Crystal grain high-temperature testing device

Abstract

An air cylinder is installed above a base through a support, a test probe is installed on a push rod of the air cylinder, a cross-shaped sliding table is installed above the base, a placement seat is installed above a sliding block of the cross-shaped sliding table, a positioning groove is formed in the middle of the upper portion of the placement seat, and a clamping groove is formed in the middle of the upper portion of the placement seat. A metal card is placed in the positioning groove, an adsorption mechanism is installed at the lower end of the placement seat through a support in a suspended mode, a jacking mechanism is arranged outside the adsorption mechanism, a dustproof mechanism used for being in vertical sliding insertion connection with the adsorption hole and the center hole is installed above the adsorption mechanism, and the dustproof mechanism is connected with the jacking mechanism; the positioning groove is formed in the placement seat, the metal card is placed in the positioning groove, the placement groove used for placing the crystal grain is formed in the metal card, the crystal grain can be conveniently placed on the metal card and then placed on the placement seat to be heated, and the test probe is arranged in a matched mode, so that the crystal grain can be tested in a high-temperature environment.

Description

Technical Field

[0001] The invention relates to the technical field of round crystal grain testing, and in particular to a high-temperature grain testing device. Background Art

[0002] After the wafer has been tested by CP, it will continue to flow to the back end and then go through processes such as grinding / cutting to become individual crystals. When abnormalities occur on the client side due to various problems, the crystal needs to be returned to CP for testing. This technology is a single bare crystal test technology.

[0003] In existing work, the die needs to be fixed on the test bench during testing. Generally, the die is pasted on a blue film, and then the blue film is pasted on a blank wafer. After that, a vacuum suction cup is used to adsorb and fix it, and then the test is performed on a probe station test platform. However, this method is limited by the blue film and the pasting technique. Since the blue film cannot be used at high temperatures, testing in this way is limited to room temperature.

[0004] At present, after the test is completed, the power supply of the vacuum suction cup needs to be disconnected, and then the blue film with the grains attached and the blank sheet are removed. Due to the strong adsorption force of the vacuum suction cup, the tester may directly take the blue film and the blank sheet in the case of misoperation, while they are still adsorbed by the vacuum suction cup. The grains themselves are small and extremely thin. If the grains are directly removed without releasing the adsorption, they may be damaged. For this reason, we designed a high-temperature test device for grains. Summary of the invention

[0005] The invention provides a high-temperature crystal grain testing device, which solves the problem that the blue film cannot be used at high temperatures, so testing in this way is limited to room temperature.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions: A high-temperature testing device for grains, comprising a base, a cylinder is installed above the base through a bracket, a test probe is installed on a push rod of the cylinder, a cross slide is installed above the base, a placement seat is installed above a slider of the cross slide, a positioning groove is opened in the middle of the top of the placement seat, a center hole is opened at the center of the bottom of the positioning groove, a plurality of adsorption holes are opened in a circular array at the bottom of the positioning groove, a metal card is placed in the positioning groove, and a placement groove is opened at the center of the upper surface of the metal card; An adsorption mechanism is installed in the air at the lower end of the placement seat through a bracket, and the multiple adsorption holes and the center hole are connected to the adsorption mechanism. A lifting mechanism is arranged on the outside of the adsorption mechanism, and the lifting mechanism passes through the placement seat and is connected to the metal card. A dustproof mechanism for slidingly plugging the adsorption holes and the center hole up and down is installed above the adsorption mechanism, and the dustproof mechanism is connected to the lifting mechanism.

[0007] Furthermore, the placement seat is provided with a plurality of strip grooves distributed in a circumferential array, the plurality of strip grooves respectively correspond to and are connected with the plurality of adsorption holes, and the plurality of strip grooves converge with each other near one end of the central hole and are connected with the central hole; An electric heating plate is also provided inside the placement seat, which is used to heat the metal card above, thereby heating the grains on the metal card, so as to facilitate testing in a high temperature environment; The plurality of adsorption holes and the center hole all penetrate the placement seat up and down. A circular hole is opened at the center of the placement slot of the metal card, and the circular hole coincides with the center hole. The size and shape of the metal card are consistent with the size and shape of the positioning slot, and the size and shape of the placement slot are completely consistent with the size and shape of the grain. The metal card is provided with a plurality of different models. The external size and shape of each model of the metal card are consistent with the shape and size of the positioning slot, and the shape and size of its placement slot match the size and shape of the grain of the corresponding model. In this way, when testing different grains, it is only necessary to replace different metal cards.

