Golden finger spacing pressure measurement device

Abstract

The invention relates to a golden finger spacing pressure test device which comprises a test circuit board, an extrusion assembly and a golden finger assembly, the golden finger assembly is extruded in the extrusion assembly by the extrusion assembly, at least two parts of the golden finger assembly extend out of the extrusion assembly, and one part of the golden finger assembly is connected with a tested chip. The other part of the golden finger assembly is connected with the test circuit board, so that a conduction circuit is formed between the tested chip and the test circuit board; the golden finger assembly comprises a first golden finger and a second golden finger, and the first golden finger and the second golden finger are adjacent to each other and nested together; the first golden finger comprises a first golden finger body, a first contact and a second contact, the first contact is used for being in contact with a tested chip, and the second contact is electrically connected with the test circuit board; the second golden finger comprises a second golden finger body, a third contact and a fourth contact, the third contact is used for being in contact with the tested chip, and the fourth contact is electrically connected with the test circuit board.

Description

Technical Field

[0001] The invention relates to the field of chip testing, and in particular to a gold finger spacing pressure testing device. Background Art

[0002] Chips are a very common electronic product. Chips generally include a chip body and pins, and a variety of electronic components are arranged on the chip body. Before a chip leaves the factory, it is necessary to test whether the circuit is conductive or not. In the prior art, the circuit conductivity test of the chip is mostly completed by workers holding electric pens. However, on the one hand, the error rate of the test by workers holding electric pens is high, and it is easy to mistakenly detect an unqualified chip as a qualified chip; on the other hand, there are multiple pins on a chip, and it is time-consuming and laborious for workers to test the pins one by one with electric pens, and the work efficiency is extremely low, and the corresponding labor cost is high. In some prior art, testing is performed by means of a test device, but this type of test device has a complex structure and is extremely cumbersome to disassemble and assemble during maintenance. Summary of the invention

[0003] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a gold finger spacing pressure measurement device.

[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a gold finger spacing pressure measurement device, comprising a test circuit board, an extrusion component, and a gold finger component, wherein the gold finger component is squeezed into the extrusion component by the extrusion component, and at least two parts of the gold finger component extend out of the extrusion component, a part of the gold finger component is connected to the tested chip, and another part of the gold finger component is connected to the test circuit board, so that a conductive circuit is formed between the tested chip and the test circuit board; wherein the gold finger component comprises a first gold finger and a second gold finger, the first gold finger and the second gold finger are adjacent to each other and nested in together; the first gold finger includes a first gold finger body, a first contact, and a second contact, the first contact and the second contact are respectively fixedly connected to the two ends of the first gold finger body, the first contact is used to contact the tested chip, and the second contact is electrically connected to the test circuit board; the second gold finger includes a second gold finger body, a third contact, and a fourth contact, the third contact and the fourth contact are respectively fixedly connected to the two ends of the second gold finger body, the third contact is used to contact the tested chip, and the fourth contact is electrically connected to the test circuit board, so that the tested chip and the test circuit board circuit are conductive.

[0005] Furthermore, the first gold finger also includes a first turning section, a first straight section, and a first connecting rod. One end of the first turning section is fixedly connected to the first gold finger body, the other end of the first turning section is fixedly connected to one end of the first straight section, the other end of the first straight section is fixedly connected to the first contact, and the angle between the first straight section and the first contact is greater than 90 degrees and less than 135 degrees. One end of the first connecting rod is fixedly connected to the first gold finger body, the other end of the first connecting rod is fixedly connected to the second contact, and the angle between the first connecting rod and the second contact is greater than 90 degrees and less than 180 degrees. The first turning section is roughly semicircular, so that the first straight section turns.

[0006] Furthermore, the second gold finger also includes a second straight section, a second turning section, a third straight section, and a second connecting rod. One end of the second straight section is fixedly connected to the second gold finger body, the other end of the second straight section is fixedly connected to one end of the second turning section, the other end of the second turning section is fixedly connected to one end of the third straight section, and the other end of the third straight section is fixedly connected to the third contact, and the third contact and the third straight section are approximately perpendicular; one end of the second connecting rod is fixedly connected to the second gold finger body, the other end of the second connecting rod is fixedly connected to the fourth contact, and the angle between the fourth contact and the second connecting rod is greater than 90 degrees and less than 180 degrees; the third contact is adjacent to the first contact, and the height of the third contact is higher than the height of the first contact; the second contact and the fourth contact are opposite and adjacent.

