Press fitting mechanism for power load cycle test of power semiconductor module

Abstract

The invention relates to a press-fitting mechanism for a power load cycle test of a power semiconductor module. The press-fitting mechanism is mainly applied to press-fitting of a modular power semiconductor device in a power load cycle test. The device mainly comprises a horizontal fixed pressing clamp pressing structure, a 360-degree rotatable sliding crimping structure and a placement heat dissipation structure. A user can place a power semiconductor module at the central position of a bottom plate of a water-cooling radiator on the press-fitting mechanism, and can rotate the horizontal pressing clamp by 360 degrees to adjust the coordinate positions of the X-axis, the Y-axis and the Z-axis of the pressing clamp as required according to the modules with different sizes, heights and shapes so as to reliably press and fasten the modules; and carrying out a power load cycle test in which power-on heating and water-cooling heat dissipation are circulated and reciprocated. The press-fitting mechanism has the advantages of being small and light in structure, high in universality, flexible and convenient to operate, high in safety and reliability and the like.

Description

Technical Field

[0001] This patent belongs to the field of power semiconductor testing, and specifically relates to a press-fit mechanism for power semiconductor module power load cycle testing. Background Art

[0002] Module power semiconductors play a key role in the field of power electronics. With their wide application, the types of modules have become diverse, including large, medium and small power modules, plastic-encapsulated modules, metal-encapsulated modules, ceramic-encapsulated modules and other forms. Their advantages are miniaturization, integration, high performance, environmental protection and customization. With the increasing market demand, in order to ensure the high-quality production of module semiconductors, manufacturers need to conduct power load cycle tests on them before leaving the factory, simulating the harsh conditions of long-term repeated heating and cooling in the later use environment to test the electrical performance indicators of the modules during the thermal cycle. Therefore, it is necessary to provide a reliable press-fitting mechanism to complete the above power load cycle test. The power load cycle test requires that a large number of power semiconductor modules be fixed to the press-fitting mechanism under a certain pressure at the same time for testing. After the test is completed, the batch modules are updated and a new test process is started. Although the current press-fitting mechanism can play the role of electrical connection and physical fixation, the bulky and heavy press-fitting structure is time-consuming and labor-intensive in replacing the test module. Based on the large workload, time-consuming and complicated operation of this test, we have developed this fast press-fitting mechanism. Summary of the invention

[0003] The present invention provides a press-fitting mechanism for a power load cycle test of an electric semiconductor module, aiming to solve the problems of heavy workload, time consumption and complexity in the test operation process.

[0004] The technical solution adopted by the present invention to solve the above technical problems is: a press-fitting mechanism for power semiconductor module power load cycle test, including a horizontal press clamp pressure structure, a 360-degree rotatable sliding adjustment structure and a heat dissipation placement structure, all of which are located on a bottom plate, wherein the horizontal press clamp pressure structure is located above the 360-degree rotatable sliding adjustment structure, and the heat dissipation placement structure is located at the center of the bottom plate, characterized in that: the horizontal press clamp pressure structure includes a horizontal press clamp, and the horizontal press clamp is connected with a press clamp fastening screw and a locking nut, and the height of the press clamp downward pressure is adjusted by adjusting the height of the press clamp fastening screw and the locking nut to achieve movement in the Z-axis direction;

[0005] The 360-degree rotatable sliding adjustment structure comprises a sliding fixed base plate, wherein there are two sliding fixed base plates, two sliding blocks are arranged above each sliding fixed base plate, a hexagonal fixing nut is arranged below the sliding fixed base plate (3), and the sliding block is connected to the sliding fixed base plate (3) by a sliding screw, and the sliding fixed base plate is connected to the upper surface of the base plate;

[0006] The sliding fixed bottom plate is respectively provided with two long grooves, the long grooves are provided with hexagonal fixing nuts, the sliding block is provided with a through hole penetrating the sliding block, and the lower end of the sliding screw passes through the through hole on the sliding block and the long grooves on the sliding fixed bottom plate and is fixedly connected with the hexagonal fixing nut.

[0007] Furthermore, there are four horizontal pressing clamps in total, two of which are arranged on each sliding fixed base plate, the bottom of the horizontal pressing clamps is connected to the upper surface of the sliding block, and the horizontal pressing clamps are arranged symmetrically at the four corners to ensure uniform pressure distribution.