[0008] Further, the adsorption mechanism includes a mounting base plate mounted below the placement seat through a bracket, a fixing seat is fixed above the mounting base plate, a rotating ring is rotatably mounted outside the fixing seat, and the lower end of the rotating ring is rotatably connected to the upper surface of the mounting base plate, a spiral portion is provided on the upper surface of the rotating ring, and a mounting top plate is fixed above the fixing seat; An adsorption groove is provided at the center above the fixed seat, and four groups of widened grooves distributed in an annular shape are provided on the upper surface of the fixed seat, the widened groove is connected to the adsorption groove, and a connecting port connected to the outside is provided on the side of the widened groove away from the adsorption groove, a piston is slidably arranged in the widened groove, a moving block is slidably arranged inside the piston, and a plurality of equally spaced meshing parts are provided on the lower surface of the moving block away from the piston, the meshing parts are connected to the spiral parts, and the four side surfaces of the piston slide with the widened groove, the mounting top plate, and the inner wall of the mounting bottom plate respectively and are sealed. When the rotating ring rotates, the spiral part rotates therewith, so that the moving block can move in a straight line along the connecting port, thereby moving the piston together, and the outward moving piston will increase the overall volume of the enclosed space formed between the four pistons, and reduce its internal pressure, so that the metal card and the grains above it can be adsorbed and fixed, and the overall adsorption strength is not large, which also avoids damage to the grains caused by equipment failure.

[0009] Furthermore, the outer ring of the rotating ring is provided with a plurality of meshing grooves distributed in a circumferential array, the outer ring of the mounting base plate is provided with a driving motor installed through a motor frame, a driving gear is installed on the output shaft of the driving motor, the driving gear is meshedly connected with the meshing groove, and the driving motor is a forward and reverse motor, the rotation of which can cause the rotating ring to rotate accordingly, thereby rotating the spiral part above it, and the rotation of the spiral part can cause the moving block and the piston to move accordingly.

[0010] Furthermore, a time delay groove is provided inside the piston, and the time delay groove is in a convex shape, and the time delay groove is connected to the widening groove at a side away from the adsorption groove; The moving block is provided with a T-shaped head on the inner side, and the T-shaped head is slidably placed in the delay groove. The T-shaped head can move along the delay groove, and when the inner end of the T-shaped head moves outward, the moving block will not immediately make the piston move outward. There is a time difference between the two. During this period of time, the lifting rod in the lifting mechanism will move downward, thereby making the metal card move downward and be placed in the positioning groove, and when the lifting rod is retracted to the inside of the placement seat, the T-shaped head is in contact with the outer end along the delay groove, and the piston will move with the moving block, and the metal card and the grain can be adsorbed and fixed at this time.

[0011] Furthermore, a connecting spring is provided in the widened groove, the connecting spring is placed below the moving block, and two ends of the connecting spring are respectively fixed to the piston and the connecting port; When the piston is at the innermost side of the widened groove, the connecting spring is in a normal state. During the inward movement of the movable block, the piston is acted upon by the connecting spring and will move inward along with the movable block. When the piston is at its most initial position, the T-shaped head of the movable block contacts the outermost end of the delay groove. At this time, the entire adsorption hole, the center hole and the internal air pressure of the adsorption groove return to the initial state, that is, the internal and external air pressures are the same. At this time, the top of the lifting rod is flush with the bottom of the positioning groove, and will not be affected by adsorption during the subsequent lifting process, thereby facilitating its lifting.

[0012] Furthermore, a lifting hole is formed downwardly through each of the four corners at the bottom of the positioning groove; The lifting mechanism comprises four bearing frames arranged in an annular shape outside the mounting base plate, a threaded sleeve is rotatably mounted in the bearing frame, a driving gear is fixed to the outer ring of the threaded sleeve, the driving gear is meshed with the tooth groove of the outer ring of the rotating ring, a lifting rod is threadedly mounted in the threaded sleeve, and the upper end of the lifting rod passes through the lifting hole and is placed above it; The lifting rod includes a threaded section, which is threadedly connected to the threaded sleeve. A straight rod section is integrally formed at the upper end of the threaded section. The straight rod section slides up and down through the lifting hole and is placed above it. When the rotating ring in the adsorption mechanism rotates, the threaded sleeve can rotate accordingly under the action of the driving gear, thereby causing the threaded section of the lifting rod to move upward or upward.

[0013] Furthermore, the inner wall of the lifting hole is provided with two groups of symmetrically distributed limiting strips, and the outer ring surface of the straight rod section is provided with two groups of symmetrically distributed limiting grooves, and the limiting strips are slidably connected with the limiting grooves, which can limit the rotation of the lifting rod, thereby facilitating the vertical linear movement of the lifting rod; The top of the lifting rod is recessed to form a card interface, and the four corners of the lower end of the metal card all protrude downward to form a card connection protrusion. The card connection protrusion is interference-connected with the card interface, which is convenient for the connection between the metal card and the lifting rod. When the lifting rod is completely inserted into the lifting hole, the lifting rod continues to move downward, which will separate the metal card from the lifting rod and will not interfere with the normal movement of the lifting rod. When the lifting rod moves upward, it can move upward, which makes it easy to remove the metal card. After that, the metal card can be tipped over to pour out the grains inside.