[0007] Furthermore, there are a first gap and a second gap between the first gold finger and the second gold finger; a third gap and a fourth gap are provided on the first gold finger, the third gap penetrates the first gold finger body, and the third gap is provided between the first connecting rod and the first gold finger body; the fourth gap penetrates the first gold finger body, and the fourth gap is provided between the first turning section and the first gold finger body; a fifth gap is provided on the second gold finger, the fifth gap penetrates the second gold finger body, and the fifth gap is provided between the second connecting rod and the second gold finger body.

[0008] Furthermore, the extrusion assembly includes a first extrusion assembly and a second extrusion assembly, the first extrusion assembly and the second extrusion assembly have the same structure, the first extrusion assembly includes a preset number of first extrusion plates and second extrusion plates, the first extrusion plates and the second extrusion plates have the same structure, at least one gold finger assembly is clamped between the first extrusion plate and the second extrusion plate, and the first contact, the second contact, the third contact, and the fourth contact of the gold finger assembly all extend out of the first extrusion plate and the second extrusion plate, so that the second contact and the fourth contact are in contact with and electrically connected to the test circuit board, and the first contact and the third contact are connected to the chip under test.

[0009] Furthermore, it also includes a latch, which connects the first extrusion plate, the second extrusion plate and the gold finger assembly, so that an assembly is formed between the first extrusion plate, the second extrusion plate and the gold finger assembly; the first extrusion plate includes a first extrusion plate body, on which a groove is provided, and the groove is recessed from the first extrusion plate body to a preset depth, and the groove has a bottom wall, on which a first limit block, a second limit block, a first guide block and a second guide block are fixedly provided, and when the gold finger assembly is installed on the first extrusion plate, the first limit block is inserted into the first gap, and the second limit block is inserted into the second gap; the first connecting rod is overlapped on the first guide block, and the second connecting rod is overlapped on the second guide block.

[0010] Further, the plug includes a first plug, a second plug, a third plug, and a fourth plug; the first gold finger body is provided with a first plug hole and a third plug hole, the second gold finger body is provided with a second plug hole and a fourth plug hole, the first plug hole and the third plug hole are both connected to the first gold finger body, the second plug hole and the fourth plug hole are both connected to the second gold finger body; the first extrusion plate is provided with a fifth plug hole, a sixth plug hole, a seventh plug hole, and an eighth plug hole; when the gold finger assembly and the first extrusion plate are installed together, the The first plug-in hole is aligned with the fifth plug-in hole, the second plug-in hole is aligned with the sixth plug-in hole, the third plug-in hole is aligned with the seventh plug-in hole, and the fourth plug-in hole is aligned with the eighth plug-in hole; the first plug-in pin is inserted into the first plug-in hole and the fifth plug-in hole, the second plug-in pin is inserted into the second plug-in hole and the sixth plug-in hole, the third plug-in pin is inserted into the third plug-in hole and the seventh plug-in hole, and the fourth plug-in pin is inserted into the fourth plug-in hole and the eighth plug-in hole, so that the gold finger assembly can be quickly disassembled and assembled with the extrusion assembly.

[0011] Furthermore, it also includes a fixed base and a pedestal, the fixed base and the test circuit board are fixedly connected together by screws or bolts; the fixed base is provided with a first mounting groove and a second mounting groove, the combination of the first extrusion assembly and the gold finger assembly is fixedly mounted in the first mounting groove, the combination of the second extrusion assembly and the gold finger assembly is fixedly mounted in the second mounting groove, and the first contact and the second contact of the gold finger assembly both extend out of the first mounting groove or the second mounting groove; the test circuit board is fixedly mounted on the pedestal, and the test circuit board is located above the pedestal, the pedestal includes a base body and at least one support column, the support column is fixedly mounted on the base body by screws / bolts, bonding, integral molding with the base body, or welding, and the test circuit board and the support column are fixedly mounted together by bolt connection or screw connection, so that the test circuit board is mounted on the pedestal.