[0008] Furthermore, the long groove on the sliding fixing plate is a step-shaped through-type with a small top and a large bottom. The width of the long groove at the bottom is the same as the width of the hexagonal fixing nut. The lower end of the step long groove is used to clamp the parallel wall of the hexagonal fixing nut so that it cannot rotate. Since the upper part of the step long groove is smaller than the width of the hexagonal fixing nut, it is locked with the sliding screw and cannot fall off, and the hexagonal fixing nut can be moved along the length direction of the long groove.

[0009] Furthermore, the sliding block can drive the horizontal pressing clamp to slide along the length direction of the long groove on the sliding fixed bottom plate, which is equivalent to the distance adjustment in the X-axis direction.

[0010] Furthermore, the central circular hole of the sliding block and the sliding screw are concentrically structured, so that the sliding block can rotate on the sliding fixed base plate, thereby causing the sliding block to drive the horizontal pressing clamp to rotate 360 ​​degrees, which is equivalent to position adjustment in the Y-axis direction.

[0011] Furthermore, the heat dissipation structure includes a water-cooled radiator, which is located above the base plate and between two sliding fixed base plates, and center scale lines are distributed on the front and sides of the water-cooled radiator.

[0012] Furthermore, a circular water pipe is laid flat inside the water-cooled radiator, and a water inlet and a water outlet are connected to the outside.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention has a simple structure and is easy to use. Based on the nature of the power load cycle test of the modular power semiconductor module, it is proposed for the first time to apply the horizontal pressure clamp to the pressure structure of the press-fitting mechanism. The key point of this design is the design of a fixing device that is light and compact in structure, easy and quick to operate, and can be pressed at any time. A 360-degree slidable and rotatable pressure clamp designed by a sliding block, a sliding fixed base plate, and a hexagonal fixing nut is designed in conjunction with the lower end of the horizontal pressure clamp to meet the different requirements of length, width, and height of different fixed positions of different modules, thereby improving the versatility and high adaptability of the press-fitting mechanism to power semiconductor modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0015] Figure 2 It is a schematic diagram of the top view of the structure of the present invention;

[0016] Figure 3 It is a partial schematic diagram of the connection between the sliding block, the sliding fixed base plate and the hexagonal fixed nut of the present invention;

[0017] Figure 4 It is a partial schematic diagram of the pressure-applying structure of the horizontal pressure clamp of the present invention;

[0018] Figure 5 It is a schematic diagram of the local structure of the long groove of the present invention;

[0019] In the figure, 1-base plate, 2-hexagonal fixing nut, 3-sliding fixing base plate, 4-sliding screw, 5-sliding block, 6-horizontal pressure clamp, 7-pressure clamp fastening screw, 8-fastening nut, 9-module, 10-water cooling radiator, 11-water inlet, 12-water outlet, 13-locking nut, 14-fixing screw, 15-screw, 16-countsunk screw, 17-connecting nut, 18-long groove. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. The components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various configurations. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention. In the embodiments, the components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application.

[0021] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "front", "back" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0022] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be an electrical connection; it can be a hydraulic oil circuit connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] refer to Figures 1 to 4 A press-fitting mechanism for power semiconductor module power load cycle test consists of three major parts: a horizontal press clamp pressure structure, a 360-degree rotatable sliding adjustment structure and a heat dissipation structure, all of which are located on a base plate 1.

[0024] 360 degree rotatable sliding adjustment structure according to Figure 1 and Figure 2 As shown, it mainly includes a horizontal pressure clamp 6, a hexagonal fixing nut 2, a sliding fixing base plate 3, a sliding screw 4, a sliding block 5, and a fixing screw 14. There are two sliding fixing base plates 3, which are respectively located on both sides above the base plate 1. The sliding block 5 is located above the sliding fixing base plate 3. Two sliding blocks 5 are arranged on each sliding fixing base plate 3. The sliding block 5 is provided with a vertically extending through threaded hole, and a sliding screw 4 is arranged in the threaded hole. The sliding block 5 is connected to the sliding fixing base plate 3 through the sliding screw 4;

[0025] The sliding screw 4 is connected to the sliding fixed base plate 3 through the hexagonal fixing nut 2. The hexagonal fixing nut 2 is located below the sliding fixed base plate 3. The surface of the sliding fixed base plate 3 is provided with a through-type stepped long groove 18 with a small upper part and a large lower part. Each sliding fixed base plate 3 is provided with two long grooves 18. The two long grooves 18 are parallel to each other. The width of the lower part of the long groove 18 is the same as the width of the hexagonal fixing nut 2. The hexagonal fixing nut 2 is located in the long groove 18. The lower end of the stepped long groove 18 is used to clamp the parallel wall of the hexagonal fixing nut 2 so that it cannot rotate. Then the sliding screw 4 is rotated to make the lower end of the sliding screw 4 inserted into the hexagonal fixing nut 2. Since the upper part of the stepped long groove 18 is smaller than the width of the hexagonal fixing nut 2, it is locked with the sliding screw 4 and cannot fall off, but can move along the length direction of the long groove 18.