[0014] Further, the dustproof mechanism includes a plurality of guide columns fixed in an annular shape above the mounting top plate, a plurality of the guide columns are slidably sleeved with a lifting plate up and down, and a tension spring is sleeved on the guide column, and the upper and lower ends of the tension spring are respectively connected to the lower surface of the lifting plate and the upper surface of the mounting top plate, a plurality of evenly distributed valve cores are arranged above the lifting plate, and an opening is arranged at the center above the lifting plate, a needle core is arranged in the opening through a tripod, a plurality of valve cores pass through corresponding adsorption holes one by one and are placed above the positioning groove, and the needle cores all pass through the center hole and are placed above the positioning groove; The outer ring of the lifting plate is provided with four groups of annularly distributed connecting plates, and the connecting plates are slidably sleeved on the corresponding lifting rods. The lifting rods are provided with lifting rings, and the lifting rings are located below the connecting plates. In the initial state, the lifting rings are connected to the connecting plates, and the connecting plates make the lifting plate face upward, and the valve core and needle core on the lifting plate are 2-3 mm above the bottom end of the positioning groove. When the lifting rod moves downward, the lifting plate will move downward under the action of the tension spring, and the valve core and needle core will move downward at this time, and when the lifting plate moves to the bottom, the valve core and needle core are still in the corresponding adsorption holes and center holes, and are not completely separated, and the needle core, valve core and inner wall of the adsorption hole and center hole slide and are sealed.

[0015] Furthermore, bellows are provided at the center above and below the lifting plate. The upper bellows is connected to the center hole below the placement seat. The opening above the mounting top plate is designed to form an air hole, and the air port is directly above the adsorption groove. The lower bellows is connected to the air hole. During the up and down movement of the lifting plate, the bellows can change accordingly, thereby facilitating the connection between the adsorption mechanism below and the placement seat, and the sealing is good and no air leakage will occur.

[0016] Beneficial effects of the present invention: 1. By setting a positioning groove on the placement seat, and placing a metal card in the positioning groove, and setting a placement groove for placing the grain on the metal card, the grain is convenient to be placed on the metal card, and then placed on the placement seat for heating. With the set test probe, it can be tested in a high temperature environment, and the shape and size of the metal card can be changed in the same way, which is suitable for testing various types of grains; 2. By setting a plurality of adsorption holes and a center hole on the placement seat, an adsorption mechanism is set under the placement seat, and the center hole and the adsorption hole are connected with the air holes in the adsorption mechanism. The adsorption mechanism can adsorb and fix the metal card and the crystal grain above, so that it will not shake during the movement and detection process, thereby improving the stability, and the overall adsorption strength is appropriate, which also avoids the damage of the crystal grain caused by equipment failure; 3. By setting a lifting mechanism on the adsorption mechanism, and the lifting rod in the lifting mechanism is in the placement seat, the metal card can be lifted. After the test is completed, the metal card can be placed outside the positioning groove, which is convenient for taking. The lifting mechanism is matched with the adsorption mechanism. Before lifting and taking, the adsorption mechanism will first disconnect the adsorption, and then it can be taken, avoiding the removal of the metal card and the grain before the adsorption and fixation are disconnected, which can avoid the wrong operation of the inspection personnel and improve the safety; 4. By arranging a dustproof mechanism above the adsorption mechanism, and connecting the dustproof mechanism with the lifting mechanism, the dustproof mechanism can move down with the lifting mechanism when it moves down, and will not interfere with the normal adsorption and fixation. After the lifting mechanism is lifted, it can move upward with it, thereby sealing multiple adsorption holes and the center hole to prevent dust from falling and clogging it when it is not in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a main schematic diagram of a high temperature grain testing device proposed by the present invention; Figure 2 for Figure 1 Schematic diagram of the bottom structure of the middle placement seat; Figure 3 for Figure 1 A schematic diagram of the structure of the middle placement seat; Figure 4 for Figure 3A cross-sectional schematic diagram of the middle placement seat; Figure 5 for Figure 2 Structural diagram of the middle adsorption mechanism, dust prevention mechanism and lifting mechanism; Figure 6 for Figure 5 Structural diagram of the middle adsorption mechanism and the lifting mechanism; Figure 7 for Figure 6 Schematic diagram of the internal structure of the adsorption mechanism; Figure 8 for Figure 7 Isometric drawing of Fig. 9 for Figure 8 Schematic diagram of the structure of the moving block and the piston; Fig.10 for Figure 7 A top view of Fig.11 for Fig.10 Sectional view at AA; Fig.12 for Figure 5 Schematic diagram of the structure of the dust protection mechanism.