[0012] Furthermore, it includes a first pressing block and a second pressing block, the first pressing block is pressed on the top of the first extrusion assembly, and the two ends of the first pressing block are fixedly connected to the fixed base by screws or bolts; the second pressing block is pressed on the top of the second extrusion assembly, and the two ends of the second pressing block are fixedly connected to the fixed base by screws or bolts; and the first contact and the second contact of the gold finger assembly are exposed to the first pressing block or the second pressing block, so that the first extrusion assembly and the second extrusion assembly are fixed on the fixed base.

[0013] Furthermore, a sensing area is provided on the test circuit board, and the third contact and the fourth contact are in contact with the sensing area, so that the gold finger assembly and the test circuit board are electrically connected; the tested chip includes a chip body and a preset number of pins, and the pins are provided on the chip body. The pins of the tested chip are connected to the first contact and the second contact, so that the circuit between the tested chip and the test circuit board is turned on, so as to test whether the circuit of the tested chip is turned on.

[0014] The beneficial effects of the present application are as follows: the gold finger spacing pressure measurement device provided by the present application has a simple structure, is easy to disassemble and assemble, and is easy to maintain. Since a gold finger assembly is fixedly installed between the extrusion assemblies, the first contact and the second contact of the gold finger assembly both extend out of the extrusion assembly, the third contact and the fourth contact of the gold finger assembly are both connected to the test circuit board, and the pins of the tested chip are pressed toward the first contact and the second contact, so that the circuit between the tested chip and the test circuit board is turned on; and a plurality of gold finger assemblies are arranged on the extrusion assembly, and a plurality of extrusion assemblies are arranged on the device, so that the tested chips can be tested in large quantities and quickly, which greatly improves the work efficiency and reduces the error rate of the test. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A structural schematic diagram of a gold finger spacing pressure measurement device provided by the present invention.

[0016] Figure 2 Another structural schematic diagram of a gold finger spacing pressure measurement device provided by the present invention.

[0017] Figure 3 Another structural schematic diagram of a gold finger spacing pressure measurement device provided by the present invention.

[0018] Figure 4 Another structural schematic diagram of a gold finger spacing pressure measurement device provided by the present invention.

[0019] Figure 5 Another structural schematic diagram of a gold finger spacing pressure measurement device provided by the present invention.

[0020] Figure 6 A structural schematic diagram of a gold finger assembly of a gold finger spacing pressure measurement device provided by the present invention.

[0021] Figure 7 A schematic structural diagram of a first extrusion plate of an extrusion assembly of a gold finger spacing pressure measurement device provided by the present invention.

[0022] Figure 8 A schematic structural diagram of a circuit board of a gold finger spacing pressure measurement device provided by the present invention.

[0023] Fig. 9 A schematic structural diagram of a chip of a gold finger spacing pressure measurement device provided by the present invention. DETAILED DESCRIPTION

[0024] The present application is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are intended to enable the present application to be better understood. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, and methods. In some cases, some operations related to the present application are not shown or described in the specification, in order to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0025] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations, and the operation steps involved in each embodiment can also be replaced or adjusted in a sequence in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for the purpose of clearly describing a certain embodiment and do not mean that the composition and / or sequence are necessary.

[0026] The serial numbers of the components in this document, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).

[0027] Please refer to Figure 1-9The present application provides a gold finger spacing pressure measurement device (hereinafter referred to as "the device"), which includes a test circuit board 2, an extrusion component 6, and a gold finger component 7. The gold finger component 7 is squeezed in the extrusion component 6 by the extrusion component 6, and at least two parts of the gold finger component 7 extend out of the extrusion component 6. A part of the gold finger component 7 is connected to the tested chip 5, and another part of the gold finger component 7 is connected to the test circuit board 2, so that a conductive circuit is formed between the tested chip 5 and the test circuit board 2; wherein the gold finger component 7 includes a first gold finger 71 and a second gold finger 72, wherein the first gold finger 71 and the second gold finger 72 are adjacent to each other and nested together; the first gold finger 71 includes a first gold finger The first contact 713 and the second contact 715 are respectively fixedly connected to the two ends of the first gold finger body 710, the first contact 713 is used to contact the tested chip 5, and the second contact 715 is electrically connected to the test circuit board 2; the second gold finger 72 includes a second gold finger body 720, a third contact 724, and a fourth contact 726, the third contact 724 and the fourth contact 726 are respectively fixedly connected to the two ends of the second gold finger body 720, the third contact 724 is used to contact the tested chip 5, and the fourth contact 726 is electrically connected to the test circuit board 2, so that the tested chip 5 and the test circuit board 2 are circuit-conducted.

