Chip testing equipment

Abstract

The invention discloses chip testing equipment, which relates to the technical field of chip testing and comprises a rack, a feeding manipulator, a discharging manipulator and a plurality of testing devices. The locking mechanism comprises a base, a first elastic piece, a limiting assembly and two pressing arms, the output end of the feeding mechanical arm can drive the test seat to descend and carry the chip to the test seat, so that the pressing ends of the two pressing arms swing downwards at the same time and press the chip on the test seat, the limiting end of the limiting assembly can abut against the test seat, and the chip is conveyed to the test seat through the first elastic piece. The output end of the discharging mechanical arm can drive the limiting end of the limiting assembly to break away from abutting connection with the testing base so that the testing base can ascend, the pressing ends of the two pressing arms can swing upwards at the same time, and the discharging mechanical arm can carry chips on the testing base to the first collecting device or the second collecting device. The locking mechanism can tightly press the chip on the test seat, and the blanking manipulator does not need to additionally execute the chip pressing step, so that the chip test efficiency of the chip test equipment is improved.

Description

Technical Field

[0001] The invention relates to chip testing, and in particular to a chip testing device. Background Art

[0002] Chip testing equipment is a kind of equipment mainly used to test the electrical performance of chips to ensure that the final chip products shipped can meet the quality standards. In the prior art, chip testing equipment usually includes a loading robot, a unloading robot and a testing device. The loading robot will first move the chip to be tested to the testing device, and then the unloading robot will press the chip to be tested on the testing device and keep it for a certain period of time. During the process of the chip being pressed, the testing device will test the chip. After the chip test is completed, the unloading robot will move the chip on the testing device to the qualified area or the unqualified area according to the results of the chip test to complete the chip testing and sorting. While the unloading robot is in the process of pressing the chip, the loading robot is in a waiting state for loading, that is, the loading robot must wait for the unloading robot to complete the chip handling and sorting before it can load the next time, resulting in the loading robot being in an idle state waiting for loading, thereby reducing the chip testing efficiency of the chip testing equipment. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a chip testing device that does not require an unloading manipulator to perform an additional chip pressing step, thereby facilitating improving chip testing efficiency.

[0004] According to an embodiment of the present invention, the chip testing equipment includes a frame, a loading robot, a unloading robot and a plurality of testing devices. The loading robot and the unloading robot are both arranged on the frame. A plurality of the testing devices are all arranged on the frame, and a plurality of the testing devices all include a locking mechanism and a test seat, wherein the locking mechanism is used to press the chip onto the test seat, and the test seat is used to test the chip. The locking mechanism includes a base, a first elastic member, a limiting assembly and two clamping arms, a sliding cavity is provided on the base, and the test seat can be slidably arranged in the sliding cavity along the up and down directions, the first elastic member is arranged in the sliding cavity, the upper and lower ends of the first elastic member are respectively connected to the test seat and the inner bottom wall of the sliding cavity, the first elastic member is used to push the test seat upward, the two clamping arms each have a mounting end and a clamping end, the mounting ends of the two clamping arms are both hinged on the base, the middle parts of the two clamping arms can be against the test seat, and the limiting assembly is provided. On the base, the output end of the loading robot can drive the test seat to descend and move the chip to the test seat, so that the clamping ends of the two clamping arms swing down at the same time and press the chip on the test seat, and the limiting end of the limiting assembly can abut against the test seat to limit the test seat from rising. The output end of the unloading robot can drive the limiting end of the limiting assembly to disengage from the abutment with the test seat, so that the test seat rises and the clamping ends of the two clamping arms swing up at the same time, and the unloading robot can move the chip on the test seat.

[0005] At least the following beneficial effects are achieved: When the chip to be tested needs to be tested, the loading robot moves the chip to the test seat. In the process of the loading robot placing the chip on the test seat, the loading robot can drive the test seat to descend. In the process of the test seat descending, the first elastic member begins to compress. Since the middle parts of the two clamping arms are against the test seat, the clamping ends of the two clamping arms can begin to swing down under their own gravity during the descent of the test seat, so that the clamping ends of the two clamping arms are close to the chip on the test seat at the same time and press on the chip, so that the chip can be clamped on the test seat to ensure that the two clamping arms can always clamp the chip during the test. When the loading robot completes loading, the loading robot moves away from the test seat. At this time, the limit end of the limit assembly can be against the upper surface of the test seat, so that the limit end of the limit assembly can limit the rise of the test seat.

[0006] After the chip test is completed, the output end of the unloading robot will be close to the test seat. In the process of picking up materials, the unloading robot can drive the limit end of the limit assembly to disengage from the abutment with the test seat. After the limit end of the limit assembly disengages from the abutment with the test seat, the test seat will begin to rise under the pushing action of the first elastic member. During the rising process of the test seat, the chip will push the clamping ends of the two clamping arms upward, so that the clamping ends of the two clamping arms swing upward at the same time, and after rising to a certain extent, the upper surface of the test seat will be against the middle of the two clamping arms again, so that the test seat pushes the two clamping arms upward, and then the clamping ends of the two clamping arms release the chip on the test seat, so that the unloading robot can take the chip off the test seat. The multiple locking mechanisms in the chip testing equipment can all press the chip onto the test seat, without the need for the unloading robot to perform an additional chip pressing step, so that the unloading robot can promptly remove the chips that have completed the test, and then the loading robot can promptly move the chips to be tested to the idle test seat, avoiding the loading robot from being idle while waiting for loading, which is beneficial to improving the chip testing efficiency of the chip testing equipment.

[0007] According to the chip testing device of an embodiment of the present invention, the locking mechanism also includes two torsion springs, one connecting arm of the two torsion springs is respectively connected to the two clamping arms, the other connecting arms of the two torsion springs are connected to the base, and the two torsion springs are respectively used to drive the clamping ends of the two clamping arms to swing downward.

[0008] According to the chip testing device of the embodiment of the present invention, the limit assembly includes two limit rods and two second elastic members, two guide holes are formed on the inner side wall of the sliding cavity, the two limit rods are parallel to the left and right directions, the two limit rods can be slidably arranged in the two guide holes along the left and right directions, the two limit rods are provided with guide inclined surfaces on the opposite ends of the two limit rods, the angle formed by the two guide inclined surfaces is upward, the two second elastic members are respectively arranged in the two guide holes, the two second elastic members are respectively used to drive the two limit rods to move toward each other, so that the opposite ends of the two limit rods can both extend into the sliding cavity, and the lower surfaces of the opposite ends of the two limit rods can both abut against the upper surface of the test seat, the two guide inclined surfaces can simultaneously abut against the output end of the unloading robot, so that the two limit rods can be retracted into the two guide holes respectively at the same time, and the two limit rods can be separated from the abutment with the test seat at the same time.