[0018] Numbers in the figure: 1, base; 2, cross slide; 3, test probe; 4, placement seat; 41, positioning slot; 42, lifting hole; 43, limit strip; 44, adsorption hole; 45, center hole; 46, strip groove; 5, metal card; 51, placement slot; 6, adsorption mechanism; 61, mounting bottom plate; 62, rotating ring; 621, meshing groove; 63, spiral part; 64, driving motor; 65, driving gear; 66, mounting top plate; 67, fixed seat; 671, adsorption slot; 672, widening slot; 673, connecting port; 68, moving block; 681, T-shaped head; 682, meshing part; 69, piston; 691, delay groove; 692, connecting spring; 7, lifting mechanism; 71, driving gear; 72, threaded sleeve; 73, lifting rod; 731, threaded section; 732, straight rod section; 733, limiting groove; 734, card interface; 735, lifting ring; 8, dustproof mechanism; 81, lifting plate; 82, valve core; 83, bellows; 84, guide column; 85, tension spring; 86, connecting plate. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] Reference Figure 1-12A high temperature test device for grains comprises a base 1, a cylinder is mounted on the base 1 through a bracket, a test probe 3 is mounted on the push rod of the cylinder, a cross slide 2 is mounted on the base 1, a placement seat 4 is mounted on the slider of the cross slide 2, a positioning groove 41 is opened in the middle of the top of the placement seat 4, a center hole 45 is opened at the center of the bottom of the positioning groove 41, a plurality of adsorption holes 44 are opened in a circular array at the bottom of the positioning groove 41, a metal card 5 is placed in the positioning groove 41, and a placement groove 51 is opened at the center of the upper surface of the metal card 5; An adsorption mechanism 6 is installed in the air at the lower end of the placement seat 4 through a bracket, and multiple adsorption holes 44 and a center hole 45 are connected to the adsorption mechanism 6. A lifting mechanism 7 is arranged on the outside of the adsorption mechanism 6. The lifting mechanism 7 passes through the placement seat 4 and is connected to the metal card 5. A dustproof mechanism 8 is installed above the adsorption mechanism 6 for slidingly inserting the adsorption holes 44 and the center hole 45 up and down, and the dustproof mechanism 8 is connected to the lifting mechanism 7.

[0021] A plurality of strip grooves 46 distributed in a circumferential array are provided inside the placement seat 4. The plurality of strip grooves 46 correspond to and are connected with the plurality of adsorption holes 44 respectively. The plurality of strip grooves 46 converge with each other near one end of the central hole 45 and are connected with the central hole 45. An electric heating plate is also provided inside the placement seat 4, which is used to heat the metal card 5 above, thereby heating the grains on the metal card 5, so as to facilitate testing in a high temperature environment; A plurality of adsorption holes 44 and a center hole 45 pass through the placement seat 4 from top to bottom. A circular hole is provided at the center of the placement slot 51 of the metal card 5, and the circular hole coincides with the center hole 45. The size and shape of the metal card are consistent with the size and shape of the positioning slot 41, and the size and shape of the placement slot 51 are completely consistent with the size and shape of the grain. The metal card 5 is provided with a plurality of different models. The external size and shape of each model of the metal card 5 are consistent with the shape and size of the positioning slot 41, and the shape and size of its placement slot 51 match the size and shape of the grain of the corresponding model. In this way, when testing different grains, it is only necessary to replace different metal cards 5.

[0022] The adsorption mechanism 6 includes a mounting base plate 61 mounted below the placement seat 4 through a bracket, a fixing seat 67 is fixed above the mounting base plate 61, a rotating ring 62 is rotatably mounted outside the fixing seat 67, and the lower end of the rotating ring 62 is rotatably connected to the upper surface of the mounting base plate 61, a spiral portion 63 is provided on the upper surface of the rotating ring 62, and a mounting top plate 66 is fixed above the fixing seat 67; An adsorption groove 671 is provided at the center of the upper part of the fixed seat 67, and four groups of widened grooves 672 distributed in an annular manner are provided on the upper surface of the fixed seat 67, the widened groove 672 is connected to the adsorption groove 671, and a connecting port 673 connected to the outside is provided on the side of the widened groove 672 away from the adsorption groove 671, a piston 69 is slidably provided in the widened groove 672, a moving block 68 is slidably provided inside the piston 69, a plurality of meshing portions 682 distributed at equal intervals are provided on the lower surface of the moving block 68 away from the piston 69, the meshing portion 682 is connected to the spiral portion 63, and the four sides of the piston 69 are divided into The widened groove 672, the mounting top plate 66, and the mounting bottom plate 61 are designed to slide and seal with the inner walls. When the rotating ring 62 rotates, the spiral portion 63 rotates therewith, so that the moving block 68 can move in a straight line along the connecting port 673, so that the piston 69 moves together. The outward moving piston 69 will increase the overall volume of the enclosed space formed between the four pistons 69, and the internal pressure is lower than the external pressure, so that the metal card 5 and the grains above it can be adsorbed and fixed, and the overall adsorption strength is not large, which also avoids damage to the grains caused by equipment failure.

[0023] The outer ring of the rotating ring 62 is provided with a plurality of meshing grooves 621 distributed in a circumferential array. The outer ring of the mounting base plate 61 is provided with a driving motor 64 via a motor frame. A driving gear 65 is installed on the output shaft of the driving motor 64. The driving gear 65 is meshedly connected with the meshing groove 621. The driving motor 64 is a forward and reverse motor. Its rotation can cause the rotating ring 62 to rotate accordingly, thereby rotating the spiral portion 63 above it. The rotation of the spiral portion 63 can cause the moving block 68 and the piston 69 to move accordingly.