[0026] Each sliding block 5 has four threaded holes on its upper surface, and fixing screws 14 are provided in the threaded holes. The bottom of the horizontal pressing clamp 6 is fixedly connected to the sliding block 5 through the fixing screws 14, so that the horizontal pressing clamp 6 and the sliding block 5 can move left and right along the X-axis direction on the sliding fixed bottom plate 3. The concentric structure between the sliding screws 4 and the sliding block 5 enables the sliding block 5 to achieve 360-degree rotation, and the horizontal pressing clamp 6 can move in the Y-axis direction at the same time.

[0027] The horizontal pressure clamp pressure structure is based on Figure 1 and Figure 2 As shown, it mainly includes a horizontal pressure clamp 6, a pressure clamp fastening screw 7, a fastening nut 8 and a locking nut 13; there are four horizontal pressure clamps 6, which are respectively fixed to the upper surfaces of the four sliding blocks 5 by four fixing screws 14, and an opening is provided at one end of the horizontal pressure clamp 6 close to each other, and a pressure rod is provided at the other end, and a pressure clamp fastening screw 7 passes through the opening, and two locking nuts 13 are sleeved on the pressure clamp fastening screw 7, and the two locking nuts 13 are respectively located on the upper and lower sides of the opening of the horizontal pressure clamp 6, and the lower end of the fastening screw 7 is connected to the fastening nut 8; the horizontal pressure clamp 6 is symmetrically distributed at four corners to ensure uniform pressure, and then the height of the pressure clamp is adjusted by adjusting the height of the pressure clamp fastening screw 7 and the locking nut 13 to achieve movement in the Z-axis direction, and the horizontal pressure clamp 6 is pressed down after the adjustment is completed, and the crimping of power semiconductor modules 9 of different heights can be achieved by pressing down the fastening screw 7 and the fastening nut 8 of the horizontal pressure clamp 6; wherein, the horizontal pressure clamp 6 is a prior art.

[0028] According to the connection and cooperation of the above-mentioned horizontal pressure clamp pressure structure and the 360-degree rotatable sliding adjustment structure, a complete set of pressure clamp pressure system with adjustable X-axis, Y-axis and Z-axis directions is realized. Figure 2 and Figure 3 As shown, two through-type step-shaped long grooves 18 are symmetrically distributed on a sliding fixed bottom plate 3, and two complete sets of pressure clamp pressure systems can be connected at the same time.

[0029] Place the heat dissipation structure according to Figure 1 and Figure 2 As shown, it includes a base plate 1, a water-cooled radiator 10, a water inlet 11, a water outlet 12, screws 15, and countersunk screws 16. The water-cooled radiator 10 is located between two sliding fixed base plates 3. Four threaded holes are provided on the water-cooled radiator 10 and the two sliding fixed base plates 3. The sliding fixed base plates 3 are symmetrically fixed to the base plate 1 by screws 15. Since two horizontal clamps 6 are symmetrically connected to each sliding fixed base plate 3, four horizontal clamps are symmetrically connected to the base plate 1 at four corners. Four threaded holes are provided on the base plate 1, and four threaded blind holes are provided on the lower surface of the water-cooled radiator 10. The countersunk screws 16 pass through the threaded holes from the bottom of the base plate 1 and are connected to the threaded blind holes on the water-cooled radiator 10, so that the water-cooled radiator 10 is fixedly connected to the base plate 1. The front and side of the water-cooled radiator 10 are provided with center scale lines as a reference for placing the center position of the module. The water-cooled radiator 10 has an annular water pipe laid flat inside. When dissipating heat, cooling water enters from the water inlet 11 and flows out from the water outlet 12 through the internal heat dissipation pipe, completing a heat dissipation cycle.