[0009] According to the chip testing equipment of an embodiment of the present invention, two buckle grooves are provided on the test seat, and the two buckle grooves are respectively used for the two limit rods to extend therein, and the inner side walls of the two buckle grooves can respectively abut against the two guide inclined surfaces so that the two limit rods can respectively escape from the two buckle grooves.

[0010] According to the chip testing device of the embodiment of the present invention, a mounting post is provided on the inner bottom wall of the sliding cavity, and the first elastic member is sleeved on the mounting post.

[0011] According to an embodiment of the present invention, the chip testing equipment also includes a suction device, which is arranged on the frame, and a plurality of suction holes are opened on the inner wall of the sliding cavity, and the plurality of suction holes are all located above the limiting assembly, and the sliding cavity forms a negative pressure cavity in the area below the test seat, and the plurality of suction holes are all connected to the negative pressure cavity, and the suction end of the suction device is connected to the negative pressure cavity, and the suction device is used to generate negative pressure in the negative pressure cavity and the plurality of suction holes, so that the plurality of suction holes can suck the air in the sliding cavity above the test seat to reduce the temperature of the chip on the test seat.

[0012] According to the chip testing equipment of an embodiment of the present invention, the test seat includes a positioning plate, the upper surface of the positioning plate can be abutted against the limiting end of the limiting assembly, the upper surface of the positioning plate can be abutted against the middle parts of the two clamping arms, a positioning groove is provided on the positioning plate, the positioning groove is used to accommodate the chip, and a plurality of adsorption holes are provided on the inner bottom wall of the positioning groove, and the plurality of adsorption holes are all connected to the negative pressure chamber, so that the plurality of adsorption holes can adsorb the chip into the positioning groove.

[0013] According to the chip testing equipment of the embodiment of the present invention, the test seat also includes a probe assembly, a circuit board and a shell, the upper end of the shell is connected to the positioning plate, the inner cavity of the shell is connected to the multiple adsorption holes, the shell can be slidably arranged in the sliding cavity along the up and down directions, the bottom wall of the shell is connected to the upper end of the first elastic member, the probe assembly and the circuit board are both arranged in the shell, the circuit board is provided with multiple test pads, the lower end of the probe assembly is abutted against the multiple test pads, the upper end of the probe assembly extends into the positioning groove, the upper end of the probe assembly is used to abut against the multiple pins on the chip, the inner bottom wall of the shell is provided with heat dissipation holes, the inner cavity of the shell is connected to the negative pressure cavity through the heat dissipation holes, the suction device can cause the negative pressure cavity to generate negative pressure, so that the inner cavity of the shell and the multiple adsorption holes can both generate negative pressure, and the temperature of the circuit board can be reduced and the chip can be adsorbed in the positioning groove.

[0014] According to the chip testing device of an embodiment of the present invention, the test seat also includes a sealing ring, which is sleeved on the outer wall of the shell, and the shell is abutted against the inner wall of the sliding cavity through the sealing ring, and the sealing ring is used to seal the gap between the shell and the inner wall of the sliding cavity.

[0015] According to the chip testing equipment of the embodiment of the present invention, it also includes a feeding device, a first collecting device and a second collecting device. The feeding device is arranged on the rack, and the feeding device is used to supply a plurality of the chips. The loading robot is used to transport the plurality of chips in the feeding device to the plurality of test seats in sequence. The first collecting device and the second collecting device are both arranged on the rack, and the first collecting device is used to collect qualified chips, and the second collecting device is used to collect unqualified chips. The unloading robot is arranged on the rack, and the unloading robot is used to transport the chips on the plurality of test seats to the first collecting device or the second collecting device in sequence.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 A schematic top view of a chip testing device according to an embodiment of the present invention; Figure 2 It is a structural schematic diagram of a locking mechanism and a test socket in an idle state in a chip testing device according to an embodiment of the present invention; Figure 3 It is a structural schematic diagram of a test socket in a chip testing device according to an embodiment of the present invention in the process of ascending or descending; Figure 4 It is a structural schematic diagram of a locking mechanism and a test socket in a pressed state in a chip testing device according to an embodiment of the present invention; Figure 5 for Figure 4 A partial enlarged view of the middle A; Figure 6 It is a schematic diagram of a loading robot in a chip testing device according to an embodiment of the present invention; Figure 7 for Figure 2 A cross-sectional schematic diagram of the middle locking mechanism and the test seat; Figure 8 for Figure 4 A cross-sectional schematic diagram of the middle locking mechanism and the test seat; Fig. 9 It is a top view schematic diagram of a locking mechanism and a test socket in a chip testing device according to an embodiment of the present invention; Figure Number: Locking mechanism 100; base 110; sliding chamber 111; negative pressure chamber 112; guide hole 113; suction hole 114; first elastic member 120; clamping arm 130; torsion spring 140; limit assembly 150; limit rod 151; guide slope 152; second elastic member 153; Test seat 200; positioning plate 210; positioning groove 211; adsorption hole 212; housing 220; buckle groove 221; sealing ring 230; probe assembly 240; Feeding device 300; first collecting device 400; second collecting device 500; Loading robot 600; first multi-axis driving device 610; first suction cup 620; first top block 630; Unloading robot 700. DETAILED DESCRIPTION

[0018] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0019] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0020] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0021] Reference Figures 1 to 8 The present invention discloses a frame, a loading robot 600, a unloading robot 700 and a plurality of testing devices.

[0022] A plurality of test devices are arranged on the frame, and the plurality of test devices include a locking mechanism 100 and a test seat 200. The locking mechanism 100 can press the chip onto the test seat 200, and the test seat 200 is used to test the chip. The locking mechanism 100 includes a base 110, a first elastic member 120, a limit assembly 150, and two clamping arms 130. A sliding cavity 111 is provided on the base 110, and the test seat 200 can be slidably arranged in the sliding cavity 111 along the up and down directions. The first elastic member 120 is arranged in the sliding cavity 111, and the upper and lower ends of the first elastic member 120 are respectively connected to the test seat 200 and the inner bottom wall of the sliding cavity 111. The first elastic member 120 is used to push the test seat 200 upwards. The two clamping arms 130 each have a mounting end and a clamping end. The mounting ends of the two clamping arms 130 are both hinged on the base 110, and the middle parts of the two clamping arms 130 can be engaged with the test seat 200. The limiting assembly 150 is arranged on the base 110, and the output end of the loading robot 600 can drive the test seat 200 to descend and move the chip to the test seat 200, so that the clamping ends of the two clamping arms 130 swing down at the same time and clamp the chip on the test seat 200, and the limiting end of the limiting assembly 150 can be offset with the test seat 200 to limit the test seat 200 from rising, and the output end of the unloading robot 700 can drive the limiting end of the limiting assembly 150 to be separated from the abutment with the test seat 200, so that the test seat 200 rises and the clamping ends of the two clamping arms 130 swing up at the same time, and the unloading robot 700 can move the chip on the test seat 200. Each test device includes a locking mechanism 100 and a test seat 200.