[0024] A time delay groove 691 is provided inside the piston 69, and the time delay groove 691 is in a convex shape. The side of the time delay groove 691 away from the adsorption groove 671 is connected to the widening groove 672; A T-shaped head 681 is provided on the inner side of the moving block 68, and the T-shaped head 681 is slidably placed in the delay groove 691. The T-shaped head 681 can move along the delay groove 691, and when the inner end of the T-shaped head 681 moves outward, the moving block 68 will not immediately move the piston 69 outward. There is a time difference between the two. During this period of time, the lifting rod 73 in the lifting mechanism 7 will move downward, thereby causing the metal card 5 to move downward and be placed in the positioning groove 41, and when the lifting rod 73 shrinks to the inside of the placement seat 4, the T-shaped head 681 at this time contacts the outer end along the delay groove 691, and the piston 69 will move together with the moving block 68, at this time, the metal card 5 and the grain can be adsorbed and fixed.

[0025] A connecting spring 692 is disposed in the widened groove 672 , and the connecting spring 692 is placed below the moving block 68 , and both ends of the connecting spring 692 are respectively fixed to the piston 69 and the connecting port 673 ; When the piston 69 is at the innermost side of the widened groove 672, the connecting spring 692 is in a normal state. During the inward movement of the movable block 68, the piston 69 is acted upon by the connecting spring 692 and will move inward along with the movable block 68. When the piston 69 is at its most initial position, the T-shaped head 681 of the movable block 68 contacts the outermost end of the delay groove 691. At this time, the air pressure inside the entire adsorption hole 44, the center hole 45 and the adsorption groove 671 returns to the initial state, that is, the air pressure inside and outside the adsorption groove 671 is the same. At this time, the top of the lifting rod 73 is flush with the bottom end of the positioning groove 41, and will not be affected by adsorption during the subsequent lifting process, which facilitates its lifting and will not cause deformation of the guide grains due to excessive adsorption force.

[0026] A lifting hole 42 is formed at each of the four corners of the bottom end of the positioning groove 41. The lifting mechanism 7 includes four bearing frames arranged in an annular shape outside the mounting base plate 61, a threaded sleeve 72 is rotatably mounted inside the bearing frame, a driving gear 71 is fixed to the outer ring of the threaded sleeve 72, the driving gear 71 is meshed with the tooth groove 621 of the outer ring of the rotating ring 62, a lifting rod 73 is installed on the inner thread of the threaded sleeve 72, and the upper end of the lifting rod 73 passes through the lifting hole 42 and is placed above it; The lifting rod 73 includes a threaded section 731, which is threadedly connected to the threaded sleeve 72. A straight rod section 732 is integrally formed at the upper end of the threaded section 731. The straight rod section 732 slides up and down through the lifting hole 42 and is placed above it. When the rotating ring 62 in the adsorption mechanism 6 rotates, the threaded sleeve 72 can rotate accordingly under the action of the driving gear 71, thereby causing the threaded section 731 of the lifting rod 73 to move upward or upward.

[0027] Two groups of symmetrically distributed limiting strips 43 are arranged on the inner wall of the lifting hole 42, and two groups of symmetrically distributed limiting grooves 733 are arranged on the outer surface of the straight rod section 732. The limiting strips 43 are slidably connected with the limiting grooves 733, which can limit the rotation of the lifting rod 73, thereby facilitating the vertical linear movement of the lifting rod 73. The top of the lifting rod 73 is recessed to form a card interface 734, and the four corners of the lower end of the metal card 5 all protrude downward to form a card connection protrusion. The card connection protrusion and the card interface 734 are interference fit, which is convenient for the connection between the metal card 5 and the lifting rod 73. When the lifting rod 73 is completely inserted into the lifting hole 42, the lifting rod 73 continues to move downward, which will separate the metal card 5 from the lifting rod 73 and will not interfere with the normal movement of the lifting rod 73. When the lifting rod 73 moves upward, it can move upward, which makes it easier to remove the metal card 5. Thereafter, the metal card 5 can be tipped over to pour out the grains inside.