[0028] In one embodiment of the present application, the first gold finger 71 also includes a first turning section 711, a first straight section 712, and a first connecting rod 714. One end of the first turning section 711 is fixedly connected to the first gold finger body 710, the other end of the first turning section 711 is fixedly connected to one end of the first straight section 712, the other end of the first straight section 712 is fixedly connected to the first contact 713, and the angle between the first straight section 712 and the first contact 713 is greater than 90 degrees and less than 135 degrees. One end of the first connecting rod 714 is fixedly connected to the first gold finger body 710, the other end of the first connecting rod 714 is fixedly connected to the second contact 715, and the angle between the first connecting rod 714 and the second contact 715 is greater than 90 degrees and less than 180 degrees. The first turning section 711 is roughly semicircular, so that the first straight section 712 is turned.

[0029] In another embodiment of the present application, the second gold finger 72 further includes a second straight section 721, a second turning section 722, a third straight section 723, and a second connecting rod 725, one end of the second straight section 721 is fixedly connected to the second gold finger body 720, the other end of the second straight section 721 is fixedly connected to one end of the second turning section 722, the other end of the second turning section 722 is fixedly connected to one end of the third straight section 723, the other end of the third straight section 723 is fixedly connected to the third contact 724, and the third contact 724 and the third straight section 723 are approximately perpendicular; one end of the second connecting rod 725 is fixedly connected to the second gold finger body 720, and the other end of the second connecting rod 725 is fixedly connected to the fourth contact 726, and the angle between the fourth contact 726 and the second connecting rod 725 is greater than 90 degrees and less than 180 degrees; the third contact 724 is adjacent to the first contact 713, and the height of the third contact 724 is higher than the height of the first contact 713; the second contact 715 and the fourth contact 726 are opposite and adjacent.

[0030] In one embodiment of the present application, there are a first gap 73 and a second gap 74 between the first golden finger 71 and the second golden finger 72; a third gap 716 and a fourth gap 717 are provided on the first golden finger 71, the third gap 716 penetrates the first golden finger body 710, and the third gap 716 is provided between the first connecting rod 714 and the first golden finger body 710; the fourth gap 717 penetrates the first golden finger body 710, and the fourth gap 717 is provided between the first turning section 711 and the first golden finger body 710; a fifth gap 727 is provided on the second golden finger 72, the fifth gap 727 penetrates the second golden finger body 720, and the fifth gap 727 is provided between the second connecting rod 725 and the second golden finger body 720.

[0031] In one embodiment of the present application, the extrusion assembly 6 includes a first extrusion assembly 61 and a second extrusion assembly 62. The first extrusion assembly 61 and the second extrusion assembly 62 have the same structure. The first extrusion assembly 61 includes a preset number of first extrusion plates 611 and second extrusion plates 612. The first extrusion plates 611 and the second extrusion plates 612 have the same structure. At least one gold finger assembly 7 is clamped between the first extrusion plate 611 and the second extrusion plate 612. The first contact 713, the second contact 715, the third contact 724, and the fourth contact 726 of the gold finger assembly 7 all extend out of the first extrusion plate 611 and the second extrusion plate 612, so that the second contact 715 and the fourth contact 726 are in contact with and electrically connected to the test circuit board 2, and the first contact 713 and the third contact 724 are connected to the chip under test 5.

[0032] In one embodiment of the present application, the device further includes a latch 8, wherein the latch 8 connects the first extrusion plate 611, the second extrusion plate 612 and the gold finger assembly 7, so that the first extrusion plate 611, the second extrusion plate 612 and the gold finger assembly 7 form an assembly; the first extrusion plate 611 includes a first extrusion plate body 6110, and a groove 6111 is provided on the first extrusion plate body 6110, wherein the groove 6111 is formed by being recessed from the first extrusion plate body to a preset depth, and the groove 611 1 has a bottom wall 6112, on which a first limit block 6113, a second limit block 6114, a first guide block 6115, and a second guide block 6116 are fixedly arranged. When the gold finger assembly 7 is installed on the first extrusion plate 611, the first limit block 6113 is inserted into the first gap 73, and the second limit block 6114 is inserted into the second gap 74; the first connecting rod 714 is overlapped on the first guide block 6115, and the second connecting rod 725 is overlapped on the second guide block 6116. Through the latch 8, the first extrusion plate 611, the second extrusion plate 612 and the gold finger assembly 7 can be quickly disassembled.