[0023] It should be explained that during the test, the chip needs to establish a reliable electrical connection with the probe assembly 240 on the test socket 200 to ensure that the test signal can be accurately transmitted to the inside of the chip, and the chip response signal can also be correctly fed back to the chip test equipment through the test socket 200. Therefore, during the chip test, the chip needs to be pressed tightly so that the pins of the chip can be closely fitted with the probe assembly 240 of the test socket 200 to ensure the stability and accuracy of the test signal transmission.

[0024] It is understandable that when the chip to be tested needs to be tested, the loading robot 600 moves the chip to the test seat 200. In the process of the loading robot 600 placing the chip on the test seat 200, the loading robot 600 can drive the test seat 200 to descend. In the process of the test seat 200 descending, the first elastic member 120 begins to compress. Since the middle parts of the two clamping arms 130 are against the test seat 200, the clamping ends of the two clamping arms 130 can begin to swing down under their own gravity during the descent of the test seat 200, so that the clamping ends of the two clamping arms 130 are close to the chip on the test seat 200 at the same time and press on the chip, so that the chip can be clamped on the test seat 200 to ensure that the two clamping arms 130 can always clamp the chip during the test. When the loading robot 600 completes loading, the loading robot 600 moves away from the test socket 200 , at which time the limiting end of the limiting assembly 150 can abut against the upper surface of the test socket 200 , so that the limiting end of the limiting assembly 150 can limit the rise of the test socket 200 .

[0025] After the chip test is completed, the output end of the unloading manipulator 700 will be close to the test seat 200. In the process of taking the material, the unloading manipulator 700 can drive the limiting end of the limiting assembly 150 to disengage from the abutment with the test seat 200. After the limiting end of the limiting assembly 150 disengages from the abutment with the test seat 200, the test seat 200 will begin to rise under the pushing action of the first elastic member 120. In the process of the test seat 200 rising, the chip will push the clamping ends of the two clamping arms 130 upward, so that the clamping ends of the two clamping arms 130 swing upward at the same time, and after rising to a certain extent, the upper surface of the test seat 200 will be against the middle of the two clamping arms 130 again, so that the test seat 200 pushes the two clamping arms 130 upward, and then the clamping ends of the two clamping arms 130 release the chip on the test seat 200, so that the unloading manipulator 700 can take the chip on the test seat 200 away. The multiple locking mechanisms 100 in the chip testing equipment can all press the chip onto the test socket 200, without the need for the unloading robot 700 to perform an additional chip pressing step, so that the unloading robot 700 can promptly remove the chips that have completed the test, and then the loading robot 600 can promptly move the chips to be tested to the idle test socket 200, avoiding the loading robot 600 from being idle while waiting for loading, which is beneficial to improving the chip testing efficiency of the chip testing equipment.

[0026] refer to Figure 7 and Figure 8 , a mounting post is provided on the inner bottom wall of the sliding cavity 111, and the first elastic member 120 is sleeved on the mounting post. It can be understood that the mounting post is used for the first elastic member 120 to be sleeved, so that the mounting post plays a limiting role on the first elastic member 120 to ensure that the first elastic member 120 can be smoothly compressed and stretched.

[0027] refer to Figure 1 The chip testing equipment also includes a feeding device 300, a first collecting device 400 and a second collecting device 500. The feeding device 300 is arranged on the rack, and the feeding device 300 is used to supply multiple chips. The loading robot 600 is used to transport the multiple chips in the feeding device 300 to multiple test seats 200 in sequence. The first collecting device 400 and the second collecting device 500 are both arranged on the rack. The first collecting device 400 is used to collect qualified chips, and the second collecting device 500 is used to collect unqualified chips. The unloading robot 700 is arranged on the rack, and the unloading robot 700 is used to transport the chips on the multiple test seats 200 to the first collecting device 400 or the second collecting device 500 in sequence.

[0028] It is understandable that when the chip to be tested needs to be tested, the loading robot 600 moves the multiple chips in the feeding device 300 to the multiple test seats 200 in sequence. After the loading robot 600 moves the chip to the test seat 200, the corresponding locking mechanism 100 can press the chip on the test seat 200, so that the test seat 200 can test the chip. In the process of the loading robot 600 moving the chip, the chip first placed on the test seat 200 has completed the chip test. At this time, the corresponding locking mechanism 100 releases the chip on the test seat 200, so that the loading robot 600 can move the chip on the test seat 200 that has completed the test to the first collection device 400 or the second collection device 500 according to the test result, so as to complete the chip testing and sorting. After the unloading robot 700 takes away the chip on the test seat 200, the loading robot 600 will immediately move the next chip and place it on the idle test seat 200.

[0029] During the loading process of the loading robot 600, there will be chips that have completed the test, and the unloading robot 700 can promptly remove the chips that have completed the test from the test seat 200, so that the loading robot 600 can promptly move the next chip to be tested to the idle test seat 200, thereby realizing the cyclic loading of the loading robot 600 and the cyclic unloading of the unloading robot 700, shortening the idle time of the loading robot 600 and the unloading robot 700, thereby facilitating the improvement of the chip testing efficiency of the chip testing equipment. On the other hand, the locking mechanism 100 can press the chip on the test seat 200, without the unloading robot 700 having to perform an additional chip pressing step, so that the unloading robot 700 can promptly remove the chips that have completed the test, thereby facilitating the loading robot 600 to promptly move the chips to be tested to the idle test seat 200, thereby avoiding the loading robot 600 being in an idle state waiting for loading, thereby facilitating the improvement of the chip testing efficiency of the chip testing equipment.

[0030] In an embodiment of the present invention, the feeding device 300 includes a first grasping mechanism, a first accommodating mechanism, a first linear drive mechanism and a first positioning jig plate. The output end of the first linear drive mechanism is connected to the first positioning jig plate. The first accommodating mechanism accommodates a plurality of chips to be tested. The first grasping mechanism can grasp and transport the plurality of chips to be tested in the first accommodating mechanism to the first positioning jig plate. Then the first linear drive mechanism drives the first positioning jig plate to move and approach the loading robot 600. After the loading robot 600 takes away the plurality of chips on the first positioning jig plate, the first linear drive mechanism drives the first positioning jig plate to move to the first accommodating mechanism, so that the first grasping mechanism can grasp and transport the next batch of chips to be tested in the first accommodating mechanism to the first positioning jig plate. The first grasping mechanism, the first accommodating mechanism, the first linear drive mechanism and the first positioning jig plate are all common settings in automation equipment and will not be further described here.

