced by a waveguide structure 51. In some embodiments, the length of the waveguide structure 40 can be less than the length of the waveguide structure 30. In some embodiments, the position of the waveguide structure 51 can correspond to or be substantially aligned with the waveguide structure 40. The waveguide structure 51 and the Figure 4A The waveguide structure 40 is the same as that of FIG. 4 , and will not be described in detail here.

[0088] Figure 7 FIG. 1 is a cross-sectional view of an electronic device 7 according to some embodiments of the present disclosure. Fig. 6A The electronic device 6a is similar to the electronic device 6a, and the differences are described as follows.

[0089] The electronic device 7 further includes a carrier 70, which is disposed in the base 10 and covers the DUT 13. The carrier 70 and the base 10 may also be collectively referred to as an upper carrier and a lower carrier. The carrier 70 may have a connector 70a. The connector 70a may penetrate the carrier 70, extend between opposite surfaces of the carrier 70, or extend beyond opposite surfaces of the carrier 70. The connector 70a may be or include a spring pin, an elastic connector, or a conductive through hole. The connector 70a of the carrier 70 may be configured to be electrically connected to the electrical contact 13e of the DUT 13 and provide an electrical signal transmission path between the DUT 13 and the circuit board 12.

[0090] The electronic device 7 further includes a waveguide structure 30 disposed on both sides of the opening 10r, a waveguide structure 50 corresponding to or substantially aligned with the waveguide structure 30, and a waveguide structure 60 corresponding to or substantially aligned with the waveguide structure 30. The number and position of the waveguide structures can be adjusted based on design requirements and are not limited to the specific embodiments depicted in the figures.

[0091] Unless otherwise specified, spatial descriptions such as "above", "below", "up", "left", "right", "lower", "top", "bottom", "vertical", "horizontal", "side", "above", "below", "upper", "above", "below", etc. are indicated relative to the orientation shown in the figure. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and that embodiments of the structures described herein may be spatially arranged in any orientation or manner, provided that the advantages of the embodiments of the present disclosure are not deviated by such arrangements.

[0092] As used herein, the terms "approximately," "substantially," "generally," "about," and "about" are used to describe and explain minor variations. When used in conjunction with an event or circumstance, these terms may refer to instances where the event or circumstance occurred exactly as well as instances where the event or circumstance occurred very approximately. For example, when used in conjunction with a numerical value, these terms may refer to a range of variation of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first numerical value is within a range of variation of less than or equal to ±10% of a second numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first numerical value may be considered to be "substantially" the same as or equal to the second numerical value. For example, "substantially" vertical can refer to an angular variation range of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0093] If the displacement between the two surfaces is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm, then the two surfaces can be considered to be coplanar or substantially coplanar. If the displacement between the highest point and the lowest point of a surface is no more than 5 μm, no more than 2 μm, no more than 1 μm, or no more than 0.5 μm, then the surface can be considered to be substantially flat.

[0094] As used herein, the singular forms "a," "an," and "the" may include plural or plural referents unless the context clearly indicates otherwise.

[0095] As used herein, the terms "conductive," "electrically conductive," and "conductivity" refer to the ability to carry an electric current. Conductive materials are materials that present little or no resistance to the flow of electric current. One unit of measurement for conductivity is Siemens per meter (S / m). Typically, a conductive material is one that has a conductivity greater than about 10 4 S / m, for example at least 10 5 S / m or at least 10 6 S / m of a material. The conductivity of a material sometimes varies with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0096] In addition, amounts, ratios and other numerical values ​​are sometimes presented herein in a range format. It should be understood that such a range format is used for the sake of convenience and brevity, and should be flexibly construed to include not only the values ​​explicitly specified as the limits of the range, but also all individual values ​​or sub-ranges encompassed within the range, as if each value and sub-range were explicitly specified.