[0033] In one embodiment of the present application, the latch 8 includes a first latch 81, a second latch 82, a third latch 83, and a fourth latch 84; the first gold finger body 710 is provided with a first plug hole 718 and a third plug hole 719, and the second gold finger body 720 is provided with a second plug hole 728 and a fourth plug hole 729, the first plug hole 718 and the third plug hole 719 are both connected to the first gold finger body 710, and the second plug hole 728 and the fourth plug hole 729 are both connected to the second gold finger body 720; the first extrusion plate 611 is provided with a fifth plug hole 6117, a sixth plug hole 6119, a seventh plug hole 6118, and an eighth plug hole 6120; when the gold finger assembly 7 and the first extrusion plate 611 are installed When connected together, the first plug hole 718 is aligned with the fifth plug hole 6117, the second plug hole 728 is aligned with the sixth plug hole 6119, the third plug hole 719 is aligned with the seventh plug hole 6118, and the fourth plug hole 729 is aligned with the eighth plug hole 6120; the first plug pin 81 is inserted into the first plug hole 718 and the fifth plug hole 6117, the second plug pin 82 is inserted into the second plug hole 728 and the sixth plug hole 6119, the third plug pin 83 is inserted into the third plug hole 719 and the seventh plug hole 6118, and the fourth plug pin 84 is inserted into the fourth plug hole 729 and the eighth plug hole 6120, so that the gold finger assembly 7 can be quickly disassembled and assembled with the extrusion assembly 6.

[0034] In one embodiment of the present application, the device also includes a fixed base 3 and a base 1, the fixed base 3 and the test circuit board 2 are fixedly connected together by screws or bolts; a first mounting groove 31 and a second mounting groove 32 are provided on the fixed base 3, the combination of the first extrusion assembly 61 and the gold finger assembly 7 is fixedly installed in the first mounting groove 31, the combination of the second extrusion assembly 62 and the gold finger assembly 7 is fixedly installed in the second mounting groove 32, and the first contact and the second contact of the gold finger assembly 7 both extend out of the first mounting groove 31 or the second mounting groove 32; the test circuit board 2 is fixedly installed on the base 1, and the test circuit board 2 is located above the base 1, the base 1 includes a base body 11 and at least one support column 12, the support column 12 is fixedly installed on the base body 11 by screws / bolts, bonding, integrally formed with the base body 11, or welding, and the test circuit board 2 and the support column 12 are fixedly installed together by bolt connection or screw connection, so that the test circuit board 2 is installed on the base 1.

[0035] In one embodiment of the present application, the device includes a first pressure block 41 and a second pressure block 42, the first pressure block 41 is pressed on top of the first extrusion assembly 61, and the two ends of the first pressure block 41 are fixedly connected to the fixed base 3 by screws or bolts; the second pressure block 42 is pressed on top of the second extrusion assembly 62, and the two ends of the second pressure block 42 are fixedly connected to the fixed base 3 by screws or bolts; and the first contact and the second contact of the gold finger assembly 7 are exposed to the first pressure block 41 or the second pressure block 42, so that the first extrusion assembly 61 and the second extrusion assembly 62 are fixed on the fixed base 3.

[0036] In one embodiment of the present application, a sensing area 20 is provided on the test circuit board 2, and the third contact and the fourth contact are in contact with the sensing area 20, so that the gold finger assembly 7 and the test circuit board 2 are electrically connected; the tested chip 5 includes a chip body 51 and a preset number of pins 52, and the pins 52 are provided on the chip body 51. The pins of the tested chip 5 are connected to the first contact and the second contact, so that the circuit between the tested chip 5 and the test circuit board 2 is turned on, so as to test whether the circuit of the tested chip 5 is turned on.