[0031] In an embodiment of the present invention, the first collection device 400 includes a first horizontal drive mechanism and a second positioning jig plate, the output end of the first horizontal drive mechanism is connected to the second positioning jig plate, and the first horizontal drive mechanism is used to drive the second positioning jig plate to move in the horizontal direction, that is, it can drive the second positioning jig plate to move in the left-right direction and the front-back direction. The first horizontal drive mechanism can drive the second positioning jig plate to approach the unloading robot 700, so that the unloading robot 700 can move the qualified chips tested on the test seat 200 to the second positioning jig plate. After the second positioning jig plate is filled with qualified chips, the first horizontal drive mechanism drives the second positioning jig plate to approach the post-processing equipment, so that the post-processing equipment can take away all the chips on the second positioning jig plate and perform corresponding processing, and then the first horizontal drive mechanism drives the second positioning jig plate to approach the unloading robot 700 again to complete the unloading of the next qualified chip.

[0032] The second collection device 500 includes a second horizontal drive mechanism and a third positioning fixture plate. The output end of the second horizontal drive mechanism is connected to the third positioning fixture plate. The second horizontal drive mechanism is used to drive the third positioning fixture plate to move in the horizontal direction. The third positioning fixture plate is used to collect multiple unqualified chips. The second collection device 500 has the same structure and operating principle as the first collection device 400, which will not be further described here. The first horizontal drive mechanism, the second positioning fixture plate, the second horizontal drive mechanism and the third positioning fixture plate are all common settings in automation equipment, which will not be further described here.

[0033] As an embodiment of the present invention, refer to Figures 2 to 4The locking mechanism 100 also includes two torsion springs 140, one connecting arm of the two torsion springs 140 is connected to the two clamping arms 130 respectively, and the other connecting arms of the two torsion springs 140 are connected to the base 110, and the two torsion springs 140 are respectively used to drive the clamping ends of the two clamping arms 130 to swing downward. It can be understood that the two torsion springs 140 can apply a downward swinging force to the two clamping arms 130 respectively, so that the two clamping arms 130 always have a downward swinging drive, so as to ensure that the two clamping arms 130 can quickly follow the upward swing or downward swing during the rise or fall of the test seat 200, thereby improving the response speed of the two clamping arms 130. On the other hand, the two torsion springs 140 can respectively increase the clamping force of the clamping ends of the two clamping arms 130 on the chip, so that the chip can be more firmly clamped on the test seat 200 to ensure the stability and accuracy of the test signal transmission.

[0034] refer to Figure 4 , Figure 5 , Figure 7 and Figure 8 The limiting assembly 150 includes two limiting rods 151 and two second elastic members 153. Two guide holes 113 are formed on the inner side wall of the sliding cavity 111. The two limiting rods 151 are parallel to the left and right directions. The two limiting rods 151 can be slidably arranged in the two guide holes 113 along the left and right directions. The two limiting rods 151 are provided with guide slopes 152 on the opposite ends of the two limiting rods 151. The angle formed by the two guide slopes 152 faces upward. The two second elastic members 153 are respectively arranged in the two guide holes 113. The two second elastic members 153 are respectively arranged in the two guide holes 113. The functional parts 153 are respectively used to drive the two limit rods 151 to move toward each other, so that the opposite ends of the two limit rods 151 can extend into the sliding cavity 111, and the lower surfaces of the opposite ends of the two limit rods 151 can abut against the upper surface of the test seat 200, and the two guide slopes 152 can abut against the output end of the unloading robot 700 at the same time, so that the two limit rods 151 can be retracted into the two guide holes 113 at the same time, and the two limit rods 151 can be separated from the abutment with the test seat 200 at the same time.

[0035] Understandably, reference Figure 7 and Figure 8When the chip is being tested, the test seat 200 and the chip on the test seat 200 are both in the sliding cavity 111. At this time, the opposite ends of the two limit rods 151 are both arranged in the sliding cavity 111, and the opposite ends of the two limit rods 151 are both against the upper surface of the test seat 200, so that the two limit rods 151 can limit the rise of the test seat 200, and then the two clamping arms 130 can clamp the chip on the test seat 200. After the chip test is completed, the output end of the unloading robot 700 needs to extend into the sliding cavity 111 to take away the chip on the test seat 200. During the process of the output end of the unloading robot 700 extending into the sliding cavity 111, the output end of the unloading robot 700 can simultaneously abut against the guide slope 152 on the opposite end of the two limit rods 151, so that the two limit rods 151 can be retracted into the two guide holes 113 respectively at the same time, and then the two limit rods 151 can be simultaneously disengaged from the abutment with the test seat 200. At this time, the test seat 200 can rise, and under the action of the rising of the test seat 200, the clamping ends of the two clamping arms 130 can be swung up at the same time, so that the clamping ends of the two clamping arms 130 can release the chip at the same time, so that the unloading robot 700 can move the chip on the test seat 200 away.

[0036] When the test socket 200 is in an idle state, refer to Figure 7 and Figure 8 , the two limiting rods 151 have a tendency to move toward each other under the action of the two second elastic members 153, that is, at this time, the opposite ends of the limiting rods 151 are both against the test seat 200. In the process of the loading robot 600 placing the chip on the test seat 200, the loading robot 600 can drive the test seat 200 to descend. When the test seat 200 descends to the bottom of the two guide holes 113, the loading robot 600 stops driving the test seat 200 to descend. At this time, the two limiting rods 151 move toward each other under the action of the two second elastic members 153, so that the opposite ends of the two limiting rods 151 simultaneously extend into the sliding cavity 111 and abut against the upper surface of the test seat 200 to complete the limiting of the test seat 200, avoiding the test seat 200 from rising under the action of the first elastic member 120, and ensuring that the two clamping arms 130 can stably clamp the chip on the test seat 200.

[0037] In the embodiment of the present invention, a first limiting structure is provided in the guide hole 113, and a second limiting structure is provided in the limiting rod 151. The first limiting structure can offset the second limiting structure to limit the limiting rod 151 from escaping from the guide hole 113, which will not be further described here.