[0097] Although the present disclosure has been described and illustrated with reference to the specific embodiments of the present disclosure, these descriptions and illustrations are not restrictive. It should be understood by those skilled in the art that various changes may be made and equivalents may be replaced without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the process reproduction in the present disclosure and the actual equipment. There may be other embodiments that are not specifically described in the present disclosure. The description and drawings should be regarded as illustrative rather than restrictive. Modifications may be made to make specific situations, materials, material compositions, methods or processes suitable for the goals, spirit and scope of the present disclosure. All such modifications are deemed to be included within the scope of the appended claims. Although the disclosed method has been described herein with reference to specific operations performed in a specific order, it should be understood that these operations may be combined, subdivided or reordered to form equivalent methods without departing from the teachings of the present disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the present disclosure.

Claims

1. An electronic device, comprising: a first circuit board; and The base is configured to accommodate a first side of a device under test (DUT), wherein the first circuit board is configured to be electrically connected to electrical contacts on a second side of the DUT and transmit signals to the first waveguide channel.

2. The electronic device of claim 1, wherein the first waveguide channel is located in the base. 3 . The electronic device of claim 1 , wherein the electronic device comprises an elastic connector defining the first waveguide channel and configured to be electrically connected to the first circuit board via a conductive pad. The electronic device of claim 3 , wherein the conductive pad comprises a ground pad. The electronic device according to claim 3 , wherein the elastic connecting member serves as a buffer between the first circuit board and the base.

6. The electronic device of claim 1, wherein the first circuit board comprises a matching element configured to electrically couple a signal to the first waveguide channel.

7. The electronic device of claim 2, wherein the first circuit board has a second waveguide channel that is substantially aligned with the first waveguide channel.

8. The electronic device according to claim 7, further comprising: A second circuit board is connected to the base and has a third waveguide channel, wherein the third waveguide channel is substantially aligned with the first waveguide channel.

9. The electronic device according to claim 1, further comprising: A second circuit board is connected to the base, wherein the base has a radiation cavity configured to electrically couple a signal of a radiation source at the second side of the DUT to the second circuit board.

10. The electronic device according to claim 1, further comprising: A second circuit board is connected to the base, wherein the base has a fourth waveguide channel configured to electrically couple a signal of a radiation source at the second side of the DUT to the second circuit board.

11. An electronic device comprising: A first circuit board having a first waveguide channel; a base comprising a recess for accommodating the DUT, wherein the first waveguide channel and the recess do not coincide with each other in a direction substantially perpendicular to a surface of the base; and The second circuit board is disposed above the base and is used for electrically connecting the DUT and the base. 12 . The electronic device according to claim 11 , wherein the second circuit board is used to carry the DUT.

13. The electronic device according to claim 11, wherein a second circuit board covers the first waveguide channel.

14. The electronic device of claim 11, wherein the base has an elastic connector defining the first waveguide channel, wherein the elastic connector coincides with the groove in a direction substantially parallel to the surface of the base.

15. The electronic device according to claim 11, wherein the first circuit board comprises: a radiation source disposed above the first waveguide channel; and A matching element is disposed above the first waveguide channel and spaced apart from the radiation source, wherein the radiation source is electrically coupled to the matching element. 16 . The electronic device according to claim 14 , wherein a portion of the elastic connecting member is disposed in a gap between the second circuit board and the base, and is used to buffer contact stress between the base and the second circuit board.

17. The electronic device according to claim 14, wherein the elastic connecting member has a first portion and a second portion separated from each other, wherein the base has a conductive member defining the first waveguide channel, and wherein in a cross-sectional view, the conductive member is located between the first portion and the second portion.

18. An electronic device comprising: a base for accommodating a DUT, wherein the DUT has a first side and a second side opposite to the first side; a first circuit board having a first waveguide channel configured to provide a first signal transmission path to the first side; and The second circuit board has a second waveguide channel configured to provide a second signal transmission path to the second side.

19. The electronic device of claim 18, wherein the base has a third waveguide channel configured to provide a portion of the second signal transmission path between the DUT and the second circuit board.

20. The electronic device of claim 18, wherein the base has a fourth waveguide channel configured to provide a portion of the first signal transmission path between the first circuit board and the second circuit board.

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