[0037] The gold finger spacing pressure measuring device provided by the present application has a simple structure, is easy to disassemble and assemble, and is easy to maintain. Since a gold finger assembly is fixedly installed between the extrusion assemblies, the first contact and the second contact of the gold finger assembly both extend out of the extrusion assembly, and the third contact and the fourth contact of the gold finger assembly are both connected to the test circuit board. The pins of the tested chip are pressed toward the first contact and the second contact, so that the circuit between the tested chip and the test circuit board is turned on; and a plurality of gold finger assemblies are arranged on the extrusion assembly, and a plurality of extrusion assemblies are arranged on the device, so that the tested chips can be tested in large quantities and quickly, which greatly improves the work efficiency and reduces the error rate of the test.

[0038] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A gold finger spacing pressure measurement device, characterized in that: The invention comprises a test circuit board, an extrusion component and a gold finger component, wherein the gold finger component is extruded in the extrusion component by the extrusion component, and at least two parts of the gold finger component extend out of the extrusion component, a part of the gold finger component is connected to a chip under test, and another part of the gold finger component is connected to the test circuit board, so that a conductive circuit is formed between the chip under test and the test circuit board; wherein the gold finger component comprises a first gold finger and a second gold finger, the first gold finger and the second gold finger are adjacent to each other and nested together; the first gold finger comprises a first gold finger body, a first contact and a second contact, the first contact and the second contact are respectively fixedly connected to the two ends of the first gold finger body, the first contact is used to contact the chip under test, and the second contact is electrically connected to the test circuit board; the second gold finger comprises a second gold finger body, a third contact and a fourth contact, the third contact and the fourth contact are respectively fixedly connected to the two ends of the second gold finger body, the third contact is used to contact the chip under test, and the fourth contact is electrically connected to the test circuit board, so that the chip under test and the test circuit board are conductive.

2. The gold finger spacing pressure measurement device according to claim 1, characterized in that: The first gold finger also includes a first turning section, a first straight section, and a first connecting rod. One end of the first turning section is fixedly connected to the first gold finger body, the other end of the first turning section is fixedly connected to one end of the first straight section, the other end of the first straight section is fixedly connected to the first contact, and the angle between the first straight section and the first contact is greater than 90 degrees and less than 135 degrees. One end of the first connecting rod is fixedly connected to the first gold finger body, the other end of the first connecting rod is fixedly connected to the second contact, and the angle between the first connecting rod and the second contact is greater than 90 degrees and less than 180 degrees. The first turning section is roughly semicircular, so that the first straight section turns.

3. The gold finger spacing pressure measurement device according to claim 2, characterized in that: The second gold finger also includes a second straight section, a second turning section, a third straight section, and a second connecting rod. One end of the second straight section is fixedly connected to the second gold finger body, the other end of the second straight section is fixedly connected to one end of the second turning section, the other end of the second turning section is fixedly connected to one end of the third straight section, the other end of the third straight section is fixedly connected to the third contact, and the third contact and the third straight section are approximately perpendicular; one end of the second connecting rod is fixedly connected to the second gold finger body, the other end of the second connecting rod is fixedly connected to the fourth contact, and the angle between the fourth contact and the second connecting rod is greater than 90 degrees and less than 180 degrees; the third contact is adjacent to the first contact, and the height of the third contact is higher than the height of the first contact; the second contact and the fourth contact are opposite and adjacent.

4. The gold finger spacing pressure measurement device according to claim 3, characterized in that: There are a first gap and a second gap between the first golden finger and the second golden finger; a third gap and a fourth gap are arranged on the first golden finger, the third gap penetrates the first golden finger body, and the third gap is arranged between the first connecting rod and the first golden finger body; the fourth gap penetrates the first golden finger body, and the fourth gap is arranged between the first turning section and the first golden finger body; a fifth gap is arranged on the second golden finger, the fifth gap penetrates the second golden finger body, and the fifth gap is arranged between the second connecting rod and the second golden finger body.

5. The gold finger spacing pressure measurement device according to claim 4, characterized in that: The extrusion assembly includes a first extrusion assembly and a second extrusion assembly. The first extrusion assembly and the second extrusion assembly have the same structure. The first extrusion assembly includes a preset number of first extrusion plates and second extrusion plates. The first extrusion plates and the second extrusion plates have the same structure. At least one gold finger assembly is clamped between the first extrusion plate and the second extrusion plate. The first contact, the second contact, the third contact, and the fourth contact of the gold finger assembly all extend out of the first extrusion plate and the second extrusion plate, so that the second contact and the fourth contact are in contact with and electrically connected to a test circuit board, and the first contact and the third contact are connected to the chip under test.