[0028] The dustproof mechanism 8 includes a plurality of guide columns 84 fixed in an annular shape above the mounting top plate 66, and a plurality of guide columns 84 are slidably sleeved with a lifting plate 81 up and down, and a tension spring 85 is sleeved on the guide column 84, and the upper and lower ends of the tension spring 85 are respectively connected to the lower surface of the lifting plate 81 and the upper surface of the mounting top plate 66, and a plurality of evenly distributed valve cores 82 are arranged above the lifting plate 81, and an opening is arranged at the center above the lifting plate 81, and a needle core is arranged in the opening through a tripod, and a plurality of valve cores 82 pass through the corresponding adsorption holes 44 one by one and are placed above the positioning groove 41, and the needle cores all pass through the center hole 45 and are placed above the positioning groove 41; The outer ring of the lifting plate 81 is provided with four groups of annularly distributed connecting plates 86, and the connecting plates 86 are slidably sleeved on the corresponding lifting rods 73. The lifting rods 73 are provided with lifting rings 735, and the lifting rings 735 are located below the connecting plates 86. In the initial state, the lifting rings 735 are connected to the connecting plates 86, and the connecting plates 86 make the lifting plate 81 face upward, and the valve core 82 and the needle core on the lifting plate 81 are 2-3 mm above the bottom end of the positioning groove 41. When the lifting rod 73 moves downward, the lifting plate 81 will move downward accordingly under the action of the tension spring 85. At this time, the valve core 82 and the needle core will move downward accordingly, and when the lifting plate 81 moves to the bottom, the valve core 82 and the needle core are still in the corresponding adsorption hole 44 and the center hole 45, and are not completely separated, and the needle core, the valve core 82 and the inner wall of the adsorption hole 44 and the center hole 45 slide and are sealed.

[0029] Bellows 83 are provided at the center above and below the lifting plate 81. The upper bellows 83 is connected to the center hole 45 below the placement seat 4. The opening above the mounting top plate 66 is designed to form an air hole, and the air port is directly above the adsorption groove 671. The lower bellows 83 is connected to the air hole. During the up and down movement of the lifting plate 81, the bellows 83 can change accordingly, thereby facilitating the connection between the lower adsorption mechanism 6 and the placement seat 4, and the sealing is good, and no air leakage will occur.

[0030] Working principle: In actual use, select a suitable metal card 5 and place the die into the placement slot 51 of the metal card 5, then place the metal card 5 on the four lifting rods 73, and make the card protrusion under the metal card 5 plug into the card interface 734 and make the two interference connected; After that, the power of the driving motor 64 can be turned on and it can rotate forward. The driving motor 64 that rotates forward will make the rotating ring 62 rotate in the opposite direction through the driving gear 65 and the meshing groove 621. The multiple threaded sleeves 72 will rotate forward accordingly under the action of the corresponding driving gear 71. At this time, the multiple lifting rods 73 will move downward accordingly. At the same time, the moving block 68 will move outward under the action of the spiral portion 63 and the meshing portion 682. The piston 69 is provided with a delay groove 691 inside, and the overall length of the delay groove 691 is relatively long. The T-shaped head 681 of the moving block 68 will move a distance in the delay groove 691. During this period of time, the lifting rod 73 in the lifting mechanism 7 will move downward, thereby causing the metal card 5 to move downward and be placed in the positioning groove 41. When the lifting rod 73 is retracted to the inside of the placement seat 4, the T-shaped head 681 is in contact with the outer end of the delay groove 691. At this time, the moving block 68 will pull the piston 69 to move outward through the T-shaped head 681. The piston 69 moving outward will increase the overall volume of the enclosed space formed between the four pistons 69, and reduce the internal pressure. At this time, the external pressure is greater than the internal pressure, and the pressure on the metal card 5 and the upper surface of the grain is greater than the pressure on the lower surface. There is a downward pressure, which can press the metal card 5 and the grain above it downward, adsorb and fix it, and the overall adsorption strength is limited, which also avoids damage to the grain caused by equipment failure. When the lifting rod 73 moves upward, the lifting plate 81 has no support and moves downward with it under the action of the tension spring 85. At this time, the valve core 82 and the needle core move downward with it. When the lifting plate 81 moves to the bottom, the valve core 82 and the needle core are still in the corresponding adsorption hole 44 and the center hole 45 and are not completely separated. At this time, the valve core 82 and the valve core 82 are below the strip groove 46 and will not block it. At this time, the metal card 5 and the crystal grain can be fixed, and then the electric heating plate inside the placement seat 4 heats up and heats the metal card 5, and finally the crystal grain is thermally conducted to make it at the required temperature, and then the placement seat 4 will move accordingly under the action of the cross slide 2, and make the crystal grain under the test probe 3, and the test probe 3 moves downward under the action of the cylinder and contacts with the crystal grain, so as to test it; After this is completed, the test heating ends, the test probe 3 is away from the grain, and then the driving motor 64 rotates in the reverse direction. At this time, the rotating ring 62, the spiral portion 63 and the threaded sleeve 72 will all rotate in the reverse direction. The threaded sleeve 72 rotating in the reverse direction will cause the lifting rod 73 to move upward. When the lifting rod 73 moves upward, the moving block 68 will move inward together with it under the action of the spiral portion 63, and under the action of the connecting spring 692, the inner wall of the delay groove 691 of the piston 69 facing outward is always in contact with the T-shaped head 681 of the moving block 68, so that the two can move inward together, and when the inner side of the piston 69 moves to the innermost end, the T-shaped head 681 is still in contact with the inner wall of the extension groove facing outward, and is not in contact with the inner wall of the delay groove 691 facing inward, so that the air pressure inside the entire adsorption mechanism 6 returns to its original state, and the metal card 5 and the grain will not be adsorbed again. At this time, the lifting rod 73 has not lifted the metal card 5 and will not cause it to deform. After that, the moving block 68 continues to move inward, and the lifting rod 73 continues to move upward. After the lifting rod 73 moves upward to a certain extent, the lifting ring 735 on the lifting rod 73 will contact the connecting plate 86 and pull it to move upward together, which enables the lifting rod 73 to lift the metal card 5 out of the positioning groove 41, so that there is a certain distance between the metal card 5 and the placement seat 4, which is convenient for quickly removing the metal card 5, and multiple valve cores 82 and needle cores can block the adsorption hole 44 and the center hole 45 to prevent dust from falling and clogging them when they are not in use.