[0038] refer to Figure 7 and Figure 8, the test seat 200 is provided with two buckle grooves 221, the two buckle grooves 221 are respectively used for two limit rods 151 to extend into, and the inner side walls of the two buckle grooves 221 can respectively abut against the two guide slopes 152, so that the two limit rods 151 can respectively escape from the two buckle grooves 221. It can be understood that after the chip test is completed, the output end of the unloading robot 700 needs to extend into the sliding cavity 111 to take away the chip on the test seat 200. The output end of the unloading robot 700 can simultaneously abut against the guide slopes 152 on the opposite ends of the two limit rods 151, so that the two limit rods 151 can be retracted into the two guide holes 113 at the same time, and the test seat 200 can rise at this time, and the clamping ends of the two clamping arms 130 can be simultaneously swung up, so that the unloading robot 700 can move the chip on the test seat 200 away.

[0039] When the test seat 200 rises to a certain extent, the two buckle grooves 221 on the test seat 200 will be aligned with the two guide holes 113 respectively, so that the two limit rods 151 can extend into the two buckle grooves 221 respectively and simultaneously under the action of the second elastic member 153, so as to complete the limit of the test seat 200 and prevent the test seat 200 from escaping from the sliding cavity 111. In the process of the loading robot 600 placing the chip on the test seat 200, the loading robot 600 can drive the test seat 200 to descend. In the process of the test seat 200 descending, the inner side walls of the two buckle grooves 221 can respectively abut against the two guide slopes 152, so that the two limit rods 151 can be simultaneously respectively withdrawn from the two buckle grooves 221 and retracted into the two guide holes 113. When the test seat 200 is lowered to the bottom of the two guide holes 113, the opposite ends of the two limiting rods 151 simultaneously extend into the sliding cavity 111 and abut against the upper surface of the test seat 200 to complete the limiting of the test seat 200. It can be seen that the two limiting rods 151 can limit the upward movement stroke and the downward movement stroke of the test seat 200. In the embodiment of the invention, the second elastic member 153 can be a compression spring.

[0040] It should be explained that the temperature of the test socket 200 will rise during the test, which may cause the temperature of the chip to rise. When the temperature of the chip rises, it may cause the chip's operating frequency to drop, signal transmission delay to increase, data processing speed to slow down, etc., making the chip fail to meet the design indicators, thereby affecting the accuracy of the test results. Figures 7 to 9The chip testing device further includes a suction device, which is arranged on the frame. A plurality of suction holes 114 are provided on the inner side wall of the sliding cavity 111. The plurality of suction holes 114 are all located above the limiting assembly 150. The sliding cavity 111 below the test seat 200 is a negative pressure cavity 112. The plurality of suction holes 114 are all connected to the negative pressure cavity 112. The suction end of the suction device is connected to the negative pressure cavity 112. The suction device is used to generate negative pressure in the negative pressure cavity 112, so that the plurality of suction holes 114 can suck the air in the sliding cavity 111 above the test seat 200 to reduce the temperature of the chip on the test seat 200. The plurality of suction holes 114 are all located above the limiting assembly 150, that is, the plurality of suction holes 114 are all located above the guide hole 113.

[0041] It is understandable that, when the chip is being tested, the test seat 200 and the chip on the test seat 200 are both in the sliding cavity 111, and the opposite ends of the two limit rods 151 are both against the upper surface of the test seat 200. At this time, the test seat 200 is located below the two guide holes 113, that is, at this time, the multiple suction holes 114 on the inner wall of the sliding cavity 111 are all located above the test seat 200 and the chip. After the test seat 200 is lowered into place, the test seat 200 starts to test the chip, and the suction device is started. The suction device can suck the air in the negative pressure cavity 112, so that the sliding cavity 111 below the test seat 200 generates negative pressure, and then the multiple suction holes 114 all generate negative pressure. After the multiple suction holes 114 generate negative pressure, the multiple suction holes 114 can suck the air in the test seat 200 and the sliding cavity 111 above the chip, so that the air above the test seat 200 and the chip can flow, and then the flowing air can take away the heat of the chip, thereby reducing the temperature of the chip on the test seat 200, avoiding the accuracy of the test result being reduced due to the increase in chip temperature.

[0042] After the chip test is completed, the output end of the unloading manipulator 700 can simultaneously abut against the guide slope 152 on the opposite end of the two limit rods 151, so that the two limit rods 151 can be retracted into the two guide holes 113 at the same time, thereby causing the test seat 200 to rise. After the test seat 200 rises to a certain extent, the two limit rods 151 are respectively inserted into the two buckle grooves 221, so that the test seat 200 stops rising. At this time, the test seat 200 blocks the multiple suction holes 114, and the suction device is closed. In an embodiment of the present invention, the suction device includes a vacuum pump and a vacuum tube, one end of the vacuum tube is connected to the output end of the vacuum pump, and the other end of the vacuum tube is connected to the sliding chamber 111 (negative pressure chamber 112) below the test seat 200, so that after the vacuum pump is started, the sliding chamber 111 below the test seat 200 can generate negative pressure. The suction device is a common device for pumping negative pressure, which will not be further described here.

[0043] refer to Figure 3 , Figure 7 , Figure 8 and Fig. 9 The test seat 200 includes a positioning plate 210, the upper surface of the positioning plate 210 can be against the opposite end of the two limit rods 151, the upper surface of the positioning plate 210 is against the middle part of the two clamping arms 130, and a positioning groove 211 is provided on the positioning plate 210, and the positioning groove 211 is used to accommodate the chip. A plurality of adsorption holes 212 are provided on the inner bottom wall of the positioning groove 211, and the plurality of adsorption holes 212 are all connected to the negative pressure chamber 112, so that the plurality of adsorption holes 212 can generate negative pressure and the chip is adsorbed in the positioning groove 211. It can be understood that during the process of testing the chip by the test seat 200, the suction device is started. The suction device can suck the air in the negative pressure chamber 112, that is, the suction device can suck the air in the sliding chamber 111 below the positioning plate 210, so that the negative pressure chamber 112 generates negative pressure. Since the multiple adsorption holes 212 on the bottom wall of the positioning groove 211 are connected to the negative pressure chamber 112, the multiple adsorption holes 212 can generate negative pressure, so that the chip in the positioning groove 211 can be adsorbed in the positioning groove 211, ensuring that the chip will not shake relative to the positioning plate 210 during the test, which is beneficial to ensure the accuracy of the test results.