[0030] When the pressing mechanism is working, the module 9 is placed in the middle of the water-cooled radiator 10 through the scale lines on the front and side of the water-cooled radiator 10. According to the different fixed points of the modules 9 on the market, and the different length, width and height dimensions, the corresponding number of fixed clamps and the sliding and rotating adjustment of the X-axis, Y-axis and Z-axis coordinate positions of the clamps are selected, so as to reliably press and tighten the module 9. After the crimping is in place, the connecting nut 17 is led out through the module 9 electrode, and its rated current level is connected to heat it. After a certain period of power supply, the power is turned off and the water is turned on. After the cooling water enters the water-cooled radiator 10 from the water inlet 11, it flows out from the water outlet 12 for heat dissipation. After a period of heat dissipation, the water is turned off and the power is turned on to continue to heat the module 9 with the rated current. This cycle is repeated to complete the power load cycle test of the module.

[0031] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A press-fitting mechanism for power semiconductor module power load cycle test, comprising a horizontal press clamp pressure structure, a 360-degree rotatable sliding adjustment structure and a heat dissipation placement structure, all of which are located on a bottom plate (1), wherein the horizontal press clamp pressure structure is located above the 360-degree rotatable sliding adjustment structure, and the heat dissipation placement structure is located at the center of the bottom plate (1), characterized in that: The horizontal pressure clamp pressure structure comprises a horizontal pressure clamp (6), to which a pressure clamp fastening screw (7) and a locking nut (13) are connected, and the height of the pressure clamp downward pressure is adjusted by adjusting the height of the pressure clamp fastening screw (7) and the locking nut (13), thereby achieving movement in the Z-axis direction; The 360-degree rotatable sliding adjustment structure comprises a sliding fixed base plate (3), wherein there are two sliding fixed base plates (3), two sliding blocks (5) are arranged above each sliding fixed base plate (3), a hexagonal fixing nut (2) is arranged below the sliding fixed base plate (3), the sliding block (5) is connected to the sliding fixed base plate (3) by a sliding screw (4), and the sliding fixed base plate (3) is connected to the upper surface of the base plate (1); The sliding fixed bottom plate (3) is respectively provided with two long grooves, and a hexagonal fixing nut (2) is arranged in the long grooves. The sliding block (5) is provided with a through hole penetrating the sliding block (5). The lower end of the sliding screw (4) passes through the through hole on the sliding block (5) and the long groove on the sliding fixed bottom plate (3) and is fixedly connected with the hexagonal fixing nut (2).

2. A press-fitting mechanism for power semiconductor module power load cycle test according to claim 1, characterized in that: There are four horizontal pressing clamps (6) in total, two of which are arranged on each sliding fixed base plate (3), the bottom of the horizontal pressing clamps (6) is connected to the upper surface of the sliding block (5), and the horizontal pressing clamps (6) are arranged symmetrically at four corners.

3. A press-fitting mechanism for power semiconductor module power load cycle test according to claim 1, characterized in that: The long groove on the sliding fixing plate (3) is a through-type step-shaped groove that is smaller at the top and larger at the bottom. The width of the lower part of the long groove is the same as the width of the hexagonal fixing nut (2). The lower end of the step long groove is used to clamp the parallel wall of the hexagonal fixing nut (2) so that it cannot rotate. Since the upper part of the step long groove is smaller than the width of the hexagonal fixing nut (2), it is locked with the sliding screw (4) and cannot fall off, and the hexagonal fixing nut (2) can be moved along the length direction of the long groove.

4. A press-fitting mechanism for power semiconductor module power load cycle test according to claim 1, characterized in that: The sliding block (5) can drive the horizontal pressing clamp (6) to slide on the sliding fixed bottom plate (3) along the length direction of the long groove, which is equivalent to the distance adjustment in the X-axis direction.

5. A press-fitting mechanism for power semiconductor module power load cycle test according to claim 4, characterized in that: The central circular hole of the sliding block (5) and the sliding screw (4) are connected through a concentric structure, so that the sliding block (5) can rotate on the sliding fixed base plate (3), thereby enabling the sliding block (5) to drive the horizontal pressing clamp (6) to rotate 360 ​​degrees, which is equivalent to adjusting the position in the Y-axis direction.

6. A press-fitting mechanism for power semiconductor module power load cycle test according to claim 1, characterized in that: The heat dissipation structure comprises a water-cooled radiator (10), which is located above the bottom plate and between two sliding fixed bottom plates (3), and central scale lines are distributed on the front and side surfaces of the water-cooled radiator (10).

7. A press-fitting mechanism for power semiconductor module power load cycle test according to claim 6, characterized in that: The water-cooling radiator (10) has an annular water pipe laid flat inside and is connected to a water inlet (11) and a water outlet (12) outside.

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