[0031] By providing a positioning groove 41 on the placement seat 4, and placing a metal card 5 in the positioning groove 41, and providing a placement groove 51 for placing a grain on the metal card 5, it is convenient for the grain to be placed on the metal card 5, and then placed on the placement seat 4 for heating, and with the provided test probe 3, it can be tested in a high temperature environment, and the shape and size of the metal card 5 can be changed in the same way, which is suitable for testing grains of various different models; By arranging a plurality of adsorption holes 44 and a center hole 45 on the placement seat 4, an adsorption mechanism 6 is arranged below the placement seat 4, and the center hole 45 and the adsorption hole 44 are both connected to the air hole in the adsorption mechanism 6, the adsorption mechanism 6 can adsorb and fix the metal card 5 and the crystal grain above, so that they will not shake during the movement and detection process, thereby improving the stability, and the overall adsorption strength is appropriate, and the damage of the crystal grain caused by equipment failure is also avoided; By arranging a lifting mechanism 7 on the adsorption mechanism 6, and the lifting rod 73 in the lifting mechanism 7 is located in the placement seat 4, the metal card 5 can be lifted. After the test is completed, the metal card 5 can be placed outside the positioning groove 41, which is convenient for taking. The lifting mechanism 7 is matched with the adsorption mechanism 6. Before lifting and taking, the adsorption mechanism 6 will first disconnect the adsorption, and then it can be taken, which avoids the removal of the metal card 5 and the grain before the adsorption and fixation are disconnected, and can avoid the wrong operation of the inspection personnel, thereby improving safety; By arranging a dustproof mechanism 8 above the adsorption mechanism 6, and connecting the dustproof mechanism 8 with the lifting mechanism 7, the dustproof mechanism 8 can move down with the lifting mechanism 7 when it moves down, and will not interfere with the normal adsorption and fixation. After the lifting mechanism 7 is lifted, it can move up with it, and then block the multiple adsorption holes 44 and the center hole 45 to prevent dust from falling and clogging it when it is not in use.

[0032] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A high temperature testing device for grains, characterized in that: The invention comprises a base (1), a cylinder is mounted on the top of the base (1) via a bracket, a test probe (3) is mounted on the push rod of the cylinder, a cross slide (2) is mounted on the top of the base (1), a placement seat (4) is mounted on the top of the slider of the cross slide (2), a positioning groove (41) is provided in the middle of the top of the placement seat (4), a center hole (45) is provided at the center of the bottom of the positioning groove (41), a plurality of adsorption holes (44) are provided in a circular array at the bottom of the positioning groove (41), a metal card (5) is placed in the positioning groove (41), and a placement groove (51) is provided at the center of the upper surface of the metal card (5); The lower end of the placement seat (4) is suspended with an adsorption mechanism (6) by a bracket, and the plurality of adsorption holes (44) and the center hole (45) are all connected to the adsorption mechanism (6). A lifting mechanism (7) is arranged outside the adsorption mechanism (6), and the lifting mechanism (7) passes through the placement seat (4) and is connected to the metal card (5). A dustproof mechanism (8) is installed above the adsorption mechanism (6) for slidingly plugging the adsorption holes (44) and the center hole (45) up and down, and the dustproof mechanism (8) is connected to the lifting mechanism (7).

2. A grain high temperature testing device according to claim 1, characterized in that: The placement seat (4) is provided with a plurality of strip grooves (46) distributed in a circumferential array inside, the plurality of strip grooves (46) respectively correspond to and are connected with the plurality of adsorption holes (44), and the plurality of strip grooves (46) converge with each other at one end close to the central hole (45) and are connected with the central hole (45); An electric heating plate is also provided inside the placement seat (4); The plurality of adsorption holes (44) and the center hole (45) all penetrate the placement seat (4) vertically, and a circular hole is provided at the center of the placement slot (51) of the metal card (5).