[0044] refer to Figure 1 , Figure 2 , Figure 7 , Figure 8 and Fig. 9 The test seat 200 also includes a probe assembly 240, a circuit board and a shell 220. The upper end of the shell 220 is connected to the positioning plate 210. The inner cavity of the shell 220 is connected to the plurality of adsorption holes 212. The shell 220 can be slidably arranged in the sliding cavity 111 along the up and down directions. The bottom wall of the shell 220 is connected to the upper end of the first elastic member 120. The probe assembly 240 and the circuit board are both arranged in the shell 220. The circuit board is provided with a plurality of test pads. The lower end of the probe assembly 240 is connected to a plurality of test pads. The pads are abutted against each other, and the upper end of the probe assembly 240 extends into the positioning groove 211. The upper end of the probe assembly 240 is used to abut against multiple pins on the chip. A heat dissipation hole is opened on the inner bottom wall of the shell 220. The inner cavity of the shell 220 is connected with the negative pressure cavity 112 through the heat dissipation hole. The suction device can make the negative pressure cavity 112 generate negative pressure, so that the inner cavity of the shell 220 and the multiple adsorption holes 212 can generate negative pressure, and the temperature of the circuit board can be reduced and the chip can be adsorbed in the positioning groove 211.

[0045] In an embodiment of the present invention, the upper end of the probe assembly 240 extends into the positioning groove 211, and the lower end of the probe assembly 240 abuts against a plurality of test pads on the circuit board. After the loading manipulator 600 carries the chip to be tested into the positioning groove 211 on the positioning plate 210, the positioning groove 211 can play a positioning role on the chip, so that a plurality of pins on the chip can abut against the upper end of the probe assembly 240. After the plurality of pins on the chip can abut against the upper end of the probe assembly 240, the electrical connection between the chip and the circuit board can be realized. The chip testing device also includes a test module, and a wire hole is provided on the inner bottom wall of the sliding cavity 111, and a signal transmission line is passed through the wire hole, and the test module is electrically connected to the circuit board through the signal transmission line. The test module can generate various types of test signals, which are transmitted to the test pads through the signal transmission line and the circuit board in the test seat 200, and then transmitted to the chip through the probe assembly 240, so that the chip enters different working states and tests various functions of the chip.

[0046] After receiving the test signal, the chip will generate a corresponding response signal according to its own function and internal circuit structure. These response signals are transmitted back to the test pad through the probe assembly 240, and then transmitted to the test module by the circuit board and the signal transmission line. The test module analyzes and processes the returned signal, and compares it with the expected result to determine whether the chip has a fault or whether the performance meets the standard. The probe assembly 240 and the circuit board in the test socket 200 are common settings in chip testing, and will not be further described here. It needs to be explained that after the test socket 200 is used for a long time, the temperature of the circuit board itself will increase significantly. Excessive temperature will cause the parameters of the electronic components on the circuit board to change, such as resistance value, capacitance value, etc. will change with the increase in temperature, which is easy to cause deviations in the parameters such as the amplitude and frequency of the test signal, thereby affecting the accuracy of the test results.

[0047] It is understandable that during the process of testing the chip by the test socket 200, the suction device is started. The suction device can suck the air in the negative pressure chamber 112, so that the negative pressure chamber 112 generates negative pressure. Since the inner cavity of the shell 220 is connected to the negative pressure chamber 112 through the heat dissipation hole, and the inner cavity of the shell 220 is connected to the multiple adsorption holes 212 on the inner bottom wall of the positioning groove 211, after the negative pressure chamber 112 forms a negative pressure, the inner cavity of the shell 220 and the multiple adsorption holes 212 can both generate negative pressure. On the one hand, after the multiple adsorption holes 212 generate negative pressure, the chip can be adsorbed in the positioning groove 211, so that the multiple pins on the chip can maintain close contact with the probe assembly 240, thereby ensuring the accuracy of the test results. On the other hand, after negative pressure is generated in the negative pressure chamber 112, the inner cavity of the shell 220 and the multiple adsorption holes 212, the outside air can flow into the inner cavity of the shell 220 and the negative pressure chamber 112 through the multiple adsorption holes 212, so that the air in the shell 220 flows from top to bottom, and then the flowing air can take away the heat of the circuit board, thereby reducing the temperature of the circuit board and avoiding the accuracy of the test results being reduced due to the increase in the temperature of the circuit board.

[0048] refer to Figure 7 and Figure 8 The test seat 200 also includes a sealing ring 230, which is sleeved on the outer wall of the shell 220. The shell 220 is abutted against the inner wall of the sliding cavity 111 through the sealing ring 230. The sealing ring 230 is used to seal the gap between the shell 220 and the inner wall of the sliding cavity 111. It can be understood that the sealing ring 230 can seal the gap between the inner wall of the sliding cavity 111 and the shell 220, avoiding air leakage between the inner wall of the sliding cavity 111 and the shell 220, and ensuring that after the suction device is started, the negative pressure cavity 112, the inner cavity of the shell 220, the multiple adsorption holes 212 and the multiple suction holes 114 can quickly generate negative pressure. In the embodiment of the present invention, two buckle grooves 221 are formed on the outer wall of the shell 220.

[0049] refer to Figure 6The loading robot 600 includes a first multi-axis driving device 610, a first suction cup 620 and two first top blocks 630. The first multi-axis driving device 610 is arranged on the frame. The output end of the first multi-axis driving device 610 is connected to the first suction cup 620 and the two first top blocks 630. The first suction cup 620 is arranged between the two first top blocks 630. The lower ends of the two first top blocks 630 are located below the first suction cup 620. The first suction cup 620 is used to adsorb chips. The two first top blocks 630 are respectively used to push the front and rear sides of the test seat 200, that is, the two first top blocks 630 are respectively used to push the front and rear sides of the positioning plate 210. The first multi-axis driving device 610 is used to drive the first suction cup 620 and the two first top blocks 630 to move in the left-right direction, the front-back direction and the up-down direction. After the pressing ends of the two pressing arms 130 are pressed against the chip, the first suction cup 620 can be located in the gap between the pressing ends of the two pressing arms 130 .

[0050] Similarly, the unloading robot 700 includes a second multi-axis drive device, a second suction cup and two second top blocks. The second multi-axis drive device is arranged on the frame, and the output end of the second multi-axis drive device is connected to the second suction cup and the two second top blocks. The second suction cup is arranged between the two second top blocks, and the lower ends of the two second top blocks are located below the second suction cup. The second suction cup is used to adsorb the chip, and the two second top blocks are respectively used to push the guide slopes 152 on the two limit rods 151. The second multi-axis drive device is used to drive the second suction cup and the two second top blocks to move in the left and right directions, the front and back directions, and the up and down directions. After the clamping ends of the two clamping arms 130 are against the chip, the second suction cup can be in the gap between the clamping ends of the two clamping arms 130, that is, the second suction cup can extend downward into the gap between the clamping ends of the two clamping arms 130.

[0051] In the embodiment of the present invention, the feeding device 300 is located in front of the loading robot 600, the multiple test devices are all located to the right of the loading robot 600, the unloading robot 700 is located to the right of the multiple test devices, and the first collection device 400 and the second collection device 500 are respectively located at the front and rear sides of the unloading robot 700. In the embodiment of the present invention, the number of the test devices is three, and the three test devices are evenly distributed on the frame along the front and rear direction.