6. The gold finger spacing pressure measurement device according to claim 5, characterized in that: It also includes a latch, which connects the first extrusion plate, the second extrusion plate and the gold finger assembly, so that an assembly is formed between the first extrusion plate, the second extrusion plate and the gold finger assembly; the first extrusion plate includes a first extrusion plate body, a groove is arranged on the first extrusion plate body, the groove is recessed from the first extrusion plate body to a preset depth, the groove has a bottom wall, a first limit block, a second limit block, a first guide block and a second guide block are fixedly arranged on the bottom wall, when the gold finger assembly is installed on the first extrusion plate, the first limit block is inserted into the first gap, and the second limit block is inserted into the second gap; the first connecting rod is overlapped on the first guide block, and the second connecting rod is overlapped on the second guide block.

7. The gold finger spacing pressure measurement device according to claim 6, characterized in that: The plug includes a first plug, a second plug, a third plug and a fourth plug; the first gold finger body is provided with a first plug hole and a third plug hole, the second gold finger body is provided with a second plug hole and a fourth plug hole, the first plug hole and the third plug hole are both through the first gold finger body, the second plug hole and the fourth plug hole are both through the second gold finger body; the first extrusion plate is provided with a fifth plug hole, a sixth plug hole, a seventh plug hole and an eighth plug hole; when the gold finger assembly and the first extrusion plate are installed together, the first plug hole is aligned with the fifth plug hole, the second plug hole is aligned with the sixth plug hole, the third plug hole is aligned with the seventh plug hole, and the fourth plug hole is aligned with the eighth plug hole; The first plug pin is inserted into the first plug hole and the fifth plug hole, the second plug pin is inserted into the second plug hole and the sixth plug hole, the third plug pin is inserted into the third plug hole and the seventh plug hole, and the fourth plug pin is inserted into the fourth plug hole and the eighth plug hole, so that the gold finger assembly can be quickly assembled and disassembled from the extrusion assembly.

8. The gold finger spacing pressure measurement device according to claim 7, characterized in that: It also includes a fixed base and a pedestal, wherein the fixed base and the test circuit board are fixedly connected together by screws or bolts; a first mounting groove and a second mounting groove are provided on the fixed base, wherein the combination of the first extrusion assembly and the gold finger assembly is fixedly mounted in the first mounting groove, and the combination of the second extrusion assembly and the gold finger assembly is fixedly mounted in the second mounting groove, and the first contact and the second contact of the gold finger assembly both extend out of the first mounting groove or the second mounting groove; the test circuit board is fixedly mounted on the pedestal, and the test circuit board is located above the pedestal, and the pedestal includes a pedestal body and at least one support column, wherein the support column is fixedly mounted on the pedestal body by screws / bolts, bonding, integral molding with the pedestal body, or welding, and the test circuit board and the support column are fixedly mounted together by bolt connection or screw connection, so that the test circuit board is mounted on the pedestal.

9. The gold finger spacing pressure measurement device according to claim 8, characterized in that: It includes a first pressing block and a second pressing block, the first pressing block is pressed on the top of the first extrusion assembly, and the two ends of the first pressing block are fixedly connected to the fixed base by screws or bolts; the second pressing block is pressed on the top of the second extrusion assembly, and the two ends of the second pressing block are fixedly connected to the fixed base by screws or bolts; and the first contact and the second contact of the gold finger assembly are exposed from the first pressing block or the second pressing block, so that the first extrusion assembly and the second extrusion assembly are fixed on the fixed base.

10. The gold finger spacing pressure measurement device according to claim 9, characterized in that: The test circuit board is provided with a sensing area, the third contact and the fourth contact are in contact with the sensing area, so that the gold finger assembly and the test circuit board are electrically connected; the tested chip includes a chip body and a preset number of pins, the pins are provided on the chip body, and the pins of the tested chip are connected to the first contact and the second contact, so that the circuit between the tested chip and the test circuit board is turned on, so as to test whether the circuit of the tested chip is turned on.

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