3. A grain high temperature testing device according to claim 1, characterized in that: The adsorption mechanism (6) comprises a mounting base (61) mounted below the placement seat (4) via a bracket, a fixing seat (67) being fixed above the mounting base (61), a rotating ring (62) being rotatably mounted outside the fixing seat (67), and a lower end of the rotating ring (62) being rotatably connected to an upper surface of the mounting base (61), a spiral portion (63) being provided on an upper surface of the rotating ring (62), and a mounting top plate (66) being fixed above the fixing seat (67); An adsorption groove (671) is provided at the center of the upper part of the fixed seat (67), and four groups of widened grooves (672) distributed in an annular shape are provided on the upper surface of the fixed seat (67), the widened groove (672) is connected to the adsorption groove (671), and a communication port (673) communicating with the outside is provided on the side of the widened groove (672) away from the adsorption groove (671), a piston (69) is slidably arranged in the widened groove (672), a moving block (68) is slidably arranged in the piston (69), and a plurality of meshing portions (682) distributed at equal intervals are provided on the lower surface of the moving block (68) away from the piston (69), and the meshing portion (682) is connected to the spiral portion (63).

4. A grain high temperature testing device according to claim 3, characterized in that: The outer ring of the rotating ring (62) is provided with a plurality of meshing grooves (621) distributed in a circumferential array, the outer ring of the mounting base plate (61) is provided with a driving motor (64) via a motor frame, a driving gear (65) is installed on the output shaft of the driving motor (64), and the driving gear (65) is meshedly connected with the meshing grooves (621).

5. The device for high temperature testing of grains according to claim 3, characterized in that: A delay groove (691) is provided inside the piston (69), and the delay groove (691) is in a convex shape. The side of the delay groove (691) away from the adsorption groove (671) is connected to the widening groove (672); The moving block (68) is provided with a T-shaped head (681) on the inner side, and the T-shaped head (681) is slidably placed in the delay groove (691).

6. A high temperature grain testing device according to claim 5, characterized in that: A connecting spring (692) is disposed in the widened groove (672), the connecting spring (692) is placed below the moving block (68), and two ends of the connecting spring (692) are respectively fixed to the piston (69) and the connecting port (673); When the piston (69) is located at the innermost side of the widened groove (672), the connecting spring (692) is in a normal state.

7. The device for high temperature testing of grains according to claim 3, characterized in that: The four corners at the bottom of the positioning groove (41) are respectively penetrated downward to form a lifting hole (42); The lifting mechanism (7) comprises four bearing frames arranged in an annular shape outside the mounting base plate (61), a threaded sleeve (72) being rotatably mounted inside the bearing frame, a driving gear (71) being fixed to the outer ring of the threaded sleeve (72), the driving gear (71) being meshed with a tooth groove (621) of the outer ring of the rotating ring (62), a lifting rod (73) being mounted on the inner thread of the threaded sleeve (72), the upper end of the lifting rod (73) passing through the lifting hole (42) and being placed above the lifting hole; The lifting rod (73) comprises a threaded section (731), the threaded section (731) being threadedly connected to the threaded sleeve (72), the upper end of the threaded section (731) being integrally formed with a straight rod section (732), the straight rod section (732) sliding up and down through the lifting hole (42) and being placed above it.

8. A grain high temperature testing device according to claim 7, characterized in that: The inner wall of the lifting hole (42) is provided with two groups of symmetrically distributed limiting strips (43), the outer ring surface of the straight rod section (732) is provided with two groups of symmetrically distributed limiting grooves (733), and the limiting strips (43) are slidably connected to the limiting grooves (733); The top end of the lifting rod (73) is recessed to form a card interface (734), and the four corners of the lower end of the metal card (5) all protrude downward to form card connection protrusions, and the card connection protrusions are interference-connected with the card interface (734).

9. The device for high temperature testing of grains according to claim 7, characterized in that: The dustproof mechanism (8) comprises a plurality of guide columns (84) fixed in an annular shape above the mounting top plate (66); the plurality of guide columns (84) are slidably sleeved with a lifting plate (81) up and down, and a tension spring (85) is sleeved on the guide column (84); the upper and lower ends of the tension spring (85) are respectively connected to the lower surface of the lifting plate (81) and the upper surface of the mounting top plate (66); a plurality of evenly distributed valve cores (82) are arranged above the lifting plate, and an opening is arranged at the center above the lifting plate, and a needle core is arranged in the opening through a tripod; the plurality of valve cores (82) pass through corresponding adsorption holes (44) one by one and are placed above the positioning groove (41); and the needle cores all pass through the center hole (45) and are placed above the positioning groove (41); The outer ring of the lifting plate (81) is provided with four groups of annularly distributed connecting plates (86), the connecting plates (86) are slidably sleeved on corresponding lifting rods (73), the lifting rods (73) are provided with lifting rings (735), and the lifting rings (735) are located below the connecting plates (86).

10. A grain high temperature testing device according to claim 9, characterized in that: A bellows (83) is provided at the center of the upper and lower parts of the lifting plate (81); the upper bellows (83) is connected to the center hole (45) below the placement seat (4); the upper opening of the mounting top plate (66) is designed to form an air hole, and the air hole is located directly above the adsorption groove (671); the lower bellows (83) is connected to the air hole.

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