[0052] refer to Figure 1 , Figure 2 , Figure 3 , Figure 7 and Figure 8 The chip testing method of the chip testing device of the embodiment of the present invention is roughly as follows: Here, one of the test devices is used as an example. When the test seat 200 is in an idle state, the opposite ends of the two limit rods 151 are respectively inserted into the two buckle grooves 221 on the shell 220 of the test seat 200, so that the test seat 200 can stay in the upper limit position; When the chip to be tested in the feeding device 300 needs to be tested, the first multi-axis driving device 610 drives the first suction cup 620 and the two first top blocks 630 to move to the feeding device 300, so that the first suction cup 620 can absorb the chip to be tested in the feeding device 300; After the first suction cup 620 absorbs the chip to be tested, the first multi-axis driving device 610 drives the first suction cup 620 and the two first top blocks 630 to move to the top of the test seat 200, so that the chip to be tested absorbed by the first suction cup 620 is aligned with the positioning groove 211 on the positioning plate 210, and the two first top blocks 630 are respectively aligned with the front and rear sides of the positioning plate 210; The first multi-axis driving device 610 drives the first suction cup 620 and the two first top blocks 630 to descend. When the two first top blocks 630 are just against the front and rear sides of the positioning plate 210, the chip adsorbed by the first suction cup 620 is just placed in the positioning groove 211 on the positioning plate 210, and the multiple pins on the chip are just against the upper end of the probe assembly 240. The first multi-axis driving device 610 continues to drive the first suction cup 620 and the two first top blocks 630 to descend. Under the pushing action of the two first top blocks 630, the guiding inclined surfaces 152 on the two limiting rods 151 respectively abut against the inner side walls of the two buckle grooves 221, so that the two limiting rods 151 are respectively retracted into the two buckle grooves 221, and the first elastic member 120 begins to compress, so that the test seat 200 begins to descend (that is, the positioning plate 210, the shell 220, the circuit board and the probe assembly 240 are descended together), thereby causing the positioning plate 210 and the chip on the positioning plate 210 to descend together into the sliding cavity 111. At the same time, under the action of the two torsion springs 140, the clamping ends of the two clamping arms 130 simultaneously swing downward and approach the chip on the positioning plate 210. When the test seat 200 is lowered to the lower limit position, that is, the upper surface of the positioning plate 210 is located below the two guide holes 113, under the action of the two second elastic members 153, the opposite ends of the two limit rods 151 are simultaneously extended and pressed against the upper surface of the positioning plate 210, so that the two limit rods 151 can limit the rise of the positioning plate 210 (i.e., limit the rise of the test seat 200). At the same time, the clamping ends of the two clamping arms 130 are pressed on the chip on the positioning plate 210, so that the chip is pressed on the positioning plate 210. The first suction cup 620 is located in the gap between the clamping ends of the two clamping arms 130, and the first suction cup 620 releases the chip, so that the chip is separated from the first suction cup 620. Then, the first multi-axis driving device 610 drives the first suction cup 620 and the two first top blocks 630 to be withdrawn from the sliding cavity 111 and moved to the feeding device 300, so that the first suction cup 620 can absorb the next chip to be tested. When the test seat 200 descends to the lower limit position, the suction device is turned on, and the test seat 200 starts to test the chip. After the suction device is turned on, the negative pressure chamber 112, the inner cavity of the shell 220, the multiple adsorption holes 212 and the multiple suction holes 114 all generate negative pressure, so that the inner cavity of the shell 220 forms flowing air to reduce the temperature of the circuit board, so that the chip can be adsorbed in the positioning groove 211, so that the multiple pins on the chip can be stably against the upper end of the probe assembly 240, so that the multiple suction holes 114 can suck the air above the positioning plate 210 and the chip to form flowing air, so that the temperature of the chip can be reduced; When the chip test is completed, the suction device is closed, and the second multi-axis driving device drives the second suction cup and the two second top blocks to move to the top of the test seat 200, so that the second suction cup is aligned with the chip on the positioning plate 210, and the two second top blocks are respectively aligned with the guide inclined surfaces 152 on the two limit rods 151. Then the second multi-axis driving device drives the second suction cup and the two second top blocks to descend, so that the second suction cup and the two second top blocks are inserted into the sliding cavity 111, and the second multi-axis driving device continues to drive The second suction cup and the two second top blocks descend, so that the two second top blocks respectively abut against the guide slopes 152 on the two limit rods 151. As the second suction cup and the two second top blocks continue to descend, the two limit rods 151 begin to retract. When the two limit rods 151 are completely retracted into the two guide holes 113, the two second top blocks just abut against the positioning plate 210, and the second suction cup just abuts against the chip, and the second suction cup is located in the gap between the clamping ends of the two clamping arms 130. The second suction cup absorbs the chip, and the second multi-axis driving device drives the second suction cup and the two second top blocks to rise. During the rising process of the second suction cup and the two second top blocks, the test seat 200 rises together under the action of the first elastic member 120, so that the two second top blocks and the positioning plate 210 are kept against each other. During the rising process of the test seat 200, the opposite ends of the two limit rods 151 are against the shell 220 of the test seat 200, that is, the two limit rods 151 cannot extend into the sliding cavity 111, and the test seat 200 During the rising process, the rising chip can first push the clamping ends of the two clamping arms 130 upward, so that the clamping ends of the two clamping arms 130 begin to swing upward at the same time. After the chip and the test seat 200 rise to a certain extent, the upper surface of the positioning plate 210 begins to abut against the middle parts of the two clamping arms 130. As the positioning plate 210 continues to rise, the positioning plate 210 pushes the two clamping arms 130 and swings upward at the same time, so that the clamping ends of the two clamping arms 130 gradually release the chip on the positioning plate 210. When the two second top blocks are just pulled out of the sliding cavity 111, the chip adsorbed by the second suction cup has been completely pulled out of the sliding cavity 111. At this time, the two clamping arms 130 have completely released the chip on the positioning plate 210, and the opposite ends of the two limit rods 151 are respectively inserted into the two buckle grooves 221 on the shell 220, so that the upper surface of the positioning plate 210 is kept flush with the upper surface of the base 110. At this time, the test seat 200 is in an idle state again, waiting for the first suction cup 620 to carry the next chip to be tested to the positioning groove 211 on the positioning plate 210; When the two second top blocks are just pulled out from the sliding cavity 111, the second multi-axis driving device will drive the second suction cup and the two second top blocks to move to the first collecting device 400 or the second collecting device 500 according to the test results. The second suction cup releases the tested chips, so that the first collecting device 400 can collect qualified chips, or the second collecting device can collect unqualified chips to complete the chip testing and sorting.

[0053] In the embodiment of the present invention, the chip testing device further includes a vacuum generating device, which is used to generate negative pressure on the first suction cup 620 and the second suction cup to adsorb the chip. The first multi-axis driving device 610, the first suction cup 620, the second multi-axis driving device and the second suction cup are all common settings in the field of automation, and will not be further described here.

[0054] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0055] Of course, the present invention is not limited to the above-mentioned embodiments, and those skilled in the art may make equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A chip testing device, characterized in that: include: A frame, a loading manipulator and a unloading manipulator, wherein the loading manipulator and the unloading manipulator are both arranged on the frame; A plurality of test devices, each of which is arranged on the rack, each of which comprises a locking mechanism and a test seat, wherein the locking mechanism is used to press the chip onto the test seat, and the test seat is used to test the chip; The locking mechanism includes a base, a first elastic member, a limit assembly and two clamping arms, the base is provided with a sliding cavity, the test seat can be slidably arranged in the sliding cavity along the up and down directions, the first elastic member is arranged in the sliding cavity, the upper and lower ends of the first elastic member are respectively connected to the test seat and the inner bottom wall of the sliding cavity, the first elastic member is used to push the test seat upward, the two clamping arms each have a mounting end and a clamping end, the mounting ends of the two clamping arms are hinged on the base, the middle parts of the two clamping arms can be against the test seat, and the limit assembly is provided. On the base, the output end of the loading robot can drive the test seat to descend and move the chip to the test seat, so that the clamping ends of the two clamping arms swing down at the same time and press the chip on the test seat, and the limiting end of the limiting assembly can abut against the test seat to limit the test seat from rising. The output end of the unloading robot can drive the limiting end of the limiting assembly to disengage from the abutment with the test seat, so that the test seat rises and the clamping ends of the two clamping arms swing up at the same time, and the unloading robot can move the chip on the test seat.

2. The chip testing device according to claim 1, characterized in that: The locking mechanism also includes two torsion springs, one connecting arm of the two torsion springs is respectively connected to the two clamping arms, and the other connecting arms of the two torsion springs are connected to the base. The two torsion springs are respectively used to drive the clamping ends of the two clamping arms to swing downward.

3. The chip testing device according to claim 1, characterized in that: The limit assembly includes two limit rods and two second elastic members, two guide holes are formed on the inner side wall of the sliding cavity, the two limit rods are parallel to the left and right directions, the two limit rods can be slidably arranged in the two guide holes along the left and right directions, guide inclined surfaces are provided on the opposite ends of the two limit rods, the angle formed by the two guide inclined surfaces is upward, the two second elastic members are respectively arranged in the two guide holes, and the two second elastic members are respectively used to drive the two limit rods to move toward each other, so that the opposite ends of the two limit rods can extend into the sliding cavity, and the lower surfaces of the opposite ends of the two limit rods can abut against the upper surface of the test seat, the two guide inclined surfaces can abut against the output end of the blanking robot at the same time, so that the two limit rods can be retracted into the two guide holes at the same time, and the two limit rods can be separated from the abutment with the test seat at the same time.

4. The chip testing device according to claim 3, characterized in that: The test seat is provided with two buckle grooves, the two buckle grooves are respectively used for the two limit rods to extend therein, and the inner side walls of the two buckle grooves can respectively abut against the two guide inclined surfaces so that the two limit rods can respectively escape from the two buckle grooves.

5. The chip testing device according to claim 1, characterized in that: A mounting column is provided on the inner bottom wall of the sliding cavity, and the first elastic member is sleeved on the mounting column.

6. The chip testing device according to claim 1, characterized in that: It also includes a suction device, which is arranged on the frame, and a plurality of suction holes are opened on the inner wall of the sliding cavity, and the plurality of suction holes are all located above the limiting assembly. The sliding cavity forms a negative pressure cavity in the area below the test seat, and the plurality of suction holes are all connected to the negative pressure cavity. The suction end of the suction device is connected to the negative pressure cavity, and the suction device is used to generate negative pressure in the negative pressure cavity and the plurality of suction holes, so that the plurality of suction holes can suck the air in the sliding cavity above the test seat to reduce the temperature of the chip on the test seat.

7. The chip testing device according to claim 6, characterized in that: The test seat includes a positioning plate, the upper surface of which can be abutted against the limiting end of the limiting assembly, and the upper surface of the positioning plate can be abutted against the middle parts of the two clamping arms. A positioning groove is provided on the positioning plate, and the positioning groove is used to accommodate the chip. A plurality of adsorption holes are provided on the inner bottom wall of the positioning groove, and the plurality of adsorption holes are all connected to the negative pressure chamber, so that the plurality of adsorption holes can adsorb the chip into the positioning groove.

8. The chip testing device according to claim 7, characterized in that: The test seat also includes a probe assembly, a circuit board and a shell, the upper end of the shell is connected to the positioning plate, the inner cavity of the shell is connected to the multiple adsorption holes, the shell can be slidably arranged in the sliding cavity along the up and down directions, the bottom wall of the shell is connected to the upper end of the first elastic member, the probe assembly and the circuit board are both arranged in the shell, the circuit board is provided with multiple test pads, the lower end of the probe assembly is abutted against the multiple test pads, the upper end of the probe assembly extends into the positioning groove, the upper end of the probe assembly is used to abut against the multiple pins on the chip, the inner bottom wall of the shell is provided with heat dissipation holes, the inner cavity of the shell is connected to the negative pressure cavity through the heat dissipation holes, the suction device can make the negative pressure cavity generate negative pressure, so that the inner cavity of the shell and the multiple adsorption holes can generate negative pressure, and the temperature of the circuit board can be reduced and the chip can be adsorbed in the positioning groove.

9. The chip testing device according to claim 8, characterized in that: The test seat also includes a sealing ring, which is sleeved on the outer wall of the shell, and the shell is abutted against the inner wall of the sliding cavity through the sealing ring. The sealing ring is used to seal the gap between the shell and the inner wall of the sliding cavity.

10. The chip testing device according to claim 1, characterized in that: It also includes a feeding device, a first collecting device and a second collecting device. The feeding device is arranged on the rack, and the feeding device is used to supply a plurality of the chips. The loading robot is used to sequentially transport the plurality of chips in the feeding device to a plurality of the test seats. The first collecting device and the second collecting device are both arranged on the rack, and the first collecting device is used to collect qualified chips, and the second collecting device is used to collect unqualified chips. The unloading robot is arranged on the rack, and the unloading robot is used to sequentially transport the chips on the plurality of the test seats to the first collecting device or the second collecting device.

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